WO2015060090A1 - Feuille à multiples couches conductrice thermique, méthode de production de feuille à multiples couches conductrice thermique, et dispositif électronique - Google Patents

Feuille à multiples couches conductrice thermique, méthode de production de feuille à multiples couches conductrice thermique, et dispositif électronique Download PDF

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WO2015060090A1
WO2015060090A1 PCT/JP2014/076439 JP2014076439W WO2015060090A1 WO 2015060090 A1 WO2015060090 A1 WO 2015060090A1 JP 2014076439 W JP2014076439 W JP 2014076439W WO 2015060090 A1 WO2015060090 A1 WO 2015060090A1
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Prior art keywords
thermally conductive
heat
mass
heat conductive
parts
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PCT/JP2014/076439
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English (en)
Japanese (ja)
Inventor
明子 北川
拓朗 熊本
正文 水島
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日本ゼオン株式会社
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Publication of WO2015060090A1 publication Critical patent/WO2015060090A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a thermally conductive laminate sheet, a method for producing the thermally conductive laminate sheet, and an electronic device including the thermally conductive laminate sheet.
  • thermal conductive sheet as described above may be used by laminating a plurality of layers in order to further provide functions such as electrical insulation depending on the application.
  • a laminated sheet hereinafter referred to as “thermal conductivity” having a function such as electrical insulation in addition to thermal conductivity by laminating a plurality of layers having different functions.
  • thermal conductivity a laminated sheet having a function such as electrical insulation in addition to thermal conductivity by laminating a plurality of layers having different functions.
  • thermoly conductive laminated sheet having functions such as electrical insulation in addition to thermal conductivity can be obtained.
  • thermally conductive laminated sheets undergo a monomer polymerization reaction when the layers constituting the thermally conductive laminated sheet are molded, and production requires a certain amount of time and labor.
  • an object of the present invention is to provide a thermally conductive laminated sheet that has thermal conductivity and electrical insulation and is easy to produce. Moreover, the manufacturing method of the said heat conductive laminated sheet and the electronic device provided with this heat conductive laminated sheet are provided.
  • a first aspect of the present invention is a thermally conductive laminated sheet (F) comprising a thermally conductive layer having thermal conductivity and an insulating layer having electrical insulation, wherein the thermally conductive layer is ( 100 parts by mass of the (meth) acrylic acid ester polymer (A1), 1 to 15 parts by mass of a polyfunctional epoxy compound (B) having 2 to 10,000 functional groups, and an expansion having an average particle size of 100 ⁇ m or more It is a heat conductive laminated sheet (F) which is a layer containing 90 mass parts or more and 450 mass parts or less of graphite powder (C).
  • (meth) acryl means “acryl and / or methacryl”.
  • thermal conductivity means having a thermal conductivity of 0.2 W / m ⁇ K or more.
  • electrical insulation means having a dielectric breakdown strength of 1 kV / mm or more.
  • a second aspect of the present invention is a method for producing a thermally conductive laminated sheet (F) comprising a thermally conductive layer having thermal conductivity and an insulating layer having electrical insulation, wherein (Meta) Expanded graphite having 100 parts by mass of acrylic ester polymer (A1), 1 to 15 parts by mass of a polyfunctional epoxy compound (B) having 2 to 10,000 functional groups, and an average particle size of 100 ⁇ m or more It is a manufacturing method of a heat conductive laminated sheet (F) including the process of shape
  • the third aspect of the present invention is an electronic device including the heating element and the heat conductive laminated sheet (F) of the first aspect of the present invention bonded to the heating element.
  • thermoly conductive laminated sheet that has thermal conductivity and electrical insulation and is easy to manufacture. Moreover, the manufacturing method of the said heat conductive laminated sheet and the electronic device provided with the said heat conductive laminated sheet can be provided.
  • FIG. 1 is a diagram schematically showing the layer configuration of the heat conductive laminated sheet 40.
  • the thermally conductive laminated sheet (F) 40 of the present invention includes a thermally conductive layer 41 having thermal conductivity and an insulating layer 42 having electrical insulation. Hereinafter, these layers will be described in detail.
  • the heat conductive layer 41 is a layer having adhesiveness and heat conductivity. Although the thickness of the heat conductive layer 41 is not particularly limited, the heat resistance in the thickness direction of the heat conductive laminated sheet (F) 40 can be lowered by forming the heat conductive layer 41 thin. On the other hand, by giving the heat conductive layer 41 a certain thickness, the heat conductive laminated sheet (F) 40 can be easily handled. From these viewpoints, the thickness of the heat conductive layer 41 can be 0.1 mm or more and 5 mm or less, preferably 0.15 mm or more and 4.5 mm or less, and more preferably 0.15 mm or more and 4 mm or less. preferable.
  • the heat conductive layer 41 includes a (meth) acrylic acid ester polymer (A1) and a polyfunctional epoxy compound (B) having a functional group of 2 or more and 10,000 or less (hereinafter simply referred to as “polyfunctional epoxy compound (B)”). And an expanded graphite powder (C) having an average particle size of 100 ⁇ m or more (hereinafter sometimes simply referred to as “expanded graphite powder (C)”). It is a layer obtained by doing this.
  • a polymerization reaction is not used.
  • the adhesive force of the heat conductive layer 41 can be kept strong by not using a monomer or a polymerization initiator.
  • the adhesive strength of the heat conductive layer 41 depends on the adhesive strength of the (meth) acrylic acid ester polymer (A1). Therefore, the adhesive force of the heat conductive layer 41 becomes stronger when the heat conductive layer 41 is not formed than when the polymerization reaction is performed. Moreover, since it shape
  • the substance constituting the heat conductive layer 41 will be described in detail below.
  • the (meth) acrylate monomer (a1m) that gives the unit (a1) of the (meth) acrylate monomer is not particularly limited.
  • ethyl acrylate the glass transition temperature of the homopolymer is -24 ° C
  • n-propyl acrylate (-37 ° C)
  • n-butyl acrylate (-54 ° C)
  • sec-butyl acrylate (-22 ° C)
  • n-octyl acrylate -65 ° C
  • 2-ethylhexyl acrylate -50 ° C
  • n-octyl methacrylate (-25 ° C)
  • a (meth) acrylic acid alkyl ester that forms a homopolymer having a glass transition temperature of ⁇ 20 ° C.
  • n-decyl methacrylate (-49 ° C.); 2-methoxyethyl acrylate
  • the glass transition temperature is ⁇ 50 ° C.), 3-methoxypropyl acrylate (-75 ° C.), 3-methoxybutyl acrylate (-56 ° C.), ethoxymethyl acrylate ( ⁇ 50 ° C.), etc.
  • (meth) acrylic acid alkoxyalkyl esters that form a homopolymer of 20 ° C. or lower. Among them, (meth) acrylic acid alkyl ester forming a homopolymer having a glass transition temperature of ⁇ 20 ° C.
  • acrylic acid ester monomers (a1m) may be used alone or in combination of two or more.
  • the monomer (a2m) that gives the monomer unit (a2) having an organic acid group is not particularly limited, but representative examples thereof include organic acid groups such as a carboxyl group, an acid anhydride group, and a sulfonic acid group.
  • monomers containing sulfenic acid groups, sulfinic acid groups, phosphoric acid groups, and the like can also be used.
  • the monomer having a carboxyl group include, for example, ⁇ , ⁇ -ethylenically unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid, and ⁇ , ⁇ such as itaconic acid, maleic acid, and fumaric acid.
  • ⁇ , ⁇ -ethylenically unsaturated polyvalent carboxylic acid partial esters such as monomethyl itaconate, monobutyl maleate and monopropyl fumarate can be exemplified.
  • the (meth) acrylic acid ester polymer (A1) may contain a monomer unit (a3) derived from a monomer (a3m) having a functional group other than an organic acid group.
  • the functional group other than the organic acid group include a hydroxyl group, an amino group, an amide group, an epoxy group, and a mercapto group.
  • Examples of the monomer having a hydroxyl group include (meth) acrylic acid hydroxyalkyl esters such as (meth) acrylic acid 2-hydroxyethyl and (meth) acrylic acid 3-hydroxypropyl.
  • Examples of the monomer having an epoxy group include glycidyl (meth) acrylate and allyl glycidyl ether.
  • the monomer (a3m) having a functional group other than the organic acid group one type may be used alone, or two or more types may be used in combination.
  • the monomer unit (a3) derived therefrom is 10% by mass or less in the (meth) acrylate polymer (A1). It is preferable to use it for polymerization in such an amount.
  • the monomer (a3m) of 10% by mass or less it becomes easy to keep the viscosity of the polymerization system during polymerization in an appropriate range.
  • the (meth) acrylic acid ester polymer (A1) has a (meth) acrylic acid ester monomer unit (a1) that forms a homopolymer having a glass transition temperature of ⁇ 20 ° C. or lower, and an organic acid group.
  • a monomer derived from the monomer (a4m) copolymerizable with the above-described monomer may be contained.
  • the monomer (a4m) is not particularly limited, and specific examples thereof include (meth) acrylate monomers other than the (meth) acrylate monomer (a1m), ⁇ , ⁇ -ethylenic monomers. Saturated polyvalent carboxylic acid complete ester, alkenyl aromatic monomer, vinyl cyanide monomer, carboxylic acid unsaturated alcohol ester, olefin monomer and the like can be mentioned.
  • the (meth) acrylate monomer other than the (meth) acrylate monomer (a1m) include methyl acrylate (homopolymer having a glass transition temperature of 10 ° C.), methyl methacrylate. (105 ° C.), ethyl methacrylate (63 ° C.), n-propyl methacrylate (25 ° C.), n-butyl methacrylate (20 ° C.), and the like.
  • ⁇ , ⁇ -ethylenically unsaturated polyvalent carboxylic acid complete ester examples include dimethyl fumarate, diethyl fumarate, dimethyl maleate, diethyl maleate, dimethyl itaconate and the like.
  • alkenyl aromatic monomer examples include styrene, ⁇ -methylstyrene, methyl ⁇ -methylstyrene, vinyltoluene and the like.
  • vinyl cyanide monomer examples include acrylonitrile, methacrylonitrile, ⁇ -chloroacrylonitrile, ⁇ -ethylacrylonitrile and the like.
  • carboxylic acid unsaturated alcohol ester monomer examples include vinyl acetate.
  • the monomer (a4m) one type may be used alone, or two or more types may be used in combination.
  • the polymerization method for obtaining the (meth) acrylic acid ester polymer (A1) is not particularly limited, and may be any of solution polymerization, emulsion polymerization, suspension polymerization, bulk polymerization, and the like, or any other method. .
  • solution polymerization is preferable, and among them, solution polymerization using a carboxylic acid ester such as ethyl acetate or ethyl lactate or an aromatic solvent such as benzene, toluene or xylene is more preferable.
  • the monomer may be added in portions to the polymerization reaction vessel, but it is preferable to add the whole amount at once.
  • the method for initiating the polymerization is not particularly limited, but it is preferable to use a thermal polymerization initiator as the polymerization initiator.
  • the thermal polymerization initiator is not particularly limited, and for example, a peroxide polymerization initiator or an azo compound polymerization initiator can be used.
  • Peroxide polymerization initiators include hydroperoxides such as t-butyl hydroperoxide, peroxides such as benzoyl peroxide and cyclohexanone peroxide, and persulfates such as potassium persulfate, sodium persulfate and ammonium persulfate. Can be mentioned. These peroxides can also be used as a redox catalyst in appropriate combination with a reducing agent.
  • the usage-amount of a polymerization initiator is not specifically limited, It is preferable that it is the range of 0.01 to 50 mass parts with respect to 100 mass parts of monomers.
  • polymerization conditions (polymerization temperature, pressure, stirring conditions, etc.) of these monomers are not particularly limited.
  • the obtained polymer is separated from the polymerization medium if necessary.
  • the separation method is not particularly limited.
  • the (meth) acrylic acid ester polymer (A1) can be obtained by placing the polymerization solution under reduced pressure and distilling off the polymerization solvent.
  • the content of the polyfunctional epoxy compound (B) is 1 part by mass or more and 15 parts by mass or less, and 2 parts by mass or more and 12 parts by mass or less based on 100 parts by mass of the (meth) acrylic ester polymer (A1). It is preferably 2 parts by mass or more and 10 parts by mass or less.
  • the material constituting the insulating layer 42 satisfying the above conditions is polyimide; polyester such as polyethylene terephthalate and polyethylene naphthalate; fluorine resin such as polytetrafluoroethylene; polyether ketone; polyether sulfone; polymethylpentene; Polysulfone; polyphenylene sulfide; polyamideimide; polyesterimide; polyamide; Among these, polyester is preferable and polyethylene terephthalate is more preferable from the viewpoint of availability at low cost.
  • the insulating layer 42 may be made of one kind of material or may be made by combining a plurality of kinds of materials.
  • the heat conductive laminated sheet (F) of the present invention includes a heat conductive layer having heat conductivity, so that the material disposed on one surface side of the heat conductive laminated sheet (F) is the other side.
  • the heat can be efficiently transferred to the object arranged on the surface side.
  • the heat conductive laminated sheet (F) of this invention can be used also for the use as which electrical insulation is requested
  • the heat conductive laminated sheet (F) of the present invention since the heat conductive layer can be formed without using a polymerization reaction in the step of forming the mixed composition into a sheet, it is easy to form the heat conductive layer. In addition, the adhesive strength of the heat conductive layer can be kept strong.
  • the heat conductive layer has high heat conductivity and the heat conductive layer has pressure-sensitive adhesiveness. It can be used for applications such as efficiently conducting heat conduction from the heating element to the radiator.
  • the heat conductive laminated sheet (F) of this invention can be attached to the electronic component which is a heat generating body with which an electronic device is equipped, and can be used as a part of this electronic component.
  • FIG. 2 is a diagram illustrating an example of use of the heat conductive laminated sheet (F).
  • LED light source examples include the following. That is, PDP panel; IC heating part; Cold cathode tube (CCFL); Organic EL light source; Inorganic EL light source; High luminance light emitting LED light source; High luminance light emitting organic EL light source; And so on.
  • the heat conductive laminated sheet (F) of the present invention can be attached to the housing of the apparatus.
  • a device provided in an automobile or the like it is affixed inside a casing provided in the automobile; affixed outside the casing provided in the automobile; a heat generating part (inside the casing provided in the automobile) Connecting the car navigation / fuel cell / heat exchanger) and the housing; affixing to a heat sink connected to the heat generating part (car navigation / fuel cell / heat exchanger) in the housing of the automobile; Etc.
  • heat conductivity was evaluated as follows. As will be described later, a laminated sheet having a heat conductive layer sandwiched between two release PET films was prepared, and a test piece was prepared by cutting it into a size of 25 mm ⁇ 120 mm. The release PET film on the upper surface side was peeled from the test piece, and a micro ceramic heater (manufactured by Sakaguchi Electric Heat Co., Ltd., trade name: MS-5, 25 mm ⁇ 25 mm) was attached to one end in the longitudinal direction. A double-sided tape having a thickness of 0.05 mm was used between the test piece and the micro ceramic heater.
  • a slidac was connected to the microceramic heater, a voltage of 20 V was applied to the microceramic heater and heated for 60 minutes, and then the surface of the microceramic heater was photographed by thermography. Compare the surface temperature of the micro ceramic heater with and without the test piece, and the difference between them (the surface temperature of the micro ceramic heater without the paste-the micro with the test piece attached) The surface temperature of the ceramic heater) [° C.] was evaluated and the thermal diffusion effect [° C.] was used. The larger the numerical value of the thermal diffusion effect [° C.], the higher the thermal diffusion effect and the higher the thermal conductivity. The measurement was performed in an atmosphere at 23 ° C. The results are shown in Tables 2 and 3.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne une feuille à multiples couches conductrice thermique (F) qui comprend une couche conductrice thermique ayant des propriétés conductrices thermiques et une couche isolante ayant des propriétés isolantes électriques. Cette feuille à multiples couches conductrice thermique (F) est configurée de façon que la couche conductrice thermique contienne 100 parties massiques d'un polymère d'ester d'acide (méth)acrylique (A1), entre 1 partie massique et 15 parties massiques (inclus) d'un composé époxyde polyfonctionnel (B) ayant de 2 à 10 000 groupes fonctionnels (inclus), et entre 90 parties massiques et 450 parties massiques (inclus) d'une poudre de graphite expansée (C) ayant un diamètre de particule moyen d'au moins 100 μm.
PCT/JP2014/076439 2013-10-25 2014-10-02 Feuille à multiples couches conductrice thermique, méthode de production de feuille à multiples couches conductrice thermique, et dispositif électronique WO2015060090A1 (fr)

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Application Number Priority Date Filing Date Title
JP2013222637 2013-10-25
JP2013-222637 2013-10-25

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WO2015060090A1 true WO2015060090A1 (fr) 2015-04-30

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Citations (6)

* Cited by examiner, † Cited by third party
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JP2009502567A (ja) * 2005-07-27 2009-01-29 エクサイーエヌシー コーポレーション 膨張黒鉛と炭素ナノチューブとの混合カーボンを用いた高熱伝導性カーボンシート
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