JP2012028545A - Method for manufacturing wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board in which a hole having a relatively small inner diameter can be filled with a conductive paste, a plurality of holes having small pitches between adjacent holes can be filled with the conductive paste, and a connection between a surface and a rear surface of a substrate body is surely established through a via conductor consisting of the paste.SOLUTION: The method for manufacturing the wiring board comprises a filling step for filling a conductive paste p into a plurality of holes 4 formed along a thickness direction of an insulating layer 1 and having a length h in an axial direction more than 5 times of the inner diameter. The filling step for filling the conductive paste p comprises a step for contacting a mask plate 5 consisting of a thin plate part 8 having perforations 9 corresponding to forming positions of holes 4 and which are the same number as the number of holes 4, and a thickness t of 30 to 100 μm, and a thick plate part 6 surrounding the thin plate part 8, with the surface or the rear surface of the insulating layer 1; and a filling step for press-fitting and filling the conductive paste p into the holes 4 conducting with perforations 9 via a plurality of perforations 9 in the mask plate 5.

Description

  The present invention has a substrate body in which a plurality of insulating layers are laminated, and is formed along the thickness direction of the insulating layer, and the conductive paste is reliably filled in a hole having a long axial length with respect to the inner diameter. The present invention also relates to a method of manufacturing a wiring board in which conduction between the front surface and the back surface of the substrate main body can be ensured by the obtained via conductor.

In order to fill a plurality of through-holes provided in an insulating substrate with a filling paste, a hole-filling mask having a through-hole communicating with the through-hole on the surface of the substrate and made of a metal plate or a resin plate A printed wiring board manufacturing method has been proposed in which a filling paste pressed by a roller squeegee from the outside of the mask is sequentially press-fitted for each through hole (see, for example, Patent Document 1).
In addition, it has a precious metal migration inhibiting action through a metal mask having a stepped mask hole in contact with the front and back surfaces along the inner wall of the through hole penetrating the printed circuit board and the front and back surfaces of the printed circuit board. There has also been proposed a method for producing a printed wiring board in which a resin paint is formed in three dimensions and then the conductive resin paint is coated on both the inside and outside of the resin paint through the same metal mask (for example, Patent Document 2).

However, in the method of manufacturing a printed wiring board disclosed in Patent Document 1, when the inner diameter of the through hole is small or the ratio of the inner diameter of the through hole to the thickness of the substrate (aspect ratio) is large, the conductor using the squeegee In the filling, there is a possibility that an unfilled portion of the conductor is generated in the through hole.
On the other hand, in the case of the method for producing the printed wiring board in Patent Document 2, a resin paint having a noble metal migration inhibiting action and a conductive resin paint are formed in the through hole of the printed circuit board, and Since the coating resin layer is filled in the hollow portion inside the conductive resin paint, the inner diameter of the through hole has to be set to a large size in advance.

JP 2001-298257 A (pages 1 to 11, FIGS. 1 to 19) JP 58-77287 A (pages 1 to 3, FIGS. 1 to 4)

  Solving the problems described in the present invention and the background art, a conductive conductor can be reliably filled in a hole having a relatively small inner diameter and a plurality of holes having a small pitch with adjacent holes, and a via conductor made of the paste It is an object of the present invention to provide a method for manufacturing a wiring board capable of reliably conducting electrical connection between the front and back surfaces of a substrate body via a wire.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problems, the present invention provides a plate thickness in the vicinity of the through hole of the mask plate which is arranged on the surface of the insulating layer and has a through hole communicating with the hole of the insulating layer. The idea is to make it thinner than the plate thickness.
That is, the method for manufacturing a wiring board according to the present invention (Claim 1) includes a substrate body provided with an insulating layer having a front surface and a back surface, and conduction between the surface and the back surface of the substrate body that penetrates the insulating layer. A conductive paste is formed in a plurality of holes formed along the thickness direction of the insulating layer and having an axial length of 5 times or more with respect to the inner diameter. A filling step of filling the conductive paste, the filling step of the conductive paste has through-holes formed on the front surface or the back surface of the insulating layer in the same number as the holes corresponding to the formation positions of the holes, A step of attaching a thin plate portion having a thickness of 30 to 100 μm and a mask plate comprising a thick plate portion surrounding the thin plate portion; and the plurality of through holes in the mask plate, and the plurality of through holes communicating with the through hole. Press the conductive paste into the hole It comprises the steps of Hama, and characterized in that.

  According to this, the ratio of the axial length to the inner diameter (hereinafter referred to as aspect ratio) is 5 or more in the hole of the insulating layer, on the surface or the back surface of the insulating layer, at the position where the hole is formed. Correspondingly, a mask plate made of a thin plate portion having the same number of through holes and having a thickness of 30 to 100 μm and a thick plate portion surrounding the thin plate portion is attached, and in this state The conductive paste is press-fitted and filled into the holes communicating with the respective through holes through the plurality of through holes in the mask plate. As a result, even if the aspect ratio is 5 or more or the pitch between adjacent holes is relatively narrow, the conductive paste can be reliably filled in each hole. Furthermore, since the mask plate has a structure in which the thick plate portion is arranged so as to surround the thin plate portion in which a plurality of through holes are formed, for example, the mask plate has a higher strength than a mask plate having only the thin plate portion. In addition, it is difficult to deform and the life can be extended. In addition, when the mask plate is cleaned after the filling step, the residue of the conductive paste remaining in the through holes of the thin plate portion can be easily and quickly removed, and the frequency of the cleaning itself is reduced. Is possible.

The insulating layer includes a ceramic green sheet, a glass-ceramic green sheet, or an epoxy resin sheet. The thickness (h) of the insulating layer is in the range of 0.2 mm to 1.5 mm, and the inner diameter (d) of the hole is accordingly in the range of 0.04 mm to 0.3 mm.
The reason why the aspect ratio of the holes in the insulating layer is set to 5 or more is that when the ratio is less than 5, it may not be necessary to apply the present invention.
Further, the mask plate is made of a metal mask made of stainless steel plate or the like, or a sheet made of hard resin (PE, PET). In the case of a metal mask, the thin plate portion is thinned to a predetermined plate thickness by etching and then a plurality of holes are formed by laser drilling. On the other hand, in the case of a hard resin sheet, the thick plate portion, the thin plate portion, and the through hole are simultaneously formed by injection molding or the like.
Further, the inner diameter (D) of the through hole of the mask plate is about 2 to 3 times the inner diameter (d) of the hole of the insulating layer that communicates, and this relationship makes it possible to cope with the positional deviation of the mask plate.
Further, the conductive paste is a mixed material having fluidity in which required amounts of W, Mo, Ag, or Cu powder, a resin binder, an organic solvent, and the like are mixed.
In addition, in the step of press-fitting and filling the conductive paste, the block-shaped conductive paste is inserted into the cylinder chamber, and the push plate positioned on the opposite side of the mask plate and pushed by the piston rod is inserted into the cylinder plate. A form using a fluid pressure cylinder that moves along the thickness direction of the mask plate and the insulating layer is recommended.

The present invention also includes a method for manufacturing a wiring board (Claim 2) in which the thickness of the thick plate portion of the mask plate is 0.2 to 1.5 mm.
According to this, since the thick plate portion having a thickness of 2 to 50 times surrounds the periphery of the thin plate portion with respect to the thickness of 30 to 100 μm of the thin plate portion, the front and back surfaces of the insulating layer Even if the pressure of the conductive paste is applied to the entire thin plate portion including a plurality of through holes, reinforcement by the thick plate portion can prevent inadvertent elastic deformation such as bending and bending and permanent deformation. It is also possible to extend the service life.
Note that the thin plate portion may have a configuration in which two or more locations are provided side by side in a single mask plate. In such a configuration, a thick plate portion is provided around each thin plate portion.

Further, according to the present invention, the mask plate includes a thin plate portion having a rectangular shape in plan view, and a thick plate portion surrounding the thin plate portion and having a rectangular frame shape in plan view, and one side (L) of the thin plate portion. The ratio (L / W) of the width (W) of the thick plate portion is in the range of 10% to 500% (including claim 3).
According to this, since one side of the thin plate portion is 0.1 to 5 times the width of the thick plate portion, the entire mask plate having a rectangular plan view and having one or a plurality of through holes is, for example, It is possible to prevent excessive bending of the mask plate due to pressure and stress during press-fitting of the conductive paste, and deformation or breakage of the thin plate.
In addition, when one side (L) of the thin plate portion is 5 times (500%) the width (W) of the thick plate portion and the single thin plate portion is single, the periphery (four sides) of the thin plate portion having a square shape in plan view is A thick plate portion having a width (W) of 1/5 of one side (L) of the thin plate portion is enclosed.

The present invention also includes a method for manufacturing a wiring board (Claim 4) in which a taper surface is located between the thin plate portion and the thick plate portion in the mask plate.
According to this, a taper surface corresponding to the difference in thickness between the thin plate portion and the thick plate portion surrounding the thin plate portion and surrounding the thin plate portion is located. Therefore, deformation and breakage due to stress concentration can be reliably prevented between the thin plate portion and the thick plate portion, and the life can be extended by pulling. In addition, in the step of press-fitting and filling the conductive paste, the flow of the conductive paste can be promoted.

Further, according to the present invention, the step of press-fitting and filling the conductive paste is centered on the insulating layer in which the mask plate is attached to at least one of the front surface and the back surface, and outside the mask plate. The conductive paste is disposed on the insulating layer, pressed from at least one of the front surface and the back surface along the thickness direction of the insulating layer, and the conductive paste is passed through the through hole of the mask plate. A method for manufacturing a wiring board (Claim 5), which is performed by press-fitting into the hole, is also included.
According to this, for example, a layered conductive paste is inserted into the cylinder chamber, and the push plate located on the opposite side of the mask plate and pushed by the piston rod of the fluid pressure cylinder is connected to the mask plate and the insulating plate. By moving along the thickness direction of the layer, the conductive paste can be equally filled with a uniform thickness into the plurality of holes in the insulating layer. Moreover, it is possible to reliably prevent the occurrence of unfilled portions in each hole.
Therefore, even for a hole with a large aspect ratio in the insulating layer, the conductive paste is entirely filled, and by laminating a plurality of obtained insulating layers, via conductors penetrating each insulating layer, It is possible to provide a wiring board that can easily conduct between the front and back surfaces of the board body.

In addition, in the present invention, the step of press-fitting and filling the conductive paste is centered on the insulating layer in which the mask plate is attached to at least one of the front surface and the back surface, and more than the mask plate. The conductive paste is disposed on the outside, and a squeegee disposed on the surface of the mask plate on the side where the conductive paste is disposed is moved along the surface, thereby passing the through hole of the mask plate. In addition, a method for manufacturing a wiring board (Claim 6), which is performed by press-fitting the conductive paste into the hole of the insulating layer, is also included.
According to this, the conductive paste made into a lump shape in advance is pressed by a squeegee that moves along the surface of the mask plate, and the hole is formed in the hole of the insulating layer through the through hole of the mask plate. The conductive paste can be sequentially press-fitted and filled, and the occurrence of unfilled portions of the conductive paste in each hole can be prevented.

Sectional drawing which shows the insulating material to which this invention is applied. Sectional drawing which shows the state which penetrated the several hole in the said insulating material. Sectional drawing which shows the step which attached the mask board to the back surface of the said insulating material. The perspective view which shows the said mask board. Sectional drawing which shows the state just before press-fitting an electrically conductive paste in the hole of the said insulating material. Sectional drawing which shows the state which press-fits the electrically conductive paste in the hole of the said insulating material. Sectional drawing which shows the state immediately after pressing the electrically conductive paste in the hole of the said insulating material. Sectional drawing which shows the some insulating layer with which the electroconductive paste was filled into the some hole. Sectional drawing which shows the board | substrate body obtained by laminating | stacking and crimping | bonding the said some insulating layer. Sectional drawing which shows the mask board of a different form. Sectional drawing which shows the step which attached the said mask board to the back surface of the insulating layer. Sectional drawing which shows the state just before press-fitting an electrically conductive paste in the hole of the said insulating layer. Sectional drawing which shows the filling step of the electrically conductive paste of a different form. Furthermore, sectional drawing which shows the mask board of a different form. Sectional drawing which shows the step which adhered the said mask board to the surface of the insulating layer. Sectional drawing which shows the state which press-fit the electrically conductive paste in the hole of the said insulating layer. Sectional drawing which shows the step which attached another mask board to the surface and back surface of an insulating layer. Sectional drawing which shows the filling step which press-fits an electrically conductive paste in the hole of the said insulating layer.

Hereinafter, modes for carrying out the present invention will be described.
FIG. 1 is a sectional view showing an insulating layer 1 to which the present invention is applied.
The insulating layer 1 is made of, for example, a ceramic green sheet containing alumina, for example, a glass-ceramic green sheet containing glass-alumina, or an epoxy resin sheet, and has a front surface 2 and a back surface 3.
As shown in FIG. 2, a plurality of holes 4 penetrating between the front surface 2 and the back surface 3 of the insulating layer 1 were previously formed by punching with a small diameter punch (not shown). In the hole 4, the aspect ratio (h / d) of the axial length (the thickness of the insulating layer 1) h with respect to the inner diameter d was 5 times or more.

Next, a mask plate 5 shown in the sectional view of FIG. 3 and the perspective view of FIG. 4 was prepared. The mask plate 5 is made of a stainless steel thin plate, and as shown in FIGS. 3 and 4, a thin plate portion 8 that is rectangular (rectangular or square) in plan view and a thick plate portion 6 that surrounds the thin plate portion 8. , 7. The thick plate portions 6 and 7 include a pair of short sides 6 and a pair of long sides 7. In the thin plate portion 8, a plurality of through holes 9 are formed in a lattice shape aligned vertically and horizontally. Between the thick plate portions 6 and 7 and the thin plate portion 8, a stepped portion 10 is located along the thickness direction.
Incidentally, the thickness t of the thin plate portion 8 is 30 to 100 μm, the thickness T of the thick plate portions 6 and 7 is 0.2 to 1.5 mm, and the inner diameter D of the through hole 9 is equal to the inner diameter d of the hole 4. 2 to 3 times. The ratio (L / W) between the length L of one side of the thin plate portion 8 and the width W of the thick plate portions 6 and 7 is in the range of 10 to 500%.
The mask plate 5 as described above is a stainless steel plate having a rectangular plan view, and after etching the central portion of the steel plate to form a thin plate portion 8, the thin plate portion 8 is subjected to partial etching, electric discharge machining, Alternatively, it was manufactured by punching.
The mask plate may be made of a hard resin such as PE or PET, and the thick plate portions 6 and 7, the thin plate portion 8, the through-hole 9, and the step portion 10 may be integrally injection-molded.

Hereinafter, the process of filling the conductive paste of the present invention will be described.
First, as shown in FIG. 3, a step of attaching the mask plate 5 to the back surface 3 of the insulating layer 1 was performed. At this time, each hole 4 of the insulating layer 1 and each through hole 9 of the mask plate 5 communicated with each other, and the hole 4 was located inside the through hole 9.
Next, as shown in FIG. 5, the upper end surface of the rectangular tube 12 having a rectangular shape in plan view is placed on the outer side of the mask plate 5 that is attached to the back surface 3 of the insulating layer 1. 7), and the bottom plate 13 on which the layered conductive paste P was placed on the entire surface was inserted inside the rectangular cylinder 12. Connected to the center of the bottom plate 13 is a piston of a hydraulic cylinder (not shown) and the other end (upper end) of a piston rod 14 connected to one end. A space 15 surrounded by the rectangular cylinder 12 and the bottom plate 13 and in which the conductive paste P is disposed is a cylinder chamber whose length in the vertical direction in FIG.

The conductive paste P is a mixed material having a slight fluidity in which W, Mo, Ag, or Cu powder, a resin binder, an organic solvent, and the like are mixed in required amounts.
When the bottom plate 13 is lifted together with the piston rod 14 as shown by the thick arrow in FIG. 6, the conductive paste P that has received the vertical thickness is the mask plate as shown by the thin arrow in FIG. 5 is pressed into the hole 4 of the insulating layer 1 communicating with the through-hole 10 through the plurality of through-holes 10 and rises as a substantially cylindrical conductive paste p.
As shown in FIG. 7, when the conductive paste p press-fitted into the upper ends of the plurality of holes 4 in the insulating layer reaches, the rising of the piston rod 14 and the bottom plate 13 is stopped. In the step of press-fitting the conductive pastes P and p into the holes 4 during this period, the conductive pastes P and p are filled in the entire holes 4 of the insulating layer 1 with a uniform pressure and are almost uniform. Each hole 4 was simultaneously filled in a small amount. At this time, no unfilled portion of the conductive paste p was produced in any of the holes 4.
In the filling process of the conductive paste p as described above, the rectangular tube body 12 and the like containing the conductive paste P are fixed in position, and the insulating layer 1 having the mask plate 5 is surrounded by the rectangular tube body 12. This can also be done by pushing downward into the space 15 formed.

As shown in FIG. 7, after stopping the piston rod 14 and the bottom plate 13 from rising, the bottom plate 13 is lowered together with the piston rod 14, and the conductive paste P on the bottom plate 13 and a plurality of the insulating layers 1 are separated. The conductive paste p filled in the holes 4 was separated.
Further, the plurality of insulating layers (1a to 1c) including the insulating layer 1 and subjected to the same filling process as described above were lifted in the vertical direction, and the mask plate 5 was removed from the back surface 3 thereof. As a result, as shown in FIG. 8, the conductive paste p has a substantially cylindrical shape filled in the plurality of holes 4 and is continuous from the back surface 3 side and opened from the through holes 9 of the mask plate 5. Insulating layers 1a to 1c having a plurality of via conductors v that were unfired including the disc-shaped cap C thus obtained were obtained.

And the insulating layers 1a-1c which have the said several via conductor v were laminated | stacked, and it crimped | bonded along the thickness direction. As a result, as shown in FIG. 9, the substrate body 20 having the front surface 2 and the back surface 3 obtained by integrally stacking the insulating layers 1 a to 1 c was obtained. In the substrate body 20, the via conductors v and v adjacent to each other in the thickness direction are connected via the flange c whose cap C is flattened. The via conductor “v” of FIG. By firing the substrate body 20, the wiring substrate that is the subject of the present invention could be manufactured.
In addition, after forming the pad connected to the said via conductor v or the wiring layer of a predetermined pattern in the surface 2 of the said insulating layers 1a-1c, you may perform the said lamination | stacking / crimping | compression-bonding process and a baking process.

FIG. 10 is a cross-sectional view showing a mask plate 5a having a different form.
The mask plate 5a is also made of the same stainless steel or hard resin as described above, and as shown in FIG. 10, the same thick plate portion 6 (7), the thin plate portion 8 having a plurality of through holes 9, and a gap therebetween. A tapered surface 11 is provided.
The filling process of the conductive paste P using the mask plate 5a will be described. First, as shown in FIG. 11, the holes 4 and the through holes of the insulating layer 1 are formed on the back surface 3 side of the insulating layer 1 as described above. The mask plate 5a was attached so that the holes 9 communicated individually.

  Next, as shown in FIG. 12, on the outer side of the mask plate 5 attached to the back surface 3 of the insulating layer 1, the upper end surface of the same rectangular tube 12 is placed on the thick plate portion 6 (7) of the mask plate 5a. The bottom plate 13 with the layered conductive paste P placed on the entire surface was inserted inside the rectangular tube 12. At this time, since the taper surface 11 of the mask plate 5a obliquely hits the vicinity of the upper corner of the layered conductive paste P, in the step of filling the conductive paste P into each hole 4 of the leading edge layer 1 in the above step. , It has the effect of not hindering its fluidity. Moreover, even when the pressure of the conductive paste P is received, the taper surface 11 can reduce or suppress stress concentration in the vicinity of the thick plate portion 6 (7) of the mask plate 5a. Therefore, deformation of the thin plate portion 8 and the like can be prevented, which can contribute to increasing the life of the mask plate 5a itself.

FIG. 13 is a vertical cross-sectional view showing the press-fitting / filling step of the conductive paste P according to different forms.
As shown in FIG. 13, a step of attaching a mask plate 5a with the tapered surface 11 facing outward (upward) on the surface 2 side of the insulating layer 1 in which a plurality of holes 4 are formed is performed. The opening on the upper end side of each hole 4 was exposed inside each through hole 10.
Next, the conductive paste P extending in the shape of a rod in the front-rear direction shown in the figure is disposed near the boundary between the mask plate 5a and the thin plate portion 8 with the left tapered surface 11 in FIG. The squeegee 16 inclined in advance to the right side was moved along the outer surface of the portion 8 while sliding, and the conductive paste P was pressed almost downward on the right side surface of the squeegee 16.

As a result, as shown on the left side in FIG. 13, a substantially cylindrical conductive paste p is press-fitted into each hole 4 of the insulating layer 1 and is filled in the through hole 9 of the mask plate 5a. A cap C similar to the above was formed to be continuous with the paste p. The conductive paste p including the cap C was sequentially press-fitted into the holes 4 and the through holes 9 after the squeegee 16 passed. In addition, no unfilled portion of the conductive paste p was produced in any of the holes 4.
According to the filling process of the conductive paste P using the squeegee 16 as described above, the conductive paste p can be press-fitted and filled into the hole 4 of the insulating layer 1 with a simple jig, and the conductive paste P can be efficiently used. It can be used well.
The squeegee 16 may be applied to the set of the mask plate 5 and the insulating layer 1 in which the plurality of holes 4 are formed.

FIG. 14 is a cross-sectional view showing a further different form of the mask plate 5b.
As shown in FIG. 14, the mask plate 5 b is located at the peripheral thick plate portion 6 (7), the same thin plate portion 8 located inside thereof, and the central portion of the thin plate portion 8. The thin plate portion 8 b is thinner than the thin portion 6 (7) and thicker than the thin plate portion 8, and a plurality of through holes 9 are formed in the thin plate portion 8 b in the same manner as the thin plate portion 8.
When the mask plate 5b is brought into contact with the surface 2 of the uppermost insulating layer 1a of the substrate body 20 as shown in FIG. 15, the holes 4 of the insulating layer 1a are located inside the through holes 9. It was. Next, a filling step of press-fitting the conductive paste P into the holes 4 was performed as described above. As a result, as shown in FIG. 16, unfired via conductors v made of the filled conductive paste p are formed without gaps in each hole 4 of the insulating layer 1a, and the insulating layer is formed at the upper end thereof. Two types of pads 18 and 19 having different heights protruding from the surface 2 of 1a were formed.
The tapered surface 11 may also be applied between the thick plate portion 6 (7) and the thin plate portion 8 and between the thin plate portions 8 and 8b in the mask plate 5b.

The present invention is not limited to the embodiments described above.
For example, the insulating layer 1 and the mask plates 5 and 5a may be in the form of a square or the same rectangle in plan view.
The plurality of holes in the same insulating layer may have different inner diameters or different intervals (pitch).
Furthermore, the hole in the insulating layer may be a bottomed hole having a dead end in the middle in the thickness direction of the insulating layer.
In addition, as shown in FIG. 17, the process of filling the conductive paste P using the squeegee 16 and the mask plate 5 together is different in the plan view of the front surface 2 and the back surface 3 of the insulating layer 1 having a large area. After the mask plate 5 is attached, as shown in FIG. 18, after the conductive paste P is press-fitted and filled from the front surface 2 side, the conductive paste P is also press-fitted and filled from the back side 3 on the upper side. Alternatively, the different holes 1 may be sequentially performed.

  The present invention can reliably fill a conductive paste into a hole having a relatively small inner diameter or a plurality of holes having a small pitch with an adjacent hole, and the front and back surfaces of the substrate body via via conductors made of the paste. It is possible to provide a wiring board that can be reliably connected to each other.

1, 1a to 1c ... Insulating layer 2 ... Front side 3 ... ... Back side 4 ... ... ... ... Hole 5, 5a, 5b ... Mask plate 6, 7 ......... ... Thick plate part 8,8b ………… Thin plate part 9 ………………… Through hole 11 ……………… Tapered surface 16 ……………… Squeegee 20 ……………… Substrate body ( Wiring board)
h ............... Axial length d, D ......... Inner diameter t, T ......... Thickness L ............... One side length W …… …………… Width of thick plate

Claims (6)

A method of manufacturing a wiring board including a substrate body provided with an insulating layer having a front surface and a back surface, and via conductors that pass through the insulating layer and are conducted between the front surface and the back surface of the substrate body,
A filling step of filling a conductive paste into a plurality of holes formed along the thickness direction of the insulating layer and having an axial length of 5 times or more with respect to the inner diameter;
The conductive paste filling step has through-holes formed in the same number as the holes corresponding to the formation positions of the holes on the front surface or the back surface of the insulating layer and has a thickness of 30 to 100 μm. Attaching a mask plate comprising a thin plate portion and a thick plate portion surrounding the thin plate portion; and
A step of press-fitting and filling a conductive paste into the holes communicating with the through-holes through the plurality of through-holes in the mask plate,
A method for manufacturing a wiring board. The thickness of the thick plate portion of the mask plate is 0.2 to 1.5 mm.
The method for manufacturing a wiring board according to claim 1. The mask plate is composed of a thin plate portion that is rectangular * in plan view and a thick plate portion that surrounds the periphery of the thin plate portion and has a rectangular frame shape in plan view, and one side (L) of the thin plate portion and the width of the thick plate portion The ratio (L / W) to (W) is in the range of 10% to 500%.
The method for manufacturing a wiring board according to claim 1, wherein: In the mask plate, a tapered surface is located between the thin plate portion and the thick plate portion,
The method for manufacturing a wiring board according to any one of claims 1 to 3, wherein The step of press-fitting the conductive paste includes disposing the conductive paste around the insulating layer having the mask plate attached to at least one of the front surface and the back surface, and outside the mask plate. And
Pressurizing from at least one of the front and back surfaces along the thickness direction of the insulating layer, and press-fitting the conductive paste into the holes of the insulating layer through the through holes of the mask plate Done,
The method for manufacturing a wiring board according to any one of claims 1 to 4, wherein: The step of press-fitting the conductive paste includes disposing the conductive paste around the insulating layer having the mask plate attached to at least one of the front surface and the back surface, and outside the mask plate. And
By moving a squeegee pressed against the surface of the mask plate on the side where the conductive paste is disposed along the surface, the conductive paste is transferred to the insulating layer through the through holes of the mask plate. It is performed by press-fitting into the hole of
The method for manufacturing a wiring board according to any one of claims 1 to 4, wherein:

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