WO2015093250A1 - Method for manufacturing wiring board - Google Patents

Method for manufacturing wiring board Download PDF

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Publication number
WO2015093250A1
WO2015093250A1 PCT/JP2014/081391 JP2014081391W WO2015093250A1 WO 2015093250 A1 WO2015093250 A1 WO 2015093250A1 JP 2014081391 W JP2014081391 W JP 2014081391W WO 2015093250 A1 WO2015093250 A1 WO 2015093250A1
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WO
WIPO (PCT)
Prior art keywords
metal plate
hole
insulating substrate
convex portion
wiring board
Prior art date
Application number
PCT/JP2014/081391
Other languages
French (fr)
Japanese (ja)
Inventor
隆宏 郡司
公教 尾崎
Original Assignee
株式会社 豊田自動織機
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Filing date
Publication date
Application filed by 株式会社 豊田自動織機 filed Critical 株式会社 豊田自動織機
Publication of WO2015093250A1 publication Critical patent/WO2015093250A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/033—Punching metal foil, e.g. solder foil

Definitions

  • the present invention relates to a method for manufacturing a wiring board in which a first metal plate and a second metal plate provided on an insulating substrate are electrically connected at an interlayer connection portion.
  • a substrate described in Patent Document 1 As a wiring board in which metal plates are provided on both surfaces of an insulating substrate and the respective metal plates are interlayer-connected, for example, a substrate described in Patent Document 1 is known. As shown in FIG. 9, the substrate 100 described in Patent Document 1 is provided with metal plates 102 and 103 on both surfaces of a ceramic plate 101. A through hole 104 is formed in the ceramic plate 101. The metal plate 102 is also provided with a through hole 105 facing the through hole 104 of the ceramic plate 101. The peripheral edge of the through hole 105 provided in the metal plate 102 is bent toward the through hole 104 of the ceramic plate 101. Both metal plates 102 and 103 are connected to the substrate 100 by solder filled in the through holes 104 and 105.
  • the through hole 105 is formed in the metal plate 102 by etching, and then the diameter of the through hole 105 is larger.
  • the columnar member 106 By inserting the columnar member 106 into the through hole 105, the periphery of the through hole 105 is bent. Bending the periphery of the through hole 105 facilitates positioning of the solder.
  • the columnar member 106 that processes the metal plate 102 applies a downward force toward the ceramic plate 101 to a local region around the through hole 105.
  • the application of the downward force generates an upward moment in a remote region (for example, an end region) of the metal plate 102 away from the local region pressed by the cylindrical member 106. Therefore, the metal plate 102 may be peeled off from the ceramic plate 101 when the metal plate 102 is processed.
  • the objective of this invention is providing the manufacturing method of a wiring board provided with the structure which suppresses that the metal plate of a wiring board peels from an insulated substrate.
  • a method for manufacturing a wiring board comprising: a first metal plate provided on a surface of an insulating substrate; and a second metal plate provided on a back surface of the insulating substrate and having a protrusion.
  • a wiring board manufacturing method in which the first metal plate and the convex portion are opposed to each other, wherein a plurality of metal plate through holes are formed in the second metal plate; A second step of forming one convex portion on the second metal plate with respect to the plurality of metal plate through holes; and the first metal plate so that the convex portion faces the insulating substrate. And a third step of providing the second metal plate on the insulating substrate.
  • the first metal plate and the second metal plate are formed on the insulating substrate. Provided. By providing the insulating plate after processing the metal plate, there is no need to process the metal plate provided on the insulating substrate, and the metal plate does not peel from the insulating substrate along with the processing of the metal plate.
  • the manufacturing method of the said wiring board it fills with a electrically conductive material between the said convex part and the said 1st metal plate, and forms the interlayer connection part which connects the said 1st metal plate and the said 2nd metal plate It is preferable to include a fourth step.
  • the interlayer connection portion is formed in a state where the first metal plate and the second metal plate are provided on the insulating substrate, it is easy to form the interlayer connection portion.
  • these metal plate through-holes are formed in the position used as the base end of the said convex part.
  • each or at least one of the plurality of metal plate through holes is preferably an inspection through hole or a gas vent through hole for inspecting a filling state of the conductive material.
  • the first step is to form a plurality of metal plate through hole groups in the second metal plate, each metal plate through hole group including at least two metal plate through holes.
  • the second step includes forming, on the second metal plate, a plurality of convex portions, each convex portion being surrounded by one of the plurality of metal plate through hole groups, and the plurality of convex portions.
  • the part is preferably formed in an end region and a non-end region of the second metal plate.
  • the plurality of interlayer connection portions can be formed by the plurality of convex portions, the first metal plate or the second metal plate is hardly peeled off from the insulating substrate.
  • the metal plate of the wiring board can be prevented from peeling off from the insulating substrate.
  • (A) is a partial plan view of the wiring board according to the first embodiment viewed from the first metal plate
  • (b) is a schematic cross-sectional view of the wiring board taken along line 1b-1b in FIG. c)
  • (A) is a top view of the 2nd metal plate in 1st Embodiment
  • (b) is the elements on larger scale of Fig.2 (a).
  • (A) is a perspective view of the metal mold
  • (b) is a perspective view of the convex metal mold
  • (A)-(d) is typical sectional drawing for demonstrating the process of forming the through-hole for an inspection and a convex part in the 2nd metal plate in 1st Embodiment.
  • (A) And (b) is typical sectional drawing for demonstrating the process of forming a bending part in the 1st metal plate in 1st Embodiment.
  • the wiring board 10 is formed using a thick copper substrate.
  • the wiring board 10 has a first metal plate 21 (for example, a copper plate) on the surface 11 a of the insulating substrate 11 and a second metal plate 31 (for example, a copper plate) on the back surface 11 b of the insulating substrate 11.
  • the insulating substrate 11 is, for example, a glass epoxy resin substrate.
  • the first metal plate 21 and the second metal plate 31 are bonded to the insulating substrate 11 with an adhesive.
  • the first metal plate 21 and the second metal plate 31 are patterned into a desired shape to form a current path.
  • the first metal plate 21 and the second metal plate 31 are connected by an interlayer connection portion 41.
  • the insulating substrate 11 is provided with a base material through hole 13 penetrating in the thickness direction.
  • the first metal plate 21 is provided with a through hole 22 that faces the base material through hole 13 and penetrates in the thickness direction.
  • the diameter of the through hole 22 is smaller than the diameter of the substrate through hole 13.
  • the peripheral edge of the through hole 22 is bent toward the base material through hole 13, whereby a bent portion 23 that bends from the front surface side to the back surface side (second metal plate side) of the insulating substrate 11. It is configured.
  • the second metal plate 31 is provided with a convex portion 32 protruding from the back surface side of the insulating substrate 11 to the front surface side (first metal plate side).
  • the convex part 32 has the circular front-end
  • the convex portion 32 is provided with its outer peripheral surface facing the inner surface of the base material through hole 13 in the insulating substrate 11.
  • the convex portion 32 is inserted into the base material through hole 13 and the through hole 22. Thereby, the convex portion 32 faces the inner peripheral surface of the through hole 22 in the first metal plate 21.
  • the convex portion 32 covers the inner surface of the base material through hole 13 together with the bent portion 23.
  • the second metal plate 31 is provided with a circular inspection through hole 33 as a metal plate through hole penetrating in the thickness direction so as to face the substrate through hole 13.
  • the inspection through hole 33 is provided in a state where the axial direction of the inspection through hole 33 is inclined with respect to the axial direction of the convex portion 32.
  • the inspection through hole 33 communicates with the base material through hole 13.
  • the inspection through holes 33 are provided at four locations and are provided so as to surround the convex portion 32.
  • the inspection through-hole 33 is provided at a position that becomes the base end of the convex portion 32 (periphery of the convex portion 32).
  • the bent portion 23 and the convex portion 32 are connected by an interlayer connection portion 41.
  • the interlayer connection portion 41 is solder filled in each of the through hole 22, the base material through hole 13, and the inspection through hole 33. Solder is also filled between the bent portion 23 and the convex portion 32, and the bent portion 23 and the convex portion 32 are connected by the interlayer connection portion 41.
  • interlayer connection portion 41 provided on the wiring board 10 is illustrated and described.
  • the wiring board 10 includes an end region in addition to the end region of the wiring board 10.
  • Interlayer connection portions 41 are also provided in non-region regions different from the above.
  • FIG. 3A is a partial schematic view of a mold for forming a plurality of inspection through holes 33 shown in FIGS. 2A and 2B in the second metal plate 31.
  • FIG. 3B is a partial schematic view of a mold for forming a plurality of convex portions 32 shown in FIG. 2A on the second metal plate 31.
  • the hole mold apparatus 50 for pressing the inspection through hole 33 in the second metal plate 31 includes a hole forming mold 51 and a support.
  • a mold 55 is included.
  • the hole forming mold 51 has a columnar hole forming protrusion 53 on one surface of a columnar support portion 52.
  • the number of hole forming projections 53 can be arbitrarily set, and is set in accordance with the number of inspection through holes 33 formed in the second metal plate 31.
  • four projection groups including four hole forming projections 53 corresponding to the respective interlayer connection portions 41 are provided.
  • the support die 55 has four recesses 54 corresponding to regions surrounding the pair of hole forming projections 53.
  • the second metal plate 31 is placed on the support mold 55.
  • the second metal plate 31 is punched by the hole forming protrusions 53, and the inspection through hole 33 is formed at the punched position.
  • the convex portion 32 is formed on the second metal plate 31.
  • the convex portion 32 of the second metal plate 31 is pressed by a mold.
  • the convex mold apparatus 60 for pressing the convex portion 32 on the second metal plate 31 includes a convex mold 61 and a support mold 65. And have.
  • the convex mold 61 has a cylindrical convex projection 63 on one surface of a columnar support 62.
  • One protrusion 63 is provided corresponding to each interlayer connection 41.
  • the diameter of the protrusion 63 for protrusions is the same as the diameter of the bottom surface of the tip 32a of the protrusion 32 (the surface opposite to the bonding surface of the insulating substrate 11 in the second metal plate 31).
  • the support mold 65 is formed with a recess 64 corresponding to the protrusion 63 for protrusion.
  • the inspection through-hole 33 is deformed. Specifically, when the second metal plate 31 is pressed by the convex mold 61, it is deformed and stretched. For this reason, the inspection through-hole 33 is distorted as compared with the case where the inspection through-hole 33 is formed after the convex portion 32 is formed. In the present embodiment, the inspection through-hole 33 is deformed so that its axial direction is inclined with respect to the axial direction of the convex portion 32.
  • the bent portion 23 is formed on the first metal plate 21.
  • a through hole 22 is formed in the first metal plate 21.
  • the through hole 22 may be formed by any method such as press working or etching.
  • a cylindrical member 69 for example, a bending punch
  • the periphery of the through-hole 22 is bent to form the bent portion 23.
  • the first metal plate 21 and the second metal plate 31 are joined to the insulating substrate 11.
  • the first metal plate 21 is bonded to the front surface 11 a of the insulating substrate 11, and the second metal plate 31 is bonded to the back surface 11 b of the insulating substrate 11.
  • positioning is performed so that the bent portion 23 is inserted into the base material through hole 13 of the insulating substrate 11 and the convex portion 32 is inserted into the through hole 22 of the first metal plate 21.
  • the bonding of the first metal plate 21 and the second metal plate 31 to the insulating substrate 11 is performed between the insulating substrate 11 and the first metal plate 21 and between the insulating substrate 11 and the second metal plate 31. This is performed by applying an adhesive and pressurizing the first metal plate 21 and the second metal plate 31 toward the insulating substrate 11 (third step).
  • a solder paste 28 as a conductive material is applied to the through hole 22 in the first metal plate 21 and its periphery.
  • the application of the solder paste 28 is performed in a state where the region other than the application region of the solder paste 28 in the base material through hole 13 is covered with a metal mask. That is, the surface of the first metal plate 21 opposite to the bonding surface with the insulating substrate 11 is flat, and a copper plate surface having no unevenness is secured, and the solder paste 28 can be printed in a desired region. it can. Further, in the solder paste 28 application step, the solder paste 28 is applied also in the electronic component placement region.
  • the applied solder paste 28 is heated in a furnace, so that the solder having fluidity flows into the through hole 22, the base material through hole 13, and the inspection through hole 33. Then, by hardening the solder, the interlayer connection portion 41 is formed inside the base material through hole 13 (fourth step). Thereby, the wiring board 10 by which the 1st metal plate 21 and the 2nd metal plate 31 were electrically conductive by the interlayer connection part 41 is manufactured.
  • action of the manufacturing method of the wiring board 10 in this embodiment is demonstrated.
  • the metal plates 21 and 31 are joined to the insulating substrate 11.
  • the bent portion 23 is formed by the first metal plate 21 alone or in a state where the first metal plate 21 is not in contact with the insulating substrate 11.
  • the formation of the inspection through-hole 33 and the formation of the convex portion 32 are performed by the second metal plate 31 alone or in a state where the second metal plate 31 is not in contact with the insulating substrate 11. For this reason, it is not necessary to process the metal plates 21 and 31 in a state where the metal plates 21 and 31 are joined to the insulating substrate 11.
  • the inspection through hole 33 is formed before the convex portion 32 is formed on the second metal plate 31.
  • the inspection through-hole 33 becomes a region allowing deformation, and the rigidity of the second metal plate 31 is reduced. Since the rigidity of the second metal plate 31 is reduced, the second metal plate 31 is easily deformed when the convex portion 32 is formed.
  • the inspection metal through-hole 33 is provided so that the second metal plate 31 is easily deformed, and the load applied to the convex forming die 61 (the convex portion projection 63). Less is. For this reason, the wear of the convex mold 61 is suppressed, and the life of the convex mold 61 is unlikely to be shortened.
  • the inspection through hole 33 Since the inspection through hole 33 is provided at a position that becomes the base end of the convex portion 32, the rigidity of the second metal plate 31 is reduced by the inspection through hole 33, and the convex portion 32 is Easy to form. (4) Since the inspection through-hole 33 is provided at a position that becomes the base end of the convex portion 32, the inspection through-hole 33 is less likely to be buried in the interlayer connection portion 41, and soldering by the inspection through-hole 33 is prevented. It is hard to disturb inspection of filling state.
  • the inspection through hole 33 is formed by the hole forming mold 51 before forming the convex portion 32. If the inspection through-hole 33 is formed after the convex portion 32 is formed, the convex portion 32 is formed, and the inspection through-hole 33 is formed in the bent portion, so that the hole forming mold 51 is easily worn. By forming the inspection through hole 33 prior to the convex portion 32, the inspection through hole 33 can be formed in the flat second metal plate 31. For this reason, the hole forming mold 51 is not easily worn, and the life of the hole forming mold 51 is not easily shortened.
  • the inspection through hole 33 it is possible to determine the bonding failure between the first metal plate 21 and the second metal plate 31. Specifically, when the inspection through hole 33 is not filled with solder, the solder cannot be visually recognized through the inspection through hole 33. Thereby, it can be determined that there is a bonding failure.
  • the cylindrical member 106 is inserted into the through hole 105 in a state where the metal plate 102 is bonded to the ceramic plate 101, so that peeling of the metal plate 102 is suppressed. In addition, it is necessary to reduce the pressing pressure of the cylindrical member 106.
  • the bent portion 23 is formed on the first metal plate 21, it is not necessary to consider peeling from the insulating substrate 11, and thus it is not necessary to reduce the press pressure.
  • the inspection through-hole 33 is already provided. For this reason, when forming the convex part 32, the metal plate 31 in the convex part 32 can be extended, and the axial direction of the inspection through-hole 33 can be inclined with respect to the axial direction of the convex part 32. In this case, since the solder filled in the inspection through hole 33 can be inclined with respect to the thickness direction of the wiring board 10, the second metal plate 31 can be hardly peeled off from the insulating substrate 11.
  • the wiring board 70 of this embodiment has an interlayer connection 71 on the periphery of the insulating substrate 11.
  • the first metal plate 72 is provided with a bent portion 73 that is bent so as to cover the periphery of the insulating substrate 11.
  • the second metal plate 81 is provided with a convex portion 82 that protrudes so as to cover the periphery of the insulating substrate 11 together with the bent portion 73.
  • the convex portion 82 faces the peripheral edge of the insulating substrate 11.
  • An inspection through-hole 33 that penetrates in the thickness direction of the second metal plate 81 is provided at the base end of the convex portion 82. Solder is filled between the bent portion 73 and the convex portion 82 and the inspection through-hole 33, thereby forming an interlayer connection portion 71.
  • the inspection through hole 33 is formed before the convex portion 82.
  • the same effect as that of the wiring board 10 described in the first embodiment can be obtained.
  • the inspection through hole 33 may be formed by drilling, etching, or the like.
  • the metal plate through hole may be other than the inspection through hole 33. That is, it may be a vent hole, for example, instead of determining a bonding failure. In the case of the gas vent hole, the gas at the time of soldering can be vented.
  • the interlayer connection 41 may be formed using other conductive material such as silver paste.
  • the convex portions 32 and 82 of the second metal plates 31 and 81 may be provided only in the end region of the second metal plates 31 and 81, or the end portions of the second metal plates 31 and 81 It may be provided only in the non-end region other than the region.
  • the first metal plate 21 is processed after the second metal plate 31 is processed.
  • the second metal plate 31 is processed. May be.
  • the shape of the inspection through-hole 33 and the convex portions 32 and 82 may be a polygonal shape other than a circular shape.
  • the adhesive may not be applied but may be one in which an adhesive layer is previously formed on the surface of the insulating substrate 11 and the adhesive layer is liquefied by heating.
  • the interlayer connection portions 41 and 71 may not be provided.
  • the inspection through-hole 33 may not be inclined with respect to the axial direction of the convex portion 32.
  • the inspection through-hole 33 may be provided other than the base end of the convex portion 32.
  • a single convex portion 32 may be provided.
  • the convex portion 32 may be formed by a method other than press working.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

This method for manufacturing a wiring board includes the formation, in a second metal sheet (31), of a plurality of inspection through-holes (33) and a protrusion (32) surrounded by said inspection through-holes (33). After the inspection through-holes (33) are formed, a hole-forming die device (50) is used to form the protrusion (32) on the second metal sheet (31) via stamping.

Description

配線板の製造方法Wiring board manufacturing method
　本発明は、絶縁基板に設けられた第１の金属板と第２の金属板を層間接続部で導電した配線板の製造方法に関する。 The present invention relates to a method for manufacturing a wiring board in which a first metal plate and a second metal plate provided on an insulating substrate are electrically connected at an interlayer connection portion.
　絶縁基板の両面に金属板を設けて、それぞれの金属板を層間接続した配線板としては、例えば、特許文献１に記載の基板が知られている。
　図９に示すように、特許文献１に記載の基板１００は、セラミックプレート１０１の両面に、金属プレート１０２，１０３が設けられている。セラミックプレート１０１には、スルーホール１０４が形成されている。金属プレート１０２にも、セラミックプレート１０１のスルーホール１０４と対向してスルーホール１０５が設けられている。金属プレート１０２に設けられたスルーホール１０５の周縁は、セラミックプレート１０１のスルーホール１０４に向けて屈曲している。基板１００は、スルーホール１０４，１０５に充填された半田によって両金属プレート１０２，１０３が接続されている。特許文献１の基板１００では、スルーホール１０４を形成したセラミックプレート１０１に金属プレート１０２，１０３を接合した後に、金属プレート１０２にエッチングでスルーホール１０５を形成した後、スルーホール１０５よりも径の大きな円柱状部材１０６をスルーホール１０５に挿入することでスルーホール１０５の周縁を屈曲させている。スルーホール１０５の周縁を屈曲させることで、半田を位置決めしやすくしている。 As a wiring board in which metal plates are provided on both surfaces of an insulating substrate and the respective metal plates are interlayer-connected, for example, a substrate described in Patent Document 1 is known.
As shown in FIG. 9, the substrate 100 described in Patent Document 1 is provided with metal plates 102 and 103 on both surfaces of a ceramic plate 101. A through hole 104 is formed in the ceramic plate 101. The metal plate 102 is also provided with a through hole 105 facing the through hole 104 of the ceramic plate 101. The peripheral edge of the through hole 105 provided in the metal plate 102 is bent toward the through hole 104 of the ceramic plate 101. Both metal plates 102 and 103 are connected to the substrate 100 by solder filled in the through holes 104 and 105. In the substrate 100 of Patent Document 1, after the metal plates 102 and 103 are joined to the ceramic plate 101 in which the through hole 104 is formed, the through hole 105 is formed in the metal plate 102 by etching, and then the diameter of the through hole 105 is larger. By inserting the columnar member 106 into the through hole 105, the periphery of the through hole 105 is bent. Bending the periphery of the through hole 105 facilitates positioning of the solder.
特開２００１－２８４８００号公報JP 2001-284800 A
　ところで、金属プレート１０２を加工する円柱状部材１０６は、スルーホール１０５の周辺の局所領域にセラミックプレート１０１に向けた下向きの力を付与する。この下向きの力の付与は、円柱状部材１０６によって押圧される局所領域から離れた金属プレート１０２の遠隔領域（例えば端部領域）に上向きのモーメントを生じる。したがって金属プレート１０２の加工時に金属プレート１０２がセラミックプレート１０１から剥離するおそれがある。 Incidentally, the columnar member 106 that processes the metal plate 102 applies a downward force toward the ceramic plate 101 to a local region around the through hole 105. The application of the downward force generates an upward moment in a remote region (for example, an end region) of the metal plate 102 away from the local region pressed by the cylindrical member 106. Therefore, the metal plate 102 may be peeled off from the ceramic plate 101 when the metal plate 102 is processed.
　本発明の目的は、配線板の金属板が絶縁基板から剥離することを抑制する構造を備える配線板の製造方法を提供することにある。
　本発明の一態様に従う配線板の製造方法は、絶縁基板の表面に設けられた第１の金属板と、前記絶縁基板の裏面に設けられるとともに凸部が形成された第２の金属板とを有し、前記第１の金属板と前記凸部とを対向させた配線板の製造方法であって、前記第２の金属板に、複数の金属板貫通孔を形成する第１の工程と、前記第２の金属板に、前記複数の金属板貫通孔に対して１つの凸部を形成する第２の工程と、前記凸部が前記絶縁基板と対向するように前記第１の金属板と前記第２の金属板とを前記絶縁基板に設ける第３の工程と、を含むことを要旨とする。 The objective of this invention is providing the manufacturing method of a wiring board provided with the structure which suppresses that the metal plate of a wiring board peels from an insulated substrate.
According to one aspect of the present invention, there is provided a method for manufacturing a wiring board comprising: a first metal plate provided on a surface of an insulating substrate; and a second metal plate provided on a back surface of the insulating substrate and having a protrusion. A wiring board manufacturing method in which the first metal plate and the convex portion are opposed to each other, wherein a plurality of metal plate through holes are formed in the second metal plate; A second step of forming one convex portion on the second metal plate with respect to the plurality of metal plate through holes; and the first metal plate so that the convex portion faces the insulating substrate. And a third step of providing the second metal plate on the insulating substrate.
　これによれば、第２の金属板に金属板貫通孔及び凸部を形成した後、すなわち、第２の金属板を加工した後に、第１の金属板と第２の金属板が絶縁基板に設けられる。金属板を加工した後に絶縁基板に設けることで、絶縁基板に設けられた状態の金属板を加工する必要がなく、金属板の加工に伴い、金属板が絶縁基板から剥離することがない。 According to this, after forming the metal plate through hole and the convex portion in the second metal plate, that is, after processing the second metal plate, the first metal plate and the second metal plate are formed on the insulating substrate. Provided. By providing the insulating plate after processing the metal plate, there is no need to process the metal plate provided on the insulating substrate, and the metal plate does not peel from the insulating substrate along with the processing of the metal plate.
　上記配線板の製造方法について、前記凸部と前記第１の金属板との間に導電材を充填して前記第１の金属板と前記第２の金属板とを接続する層間接続部を形成する第４の工程を含むことが好ましい。 About the manufacturing method of the said wiring board, it fills with a electrically conductive material between the said convex part and the said 1st metal plate, and forms the interlayer connection part which connects the said 1st metal plate and the said 2nd metal plate It is preferable to include a fourth step.
　これによれば、第１の金属板と第２の金属板が絶縁基板に設けられた状態で層間接続部を形成するため、層間接続部を形成しやすい。
　上記配線板の製造方法について、前記第１の工程において、前記複数の金属板貫通孔は前記凸部の基端となる位置に形成されることが好ましい。 According to this, since the interlayer connection portion is formed in a state where the first metal plate and the second metal plate are provided on the insulating substrate, it is easy to form the interlayer connection portion.
About the manufacturing method of the said wiring board, in the said 1st process, it is preferable that these metal plate through-holes are formed in the position used as the base end of the said convex part.
　これによれば、凸部を形成するときに、金属板貫通孔によって第２の金属板の剛性が低下しているため、凸部を形成しやすい。
　上記配線板の製造方法について、前記第１の工程において、前記複数の金属板貫通孔は、プレスして形成されることが好ましい。 According to this, when forming a convex part, since the rigidity of a 2nd metal plate is falling with the metal plate through-hole, it is easy to form a convex part.
About the manufacturing method of the said wiring board, in a said 1st process, it is preferable that these metal plate through-holes are formed by pressing.
　これによれば、容易に金属板貫通孔を形成することができる。
　上記配線板の製造方法について、前記複数の金属板貫通孔の各々または少なくとも一つは、導電材の充填状態を検査するための検査用貫通孔又はガス抜き用貫通孔であることが好ましい。 According to this, a metal plate through-hole can be formed easily.
In the method for manufacturing the wiring board, each or at least one of the plurality of metal plate through holes is preferably an inspection through hole or a gas vent through hole for inspecting a filling state of the conductive material.
　これによれば、導電材が十分に充填されたか否かを確認することができる。また、層間接続部を形成するときに生じるガスを排出することができる。
　上記配線板の製造方法について、前記第１の工程は、各金属板貫通孔群が少なくとも２つの金属板貫通孔によって構成される複数の金属板貫通孔群を前記第２の金属板に形成することを含み、前記第２の工程は、各凸部が前記複数の金属板貫通孔群のひとつに囲まれる複数の凸部を前記第２の金属板に形成することを含み、前記複数の凸部は、前記第２の金属板の端部領域と非端部領域とに形成されることが好ましい。 According to this, it can be confirmed whether or not the conductive material is sufficiently filled. Further, the gas generated when forming the interlayer connection portion can be discharged.
Regarding the method for manufacturing the wiring board, the first step is to form a plurality of metal plate through hole groups in the second metal plate, each metal plate through hole group including at least two metal plate through holes. The second step includes forming, on the second metal plate, a plurality of convex portions, each convex portion being surrounded by one of the plurality of metal plate through hole groups, and the plurality of convex portions. The part is preferably formed in an end region and a non-end region of the second metal plate.
　これによれば、複数の凸部によって複数の層間接続部を形成できるので、絶縁基板から第１の金属板又は第２の金属板が剥がれ難い。 According to this, since the plurality of interlayer connection portions can be formed by the plurality of convex portions, the first metal plate or the second metal plate is hardly peeled off from the insulating substrate.
　本発明によれば、配線板の金属板が絶縁基板から剥離することを抑制することができる。他の態様及び利点は本発明の技術的思想の例を示す図面と共に以下の記載から明らかとなる。 According to the present invention, the metal plate of the wiring board can be prevented from peeling off from the insulating substrate. Other aspects and advantages will become apparent from the following description taken in conjunction with the drawings, which illustrate examples of the technical spirit of the present invention.
（ａ）は第１の金属板から見た第１の実施形態における配線板の一部平面図、（ｂ）は図１（ａ）の１ｂ－１ｂ線における配線板の模式的断面図、（ｃ）は第２の金属板から見た配線板の一部平面図。(A) is a partial plan view of the wiring board according to the first embodiment viewed from the first metal plate, (b) is a schematic cross-sectional view of the wiring board taken along line 1b-1b in FIG. c) A partial plan view of the wiring board as viewed from the second metal plate. （ａ）は第１の実施形態における第２の金属板の平面図、（ｂ）は図２（ａ）の部分拡大図。(A) is a top view of the 2nd metal plate in 1st Embodiment, (b) is the elements on larger scale of Fig.2 (a). （ａ）は第１の実施形態における孔用金型装置の斜視図、（ｂ）は第１の実施形態における凸用金型の斜視図。(A) is a perspective view of the metal mold | die apparatus for holes in 1st Embodiment, (b) is a perspective view of the convex metal mold | die in 1st Embodiment. （ａ）～（ｄ）は第１の実施形態における第２の金属板に検査用貫通孔及び凸部を形成する工程を説明するための模式的断面図。(A)-(d) is typical sectional drawing for demonstrating the process of forming the through-hole for an inspection and a convex part in the 2nd metal plate in 1st Embodiment. （ａ）及び（ｂ）は第１の実施形態における第１の金属板に折曲がり部を形成する工程を説明するための模式的断面図。(A) And (b) is typical sectional drawing for demonstrating the process of forming a bending part in the 1st metal plate in 1st Embodiment. 第１の実施形態における配線板の製造工程を説明するための模式的断面図。The typical sectional view for explaining the manufacturing process of the wiring board in a 1st embodiment. 第１の実施形態における配線板の製造工程を説明するための模式的断面図。The typical sectional view for explaining the manufacturing process of the wiring board in a 1st embodiment. 第２の実施形態における配線板の模式的断面図。The typical sectional view of the wiring board in a 2nd embodiment. 従来技術の基板の断面図。Sectional drawing of the board | substrate of a prior art.
　（第１の実施形態）
　以下、配線板の第１の実施形態について説明する。
　図１（ａ）～（ｃ）に示すように、配線板１０は、厚銅基板を用いて構成されている。配線板１０は、絶縁基板１１の表面１１ａに、第１の金属板２１（例えば銅板）を有するとともに、絶縁基板１１の裏面１１ｂに第２の金属板３１（例えば銅板）を有する。絶縁基板１１は、例えば、ガラスエポキシ樹脂基板である。第１の金属板２１と第２の金属板３１は、接着剤によって絶縁基板１１に接合されている。第１の金属板２１及び第２の金属板３１は、所望の形状にパターニングされ、電流経路となる。 (First embodiment)
Hereinafter, a first embodiment of the wiring board will be described.
As shown in FIGS. 1A to 1C, the wiring board 10 is formed using a thick copper substrate. The wiring board 10 has a first metal plate 21 (for example, a copper plate) on the surface 11 a of the insulating substrate 11 and a second metal plate 31 (for example, a copper plate) on the back surface 11 b of the insulating substrate 11. The insulating substrate 11 is, for example, a glass epoxy resin substrate. The first metal plate 21 and the second metal plate 31 are bonded to the insulating substrate 11 with an adhesive. The first metal plate 21 and the second metal plate 31 are patterned into a desired shape to form a current path.
　第１の金属板２１と第２の金属板３１は、層間接続部４１によって接続されている。絶縁基板１１には、厚み方向に貫通する基材貫通孔１３が設けられている。第１の金属板２１には、基材貫通孔１３と対向して厚み方向に貫通する貫通孔２２が設けられている。貫通孔２２の径は、基材貫通孔１３の径よりも小さい。貫通孔２２の周縁は、基材貫通孔１３に向けて折り曲げられており、これにより、絶縁基板１１の表面側から裏面側（第２の金属板側）に向けて折り曲がる折曲がり部２３が構成されている。 The first metal plate 21 and the second metal plate 31 are connected by an interlayer connection portion 41. The insulating substrate 11 is provided with a base material through hole 13 penetrating in the thickness direction. The first metal plate 21 is provided with a through hole 22 that faces the base material through hole 13 and penetrates in the thickness direction. The diameter of the through hole 22 is smaller than the diameter of the substrate through hole 13. The peripheral edge of the through hole 22 is bent toward the base material through hole 13, whereby a bent portion 23 that bends from the front surface side to the back surface side (second metal plate side) of the insulating substrate 11. It is configured.
　第２の金属板３１には、絶縁基板１１の裏面側から表面側（第１の金属板側）へ突出する凸部３２が設けられている。凸部３２は、円形状の先端部３２ａと、先端部３２ａの周縁に設けられた円筒状の筒部３２ｂとを有している。凸部３２は、その外周面が絶縁基板１１における基材貫通孔１３の内面と対向して設けられている。凸部３２は、基材貫通孔１３及び貫通孔２２に挿入されている。これにより、凸部３２は、第１の金属板２１における貫通孔２２の内周面と対向している。凸部３２は、折曲がり部２３とともに基材貫通孔１３の内面を覆っている。 The second metal plate 31 is provided with a convex portion 32 protruding from the back surface side of the insulating substrate 11 to the front surface side (first metal plate side). The convex part 32 has the circular front-end | tip part 32a and the cylindrical cylinder part 32b provided in the periphery of the front-end | tip part 32a. The convex portion 32 is provided with its outer peripheral surface facing the inner surface of the base material through hole 13 in the insulating substrate 11. The convex portion 32 is inserted into the base material through hole 13 and the through hole 22. Thereby, the convex portion 32 faces the inner peripheral surface of the through hole 22 in the first metal plate 21. The convex portion 32 covers the inner surface of the base material through hole 13 together with the bent portion 23.
　第２の金属板３１には、厚み方向に貫通する金属板貫通孔としての円形状の検査用貫通孔３３が、基材貫通孔１３に対向して設けられている。検査用貫通孔３３は、検査用貫通孔３３の軸方向が凸部３２の軸方向に対して傾斜する状態に設けられている。検査用貫通孔３３は、基材貫通孔１３と連通している。検査用貫通孔３３は、四箇所に設けられており、凸部３２を囲むように設けられている。検査用貫通孔３３は、凸部３２の基端（凸部３２の周縁）となる位置に設けられている。 The second metal plate 31 is provided with a circular inspection through hole 33 as a metal plate through hole penetrating in the thickness direction so as to face the substrate through hole 13. The inspection through hole 33 is provided in a state where the axial direction of the inspection through hole 33 is inclined with respect to the axial direction of the convex portion 32. The inspection through hole 33 communicates with the base material through hole 13. The inspection through holes 33 are provided at four locations and are provided so as to surround the convex portion 32. The inspection through-hole 33 is provided at a position that becomes the base end of the convex portion 32 (periphery of the convex portion 32).
　そして、折曲がり部２３と凸部３２は、層間接続部４１によって接続されている。層間接続部４１は、貫通孔２２、基材貫通孔１３及び検査用貫通孔３３のそれぞれに充填された半田である。折曲がり部２３と凸部３２との間にも半田が充填され、層間接続部４１によって折曲がり部２３と凸部３２が接続されている。 The bent portion 23 and the convex portion 32 are connected by an interlayer connection portion 41. The interlayer connection portion 41 is solder filled in each of the through hole 22, the base material through hole 13, and the inspection through hole 33. Solder is also filled between the bent portion 23 and the convex portion 32, and the bent portion 23 and the convex portion 32 are connected by the interlayer connection portion 41.
　なお、図１では、説明の便宜上、配線板１０に設けられる一つの層間接続部４１のみを図示して説明したが、配線板１０には、配線板１０の端部領域に加え、端部領域と異なる非領域領域にも層間接続部４１が設けられている。 In FIG. 1, for convenience of explanation, only one interlayer connection portion 41 provided on the wiring board 10 is illustrated and described. However, the wiring board 10 includes an end region in addition to the end region of the wiring board 10. Interlayer connection portions 41 are also provided in non-region regions different from the above.
　次に、本実施形態の配線板１０の製造方法について説明する。
　図３（ａ）は、第２の金属板３１に図２（ａ）及び（ｂ）に示す複数の検査用貫通孔３３を形成するための金型の部分的模式図である。図３（ｂ）は、第２の金属板３１に図２（ａ）に示す複数の凸部３２を形成するための金型の部分的模式図である。まず、第２の金属板３１に複数の検査用貫通孔３３を形成するためのプレス加工について説明する。 Next, the manufacturing method of the wiring board 10 of this embodiment is demonstrated.
FIG. 3A is a partial schematic view of a mold for forming a plurality of inspection through holes 33 shown in FIGS. 2A and 2B in the second metal plate 31. FIG. 3B is a partial schematic view of a mold for forming a plurality of convex portions 32 shown in FIG. 2A on the second metal plate 31. First, press working for forming a plurality of inspection through holes 33 in the second metal plate 31 will be described.
　図３（ａ）及び図４（ａ）に示すように、第２の金属板３１に検査用貫通孔３３をプレス加工するための孔用金型装置５０は、孔形成金型５１と、支持金型５５とを有している。孔形成金型５１は、柱状の支持部５２の一面に、円柱状の孔形成用突起５３を有している。孔形成用突起５３の数は、任意に設定することができ、第２の金属板３１に形成する検査用貫通孔３３の数に合わせて設定される。本実施形態では、各層間接続部４１に対応する四つの孔形成用突起５３からなる突起群が４つ設けられている。支持金型５５は、一組の孔形成用突起５３を囲む領域に対応した凹部５４を四箇所に有している。 As shown in FIGS. 3A and 4A, the hole mold apparatus 50 for pressing the inspection through hole 33 in the second metal plate 31 includes a hole forming mold 51 and a support. A mold 55 is included. The hole forming mold 51 has a columnar hole forming protrusion 53 on one surface of a columnar support portion 52. The number of hole forming projections 53 can be arbitrarily set, and is set in accordance with the number of inspection through holes 33 formed in the second metal plate 31. In the present embodiment, four projection groups including four hole forming projections 53 corresponding to the respective interlayer connection portions 41 are provided. The support die 55 has four recesses 54 corresponding to regions surrounding the pair of hole forming projections 53.
　そして、図４（ａ）及び（ｂ）に示すように、第２の金属板３１を、支持金型５５に載置する。次に、孔形成金型５１で第２の金属板３１をプレスすると、各孔形成用突起５３によって第２の金属板３１が打ち抜かれ、その打ち抜いた位置に検査用貫通孔３３が形成される（第１の工程）。 Then, as shown in FIGS. 4A and 4B, the second metal plate 31 is placed on the support mold 55. Next, when the second metal plate 31 is pressed by the hole forming die 51, the second metal plate 31 is punched by the hole forming protrusions 53, and the inspection through hole 33 is formed at the punched position. (First step).
　次に、第２の金属板３１に凸部３２を形成する。第２の金属板３１の凸部３２は、金型によってプレス加工される。
　図３（ｂ）及び図４（ｂ）に示すように、第２の金属板３１に凸部３２をプレス加工するための凸用金型装置６０は、凸形成金型６１と支持金型６５とを有している。凸形成金型６１は、柱状の支持部６２の一面に、円柱状の凸部用突起６３を有している。凸部用突起６３は、層間接続部４１に対応して一つずつ設けられている。凸部用突起６３の直径は、凸部３２の先端部３２ａの底面（第２の金属板３１における絶縁基板１１の接合面とは反対側の面）の直径と同一になっている。支持金型６５には、凸部用突起６３に対応して凹部６４が形成されている。 Next, the convex portion 32 is formed on the second metal plate 31. The convex portion 32 of the second metal plate 31 is pressed by a mold.
As shown in FIGS. 3B and 4B, the convex mold apparatus 60 for pressing the convex portion 32 on the second metal plate 31 includes a convex mold 61 and a support mold 65. And have. The convex mold 61 has a cylindrical convex projection 63 on one surface of a columnar support 62. One protrusion 63 is provided corresponding to each interlayer connection 41. The diameter of the protrusion 63 for protrusions is the same as the diameter of the bottom surface of the tip 32a of the protrusion 32 (the surface opposite to the bonding surface of the insulating substrate 11 in the second metal plate 31). The support mold 65 is formed with a recess 64 corresponding to the protrusion 63 for protrusion.
　そして、図４（ｃ）に示すように、第２の金属板３１を支持金型６５に載置する。次に、凸部用突起６３の先端縁が複数の検査用貫通孔３３に沿うように、凸形成金型６１で検査用貫通孔３３に囲まれる領域をプレスすると、図４（ｄ）に示すように、４つの検査用貫通孔３３に対して１つの凸部３２が形成される（第２の工程）。 And the 2nd metal plate 31 is mounted in the support metal mold | die 65 as shown in FIG.4 (c). Next, when the region surrounded by the inspection through hole 33 is pressed with the convex forming die 61 so that the tip edge of the protrusion 63 for protrusion protrudes along the plurality of through holes 33 for inspection, FIG. As described above, one convex portion 32 is formed for the four inspection through holes 33 (second step).
　検査用貫通孔３３を形成した後に、凸部３２をプレス加工しているため、検査用貫通孔３３は、変形している。具体的にいえば、第２の金属板３１は、凸形成金型６１によってプレスされると、変形して、伸張する。このため、凸部３２を形成した後に検査用貫通孔３３を形成する場合に比べて、検査用貫通孔３３が歪む。本実施形態において、検査用貫通孔３３は、その軸方向が凸部３２の軸方向に対して傾斜するように変形する。 Since the convex portion 32 is pressed after the inspection through-hole 33 is formed, the inspection through-hole 33 is deformed. Specifically, when the second metal plate 31 is pressed by the convex mold 61, it is deformed and stretched. For this reason, the inspection through-hole 33 is distorted as compared with the case where the inspection through-hole 33 is formed after the convex portion 32 is formed. In the present embodiment, the inspection through-hole 33 is deformed so that its axial direction is inclined with respect to the axial direction of the convex portion 32.
　次に、第１の金属板２１に折曲がり部２３を形成する。
　図５（ａ）及び（ｂ）に示すように、第１の金属板２１に、貫通孔２２を形成する。この貫通孔２２は、プレス加工や、エッチングなど、どのような方法で形成されていてもよい。この貫通孔２２を、貫通孔２２の直径よりも直径の大きい円柱状部材６９（例えば曲げパンチ）で押圧することで、貫通孔２２の周縁を折れ曲げて、折曲がり部２３を形成する。 Next, the bent portion 23 is formed on the first metal plate 21.
As shown in FIGS. 5A and 5B, a through hole 22 is formed in the first metal plate 21. The through hole 22 may be formed by any method such as press working or etching. By pressing the through-hole 22 with a cylindrical member 69 (for example, a bending punch) having a diameter larger than that of the through-hole 22, the periphery of the through-hole 22 is bent to form the bent portion 23.
　次に、絶縁基板１１に第１の金属板２１及び第２の金属板３１を接合する。
　図６に示すように、絶縁基板１１の表面１１ａに第１の金属板２１を接合するとともに、絶縁基板１１の裏面１１ｂに第２の金属板３１を接合する。このとき、絶縁基板１１の基材貫通孔１３に折曲がり部２３が挿入され、凸部３２が第１の金属板２１の貫通孔２２に挿入されるように位置決めを行う。第１の金属板２１と第２の金属板３１の絶縁基板１１への接合は、絶縁基板１１と第１の金属板２１との間及び絶縁基板１１と第２の金属板３１との間に接着剤を塗布するとともに、第１の金属板２１及び第２の金属板３１を絶縁基板１１に向けて加圧することで行われる（第３の工程）。 Next, the first metal plate 21 and the second metal plate 31 are joined to the insulating substrate 11.
As shown in FIG. 6, the first metal plate 21 is bonded to the front surface 11 a of the insulating substrate 11, and the second metal plate 31 is bonded to the back surface 11 b of the insulating substrate 11. At this time, positioning is performed so that the bent portion 23 is inserted into the base material through hole 13 of the insulating substrate 11 and the convex portion 32 is inserted into the through hole 22 of the first metal plate 21. The bonding of the first metal plate 21 and the second metal plate 31 to the insulating substrate 11 is performed between the insulating substrate 11 and the first metal plate 21 and between the insulating substrate 11 and the second metal plate 31. This is performed by applying an adhesive and pressurizing the first metal plate 21 and the second metal plate 31 toward the insulating substrate 11 (third step).
　図７に示すように、第１の金属板２１における貫通孔２２及びその周囲に、導電材としての半田ペースト２８を塗布する。この半田ペースト２８の塗布は、基材貫通孔１３での半田ペースト２８の塗布領域以外の領域はメタルマスクで覆った状態で行われる。つまり、第１の金属板２１における絶縁基板１１との接合面とは反対側の面は平坦であり、凹凸のない銅板表面を確保しており、所望の領域に半田ペースト２８を印刷することができる。また、当該半田ペースト２８の塗布工程において、電子部品の配置領域においても、半田ペースト２８を塗布する。 As shown in FIG. 7, a solder paste 28 as a conductive material is applied to the through hole 22 in the first metal plate 21 and its periphery. The application of the solder paste 28 is performed in a state where the region other than the application region of the solder paste 28 in the base material through hole 13 is covered with a metal mask. That is, the surface of the first metal plate 21 opposite to the bonding surface with the insulating substrate 11 is flat, and a copper plate surface having no unevenness is secured, and the solder paste 28 can be printed in a desired region. it can. Further, in the solder paste 28 application step, the solder paste 28 is applied also in the electronic component placement region.
　そして、塗布された半田ペースト２８を、炉において加熱することにより、流動性を有する半田が貫通孔２２、基材貫通孔１３、検査用貫通孔３３に流入していく。そして、半田が硬化することで、基材貫通孔１３の内部に層間接続部４１が形成される（第４の工程）。これにより、第１の金属板２１と第２の金属板３１が層間接続部４１によって導電された配線板１０が製造される。 Then, the applied solder paste 28 is heated in a furnace, so that the solder having fluidity flows into the through hole 22, the base material through hole 13, and the inspection through hole 33. Then, by hardening the solder, the interlayer connection portion 41 is formed inside the base material through hole 13 (fourth step). Thereby, the wiring board 10 by which the 1st metal plate 21 and the 2nd metal plate 31 were electrically conductive by the interlayer connection part 41 is manufactured.
　次に、本実施形態における配線板１０の製造方法の作用について説明する。
　第１の金属板２１及び第２の金属板３１を加工した後に、金属板２１，３１を絶縁基板１１に接合している。例えば、折曲がり部２３の形成は、第１の金属板２１単独で、または、第１の金属板２１が絶縁基板１１と非接触の状態で行われる。また、検査用貫通孔３３の形成、及び、凸部３２の形成は、第２の金属板３１単独で、または、第２の金属板３１が絶縁基板１１と非接触の状態で行われる。このため、絶縁基板１１に金属板２１，３１が接合された状態で、金属板２１，３１を加工する必要がない。 Next, the effect | action of the manufacturing method of the wiring board 10 in this embodiment is demonstrated.
After processing the first metal plate 21 and the second metal plate 31, the metal plates 21 and 31 are joined to the insulating substrate 11. For example, the bent portion 23 is formed by the first metal plate 21 alone or in a state where the first metal plate 21 is not in contact with the insulating substrate 11. Further, the formation of the inspection through-hole 33 and the formation of the convex portion 32 are performed by the second metal plate 31 alone or in a state where the second metal plate 31 is not in contact with the insulating substrate 11. For this reason, it is not necessary to process the metal plates 21 and 31 in a state where the metal plates 21 and 31 are joined to the insulating substrate 11.
　また、第２の金属板３１に凸部３２を形成する前に、検査用貫通孔３３を形成している。検査用貫通孔３３を形成することで、この検査用貫通孔３３が変形を許容する領域となり、第２の金属板３１の剛性が低下する。第２の金属板３１の剛性が低下することで、凸部３２を形成するときに、第２の金属板３１が変形しやすい。 In addition, the inspection through hole 33 is formed before the convex portion 32 is formed on the second metal plate 31. By forming the inspection through-hole 33, the inspection through-hole 33 becomes a region allowing deformation, and the rigidity of the second metal plate 31 is reduced. Since the rigidity of the second metal plate 31 is reduced, the second metal plate 31 is easily deformed when the convex portion 32 is formed.
　したがって、上記実施形態によれば、以下のような効果を得ることができる。
　（１）絶縁基板１１に金属板２１，３１が接合された状態で、金属板２１，３１を加工する必要がないため、加工に伴い絶縁基板１１から金属板２１，３１から剥離することがない。 Therefore, according to the above embodiment, the following effects can be obtained.
(1) Since it is not necessary to process the metal plates 21 and 31 in a state where the metal plates 21 and 31 are bonded to the insulating substrate 11, the metal plates 21 and 31 are not peeled off from the insulating substrate 11 along with the processing. .
　（２）凸部３２を形成するときに、検査用貫通孔３３が設けられていることで第２の金属板３１が変形しやすく、凸形成金型６１（凸部用突起６３）にかかる負荷が少ない。このため、凸形成金型６１の摩耗が抑えられ、凸形成金型６１の寿命が短くなりにくい。 (2) When the convex portion 32 is formed, the inspection metal through-hole 33 is provided so that the second metal plate 31 is easily deformed, and the load applied to the convex forming die 61 (the convex portion projection 63). Less is. For this reason, the wear of the convex mold 61 is suppressed, and the life of the convex mold 61 is unlikely to be shortened.
　（３）検査用貫通孔３３は、凸部３２の基端となる位置に設けられているため、検査用貫通孔３３によって第２の金属板３１の剛性が低下しており、凸部３２を形成しやすい。
　（４）検査用貫通孔３３が、凸部３２の基端となる位置に設けられていることで、検査用貫通孔３３が、層間接続部４１に埋まりにくく、検査用貫通孔３３による半田の充填状態の検査を阻害しにくい。 (3) Since the inspection through hole 33 is provided at a position that becomes the base end of the convex portion 32, the rigidity of the second metal plate 31 is reduced by the inspection through hole 33, and the convex portion 32 is Easy to form.
(4) Since the inspection through-hole 33 is provided at a position that becomes the base end of the convex portion 32, the inspection through-hole 33 is less likely to be buried in the interlayer connection portion 41, and soldering by the inspection through-hole 33 is prevented. It is hard to disturb inspection of filling state.
　（５）検査用貫通孔３３は、凸部３２を形成する前に、孔形成金型５１によって形成されている。凸部３２を形成した後に、検査用貫通孔３３を形成すると、凸部３２が形成され、屈曲した部分に検査用貫通孔３３を形成することになり、孔形成金型５１が摩耗しやすい。検査用貫通孔３３を凸部３２よりも先に形成することで、平坦な第２の金属板３１に検査用貫通孔３３を形成することができる。このため、孔形成金型５１が摩耗しにくく、孔形成金型５１の寿命が短くなりにくい。 (5) The inspection through hole 33 is formed by the hole forming mold 51 before forming the convex portion 32. If the inspection through-hole 33 is formed after the convex portion 32 is formed, the convex portion 32 is formed, and the inspection through-hole 33 is formed in the bent portion, so that the hole forming mold 51 is easily worn. By forming the inspection through hole 33 prior to the convex portion 32, the inspection through hole 33 can be formed in the flat second metal plate 31. For this reason, the hole forming mold 51 is not easily worn, and the life of the hole forming mold 51 is not easily shortened.
　（６）検査用貫通孔３３によって、第１の金属板２１と第２の金属板３１の接合不良を判定することができる。具体的にいえば、検査用貫通孔３３内に、半田が充填されていない場合、検査用貫通孔３３を通して半田を視認することができない。これにより、接合不良であると判断することができる。 (6) By the inspection through hole 33, it is possible to determine the bonding failure between the first metal plate 21 and the second metal plate 31. Specifically, when the inspection through hole 33 is not filled with solder, the solder cannot be visually recognized through the inspection through hole 33. Thereby, it can be determined that there is a bonding failure.
　（７）特許文献１に記載の基板１００の場合、セラミックプレート１０１に金属プレート１０２が接合された状態で、円柱状部材１０６をスルーホール１０５に挿入するため、金属プレート１０２の剥離を抑制するために、円柱状部材１０６のプレス圧を小さくする必要がある。一方、本実施形態では、第１の金属板２１に折曲がり部２３を形成するときに、絶縁基板１１からの剥離を考慮する必要がないため、プレス圧を小さくする必要がない。 (7) In the case of the substrate 100 described in Patent Document 1, the cylindrical member 106 is inserted into the through hole 105 in a state where the metal plate 102 is bonded to the ceramic plate 101, so that peeling of the metal plate 102 is suppressed. In addition, it is necessary to reduce the pressing pressure of the cylindrical member 106. On the other hand, in the present embodiment, when the bent portion 23 is formed on the first metal plate 21, it is not necessary to consider peeling from the insulating substrate 11, and thus it is not necessary to reduce the press pressure.
　（８）凸部３２を形成するときには既に検査用貫通孔３３が設けられている。このため、凸部３２を形成するときに凸部３２における金属板３１を伸ばして、検査用貫通孔３３の軸方向を凸部３２の軸方向に対して傾斜させることができる。この場合、検査用貫通孔３３に充填された半田を配線板１０の厚み方向に対して傾斜させることができるので、絶縁基板１１から第２の金属板３１を剥がれ難くすることができる。 (8) When the convex portion 32 is formed, the inspection through-hole 33 is already provided. For this reason, when forming the convex part 32, the metal plate 31 in the convex part 32 can be extended, and the axial direction of the inspection through-hole 33 can be inclined with respect to the axial direction of the convex part 32. In this case, since the solder filled in the inspection through hole 33 can be inclined with respect to the thickness direction of the wiring board 10, the second metal plate 31 can be hardly peeled off from the insulating substrate 11.
　（９）凸部３２は複数形成されているため、層間接続部４１が複数形成される。このため、絶縁基板１１から第１の金属板２１又は第２の金属板３１が剥がれ難い。
　（第２の実施形態）
　以下、配線板の第２の実施形態について説明する。 (9) Since a plurality of convex portions 32 are formed, a plurality of interlayer connection portions 41 are formed. For this reason, the first metal plate 21 or the second metal plate 31 is not easily peeled off from the insulating substrate 11.
(Second Embodiment)
Hereinafter, a second embodiment of the wiring board will be described.
　図８に示すように、本実施形態の配線板７０は、絶縁基板１１の周縁に層間接続部７１を有する。第１の金属板７２には、絶縁基板１１の周縁を覆うように折れ曲がる折曲がり部７３が設けられている。第２の金属板８１には、折曲がり部７３とともに絶縁基板１１の周縁を覆うように突出する凸部８２が設けられている。凸部８２は、絶縁基板１１における周縁と対向している。凸部８２の基端には、第２の金属板８１の厚み方向に貫通する検査用貫通孔３３が設けられている。折曲がり部７３と凸部８２との間及び検査用貫通孔３３には、半田が充填され、これにより層間接続部７１が構成されている。 As shown in FIG. 8, the wiring board 70 of this embodiment has an interlayer connection 71 on the periphery of the insulating substrate 11. The first metal plate 72 is provided with a bent portion 73 that is bent so as to cover the periphery of the insulating substrate 11. The second metal plate 81 is provided with a convex portion 82 that protrudes so as to cover the periphery of the insulating substrate 11 together with the bent portion 73. The convex portion 82 faces the peripheral edge of the insulating substrate 11. An inspection through-hole 33 that penetrates in the thickness direction of the second metal plate 81 is provided at the base end of the convex portion 82. Solder is filled between the bent portion 73 and the convex portion 82 and the inspection through-hole 33, thereby forming an interlayer connection portion 71.
　第２の金属板８１に凸部８２を形成する際には、凸部８２よりも先に検査用貫通孔３３を形成する。第２の実施形態の配線板７０についても、第１の実施形態に記載の配線板１０と同様な効果を得ることができる。 When forming the convex portion 82 on the second metal plate 81, the inspection through hole 33 is formed before the convex portion 82. For the wiring board 70 of the second embodiment, the same effect as that of the wiring board 10 described in the first embodiment can be obtained.
　なお、実施形態は以下のように変更してもよい。
　○検査用貫通孔３３は、ドリルや、エッチングなどで形成されてもよい。
　○金属板貫通孔は、検査用貫通孔３３以外でもよい。すなわち、接合不良の判定用ではなく、例えばガス抜き孔であってもよい。ガス抜き孔の場合、半田付け時のガスを抜くことができる。 In addition, you may change embodiment as follows.
The inspection through hole 33 may be formed by drilling, etching, or the like.
The metal plate through hole may be other than the inspection through hole 33. That is, it may be a vent hole, for example, instead of determining a bonding failure. In the case of the gas vent hole, the gas at the time of soldering can be vented.
　○銀ペーストなど他の導電材を用いて層間接続部４１を形成してもよい。
　○第２の金属板３１，８１の凸部３２，８２は、第２の金属板３１，８１の端部領域にのみ設けられていてもよいし、第２の金属板３１，８１の端部領域以外の非端部領域にのみ設けられていてもよい。 The interlayer connection 41 may be formed using other conductive material such as silver paste.
The convex portions 32 and 82 of the second metal plates 31 and 81 may be provided only in the end region of the second metal plates 31 and 81, or the end portions of the second metal plates 31 and 81 It may be provided only in the non-end region other than the region.
　○第１の実施形態では、第２の金属板３１を加工した後に、第１の金属板２１を加工したが、第１の金属板２１と加工した後に、第２の金属板３１を加工してもよい。
　○検査用貫通孔３３及び凸部３２，８２の形状は、円形状以外の、多角形状などであってもよい。 In the first embodiment, the first metal plate 21 is processed after the second metal plate 31 is processed. However, after the first metal plate 21 is processed, the second metal plate 31 is processed. May be.
○ The shape of the inspection through-hole 33 and the convex portions 32 and 82 may be a polygonal shape other than a circular shape.
　○接着剤は、塗布するものではなく、予め絶縁基板１１の面に接着剤層が形成されて加熱によって接着剤層が液化するものでもよい。
　○層間接続部４１，７１は設けられていなくてもよい。 The adhesive may not be applied but may be one in which an adhesive layer is previously formed on the surface of the insulating substrate 11 and the adhesive layer is liquefied by heating.
The interlayer connection portions 41 and 71 may not be provided.
　○検査用貫通孔３３は、凸部３２の軸方向に対して傾斜していなくてもよい。
　○検査用貫通孔３３は、凸部３２の基端以外に設けられていてもよい。
　○凸部３２は、単数設けられていてもよい。 The inspection through-hole 33 may not be inclined with respect to the axial direction of the convex portion 32.
The inspection through-hole 33 may be provided other than the base end of the convex portion 32.
A single convex portion 32 may be provided.
　○凸部３２は、プレス加工以外の方法で形成されてもよい。 ○ The convex portion 32 may be formed by a method other than press working.
　本発明は、例示したものに限定されるものではない。例えば、例示した特徴が本発明にとって必須であると解釈されるべきでなく、むしろ、本発明の主題は、開示した特定の実施形態の全ての特徴より少ない特徴に存在することがある。本発明は、特許請求の範囲によって示され、特許請求の範囲と均等の範囲内での全ての変更が含まれることが意図される。 The present invention is not limited to the illustrated example. For example, the illustrated features should not be construed as essential to the invention, but rather the subject matter of the invention may be present in fewer features than all the features of the particular embodiment disclosed. The present invention is defined by the terms of the claims, and is intended to include any modifications within the scope equivalent to the terms of the claims.

Claims (7)

  1. 　絶縁基板の表面に設けられた第１の金属板と、前記絶縁基板の裏面に設けられるとともに凸部が形成された第２の金属板とを有し、前記第１の金属板と前記凸部とを対向させた配線板の製造方法であって、
    　前記第２の金属板に、複数の金属板貫通孔を形成する第１の工程と、
    　前記第２の金属板に、前記複数の金属板貫通孔に対して１つの凸部を形成する第２の工程と、
    　前記凸部が前記絶縁基板と対向するように前記第１の金属板と前記第２の金属板とを前記絶縁基板に設ける第３の工程と、を含むことを特徴とする配線板の製造方法。     A first metal plate provided on the surface of the insulating substrate; and a second metal plate provided on the back surface of the insulating substrate and having a convex portion formed thereon, the first metal plate and the convex portion. A method of manufacturing a wiring board facing each other,
    A first step of forming a plurality of metal plate through holes in the second metal plate;
    A second step of forming, on the second metal plate, one convex portion with respect to the plurality of metal plate through holes;
    And a third step of providing the first metal plate and the second metal plate on the insulating substrate so that the convex portion faces the insulating substrate. .
  2. 　前記凸部と前記第１の金属板との間に導電材を充填して前記第１の金属板と前記第２の金属板とを接続する層間接続部を形成する第４の工程を含むことを特徴とする請求項１に記載の配線板の製造方法。 Including a fourth step of forming an interlayer connection portion for connecting the first metal plate and the second metal plate by filling a conductive material between the convex portion and the first metal plate. The manufacturing method of the wiring board of Claim 1 characterized by these.
  3. 　前記第１の工程において、前記複数の金属板貫通孔は前記凸部の基端となる位置に形成されることを特徴とする請求項１又は請求項２に記載の配線板の製造方法。 3. The method of manufacturing a wiring board according to claim 1, wherein, in the first step, the plurality of metal plate through holes are formed at a position to be a base end of the convex portion.
  4. 　前記第１の工程において、前記複数の金属板貫通孔は、プレスして形成されることを特徴とする請求項１～請求項３のうちいずれか一項に記載の配線板の製造方法。 The method of manufacturing a wiring board according to any one of claims 1 to 3, wherein, in the first step, the plurality of metal plate through holes are formed by pressing.
  5. 　前記複数の金属板貫通孔の各々または少なくとも一つは、前記凸部と前記第１の金属板との間の導電材の充填状態を検査するための検査用貫通孔又はガス抜き用貫通孔であることを特徴とする請求項１～請求項４のうちいずれか一項に記載の配線板の製造方法。 Each or at least one of the plurality of metal plate through holes is an inspection through hole or a gas vent through hole for inspecting a filling state of the conductive material between the convex portion and the first metal plate. The method of manufacturing a wiring board according to any one of claims 1 to 4, wherein the wiring board is provided.
  6. 　前記第１の工程は、各金属板貫通孔群が少なくとも２つの金属板貫通孔によって構成される複数の金属板貫通孔群を、前記第２の金属板に形成することを含み、
    　前記第２の工程は、各凸部が前記複数の金属板貫通孔群のひとつに囲まれる複数の凸部を、前記第２の金属板に形成することを含み、
    　前記複数の凸部は、前記第２の金属板の端部領域と非端部領域とに形成されることを特徴とする請求項１～請求項５のうちいずれか一に記載の配線板の製造方法。     The first step includes forming, on the second metal plate, a plurality of metal plate through-hole groups each metal plate through-hole group including at least two metal plate through-holes,
    The second step includes forming, on the second metal plate, a plurality of convex portions, each convex portion being surrounded by one of the plurality of metal plate through hole groups,
    6. The wiring board according to claim 1, wherein the plurality of convex portions are formed in an end region and a non-end region of the second metal plate. Production method.
  7. 　絶縁基板と、前記絶縁基板の両面に結合された第１の金属板と第２の金属板とを含む配線板の製造方法であって、
    　基材貫通孔を有する絶縁基板を準備し、
    　前記第１の金属板と前記絶縁基板とが非接触である状態で、前記第１の金属板に第１貫通孔を形成し、
    　前記第１の金属板と前記絶縁基板とが非接触である状態で、前記第１貫通孔の開口縁に折曲がり部を形成し、
    　前記第２の金属板と前記絶縁基板とが非接触である状態で、前記第２の金属板の所定位置を囲む第２貫通孔群を形成し、
    　前記第２の金属板と前記絶縁基板とが非接触である状態で、前記第２貫通孔群に囲まれる前記所定位置を含む凸部を形成し、
    　前記第１の金属板と前記第２の金属板との間に前記絶縁基板をサンドイッチして、前記第２の金属板の前記凸部を前記絶縁基板の前記基材貫通孔及び前記第１の金属板の前記第１貫通孔内に配置し、
    　前記第２の金属板の前記凸部と前記絶縁基板の前記基材貫通孔との間の間隙、及び、前記第２の金属板の前記凸部と前記第１の金属板の前記第１貫通孔との間の間隙、及び、前記第２の金属板の前記第２貫通孔群を充填する導電材によって層間接続部を形成することを備える配線板の製造方法。     A method of manufacturing a wiring board comprising an insulating substrate, and a first metal plate and a second metal plate bonded to both surfaces of the insulating substrate,
    Preparing an insulating substrate having a base material through hole,
    Forming a first through hole in the first metal plate in a state where the first metal plate and the insulating substrate are not in contact with each other;
    In a state where the first metal plate and the insulating substrate are not in contact with each other, a bent portion is formed at an opening edge of the first through hole,
    Forming a second through hole group surrounding a predetermined position of the second metal plate in a state where the second metal plate and the insulating substrate are not in contact with each other;
    In a state where the second metal plate and the insulating substrate are not in contact with each other, a convex portion including the predetermined position surrounded by the second through hole group is formed,
    The insulating substrate is sandwiched between the first metal plate and the second metal plate, and the convex portion of the second metal plate is inserted into the base material through-hole of the insulating substrate and the first metal plate. Arranged in the first through hole of the metal plate,
    The gap between the convex portion of the second metal plate and the base material through-hole of the insulating substrate, and the first penetration of the convex portion of the second metal plate and the first metal plate A method for manufacturing a wiring board, comprising forming an interlayer connection portion with a conductive material filling a gap between the holes and the second through hole group of the second metal plate.
PCT/JP2014/081391 2013-12-19 2014-11-27 Method for manufacturing wiring board WO2015093250A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052855B2 (en) * 1996-10-21 2000-06-19 日本電気株式会社 Wiring board
WO2012161218A1 (en) * 2011-05-26 2012-11-29 株式会社 豊田自動織機 Wiring board and method for manufacturing wiring board
JP2013128142A (en) * 2009-07-27 2013-06-27 Toyota Industries Corp Printed wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3052855B2 (en) * 1996-10-21 2000-06-19 日本電気株式会社 Wiring board
JP2013128142A (en) * 2009-07-27 2013-06-27 Toyota Industries Corp Printed wiring board
WO2012161218A1 (en) * 2011-05-26 2012-11-29 株式会社 豊田自動織機 Wiring board and method for manufacturing wiring board

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