WO2015072616A1 - Procédé pour fabriquer un emballage de microphone - Google Patents

Procédé pour fabriquer un emballage de microphone Download PDF

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Publication number
WO2015072616A1
WO2015072616A1 PCT/KR2013/011276 KR2013011276W WO2015072616A1 WO 2015072616 A1 WO2015072616 A1 WO 2015072616A1 KR 2013011276 W KR2013011276 W KR 2013011276W WO 2015072616 A1 WO2015072616 A1 WO 2015072616A1
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WO
WIPO (PCT)
Prior art keywords
cover
substrate
repellent coating
forming
water repellent
Prior art date
Application number
PCT/KR2013/011276
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English (en)
Korean (ko)
Inventor
김태원
최지원
오준혁
Original Assignee
(주)파트론
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Application filed by (주)파트론 filed Critical (주)파트론
Publication of WO2015072616A1 publication Critical patent/WO2015072616A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to a microphone package, and more particularly, to a microphone package mounted on an electronic device or the like to convert an acoustic signal into an electrical signal.
  • the microphone package is mounted in various electronic devices such as smartphones and tablet computers. Some recent electronic devices implement waterproof and dustproof functions to be used in various environments. In order for an electronic device to have waterproof and dustproof properties, the devices exposed to the outside must also have waterproof and dustproof properties.
  • the conventional structure is not only insufficient to satisfy the IP57 standard, which is mainly required in recent years in waterproofing properties, but also a complicated process because a process of attaching a nonwoven fabric or a net must be added.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a microphone package having a waterproof and dustproof characteristics that can be produced by a simple process.
  • Another object of the present invention is to provide a method for manufacturing a microphone package, which is easy to input an acoustic signal and has waterproof and dustproof characteristics.
  • Another object of the present invention is to provide a method of manufacturing a microphone package having high durability against air shock.
  • a method of manufacturing a microphone package including: preparing a substrate having a top surface on which a mounting pad is formed and a bottom surface on which an input / output pad is formed, and mounting a transducer on the mounting pad; Forming a water repellent coating layer on an outer surface of at least a portion of the cover including the step of preparing a cover, forming a plurality of micro holes in the cover, combining the substrate and the cover, and surrounding the micro holes. It includes a step.
  • the bonding of the substrate and the cover comprises: applying solder to a portion of the substrate that is in contact with the cover, arranging the cover to be in contact with the substrate, and melting the solder to form the substrate. And combining the cover with the cover.
  • the forming of the water repellent coating layer may include spraying a water repellent coating on the cover and curing the water repellent coating sprayed on the cover.
  • the forming of the water repellent coating layer may be performed after the bonding of the substrate and the cover is performed.
  • the step of forming the water repellent coating layer PTFE (Poly Tetra Fluoro Ethylene), silicon carbide (silicon carbide (SiC)) or silicon resin (silicone resin) selected from one or two or more combinations of materials of water repellent coating layer Can be formed.
  • PTFE Poly Tetra Fluoro Ethylene
  • silicon carbide silicon carbide (SiC)
  • silicon resin silicon resin
  • a method of manufacturing a microphone package comprising: preparing a plurality of covers, forming a plurality of microholes in each of the plurality of covers, and an upper surface on which a mounting pad is formed. And preparing an array substrate having a plurality of substrates having a bottom surface having an input / output pad formed thereon, mounting a transducer on each substrate of the array substrate, and attaching a plurality of covers on which the micro holes are formed to each substrate. Combining, forming a water-repellent coating layer on the outer surface of the plurality of covers, and separating the plurality of substrates, respectively.
  • the forming of the microholes may include arranging the plurality of covers on a carrier and periodically moving the carrier according to a predetermined trajectory, and different angles from a laser diode located above the carrier. And irradiating a plurality of laser beams to be focused on the underside of the cover, wherein the laser diode may be turned on / off according to a period of the trajectory of the carrier.
  • the forming of the micro holes may include preparing a carrier having a support corresponding to the plurality of covers, coupling the plurality of covers to the support with the cover turned upside down, and the cover and the carrier being connected to the support.
  • the laser diode may be on / off according to the period of the trajectory of the carrier.
  • the forming of the water repellent coating layer may include spraying a water repellent coating on the cover and curing the water repellent coating sprayed on the cover.
  • the step of forming the water repellent coating layer may be performed after the step of bonding the cover to the substrate is performed.
  • the step of forming the water repellent coating layer may be performed before the step of separating the substrate.
  • the step of forming the water repellent coating layer PTFE (Poly Tetra Fluoro Ethylene), silicon carbide (silicon carbide (SiC)) or silicon resin (silicone resin) selected from one or two or more combinations of materials of water repellent coating layer Can be formed.
  • PTFE Poly Tetra Fluoro Ethylene
  • silicon carbide silicon carbide (SiC)
  • silicon resin silicon resin
  • the method of manufacturing a microphone package according to the embodiments of the present invention has the effect of having a waterproof and dustproof property but a simple manufacturing process and high durability.
  • the method of manufacturing a microphone package according to the embodiments of the present invention has an effect of easily inputting a sound signal and manufacturing a microphone package having high acoustic characteristics.
  • the method of manufacturing a microphone package according to the embodiments of the present invention has the effect of increasing the durability against air shock.
  • FIG. 1 is a flowchart illustrating a method of manufacturing a microphone package according to a first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view illustrating a substrate preparation step of the method of manufacturing a microphone package according to the first embodiment.
  • FIG 3 is a cross-sectional view illustrating a transducer mounting step of the method of manufacturing a microphone package according to the first embodiment.
  • FIG. 4 is a cross-sectional view illustrating a cover preparation step of the method for manufacturing a microphone package according to the first embodiment.
  • FIG. 5 is a cross-sectional view illustrating a step of forming a microhole in a method of manufacturing a microphone package according to a first embodiment.
  • FIG. 6 is an enlarged view of the microhole of FIG. 5.
  • FIG. 7 is a cross-sectional view illustrating a cover coupling step of the method of manufacturing a microphone package according to the first embodiment.
  • FIG. 8 is a cross-sectional view illustrating a step of forming a water repellent coating of the method of manufacturing a microphone package according to the first embodiment.
  • FIG. 9 is an enlarged view of the microhole and the water repellent coating layer of FIG. 8.
  • FIG. 10 is a flowchart illustrating a method of manufacturing a microphone package according to a second embodiment of the present invention.
  • FIG. 11 is a cross-sectional view illustrating a cover preparation step of the method for manufacturing a microphone package according to the second embodiment.
  • FIG. 12 is a cross-sectional view illustrating a step of forming a microhole in a method of manufacturing a microphone package according to a second embodiment.
  • FIG. 13 is a cross-sectional view illustrating a step of preparing an array substrate of a method of manufacturing a microphone package according to a second embodiment.
  • FIG. 14 is a cross-sectional view illustrating a transducer mounting step of a method of manufacturing a microphone package according to a second embodiment.
  • 15 is a cross-sectional view illustrating a cover coupling step of a method of manufacturing a microphone package according to a second embodiment.
  • 16 is a cross-sectional view illustrating a water repellent coating forming step of the method of manufacturing a microphone package according to the second embodiment.
  • 17 is a cross-sectional view illustrating a substrate separation step of the method of manufacturing a microphone package according to the second embodiment.
  • FIG. 18 is a cross-sectional view illustrating a process of forming a microhole in a method of manufacturing a microphone package according to a third embodiment.
  • the present invention relates to a method of manufacturing a microphone package.
  • FIG. 1 is a flowchart illustrating a method of manufacturing a microphone package according to a first embodiment of the present invention.
  • 2 is a cross-sectional view illustrating a substrate preparation step of the method of manufacturing a microphone package according to the first embodiment.
  • 3 is a cross-sectional view illustrating a transducer mounting step of the method of manufacturing a microphone package according to the first embodiment.
  • 4 is a cross-sectional view illustrating a cover preparation step of the method for manufacturing a microphone package according to the first embodiment.
  • FIG. 5 is a cross-sectional view illustrating a step of forming a microhole in a method of manufacturing a microphone package according to a first embodiment.
  • FIG. FIG. 6 is an enlarged view of the microhole of FIG. 5.
  • FIG. 7 is a cross-sectional view illustrating a cover coupling step of the method of manufacturing a microphone package according to the first embodiment.
  • 8 is a cross-sectional view illustrating a step of forming a water repellent coating of the method of manufacturing a microphone package according to the first embodiment.
  • 9 is an enlarged view of the microhole and the water repellent coating layer of FIG. 8.
  • a method of manufacturing a microphone package includes a substrate preparation step (S110), a transducer mounting step (S120), a cover preparation step (S130), a microhole forming step (S140), a cover bonding step (S150), and a water repellent property. It includes a coating layer forming step (S160).
  • the substrate preparing step (S110) is a step of preparing a substrate 100 having an upper surface on which the mounting pad 110 is formed and a lower surface on which the input / output pad 130 is formed.
  • the substrate 100 may be a printed circuit board (PCB).
  • the substrate 100 may be a rigid PCB or a flexible PCB.
  • the substrate 100 has an upper surface and a lower surface.
  • the mounting pad 110 is formed on the top surface.
  • the mounting pad 110 may be mounted with a transducer 400 or an ASIC.
  • An input / output pad 130 is formed on the bottom surface.
  • the input / output pad 130 may be combined with a substrate of a device on which the microphone package is mounted, and may input / output a signal or receive power.
  • the mounting pad 110 and the input / output pad 130 may be electrically connected to each other through a pattern inside the substrate 100.
  • the substrate 100 may have a coupling part 150.
  • Coupling portion 150 is formed on the outer portion of the substrate 100 is coupled to the flange portion 250 of the cover 200 to be described later.
  • the coupling part 150 may be formed in a conductor pattern exposed to the outside, such as the mounting pad 110, and may be coupled to the flange part 250 of the cover 200 by soldering.
  • the transducer mounting step S120 is a step of mounting the transducer 400 on the mounting pad 110 of the substrate 100.
  • the transducer 400 is an element that receives an acoustic signal and converts it into an electrical signal.
  • the transducer 400 may be an electret transducer or a MEMS transducer, but is not limited thereto.
  • the transducer 400 is mounted on the mounting pad 110 of the substrate 100 and electrically connected thereto.
  • the transducer 400 may be located under the microhole 300 of the cover 200 to be described later.
  • the transducer 400 is accommodated in an internal space formed by the substrate 100 and the cover 200.
  • other devices such as an ASIC may be mounted in the internal space.
  • the cover preparation step (S130) is a step of preparing the cover 200.
  • the cover 200 is combined with the substrate 100 to form an internal space.
  • the cover 200 includes an upper surface portion 210, a side portion 230, and a flange portion 250.
  • the upper surface 210 is spaced apart from the substrate 100 and faces the substrate 100.
  • the side portion 230 extends vertically at the outside of the upper surface portion 210.
  • the flange part 250 is formed to protrude inward or outward from the lower end of the side part 230.
  • the flange part 250 may be coupled to the coupling part 150 of the substrate 100 by soldering.
  • the space between the substrate 100 and the cover 200 may be sealed by the coupling of the flange part 250 and the coupling part 150.
  • the cover 200 may be formed by extrusion molding or injection molding.
  • the cover 200 may be formed of a material of one or a combination of two or more selected from brass, bronze, or phosphor bronze.
  • the fine hole forming step S140 is a step of forming a plurality of fine holes 300 in the cover 200.
  • the micro holes 300 penetrate through the outer surface and the inner surface of the cover 200.
  • the inner surface of the cover 200 is a portion that is in contact with the inner space formed by the substrate 100 and the cover 200, the outer surface means the opposite surface of the inner surface.
  • the micro holes 300 may be formed in the upper surface portion 210 of the cover 200, but may be formed in the side surface portion 230 or in both the upper surface portion 210 and the side surface portion 230.
  • the fine holes 300 are densely formed at predetermined positions of the cover 200.
  • the micro holes 300 may be formed by irradiating the laser beam 350 to the surface of the cover 200.
  • the cover 200 is punctured.
  • the laser perforator for drilling the micro holes 300 may irradiate one laser beam 350 to perforate the cover 200
  • the laser perforator 300 irradiates a plurality of laser beams 350 irradiated at different angles to cover the cover ( 200 may be drilled. Irradiating and puncturing the plurality of laser beams 350 has the advantage of puncturing with a laser beam 350 of less energy than irradiating and puncturing one laser beam 350.
  • a part of the cover 200 may be melted to form a burr around the micro holes 300. The burr is formed around the fine hole 300 may damage the acoustic characteristics of the microphone.
  • the laser beam 350 may be irradiated from above the cover 200.
  • the upper side of the cover 200 means the outer surface side of the cover 200. Even when the laser diode is located under the cover 200 and the cover 200 is turned upside down, the laser beam 350 is irradiated from the outer surface side of the cover 200, so that the laser diode is irradiated from above.
  • the plurality of laser beams 350 irradiated at different angles of the laser beam 350 may be irradiated so as to be focused under the cover 200.
  • the fine hole 300 may be formed in a form in which the top diameter d1 is larger than the bottom diameter d2.
  • the size of the microhole 300 may be adjusted by adjusting the light collecting point 351 where the plurality of laser beams 350 are collected. If the location of the light collecting point 351 is located directly below the cover 200, the micro holes 300 may be made smaller, and if located below the micro holes 300, the micro holes 300 may be formed relatively large. Can be.
  • the fine holes 300 may have a top diameter d1 larger than a bottom diameter d2. That is, the micro holes 300 may be formed in the shape of an inverted truncated cone. In this case, the inner surface of the micro holes 300 may be formed to be inclined. Specifically, it is preferable that the upper diameter d1 is formed to be 40 ⁇ m to 95 ⁇ m and the lower diameter d2 is formed to be 5 ⁇ m to 65 ⁇ m under the condition that the upper diameter d1 is larger than the lower diameter d2. .
  • IP57 grades which are normally required for water and dust resistance, do not allow the passage of particles larger than 60 ⁇ m. Therefore, the portion having the smallest diameter of the micro holes 300 may be formed to have a diameter of 60 ⁇ m or less to prevent the passage of particles of 60 ⁇ m or more. Even in the above-described range, even if the bottom diameter (d2) of 60 ⁇ m to 65 ⁇ m additionally a plating layer or a waterproof coating layer 500 may be formed to have a diameter of 60 ⁇ m or less. Therefore, in conclusion, the bottom diameter d2 may be 5 ⁇ m to 65 ⁇ m to satisfy the IP57 rating.
  • the micro holes 300 may perform a shielding function for air shock to increase durability.
  • Air shock refers to the instantaneous application of air above a certain pressure, so durability against air shock is one of the common methods of measuring the durability of a microphone package.
  • Forming the micro holes 300 directly in the cover 200 is more durable against air shock than attaching a nonwoven fabric or the like inside the conventional cover 200, and the pressure due to the air shock is transmitted to all the interior space There is an advantage that can be prevented.
  • an acoustic signal of a predetermined level or more must be input.
  • the magnitude of the acoustic signal transmitted to the internal space may be determined by the number of the micro holes 300 and the area of the micro holes 300.
  • the number of the fine holes 300 may be limited within a certain range due to a design problem or a problem of controlling characteristics of the microphone.
  • the area of the microhole 300 may also be limited within a certain range because of the above-described dustproof characteristics. In this case, by forming the upper diameter d1 wider than the lower diameter d2, the size of the transmitted acoustic signal can be improved.
  • the top diameter d1 may be formed to be 40 ⁇ m to 95 ⁇ m under conditions larger than the bottom diameter d2.
  • the size of the acoustic signal transmitted can be improved rather than the fine hole 300 is formed such that the lower diameter d2 and the upper diameter d1 are the same (such as a cylindrical shape).
  • the characteristics of the microphone may be adjusted by adjusting the number of the fine holes 300 to be formed.
  • the flatness characteristic of the microphone may be adjusted by adjusting the number of the fine holes 300.
  • the flatness characteristic of the microphone is typically required to be within a predetermined range based on the sensitivity of the frequency band used. For example, the flatness of the microphone may be required so that the sensitivity of the 100Hz to 10kHz band is within ⁇ 2dB to ⁇ 6dB based on the sensitivity at 1kHz.
  • the number of the fine holes 300 By adjusting the number of the fine holes 300, it is possible to adjust the sensitivity in a specific frequency band. In the flatness of the transducer 400 itself, the sensitivity of the high frequency band is often too high relative to other frequency bands. In this case, increasing the number of the fine holes 300 may reduce the sensitivity of the high frequency band. MEMS transducers that are commonly used also often have high sensitivity in a high frequency band. In this case, the flatness of the microphone can be adjusted to a good level by adjusting the number of the micro holes 300 to 25 to 40.
  • the number of the fine holes 300 for adjusting the sensitivity to an appropriate level may vary depending on the characteristics of the transducer 400 or the size of the fine holes 300. It is a general tendency but not necessarily applied, but in order to realize the same high frequency sensitivity reduction, a smaller number of microholes 300 is required when the opening area of the microholes 300 is smaller, and microholes are required. If the opening area of 300 is large, a smaller number of micro holes 300 tend to be required.
  • the sum of the top areas of each of the microholes 300 is 3 ⁇ 10 ⁇ 8 m 2 to 4 ⁇ 10 ⁇ 7 m 2, and the sum of the bottom areas of each of the micro holes 300.
  • the flatness of the microphone can be adjusted to a good level in the case of 3 ⁇ 10 ⁇ 9 m 2 to 6 ⁇ 10 ⁇ 8 m 2.
  • the size and number of the top diameter d1 and the bottom diameter d2 of the microhole 300 should be adjusted so as to satisfy the characteristics of the microphone, the anti-vibration characteristics, and the sound transmission characteristics.
  • the cover bonding step S150 is a step of combining the substrate 100 and the cover 200.
  • Cover bonding step (S150) is a step (S151) of applying a solder to the portion of the substrate 100 abuts with the cover 200, the step of arranging the cover 200 to abut the substrate 100 (S152) and the solder Melting to combine the substrate 100 and the cover 200 (S153).
  • a portion of the substrate 100 that contacts the cover 200 is a coupling portion 150 of the substrate 100, and a portion of the cover 200 that contacts the coupling portion 150 is a flange portion 250.
  • the coupling part 150 and the flange part 250 may be coupled by soldering. Specifically, after solder cream is applied to the coupling part 150 and the flange part 250 of the cover 200 is disposed to contact the coupling part 150, the substrate 100 and the cover 200 are reflowed. Solder may be melted through the process to bond the substrate 100 and the cover 200.
  • the internal space formed by the substrate 100 and the cover 200 may be effectively shielded from external electromagnetic interference (EMI).
  • EMI external electromagnetic interference
  • the water repellent coating layer forming step S160 is a step of forming the water repellent coating layer 500 on at least a part of the outer surface of the cover 200 including the micro holes 300.
  • the water repellent coating layer forming step (S160) may form a water repellent coating layer 500 of one or two or more selected materials selected from PTFE (Poly Tetra Fluoro Ethylene), silicon carbide (SiC), or silicon resin. have.
  • PTFE Poly Tetra Fluoro Ethylene
  • SiC silicon carbide
  • silicon resin silicon resin
  • Forming the water repellent coating layer (S160) is preferably performed after the step (S150) of bonding the substrate and the cover is performed.
  • the material of the above-described water repellent coating layer 500 has a hydrophobic property. In such a water repellent coating layer 500, the bondability of the solder is remarkably inferior. Therefore, if the step (S160) of forming the water-repellent coating layer before the step (S150) of bonding the substrate and the cover is performed, the water-repellent coating layer 500 also in the flange portion 250 in contact with the coupling portion 150 of the substrate 100 ) May be formed. In this case, even when the flange portion 250 and the coupling portion 150 of the substrate 100 cannot be coupled by solder or are coupled, the bondability is remarkably weak.
  • the water repellent coating layer forming step (S160) includes spraying a water repellent coating on the cover 200 (S161) and curing the water repellent coating sprayed on the cover 200 (S162). Referring to FIG. 9, when the water repellent coating is sprayed from the upper side of the cover 200, the water repellent coating is sprayed to the inner surface of the micro holes 300 as well as the outer surface of the cover 200 to form the water repellent coating layer 500. Can be.
  • the step of curing the water repellent coating may be selected in various ways such as room temperature drying or high temperature drying.
  • the second embodiment is an array manufacturing method capable of manufacturing a plurality of microphone packages with respect to the manufacturing method of the microphone package of the first embodiment described above.
  • the second embodiment some of the same contents as those of the first embodiment described above with reference to FIGS. 1 to 9 will be omitted.
  • 10 is a flowchart illustrating a method of manufacturing a microphone package according to a second embodiment of the present invention.
  • 11 is a cross-sectional view illustrating a cover preparation step of the method for manufacturing a microphone package according to the second embodiment.
  • 12 is a cross-sectional view illustrating a step of forming a microhole in a method of manufacturing a microphone package according to a second embodiment.
  • 13 is a cross-sectional view illustrating a step of preparing an array substrate of a method of manufacturing a microphone package according to a second embodiment.
  • 14 is a cross-sectional view illustrating a transducer mounting step of a method of manufacturing a microphone package according to a second embodiment.
  • 15 is a cross-sectional view illustrating a cover coupling step of a method of manufacturing a microphone package according to a second embodiment.
  • 16 is a cross-sectional view illustrating a water repellent coating forming step of the method of manufacturing a microphone package according to the second embodiment.
  • 17 is a cross-sectional view illustrating a substrate separation step of the method of manufacturing a microphone package according to the second embodiment.
  • the method of manufacturing a microphone package includes a cover preparation step (S210), a microhole formation step (S220), an array substrate preparation step (S230), a transducer mounting step (S240), a cover coupling step (S250), It includes a water-repellent coating layer forming step (S260) and the substrate separation step (S270).
  • a cover preparation step (S210) is a step of preparing a plurality of covers 200.
  • the cover 200 may be formed by extrusion molding or injection molding.
  • the fine hole forming step S220 is a step of forming a plurality of fine holes 300 in each of the plurality of covers 200.
  • the plurality of covers 200 are arranged on the carrier 201, and the carrier 201 is periodically moved according to a predetermined trajectory, and the carrier 201 is upward.
  • a plurality of laser beams 350 irradiated at different angles from a laser diode located at may be irradiated and collected at a lower side of the cover 200 (S222).
  • the plurality of covers 200 may be arranged in the horizontal and vertical directions on the carrier 201.
  • the carrier 201 may periodically move according to a predetermined trajectory, and may form the microholes 300 at a specific position of the predetermined cover 200.
  • the plurality of laser beams 350 may be collected under the cover 200.
  • the laser diode is turned on / off according to the period of the trace of the carrier. Through this, the micro holes 300 may be formed in a predetermined trajectory.
  • an array substrate 101 having a plurality of substrates 100 having an upper surface on which the mounting pad 110 is formed and a lower surface on which the input / output pad 130 is formed is prepared. It's a step.
  • a plurality of substrates 100 may be integrally formed.
  • a space 102 may be provided between the substrate 100 and the substrate 100 to be cut in a subsequent substrate separation step S270.
  • the number of substrates 100 of the array substrate 101 may be prepared to correspond to the number of prepared covers 200.
  • the arrangement form of the substrate 100 of the array substrate 101 may also be prepared to correspond to that of the cover 200 arranged on the carrier 201.
  • the transducer mounting step S240 is a step of mounting the transducer 400 on each substrate 100 of the array substrate 101.
  • the cover bonding step S250 is a step of coupling the plurality of covers 200 having the micro holes 300 to each substrate 100.
  • a portion of the substrate 100 that contacts the cover 200 is a coupling portion 150 of the substrate 100, and a portion of the cover 200 that contacts the coupling portion 150 is a flange portion 250.
  • the coupling part 150 and the flange part 250 may be coupled by soldering. Specifically, after solder cream is applied to the coupling part 150 and the flange part 250 of the cover 200 is disposed to contact the coupling part 150, the substrate 100 and the cover 200 are reflowed. Solder may be melted through the process to bond the substrate 100 and the cover 200.
  • the internal space formed by the substrate 100 and the cover 200 may be effectively shielded from external electromagnetic interference (EMI).
  • EMI external electromagnetic interference
  • the water repellent coating layer forming step S260 is a step of forming the water repellent coating layer 500 on the outer surfaces of the plurality of covers 200.
  • the water repellent coating layer forming step (S260) includes spraying a water repellent coating on the cover 200 (S261) and curing the water repellent coating sprayed on the cover 200 (S262).
  • the water repellent coating layer forming step (S260) may form a water repellent coating layer 500 made of one or two or more combinations of materials selected from PTFE (Poly Tetra Fluoro Ethylene), silicon carbide (SiC), and silicon resin. have.
  • PTFE Poly Tetra Fluoro Ethylene
  • SiC silicon carbide
  • silicon resin silicon resin
  • Forming the water repellent coating layer (S260) is preferably performed after the step (S250) of bonding the cover to the substrate.
  • the material of the water repellent coating layer 500 has a hydrophobic property. In such a water repellent coating layer 500, the bondability of the solder is remarkably inferior. Therefore, if the step S260 of forming the water repellent coating layer is performed before the step S250 of combining the substrate and the cover is performed, the water repellent coating layer 500 may also be applied to the flange part 250 which is in contact with the coupling part 150 of the substrate 100. ) May be formed. In this case, even when the flange portion 250 and the coupling portion 150 of the substrate 100 cannot be coupled by solder or are coupled, the bondability is remarkably weak.
  • the substrate separation step S270 is a step of separating the plurality of substrates 100, respectively.
  • the space 102 between the substrate 100 and the substrate 100 may be cut and separated into separate microphone packages.
  • 18 is a cross-sectional view illustrating a process of forming a microhole in a method of manufacturing a microphone package according to a third embodiment.
  • 19 is a cross-sectional view illustrating a step of forming a water repellent coating according to the third embodiment.
  • 20 is an enlarged view of the microhole and the water repellent coating layer of FIG. 19.
  • 21 is a sectional view after the substrate separation step of the third embodiment is performed.
  • the third embodiment relates to a manufacturing method in which the laser beam 350 is irradiated under the cover 200 to form the microholes 300.
  • the laser beam 350 In order for the laser beam 350 to be irradiated to form the micro holes 300 in the cover 200, it is necessary to form a space apart from the direction in which the laser beam 350 is irradiated.
  • a space exists between the lower side of the cover 200 and the carrier 201, but the cover 200 is turned over and the cover 201 is turned on.
  • the separation space When the laser beam 350 is irradiated from below, the separation space must be formed between the cover 200 and the carrier 201.
  • Support 202 may be formed on the carrier 201.
  • the support 202 is formed to correspond to the plurality of covers 200.
  • the support 202 is coupled with the cover 200 in an inverted state so that the support 202 is spaced apart from the cover 200 and the carrier 201 by the support 202.
  • the carrier 201 periodically moves according to a predetermined trajectory, and the cover 200 disposed on the carrier 201 periodically moves according to the predetermined trajectory.
  • the laser diode is turned on / off according to the period of the trajectory, whereby the minute hole 300 may be formed at a specific position of the cover 200.
  • the laser beam 350 is irradiated above the carrier 201. Since the cover 200 is disposed on the carrier 201 in an inverted state, the upper side of the carrier 201 becomes the lower side of the cover 200. The light is collected in the spaced space between the cover 200 and the carrier 201.
  • the separation space between the cover 200 and the carrier 201 is above the cover 200.
  • the water repellent coating layer 500 may be formed on at least a portion of the inner surface of the micro hole 300 as well as the outer surface of the cover 200 corresponding to the periphery of the micro hole 300.
  • the water repellent coating layer 500 may be formed by spraying the water repellent coating on the cover 200 as described above with reference to FIG.
  • an individual microphone package may be manufactured by cutting the space 102 between the substrate 100 and the substrate 100.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

La présente invention concerne un procédé pour fabriquer un emballage de microphone. Le procédé pour fabriquer un emballage de microphone selon la présente invention comprend les étapes consistant à : préparer un substrat ayant une surface supérieure sur laquelle une plage d'accueil est formée et une surface inférieure sur laquelle un plot d'entrée-sortie est formé ; monter un transducteur sur la plage d'accueil ; préparer un couvercle ; former une pluralité de micro-trous dans le couvercle ; coupler le couvercle au substrat ; et former une couche de revêtement hydrophobe sur au moins une partie de la surface externe du couvercle, comprenant les périphéries des micro-trous.
PCT/KR2013/011276 2013-11-13 2013-12-06 Procédé pour fabriquer un emballage de microphone WO2015072616A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130137712A KR101469606B1 (ko) 2013-11-13 2013-11-13 마이크로폰 패키지의 제조 방법
KR10-2013-0137712 2013-11-13

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WO2015072616A1 true WO2015072616A1 (fr) 2015-05-21

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WO (1) WO2015072616A1 (fr)

Families Citing this family (8)

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KR102437764B1 (ko) 2017-12-20 2022-08-30 삼성전자주식회사 센서 패키지, 센서 패키지의 제조 방법, 및 리드 구조체의 제조 방법
KR102087644B1 (ko) 2018-12-04 2020-04-20 지엔에스티 주식회사 마이크로폰소자 제조방법 및 이를 이용한 마이크로폰소자의 세팅장치
KR102106170B1 (ko) * 2018-12-14 2020-04-29 (주)파트론 마이크로폰 패키지 및 그 제조방법
KR102341770B1 (ko) 2020-10-30 2021-12-22 지엔에스티 주식회사 신호레벨 조정과 생산성이 우수한 차량용 마이크로폰
KR102341773B1 (ko) 2020-10-30 2021-12-22 지엔에스티 주식회사 전체 증폭률과 저역/고역 개별 증폭률 제어가 가능한 차량용 마이크로폰
KR20230151758A (ko) 2022-04-26 2023-11-02 지엔에스티 주식회사 가속도 센서를 이용한 마이크로폰 소자
KR102676628B1 (ko) 2022-12-20 2024-06-20 지엔에스티 주식회사 방수 구조를 가지는 마이크로폰 소자 제조방법
KR102676643B1 (ko) 2022-12-29 2024-06-19 지엔에스티 주식회사 Mesh 필터 주파수 응답 특성 분석툴을 이용한 마이크로폰 소자 제조방법

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JP2007037069A (ja) * 2005-07-21 2007-02-08 Toshimitsu Hirahiro 耐湿型エレクトレットコンデンサマイクロホン
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JP2006222641A (ja) * 2005-02-09 2006-08-24 Hosiden Corp 防塵板内蔵マイクロホン
JP2007037069A (ja) * 2005-07-21 2007-02-08 Toshimitsu Hirahiro 耐湿型エレクトレットコンデンサマイクロホン
US20080247572A1 (en) * 2005-09-09 2008-10-09 Nxp B.V. Micro-Electro-Mechanical System (Mems) Capacitor Microphone and Method of Manufacturing Thereof
JP2009260573A (ja) * 2008-04-15 2009-11-05 Funai Electric Advanced Applied Technology Research Institute Inc マイクロホンユニット及びその製造方法

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