WO2015043053A1 - Oled器件的封装结构和封装方法 - Google Patents

Oled器件的封装结构和封装方法 Download PDF

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Publication number
WO2015043053A1
WO2015043053A1 PCT/CN2013/088246 CN2013088246W WO2015043053A1 WO 2015043053 A1 WO2015043053 A1 WO 2015043053A1 CN 2013088246 W CN2013088246 W CN 2013088246W WO 2015043053 A1 WO2015043053 A1 WO 2015043053A1
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Prior art keywords
glass
oled device
recessed portion
sealing layer
glass cover
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PCT/CN2013/088246
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English (en)
French (fr)
Inventor
张玉欣
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US14/360,172 priority Critical patent/US9349984B2/en
Publication of WO2015043053A1 publication Critical patent/WO2015043053A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Definitions

  • Embodiments of the present invention relate to a package structure and a package method of an OLED device.
  • Electroluminescent devices that cause carrier injection and recombination result in luminescence.
  • OLED devices have many advantages and have bright prospects in the display field.
  • OLED devices are very sensitive to moisture and oxygen. Water vapor and oxygen that penetrate into the OLED device are the main factors affecting the lifetime of OLED devices. Water vapor and oxygen react chemically with organic materials, causing failure of OLED devices.
  • an OLED device is a DC current-driven device. When the OLED device is in operation, if there is moisture inside the device, a type of electrolytic cell is formed inside the device, causing an electrochemical reaction, and the generated reaction gas will be generated. The metal cathode is separated from the organic functional layer, causing device failure.
  • Embodiments of the present invention provide a package structure and a package method of an OLED device
  • the package structure of the OLED device prevents moisture and oxygen from entering the OLED device, thereby increasing the lifetime of the OLED device.
  • One aspect of the present invention provides a package structure of an OLED device including a glass substrate, a cover glass, an OLED device, and a sealing layer.
  • the glass substrate has a recessed portion, the glass cover plate is located at an opening of the recessed portion, and a glass retaining wall bonded between the periphery of the glass cover plate and the glass substrate by melting glass frit
  • the glass cover plate and the glass substrate have an integrated structure, and the glass cover plate and the trap portion form a sealed cavity, and the OLED device and the sealing layer are both located in the sealed cavity.
  • the OLED device is disposed on a bottom surface of the recess, and the sealing layer fills other spaces in the sealed cavity; for example, in a direction of the glass cover along a bottom surface of the recess, The spacing between the opposite side walls of the sealed cavity gradually becomes larger.
  • the OLED device is disposed on a side of the glass cover plate facing the bottom surface of the recessed portion, and the sealing layer fills other spaces in the sealed cavity; for example, pointing the glass cover along the bottom surface of the recessed portion In the direction, the spacing between the opposite side walls of the closed cavity gradually becomes larger.
  • the sealing layer is a transparent sealing layer made of silicone oil, resin or liquid crystal.
  • a side of the cover glass facing away from the bottom surface of the recess is flush with the upper edge of the recess of the glass substrate.
  • Another aspect of the present invention provides a packaging method for a package structure of the above OLED device, comprising: forming a recess on a glass substrate, preparing an OLED device, filling a recess into the recess to form a sealing layer, and forming the glass
  • the cover is placed at the opening of the recess, and the OLED device and the sealing layer are covered in the recess; the glass powder is filled into the gap between the periphery of the cover glass and the sidewall of the recess; the laser is encapsulated by the laser packaging method
  • the head is smelted along the glass powder to melt the glass frit, and the glass substrate and the glass cover are bonded into a one-piece structure, so that the glass cover and the recess form a closed cavity.
  • a recess having a stepped structure is formed on the glass substrate, and a width along a bottom surface of the recess is smaller than a width of the opening of the recess; an OLED device is prepared on a bottom surface of the recess; and a sealing material is filled into the recess to form a sealing layer;
  • the glass cover is disposed on the step surface of the sidewall of the recess to cover the OLED device and the sealing layer in the recess.
  • a recessed portion having a stepped structure is prepared on the glass substrate, and a width along a bottom surface of the recessed portion is smaller than a width of the recessed portion of the recessed portion, a sealing material is filled into the recessed portion, and an OLED device is prepared on one side of the cover glass.
  • the glass cover is provided with a surface of the OLED device facing the recessed portion and covering the stepped surface of the sidewall of the recess, and the sealing material is formed into a sealing layer to cover the OLED device and the sealing layer in the recess.
  • FIG. 2b is a schematic structural view showing the arrangement of an OLED device on the bottom surface of the depressed portion of the glass substrate of the structure shown in FIG. 2a;
  • FIG. 2c is a schematic structural view showing a sealing layer formed on the glass substrate and the OLED device of the structure shown in FIG. 2b; a schematic structural view of the glass cover plate facing one side of the bottom surface of the trapped portion of the glass substrate; a schematic structural view of the depressed portion; Another structural diagram of the department. detailed description
  • FIG. 2 is a schematic structural view of a glass substrate in a package structure of an OLED device according to an embodiment of the present invention
  • FIG. 3 is an OLED structure in an OLED device package structure according to an embodiment of the present invention
  • the device is disposed on the side of the glass cover plate facing the bottom surface of the recessed portion of the glass substrate.
  • the package structure of the OLED device provided in this embodiment includes a glass substrate 1, a glass cover 2, an OLED device 3, and a sealing layer 4.
  • the glass substrate 1 has a recessed portion 11, and the cover glass 2 is located at the opening of the recessed portion 11.
  • the cover glass 2 and the recess 11 of the glass substrate 1 form a closed cavity, and the OLED device 3 and the sealing layer 4 are both Located in a closed cavity.
  • the periphery of the cover glass 2 is bonded to the glass substrate 1 through the glass retaining wall 5 which is formed by melting the glass powder, so that the glass cover 2 and the cover glass 1 form an integral structure.
  • the glass cover 2 is matched with the trap 11 of the glass substrate 1 to form a sealed cavity, and the prepared OLED device 3 and the sealing layer 4 are located in the sealed cavity.
  • the glass substrate 1, the glass cover 2 and the glass retaining wall 5 realize the all-glass encapsulation of the OLED device 3, and the glass material has good barrier properties against moisture and oxygen, thereby preventing moisture and oxygen outside the package structure from entering the sealed cavity. Thereby, water vapor and oxygen are prevented from entering the OLED device 3, and the service life of the OLED device 3 is prolonged.
  • the package structure of the OLED device provided by the embodiment of the invention can prevent moisture and oxygen from entering the OLED device and prolong the service life of the OLED device.
  • the OLED device 3 can be arranged in various ways.
  • the OLED device 3 can be disposed on the bottom surface of the depressed portion 11 of the glass substrate 1, and the sealing layer 4 fills the other space in the closed cavity.
  • the sealing layer 4 is capable of better sealing the side of the OLED device 3 and the side of the OLED device 3 facing away from the bottom surface of the recess 11.
  • the sealing layer 4 can better seal the periphery of the OLED device 3, and the direction of the bottom surface of the recessed portion 11 is directed to the glass cover 2, and the sealed cavity is relatively
  • the spacing between the two side walls can be gradually increased.
  • the OLED device 3 can also be disposed on the side of the glass cover 2 facing the bottom surface of the recessed portion 11, and the sealing layer 4 fills the other space in the closed cavity.
  • the sealing layer 4 fills the other space in the closed cavity formed by the assembly of the glass cover 2 and the recess 11 so that the sealing layer 4 can better seal the side of the OLED device 3 and the side of the OLED device 3 facing away from the cover glass 2 .
  • the spacing between the opposite side walls in the closed cavity can be gradually increased along the direction in which the bottom surface of the depressed portion is directed to the cover glass.
  • the sealing layer 4 is a transparent sealing layer made of silicone oil, resin or liquid crystal.
  • Transparent sealing layer does not affect OLED
  • the light-emitting efficiency when the device emits light can improve the display quality of the OLED device.
  • the amount of silicone oil, resin or liquid crystal used can be calculated.
  • the side of the glass cover 2 facing away from the bottom surface of the recessed portion 11 is flush with the upper edge of the depressed portion 11 of the glass substrate 1.
  • the embodiment of the invention further provides a packaging method of the package structure of the above OLED device, and the method can be performed as follows.
  • Step S601 forming a depressed portion on the glass substrate, preparing an OLED device, filling a sealing material into the depressed portion to form a sealing layer, covering the glass cover at the opening of the depressed portion, and covering the OLED device and the sealing layer in the depressed portion .
  • Step S602 filling the gap between the periphery of the cover glass and the side wall of the recessed portion with glass frit.
  • Step S603 using a laser encapsulation method, for example, using a PC to control the laser head to scan the glass powder to melt the glass powder, and bonding the glass substrate and the glass cover to form a unitary structure, so that the glass cover and the recess form a close-packed structure. Cavity.
  • a laser encapsulation method for example, using a PC to control the laser head to scan the glass powder to melt the glass powder, and bonding the glass substrate and the glass cover to form a unitary structure, so that the glass cover and the recess form a close-packed structure. Cavity.
  • the laser packaging method in step S603 melts the glass powder filled in the gap between the periphery of the glass cover and the sidewall of the depressed portion in step S602, thereby realizing Bonding between the periphery of the glass cover and the glass substrate, finally bonding the glass substrate and the glass cover into an integrated structure, and fitting the glass cover to the trapped portion of the glass substrate to form an assembly position of the sealed cavity step S601
  • the OLED device and the sealing layer are located in the above-mentioned sealed cavity, thereby implementing an all-glass package of the OLED device.
  • step S601 can be performed as follows.
  • a recess 11 having a stepped structure is formed on the glass substrate 1, and the width along the bottom surface of the recess 11 is smaller than the width of the opening of the recess; as shown in Fig. 2b, on the bottom surface of the recess 11.
  • the OLED device 3 is prepared; as shown in FIG. 2c, the sealing material is filled into the depressed portion 11 to form the sealing layer 4; then, the glass cover 2 is covered on the stepped surface of the side wall of the depressed portion 11.
  • step S602 and step S603 the package structure of the OLED device shown in FIG. 1 is finally obtained, and the all-glass package of the OLED device 3 is realized.
  • step S601 Another specific example of step S601 can be performed as follows.
  • a recessed portion having a stepped structure is prepared on the glass substrate, and a width along a bottom surface of the recessed portion is smaller than a width of the opening of the recessed portion, and the recessed portion is filled with a sealing material and is formed on one side of the cover glass.
  • one side of the glass cover plate provided with the OLED device is covered on the bottom surface of the recessed portion toward the bottom surface of the recessed portion, and the sealing material is formed into a sealing layer.
  • the package structure of the OLED device shown in FIG. 3 is obtained through steps S602 and S603, and the all-glass package of the OLED device 3 can also be realized.
  • the shape of the depressed portion formed on the glass substrate is not limited to the shape shown in Fig. 2a, and may be the structure shown in Figs. 4 and 5.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED器件的封装结构及封装方法，该OLED器件（3）的封装结构包括玻璃基板（1）、玻璃盖板（2）、OLED器件（3）、密封层（4）。该玻璃基板（1）具有凹陷部（11），该玻璃盖板（2）位于凹陷部（11）的开口处，且玻璃盖板（2）的周边与玻璃基板（1）之间通过玻璃粉料熔融而成的玻璃挡墙（5）键合，使玻璃盖板（2）与玻璃基板（1）具有一体式结构，玻璃盖板（2）与凹陷部（11）形成一密闭容腔，OLED器件（3）以及密封层（4）均位于密闭容腔内。该封装结构能够防止水汽和氧气进入OLED器件内，延长OLED器件的使用寿命。

Description

OLED器件的封装结构和封装方法 技术领域
本发明的实施例涉及一种 OLED器件的封装结构和封装方法。 背景技术 载流子注入和复合而导致发光的电致发光器件。 OLED器件具有较多的优点， 在显示领域有着光明的前景。 OLED器件对水汽和氧气非常敏感， 渗透进入 OLED器件内部的水汽和氧气是影响 OLED器件寿命的主要因素。 水汽和氧 气会与有机材料发生化学反应， 引起 OLED器件的失效。 例如， OLED器件 属于直流电流驱动型的器件， 当 OLED器件处于工作状态时， 如果器件内部 有水汽的话， 在器件内部就会构成一个 型的电解池， 导致电化学反应， 产 生的反应气体会将金属阴极与有机功能层分离， 导致器件失效。
因此， 如何提供一种能够防止水汽和氧气渗入 OLED器件的封装结构是 本领域技术人员亟需解决的技术问题之一。 发明内容
本发明的实施例提供了一种 OLED 器件的封装结构和封装方法， 该
OLED 器件的封装结构能够防止水汽和氧气进入 OLED 器件， 进而提高 OLED器件的使用寿命。
本发明的一个方面提供了一种 OLED器件的封装结构，其包括玻璃基板、 玻璃盖板、 OLED器件、 密封层。 所述玻璃基板具有凹陷部， 所述玻璃盖板 位于所述凹陷部的开口处， 且所述玻璃盖板的周边与所述玻璃基板之间通过 玻璃粉料熔融而成的玻璃挡墙键合， 使所述玻璃盖板与所述玻璃基板具有一 体式结构， 所述玻璃盖板与所述 陷部形成一密闭容腔， 所述 OLED器件以 及密封层均位于所述密闭容腔内。
例如， 所述 OLED器件设置在所述凹陷部的底面上， 所述密封层填充满 所述密闭容腔内的其他空间； 例如， 沿凹陷部的底面指向玻璃盖板的方向， 所述密闭容腔中相对的两个侧壁之间的间距逐渐变大。
例如， 所述 OLED器件设置在所述玻璃盖板朝向所述凹陷部底面的一面 上， 所述密封层填充满所述密闭容腔内的其他空间； 例如， 沿凹陷部的底面 指向玻璃盖板的方向，所述密闭容腔中相对的两个侧壁之间的间距逐渐变大。
例如， 所述密封层为由硅油、 树脂或液晶制备的透明的密封层。
例如， 所述玻璃盖板背离所述 陷部底面的一面与所述玻璃基板的 陷 部的上沿平齐。
本发明的另一个方面还提供了一种上述 OLED器件的封装结构的封装方 法， 包括： 在玻璃基板上形成一凹陷部， 并制备 OLED器件、 向凹陷部内填 充密封材料以形成密封层、 将玻璃盖板盖在凹陷部的开口处， 将 OLED器件 以及密封层盖在凹陷部内； 向玻璃盖板的周边与凹陷部的侧壁之间的间隙处 填充玻璃粉料； 采用激光封装方法， 控制激光头沿着玻璃粉料扫描使玻璃粉 料熔融， 将玻璃基板与玻璃盖板键合成一体式结构， 使玻璃盖板与凹陷部形 成一密闭容腔。
例如， 在玻璃基板上形成一具有阶梯型结构的凹陷部， 且沿凹陷部底面 的宽度小于凹陷部开口的宽度； 在凹陷部底面上制备 OLED器件； 向凹陷部 内填充密封材料形成密封层；将玻璃盖板盖设在凹陷部侧壁具有的阶梯面上， 以将 OLED器件以及密封层盖在凹陷部内。
优选地， 在玻璃基板上制备一具有阶梯型结构的凹陷部， 且沿凹陷部底 面的宽度小于凹陷部开口的宽度， 向凹陷部内填充密封材料， 并在玻璃盖板 的一面制备 OLED器件，将玻璃盖板设置有 OLED器件的一面朝向凹陷部的 底面盖设在 陷部侧壁具有的阶梯面上， 并使密封材料形成密封层， 以将 OLED器件以及密封层盖在凹陷部内。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。 玻璃基板的凹陷部底面上时的结构示意图； 图 2a为本发明实施例提供的 OLED器件的封装结构中玻璃基板的结构 示意图；
图 2b为在图 2a所示结构的玻璃基板的凹陷部的底面上设置 OLED器件 的结构示意图；
图 2c为在图 2b所示结构的玻璃基板以及 OLED器件上形成密封层时的 结构示意图； 玻璃盖板朝向玻璃基板的 陷部底面的一面上的结构示意图； 陷部的一种结构示意图； 陷部的另一种结构示意图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。 玻璃基板的 W陷部底面上时的结构示意图； 图 2a 为本发明实施例提供的 OLED器件的封装结构中玻璃基板的结构示意图； 图 3为本发明实施例提供 的 OLED器件的封装结构中 OLED器件设置在玻璃盖板朝向玻璃基板的凹陷 部底面的一面上的结构示意图。
如图 1和图 3所示， 本实施例提供的 OLED器件的封装结构包括玻璃基 板 1、 玻璃盖板 2、 OLED器件 3、 密封层 4。
如图 2a所示， 玻璃基板 1具有凹陷部 11 , 玻璃盖板 2位于凹陷部 11的 开口处。 玻璃盖板 2的周边与玻璃基板 1之间通过玻璃粉料熔融而成的玻璃 挡墙 5键合在一起， 使玻璃盖板 2与玻璃基板 1具有一体式结构。 玻璃盖板 2与玻璃基板 1的凹陷部 11形成一密闭容腔， OLED器件 3以及密封层 4均 位于密闭容腔内。
上述 OLED器件的封装结构中， 玻璃盖板 2的周边通过由玻璃粉料熔融 而成的玻璃挡墙 5与玻璃基板 1键合在一起， 使玻璃盖板 2与玻璃盖板 1形 成一体式结构，而且使玻璃盖板 2与玻璃基板 1的 陷部 11配合形成一个密 闭容腔， 制备的 OLED器件 3和密封层 4位于密闭容腔内。
玻璃基板 1、 玻璃盖板 2以及玻璃挡墙 5实现了对 OLED器件 3的全玻 璃封装， 玻璃材料对水汽和氧气具有良好的阻隔性能， 进而能够防止封装结 构外的水汽和氧气进入密闭容腔内， 进而防止水汽和氧气进入 OLED器件 3 内， 延长 OLED器件 3的使用寿命。
因此， 本发明实施例提供的 OLED器件的封装结构能够防止水汽和氧气 进入 OLED器件内， 延长 OLED器件的使用寿命。
本发明实施例中提供的 OLED器件的封装结构中， OLED器件 3的设置 方式可以有多种方式。
方式一
请继续参考图 1 , OLED器件 3可以设置在玻璃基板 1的凹陷部 11的底 面上，而密封层 4填充满密闭容腔内的其他空间。这样，密封层 4能够对 OLED 器件 3的侧面以及 OLED器件 3背离凹陷部 11底面的一面进行更好的密封。
在方式一的基础上， 为了便于制备密封层 4, 使密封层 4能够更好的对 OLED器件 3的周边进行密封， 沿 陷部 11的底面指向玻璃盖板 2的方向， 密闭容腔中相对的两个侧壁之间的间距可以逐渐变大。
方式二
请继续参考图 3 , OLED器件 3还可以设置在玻璃盖板 2朝向凹陷部 11 底面的一面上， 密封层 4填充满密闭容腔内的其他空间。
密封层 4充满玻璃盖板 2与凹陷部 11装配形成的密闭容腔内的其他空 间，使密封层 4能够对 OLED器件 3的侧面以及 OLED器件 3背离玻璃盖板 2的一面进行更好的密封。
在方式二的基础上， 为了便于制备密封层 4, 沿凹陷部的底面指向玻璃 盖板的方向， 密闭容腔中相对的两个侧壁之间的间距可以逐渐变大。
例如， 上述各实施方式中提供的 OLED器件封装结构中， 上述密封层 4 为由硅油、 树脂或液晶制备的透明的密封层。 透明的密封层不会影响 OLED 器件发光时的出光效率， 能够提高 OLED器件的显示质量。 硅油、 树脂或液 晶的使用量可以根据计算得到。
为了提高 OLED器件的封装结构的美观性， 玻璃盖板 2背离 陷部 11 底面的一面与玻璃基板 1的 陷部 11的上沿平齐。
本发明实施例还提供了一种上述 OLED器件的封装结构的封装方法， 该 方法可以如下进行。
步骤 S601: 在玻璃基板上形成一凹陷部， 并制备 OLED器件、 向凹陷部 内填充密封材料以形成密封层、 将玻璃盖板盖在凹陷部的开口处， 将 OLED 器件以及密封层盖在凹陷部内。
步骤 S602:向玻璃盖板的周边与凹陷部的侧壁之间的间隙处填充玻璃粉 料。
步骤 S603: 采用激光封装方法， 例如用 PC控制激光头沿着玻璃粉料扫 描使玻璃粉料熔融， 将玻璃基板与玻璃盖板键合成一体式结构， 使玻璃盖板 与凹陷部形成一密闭容腔。
上述 OLED器件的封装结构的封装方法中， 步骤 S603中的激光封装方 法将步骤 S602 中填充在玻璃盖板的周边与凹陷部的侧壁之间的间隙处的玻 璃粉料熔融， 由此实现了玻璃盖板周边与玻璃基板之间的键合， 最终将玻璃 基板和玻璃盖板键合为一体式结构， 使玻璃盖板与玻璃基板的 陷部配合形 成与密闭容腔步骤 S601的装配位置使 OLED器件和密封层位于上述密闭容 腔中， 进而实现对 OLED器件的全玻璃封装。
步骤 S601的一个具体示例可如下进行。
如图 2a所示， 在玻璃基板 1上形成一具有阶梯型结构的凹陷部 11 , 且 沿凹陷部 11底面的宽度小于凹陷部开口的宽度； 如图 2b所示， 在凹陷部 11 的底面上制备 OLED器件 3; 如图 2c所示， 向凹陷部 11内填充密封材料形 成密封层 4; 然后， 将玻璃盖板 2盖在凹陷部 11侧壁具有的阶梯面上。
然后通过步骤 S602和步骤 S603最终得到如图 1所示的 OLED器件的封 装结构， 实现对 OLED器件 3的全玻璃封装。
步骤 S601的另一个具体示例可如下进行。
在玻璃基板上制备一具有阶梯型结构的凹陷部， 且沿凹陷部底面的宽度 小于凹陷部开口的宽度， 向凹陷部内填充密封材料， 并在玻璃盖板的一面制 备 OLED器件，将玻璃盖板设置有 OLED器件的一面朝向凹陷部的底面盖设 在凹陷部侧壁具有的阶梯面上， 并使密封材料形成密封层。
然后通过步骤 S602和步骤 S603得到如图 3所示的 OLED器件的封装结 构， 也可以实现对 OLED器件 3的全玻璃封装。
进一步地， 步骤 S601 的上述两个具体示例中， 在玻璃基板上形成的凹 陷部的形状不限于图 2a所示的形状， 还可以为图 4和图 5所示结构。
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定。

Claims

权利要求书
1、 一种 0LED器件的封装结构， 包括玻璃基板、 玻璃盖板、 OLED器 件、 密封层，
其中， 所述玻璃基板具有凹陷部， 所述玻璃盖板位于所述凹陷部的开口 处， 且所述玻璃盖板的周边与所述玻璃基板之间通过玻璃粉料熔融而成的玻 璃挡墙键合， 使所述玻璃盖板与所述玻璃基板具有一体式结构， 所述玻璃盖 板与所述凹陷部形成一密闭容腔， 所述 OLED器件以及密封层均位于所述密 闭容月空内。
2、 根据权利要求 1所述的封装结构， 其中， 所述 OLED器件设置在所 述凹陷部的底面上， 所述密封层填充满所述密闭容腔内的其他空间。
3、根据权利要求 2所述的封装结构， 其中， 沿凹陷部的底面指向玻璃盖 板的方向， 所述密闭容腔中相对的两个侧壁之间的间距逐渐变大。
4、 根据权利要求 1所述的封装结构， 其中， 所述 OLED器件设置在所 述玻璃盖板朝向所述凹陷部底面的一面上， 所述密封层填充满所述密闭容腔 内的其他空间。
5、根据权利要求 4所述的封装结构， 其中， 沿凹陷部的底面指向玻璃盖 板的方向， 所述密闭容腔中相对的两个侧壁之间的间距逐渐变大。
6、 根据权利要求 1~5任一项所述的封装结构， 其中， 所述密封层为由 硅油、 树脂或液晶制备的透明的密封层。
7、根据权利要求 6所述的封装结构， 其中， 所述玻璃盖板背离所述 陷 部底面的一面与所述玻璃基板的 陷部的上沿平齐。
8、 一种如权利要求 1所述的 OLED器件的封装结构的封装方法， 包括： 在玻璃基板上形成一凹陷部， 并制备 OLED器件、 向凹陷部内填充密封 材料以形成密封层、 将玻璃盖板盖在凹陷部的开口处， 将 OLED器件以及密 封层盖在凹陷部内；
向玻璃盖板的周边与 陷部的侧壁之间的间隙处填充玻璃粉料； 采用激光封装方法， 控制激光头沿着玻璃粉料扫描使玻璃粉料熔融， 将 玻璃基板与玻璃盖板键合成一体式结构， 使玻璃盖板与凹陷部形成一密闭容 腔。
9、根据权利要求 8所述的封装方法， 其中， 在所述玻璃基板上形成一具 有阶梯型结构的凹陷部， 且沿凹陷部底面的宽度小于凹陷部开口的宽度； 在 陷部底面上制备 OLED器件； 向 陷部内填充密封材料形成密封层； 将所 述玻璃盖板盖设在凹陷部侧壁具有的阶梯面上， 以将 OLED器件以及密封层 盖在凹陷部内。
10、 根据权利要求 8所述的封装方法， 其中， 在所述玻璃基板上制备一 具有阶梯型结构的凹陷部， 且沿凹陷部底面的宽度小于凹陷部开口的宽度， 向 陷部内填充密封材料， 并在玻璃盖板的一面制备 OLED器件， 将所述玻 璃盖板设置有 OLED器件的一面朝向凹陷部的底面盖设在凹陷部侧壁具有的 阶梯面上， 并使密封材料形成密封层， 以将 OLED器件以及密封层盖在凹陷 部内。
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