WO2015085597A1 - 壳体散热结构及电子装置 - Google Patents

壳体散热结构及电子装置 Download PDF

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Publication number
WO2015085597A1
WO2015085597A1 PCT/CN2013/089439 CN2013089439W WO2015085597A1 WO 2015085597 A1 WO2015085597 A1 WO 2015085597A1 CN 2013089439 W CN2013089439 W CN 2013089439W WO 2015085597 A1 WO2015085597 A1 WO 2015085597A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
housing
diaphragm
dissipation structure
heat dissipating
Prior art date
Application number
PCT/CN2013/089439
Other languages
English (en)
French (fr)
Inventor
谢晋市
Original Assignee
华为终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为终端有限公司 filed Critical 华为终端有限公司
Priority to PCT/CN2013/089439 priority Critical patent/WO2015085597A1/zh
Priority to CN201380074897.6A priority patent/CN105075412B/zh
Publication of WO2015085597A1 publication Critical patent/WO2015085597A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff

Definitions

  • the present invention relates to the field of heat dissipation technologies, and in particular, to a heat dissipation structure and an electronic device of a housing. Background technique
  • the heat dissipation structure of the existing electronic device housing is improved by disposing a graphite sheet on the inner surface of the housing.
  • a graphite sheet is attached to the inner surface of the battery cover for heat dissipation.
  • the graphite sheet on the inner surface of the casing affects the quality of the secondary appearance surface. Especially when the graphite sheet has scratches, the quality of the secondary appearance surface deteriorates, and when the user opens the battery cover, the finger touches the graphite sheet to form a scratch. This leads to a reduction in the life of the graphite sheet and a reduction in heat dissipation efficiency, which affects the user experience. Summary of the invention
  • the embodiment of the invention provides a heat dissipation structure and an electronic device of the housing, and the heat dissipation component is embedded in the interior of the housing, so that the user does not have the opportunity to see and contact the heat dissipation component, so that the life of the heat dissipation component is improved, and the user experience is improved. At the same time, no heat dissipation is lost.
  • the present invention provides a heat dissipation structure for a housing, including a diaphragm, a heat dissipating component, and a housing body, the diaphragm including a first surface and a second surface, the first surface being an outer surface of the electronic device,
  • the heat dissipating component and the shell body are coupled to the second surface, and the heat dissipating component is embedded between the shell body and the diaphragm.
  • the heat dissipating component is injection molded between the shell body and the diaphragm by an in-mold decoration technique.
  • the heat dissipating component is a graphite sheet.
  • the heat dissipating component is attached to the second surface of the diaphragm by means of an adhesive.
  • the present invention also provides an electronic device including the housing heat dissipation structure.
  • the heat dissipation structure of the electronic device and the housing provided by the present invention embeds the heat dissipating component in the interior of the housing, so that the user does not have the opportunity to see and contact the heat dissipating component, so that the life of the heat dissipating component is improved. No loss of heat dissipation.
  • FIG. 1 is a schematic view of a heat dissipation structure of a housing according to an embodiment of the present invention. detailed description
  • the present invention provides a housing heat dissipation structure 100 and an electronic device (not shown) that is applied to the housing of the electronic device. Specifically, the case heat dissipation structure 100 is applied to a battery cover of the electronic device.
  • the housing heat dissipation structure 100 includes a diaphragm 10 , a heat dissipating component 20 and a housing body 30 , the diaphragm 10 including a first surface 11 and a second surface 13 , the first surface 11 being external to the electronic device
  • the heat dissipating component 20 and the shell body 30 are coupled to the second surface 13 , and the heat dissipating component 20 is embedded between the shell body 30 and the diaphragm 10 .
  • the heat dissipation structure of the electronic device and the housing provided by the invention embeds the heat dissipation component 20 in the interior of the housing, so that the user does not have the opportunity to see and contact the heat dissipation component 20, so that the life of the heat dissipation component is improved, and the user experience is improved, and there is no Loss of heat dissipation.
  • the heat dissipating member 20 is injection molded between the shell main body 30 and the diaphragm 10 by an in-mold decoration technology (IML) process.
  • IML in-mold decoration technology
  • the diaphragm 10 is first fixed on the mold, so that the second surface 13 of the mold is exposed, the heat dissipating member 20 is pasted on the second surface 13 of the diaphragm 10, and then an injection molding process is performed, and injection molding is performed. Thereafter, the heat dissipating member 20 is embedded between the case main body 30 and the second surface 13 of the diaphragm 10.
  • the heat dissipating member 20 is integrally molded with the case main body 30 by a technique of injection molding, and an assembly process is not required.
  • the thickness of the diaphragm 10 is 0.15 mm
  • the material of the diaphragm 10 is polycarbonate (PC)
  • the material of the shell body 30 is polycarbonate and propylene butadiene benzene.
  • the heat dissipating member 20 is a graphite sheet, and the graphite sheet is embedded between the shell main body 30 and the diaphragm 10, and the graphite sheet is protected by the shell main body 30 and the diaphragm 10 in an all-round manner, thereby ensuring the stability of heat dissipation efficiency of the graphite sheet.
  • the heat dissipating component 20 is attached to the second surface 13 of the diaphragm 10 by means of an adhesive. First, the heat dissipating component 20 is fixed to the second surface 13. During the injection molding process, the position of the heat dissipating component 20 remains unchanged, and the yield is improved.
  • a housing heat dissipation structure 100 and an electronic device provided by the embodiments of the present invention are described in detail.
  • the principles and embodiments of the present invention are described in the following. The description of the above embodiments is only for helping. The method of the present invention and its core idea are understood; at the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific embodiments and application scopes. It should be understood that the invention is limited.

Abstract

　一种壳体散热结构，包括膜片、散热元件及壳主体，所述膜片包括第一表面和第二表面，所述第一表面为电子装置之外表面，所述散热元件及所述壳主体连接于所述第二表面，且所述散热元件内嵌于所述壳主体与所述膜片之间。本发明还提供一种电子装置。本发明提供的壳体散热结构及电子装置将散热元件内嵌于壳体的内部，使得散热元件寿命得到提升，使用户没有机会看到和接触散热元件，最终提升用户体验，同时没有丧失散热作用。

Description

壳体散热结构及电子装置
技术领域
本发明涉及散热技术领域， 尤其涉及一种壳体的散热结构及电子装置。 背景技术
随着便携式电子装置轻薄型化的发展， 电子装置的散热空间日益缩减，散 热效率降低。现有电子装置壳体的散热结构是通过在壳体内表面贴石墨片来提 高散热效率， 例如， 在电池盖的内表面贴石墨片达到散热目的。 但是在壳体的 内表面贴石墨片影响二级外观面质量， 尤其当石墨片有划痕时，二级外观面质 量恶化， 而且用户打开电池盖操作时， 手指触碰石墨片形成划痕， 导致石墨片 寿命的降低， 及散热效率降低， 影响用户体验。 发明内容
本发明实施例提供了一种壳体散热结构及电子装置，将散热元件内嵌于壳 体的内部，使用户没有机会看到和接触散热元件，使得散热元件寿命得到提升， 同时提升用户体验， 同时没有丧失散热作用。
一方面本发明提供了一种壳体散热结构， 包括膜片、 散热元件及壳主体， 所述膜片包括第一表面和第二表面， 所述第一表面为电子装置之外表面， 所述 散热元件及所述壳主体连接于所述第二表面，且所述散热元件内嵌于所述壳主 体与所述膜片之间。
其中，通过模内装饰技术工艺将所述散热元件注塑成型于所述壳主体与所 述膜片之间。
其中， 所述散热元件为石墨片。
其中， 所述散热元件通过粘胶的方式贴附于所述膜片的第二表面。
另一方面，本发明还提供一种电子装置， 所述电子装置包括所述壳体散热 结构。
相较于现有技术， 本发明提供的电子装置及壳体的散热结构，将散热元件 内嵌于壳体的内部，使用户没有机会看到和接触散热元件，使得散热元件寿命 得到提升， 同时没有丧失散热作用。 附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施 例中所需要使用的附图作筒单地介绍，显而易见地， 下面描述中的附图仅仅是 本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的 前提下， 还可以根据这些附图获得其他的附图。
图 1为本发明一种实施方式中壳体散热结构的示意图。 具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清 楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是 全部的实施例。基于本发明中的实施例， 本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。
本发明提供了一种壳体散热结构 100及电子装置 （未标示）， 所述壳体散 热结构 100应用于所述电子装置的外壳。 具体而言， 所述壳体散热结构 100 应用于所述电子装置的电池盖。
请参阅图 1 , 壳体散热结构 100包括膜片 10、 散热元件 20及壳主体 30, 所述膜片 10包括第一表面 11和第二表面 13 , 所述第一表面 11为电子装置之 外表面， 所述散热元件 20及所述壳主体 30连接于所述第二表面 13 , 且所述 散热元件 20内嵌于所述壳主体 30与所述膜片 10之间。
本发明提供的电子装置及壳体的散热结构， 将散热元件 20内嵌于壳体的 内部， 使用户没有机会看到和接触散热元件 20, 使得散热元件寿命得到提升， 提升用户体验， 同时没有丧失散热作用。
本实施方式中， 通过模内装饰技术（IML )工艺将所述散热元件 20注塑 成型于所述壳主体 30与所述膜片 10之间。 制造过程中， 先将膜片 10固定在 模具上， 使得模片的第二表面 13外露， 将散热元件 20粘贴在所述膜片 10的 第二表面 13上， 然后进行注塑成型工艺， 注塑成型后， 散热元件 20被镶嵌在 壳主体 30与膜片 10的第二表面 13之间。 通过注塑成型的技术使得散热元件 20与壳主体 30—体成型， 无需组装工序。 本实施方式中， 所述膜片 10的厚 度为 0.15mm, 所述膜片 10的材质为聚碳酸酯（ Polycarbonate, PC ), 所述壳主 体 30 的材质为聚碳酸酯与丙烯 丁二烯 苯二烯 （Acrylonitrile Butadiene Styrene, ABS ) 的共混物， 即 PC+ABS。
所述散热元件 20为石墨片， 将石墨片内嵌在壳主体 30与膜片 10之间， 石墨片受到壳主体 30与膜片 10全方位保护，能够保证石墨片散热效率的稳定 性。
本实施方式中，所述散热元件 20通过粘胶的方式贴附于所述膜片 10的第 二表面 13。 先将散热元件 20固定于第二表面 13, 在注塑成型的过程中， 散热 元件 20位置保持不变， 提高良率。
以上对本发明实施例所提供的一种壳体散热结构 100及电子装置进行了详 细介绍， 本文中应用了具体个例对本发明的原理及实施方式进行了阐述， 以上 实施例的说明只是用于帮助理解本发明的方法及其核心思想； 同时，对于本领 域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有 改变之处， 综上所述， 本说明书内容不应理解为对本发明的限制。

Claims

权 利 要 求
1. 一种壳体散热结构， 包括散热元件， 其特征在于， 所述壳体散热结构 还包括膜片和壳主体， 所述膜片包括第一表面和第二表面， 所述第一表面为电 子装置之外表面， 所述散热元件及所述壳主体连接于所述第二表面，且所述散 热元件内嵌于所述壳主体与所述膜片之间。
2. 如权利要求 1 所述的壳体散热结构， 其特征在于， 通过模内装饰技术 工艺将所述散热元件注塑成型于所述壳主体与所述膜片之间。
3. 如权利要求 1 所述的壳体散热结构， 其特征在于， 所述散热元件为石 墨片。
4. 如权利要求 1 所述的壳体散热结构， 其特征在于， 所述散热元件通过 粘胶的方式贴附于所述膜片的第二表面。
5.一种电子装置，其特征在于，所述电子装置包括如权利要求 1-4任意一 项所述的壳体散热结构。
PCT/CN2013/089439 2013-12-13 2013-12-13 壳体散热结构及电子装置 WO2015085597A1 (zh)

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PCT/CN2013/089439 WO2015085597A1 (zh) 2013-12-13 2013-12-13 壳体散热结构及电子装置
CN201380074897.6A CN105075412B (zh) 2013-12-13 2013-12-13 壳体散热结构及电子装置

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202354003U (zh) * 2011-10-31 2012-07-25 深圳富泰宏精密工业有限公司 便携式电子装置
CN202873205U (zh) * 2012-10-19 2013-04-10 青岛海信移动通信技术股份有限公司 散热式机壳及便携式移动终端
CN203233628U (zh) * 2013-02-25 2013-10-09 华为终端有限公司 一种移动终端
CN203327249U (zh) * 2013-07-20 2013-12-04 徐红波 多功能无线智能路由器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM440625U (en) * 2012-06-07 2012-11-01 Askey Computer Corp Casing of electronic apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202354003U (zh) * 2011-10-31 2012-07-25 深圳富泰宏精密工业有限公司 便携式电子装置
CN202873205U (zh) * 2012-10-19 2013-04-10 青岛海信移动通信技术股份有限公司 散热式机壳及便携式移动终端
CN203233628U (zh) * 2013-02-25 2013-10-09 华为终端有限公司 一种移动终端
CN203327249U (zh) * 2013-07-20 2013-12-04 徐红波 多功能无线智能路由器

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