Classifications

• • A—HUMAN NECESSITIES
  • A21—BAKING; EDIBLE DOUGHS
  • A21C—MACHINES OR EQUIPMENT FOR MAKING OR PROCESSING DOUGHS; HANDLING BAKED ARTICLES MADE FROM DOUGH
  • A21C15/00—Apparatus for handling baked articles
  • A21C15/04—Cutting or slicing machines or devices specially adapted for baked articles other than bread

Definitions

• This invention relates to cutting of wafer books, in particular to the optimization of the method of cutting wafer books in a production line, and an apparatus for the same.
• Wafer books are a precursor product to some confectionery products, and comprise a layered product made up of a plurality of sheets of thin edible wafer interspersed with a cream, chocolate or other edible foodstuff that attaches the sheets of wafer to one another.
• the wafer books are processed to turn them into a finished confectionery product. Part of the processing is the cutting of the wafer books into individual wafer products. These individual wafers themselves may be the finished confectionery product or may be further processed, for example by enrobing them in chocolate.
• a typical wafer cutting operation will first push a wafer book through a cutter in one direction, and will then push the wafer book through a cutter in the opposite direction.
• the speed at which the machine can operate is dictated by the maximum speed that the wafers can be pushed through the cutters and still result in an acceptable cut product. Pushing too fast may buckle the wafer product or create tears or other poor cut surfaces, or can even cause the wafer book to delaminate or burst.
• a method of cutting edible wafer books comprises feeding a first wafer book into a first cutting station and then extending a first cutting station pusher a first time to push the first wafer book through a first cutter into a second cutting station. This cuts the wafer books into a plurality of first strips aligned in the axis of movement through the first cutter. The first cutting station pusher is then retracted a first time. The method further comprises feeding a second wafer book into the first cutting station and then extending the first cutting station pusher a second time to push the second wafer book through the first cutter into the second cutting station to a position adjacent the first wafer book.
• the first cutter station pusher is then retracted a second time.
• a second cutting station pusher is then extended in a direction substantially perpendicular to the axis of movement through the first cutter to simultaneously push the first and second wafer books through a second cutter. This cuts the wafer books in a direction traverse to the first cuts so as to cut each of the first strips into a plurality of wafers fingers.
• the method preferably includes the further step of, after extending the first cutting station pusher a first time and prior to retracting the first cutting station pusher a first time, retaining the first wafer book in the second cutting station. This will ensure that the wafer strip alignment is maintained as the first cutting station pusher is retracted.
• Extending the first cutting station pusher a first time to push the first wafer book through a first cutter into the second cutting station preferably comprises extending the first cutting station pusher until an edge of the first wafer book abuts a first aligner. This ensures good alignment of the first strips of the first wafer book in the second cutting station.
• the method may further comprise: locating a second aligner in the second cutting station such that the step of extending the first cutting station pusher the second time pushes the second wafer book into the second cutting station until an edge of the second wafer book abuts the second aligner. This ensures good alignment of the first strips of the both wafer books in the second cutting station and assists in ensuring that when pushed through the second cutting blade the waver strips are perpendicular thereto.
• the method may further comprise retaining the second wafer book in the second cutting station. This will ensure that the wafer strip alignment is maintained as the pusher is retracted, i.e. if there is any adhesion of the wafer to the pusher (for example by the foodstuff sandwiched between the wafer layers) that the pusher will separate therefrom without moving the first strips of the second wafer book.
• the method may further comprise: locating a third aligner adjacent to the edge of the second wafer book on the side adjacent the first cutting station pusher. This assists in providing good alignment of the first strips of the second wafer book in the second cutting station.
• the wafer books are rectangular in shape having two longer sides and two shorter sides, and the first and second wafer books are pushed through the first cutter in an orientation in which a longer side thereof is presented to the cutter.
• the first and second wafer books may therefore be pushed through the second cutter in an orientation in which the shorter sides thereof are presented to the cutter, as the motion of the second cutting station pusher is substantially perpendicular to the motion of the first cutting station pusher.
• a confectionery product comprising a filled wafer that has been cut according to the method of the first aspect of the invention.
• the confectionery product may be enrobed in chocolate.
• an apparatus for cutting a wafer book comprising a first cutting station having an in-feed side and an out-feed side and configured to receive wafer books at the in-feed side.
• the first cutting station has a first cutting station pusher which is extendable between a first position and a second position along a first axis of motion.
• the apparatus also comprises a second cutting station having an in-feed side and an out-feed side and configured to receive wafer books from the first cutting station at the in-feed side.
• the second cutting station has a second cutting station pusher, extendable between a first position and a second position along a second axis of motion.
• a first cutter is positioned between the out-feed side of the first cutting station and the in-feed side of the second cutting station and a second cutter is positioned at the out-feed side of the second cutting station.
• a controller is provided which is configured to operate the machine according to the method of the first aspect of the invention.
• the apparatus may further comprise a first retaining means for, in use, retaining the first wafer book in the second cutting station; and the controller may be further configured to control the first retaining means to operate prior to the retraction of the first cutting station pusher the first time.
• the apparatus may also further comprise a second retaining means for, in use, retaining the second wafer book in the second cutting station; and the controller may be further configured to control the second retaining means to operate prior to the retraction of the first cutting station pusher the second time.
• the retaining means assist in ensuring that the wafer alignment is maintained, and aid the prevention of any adhesion of the wafer strips to the pusher.
• a first, and optionally a second, retractable aligner may be located in the second cutting station substantially perpendicular to the first axis of movement, the aligner movable between an aligning position and a non-aligning position.
• the controller may be configured to operate the retractable aligner(s) such that after the retraction of the first cutting station pusher the first time the first aligner is moved into the aligning position.
• the second retractable aligner is moved into the aligning position.
• the in-feed side and the out-feed side of the first cutting station are provided with an in-feed opening and an out-feed opening respectively and the out-feed opening is wider than the in-feed opening.
• the in-feed side and the out- feed side of the second cutting station may also be provided with an in-feed opening and an out-feed opening respectively and the out-feed opening may be wider than the in-feed opening.
• the in-feed opening of the second cutting station may comprise the out-feed opening of the first cutting station.
• the width of the out-feed opening of the second cutting station is preferably at least twice the width of the in-feed opening of the first cutting station.
• Two of the rectangular wafer books can therefore be consecutively pushed from the first section into the second section such that in the second section the longer rectangular edges of the rectangular wafer books are adjacent one another. The two books can then be pushed, side by side, through the second cutter and through the out-feed opening of the second cutting station.
• the first cutting station can have a receiving area for receiving an uncut wafer book and the second cutting station has a receiving area for receiving the wafer book from the first cutting station.
• the receiving area of the second cutting station is twice the size of the receiving area of the first cutting station, thereby accommodating two wafer books.
• Figure 1 is a flow chart of the method of the first aspect of the invention
• Figure 2 is a wafer book showing the cut lines achieved in the method of the invention
• Figure 3 shows a product in accordance with the second aspect of the invention
• Figure 4 is an apparatus in accordance with the third aspect of the invention
• Figure 5 shows a schematic diagram of operation of a prior art machine
• FIG. 6 shows a schematic diagram of operation of the apparatus of the invention.
• the method and apparatus of the invention are as follows.
• a feed of wafer books are presented to an in-feed edge 2 of a wafer cutting machine 4.
• the books may be presented to the in-feed edge in a manner as known in the art, for example using moving conveyers.
• a first wafer book 210 passes through an in-feed opening in the in-feed edge 2 into a platform of a first cutting station 6.
• the wafer book 210 is preferably rectangular and is fed 100 into the first cutting station in an orientation such that a shorter rectangular edge enters the in-feed edge 2 first.
• An alignment plate 8 is provided at the far side of the platform and the wafer book enters the platform until it abuts the alignment plate 8.
• a first cutting station pusher 10 is extended 110 such that it moves in the direction "X". This pushes the first wafer book 210 through a first cutting blade 12 which is positioned at an out-feed edge (in an out- feed opening) of the first cutting station.
• the cutting blade 12 comprises a plurality of vertical cutters aligned in a linear array.
• the cutters may comprise traditional blades or may, for example, comprise pieces of thin wire.
• the cutting blade 12 is stationary. As the first wafer book is pushed through the first cutting blade 12 it is cut into a plurality of aligned strips 220.
• the first cutting station pusher 10 comprises a plurality of long pushing fingers 14 each separated by a narrow gap that is aligned in the direction of movement with the cutters of the cutting blade. In this manner the pusher 10 can extend between the cutters of the cutting blade 12 so as to continue to push the wafer book 210 beyond the blade 12.
• the cutting blade 12 can be easily removed when blades need to be changed, for example as a result of a blade becoming blunt or breaking so that the blades may be quickly and conveniently replaced.
• a first retractable alignment plate 20 extends 140 into the second platform area so as to block a path from the first cutting station pusher 10 to the first wafer book.
• the process 150 of feeding a wafer book into the first cutting station 6 is then repeated with a second wafer book and the first cutting station pusher 10 is again extended 160 until the side of the second wafer book opposite the pusher 10 meets the first retractable aligner 20. In doing so the pusher 10 pushes the second wafer book through the first cutter 12 so that it is cut into strips in the same way as the first wafer book.
• a second retaining mechanism 24 of the second cutting station is operated 170 so as to hold the second wafer book 210 in place as the first cutting station pusher 10 is retracted a second time 180.
• first and second wafer books are located on the platform 27 of the second cutting station and are oriented such that the long sides of the wafer books are aligned adjacent and parallel to one another and are substantially perpendicular to the direction of travel "X" of the first cutting station pusher 10. The shorter edges of the wafer books are therefore substantially parallel to the direction of travel of the first cutting station pusher 10.
• a second retractable alignment plate 29 is moved 190 so that it is adjacent the edge of the second wafer book on the side facing the first cutting station pusher.
• the first and second retaining mechanisms 22, 24 are then released, although it will be appreciated that the first retaining mechanism may be released at any point after the retractable alignment plate 20 is extended into the second platform area.
• the second cutting station 16 is loaded with two adjacent rectangular wafer books 210 which have each been cut into a plurality of slices 220, and which are located on their longer sides by three alignment plates, one located between the two wafer books and one on either opposite side of the wafer books.
• the second cutting station 16 is then operated so that a second cutting station pusher 26 is extended 200 in a direction perpendicular to the direction of travel "X"-"Y" of the first cutting station pusher 10.
• the cutting blade 28 comprises a plurality of vertical cutters aligned in a linear array.
• the cutters may comprise traditional blades or may, for example, comprise pieces of thin wire.
• the cutting blade 28 is stationary and fixed by screws.
• the strips 220 are each cut in a direction perpendicular to the first cuts 230 to form a plurality of second cuts 240 thereby dividing the wafer book into a plurality of individual wafer products 250.
• the second cutting station pusher 26 also comprises a plurality of pushing fingers each separated by a narrow gap that is aligned in the direction of movement with the cutters of the cutting blade.
• An out-feed mechanism for example a conveyor, is provided adjacent the out-feed opening of the second cutting station 16, downstream of the second cutting blade 28, so as to convey the cut wafer products from the second cutting station 16.
• the cutting blade 28 can be easily removed when blades are needed to be changed, for example when they become blunt or they break so that the blades may be quickly and conveniently replaced in the same manner as described above in relation to the first cutting blade 12
• the invention described herein can increase the throughput of a cutting station as known in the prior art, in particular it can increase the throughput of rectangular shaped wafer books.
• the total minimum distance travelled by pushing mechanisms to cut a wafer book by pushing it through two perpendicularly arranged blades is the twice the sum of the length of the two sides, i.e. the first pusher mechanism must push the wafer book from A to B in one direction at least the length of one side X, and return Y, and the second pusher mechanism must subsequently push the wafer book from B to C in the opposite direction V by at least the length of the other side, and return W.
• the speeds and / or cutting and size of the wafer books will be dependent upon a number of factors such as the thickness of the wafer books, the thickness of each wafer layer in the wafer books, the hardness of the wafer filling etc. and the adjustment of the cutting blades to take these factors into consideration will be within the scope of the skilled person.

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• Life Sciences & Earth Sciences (AREA)
• Engineering & Computer Science (AREA)
• Food Science & Technology (AREA)
• Nonmetal Cutting Devices (AREA)
• Dicing (AREA)

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Citations (5)

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• 2014
  • 2014-01-06 GB GB1400152.3A patent/GB2523536A/en not_active Withdrawn
• 2015
  • 2015-01-06 BR BR112016015192-5A patent/BR112016015192B1/pt active IP Right Grant
  • 2015-01-06 WO PCT/IB2015/050091 patent/WO2015101966A1/en active Application Filing

Patent Citations (5)

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