WO2015105209A1 - Dispositif sonde - Google Patents

Dispositif sonde Download PDF

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Publication number
WO2015105209A1
WO2015105209A1 PCT/KR2014/000245 KR2014000245W WO2015105209A1 WO 2015105209 A1 WO2015105209 A1 WO 2015105209A1 KR 2014000245 W KR2014000245 W KR 2014000245W WO 2015105209 A1 WO2015105209 A1 WO 2015105209A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
spring member
contact
spring
diameter
Prior art date
Application number
PCT/KR2014/000245
Other languages
English (en)
Korean (ko)
Inventor
이재학
Original Assignee
주식회사 아이에스시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Priority to PCT/KR2014/000245 priority Critical patent/WO2015105209A1/fr
Publication of WO2015105209A1 publication Critical patent/WO2015105209A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Definitions

  • the present invention relates to a probe device, and more particularly, to a probe device that is easy to manufacture and does not penetrate foreign substances into the inside even after long-term use.
  • the completed semiconductor product is subjected to various types of tests to ensure the normal operation or reliability.
  • test socket is basically determined according to the shape of the semiconductor package, and serves as a medium for connecting the test board by mechanical contact between the external connection terminal of the semiconductor package and the socket lead.
  • test socket is connected to the semiconductor package and at the same time connected to the test substrate, thereby connecting the test socket, thereby transmitting a signal of the test substrate to the semiconductor package to perform the test.
  • a socket pin is embedded in a test socket body made of plastic.
  • a probe device also called a probe pin is used.
  • FIG. 1 schematically illustrates a test state of a semiconductor device using a conventional probe device according to the prior art.
  • the semiconductor package 1 serving as the device under test is provided with an external connection terminal 2, and a test substrate 8 and a substrate pad 9 provided therein are provided at positions opposite thereto.
  • the probe device 3 is located therebetween to electrically connect both sides.
  • the housing which is the test socket body, is omitted.
  • the probe device 3 is provided with an upper plunger 5 and a lower plunger 6 at both ends of the body 4, and a spring 7 is inserted into the inner space of the body 4. . Accordingly, the upper plunger 5 and the lower plunger 6 are subjected to an elastic force in a direction away from each other by the spring (7).
  • the upper plunger 5 is connected to the external connection terminal 2 of the semiconductor package 1
  • the lower plunger 6 is connected to the substrate pad 9 of the test substrate 8.
  • the external connection terminal 2 and the substrate pad 9 are electrically connected.
  • Probe device is that the spring is inserted into the interior of the body, in this case there is a limit in miniaturizing the probe device as a whole. That is, the spring is produced by winding the wire by mechanical processing, it is not easy to finely reduce the outer diameter of the spring through the mechanical processing. In addition, even if the outer diameter of the spring is reduced, it is not easy to maintain sufficient elastic repulsive force. That is, not only is it not easy to sufficiently reduce the outer diameter of the spring, but if the outer diameter of the spring is excessively reduced, there is a problem that the elastic repulsive force of the spring is lowered. In addition, when the spring is made fine, there is a problem that it is not easy to insert the spring into the body.
  • Probe device by bending the upper and lower ends of the upper and lower cylindrical body inward to prevent the upper plunger to escape to the outside, wherein the gap (S) between the upper plunger and the upper end of the bent body Will occur. That is, in order to enable the upper plunger to slide with respect to the body, a predetermined separation space is provided between the upper end of the body and the plunger. There is a problem flowing into the body through. The foreign matter introduced in this way is to reduce the elasticity of the spring, to prevent the slide movement of the upper plunger and to become a major cause of corrosion in the body there is a problem that causes the use of the probe for a long time.
  • the present invention has been made to solve the above-mentioned problems, and more particularly, it is an object of the present invention to provide a probe device that is easy to manufacture and does not penetrate foreign substances into the interior even after long-term use.
  • the probe device of the present invention for achieving the above object is a probe device for electrically connecting the terminal of the device under test and the pad of the test device with each other,
  • a first probe member including an upper probe portion having an end portion blocked and an accommodation portion disposed below the upper probe portion and having an accommodation groove extending from the lower portion to an upper side thereof;
  • a second probe member including a lower probe part disposed below the first probe member and an insertion part disposed above the lower probe part and inserted into the receiving groove;
  • It includes a spring member for elastically biasing the first probe member in a direction away from the second probe member,
  • the inner surface of the spring member is coupled to the outer surface of the first probe member and the outer surface of the second probe member.
  • the upper end of the spring member may be coupled to surround the outer surface of the receiving portion.
  • the outer diameter of the upper probe portion is greater than the inner diameter of the spring member, it is possible to prevent the spring member from passing out through the first probe member.
  • the receiving portion has a small diameter portion and a large diameter portion disposed above the small diameter portion and larger in diameter than the small diameter portion,
  • the spring member may be coupled to be in contact with the outer surface of the large diameter portion and spaced apart from the outer surface of the small diameter portion.
  • an intermediate portion of the spring member may be compressed and extended in a state of not being in contact with the first probe member and the second probe member.
  • an end portion of the upper probe portion may have one or more irregularities having a sharp tip.
  • the lower probe portion of the second probe member In the probe device, the lower probe portion of the second probe member, the lower portion in contact with the pad, the intermediate portion disposed on the upper side of the lower portion and having a diameter larger than the spring member, and the outer diameter equivalent to the inner diameter of the spring member
  • the branch is configured to include an upper side, and the spring member may be coupled to the outer surface of the upper portion.
  • the insertion portion when the insertion portion is inserted into the accommodation groove and slides along the direction in which the accommodation groove extends, at least a part of the outer surface of the insertion portion may contact the inner surface of the accommodation groove.
  • Probe device has the advantage that the spring member is disposed on the outer surface of the first probe member and the second probe member, so that the size of the spring member does not need to be significantly reduced.
  • the probe device according to the present invention has an advantage of preventing the defect of the product caused by the foreign matter even if used for a long time is not provided with a gap for penetrating foreign matter falling from the device under test.
  • FIG. 1 is a view showing a probe according to the prior art.
  • FIG. 2 is a view showing a probe device according to an embodiment of the present invention.
  • FIG. 3 is a diagram illustrating an example in which the probe device of FIG. 1 is installed.
  • FIG. 4 is a view showing a state of performing a test using the probe of FIG.
  • FIG. 5 is a view showing a probe device according to another embodiment of the present invention.
  • the probe device 100 is disposed between the device under test 140 and the test device 150 and has a terminal 141 of the device under test 140 and a pad 151 of the test device 150. ) To electrically connect each other, specifically, the terminal 141 of the device under test 140 is padd of the test device 150 while absorbing the impact force that the device under test 140 falls. 151 to be electrically connected.
  • the probe device 100 is configured to include a first probe member 110, a second probe member 120 and a spring member 130.
  • the first probe member 110 is configured to be in contact with the terminal 141 of the device under test 140, and includes an upper probe 111 and a housing 112.
  • the upper probe part 111 is closed at an end (upper end) and is in contact with the terminal 141 of the device under test 140 to prevent foreign substances from flowing into the inside, and has a conical portion and the cone. It consists of a disk-shaped part extending downward from the bottom of the shaped part.
  • the upper probe portion 111 may be plated with precious metal (gold) on the surface to facilitate electrical conduction when connected to the terminal 141 of the device under test 140.
  • the upper probe portion 111 may be made of a material of high hardness such as nickel so as not to be easily damaged due to frequent contact with the terminal 141 of the device under test 140.
  • the present invention is not limited thereto, and various materials may be used.
  • the outer diameter of the upper probe portion 111 is larger than the inner diameter of the spring member 130 to be described later can prevent the spring member 130 from passing upward through the first probe member 110. .
  • the accommodating part 112 is formed integrally with the upper probe part 111 and is disposed below the upper probe part 111 and has an accommodating groove 112 a extending in the vertical direction from the lower end to the upper part therein. This will be provided.
  • the receiving groove 112a may have a length through which the insertion portion 122 of the second probe member 120 to be described later is fully inserted, and may have a shape corresponding to the insertion portion 122.
  • the inner diameter of the receiving groove 112a is somewhat larger than the outer diameter of the inserting portion 122 so that the insertion portion 122 can be easily linearly moved along the receiving groove 112a in a state of being fitted into the receiving groove 112a. do.
  • the inner surface of the receiving portion 112 may be subjected to the surface plating treatment of a precious metal such as gold so as to facilitate the electrical connection with the insertion portion 122 when in contact with the insertion portion 122. .
  • the receiving portion 112 is opened toward the lower end and the upper portion is blocked by the upper probe portion 111, foreign matter falls from the terminal 141 of the device under test 140. Even if the foreign matter is not inserted into the interior of the receiving groove (112a).
  • the receiving portion 112 has a small diameter portion 1121 disposed below the lower portion, and a large diameter portion 1122 disposed above the small diameter portion 1121 and larger in diameter than the small diameter portion 1121. At this time, the spring member 130 to be described later is caught in the large diameter portion 1122. As described above, as the small diameter portion 1121 is provided, the length of the entire accommodating portion 112 is lengthened, as well as the contact area between the spring member 130 and the accommodating portion 112 is minimized, thereby providing the spring member 130. Is less in contact with the receiving portion 112 in the process of compression and extension and thus less disturb the expansion and contraction of the spring.
  • the second probe member 120 includes a lower probe part 121 and an insertion part 122.
  • the lower probe part 121 is disposed below the first probe member 110 and is in contact with the pad 151 of the inspection device 150. More specifically, the lower probe part 1211 and the intermediate part ( 1212 and an upper portion 1213.
  • the lower end part 1211 is formed in a conical shape in which an end is blocked and is in contact with the pad 151, and the end part has a round shape.
  • the intermediate part 1212 is disposed above the lower end part 1211 and has an outer diameter larger than the inner diameter of the spring member 130 and has a disc shape. As such, the outer diameter of the intermediate portion 1212 is larger than the inner diameter of the spring member 130 so that the spring member 130 does not deviate from the lower probe portion 121.
  • the upper portion 1213 has a cylindrical shape having an outer diameter equal to the inner diameter of the spring member 130, and is a portion at which the lower end of the spring member 130 is coupled and supported.
  • the insertion part 122 is disposed above the lower probe part 121 and is inserted into the accommodation groove 112a.
  • the insertion part 122 is inserted into the accommodation groove 112a.
  • the slide moves along the receiving groove 112a.
  • the insertion part 122 may have a substantially cylindrical shape, but an upper end thereof may have a sharp cone shape.
  • the outer diameter of the insertion portion 122 may be slightly smaller than the inner diameter of the receiving groove (112a).
  • the surface of the insertion part 122 may be plated with a precious metal such as gold to facilitate electrical conduction when contacted with the inner surface of the receiving groove 112a.
  • the inserting portion 122 when the inserting portion 122 is inserted into the receiving groove 112a and slides, at least a part of the outer surface of the inserting portion 122 is in contact with the inner surface of the receiving groove 112a so as to move the current ( To simplify current pass). That is, although the current may move between the first and second probe members 110 and 120 by the spring member 130, the insertion portion 122 contacts the inner surface of the receiving groove 112a. This further simplifies the path of travel, allowing the current to travel faster.
  • the spring member 130 is to bias the first probe member 110 in a direction away from the second probe member 120, specifically, the wire is wound in a spiral form.
  • the spring member 130 may be plated with a noble metal such as gold in consideration of oxidation prevention and electrical current transfer speed.
  • the spring member 130, the inner surface may be coupled to the outer surface of the first probe member 110 and the outer surface of the second probe member 120.
  • the upper end of the spring member 130 is coupled to the receiving portion 112 while wrapping the outer surface of the receiving portion 112, the lower end of the spring member 130 is the upper side ( 1213) can be fitted to the outer surface of the coupling.
  • the intermediate portion 1212 of the spring member 130 is in a state of not being in contact with the first and second probe members 110 and 120. As such, since the middle portion 1212 of the spring member 130 is not placed in contact, there is an advantage in that elastic compression and elastic restoration of the spring can be facilitated.
  • Probe device 100 according to an embodiment of the present invention has the following effects.
  • the probe device 100 is disposed between the device under test 140 and the test device 150. At this time, the probe device 100 is supported by the housing, but the detailed description is omitted because it is a conventional technology.
  • the insertion part 122 receives the receiving groove. It is to be inserted into the (112a) and the spring member 130 is to be compressed.
  • a predetermined amount is determined from the pad 151 of the test apparatus 150. An electrical signal or current is applied and transferred to the device under test 140 through the probe device 100, so that a predetermined test is performed.
  • the probe device there is an advantage that the assembly is easy because the spring member is disposed outside the receiving groove.
  • the spring member since the spring member may be made at least larger than the diameter of the receiving portion, it is easy to manufacture the spring and can be easily applied even when the terminal of the device under test has a fine pitch.
  • the probe device since the spring member can minimize the contact portion with the first probe member, the second probe member, there is an advantage that the compression and extension of the spring member is easy.
  • the probe device since the receiving groove is open only to the lower side, even if foreign matter falls from the device under test, there is no fear that the foreign matter may enter the inside of the receiving groove and accordingly the insertion portion It does not interfere with the slide movement. As a result, even when used for a long time, there is little possibility that the probe device may be broken, and it is possible to guarantee a constant stroke and life.
  • the probe device according to one embodiment of the present invention may be modified as follows.
  • the upper end of the first probe member is referred to as having a shape having a single pointed unevenness, but is not limited to this, as shown in Figure 5 the end of the first probe member 110 '
  • having a large number of irregularities can be considered.
  • the probe device according to the present invention is not limited thereto, and may be expanded and interpreted as long as it is reasonably interpreted according to the claims.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne un dispositif sonde et, plus particulièrement, un dispositif sonde servant à connecter électriquement une borne d'un dispositif d'analyse de sang à un tampon d'un appareil d'analyse, le dispositif sonde comprenant : un premier élément de sonde comprenant une partie de sonde supérieure dont une partie d'extrémité est amenée en contact avec le dispositif d'analyse de sang, et une partie de réception qui est disposée sous la partie de sonde supérieure et qui est disposée dans une rainure de réception s'étendant vers le haut de l'extrémité inférieure ; un second élément de sonde comprenant une partie de sonde inférieure dont une partie d'extrémité est amenée en contact avec le tampon de l'appareil d'analyse, et une partie d'introduction qui est disposée au-dessus de la partie de sonde inférieure et est introduite à l'intérieur de la rainure de réception ; et un élément ressort destiné à solliciter élastiquement le premier élément de sonde dans un sens allant en s'éloignant du second élément de sonde, la surface intérieure de l'élément ressort étant couplée à la surface extérieure du premier élément de sonde et à la surface extérieure du second élément de sonde.
PCT/KR2014/000245 2014-01-09 2014-01-09 Dispositif sonde WO2015105209A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/KR2014/000245 WO2015105209A1 (fr) 2014-01-09 2014-01-09 Dispositif sonde

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2014/000245 WO2015105209A1 (fr) 2014-01-09 2014-01-09 Dispositif sonde

Publications (1)

Publication Number Publication Date
WO2015105209A1 true WO2015105209A1 (fr) 2015-07-16

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PCT/KR2014/000245 WO2015105209A1 (fr) 2014-01-09 2014-01-09 Dispositif sonde

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110031659A (zh) * 2019-04-16 2019-07-19 深圳市美锐精密电子有限公司 一种用于电子检测的抗扭转探针及装配方法
CN115184652A (zh) * 2022-07-06 2022-10-14 渭南木王智能科技股份有限公司 一种细长稳流测试探针
CN115184652B (en) * 2022-07-06 2024-07-09 渭南木王智能科技股份有限公司 Slender steady flow test probe

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000062366A (ko) * 1996-12-27 2000-10-25 마에다 츠구요시 접촉 탐침 장치
KR20040052916A (ko) * 2004-05-17 2004-06-23 리노공업주식회사 대전류용 프로브
KR20050087300A (ko) * 2004-02-26 2005-08-31 (주)티에스이 반도체 패키지용 테스트 소켓
KR101020025B1 (ko) * 2010-06-01 2011-03-09 주식회사 엔티에스 전자부품 검침 프로브
KR101330995B1 (ko) * 2012-07-10 2013-11-20 박상량 굽은 등 형상의 스프링 프로 브 핀

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000062366A (ko) * 1996-12-27 2000-10-25 마에다 츠구요시 접촉 탐침 장치
KR20050087300A (ko) * 2004-02-26 2005-08-31 (주)티에스이 반도체 패키지용 테스트 소켓
KR20040052916A (ko) * 2004-05-17 2004-06-23 리노공업주식회사 대전류용 프로브
KR101020025B1 (ko) * 2010-06-01 2011-03-09 주식회사 엔티에스 전자부품 검침 프로브
KR101330995B1 (ko) * 2012-07-10 2013-11-20 박상량 굽은 등 형상의 스프링 프로 브 핀

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110031659A (zh) * 2019-04-16 2019-07-19 深圳市美锐精密电子有限公司 一种用于电子检测的抗扭转探针及装配方法
CN110031659B (zh) * 2019-04-16 2021-06-08 深圳市美锐精密电子有限公司 一种用于电子检测的抗扭转探针及装配方法
CN115184652A (zh) * 2022-07-06 2022-10-14 渭南木王智能科技股份有限公司 一种细长稳流测试探针
CN115184652B (en) * 2022-07-06 2024-07-09 渭南木王智能科技股份有限公司 Slender steady flow test probe

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