WO2015103801A1 - 背光模组及用该背光模组的液晶显示装置 - Google Patents

背光模组及用该背光模组的液晶显示装置 Download PDF

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Publication number
WO2015103801A1
WO2015103801A1 PCT/CN2014/071164 CN2014071164W WO2015103801A1 WO 2015103801 A1 WO2015103801 A1 WO 2015103801A1 CN 2014071164 W CN2014071164 W CN 2014071164W WO 2015103801 A1 WO2015103801 A1 WO 2015103801A1
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WO
WIPO (PCT)
Prior art keywords
plate
disposed
backlight
board
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/071164
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English (en)
French (fr)
Inventor
俞刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/349,385 priority Critical patent/US9322982B2/en
Priority to GB1606693.8A priority patent/GB2534741B/en
Priority to KR1020167013145A priority patent/KR101807442B1/ko
Priority to JP2016542683A priority patent/JP6247769B2/ja
Publication of WO2015103801A1 publication Critical patent/WO2015103801A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/13332—Front frames
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means

Definitions

  • the present invention relates to the field of flat display, and in particular to a backlight module and a display device using the same.
  • Liquid Crystal Display has many advantages, such as mobile phone, personal digital assistant (PDA), digital camera, computer screen or laptop screen. Wait.
  • liquid crystal display devices which include a casing, a liquid crystal panel disposed in the casing, and a backlight module disposed in the casing.
  • the structure of a conventional liquid crystal panel is composed of a color filter substrate (Color Filter), a thin film transistor Array Substrate (TFT Array Substrate), and a substrate disposed between the two substrates.
  • the liquid crystal layer is composed of a liquid crystal layer.
  • the working principle is to control the rotation of the liquid crystal molecules of the liquid crystal layer by applying a driving voltage on the two glass substrates, and refract the light of the backlight module to produce a picture whh Since the liquid crystal panel itself is not
  • the light source needs to be normally displayed by the light source provided by the backlight module. Therefore, the backlight module becomes one of the key components of the liquid crystal display device.
  • the backlight module is divided into a side-in type backlight module and a direct-type backlight module according to different incident positions of the light source.
  • the direct-lit backlight module is provided with a light source such as a cathode fluorescent lamp (CCFL) or a light emitting diode (LED) disposed behind the liquid crystal panel to directly form a surface light source for the liquid crystal panel.
  • CCFL cathode fluorescent lamp
  • LED light emitting diode
  • the side-lit backlight module has a backlight LED strip (Light bar) disposed at the edge of the back panel behind the liquid crystal panel, and the light emitted by the LED strip is from the light guide plate (LGP) side.
  • the smooth surface enters the light guide plate, is reflected and diffused, and is emitted from the light exit surface of the light guide plate, and then passes through the optical film group to form a surface light source to be supplied to the liquid crystal panel.
  • FIG. 1 is a schematic structural diagram of a conventional liquid crystal display device, including: a backlight module 100, a plastic frame 300 disposed on the backlight module 100, a liquid crystal display panel 500 disposed on the plastic frame 300, and The front cover 700 of the liquid crystal display panel 500, the backlight module 100 includes a back plate 101, a light guide plate 103 disposed in the back plate 101, and a backlight 105 disposed in the light guide plate 103.
  • the backlight 105 includes a PCB.
  • the distance between the light guide plate 103 and the backlight module disposed on the side panel of the backlight module 100 is smaller than the gap between the light guide plate 103 and the back plate 101 side plate 113.
  • a heat dissipation plate 107 is disposed between the PCB board 15 and the bottom plate 111 of the backplane 01 to dissipate heat from the LED chip 153. It is better transmitted to the backplane 01, and then the backplane 101 exchanges heat with the outside to perform heat dissipation. Although the heat dissipation effect is improved, the thickness of the backlight module 100 is increased, thereby increasing the thickness of the entire liquid crystal display device, which is contrary to the current thinning trend.
  • Another object of the present invention is to provide a liquid crystal display device which is simple in structure, thin in thickness, and advantageous in achieving narrow frame.
  • the present invention provides a backlight module, including: a backplane, a light guide plate disposed in the backplane, a backlight disposed in the backplane, and a heat dissipation plate disposed between the backlight and the backplane.
  • the backplane includes a bottom plate and a side plate vertically connected to the bottom plate, the backlight includes a PCB board and an LED chip on the PCB board, and the PCB board is mounted on the bottom board of the back board and the heat dissipation board.
  • the PCB board includes a mounting portion and a lap portion connecting the mounting portion
  • the heat dissipation plate includes a support portion and a receiving portion connecting the support portions, wherein the receiving portion is disposed corresponding to the lap portion, and the lap portion is assembled when assembled
  • the light guide plate is carried on the support portion and the overlapping portion.
  • a backlight is disposed on the bottom plate of the backboard corresponding to the backlight and the heat dissipation plate, and the backlight and the heat dissipation plate are mounted and engaged in the slot.
  • the light guide plate includes a bottom surface facing the bottom plate of the back plate, a top surface disposed opposite to the bottom surface, and a plurality of side surfaces disposed between the bottom surface and the top surface, wherein the plurality of side surfaces include at least one light incident surface, and the LED chip corresponds to The light incident surface is disposed between the light guide plate and the side plate of the back plate.
  • a bottom reflective sheet disposed between the bottom surface of the light guide plate and the bottom plate of the back sheet.
  • the present invention also provides a liquid crystal display device, comprising: a backlight module, a plastic frame disposed on the backlight module, a liquid crystal display panel disposed on the plastic frame, and a front frame disposed on the liquid crystal display panel, the backlight module
  • the group includes a back plate, a light guide plate disposed in the back plate, a backlight disposed in the back plate, and a heat dissipation plate disposed between the backlight and the back plate, wherein the back plate includes a bottom plate and a side plate vertically connected to the bottom plate.
  • the backlight includes a PCB board and an LED chip on the PCB board.
  • the PCB board is mounted on the bottom board of the back board and the heat dissipation board, and the PCB board includes a mounting portion and a lap joint connecting the mounting portions.
  • the heat dissipation plate includes a support portion and a receiving portion connecting the support portions, and the receiving portion is correspondingly overlapped And the lap joint is overlapped on the receiving portion, and the light guide plate is carried on the support portion and the lap portion.
  • a backlight is disposed on the bottom plate of the backplane corresponding to the backlight and the heat dissipation plate, and the backlight and the heat dissipation plate are mounted and engaged in the groove.
  • the light guide plate includes a bottom surface facing the bottom plate of the back plate, a top surface disposed opposite to the bottom surface, and a plurality of side surfaces disposed between the bottom surface and the top surface, wherein the plurality of side surfaces include at least one light incident surface, and the LED chip corresponds to The light incident surface is disposed between the light guide plate and the side plate of the back plate.
  • the backlight module further includes a bottom reflective sheet disposed between the bottom surface of the light guide plate and the bottom plate of the back plate.
  • the optical film set disposed between the backlight module and the liquid crystal display panel is further included.
  • the present invention also provides a liquid crystal display device, comprising: a backlight module, a plastic frame disposed on the backlight module, a liquid crystal display panel disposed on the plastic frame, and a front frame disposed on the liquid crystal display panel, the backlight module
  • the group includes a board, a light guide plate disposed in the back board, a backlight disposed in the back board, and a heat sink disposed between the backlight and the back board, the back board including a bottom board and a side board vertically connecting the bottom board
  • the backlight includes a PCB board and an LED chip on the PCB board, the PCB board is mounted on the bottom board of the back board and the heat dissipation board, and the PCB board includes a mounting portion and a lap joint connecting the mounting portion.
  • the heat dissipation plate includes a support portion and a receiving portion that connects the support portion.
  • the receiving portion is disposed corresponding to the overlapping portion. When assembling, the overlapping portion is overlapped on the receiving portion, and the light guide plate is supported by the support. Department and lap joint;
  • the backplane has a recess corresponding to the backlight and the heat sink, and the backlight and the heat sink are mounted and engaged in the recess.
  • the light guide plate includes a bottom surface facing the bottom plate of the back plate, a top surface disposed opposite to the bottom surface, and a plurality of side surfaces disposed between the bottom surface and the top surface, wherein the plurality of side surfaces include at least one light incident surface, and the LED chip corresponds to The light incident surface is disposed between the light guide plate and the side plate of the back plate.
  • the backlight module further includes a bottom reflective sheet disposed between the bottom surface of the light guide plate and the bottom plate of the back plate.
  • the optical film set disposed between the backlight module and the liquid crystal display panel is further included.
  • the backlight module of the present invention and the liquid crystal display device using the backlight module by directly printing the LED chip on the PCB board, placing the PCB board on the backplane substrate, and setting the LED chip on the LED chip Between the light-incident surface of the light guide plate and the side plate of the back plate, a narrow frame of the liquid crystal display device can be realized, and at the same time, a lap portion is provided on the PCB board, and a receiving portion, a lap portion and a receiving portion are disposed on the heat dissipation plate The mutual cooperation can improve the heat dissipation effect without increasing the thickness of the backlight module, which is advantageous for realizing the thinning of the liquid crystal display device.
  • FIG. 1 is a schematic cross-sectional structural view of a conventional liquid crystal display device
  • FIG. 2 is a schematic cross-sectional structural view of a backlight module of the present invention
  • FIG. 3 is a schematic cross-sectional view showing a liquid crystal display device of the present invention. detailed description
  • the present invention provides a backlight module, including: a back plate 2 , a light guide plate 4 disposed in the back plate 2 , a backlight 6 disposed in the back plate 2 , and a backlight 6 and a back plate
  • the light emitted by the backlight 6 is reflected by the bottom reflection sheet 9 or directly enters the light guide plate 4, and is propagated in the light guide plate 4, thereby converting the point light source into a surface light source.
  • the backplane 2 includes a bottom plate 22 and a side plate 24 that vertically connects the bottom plate 22 , and the bottom plate 22 of the back plate 2 is provided with a recess 222 corresponding to the backlight 6 and the heat dissipation plate 8 .
  • the backlight 6 and the heat dissipation plate 8 are mounted and engaged in the recess 222.
  • the backlight 6 includes a PCB board 62. and an LED chip 64 on the PCB board 62.
  • the PCB board 62 is mounted on the bottom board 22 and the heat sink board 8 of the back board 2.
  • the heat generated by the LED chip 64 is transmitted to the backboard 2 and the heat sink 8 through the PCB board 62, and then radiated by heat exchange with the outside, and the heat dissipation effect of the PCB board 62 is poor, and the heat dissipation effect of the heat sink 8 is better. , can make up for the defect that the heat dissipation effect of the PCB board 62 is not good, thereby improving the quality of the backlight module.
  • the light guide plate 4 includes a bottom surface 42 facing the bottom plate 22 of the back plate 2, a top surface 44 disposed opposite to the bottom surface 42, and a plurality of sides disposed between the bottom surface 42 and the top surface 44, wherein the plurality of inverted surfaces include at least one
  • the LED chip 64 is disposed between the light guide plate 4 and the side plate 24 of the back plate 2 corresponding to the light incident surface 46. Since the PCB board 62 is disposed on the bottom plate 22 of the back board 2, only the LED chip 64 is disposed between the side board 24 of the back board 2 and the light guide board 4 corresponding to the light incident surface 46, thereby effectively reducing the light guide board 4 and the back side.
  • the distance between the side panels 24 of the panel 2 facilitates a narrow frame.
  • the PCB board 62 includes a mounting portion 622 and a lap portion 624 that connects the mounting portion 622.
  • the heat sink 8 includes a support portion 82 and a receiving portion 84 that connects the support portion 82.
  • the splicing portion 624 is disposed on the receiving portion 84, and the light guide plate 4 is carried on the supporting portion 82 and the overlapping portion 624, and the overlapping portion 624 is
  • the receiving portion 84 is disposed so that the total thickness of the PCB board 62 and the heat dissipation board 8 is equal to the thickness of the existing PCB board, thereby improving the heat dissipation effect without increasing the thickness of the backlight module, thereby facilitating thinning.
  • the present invention further provides a liquid crystal display device, including: a backlight module 20 , a plastic frame 40 disposed on the backlight module 20 , a liquid crystal display panel 60 disposed on the plastic frame 40 , and a liquid crystal display
  • the front frame 80 of the panel 60 and the optical film set 90 disposed between the backlight module 20 and the liquid crystal display panel 60.
  • the backlight module 20 is used to provide a surface light source
  • the plastic frame 40 is used to carry a liquid crystal display.
  • the front frame 80 is used to fix the liquid crystal display panel 60 to the plastic frame 40.
  • the backlight module 20 includes a back plate 2, a light guide plate 4 disposed in the back plate 2, a backlight 6 disposed in the back plate 2, and is disposed between the backlight 6 and the back plate 2.
  • the heat dissipation plate 8 and the bottom reflection sheet 9 disposed between the light guide plate 4 and the back plate 2.
  • the light emitted by the backlight 6 is reflected by the bottom reflection sheet 9 or directly enters the light guide plate 4, and is propagated in the light guide plate 4 to convert the point light source into a surface light source.
  • the backboard 2 includes a bottom plate 22 and a side plate 24 that vertically connects the bottom plate 22 , and the bottom plate 22 of the back plate 2 is provided with a recess 222 corresponding to the backlight 6 and the heat dissipation plate 8 .
  • the backlight 6 and the heat dissipation plate 8 are mounted and engaged in the recess 222.
  • the backlight 6 includes a PCB board 62 and an LED chip 64 that is wound on the PCB board 62.
  • the PCB board 62 is mounted on the bottom board 22 and the heat sink board 8 of the back board 2.
  • the heat generated by the LED chip 64 is transmitted to the backboard 2 and the heat sink 8 through the PCB board 62, and then radiated by heat exchange with the outside, and the heat dissipation effect of the PCB board 62 is poor, and the heat dissipation effect of the heat sink 8 is relatively high. Well, it can make up for the defect that the heat dissipation effect of the PCB board 62 is not good, thereby improving the quality of the backlight module.
  • the light guide plate 4 includes a bottom surface 42 facing the bottom plate 22 of the back plate 2, a top surface 44 disposed opposite to the bottom surface 42, and a plurality of sides disposed between the bottom surface 42 and the top surface 44, wherein the plurality of sides include at least one inlet
  • the light surface 46 is disposed between the light guide plate 4 and the side plate 24 of the back plate 2 corresponding to the light incident surface 46. Since the PCB board 62 is disposed on the bottom plate 22 of the back board 2, only the LED chip 64 is disposed corresponding to the light incident surface 46.
  • the side board 24 of the back board 2 is disposed between the side plate 24 and the light guide plate 4, thereby effectively reducing the light guide plate 4. The distance from the side panel 24 of the backboard 2 facilitates narrow frame formation.
  • the PCB board 62 includes a mounting portion 622 and a lap portion connecting the mounting portions 622 624
  • the heat dissipation plate 8 includes a support portion 82 and a receiving portion 84 that connects the support portion 82.
  • the receiving portion 84 is disposed corresponding to the overlapping portion 624. When assembled, the overlapping portion 624 is overlapped with the receiving portion 84.
  • the light guide plate 4 is carried on the support portion 82 and the lap portion 624.
  • the lap portion 624 is matched with the receiving portion 84 such that the total thickness of the PCB board 62 and the heat dissipation plate 8 is equal to the existing PCB.
  • the thickness of the board further improves the heat dissipation effect without increasing the thickness of the backlight module, which is advantageous for thinning.
  • the backlight module of the present invention and the liquid crystal display device using the backlight module are disposed on the PCB board by directly printing the LED chip on the PCB board, and the LED chip is disposed on the backplane.
  • a narrow frame of the liquid crystal display device can be realized between the light incident surface of the light plate and the side plate of the back plate.
  • a lap portion is disposed on the PCB board, and a receiving portion is disposed on the heat dissipation plate, and the lap portion and the receiving portion are mutually connected
  • the heat dissipation effect is improved without increasing the thickness of the backlight module, which is advantageous for achieving a thinner liquid crystal display device.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

提供了一种背光模组（20）及用该背光模组（20）的液晶显示装置。背光模组（20）包括背板（2）、设于背板（2）内的导光板（4）、设于背板（2）内的背光源（6）及设于背光源（6）与背板（2）之间的散热板（8），背板（2）包括底板（22）及垂直连接底板（22）的侧板（24），背光源（6）包括PCB板（62）及打件于PCB板（62）上的LED芯片（64），PCB板（62）安装于背板（2）的底板（22）及散热板（8）上，PCB板（62）包括安装部（622）及连接安装部（622）的搭接部（624），散热板（8）包括支撑部（82）及连接支撑部（82）的承接部（84），搭接部（624）搭接于承接部（84）上，导光板（4）承载于该支撑部（82）与搭接部（624）上，因此，可以达到结构简单，散热效果好，厚度薄以及窄边框化的目的。

Description

f光模组及用该背光模组的液晶显示装置
本发明涉及平面显示领域， 尤其涉及一种背光模组及用该背光模组的 显示装置。
液晶显示装置 ( Liquid Crystal Display, LCD )具有机身薄、 省电、 无 辐射等众多优点， 得到了广泛的应用， 如移动电话、 个人数字助理 ( PDA ) 、 数字相机、 计算机屏幕或笔记本电脑屏幕等。
现有市场上的液晶显示装置大部分为背光型液晶显示装置， 其包括壳 体、 设于壳体内的液晶面板及设于壳体内的背光模组 （ Backlight module ) 。 传统的液晶面板的结构是由一彩色滤光片基板 （ Color Filter ) ■' 一— 月莫晶 4 ' 「车歹 基 ( Thin Film Transistor Array Substrate , TFT Array Substrate ) 以及一配置于两基板间的液晶层 ( Liquid Crystal Layer )所构成， 其工作原理是通过在两片玻璃基板上施加驱动电压来控制 液晶层的液晶分子的旋转， 将背光模组的光线折射出来产生画面„ 由于液 晶面板本身不发光， 需要借由背光模组提供的光源来正常显示影像， 因 此， 背光模组成为液晶显示装置的关键组件之一。 背光模组依照光源入射 位置的不同分成側入式背光模组与直下式背光模组两种。 直下式背光模组 是将发光光源例如阴极萤光灯管 （Cold Cathode Fluorescent Lamp, CCFL) 或发光二极管 (Light Emitting Diode, LED)设置在液晶面板后方， 直接形成 面光源提供给液晶面板。 而侧入式背光模组是将背光源 LED 灯条（Light bar )设于液晶面板侧后方的背板边缘处， LED 灯条发出的光线从导光板 ( Light Guide Plate , LGP )—侧的入光面进入导光板， 经反射和扩散后从 导光板出光面射出， 再经由光学膜片组， 以形成面光源提供给液晶面板。
请参阅图 1 , 为现有一种液晶显示装置的结构示意图， 其包括： 背光 模组 100、 设于背光模组 100上的胶框 300、 设于胶框 300上的液晶显示 面板 500及设于液晶显示面板 500上的前框 700, 所述背光模组 100包括 背板 101、 设于背板 101 内的导光板 103 及设于导光板 103 内的背光源 105 , 所述背光源 105 包括 PCB板 151 及直接打件于 PCB板 151 上的 LED芯片 153 , PCB板 151设于背板 101的底板 111上， LED芯片 153对 应导光板 103的入光面 131设置于背板 101的侧板 113与导光板 103的入 光面 131 之间， 相比于现有的将背光源设于侧板上的背光模组， 本背光模 组 100中的导光板 103与背板 101侧板 113之间的间距较小， 利于实现液 晶显示装置的窄边框化， 另， 为了提高背光模组 100的散热效果， 在 PCB 板 15 与背板】01的底板 111之间设置一散热板 107， 以将 LED芯片 153 散发出来的热量更好的传递给背板 01， 再由背板 101 与外界进行热交 换， 以进行 ·散热。 这样虽然提高了散热效果， 但却增加了背光模组 100 的 厚度， 进而增加了整个液晶显示装置的厚度， 与目前的薄型化趋势相违
发明内容
本发明的目的在于提供一种背光模组， 其结构简单、 散热效果好、 厚 度薄， 且利于实现液晶显示装置的窄边框化。
本发明的另一目的在于提供一种液晶显示装置， 其结构简单、 厚度 薄， 且利于实现窄边框化。
为实现上述目的， 本发明提供一种背光模组， 包括： 背板、 设于背板 内的导光板、 设于背板内的背光源及设于背光源与背板之间的散热板， 所 述背板包括底板及垂直连接底板的侧板， 所述背光源包括 PCB板及打件于 PCB板上的 LED芯片， 所述 PCB板安装于所述背板的底板.及散热板上， 该 PCB板包括安装部及连.接安装部的搭接部， 所述散热板包括支撑部及连 接支撑部的承接部， 所述承接部对应搭接部设置， 组装时， 所述搭接部搭 接于所述承接部上， 所述导光板承载于所述支撑部与搭接部上。
所述背板的底板上对应背光源与散热板设有凹槽， 所述背光源与散热 板安装并卡合于该 槽内。
所述导光板包括朝向背板底板的底面、 与底面相对设置的顶面及设于 底面与顶面之间的数个侧面 , 该数个侧面中包括至少一个入光面， 所述 LED芯片对应所述入光面设置于导光板与背板的侧板之间。
还包括设于导光板的底面与背板的底板之间的底反射片。
本发明还提供一种液晶显示装置， 包括： 背光模组、 设于背光模组上 的胶框、 设于胶框上的液晶显示面板及设于液晶显示面板上的前框， 所述 背光模组包括背板、 设于背板内的导光板、 设于背板内的背光源及设于背 光源与背板之间的散热板， 所述背板包括底板及垂直连接底板的侧板， 所 述背光源包括 PCB板及打件于 PCB板上的 LED芯片 , 所述 PCB板安装 于所述背板的底板及散热板上， 该 PCB板包括安装部及连接安装部的搭接 部， 所述散热板包括支撑部及连接支撑部的承接部， 所述承接部对应搭接 部设置， 组装时， 所述搭接部搭接于所述承接部上， 所述导光板承载于所 述支撑部与搭接部上。
所述背板的底板上对应背光源与散热板设有 槽， 所述背光源与散热 板安装并卡合于该凹槽内。
所述导光板包括朝向背板底板的底面、 与底面相对设置的顶面及设于 底面与顶面之间的数个側面， 该数个侧面中包括至少一个入光面， 所述 LED芯片对应所述.入光面设置于导光板与背板的侧板之间。
所述背光模组还包括设于导光板的底面与背板的底板之间的底反射 片。
还包括设于背光模组与液晶显示面板之间的光学膜片组。
本发明还提供一种液晶显示装置， 包括： 背光模组、 设于背光模组上 的胶框、 设于胶框上的液晶显示面板及设于液晶显示面板上的前框， 所述 背光模组包括板、 设于背板内的导光板， 设于背板内的背光源及设于背光 源与背板之间的散热板， 所述背板包括底板及垂直连接底板的侧板， 所述 背光源包括 PCB板及打件于 PCB板上的 LED芯片， 所述 PCB板安装于 所述背板的底板及散热板上， 该 PCB 板包括安装部及连接安装部的搭接 部， 所述散热板包括支撑部及连接支撑部的承接部， 所述承接部对应搭接 部设置， 组装时， 所述搭接部搭接于所述承接部上， 所述导光板承载于所 述支撑部与搭接部上；
其中， 所述背板的底板上对应背光源与散热板设有凹槽， 所述背光源 与散热板安装并卡合于该凹槽内。
所述导光板包括朝向背板底板的底面、 与底面相对设置的顶面及设于 底面与顶面之间的数个側面， 该数个侧面中包括至少一个入光面， 所述 LED芯片对应所述.入光面设置于导光板与背板的侧板之间。
所述背光模组还包括设于导光板的底面与背板的底板之间的底反射 片。
还包括设于背光模组与液晶显示面板之间的光学膜片组。
本发明的有益效果： 本发明的背光模组及用该背光模组的液晶显示装 置， 通过直接将 LED 芯片打件于 PCB板上， 将 PCB板设置于背板底板 上， 将 LED 芯片设于导光板的入光面与背板的侧板之间， 可以实现液晶 显示装置的窄边框化， 同时， 在 PCB板上设置搭接部， 在散热板上设置承 接部， 搭接部与承接部相互配合， 在提高散热效杲的同时不增加背光模组 的厚.度， 利于实现液晶显示装置的薄型化。
为了能更进一步了解本发明的特征以及技术内容， 请参阅以下有关本 发明的详细说明与酎图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1为现有的一种液晶显示装置的剖面结构示意图；
图 2为本发明背光模组的剖面结构示意图；
图 3为本发明液晶显示装置的剖面结构示意图。 具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 2 , 本发明提供一种背光模组， 包括： 背板 2、 设于背板 2 内的导光板 4、 设于背板 2 内的背光源 6、 设于背光源 6与背板 2之间的 散热板 8及设于导光板 4与背板 2之间的底反射片 9。 所述背光源 6发出 的光线经由底反射片 9反射或直接进入导光板 4, 并在导光板 4 内进行传 播， 进而将点光源转变成面光源。
具体地， 请参阔图 2, 所述背板 2 包括底板 22及垂直连接底板 22的 侧板 24， 所述背板 2 的底板 22 上对应背光源 6 与散热板 8 设有凹槽 222, 所述背光源 6与散热板 8安装并卡合于该凹槽 222内。 所述背光源 6 包括 PCB板 62.及打件于 PCB板 62上的 LED芯片 64， 所述 PCB板 62安 装于所述背板 2的底板 22及.散热板 8上。 所述 LED芯片 64产生的热量 通过 PCB板 62传递给背板 2及散热板 8, 再通过与外界进行热交换而散 热， PCB板 62的散热效果较差， 而散热板 8的散热效果较好， 可以弥补 PCB板 62散热效果不好的缺陷， 进而提升了背光模组的品质。
所述导光板 4包括朝向背板 2底板 22的底面 42、 与底面 42相对设置 的顶面 44及设于底面 42与顶面 44之间的数个侧面， 该数个倒面中包括 至少一个入光面 46, 所述 LED芯片 64对应所述入光面 46设置于导光板 4与背板 2的侧板 24之间。 由于 PCB板 62设置于背板 2的底板 22上， 只有 LED芯片 64对应所述入光面 46设置于背板 2的侧板 24与导光板 4 之间， 有效减小了导光板 4与背板 2的侧板 24之间的距离， 利于实现窄 边框化。 进一步地， 该 PCB板 62包括安装部 622及连接安装部 622的搭接部 624, 所述.散热板 8包括支撑部 82及连接支撑部 82的承接部 84， 所述.承 接部 84对应搭接部 624设置， 组装时， 所述搭接部 624搭接于所述承接 部 84上， 所述导光板 4承载于所述支撑部 82与搭接部 624上， 所述搭接 部 624与承接部 84配合设置， 使得 PCB板 62与散热板 8的总厚度等于现 有的 PCB板的厚度， 进而实现在提高散热效果的同时， 不增加背光模组的 厚度， 利于实现薄型化。
请参阅图 3， 本发明还提供一种液晶显示装置， 包括： 背光模组 20、 设于背光模组 20上的胶框 40、 设于胶框 40上的液晶显示面板 60、 设于 液晶显示面板 60上的前框 80及设于背光模组 20与液晶显示面板 60之间 的光学膜片组 90， 所述背光模组 20用于提供面光源， 所述胶框 40用于承 载液晶显示面板 60， 所述前框 80用于将液晶显示面板 60 固定与胶框 40 内。
在本实施例中， 所述背光模组 20包括背板 2、 设于背板 2内的导光板 4、 设于背板 2内的背光源 6、 设于背光源 6与背板 2之间的散热板 8及设 于导光板 4与背板 2之间的底反射片 9。 所述背光源 6发出的光线经由底 反射片 9反射或直接进入导光板 4， 并在导光板 4 内进行 ·传播， 进 将点 光源转变成面光源。
具体地， 请参阔图 3 , 所述背板 2包括底板 22及垂直连接底板 22的 侧板 24， 所述背板 2 的底板 22 上对应背光源 6 与散热板 8设有凹槽 222, 所述背光源 6与散热板 8安装并卡合于该凹槽 222内。 所述背光源 6 包括 PCB板 62及打件于 PCB板 62上的 LED芯片 64， 所述 PCB板 62安 装于所述背板 2的底板 22及散热板 8上。 所述 LED芯片 64产生的热量 通过 PCB板 62传递给背板 2及散热板 8, 再通过与外界进行热交换而散 热， PCB板 62的散热效果较差， 而散热板 8的散热效果较.好， 可以弥补 PCB板 62散热效果不好的缺陷， 进而提升了背光模组的品质。
所述导光板 4包括朝向背板 2底板 22的底面 42、 与底面 42相对设置 的顶面 44及设于底面 42与顶面 44之间的数个侧面， 该数个侧面中包括 至少一个入光面 46, 所述 LED芯片 64对应所述入光面 46设置于导光板 4与背板 2的側板 24之间。 由于 PCB板 62设置于背板 2的底板 22上， 只有 LED芯片 64对应所述入光面 46设.置于背板 2的侧板 24与导光板 4 之间， 有效减小了导光板 4与背板 2的侧板 24之间的距离， 利于实现窄 边框化。
进一步地， 该 PCB板 62包括安装部 622及连接安装部 622的搭接部 624, 所述散热板 8包括支撑部 82及连接支撑部 82的承接部 84, 所述承 接部 84对应搭接部 624设置， 组装时， 所述搭接部 624搭接于所述承接 部 84上， 所述导光板 4承载于所述支撑部 82与搭接部 624上， 所述搭接 部 624与承接部 84配合设置， 使得 PCB板 62与散热板 8的总厚度等于现 有的 PCB板的厚度， 进而实现在提高散热效果的同时， 不增加背光模组的 厚度， 利于实现薄型化。
综上所述， 本发明的背光模组及用该背光模组的液晶显示装置， 通过 直接将 LED 芯片打件于 PCB 板上， 将 PCB 板设置于背板底板上， 将 LED 芯片设于导光板的入光面与背板的侧板之间， 可以实现液晶显示装置 的窄边框化， 同时， 在 PCB板上设置搭接部， 在散热板上设置承接部， 搭 接部与承接部相互配合， 在提高散热效果的同时不增加背光模组的厚度， 利于实现液晶显示装置的薄型化。
以上所述， 对于本领域的普通技术人员来说， 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

权 利 要 求
】、 一种背光模组， 包括： 背板、 设于背板内的导光板、 设.于背板内 的背光源及设于背光源与背板之间的散热板， 所述背板包括底板及垂直连 接底板的侧板， 所述背光源包括 PCB板及打件于 PCB板上的 LED芯片， 所述 PCB板安装于所述背板的底板及散热板上， 该 PCB板包括安装部及 连接安装部的搭接部， 所述.散热板包括支撑部及连接支撑部的承接部， 所 述承接部对应搭接部设置， 组装时， 所述搭接部搭接于所述承接部上， 所 述导光板承载于所述支撑部与搭 ^部上。
2、 如权利要求 1 所述的背光模组， 其中， 所述背板的底板上对应背 光源与散热板设有凹槽， 所述背光源与散热板安装并卡合于该 槽内。
3 , 如权利要求 1 所述的背光模组， 其中， 所述导光板包括朝向背板 底板的底面， 与底面相对设置的顶面及设于底面与顶面之间的数个侧面， 该数个侧面中包括至少一个入光面， 所述 LED 芯片对应所述入光面设置 于导光板与背板的侧板之间。
4、 如权利要求 3 所述的背光模组， 还包括设于导光板的底面与背板 的底板之间的底反射片。
5、 一种液晶显示装置， 包括： 背光模组、 设于背光模组上的胶框。 设于胶框上的液晶显示面板及设于液晶显示面板上的前框， 所述背光模组 包括板、 设于背板内的导光板、 设于背板内的背光源及设于背光源与背板 之间的散热板， 所述背板包括底板及垂直连接底板的倒板， 所述背光源包 括 PCB板及打件于 PCB板上的 LED芯片， 所述 PCB板安装于所述背板 的底板及散热板上， 该 PCB板包括安装部及连接安装部的搭接部， 所述.散 热板包括支撑部及连接支撑部的承接部， 所述承接部对应搭接部设置， 组 装时， 所述搭接部搭接于所述承接部上， 所述导光板承载于所述支撑部与 搭接部上。
6 , 如权利要求 5 所述的液晶显示装置， 其中， 所述背板的底板上对 应背光源与散热板设有凹槽， 所述背光源与散热板安装并卡合于该凹槽 内。
7、 如权利要求 5 所述的液晶显示装置， 其中， 所述导光板包括朝向 背板底板的底面、 与底面相对设置的顶面及设于底面与顶面之间的数个侧 面， 该数个侧面中包括至少一个入光面， 所述 LED 芯片对应所述入光面 设置于导光板与背板的侧板之间。 8 , 如权利要求 7 所述的液晶显示装置， 其中， 所述背光模组还包括 设于导光板的底面与背板的底板之间的底反射片„
9、 如权利要求 5 所述的液晶显示装置， 还包括设于背光模组与液晶 显示面板之间的光学膜片组。
10、 一种液晶显示装置， 包括： 背光模组、 设于背光模组上的胶框、 设于胶框上的液晶显示面板及设于液晶显示面板上的前框， 所述背光模组 包括板、 设于背板内的导光板、 设于背板内的背光源及设于背光源与背板 之间的散热板， 所述背板包括底板及垂直连接底板的侧板， 所述背光源包 括 PCB板及打件于 PCB板上的 LED芯片， 所述 PCB板安装于所述背板 的底板及散热板上， 该 PCB板包括安装部及连接安装部的搭接部， 所述散 热板包括支撑部及连接支撑部的承接部， 所述承接部对应搭接部设置， 组 装时， 所述搭接部搭接于所述承接部上， 所述导光板承载于所述支撑部与 搭接部上；
其中， 所述背板的底板上对应背光源与散热板设有 IHJ槽， 所述背光源 与散热板安装并卡合于该凹槽内。
】1、 如权利要求 0 所述的液晶显示装置， 其中， 所述导光板包括朝 向背板底板的底面、 与底面相对设置的顶面及设于底面与顶面之间的数个 侧面， 该数个侧面中包括至少一个入光面， 所述 LED 芯片对应所述入光 面设置于导光板与背板的侧板之闾。
12、 如权利要求 11 所述的液晶显示装置， 其中， 所述背光模组还包 括设于导光板的底面与背板的底板之间的底反.射片。
13、 如权利要求 10 所述的液晶显示装置， 还包括设于背光模组与液
PCT/CN2014/071164 2014-01-10 2014-01-23 背光模组及用该背光模组的液晶显示装置 Ceased WO2015103801A1 (zh)

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