WO2015093229A1 - Procédé d'élimination d'impuretés pour des matériaux de carte de câblage, procédé pour fabriquer un matériau de carte de câblage et matériau de formation de couche d'isolation composite - Google Patents

Procédé d'élimination d'impuretés pour des matériaux de carte de câblage, procédé pour fabriquer un matériau de carte de câblage et matériau de formation de couche d'isolation composite Download PDF

Info

Publication number
WO2015093229A1
WO2015093229A1 PCT/JP2014/080914 JP2014080914W WO2015093229A1 WO 2015093229 A1 WO2015093229 A1 WO 2015093229A1 JP 2014080914 W JP2014080914 W JP 2014080914W WO 2015093229 A1 WO2015093229 A1 WO 2015093229A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
insulating layer
consumable
layer
board material
Prior art date
Application number
PCT/JP2014/080914
Other languages
English (en)
Japanese (ja)
Inventor
廣瀬　賢一
真 和佐本
真一 遠藤
Original Assignee
ウシオ電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ウシオ電機株式会社 filed Critical ウシオ電機株式会社
Priority to US15/106,039 priority Critical patent/US10420221B2/en
Publication of WO2015093229A1 publication Critical patent/WO2015093229A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/418—Refractive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs

Definitions

  • the present invention relates to a desmear treatment method for a wiring board material in which an insulating layer made of a resin containing a filler is laminated on a conductive layer, a method for producing a wiring board material used in this desmear treatment method, and the above desmear
  • the present invention relates to a composite insulating layer forming material used in the processing method or the above manufacturing method.
  • a multilayer wiring board for mounting a semiconductor element such as a semiconductor integrated circuit element
  • a multilayer wiring board in which insulating layers and conductive layers (wiring layers) are alternately stacked is known.
  • a via hole or a through hole extending through one or a plurality of insulating layers in the thickness direction is formed. Yes.
  • via holes, through holes, etc. are obtained by removing a part of the insulating layer by drilling or laser processing the wiring board material in which the insulating layer and the conductive layer are laminated. Through-holes are formed.
  • this desmear treatment conventionally, a wet treatment method in which treatment is performed with an alkaline solution in which potassium permanganate and sodium hydroxide are dissolved, and a dry treatment method in which treatment is performed with ultraviolet rays and ozone or oxygen radicals generated by the ultraviolet rays are known. ing.
  • a desmear treatment method the smear adhered to the inside of the via hole or the through hole is removed, and the surface of the insulating layer is roughened.
  • the desmear treatment when the desmear treatment is performed under the condition that the smear is sufficiently removed, the surface of the insulating layer is excessively roughened.
  • the present invention has been made based on the circumstances as described above, and its purpose is to perform a sufficient desmear treatment on the inside of a hole formed in an insulating layer without requiring a complicated treatment process.
  • An object of the present invention is to provide a desmear treatment method for a wiring board material that can produce an insulating layer having an appropriate surface roughness.
  • Another object of the present invention is to provide a method for producing a wiring board material used in the above desmear treatment method, and a composite insulating layer forming material used in the above desmear treatment method or the above production method. .
  • a desmearing method for a wiring board material according to the present invention is a desmearing method for a wiring board material in which an insulating layer made of a resin containing a filler is laminated on a conductive layer, A hole forming step for forming a hole penetrating the insulating layer in the thickness direction, and a desmear treatment step for treating the wiring board material via the hole forming step with radicals; A consumable resist layer is formed on the insulating layer in the wiring board material provided for the desmear treatment process, and the consumable resist layer is made of a resin consumed in the desmear treatment process.
  • the consumable resist layer is preferably formed on the insulating layer in the wiring board material provided for the hole forming step.
  • the desmear treatment step is preferably performed by irradiating ultraviolet rays having a wavelength of 220 nm or less from above the consumable resist layer toward the bottom of the hole in an atmosphere containing a radical source.
  • the thickness of the consumable resist layer is preferably 0.05 to 5 ⁇ m.
  • the consumable resist layer is made of a resin having the same quality as the resin constituting the insulating layer,
  • the desmear treatment step may be completed in a state where a part of the consumable resist layer remains. Further, the desmear treatment step may be terminated after the entire consumable resist layer has disappeared.
  • the method for producing a wiring board material of the present invention is a method for producing a wiring board material provided for the above desmear treatment method, On the base layer, a composite insulating layer forming material made of a laminate in which the insulating layer is formed via the consumable resist layer is laminated so that the insulating layer is in contact with the conductive layer, and then the base The layer is removed.
  • the composite insulating layer forming material of the present invention comprises a laminate in which the insulating layer is formed on the base layer via the consumable resist layer, and is used in the method for manufacturing a wiring board material described above. To do.
  • the composite insulating layer forming material of the present invention is a laminate in which the insulating layer is formed on the base layer via the consumable resist layer, and a wiring board material used for the desmear treatment method described above is used. It is used for manufacturing.
  • the desmear treatment method of the present invention a complicated treatment process is not required, and sufficient desmear treatment can be performed on the inside of the hole formed in the insulation layer, and the insulation layer has an appropriate surface roughness. Is obtained.
  • FIG. 1 is an explanatory cross-sectional view showing a configuration of a main part in an example of a wiring board material to be processed in the desmear processing method of the present invention.
  • This wiring board material 1 is constituted by a laminate in which an insulating layer 3 made of a resin containing a filler is laminated on a conductive layer 2 made of a metal.
  • the metal constituting the conductive layer 2 copper, nickel, gold, or the like can be used.
  • the thickness of the conductive layer 2 is, for example, 10 to 100 ⁇ m.
  • an epoxy resin, a bismaleimide triazine resin, a polyimide resin, a polyester resin, or the like can be used as the resin constituting the insulating layer 3.
  • a material constituting the filler contained in the insulating layer 3 silica, alumina, mica, silicate, barium sulfate, magnesium hydroxide, titanium oxide, or the like can be used.
  • the average particle diameter of this filler is, for example, 0.1 to 3 ⁇ m.
  • the filler content in the insulating layer 3 is, for example, 20 to 60% by mass.
  • a hole forming step for forming a hole penetrating the insulating layer in the wiring substrate material 1 in the thickness direction, and a desmear for treating the wiring substrate material 1 via the hole forming step with radicals. And processing steps.
  • a consumable resist layer 4 is preferably formed on the insulating layer 3 in the wiring board material 1 used for the hole forming step.
  • the consumable resist layer 4 is made of a resin that can be consumed by contact of radicals in the subsequent desmear process.
  • the resin constituting the consumable resist layer 4 acrylic resin, urethane resin, epoxy resin, phthalic acid resin, vinyl resin, or the like can be used.
  • a thermoplastic resin as the resin constituting the consumable resist layer 4.
  • a resin having the same quality as the resin constituting the insulating layer 3 is used as the resin constituting the consumable resist layer 4. It is preferable.
  • the thickness of the consumable resist layer 4 is preferably 0.05 to 5 ⁇ m. When this thickness is less than 0.05 ⁇ m, all of the consumable resist layer 4 disappears before smear is sufficiently removed. Therefore, the exposed insulating layer 3 is ashed. Thereby, the filler is exposed on the surface of the insulating layer 3. As a result, the surface of the insulating layer 3 is excessively roughened. On the other hand, if this thickness exceeds 5 ⁇ m, the thickness of the consumable resist layer 4 with respect to the holes to be formed becomes large, that is, the aspect ratio becomes large, so that the problem that the speed of desmear processing itself becomes slow occurs. To do.
  • the thickness of the consumable resist layer 4 may be 1 to 5 times the thickness of the smear. Since the smear thickness is generally about 0.05 to 1 ⁇ m, the thickness of the consumable resist layer 4 is preferably 0.05 to 5 ⁇ m.
  • the actual thickness of the consumable resist layer 4 may be set in consideration of the time until the smear at the bottom of the hole is sufficiently removed by the desmear process and the speed at which the consumable resist layer 4 is ashed.
  • the wiring board material 1 on which such a consumable resist layer 4 is formed can be manufactured as follows. First, as shown in FIG. 3, a composite insulating layer forming material 6 made of a laminate in which the insulating layer 3 is formed on the base layer 5 via the consumable resist layer 4 is manufactured. Next, as shown in FIG. 4, the composite insulating layer forming material 6 is laminated and bonded so that the insulating layer 3 is in contact with the conductive layer 2 formed on the surface of an insulating substrate (not shown), for example. Thereafter, the base layer 5 is removed from the consumable resist layer 4. Thereby, the wiring board material 1 on which the consumable resist layer 4 is formed is obtained.
  • a PET film As a material constituting the base layer 5, a PET film, a polyethylene film, a polypropylene film, a polycarbonate film, or the like can be used.
  • the thickness of the base layer 5 is, for example, 10 to 200 ⁇ m.
  • the composite insulating layer forming material 6 can be manufactured, for example, as follows. First, a consumable resist layer forming coating solution containing a resin material constituting the consumable resist layer 4 in an appropriate solvent, and a resin material and filler constituting the insulating layer 3 in an appropriate solvent. An insulating layer forming coating solution is prepared. Next, the consumable resist layer 4 is formed by applying and drying a consumable resist layer forming coating solution on the surface of the base layer 5 treated with the release material. Then, the insulating layer 3 is formed by applying a coating solution for forming an insulating layer on the surface of the consumable resist layer 4 and drying it. In this way, the composite insulating layer forming material 6 can be manufactured. In the above, a die coater can be used as means for applying the consumable resist layer forming coating solution and the insulating layer forming coating solution.
  • thermocompression bonding As a method for bonding the insulating layer 3 to the conductive layer 2, a method such as thermocompression bonding can be used. Further, the base layer 5 is removed by peeling off the consumable resist layer 4.
  • a hole 4a that penetrates the consumable resist layer 4 in the thickness direction is formed, and a hole that communicates with the hole 4a and penetrates the insulating layer 3 in the thickness direction. 3a is formed.
  • a method by drilling or a method by laser processing can be used.
  • a carbon dioxide laser device, a YAG laser device, or the like can be used.
  • the ratio of the total thickness of the insulating layer 3 and the consumable resist layer 4 to the diameter of the hole 3a in the insulating layer 3 is preferably 2.5 or less, and more preferably 2 or less. When this ratio exceeds 2.5, there arises a problem that the speed of desmear processing itself becomes slow.
  • the inner surface and the bottom surface of the hole 3a formed in the insulating layer 3 are desmeared with radicals.
  • the consumable resist layer 4 is consumed by radicals.
  • a specific processing method in the desmear processing step a method of irradiating ultraviolet rays having a wavelength of 220 nm or less from above the consumable resist layer 4 toward the bottom of the hole 3a of the insulating layer 3 in an atmosphere including a radical source. Can be mentioned.
  • a radical source that generates radicals when irradiated with ultraviolet rays of 220 nm or less is used.
  • the radical source include those that generate oxygen radicals such as oxygen gas and ozone, and those that generate OH radicals such as water vapor.
  • the concentration of the radical source in the atmospheric gas is appropriately selected depending on the type of the radical source. For example, when the radical source is oxygen gas, the concentration of oxygen gas is preferably 50 to 100%.
  • the ultraviolet rays applied to the wiring board material 1 have a wavelength of 220 nm or less, preferably 190 nm or less. When the wavelength of the ultraviolet light exceeds 220 nm, it becomes difficult to remove the smear and the consumable resist layer 4.
  • an ultraviolet light source having a wavelength of 220 nm or less a xenon excimer lamp (peak wavelength: 172 nm), a low-pressure mercury lamp (185 nm emission line), a rare gas fluorescent lamp, or the like can be used.
  • the illuminance of ultraviolet rays applied to the wiring board material 1 is, for example, 10 to 1000 mW / cm 2 .
  • the irradiation time of the ultraviolet rays to the wiring board material 1 is appropriately set in consideration of the illuminance of the ultraviolet rays, the residual state of smears, etc., and is, for example, 1 to 180 minutes.
  • FIG. 6 is an explanatory cross-sectional view showing an outline of the configuration of an example of an excimer lamp used as an ultraviolet light source having a wavelength of 220 nm or less, and (a) a cross-sectional view showing a cross section along the longitudinal direction of the discharge vessel; (B) It is the sectional view on the AA line in (a).
  • This excimer lamp 10 includes a hollow discharge vessel 11 having a rectangular cross section in which both ends are hermetically sealed and a discharge space S is formed therein.
  • As the discharge gas for example, xenon gas or a mixed gas of argon and chlorine is enclosed.
  • the discharge vessel 11 is made of silica glass, for example, synthetic quartz glass, which transmits vacuum ultraviolet rays well, and has a function as a dielectric.
  • a pair of grid electrodes that is, one electrode 15 functioning as a high voltage supply electrode and the other electrode 16 functioning as a ground electrode extend in a long direction.
  • the discharge vessel 11 functioning as a dielectric is interposed between the pair of electrodes 15 and 16.
  • Such an electrode can be formed, for example, by applying an electrode material made of metal to the discharge vessel 11 or by printing or vapor deposition.
  • the ultraviolet reflection film 20 is, for example, an inner surface region corresponding to one electrode 15 functioning as a high voltage supply electrode on the long side surface of the discharge vessel 11 and a part of an inner surface region of a short side surface continuous with this region.
  • the light emitting portion (aperture portion) 18 is formed by the absence of the ultraviolet reflecting film 20 in the inner surface region corresponding to the other electrode 16 that functions as the ground electrode on the long side surface of the discharge vessel 11. Is configured.
  • the film thickness of the ultraviolet reflecting film 20 is preferably 10 to 100 ⁇ m, for example.
  • the ultraviolet reflecting film 20 has a vacuum ultraviolet ray transmittance in which the silica particles and the alumina particles themselves have a high refractive index, a part of the vacuum ultraviolet rays reaching the silica particles or the alumina particles is reflected on the surface of the particles. And the other part is refracted and incident on the inside of the particle, and more of the light incident on the inside of the particle is transmitted (partially absorbed) and refracted when it is emitted again. It has a function of “diffuse reflection” in which such reflection and refraction occur repeatedly. Further, since the ultraviolet reflecting film 20 is composed of silica particles and alumina particles, that is, ceramics, the ultraviolet reflecting film 20 does not generate an impure gas and has a characteristic that can withstand discharge.
  • silica particles constituting the ultraviolet reflective film 20 for example, silica glass made into fine powder particles can be used.
  • Silica particles have a particle diameter defined as follows within a range of 0.01 to 20 ⁇ m, for example, and have a center particle diameter (peak value of number average particle diameter) of, for example, 0.1 to 10 ⁇ m. And more preferably 0.3 to 3 ⁇ m.
  • the ratio of the silica particle which has a center particle diameter is 50% or more.
  • the alumina particles constituting the ultraviolet reflecting film 20 have a particle diameter in the range of 0.1 to 10 ⁇ m, for example, and the center particle diameter (peak value of the number average particle diameter) is, for example, 0.1 to 3 ⁇ m. And more preferably 0.3 to 1 ⁇ m. Moreover, it is preferable that the ratio of the alumina particle which has a center particle diameter is 50% or more.
  • the desmear treatment step may be finished with a part of the consumable resist layer 4 remaining, or may be finished after all of the consumable resist layer 4 has disappeared.
  • the desmear treatment process is terminated with a part of the consumable resist layer 4 remaining, a part of the consumable resist layer 4 with the surface of the wiring board material 1 remaining forms the surface of the insulating layer 3. It becomes the surface layer part. Since the consumable resist layer 4 does not contain a filler, the insulating layer 3 having an appropriate surface roughness can be obtained by ashing by desmear treatment.
  • the desmear process when the desmear process is terminated immediately after all of the consumable resist layer 4 disappears, the ashing of the insulating layer 3 is prevented by the desmear process. That is, since the roughness of the surface of the insulating layer 3 before the desmear treatment is maintained, the insulating layer 3 having an appropriate surface roughness can be obtained. In addition, when the desmear treatment process is continued after all of the consumable resist layer 4 disappears, the exposed insulating layer 3 is ashed. Thereby, since the roughness of the surface of the insulating layer 3 can be adjusted, the insulating layer 3 which has moderate surface roughness is obtained.
  • the desmear treatment method of the present invention all or most of the consumable resist layer 4 is removed by the desmear treatment step, so that it is not necessary to perform the removal treatment of the consumable resist layer 4. It is not necessary to perform a roughening treatment on the insulating layer 3 after the treatment. Therefore, according to the desmear treatment method of the present invention, a complicated treatment process is not required, and sufficient desmear treatment can be performed on the inside of the hole 3a formed in the insulating layer 3, and an appropriate surface roughness is achieved.
  • the insulating layer 3 having
  • the consumable resist layer 4 may be formed on the surface of the insulating layer 3 after performing the hole forming step. Further, in the production of the wiring board material 1 on which the consumable resist layer 4 is formed, it is not essential to use the composite insulating layer forming material 6.
  • the wiring substrate material 1 in which the insulating layer 3 is laminated on the conductive layer 2 is manufactured by an appropriate method, and a consumable resist layer forming coating solution is applied to the surface of the insulating layer 3 of the wiring substrate material 1.
  • the consumable resist layer 4 may be formed by drying. Further, in the desmear treatment step, desmear treatment may be performed by radicals generated by plasma discharge. Further, in order to remove smear caused by the filler from the wiring board material 1, the wiring board material 1 may be subjected to physical vibration processing such as ultrasonic processing after the desmearing process is completed. .
  • the present invention is not limited to these examples.
  • the surface roughness Ra was measured using a “Nanoscale Hybrid Microscope VN-8010” manufactured by Keyence Corporation under the condition that the observation range was 50 ⁇ m ⁇ 38 ⁇ m.
  • Example 1 Production of wiring board material A copper-clad laminate having a thickness of 0.4 mm was prepared by laminating a copper foil on one surface of an insulating substrate. A conductive layer having a required pattern was formed on one surface of the insulating substrate by subjecting the copper foil in the copper-clad laminate to photolithography and etching. An insulating film (“ABF-GX92” manufactured by Ajinomoto Fine Techno Co., Ltd.), in which an insulating layer containing a filler is laminated on a PET film as a carrier layer, is laminated on one surface of an insulating substrate including a conductive layer. Then, the PET film was peeled off.
  • ABSGX92 manufactured by Ajinomoto Fine Techno Co., Ltd.
  • the thickness of the insulating layer in this insulating film is 20 ⁇ m.
  • Lamination was performed using a batch type vacuum pressure laminator under a pressure of 10000 hPa or less, a temperature of 110 ° C., and a pressure of 500 kN / m 2 . And the thermosetting process of the insulating layer was performed for 30 minutes at 170 degreeC. In this way, a wiring board material having an insulating layer made of an epoxy resin containing a conductive layer and a filler was produced.
  • the surface roughness Ra of the insulating layer in this wiring board material was 52 nm.
  • Hole formation process A hole with a diameter of 50 ⁇ m that penetrates the consumable resist layer and the insulating layer is formed by performing laser processing on the wiring board material on which the consumable resist layer is formed, using a carbon dioxide laser device. did.
  • Desmear treatment process The wiring board material which passed through the hole formation process of said (3) was mounted on the stage provided with the heating means. Then, desmear treatment was performed by irradiating the wiring board material with ultraviolet rays through an ultraviolet transmission window while supplying oxygen gas. Specific conditions for the desmear treatment are as follows.
  • Example 2 (1) Manufacture of composite insulating layer forming material 20 parts by mass of liquid bisphenol A type epoxy resin ("jER @ 828EL” manufactured by Mitsubishi Chemical Corporation) and epoxy resin curing agent (“jER manufactured by Mitsubishi Chemical Corporation") @Cure ST12 ”) 12 parts by mass and a diluent (“ Reactive Diluent YDE “manufactured by Mitsubishi Chemical Corporation) were mixed to prepare a consumable resist layer forming coating solution.
  • This consumable resist layer forming coating solution is applied onto a base layer made of a PET film with an alkyd mold release material (AL-5) (Lintech Co., Ltd., thickness: 38 ⁇ m) using a die coater, and the coating solution is formed at 100 ° C. for 5 minutes.
  • the consumable resist layer made of an epoxy resin having a thickness of 1.5 ⁇ m was formed on the base layer by drying under the conditions described above.
  • This insulating layer forming coating solution is applied to the surface of the consumable resist layer with a die coater and dried at 100 ° C. for 5 minutes to form an insulating layer having a thickness of 20 ⁇ m on the consumable resist layer. did. In this way, a composite insulating layer forming material in which a consumable resist layer and an insulating layer were laminated on the base layer was manufactured.
  • a copper-clad laminate in which a copper foil having a thickness of 4 mm was laminated on one surface of an insulating substrate was prepared.
  • a conductive layer having a required pattern was formed on one surface of the insulating substrate by subjecting the copper foil in the copper-clad laminate to photolithography and etching.
  • the composite insulating layer forming material was disposed on one surface of the insulating substrate including the conductive layer so that the insulating layer was in contact with one surface of the insulating substrate.
  • an insulating substrate and a composite insulating layer forming material are laminated with a batch type vacuum pressure laminator at a pressure of 10000 hPa, a temperature of 110 ° C., and a pressure of 500 kN / m 2.
  • the layer was peeled off.
  • the consumable resist layer and the insulating layer were thermally cured at 170 ° C. for 30 minutes.
  • a wiring board material having an insulating layer made of an epoxy resin containing a conductive layer and a filler and having a consumable resist layer formed on the insulating layer was manufactured.
  • Hole formation process A hole with a diameter of 50 ⁇ m that penetrates the consumable resist layer and the insulating layer is formed by performing laser processing on the wiring board material on which the consumable resist layer is formed, using a carbon dioxide laser device. did.
  • Desmear treatment process The wiring board material which passed through the hole formation process of said (3) was mounted on the stage provided with the heating means. Then, desmear treatment was performed by irradiating the wiring board material with ultraviolet rays through an ultraviolet transmission window while supplying oxygen gas (concentration: 100%). Specific conditions for the desmear treatment are as follows.
  • Example 1 A wiring board material was manufactured in the same manner as in Example 1 except that the consumable resist layer was not formed, and a hole forming process, a desmearing process, and a physical vibration process were performed on the wiring board material.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Le but de la présente invention est de fournir : un procédé d'élimination d'impuretés pour des matériaux de carte de câblage, qui est configuré pour réaliser une élimination d'impuretés suffisant de l'intérieur d'un trou traversant qui est formé dans une couche d'isolation sans requérir des étapes compliquées, et qui permet à la couche d'isolation d'avoir une rugosité de surface adéquate ; un procédé pour fabriquer un matériau de carte de câblage qui est soumis à ce procédé d'élimination d'impuretés ; et un matériau de formation de couche d'isolation composite qui est utilisé dans ce procédé de fabrication. Un procédé d'élimination d'impuretés selon la présente invention est un procédé pour l'élimination d'impuretés d'un matériau de carte de câblage qui est obtenu par stratification d'une couche d'isolation, qui est formée d'une résine contenant un agent de remplissage, sur une couche conductrice. Ce procédé d'élimination d'impuretés pour des matériaux de carte de câblage est caractérisé par le fait qu'il comprend : la formation de trou dans laquelle un trou qui pénètre la couche d'isolation dans la direction d'épaisseur est formé ; et une élimination d'impuretés dans laquelle le matériau de carte de câblage après l'étape de formation de trou est traité avec des radicaux. Ce procédé d'élimination d'impuretés pour des matériaux de carte de câblage est également caractérisé par le fait que : le matériau de carte de câblage soumis à l'étape d'élimination d'impuretés comporte une couche d'agent de réserve consommable sur la couche d'isolation ; et la couche d'agent de réserve consommable est formée d'une résine qui est consommée dans l'étape d'élimination d'impuretés.
PCT/JP2014/080914 2013-12-20 2014-11-21 Procédé d'élimination d'impuretés pour des matériaux de carte de câblage, procédé pour fabriquer un matériau de carte de câblage et matériau de formation de couche d'isolation composite WO2015093229A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/106,039 US10420221B2 (en) 2013-12-20 2014-11-21 Wiring board desmear treatment method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-263285 2013-12-20
JP2013263285A JP5874720B2 (ja) 2013-12-20 2013-12-20 配線基板材料のデスミア処理方法、配線基板材料の製造方法および複合絶縁層形成材料

Publications (1)

Publication Number Publication Date
WO2015093229A1 true WO2015093229A1 (fr) 2015-06-25

Family

ID=53402584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/080914 WO2015093229A1 (fr) 2013-12-20 2014-11-21 Procédé d'élimination d'impuretés pour des matériaux de carte de câblage, procédé pour fabriquer un matériau de carte de câblage et matériau de formation de couche d'isolation composite

Country Status (3)

Country Link
US (1) US10420221B2 (fr)
JP (1) JP5874720B2 (fr)
WO (1) WO2015093229A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015108184A1 (ja) * 2014-01-20 2017-03-23 ウシオ電機株式会社 デスミア処理装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5874720B2 (ja) * 2013-12-20 2016-03-02 ウシオ電機株式会社 配線基板材料のデスミア処理方法、配線基板材料の製造方法および複合絶縁層形成材料
JP7512122B2 (ja) 2020-08-06 2024-07-08 新光電気工業株式会社 配線基板の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08180757A (ja) * 1994-12-21 1996-07-12 Nitto Denko Corp 接点部の形成方法
JP2002009435A (ja) * 2000-06-20 2002-01-11 Sumitomo Heavy Ind Ltd 有機物基板におけるビア処理方法及びビア形成方法
JP2002036255A (ja) * 2000-07-26 2002-02-05 Matsushita Electric Works Ltd プラズマ処理方法及びプラズマ処理装置
JP2005050999A (ja) * 2003-07-28 2005-02-24 Toyota Motor Corp 配線基板および配線の形成方法
WO2010150310A1 (fr) * 2009-06-24 2010-12-29 富士通株式会社 Procédé de production d'un tableau de connexions
JP2013038141A (ja) * 2011-08-04 2013-02-21 Hitachi Chem Co Ltd 配線板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3606738B2 (ja) * 1998-06-05 2005-01-05 東京応化工業株式会社 アッシング後の処理液およびこれを用いた処理方法
US5985040A (en) * 1998-09-21 1999-11-16 Electrochemicals Inc. Permanganate desmear process for printed wiring boards
JP2007073834A (ja) * 2005-09-08 2007-03-22 Shinko Electric Ind Co Ltd 絶縁樹脂層上の配線形成方法
WO2009054456A1 (fr) * 2007-10-23 2009-04-30 Ube Industries, Ltd. Procédé de fabrication de carte de câblage imprimé
JP5322531B2 (ja) 2008-05-27 2013-10-23 新光電気工業株式会社 配線基板の製造方法
JP5282487B2 (ja) * 2008-08-28 2013-09-04 住友ベークライト株式会社 多層プリント配線板の製造方法、多層プリント配線板および半導体装置
CN103140537B (zh) * 2010-08-10 2016-10-12 日立化成株式会社 树脂组合物、树脂固化物、配线板及配线板的制造方法
JP5874720B2 (ja) * 2013-12-20 2016-03-02 ウシオ電機株式会社 配線基板材料のデスミア処理方法、配線基板材料の製造方法および複合絶縁層形成材料

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08180757A (ja) * 1994-12-21 1996-07-12 Nitto Denko Corp 接点部の形成方法
JP2002009435A (ja) * 2000-06-20 2002-01-11 Sumitomo Heavy Ind Ltd 有機物基板におけるビア処理方法及びビア形成方法
JP2002036255A (ja) * 2000-07-26 2002-02-05 Matsushita Electric Works Ltd プラズマ処理方法及びプラズマ処理装置
JP2005050999A (ja) * 2003-07-28 2005-02-24 Toyota Motor Corp 配線基板および配線の形成方法
WO2010150310A1 (fr) * 2009-06-24 2010-12-29 富士通株式会社 Procédé de production d'un tableau de connexions
JP2013038141A (ja) * 2011-08-04 2013-02-21 Hitachi Chem Co Ltd 配線板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015108184A1 (ja) * 2014-01-20 2017-03-23 ウシオ電機株式会社 デスミア処理装置

Also Published As

Publication number Publication date
JP2015119126A (ja) 2015-06-25
US20160324007A1 (en) 2016-11-03
JP5874720B2 (ja) 2016-03-02
US10420221B2 (en) 2019-09-17

Similar Documents

Publication Publication Date Title
WO2015025777A1 (fr) Procédé de débarbouillage et appareil de débarbouillage
WO2014104154A1 (fr) Procédé de nettoyage de bavures et dispositif de nettoyage de bavures
JP4212006B2 (ja) 多層プリント配線板の製造方法
JP6160656B2 (ja) 配線基板の製造方法、配線基板及び配線基板製造装置
JP5874720B2 (ja) 配線基板材料のデスミア処理方法、配線基板材料の製造方法および複合絶縁層形成材料
JP5282487B2 (ja) 多層プリント配線板の製造方法、多層プリント配線板および半導体装置
JP5967147B2 (ja) デスミア処理装置
WO2017150435A1 (fr) Procédé de fabrication de tableau de connexions et tableau de connexions
JP2015090948A (ja) 配線基板材料の製造方法および配線基板材料の製造装置
TWI651025B (zh) 配線基板的製造方法及配線基板製造裝置
JP5660118B2 (ja) デスミア処理方法
JP5660117B2 (ja) デスミア処理方法
JP2001015928A (ja) 多層プリント配線板およびその製造方法
JP2017092498A (ja) 配線基板の製造方法、配線基板及び配線基板製造装置
JP6422837B2 (ja) 配線基板の製造方法、配線基板及び配線基板製造装置
JP4341281B2 (ja) プリント配線基板用の積層板の製造方法
JPH06112649A (ja) 多層プリント板の層間接続の製造方法
JP6531556B2 (ja) 配線基板の製造方法、および配線基板
JP2001144432A (ja) 絶縁層上の導体層の製造方法およびビルドアップ回路基板の製造方法
JP2005072483A (ja) プリント配線基板の製造方法
JP2017157634A (ja) 配線基板の製造方法および配線基板
JP2000294928A (ja) ビアホール形成方法
JP2001177252A (ja) 多層配線板の製造法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14872696

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 15106039

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14872696

Country of ref document: EP

Kind code of ref document: A1