WO2015100711A1 - Structure de carte de circuits imprimés ayant une conductivité thermique élevée - Google Patents

Structure de carte de circuits imprimés ayant une conductivité thermique élevée Download PDF

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Publication number
WO2015100711A1
WO2015100711A1 PCT/CN2014/070013 CN2014070013W WO2015100711A1 WO 2015100711 A1 WO2015100711 A1 WO 2015100711A1 CN 2014070013 W CN2014070013 W CN 2014070013W WO 2015100711 A1 WO2015100711 A1 WO 2015100711A1
Authority
WO
WIPO (PCT)
Prior art keywords
pattern layer
layer
thermally conductive
circuit board
printed circuit
Prior art date
Application number
PCT/CN2014/070013
Other languages
English (en)
Chinese (zh)
Inventor
俞宛伶
Original Assignee
俞宛伶
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 俞宛伶 filed Critical 俞宛伶
Priority to PCT/CN2014/070013 priority Critical patent/WO2015100711A1/fr
Publication of WO2015100711A1 publication Critical patent/WO2015100711A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the thermally conductive printed circuit board structure of the first embodiment includes a thermally conductive layer 111 and a metal core 1 13 , a wiring layer 120 , and a solder resist layer 130 .
  • the metal core 113 is attached to the lower surface of the insulating and thermally conductive layer 11 1 .
  • the circuit layer 120 is formed on the upper surface of the insulating and thermally conductive layer 111, and the solder resist layer 130 covers a portion of the circuit layer 120 and the insulating thermally conductive layer.
  • the embodiment mainly utilizes the gold below.
  • the overall heat dissipation effect is compared with the general heat conductive material.
  • the circuit layer 120 and the solder resist layer 130 are formed by using a high dispersion of the ceramic plate 115. However, a circuit layer is formed on the ceramic board 115.
  • the current method usually has
  • the copper powder is incorporated into the surface of the ceramic plate, or (2) after the sintering is completed, a plating seed layer is formed on the surface by sputtering.
  • these methods are costly and time consuming, in addition, When the lines are stacked, it is sometimes necessary to drill with lasers, and the ceramics are brittle after sintering, which may cause damage due to these processes.
  • thermally conductive printed circuit board structure that is inexpensive, easy to manufacture, and has high thermal conductivity for use in high power LEDs or semiconductor wafers to maintain product performance and extend service life.
  • the main object of the present invention is to provide a high thermal conductive printed circuit board structure comprising a heat conducting plate, an insulating layer, a metal pattern layer, and a circuit pattern layer
  • the heat conducting plate can be a metal plate or a graphite plate.
  • a heat conducting glass plate, and one of the ceramic plates, the insulating layer is formed on a surface of the heat conducting plate, the metal pattern layer is formed on a part of the surface of the insulating layer, and the metal pattern layer and the insulating layer have an overlapping opening pattern.
  • a heat conducting hole is formed to expose a portion of the surface of the heat conducting plate.
  • the wiring pattern layer is formed on the wall surface and the bottom of the heat conduction hole, or fills the heat conduction hole, and is formed on the surface of the metal pattern layer, and is connected to the metal pattern layer and the heat conduction plate.
  • the heat conducting plate When the heat conducting plate is in electrical communication with the circuit pattern layer, further comprising at least one cutting gap to divide the heat conducting plate into a plurality of blocks to avoid short circuit of the metal pattern layer and the circuit pattern layer, and filling in the cutting gap Insulating glue is added to maintain the integrity and mechanical strength of the heat conducting plate. Further, it is also possible to stack the insulating layer and the metal pattern layer and to form via holes to form a second line pattern layer to be connected to the line pattern layer to form a structure in which the multilayer lines are stacked.
  • the large-area heat-conducting plate can effectively extract the heat source and improve the performance and service life of the printed circuit board. It is suitable for the use of light-emitting diodes and high-power semiconductor components.
  • ceramics and heat-conducting glass No need to use expensive and time-consuming sputtering technology, but also can be processed in advance and then bonded to achieve high thermal conductivity, while saving production costs and production time.
  • Figure iA is a cross-sectional view showing a first embodiment of a conventional thermally conductive printed circuit board structure.
  • Figure IB is a cross-sectional view showing a second embodiment of a conventional thermally conductive printed circuit board structure.
  • 2 is a cross-sectional view showing the first embodiment of the high thermal conductive printed circuit board structure of the present invention.
  • 3 is a cross-sectional view showing a second embodiment of a high thermal conductivity printed circuit board structure of the present invention.
  • the high thermal conductive printed circuit board structure 1 of the first embodiment of the present invention comprises a heat conducting plate 10, an insulating layer 20, a metal pattern layer 30, and a circuit pattern layer 40.
  • the heat conducting plate 10 is made of metal.
  • the insulating layer 20 is formed on one surface of the heat conducting plate 10, and the metal pattern layer 30 is formed on a part of the surface of the insulating layer 20, the metal pattern layer 30 and The insulating layer 20 has an overlapping opening pattern to form at least one of the heat conducting holes 25 to expose a portion of the surface of the heat conducting plate 10.
  • the wiring pattern layer 40 is formed on the wall surface and the bottom of the heat conduction hole 25, or fills the heat conduction hole 25, and is formed on the ((partial) surface of the metal pattern layer 30, together with the metal pattern layer 30 and the heat conduction.
  • the board 10 is connected, wherein the metal ring layer 30 is copper or aluminum, and the line pattern layer 40 is at least one of copper, nickel, zinc, aluminum, gold, and silver.
  • the heat conducting plate 10 is exposed on the surface of the heat conducting hole 25, and further comprises a metal seed layer 55, which is copper or zinc. Further, when the heat conducting plate 10 is in electrical communication with the metal seed layer 55, further comprising at least one cutting gap, cutting the heat conducting plate 10 into a plurality of blocks, and filling the cutting gap with the insulating rubber 50 The metal pattern layer 30 and the line pattern layer 40 are prevented from being improperly short-circuited, and the integrity and mechanical strength of the heat conducting plate 10 are maintained.
  • the high thermal conductivity printed circuit board structure 1 further includes a solder resist layer 60 partially covering the circuit pattern layer 40 to expose only a portion of the area for subsequent connection of the components.
  • the high thermal conductive printed circuit board structure 2 of the second embodiment of the present invention is basically the buildup structure of the first embodiment, the heat conductive plate 10, the insulating layer 20, the metal pattern layer 30, and the wiring pattern layer 40. It is substantially the same as the first embodiment and will not be described here.
  • Second The high thermal conductive printed circuit board structure 2 of the embodiment further includes a second insulating layer 22, a second metal pattern layer 32 and a second line pattern layer 42 covering the insulating layer 20 and the metal pattern layer.
  • the second metal pattern layer 32 is formed on a portion of the surface of the second insulating layer 22, and the two metal pattern layer 32 and the second insulating layer 22 have overlapping openings
  • the pattern forms a plurality of via holes 27.
  • the via holes 27 expose a portion of the line pattern layer 40.
  • the third line pattern layer 42 is formed at least on the bottom and the wall surface of the via hole 27, further fills the via hole 27, and is formed on the surface of the second metal pattern layer 32 while being in contact with the second metal pattern layer. 32 and the line pattern layer 40 are connected.
  • the high thermal conductive printed circuit board structure 2 of the second embodiment further includes a solder resist layer 60 partially covering the second circuit pattern layer 42 to expose only a portion of the region for subsequent connection components. Use.
  • the technical feature of the invention is that the high thermal conductive printed circuit board structure of the invention utilizes a large-area heat conducting plate, can effectively lead the heat source, and improve the performance and service life of the components on the printed circuit board, and is suitable for the light emitting diode and the high
  • the use of power semiconductor components, in addition to the use of ceramic and thermal glass, does not require the use of expensive and time-consuming sputtering technology, but also can be processed in advance, and then bonded to achieve high thermal conductivity, while saving production Cost and production time effects.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention porte sur une structure de carte de circuits imprimés ayant une conductivité thermique élevée et comportant une plaque conductrice de la chaleur (10), une couche d'isolation (20), une couche de motif métallique (30) et une couche de motif de circuit (40). La couche d'isolation (20) et la couche de motif métallique (30) sont empilées sur une surface de la plaque conductrice de la chaleur (10) et sont pourvues d'un trou de guide thermique (25) dans celles-ci pour exposer une partie de la surface de la plaque conductrice de la chaleur (10) ; la couche de motif de circuit (40) est formée au moins sur la paroi et au niveau du fond du trou de guide thermique (25) et sur la surface de la couche de motif métallique (30), et est connectée à la couche de motif métallique (30) et à la plaque conductrice de la chaleur (10). La conception de la structure peut conduire une source thermique vers la grande surface d'une plaque conductrice de la chaleur pour une dissipation thermique, améliorant ainsi l'efficacité et la durée de service des éléments sur la carte de circuits, étant applicable à des diodes électroluminescentes et à des éléments à semi-conducteurs à puissance élevée.
PCT/CN2014/070013 2014-01-02 2014-01-02 Structure de carte de circuits imprimés ayant une conductivité thermique élevée WO2015100711A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/070013 WO2015100711A1 (fr) 2014-01-02 2014-01-02 Structure de carte de circuits imprimés ayant une conductivité thermique élevée

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/070013 WO2015100711A1 (fr) 2014-01-02 2014-01-02 Structure de carte de circuits imprimés ayant une conductivité thermique élevée

Publications (1)

Publication Number Publication Date
WO2015100711A1 true WO2015100711A1 (fr) 2015-07-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/070013 WO2015100711A1 (fr) 2014-01-02 2014-01-02 Structure de carte de circuits imprimés ayant une conductivité thermique élevée

Country Status (1)

Country Link
WO (1) WO2015100711A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232755A (ja) * 1996-02-27 1997-09-05 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2003046245A (ja) * 2001-07-30 2003-02-14 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
KR20060105382A (ko) * 2005-04-04 2006-10-11 엘지전자 주식회사 인쇄회로기판의 접합구조 및 그 방법
CN101426337A (zh) * 2007-10-30 2009-05-06 日本梅克特隆株式会社 内置了膜状电阻元件的多层印刷布线板的制造方法
CN101682991A (zh) * 2007-05-08 2010-03-24 奥卡姆业务有限责任公司 无焊料的发光二级管组件
CN203040009U (zh) * 2012-12-27 2013-07-03 深圳市五株科技股份有限公司 高导热电路板
CN103716982A (zh) * 2014-01-02 2014-04-09 俞宛伶 高导热印刷电路板结构
CN104039079A (zh) * 2013-12-01 2014-09-10 吴祖 集成线路板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232755A (ja) * 1996-02-27 1997-09-05 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2003046245A (ja) * 2001-07-30 2003-02-14 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
KR20060105382A (ko) * 2005-04-04 2006-10-11 엘지전자 주식회사 인쇄회로기판의 접합구조 및 그 방법
CN101682991A (zh) * 2007-05-08 2010-03-24 奥卡姆业务有限责任公司 无焊料的发光二级管组件
CN101426337A (zh) * 2007-10-30 2009-05-06 日本梅克特隆株式会社 内置了膜状电阻元件的多层印刷布线板的制造方法
CN203040009U (zh) * 2012-12-27 2013-07-03 深圳市五株科技股份有限公司 高导热电路板
CN104039079A (zh) * 2013-12-01 2014-09-10 吴祖 集成线路板
CN103716982A (zh) * 2014-01-02 2014-04-09 俞宛伶 高导热印刷电路板结构

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