WO2015041182A1 - Attachment and lighting device - Google Patents

Attachment and lighting device Download PDF

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Publication number
WO2015041182A1
WO2015041182A1 PCT/JP2014/074296 JP2014074296W WO2015041182A1 WO 2015041182 A1 WO2015041182 A1 WO 2015041182A1 JP 2014074296 W JP2014074296 W JP 2014074296W WO 2015041182 A1 WO2015041182 A1 WO 2015041182A1
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WO
WIPO (PCT)
Prior art keywords
light source
support
semiconductor light
attachment
holding portions
Prior art date
Application number
PCT/JP2014/074296
Other languages
French (fr)
Japanese (ja)
Inventor
崇 松永
Original Assignee
株式会社小糸製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Priority to JP2015537906A priority Critical patent/JPWO2015041182A1/en
Publication of WO2015041182A1 publication Critical patent/WO2015041182A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/39—Attachment thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device

Definitions

  • the present invention relates to an attachment for fixing a semiconductor light source to a support. Moreover, this invention relates to an illuminating device provided with the said semiconductor light source and the said attachment.
  • a semiconductor light source including a semiconductor light emitting element such as a light emitting diode (LED) is known as a light source of a vehicular lamp as an example of a lighting device.
  • the semiconductor light source is fixed on a support such as a heat sink that dissipates heat generated by light emission.
  • a member called an attachment is used.
  • the attachment includes a conductive terminal. One end of the conductive terminal is in contact with a power feeding unit provided in the semiconductor light source. Electric power is supplied from the outside to the semiconductor light source through the conductive terminal and the power feeding unit (see, for example, Patent Document 1).
  • Cost reduction is required for semiconductor light sources mounted on lighting devices. It is an object of the present invention to provide an attachment that can use such a semiconductor light source, and thus to reduce the cost of a lighting device.
  • a first aspect that the present invention can take is an attachment for fixing a semiconductor light source to a support,
  • a frame having an opening through which light emitted from a semiconductor light source fixed to the support can pass, and fixed to the support;
  • At least three holding portions made of an insulating material formed at the edge of the opening; With Each of the at least three holding portions is configured to press a part of the semiconductor light source toward the support when the frame is fixed to the support.
  • an insulating film is formed so as to cover a conductive path formed on the surface of the semiconductor light source.
  • maintenance part consists of an insulating material, even if it does not cover a conductive path with an insulating film, a short circuit does not arise between holding
  • the holding portion can be maximized to ensure a high holding force.
  • the semiconductor light source is held by three or more holding portions, the holding force can be applied in a plane, and the heat radiation surface of the semiconductor light source can be reliably brought into contact with the support. Thereby, it is possible to improve the heat dissipation efficiency through the support.
  • a second aspect that the present invention can take is a lighting device, A support; A semiconductor light source disposed on the support; An attachment for fixing the semiconductor light source to the support; With The attachment is A frame having an opening through which light emitted from the semiconductor light source can pass and fixed to the support; At least three holding portions made of an insulating material formed at the edge of the opening; With Each of the at least three holding portions presses a part of the semiconductor light source toward the support.
  • each of the at least three holding portions may extend toward the inside of the opening, and may have a configuration in which the width on the distal end side is narrower than that on the proximal end side.
  • the holding portion since the holding portion is easily bent, the holding portion can be pressed against the semiconductor light source with an appropriate pressing force. Thereby, the maximum holding force can be secured by the holding portion having the minimum dimension. Therefore, the part cost of the attachment can be suppressed, and as a result, the cost of the lighting device including the attachment can be suppressed.
  • the frame body may include a first fixing portion and a second fixing portion that extend in a direction parallel to the first direction.
  • a first through hole through which a first fastening member for fastening the frame body to the support body is inserted is formed in the first fixing portion, and the frame body is attached to the second fixing portion.
  • a second through hole may be formed through which a second fastening member to be fastened to the support is inserted.
  • the at least three holding portions may be arranged so as to be line-symmetric with respect to a straight line connecting the centers of the first through hole and the second through hole.
  • the fastening force by the first fastening member and the second fastening member can be applied equally to each holding portion.
  • the maximum holding force can be secured by the holding portion having the minimum dimension. Therefore, the part cost of the attachment can be suppressed, and as a result, the cost of the lighting device including the attachment can be suppressed.
  • each of the at least three holding portions may be formed integrally with the frame body.
  • the number of parts can be reduced. Therefore, the part cost of the attachment can be suppressed, and as a result, the cost of the lighting device including the attachment can be suppressed.
  • FIG. 9 is a cross-sectional view taken along IX-IX in FIG.
  • FIG. 1 shows a support 10 provided in a lamp unit 1 (see FIG. 4) as an example of a lighting device.
  • the lamp unit 1 is equipped, for example, in a headlamp device mounted on a vehicle.
  • the support 10 includes a left support region 11 and a right support region 12.
  • a front positioning pin 13a and a rear positioning pin 13b are provided on the upper surface of the left support region 11 and extend upward.
  • a front positioning pin 14a and a rear positioning pin 14b are provided on the upper surface of the right support region 12 and extend upward.
  • a left light source mounting portion 15 is provided between the front positioning pin 13a and the rear positioning pin 13b in the left support region 11. From the upper surface of the left light source mounting portion 15, a left positioning pin 15a and a right positioning pin 15b extend upward.
  • a right light source mounting portion 16 is provided between the front positioning pin 14a and the rear positioning pin 14b in the right support region 12. From the upper surface of the right light source mounting portion 16, a left positioning pin 16a and a right positioning pin 16b extend upward.
  • a front screw hole 17a is formed in front of the front positioning pin 13a in the left support region 11.
  • a rear screw hole 17b is formed behind the rear positioning pin 13b in the left support region 11.
  • a front screw hole 18 a is formed in front of the front positioning pin 14 a in the right support region 12.
  • a rear screw hole 18b is formed behind the rear positioning pin 14b in the right support region 12.
  • a semiconductor light source 20 having the same configuration is mounted on the left light source mounting portion 15 in the left support region 11 and the right light source mounting portion 16 in the right support region 12, respectively. Details of the configuration of the semiconductor light source 20 and the mounting method on the left light source mounting portion 15 and the right light source mounting portion 16 will be described later.
  • the semiconductor light source 20 is fixed to the left light source mounting portion 15 by attaching the left attachment 30 to the left support region 11. Also, the semiconductor light source 20 is fixed to the right light source mounting portion 16 by attaching the right attachment 40 to the right support region 12. The details of the configuration of the left attachment 30 and the right attachment 40 and the mounting method to the left support region 11 and the right support region 12 will be described later.
  • the left reflector 50 is mounted on the left support area 11 and the right reflector 60 is mounted on the right support area 12, whereby the lamp unit 1 is configured.
  • the inner surface of the left reflector 50 is a reflecting surface 51.
  • the left reflector 50 is disposed so that the reflecting surface 51 faces the semiconductor light source 20 fixed by the left attachment 30.
  • the light emitted from the semiconductor light source 20 is reflected by the reflecting surface 51 and irradiated in a direction including the front of the semiconductor light source 20.
  • the inner surface of the right reflector 60 is a reflecting surface 61.
  • the right reflector 60 is disposed so that the reflecting surface 61 faces the semiconductor light source 20 fixed by the right attachment 40.
  • the light emitted from the semiconductor light source 20 is reflected by the reflecting surface 61 and irradiated in a direction including the front of the semiconductor light source 20.
  • a lens (not shown) may be disposed as necessary.
  • the reflected light passing through the lens is subjected to a predetermined orientation control.
  • the lamp unit 1 is mounted at an appropriate position in the vehicle. The light emitted from each semiconductor light source 20 illuminates a predetermined area in front of the lamp unit 1.
  • FIG. 5 is a perspective view showing an appearance of the left attachment 30 as seen from the right rear side.
  • the left attachment 30 includes a frame 31 made of an insulating material such as resin.
  • An opening 31a, a front positioning hole 31b, and a rear positioning hole 31c are formed in the frame 31.
  • the opening 31a, the front positioning hole 31b, and the rear positioning hole 31c penetrate the frame body 31 in the vertical direction.
  • the left side attachment 30 further includes a front side fixing piece 32 and a rear side fixing piece 33.
  • the front fixing piece 32 extends forward from the front end of the frame 31.
  • a front side fixing hole 32 a is formed in the front side fixing piece 32.
  • the front side fixing hole 32a penetrates the front side fixing piece 32 in the vertical direction.
  • the rear side fixing piece 33 extends rearward from the rear end portion of the frame body 31.
  • a rear side fixing hole 33 a is formed in the rear side fixing piece 33.
  • the rear side fixing hole 33a penetrates the rear side fixing piece 33 in the vertical direction.
  • the left attachment 30 further includes a connector portion 34.
  • the connector portion 34 is formed integrally with the right end portion of the frame body 31.
  • the connector portion 34 is formed with a connection hole 34a that opens rearward. As shown in FIG. 6B, connection terminals 34b and 34c are arranged inside the connection hole 34a.
  • the left attachment 30 further includes a left conductive terminal 35 and a right conductive terminal 36.
  • the left conductive terminal 35 and the right conductive terminal 36 are made of a conductive material such as copper, and are integrally formed with the frame 31 and the connector portion 34 by, for example, insert molding. A part of the left conductive terminal 35 and the right conductive terminal 36 is exposed in an opening 31 a formed in the frame 31. The remaining portions of the left conductive terminal 35 and the right conductive terminal 36 extend inside the frame 31 and are physically and electrically connected to connection terminals 34b and 34c provided on the connector portion 34, respectively.
  • FIG. 5B is an enlarged perspective view showing a portion of the right conductive terminal 36 exposed in the opening 31a.
  • the portion includes a base end portion 36a, an inclined portion 36b, and a pair of arm portions 36c.
  • the base end portion 36a is a portion that is sandwiched between molds in the process of the above-described insert molding. Since the base end portion 36a is a flat surface, the support state when sandwiched between the molds is stabilized. Thereby, stable molding quality can be maintained.
  • the width of the base end portion 36a is widened only on the right side at the front end portion to form a widened portion 36a1.
  • the inclined part 36b is a part extending continuously rearward and obliquely upward from the rear end of the base end part 36a.
  • the pair of arm portions 36c are portions that extend rearward continuously from the rear end of the inclined portion 36b.
  • Each of the pair of arm portions 36c includes a flat portion 36c1, an inclined portion 36c2, and a contact portion 36c3.
  • the flat portion 36c1 is a portion that continuously extends rearward from the rear end of the inclined portion 36b.
  • the inclined portion 36c2 is a portion that extends rearward and obliquely downward continuously from the rear end of the flat portion 36c1.
  • the contact portion 36c3 is a portion that is continuously formed at the rear end of the inclined portion 36c2.
  • the left conductive terminal 35 has a symmetrical shape with the right conductive terminal 36 in plan view. That is, the base end portion (the portion corresponding to the base end portion 36a) of the left conductive terminal 35 is widened only on the left side at the front end portion to form a widened portion (corresponding to the widened portion 36a1). Since the other configuration relating to the left conductive terminal 35 is substantially the same as that of the right conductive terminal 36, a detailed description thereof is omitted.
  • the base end portions of the left conductive terminal 35 and the right conductive terminal 36 are arranged at the front end edge 31a1 of the opening 31a. That is, the left conductive terminal 35 and the right conductive terminal 36 both extend rearward from the front end edge 31a1. Since each base end is widened in only one direction, the left conductive terminal 35 and the right conductive terminal 36 having a symmetrical shape can be arranged as close as possible. That is, it becomes possible to use the semiconductor light source 20 in which the distance between the left power supply unit 24 and the right power supply unit 25 is narrowed due to the demand for miniaturization.
  • the front side fixing piece 32 and the rear side fixing piece 33 extend in parallel with the direction in which the left conductive terminal 35 and the right conductive terminal 36 extend.
  • the front fixing hole 32 a of the front fixing piece 32 is disposed in front of the left conductive terminal 35 and the right conductive terminal 36.
  • the rear fixing hole 33 a of the rear fixing piece 33 is disposed behind the left conductive terminal 35 and the right conductive terminal 36.
  • the front side fixing hole 32a and the rear side fixing hole 33a are arranged so that a straight line L1 connecting the centers thereof extends between the left conductive terminal 35 and the right conductive terminal 36.
  • the front positioning hole 31b is arranged diagonally to the left of the opening 31a.
  • the rear positioning hole 31c is disposed diagonally to the right of the opening 31a. That is, the front positioning hole 31b and the rear positioning hole 31c are arranged so that a straight line L2 connecting their centers obliquely crosses the opening 31a.
  • the front positioning hole 31b is formed as a long hole whose longitudinal direction is the direction along the straight line L2.
  • the rear positioning hole 31c is formed as an ordinary round hole.
  • the right attachment 40 has a shape that is symmetrical to the left attachment 30. Since the other structure concerning the right attachment 40 is substantially the same as the left attachment 30, detailed description is omitted.
  • the semiconductor light source 20 includes a support part 21, a left light emitting element 22, a right light emitting element 23, a left power feeding part 24, and a right power feeding part 25.
  • the left light emitting element 22 and the right light emitting element 23 are, for example, white light emitting diodes (LEDs) each having a planar light emitting unit on the upper surface of the semiconductor light source 20.
  • the left power supply unit 24 and the right power supply unit 25 are contact points made of a conductive material.
  • the left power feeding unit 24 is electrically connected to the left light emitting element 22 through the left conductive path 26.
  • the left side light emitting element 22 and the right side light emitting element 23 are electrically connected.
  • the right light emitting element 23 is electrically connected to the right power supply unit 25 via the right conductive path 27.
  • the support portion 21 is a metal (copper or the like) substrate whose surface is treated with an insulating coating.
  • the support part 21 supports the left light emitting element 22, the right light emitting element 23, the left power feeding part 24, the right power feeding part 25, the left conductive path 26, and the right conductive path 27 on the insulating coating.
  • a notch 21 a is formed at the left end of the support portion 21.
  • a through hole 21 b is formed at the right end portion of the support portion 21. The notch 21a and the through hole 21b penetrate the support portion 21 in the vertical direction.
  • the semiconductor light source 20 is mounted on the left light source mounting portion 15 so that the left light emitting element 22, the right light emitting element 23, the left power feeding portion 24, and the right power feeding portion 25 face upward. Placed. At this time, the left positioning pin 15a and the right positioning pin 15b shown in FIG. 1 are inserted into the notch 21a and the through hole 21b, respectively, and the semiconductor light source 20 is positioned with respect to the left light source mounting portion 15.
  • the left attachment 30 is mounted from above the semiconductor light source 20 placed on the left light source mounting portion 15.
  • the front positioning pin 13a and the rear positioning pin 13b shown in FIG. 1 are inserted into the front positioning hole 31b and the rear positioning hole 31c, respectively, so that the left attachment 30 is positioned with respect to the support 10 (left support region 11). Is made.
  • the front side fixing screw 37 is inserted into the front side screw hole 17a shown in FIG. 1 through the front side fixing hole 32a of the front side fixing piece 32, and the rear side fixing screw 38 is connected to the rear side fixing screw 38.
  • the fixing piece 33 is inserted through the rear fixing hole 33a and screwed into the rear screw hole 17b shown in FIG. Thereby, the left attachment 30 is fixed with respect to the support body 10 (left support area
  • the left side connector 70 connected to a signal line for transmitting a signal from a light source control unit (not shown) is attached to the support 10.
  • the left connector 70 is fitted into the connection hole 34 a of the connector portion 34 included in the left attachment 30.
  • the signal line is electrically connected to the connection terminals 34b and 34c.
  • the left side light emitting element 22 and the right side light emitting element 23 of the semiconductor light source 20 are exposed upward through the opening 31a formed in the frame body 31 of the left attachment 30. That is, the frame 31 has a shape that allows light emitted from the semiconductor light source 20 to pass through the opening 31a.
  • the tips (contact portions 36c3) of the pair of arm portions 36c included in the right conductive terminal 36 are in contact with the upper surface of the right power supply portion 25.
  • the tip of the left conductive terminal 35 (the part corresponding to the contact portion 36 c 3) is in contact with the upper surface of the left power feeding unit 24.
  • a signal input via the left connector 70 is input to the left light emitting element 22 and the right light emitting element 23 via the left conductive terminal 35, the left power feeding unit 24, and the left conductive path 26.
  • the lighting control of the left light emitting element 22 and the right light emitting element 23 by the light source control unit is enabled.
  • the right light source mounting portion 16 is similarly positioned with respect to the right light source mounting portion 16 of the semiconductor light source 20 using the left positioning pin 16a and the right positioning pin 16b.
  • the right attachment 40 is positioned with respect to the support 10 (right support region 12) using the front positioning pin 14a and the rear positioning pin 14b.
  • the right attachment 40 is fixed to the support 10 (right support region 12) by screwing the front fixing screw 47 and the rear fixing screw 48 into the front screw hole 18a and the rear screw hole 18b, respectively. .
  • the right connector 80 is connected to the connector portion of the right attachment 40 (corresponding portion of the connector portion 34).
  • Other configurations relating to the relationship between the right attachment 40 and the semiconductor light source 20 mounted on the right light source mounting portion 16 are substantially the same as the relationship between the left attachment 30 and the semiconductor light source 20 mounted on the left light source mounting portion 15. Therefore, the detailed explanation is omitted.
  • the support 10 is formed of a material having high thermal conductivity such as aluminum. Thereby, the support body 10 functions as a heat sink and can efficiently dissipate the heat generated with the light emission of the semiconductor light source 20.
  • FIG. 8 shows four holding portions 31a2 to 31a5 at the edge of the opening 31a in the frame 31 of the left attachment 30.
  • Each of the holding portions 31a2 to 31a5 is made of an insulating material and covers a part of the support portion 21 of the semiconductor light source 20.
  • FIG. 9 shows a cross section taken along line IX-IX in FIG.
  • Each of the holding portions 31a2 to 31a5 abuts on the upper surface of the support portion 21, and presses the semiconductor light source 20 toward the left light source mounting portion 15 (support body 10) (only the holding portions 31a2 and 31a3 are shown in FIG. 9). Have been).
  • the upper surface of the support portion 21 is an insulating coating 21a.
  • an insulating film that further covers the left conductive path 26 and the right conductive path 27 formed on the insulating film 21a is formed.
  • the holding portions 31a2 to 31a5 are made of an insulating material, a short circuit occurs between the holding portions 31a2 to 31a5 without covering the left conductive path 26 and the right conductive path 27 with an insulating coating. There is no. Therefore, the semiconductor light source 20 based on the request
  • the holding portions 31a2 to 31a5 can be maximized in size to ensure a high holding force.
  • the semiconductor light source 20 is held by the four holding portions 31a2 to 31a5, the holding force can be applied in a plane, and the heat radiation surface of the semiconductor light source 20 can be reliably brought into contact with the support 10. . Thereby, it is possible to improve the heat dissipation efficiency through the support.
  • each of the holding portions 31a2 to 31a5 extends inwardly from the peripheral portion of the opening 31a formed in the frame body 31, and the width of the distal end side contacting the semiconductor light source 20 is the proximal end side. It is narrower than.
  • the holding portions 31a2 to 31a5 are easily bent, the holding portions 31a2 to 31a5 can be pressed against the semiconductor light source 20 with an appropriate pressing force. As a result, the maximum holding force can be secured by the holding portions 31a2 to 31a5 having the minimum dimensions. Therefore, the component cost of the left attachment 30 can be suppressed, and consequently the cost of the lamp unit 1 including the left attachment 30 can be suppressed.
  • the frame 31 includes a front side fixing piece 32 (an example of a first fixing part) and a rear side fixing piece 33 (an example of a second fixing part) extending in a direction parallel to the left conductive terminal 35 and the right conductive terminal 36.
  • the front side fixing piece 32 is formed with a front side fixing hole 32a (an example of a first through hole) through which a front side fixing screw 37 (an example of a first fastening member) for fastening the frame 31 to the support body 10 is inserted. .
  • the rear side fixing piece 33 is formed with a rear side fixing hole 33a (an example of a second through hole) through which a rear side fixing screw 38 (an example of a second fastening member) for fastening the frame 31 to the support body 10 is inserted.
  • a rear side fixing screw 38 an example of a second fastening member for fastening the frame 31 to the support body 10 is inserted.
  • the holding portions 31a2 to 31a5 are arranged so as to be symmetric with respect to a straight line L1 connecting the centers of the front side fixing hole 32a and the rear side fixing hole 33a.
  • the fastening force by the front side fixing screw 37 and the rear side fixing screw 38 can be applied equally to the holding portions 31a2 to 31a5.
  • the maximum holding force can be secured by the holding portions 31a2 to 31a5 having the minimum dimensions. Therefore, the component cost of the left attachment 30 can be suppressed, and consequently the cost of the lamp unit 1 including the left attachment 30 can be suppressed.
  • each holding portion 31a2 to 31a5 is formed integrally with the frame 31, the number of parts can be reduced. Therefore, the component cost of the left attachment 30 can be suppressed, and consequently the cost of the lamp unit 1 including the left attachment 30 can be suppressed.
  • the semiconductor light source 20 is not limited to a white light emitting diode.
  • a light emitting diode that emits light of a predetermined color may be used, or a light source including a semiconductor light emitting element such as a laser diode or an organic EL element may be used.
  • the four holding portions 31a2 to 31a5 are formed on the frame body 31.
  • the number of holding parts formed in the frame 31 can be arbitrarily determined as three or more. If there are at least three pressing points, the pressing force against the semiconductor light source 20 can be applied in a surface manner. Thereby, the semiconductor light source 20 can be stably held with respect to the support 10.
  • each holding part in the case of forming three holding parts is arbitrary.
  • the stability of the holding force is further improved by arranging the three holding portions so as to be line symmetric with respect to the straight line L1 connecting the centers of the front side fixing hole 32a and the rear side fixing hole 33a.
  • one of the three holding portions may be arranged on the straight line L1, and the remaining two may be arranged at positions that are line-symmetric with respect to the left and right of the straight line L1.
  • each of the holding portions 31a2 to 31a5 is in contact with the upper surface of the support portion 21 in the semiconductor light source 20.
  • the locations where the holding portions 31 a 2 to 31 a 5 abut can be appropriately determined according to the specifications of the semiconductor light source 20.
  • the left attachment 30 and the right attachment 40 do not necessarily have a symmetrical shape.
  • a configuration in which the left and right semiconductor light sources 20 are fixed to the support 10 using attachments having the same shape may be employed.
  • the left attachment 30 and the right attachment 40 do not necessarily need to be fastened to the support using the front fixing screws 37 and 47 and the rear fixing screws 38 and 48. As long as fastening to the support 10 is possible, an appropriate member can be used.
  • the number of semiconductor light sources 20 included in the lamp unit 1 is not limited to two. A configuration including a single semiconductor light source 20 or three or more semiconductor light sources 20 may be employed.
  • the lamp unit 1 does not necessarily need to be installed in a lighting device mounted on a vehicle.
  • the lamp unit 1 can also be installed in a lighting device such as a large flashlight.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

In this attachment (30), a semiconductor light source (20) is affixed to a support body (10). The attachment (30) is provided with a frame body (31) and holding sections (31a2-31a5). The frame body (31) has an opening (31a) through which light exiting from the semiconductor light source (20) affixed to the support body (10) can pass. The holding sections (31a2-31a5) are formed at the rim of the opening (31a), and comprise an insulating material. When the frame body (31) is affixed to the support body (10), each of the holding sections (31a2-31a5) presses a portion of the semiconductor light source (20) towards the support body (10).

Description

アタッチメントおよび照明装置Attachment and lighting device
　本発明は、半導体光源を支持体に固定するアタッチメントに関する。また本発明は、当該半導体光源と当該アタッチメントを備える照明装置に関する。 The present invention relates to an attachment for fixing a semiconductor light source to a support. Moreover, this invention relates to an illuminating device provided with the said semiconductor light source and the said attachment.
　照明装置の一例としての車両用灯具の光源として、発光ダイオード（ＬＥＤ）などの半導体発光素子を含む半導体光源が知られている。半導体光源は、発光に伴い発生する熱を放散するヒートシンクなどの支持体上に固定される。固定の際には、アタッチメントと呼ばれる部材が用いられる。アタッチメントは、導電端子を備えている。導電端子の一端は、半導体光源が備える給電部と接触する。導電端子と給電部を通じて、外部より半導体光源へ電力が供給される（例えば、特許文献１を参照）。 2. Description of the Related Art A semiconductor light source including a semiconductor light emitting element such as a light emitting diode (LED) is known as a light source of a vehicular lamp as an example of a lighting device. The semiconductor light source is fixed on a support such as a heat sink that dissipates heat generated by light emission. In fixing, a member called an attachment is used. The attachment includes a conductive terminal. One end of the conductive terminal is in contact with a power feeding unit provided in the semiconductor light source. Electric power is supplied from the outside to the semiconductor light source through the conductive terminal and the power feeding unit (see, for example, Patent Document 1).
日本国特許出願公開２０１０－１９２１３９号公報Japanese Patent Application Publication No. 2010-192139
　照明装置に搭載される半導体光源にはコスト抑制が求められている。本発明は、そのような半導体光源を用いることが可能なアタッチメントを提供し、ひいては照明装置のコスト抑制を可能とすることを目的とする。 Cost reduction is required for semiconductor light sources mounted on lighting devices. It is an object of the present invention to provide an attachment that can use such a semiconductor light source, and thus to reduce the cost of a lighting device.
　上記の目的を達成するために、本発明がとりうる第１の態様は、半導体光源を支持体に固定するアタッチメントであって、
　前記支持体に固定された半導体光源から出射された光が通過可能な開口を有し、前記支持体に固定される枠体と、
　前記開口の縁に形成され、絶縁性材料からなる少なくとも３つの保持部と、
を備えており、
　前記少なくとも３つの保持部の各々は、前記枠体が前記支持体に固定されるとき、前記半導体光源の一部を前記支持体に向けて押圧する構成とされている。 In order to achieve the above object, a first aspect that the present invention can take is an attachment for fixing a semiconductor light source to a support,
A frame having an opening through which light emitted from a semiconductor light source fixed to the support can pass, and fixed to the support;
At least three holding portions made of an insulating material formed at the edge of the opening;
With
Each of the at least three holding portions is configured to press a part of the semiconductor light source toward the support when the frame is fixed to the support.
　一般的には、半導体光源の表面に形成された導電経路を覆うように絶縁性被膜が形成される。しかしながら、光源の低コスト化を志向した場合、そのような絶縁性被膜の形成を省略したいというニーズがある。上記の構成によれば、保持部は絶縁性材料からなるため、導電経路を絶縁性被膜で覆わずとも保持部との間に短絡が生ずることがない。したがって、低コスト化の要求に基づいた半導体光源を用いることができ、ひいては当該半導体光源を備える照明装置のコストを抑制できる。 Generally, an insulating film is formed so as to cover a conductive path formed on the surface of the semiconductor light source. However, when it is intended to reduce the cost of the light source, there is a need to omit the formation of such an insulating coating. According to said structure, since a holding | maintenance part consists of an insulating material, even if it does not cover a conductive path with an insulating film, a short circuit does not arise between holding | maintenance parts. Therefore, a semiconductor light source based on a demand for cost reduction can be used, and as a result, the cost of an illumination device including the semiconductor light source can be suppressed.
　また半導体光源の表面に形成された導電経路と保持部との間に短絡が生ずることがないため、保持部の寸法を最大限大きくして高い保持力を確保できる。特に３つ以上の保持部で半導体光源を保持するため、保持力を面的に作用させることが可能となり、半導体光源の放熱面を支持体に対して確実に接触させることができる。これにより支持体を通じた放熱効率を高めることが可能である。 In addition, since a short circuit does not occur between the conductive path formed on the surface of the semiconductor light source and the holding portion, the holding portion can be maximized to ensure a high holding force. In particular, since the semiconductor light source is held by three or more holding portions, the holding force can be applied in a plane, and the heat radiation surface of the semiconductor light source can be reliably brought into contact with the support. Thereby, it is possible to improve the heat dissipation efficiency through the support.
　したがって、上記の目的を達成するために本発明がとりうる第２の態様は、照明装置であって、
　支持体と、
　前記支持体上に配置された半導体光源と、
　前記半導体光源を前記支持体に固定するアタッチメントと、
を備えており、
　前記アタッチメントは、
　　前記半導体光源から出射された光が通過可能な開口を有し、前記支持体に固定される枠体と、
　　前記開口の縁に形成され、絶縁性材料からなる少なくとも３つの保持部と、
を備えており、
　前記少なくとも３つの保持部の各々は、前記半導体光源の一部を前記支持体に向けて押圧している。 Therefore, in order to achieve the above object, a second aspect that the present invention can take is a lighting device,
A support;
A semiconductor light source disposed on the support;
An attachment for fixing the semiconductor light source to the support;
With
The attachment is
A frame having an opening through which light emitted from the semiconductor light source can pass and fixed to the support;
At least three holding portions made of an insulating material formed at the edge of the opening;
With
Each of the at least three holding portions presses a part of the semiconductor light source toward the support.
　上記のアタッチメントにおいて、前記少なくとも３つの保持部の各々は、前記開口の内側に向かって延びており、先端側の幅が基端側よりも狭くなっている構成とされうる。 In the attachment described above, each of the at least three holding portions may extend toward the inside of the opening, and may have a configuration in which the width on the distal end side is narrower than that on the proximal end side.
　このような構成によれば、保持部が撓みやすくなるため、適度の押圧力で保持部が半導体光源に対して圧接されうる。これにより、最小限の寸法を有する保持部で最大限の保持力を確保できる。したがって、アタッチメントの部品コストを抑制でき、ひいては当該アタッチメントを備える照明装置のコストを抑制できる。 According to such a configuration, since the holding portion is easily bent, the holding portion can be pressed against the semiconductor light source with an appropriate pressing force. Thereby, the maximum holding force can be secured by the holding portion having the minimum dimension. Therefore, the part cost of the attachment can be suppressed, and as a result, the cost of the lighting device including the attachment can be suppressed.
　上記のアタッチメントにおいて、前記枠体は、それぞれ前記第１方向に平行な向きに延びる第１固定部と第２固定部を備える構成とされうる。この場合、前記第１固定部には、前記枠体を前記支持体に締結する第１締結部材が挿通される第１貫通孔が形成され、前記第２固定部には、前記枠体を前記支持体に締結する第２締結部材が挿通される第２貫通孔が形成される構成とされうる。さらに前記少なくとも３つの保持部は、前記第１貫通孔と前記第２貫通孔の中心同士を結ぶ直線に対して線対称となるように配置されている構成とされうる。 In the above attachment, the frame body may include a first fixing portion and a second fixing portion that extend in a direction parallel to the first direction. In this case, a first through hole through which a first fastening member for fastening the frame body to the support body is inserted is formed in the first fixing portion, and the frame body is attached to the second fixing portion. A second through hole may be formed through which a second fastening member to be fastened to the support is inserted. Further, the at least three holding portions may be arranged so as to be line-symmetric with respect to a straight line connecting the centers of the first through hole and the second through hole.
　このような構成によれば、第１締結部材と第２締結部材による締結力を、各保持部に等しく作用させることができる。これにより、最小限の寸法を有する保持部で最大限の保持力を確保できる。したがって、アタッチメントの部品コストを抑制でき、ひいては当該アタッチメントを備える照明装置のコストを抑制できる。 According to such a configuration, the fastening force by the first fastening member and the second fastening member can be applied equally to each holding portion. Thereby, the maximum holding force can be secured by the holding portion having the minimum dimension. Therefore, the part cost of the attachment can be suppressed, and as a result, the cost of the lighting device including the attachment can be suppressed.
　上記のアタッチメントにおいて、前記少なくとも３つの保持部の各々は、前記枠体と一体に成形されている構成とされうる。 In the above attachment, each of the at least three holding portions may be formed integrally with the frame body.
　このような構成によれば、部品点数の削減が可能である。したがって、アタッチメントの部品コストを抑制でき、ひいては当該アタッチメントを備える照明装置のコストを抑制できる。 According to such a configuration, the number of parts can be reduced. Therefore, the part cost of the attachment can be suppressed, and as a result, the cost of the lighting device including the attachment can be suppressed.
一実施形態に係る灯具ユニットが備える支持体を示す斜視図である。It is a perspective view which shows the support body with which the lamp unit which concerns on one Embodiment is provided. 上記の支持体に半導体光源が載置された状態を示す斜視図である。It is a perspective view which shows the state by which the semiconductor light source was mounted in said support body. 上記の支持体にアタッチメントが装着された状態を示す斜視図である。It is a perspective view which shows the state with which the attachment was mounted | worn with said support body. 上記の支持体にリフレクタが装着された状態を示す斜視図である。It is a perspective view which shows the state with which the reflector was mounted | worn with said support body. 上記のアタッチメントの構成を示す斜視図である。It is a perspective view which shows the structure of said attachment. 上記のアタッチメントの構成を示す平面図および背面図である。It is the top view and back view which show the structure of said attachment. 上記のアタッチメントと半導体光源の位置関係を示す平面図である。It is a top view which shows the positional relationship of said attachment and a semiconductor light source. 上記のアタッチメントが備える保持部の形状を説明する平面図である。It is a top view explaining the shape of the holding | maintenance part with which said attachment is equipped. 図８におけるＩＸ－ＩＸに沿う断面図である。FIG. 9 is a cross-sectional view taken along IX-IX in FIG.
　添付の図面を参照しつつ本発明に係る実施形態の例について以下詳細に説明する。なお以下の説明に用いる各図面では、各部材を認識可能な大きさとするために縮尺を適宜変更している。また以降の説明に用いる「右」および「左」は、運転席から見た左右の方向を示している。 Examples of embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. In each drawing used in the following description, the scale is appropriately changed to make each member a recognizable size. Further, “right” and “left” used in the following description indicate the left and right directions viewed from the driver's seat.
　図１は、照明装置の一例としての灯具ユニット１（図４参照）が備える支持体１０を示している。灯具ユニット１は、例えば、車両に搭載される前照灯装置に装備される。支持体１０は、左側支持領域１１と右側支持領域１２を含んでいる。左側支持領域１１の上面には、前側位置決めピン１３ａと後側位置決めピン１３ｂが設けられ、上方に延びている。右側支持領域１２の上面には、前側位置決めピン１４ａと後側位置決めピン１４ｂが設けられ、上方に延びている。 FIG. 1 shows a support 10 provided in a lamp unit 1 (see FIG. 4) as an example of a lighting device. The lamp unit 1 is equipped, for example, in a headlamp device mounted on a vehicle. The support 10 includes a left support region 11 and a right support region 12. A front positioning pin 13a and a rear positioning pin 13b are provided on the upper surface of the left support region 11 and extend upward. A front positioning pin 14a and a rear positioning pin 14b are provided on the upper surface of the right support region 12 and extend upward.
　左側支持領域１１における前側位置決めピン１３ａと後側位置決めピン１３ｂの間には、左側光源搭載部１５が設けられている。左側光源搭載部１５の上面からは、左側位置決めピン１５ａと右側位置決めピン１５ｂが上方に延びている。右側支持領域１２における前側位置決めピン１４ａと後側位置決めピン１４ｂの間には、右側光源搭載部１６が設けられている。右側光源搭載部１６の上面からは、左側位置決めピン１６ａと右側位置決めピン１６ｂが上方に延びている。 A left light source mounting portion 15 is provided between the front positioning pin 13a and the rear positioning pin 13b in the left support region 11. From the upper surface of the left light source mounting portion 15, a left positioning pin 15a and a right positioning pin 15b extend upward. A right light source mounting portion 16 is provided between the front positioning pin 14a and the rear positioning pin 14b in the right support region 12. From the upper surface of the right light source mounting portion 16, a left positioning pin 16a and a right positioning pin 16b extend upward.
　左側支持領域１１における前側位置決めピン１３ａの前方には、前側ねじ孔１７ａが形成されている。左側支持領域１１における後側位置決めピン１３ｂの後方には、後側ねじ孔１７ｂが形成されている。右側支持領域１２における前側位置決めピン１４ａの前方には、前側ねじ孔１８ａが形成されている。右側支持領域１２における後側位置決めピン１４ｂの後方には、後側ねじ孔１８ｂが形成されている。 A front screw hole 17a is formed in front of the front positioning pin 13a in the left support region 11. A rear screw hole 17b is formed behind the rear positioning pin 13b in the left support region 11. A front screw hole 18 a is formed in front of the front positioning pin 14 a in the right support region 12. A rear screw hole 18b is formed behind the rear positioning pin 14b in the right support region 12.
　図２に示すように、左側支持領域１１における左側光源搭載部１５と右側支持領域１２における右側光源搭載部１６には、同一の構成を有する半導体光源２０がそれぞれ搭載される。半導体光源２０の構成および左側光源搭載部１５と右側光源搭載部１６への搭載法の詳細については、後述する。 As shown in FIG. 2, a semiconductor light source 20 having the same configuration is mounted on the left light source mounting portion 15 in the left support region 11 and the right light source mounting portion 16 in the right support region 12, respectively. Details of the configuration of the semiconductor light source 20 and the mounting method on the left light source mounting portion 15 and the right light source mounting portion 16 will be described later.
　図３に示すように、左側アタッチメント３０が左側支持領域１１に装着されることにより、半導体光源２０が左側光源搭載部１５に固定される。また、右側アタッチメント４０が右側支持領域１２に装着されることにより、半導体光源２０が右側光源搭載部１６に固定される。左側アタッチメント３０と右側アタッチメント４０の構成、および左側支持領域１１と右側支持領域１２への装着法の詳細については後述する。 As shown in FIG. 3, the semiconductor light source 20 is fixed to the left light source mounting portion 15 by attaching the left attachment 30 to the left support region 11. Also, the semiconductor light source 20 is fixed to the right light source mounting portion 16 by attaching the right attachment 40 to the right support region 12. The details of the configuration of the left attachment 30 and the right attachment 40 and the mounting method to the left support region 11 and the right support region 12 will be described later.
　図４に示すように、左側リフレクタ５０が左側支持領域１１に装着され、右側リフレクタ６０が右側支持領域１２に装着されることにより、灯具ユニット１が構成される。 As shown in FIG. 4, the left reflector 50 is mounted on the left support area 11 and the right reflector 60 is mounted on the right support area 12, whereby the lamp unit 1 is configured.
　左側リフレクタ５０の内面は、反射面５１とされている。左側リフレクタ５０は、反射面５１が左側アタッチメント３０により固定された半導体光源２０に対向するように配置される。当該半導体光源２０から出射された光は、反射面５１により反射されて当該半導体光源２０の前方を含む方向へ照射される。右側リフレクタ６０の内面は、反射面６１とされている。右側リフレクタ６０は、反射面６１が右側アタッチメント４０により固定された半導体光源２０に対向するように配置される。当該半導体光源２０から出射された光は、反射面６１により反射されて当該半導体光源２０の前方を含む方向へ照射される。 The inner surface of the left reflector 50 is a reflecting surface 51. The left reflector 50 is disposed so that the reflecting surface 51 faces the semiconductor light source 20 fixed by the left attachment 30. The light emitted from the semiconductor light source 20 is reflected by the reflecting surface 51 and irradiated in a direction including the front of the semiconductor light source 20. The inner surface of the right reflector 60 is a reflecting surface 61. The right reflector 60 is disposed so that the reflecting surface 61 faces the semiconductor light source 20 fixed by the right attachment 40. The light emitted from the semiconductor light source 20 is reflected by the reflecting surface 61 and irradiated in a direction including the front of the semiconductor light source 20.
　左側リフレクタ５０と右側リフレクタ６０の前方には、それぞれ必要に応じて図示しないレンズが配置されうる。レンズを通過する反射光は、所定の配向制御を受ける。灯具ユニット１は、車両における適宜の位置に搭載される。各半導体光源２０から出射された光は、灯具ユニット１の前方における所定の領域を照明する。 In front of the left reflector 50 and the right reflector 60, a lens (not shown) may be disposed as necessary. The reflected light passing through the lens is subjected to a predetermined orientation control. The lamp unit 1 is mounted at an appropriate position in the vehicle. The light emitted from each semiconductor light source 20 illuminates a predetermined area in front of the lamp unit 1.
　図５の（ａ）は、左側アタッチメント３０を右斜め後方から見た外観を示す斜視図である。左側アタッチメント３０は、樹脂などの絶縁性材料からなる枠体３１を備えている。枠体３１には、開口３１ａ、前側位置決め孔３１ｂ、および後側位置決め孔３１ｃが形成されている。開口３１ａ、前側位置決め孔３１ｂ、および後側位置決め孔３１ｃは、それぞれ枠体３１を上下方向に貫通している。 (A) of FIG. 5 is a perspective view showing an appearance of the left attachment 30 as seen from the right rear side. The left attachment 30 includes a frame 31 made of an insulating material such as resin. An opening 31a, a front positioning hole 31b, and a rear positioning hole 31c are formed in the frame 31. The opening 31a, the front positioning hole 31b, and the rear positioning hole 31c penetrate the frame body 31 in the vertical direction.
　左側アタッチメント３０は、前側固定片３２と後側固定片３３をさらに備えている。前側固定片３２は、枠体３１の前端部より前方に延びている。前側固定片３２には前側固定孔３２ａが形成されている。前側固定孔３２ａは、前側固定片３２を上下方向に貫通している。後側固定片３３は、枠体３１の後端部より後方に延びている。後側固定片３３には後側固定孔３３ａが形成されている。後側固定孔３３ａは、後側固定片３３を上下方向に貫通している。 The left side attachment 30 further includes a front side fixing piece 32 and a rear side fixing piece 33. The front fixing piece 32 extends forward from the front end of the frame 31. A front side fixing hole 32 a is formed in the front side fixing piece 32. The front side fixing hole 32a penetrates the front side fixing piece 32 in the vertical direction. The rear side fixing piece 33 extends rearward from the rear end portion of the frame body 31. A rear side fixing hole 33 a is formed in the rear side fixing piece 33. The rear side fixing hole 33a penetrates the rear side fixing piece 33 in the vertical direction.
　左側アタッチメント３０は、コネクタ部３４をさらに備えている。コネクタ部３４は、枠体３１の右端部と一体に成形されている。コネクタ部３４には、後方に開口する接続孔３４ａが形成されている。図６の（ｂ）に示すように、接続孔３４ａの内部には、接続端子３４ｂ、３４ｃが配置されている。 The left attachment 30 further includes a connector portion 34. The connector portion 34 is formed integrally with the right end portion of the frame body 31. The connector portion 34 is formed with a connection hole 34a that opens rearward. As shown in FIG. 6B, connection terminals 34b and 34c are arranged inside the connection hole 34a.
　図５の（ａ）に示すように、左側アタッチメント３０は、左側導電端子３５と右側導電端子３６をさらに備えている。左側導電端子３５と右側導電端子３６は、銅などの導電性材料からなり、例えばインサート成型により、枠体３１およびコネクタ部３４と一体成型されている。左側導電端子３５と右側導電端子３６の一部は、枠体３１に形成された開口３１ａ内に露出している。左側導電端子３５と右側導電端子３６の残りの部分は、枠体３１内部を延び、それぞれコネクタ部３４に設けられた接続端子３４ｂ、３４ｃと物理的および電気的に接続されている。 As shown in FIG. 5A, the left attachment 30 further includes a left conductive terminal 35 and a right conductive terminal 36. The left conductive terminal 35 and the right conductive terminal 36 are made of a conductive material such as copper, and are integrally formed with the frame 31 and the connector portion 34 by, for example, insert molding. A part of the left conductive terminal 35 and the right conductive terminal 36 is exposed in an opening 31 a formed in the frame 31. The remaining portions of the left conductive terminal 35 and the right conductive terminal 36 extend inside the frame 31 and are physically and electrically connected to connection terminals 34b and 34c provided on the connector portion 34, respectively.
　図５の（ｂ）は、右側導電端子３６における開口３１ａ内に露出している部分を拡大して示す斜視図である。当該部分は、基端部３６ａ、傾斜部３６ｂ、一対の腕部３６ｃを有している。 FIG. 5B is an enlarged perspective view showing a portion of the right conductive terminal 36 exposed in the opening 31a. The portion includes a base end portion 36a, an inclined portion 36b, and a pair of arm portions 36c.
　基端部３６ａは、上述のインサート成型が行なわれる過程で金型に挟まれる部位である。基端部３６ａは平坦面とされているため、金型に挟まれる際の支持状態が安定する。これにより安定した成形品質を維持できる。基端部３６ａの幅は、その前端部において右側のみに広げられて拡幅部３６ａ１を形成している。 The base end portion 36a is a portion that is sandwiched between molds in the process of the above-described insert molding. Since the base end portion 36a is a flat surface, the support state when sandwiched between the molds is stabilized. Thereby, stable molding quality can be maintained. The width of the base end portion 36a is widened only on the right side at the front end portion to form a widened portion 36a1.
　傾斜部３６ｂは、基端部３６ａの後端より連続して後方かつ斜め上方に延びる部位である。一対の腕部３６ｃは、傾斜部３６ｂの後端より連続して後方に延びる部位である。一対の腕部３６ｃは、それぞれ、平坦部３６ｃ１、傾斜部３６ｃ２、および接点部３６ｃ３を有している。平坦部３６ｃ１は、傾斜部３６ｂの後端より連続して後方に延びる部位である。傾斜部３６ｃ２は、平坦部３６ｃ１の後端より連続して後方かつ斜め下方に延びる部位である。接点部３６ｃ３は、傾斜部３６ｃ２の後端に連続して形成されている部位である。このような形状を有することにより、一対の腕部３６ｃは、上下方向にある程度の変位が可能な程度の弾性を有している。 The inclined part 36b is a part extending continuously rearward and obliquely upward from the rear end of the base end part 36a. The pair of arm portions 36c are portions that extend rearward continuously from the rear end of the inclined portion 36b. Each of the pair of arm portions 36c includes a flat portion 36c1, an inclined portion 36c2, and a contact portion 36c3. The flat portion 36c1 is a portion that continuously extends rearward from the rear end of the inclined portion 36b. The inclined portion 36c2 is a portion that extends rearward and obliquely downward continuously from the rear end of the flat portion 36c1. The contact portion 36c3 is a portion that is continuously formed at the rear end of the inclined portion 36c2. By having such a shape, the pair of arm portions 36c have elasticity that can be displaced to some extent in the vertical direction.
　図６の（ａ）に示すように、左側導電端子３５は、平面視で右側導電端子３６と左右対称の形状を有している。すなわち、左側導電端子３５の基端部（基端部３６ａに対応する部分）は、その前端部において左側のみに拡幅されて拡幅部（拡幅部３６ａ１に対応）を形成している。左側導電端子３５に係るそれ以外の構成は、右側導電端子３６と実質的に同一であるため、詳細な説明は割愛する。 As shown in FIG. 6A, the left conductive terminal 35 has a symmetrical shape with the right conductive terminal 36 in plan view. That is, the base end portion (the portion corresponding to the base end portion 36a) of the left conductive terminal 35 is widened only on the left side at the front end portion to form a widened portion (corresponding to the widened portion 36a1). Since the other configuration relating to the left conductive terminal 35 is substantially the same as that of the right conductive terminal 36, a detailed description thereof is omitted.
　左側導電端子３５と右側導電端子３６の各基端部は、開口３１ａの前端縁３１ａ１に配置されている。すなわち、左側導電端子３５と右側導電端子３６は、ともに前端縁３１ａ１より後方に延びている。各基端部は、それぞれ一方向のみに拡幅されているため、左右対称の形状を有する左側導電端子３５と右側導電端子３６を、可及的に接近させて配置できる。すなわち、小型化の要請により左側給電部２４と右側給電部２５の間隔が狭められた半導体光源２０を用いることが可能となる。 The base end portions of the left conductive terminal 35 and the right conductive terminal 36 are arranged at the front end edge 31a1 of the opening 31a. That is, the left conductive terminal 35 and the right conductive terminal 36 both extend rearward from the front end edge 31a1. Since each base end is widened in only one direction, the left conductive terminal 35 and the right conductive terminal 36 having a symmetrical shape can be arranged as close as possible. That is, it becomes possible to use the semiconductor light source 20 in which the distance between the left power supply unit 24 and the right power supply unit 25 is narrowed due to the demand for miniaturization.
　前側固定片３２と後側固定片３３は、左側導電端子３５と右側導電端子３６が延びる向きと平行に延びている。前側固定片３２の前側固定孔３２ａは、左側導電端子３５と右側導電端子３６の前方に配置されている。後側固定片３３の後側固定孔３３ａは、左側導電端子３５と右側導電端子３６の後方に配置されている。前側固定孔３２ａと後側固定孔３３ａは、それらの中心同士を結ぶ直線Ｌ１が左側導電端子３５と右側導電端子３６の間を延びるように配置されている。 The front side fixing piece 32 and the rear side fixing piece 33 extend in parallel with the direction in which the left conductive terminal 35 and the right conductive terminal 36 extend. The front fixing hole 32 a of the front fixing piece 32 is disposed in front of the left conductive terminal 35 and the right conductive terminal 36. The rear fixing hole 33 a of the rear fixing piece 33 is disposed behind the left conductive terminal 35 and the right conductive terminal 36. The front side fixing hole 32a and the rear side fixing hole 33a are arranged so that a straight line L1 connecting the centers thereof extends between the left conductive terminal 35 and the right conductive terminal 36.
　前側位置決め孔３１ｂは、開口３１ａの左斜め前方に配置されている。後側位置決め孔３１ｃは、開口３１ａの右斜め後方に配置されている。すなわち、前側位置決め孔３１ｂと後側位置決め孔３１ｃは、それらの中心同士を結ぶ直線Ｌ２が開口３１ａを斜めに横切るように配置されている。なお前側位置決め孔３１ｂは、当該直線Ｌ２に沿う向きを長手方向とする長孔として形成されている。後側位置決め孔３１ｃは、普通の丸孔として形成されている。 The front positioning hole 31b is arranged diagonally to the left of the opening 31a. The rear positioning hole 31c is disposed diagonally to the right of the opening 31a. That is, the front positioning hole 31b and the rear positioning hole 31c are arranged so that a straight line L2 connecting their centers obliquely crosses the opening 31a. The front positioning hole 31b is formed as a long hole whose longitudinal direction is the direction along the straight line L2. The rear positioning hole 31c is formed as an ordinary round hole.
　図３に示すように、右側アタッチメント４０は、左側アタッチメント３０と左右対称の形状を有している。右側アタッチメント４０に係るそれ以外の構成は、左側アタッチメント３０と実質的に同一であるため、詳細な説明は割愛する。 As shown in FIG. 3, the right attachment 40 has a shape that is symmetrical to the left attachment 30. Since the other structure concerning the right attachment 40 is substantially the same as the left attachment 30, detailed description is omitted.
　次に図７を参照しつつ、左側アタッチメント３０を用いて半導体光源２０を左側光源搭載部１５に固定する方法について詳細に説明する。 Next, a method for fixing the semiconductor light source 20 to the left light source mounting portion 15 using the left attachment 30 will be described in detail with reference to FIG.
　半導体光源２０は、支持部２１、左側発光素子２２、右側発光素子２３、左側給電部２４、および右側給電部２５を備えている。左側発光素子２２と右側発光素子２３は、例えば、それぞれ半導体光源２０の上面に平面発光部を有する白色発光ダイオード（ＬＥＤ）である。左側給電部２４と右側給電部２５は、それぞれ導電性材料からなる接点である。左側給電部２４は、左側導電経路２６を介して左側発光素子２２と電気的に接続されている。左側発光素子２２と右側発光素子２３は、電気的に接続されている。右側発光素子２３は、右側導電経路２７を介して右側給電部２５と電気的に接続されている。 The semiconductor light source 20 includes a support part 21, a left light emitting element 22, a right light emitting element 23, a left power feeding part 24, and a right power feeding part 25. The left light emitting element 22 and the right light emitting element 23 are, for example, white light emitting diodes (LEDs) each having a planar light emitting unit on the upper surface of the semiconductor light source 20. The left power supply unit 24 and the right power supply unit 25 are contact points made of a conductive material. The left power feeding unit 24 is electrically connected to the left light emitting element 22 through the left conductive path 26. The left side light emitting element 22 and the right side light emitting element 23 are electrically connected. The right light emitting element 23 is electrically connected to the right power supply unit 25 via the right conductive path 27.
　支持部２１は、表面が絶縁被膜処理をされた金属製（銅など）の基板である。支持部２１は、当該絶縁被膜上において、左側発光素子２２、右側発光素子２３、左側給電部２４、右側給電部２５、左側導電経路２６、および右側導電経路２７を支持している。 The support portion 21 is a metal (copper or the like) substrate whose surface is treated with an insulating coating. The support part 21 supports the left light emitting element 22, the right light emitting element 23, the left power feeding part 24, the right power feeding part 25, the left conductive path 26, and the right conductive path 27 on the insulating coating.
　支持部２１の左端部には、切欠き２１ａが形成されている。支持部２１の右端部には、貫通孔２１ｂが形成されている。切欠き２１ａと貫通孔２１ｂは、支持部２１を上下方向に貫通している。 A notch 21 a is formed at the left end of the support portion 21. A through hole 21 b is formed at the right end portion of the support portion 21. The notch 21a and the through hole 21b penetrate the support portion 21 in the vertical direction.
　図２および図７に示すように、半導体光源２０は、左側発光素子２２、右側発光素子２３、左側給電部２４、および右側給電部２５が上方を向くように、左側光源搭載部１５上に載置される。このとき、図１に示した左側位置決めピン１５ａと右側位置決めピン１５ｂが、それぞれ切欠き２１ａと貫通孔２１ｂに挿入され、半導体光源２０の左側光源搭載部１５に対する位置決めがなされる。 As shown in FIGS. 2 and 7, the semiconductor light source 20 is mounted on the left light source mounting portion 15 so that the left light emitting element 22, the right light emitting element 23, the left power feeding portion 24, and the right power feeding portion 25 face upward. Placed. At this time, the left positioning pin 15a and the right positioning pin 15b shown in FIG. 1 are inserted into the notch 21a and the through hole 21b, respectively, and the semiconductor light source 20 is positioned with respect to the left light source mounting portion 15.
　この状態から図３に示すように、左側光源搭載部１５上に載置された半導体光源２０の上方から、左側アタッチメント３０が装着される。このとき、図１の示した前側位置決めピン１３ａと後側位置決めピン１３ｂが、それぞれ前側位置決め孔３１ｂと後側位置決め孔３１ｃに挿入され、支持体１０（左側支持領域１１）に対する左側アタッチメント３０の位置決めがなされる。 From this state, as shown in FIG. 3, the left attachment 30 is mounted from above the semiconductor light source 20 placed on the left light source mounting portion 15. At this time, the front positioning pin 13a and the rear positioning pin 13b shown in FIG. 1 are inserted into the front positioning hole 31b and the rear positioning hole 31c, respectively, so that the left attachment 30 is positioned with respect to the support 10 (left support region 11). Is made.
　さらに、図３に示すように、前側固定ねじ３７が、前側固定片３２の前側固定孔３２ａを挿通して図１に示した前側ねじ孔１７ａにねじ込まれ、後側固定ねじ３８が、後側固定片３３の後側固定孔３３ａを挿通して図１に示した後側ねじ孔１７ｂにねじ込まれる。これにより、左側アタッチメント３０は、支持体１０（左側支持領域１１）に対して固定される。 Further, as shown in FIG. 3, the front side fixing screw 37 is inserted into the front side screw hole 17a shown in FIG. 1 through the front side fixing hole 32a of the front side fixing piece 32, and the rear side fixing screw 38 is connected to the rear side fixing screw 38. The fixing piece 33 is inserted through the rear fixing hole 33a and screwed into the rear screw hole 17b shown in FIG. Thereby, the left attachment 30 is fixed with respect to the support body 10 (left support area | region 11).
　支持体１０には、図示しない光源制御部からの信号を伝達する信号線に接続された左側コネクタ７０が装着されている。左側コネクタ７０は、左側アタッチメント３０が備えるコネクタ部３４の接続孔３４ａに嵌入される。これにより当該信号線と、接続端子３４ｂ、３４ｃが電気的に接続される。 The left side connector 70 connected to a signal line for transmitting a signal from a light source control unit (not shown) is attached to the support 10. The left connector 70 is fitted into the connection hole 34 a of the connector portion 34 included in the left attachment 30. Thereby, the signal line is electrically connected to the connection terminals 34b and 34c.
　この状態において、図７に示すように、半導体光源２０の左側発光素子２２と右側発光素子２３が、左側アタッチメント３０の枠体３１に形成された開口３１ａを通じて上方に露出する。すなわち、枠体３１は、半導体光源２０から出射された光が開口３１ａを通過可能な形状とされている。 In this state, as shown in FIG. 7, the left side light emitting element 22 and the right side light emitting element 23 of the semiconductor light source 20 are exposed upward through the opening 31a formed in the frame body 31 of the left attachment 30. That is, the frame 31 has a shape that allows light emitted from the semiconductor light source 20 to pass through the opening 31a.
　このとき右側導電端子３６が備える一対の腕部３６ｃの先端（接点部３６ｃ３）は、右側給電部２５の上面に接触する。同様に、左側導電端子３５の先端（接点部３６ｃ３に対応する部分）は、左側給電部２４の上面に接触する。左側コネクタ７０を介して入力された信号は、左側導電端子３５、左側給電部２４、および左側導電経路２６を経由して左側発光素子２２と右側発光素子２３に入力される。これにより、光源制御部による左側発光素子２２と右側発光素子２３の点消灯制御が可能とされる。 At this time, the tips (contact portions 36c3) of the pair of arm portions 36c included in the right conductive terminal 36 are in contact with the upper surface of the right power supply portion 25. Similarly, the tip of the left conductive terminal 35 (the part corresponding to the contact portion 36 c 3) is in contact with the upper surface of the left power feeding unit 24. A signal input via the left connector 70 is input to the left light emitting element 22 and the right light emitting element 23 via the left conductive terminal 35, the left power feeding unit 24, and the left conductive path 26. As a result, the lighting control of the left light emitting element 22 and the right light emitting element 23 by the light source control unit is enabled.
　図３に示すように、右側光源搭載部１６についても同様に、左側位置決めピン１６ａと右側位置決めピン１６ｂを用いて、半導体光源２０の右側光源搭載部１６に対する位置決めがなされる。また前側位置決めピン１４ａと後側位置決めピン１４ｂを用いて、支持体１０（右側支持領域１２）に対する右側アタッチメント４０の位置決めがなされる。さらに、前側固定ねじ４７と後側固定ねじ４８を、それぞれ前側ねじ孔１８ａと後側ねじ孔１８ｂにねじ込むことにより、右側アタッチメント４０が、支持体１０（右側支持領域１２）に対して固定される。 As shown in FIG. 3, the right light source mounting portion 16 is similarly positioned with respect to the right light source mounting portion 16 of the semiconductor light source 20 using the left positioning pin 16a and the right positioning pin 16b. Further, the right attachment 40 is positioned with respect to the support 10 (right support region 12) using the front positioning pin 14a and the rear positioning pin 14b. Further, the right attachment 40 is fixed to the support 10 (right support region 12) by screwing the front fixing screw 47 and the rear fixing screw 48 into the front screw hole 18a and the rear screw hole 18b, respectively. .
　また右側コネクタ８０が、右側アタッチメント４０のコネクタ部（コネクタ部３４の対応部分）に接続される。右側アタッチメント４０と右側光源搭載部１６に搭載された半導体光源２０との関係に係るその他の構成は、左側アタッチメント３０と左側光源搭載部１５に搭載された半導体光源２０との関係と実質的に同一であるため、詳細な説明は割愛する。 Also, the right connector 80 is connected to the connector portion of the right attachment 40 (corresponding portion of the connector portion 34). Other configurations relating to the relationship between the right attachment 40 and the semiconductor light source 20 mounted on the right light source mounting portion 16 are substantially the same as the relationship between the left attachment 30 and the semiconductor light source 20 mounted on the left light source mounting portion 15. Therefore, the detailed explanation is omitted.
　なお支持体１０は、アルミニウムなどの熱伝導性が高い材料により形成されている。これにより支持体１０はヒートシンクとして機能し、半導体光源２０の発光に伴って発生する熱を効率よく放散できる。 The support 10 is formed of a material having high thermal conductivity such as aluminum. Thereby, the support body 10 functions as a heat sink and can efficiently dissipate the heat generated with the light emission of the semiconductor light source 20.
　図８に示すように、左側アタッチメント３０の枠体３１における開口３１ａの縁には、４つの保持部３１ａ２～３１ａ５が形成されている。保持部３１ａ２～３１ａ５の各々は絶縁性材料からなり、半導体光源２０の支持部２１の一部を覆う。図９は、図８における線ＩＸ－ＩＸに沿う断面を示している。保持部３１ａ２～３１ａ５の各々は、支持部２１の上面に当接し、半導体光源２０を左側光源搭載部１５（支持体１０）に向けて押圧する（図９においては保持部３１ａ２と３１ａ３のみが示されている）。 As shown in FIG. 8, four holding portions 31a2 to 31a5 are formed at the edge of the opening 31a in the frame 31 of the left attachment 30. Each of the holding portions 31a2 to 31a5 is made of an insulating material and covers a part of the support portion 21 of the semiconductor light source 20. FIG. 9 shows a cross section taken along line IX-IX in FIG. Each of the holding portions 31a2 to 31a5 abuts on the upper surface of the support portion 21, and presses the semiconductor light source 20 toward the left light source mounting portion 15 (support body 10) (only the holding portions 31a2 and 31a3 are shown in FIG. 9). Have been).
　図９に示すように、支持部２１の上面は、絶縁性被膜２１ａとされている。一般的には、この絶縁性被膜２１ａ上に形成された左側導電経路２６と右側導電経路２７をさらに覆う絶縁性被膜が形成される。しかしながら、光源の低コスト化を志向した場合、そのような絶縁性被膜の形成を省略したいというニーズがある。上記の構成によれば、保持部３１ａ２～３１ａ５は絶縁性材料からなるため、左側導電経路２６と右側導電経路２７を絶縁性被膜で覆わずとも保持部３１ａ２～３１ａ５との間に短絡が生ずることがない。したがって、低コスト化の要求に基づいた半導体光源２０を用いることができ、ひいては当該半導体光源２０を備える灯具ユニット１のコストを抑制できる。 As shown in FIG. 9, the upper surface of the support portion 21 is an insulating coating 21a. In general, an insulating film that further covers the left conductive path 26 and the right conductive path 27 formed on the insulating film 21a is formed. However, when it is intended to reduce the cost of the light source, there is a need to omit the formation of such an insulating coating. According to the above configuration, since the holding portions 31a2 to 31a5 are made of an insulating material, a short circuit occurs between the holding portions 31a2 to 31a5 without covering the left conductive path 26 and the right conductive path 27 with an insulating coating. There is no. Therefore, the semiconductor light source 20 based on the request | requirement of cost reduction can be used, and the cost of the lamp unit 1 provided with the said semiconductor light source 20 can be suppressed by extension.
　また、支持部２１上に形成された導電経路と保持部３１ａ２～３１ａ５との間に短絡が生ずることがないため、保持部３１ａ２～３１ａ５の寸法を最大限大きくして高い保持力を確保できる。特に４つの保持部３１ａ２～３１ａ５で半導体光源２０を保持するため、保持力を面的に作用させることが可能となり、半導体光源２０の放熱面を支持体１０に対して確実に接触させることができる。これにより支持体を通じた放熱効率を高めることが可能である。 Also, since a short circuit does not occur between the conductive path formed on the support portion 21 and the holding portions 31a2 to 31a5, the holding portions 31a2 to 31a5 can be maximized in size to ensure a high holding force. In particular, since the semiconductor light source 20 is held by the four holding portions 31a2 to 31a5, the holding force can be applied in a plane, and the heat radiation surface of the semiconductor light source 20 can be reliably brought into contact with the support 10. . Thereby, it is possible to improve the heat dissipation efficiency through the support.
　図８に示すように、各保持部３１ａ２～３１ａ５は、枠体３１に形成された開口３１ａの周縁部から内側に向かって延びており、半導体光源２０に当接する先端側の幅が基端側よりも狭くなっている。 As shown in FIG. 8, each of the holding portions 31a2 to 31a5 extends inwardly from the peripheral portion of the opening 31a formed in the frame body 31, and the width of the distal end side contacting the semiconductor light source 20 is the proximal end side. It is narrower than.
　このような構成によれば、各保持部３１ａ２～３１ａ５が撓みやすくなるため、半導体光源２０に対して、各保持部３１ａ２～３１ａ５が適度の押圧力で圧接されうる。これにより、最小限の寸法を有する保持部３１ａ２～３１ａ５で最大限の保持力を確保できる。したがって、左側アタッチメント３０の部品コストを抑制でき、ひいては当該左側アタッチメント３０を備える灯具ユニット１のコストを抑制できる。 According to such a configuration, since the holding portions 31a2 to 31a5 are easily bent, the holding portions 31a2 to 31a5 can be pressed against the semiconductor light source 20 with an appropriate pressing force. As a result, the maximum holding force can be secured by the holding portions 31a2 to 31a5 having the minimum dimensions. Therefore, the component cost of the left attachment 30 can be suppressed, and consequently the cost of the lamp unit 1 including the left attachment 30 can be suppressed.
　枠体３１は、左側導電端子３５と右側導電端子３６と平行な向きに延びる前側固定片３２（第１固定部の一例）と後側固定片３３（第２固定部の一例）を備えている。前側固定片３２には、枠体３１を支持体１０に締結する前側固定ねじ３７（第１締結部材の一例）が挿通される前側固定孔３２ａ（第１貫通孔の一例）が形成されている。後側固定片３３には、枠体３１を支持体１０に締結する後側固定ねじ３８（第２締結部材の一例）が挿通される後側固定孔３３ａ（第２貫通孔の一例）が形成されている。保持部３１ａ２～３１ａ５は、前側固定孔３２ａと後側固定孔３３ａの中心同士を結ぶ直線Ｌ１に対して線対称となるように配置されている。 The frame 31 includes a front side fixing piece 32 (an example of a first fixing part) and a rear side fixing piece 33 (an example of a second fixing part) extending in a direction parallel to the left conductive terminal 35 and the right conductive terminal 36. . The front side fixing piece 32 is formed with a front side fixing hole 32a (an example of a first through hole) through which a front side fixing screw 37 (an example of a first fastening member) for fastening the frame 31 to the support body 10 is inserted. . The rear side fixing piece 33 is formed with a rear side fixing hole 33a (an example of a second through hole) through which a rear side fixing screw 38 (an example of a second fastening member) for fastening the frame 31 to the support body 10 is inserted. Has been. The holding portions 31a2 to 31a5 are arranged so as to be symmetric with respect to a straight line L1 connecting the centers of the front side fixing hole 32a and the rear side fixing hole 33a.
　このような構成によれば、前側固定ねじ３７と後側固定ねじ３８による締結力を、各保持部３１ａ２～３１ａ５に等しく作用させることができる。これにより、最小限の寸法を有する保持部３１ａ２～３１ａ５で最大限の保持力を確保できる。したがって、左側アタッチメント３０の部品コストを抑制でき、ひいては当該左側アタッチメント３０を備える灯具ユニット１のコストを抑制できる。 According to such a configuration, the fastening force by the front side fixing screw 37 and the rear side fixing screw 38 can be applied equally to the holding portions 31a2 to 31a5. As a result, the maximum holding force can be secured by the holding portions 31a2 to 31a5 having the minimum dimensions. Therefore, the component cost of the left attachment 30 can be suppressed, and consequently the cost of the lamp unit 1 including the left attachment 30 can be suppressed.
　また各保持部３１ａ２～３１ａ５は、枠体３１と一体に成形されているため、部品点数の削減が可能である。したがって、左側アタッチメント３０の部品コストを抑制でき、ひいては当該左側アタッチメント３０を備える灯具ユニット１のコストを抑制できる。 Further, since each holding portion 31a2 to 31a5 is formed integrally with the frame 31, the number of parts can be reduced. Therefore, the component cost of the left attachment 30 can be suppressed, and consequently the cost of the lamp unit 1 including the left attachment 30 can be suppressed.
　上述の説明は、右側アタッチメント４０についても同様に適用可能であることは明らかであるため、繰り返しとなる説明は割愛する。 The above description is obviously applicable to the right attachment 40 in the same manner, and a repeated description is omitted.
　上記の実施形態は本発明の理解を容易にするためのものであって、本発明を限定するものではない。本発明は、その趣旨を逸脱することなく変更・改良され得るとともに、その等価物が本発明の技術的範囲に含まれることは明らかである。 The above embodiment is for facilitating understanding of the present invention, and does not limit the present invention. It is obvious that the present invention can be changed and improved without departing from the spirit thereof, and equivalents thereof are included in the technical scope of the present invention.
　半導体光源２０は、白色発光ダイオードに限られるものではない。所定の色の光を出射する発光ダイオードを用いてもよく、レーザダイオードや有機ＥＬ素子のような半導体発光素子を備える光源を用いてもよい。 The semiconductor light source 20 is not limited to a white light emitting diode. A light emitting diode that emits light of a predetermined color may be used, or a light source including a semiconductor light emitting element such as a laser diode or an organic EL element may be used.
　上記の実施形態においては、４つの保持部３１ａ２～３１ａ５が枠体３１に形成されている。しかしながら、枠体３１に形成される保持部の数は、３つ以上で任意に定められうる。押圧箇所を少なくとも３点とすれば、半導体光源２０に対する押圧力を面的に作用させることができる。これにより半導体光源２０を支持体１０に対して安定的に保持できる。 In the above embodiment, the four holding portions 31a2 to 31a5 are formed on the frame body 31. However, the number of holding parts formed in the frame 31 can be arbitrarily determined as three or more. If there are at least three pressing points, the pressing force against the semiconductor light source 20 can be applied in a surface manner. Thereby, the semiconductor light source 20 can be stably held with respect to the support 10.
　３つの保持部を形成する場合における各保持部の位置は任意である。しかしながら、前側固定孔３２ａと後側固定孔３３ａの中心同士を結ぶ直線Ｌ１に対して線対称となるように３つの保持部を配置することにより、保持力の安定性がより向上する。例えば３つの保持部の１つを直線Ｌ１上に配置し、残りの２つを直線Ｌ１の左右に線対称となる位置に配置すればよい。 The position of each holding part in the case of forming three holding parts is arbitrary. However, the stability of the holding force is further improved by arranging the three holding portions so as to be line symmetric with respect to the straight line L1 connecting the centers of the front side fixing hole 32a and the rear side fixing hole 33a. For example, one of the three holding portions may be arranged on the straight line L1, and the remaining two may be arranged at positions that are line-symmetric with respect to the left and right of the straight line L1.
　上記の実施形態において、各保持部３１ａ２～３１ａ５は、半導体光源２０における支持部２１の上面に当接している。しかしながら、半導体光源２０の一部を支持体１０に対して押圧可能であれば、各保持部３１ａ２～３１ａ５が当接する箇所は、半導体光源２０の仕様に応じて適宜に定められうる。 In the above embodiment, each of the holding portions 31a2 to 31a5 is in contact with the upper surface of the support portion 21 in the semiconductor light source 20. However, as long as a part of the semiconductor light source 20 can be pressed against the support 10, the locations where the holding portions 31 a 2 to 31 a 5 abut can be appropriately determined according to the specifications of the semiconductor light source 20.
　左側アタッチメント３０と右側アタッチメント４０は、必ずしも左右対称の形状を有していることを要しない。灯具ユニット１の仕様に応じて、同一形状のアタッチメントを用いて左右の半導体光源２０を支持体１０に固定する構成が採用されうる。 The left attachment 30 and the right attachment 40 do not necessarily have a symmetrical shape. Depending on the specifications of the lamp unit 1, a configuration in which the left and right semiconductor light sources 20 are fixed to the support 10 using attachments having the same shape may be employed.
　左側アタッチメント３０と右側アタッチメント４０は、必ずしも前側固定ねじ３７、４７および後側固定ねじ３８、４８を用いて支持体に締結されることを要しない。支持体１０への締結が可能であれば、適宜の部材が用いられうる。 The left attachment 30 and the right attachment 40 do not necessarily need to be fastened to the support using the front fixing screws 37 and 47 and the rear fixing screws 38 and 48. As long as fastening to the support 10 is possible, an appropriate member can be used.
　灯具ユニット１が備える半導体光源２０の数は、２つに限られない。単一、あるいは３つ以上の半導体光源２０を備える構成が採用されうる。 The number of semiconductor light sources 20 included in the lamp unit 1 is not limited to two. A configuration including a single semiconductor light source 20 or three or more semiconductor light sources 20 may be employed.
　灯具ユニット１は、必ずしも車両に搭載される照明装置に装備されることを要しない。灯具ユニット１は、大型の懐中電灯などの照明装置にも装備されうる。 The lamp unit 1 does not necessarily need to be installed in a lighting device mounted on a vehicle. The lamp unit 1 can also be installed in a lighting device such as a large flashlight.
　本出願の記載の一部を構成するものとして、２０１３年９月１７日に提出された日本国特許出願２０１３－１９２２１４の内容を援用する。 The contents of Japanese Patent Application 2013-192214 filed on September 17, 2013 are incorporated as part of the description of this application.

Claims (5)

  1. 　半導体光源を支持体に固定するアタッチメントであって、
    　前記支持体に固定された半導体光源から出射された光が通過可能な開口を有し、前記支持体に固定される枠体と、
    　前記開口の縁に形成され、絶縁性材料からなる少なくとも３つの保持部と、
    を備えており、
    　前記少なくとも３つの保持部の各々は、前記枠体が前記支持体に固定されるとき、前記半導体光源の一部を前記支持体に向けて押圧する構成とされている、
    アタッチメント。     An attachment for fixing a semiconductor light source to a support,
    A frame having an opening through which light emitted from a semiconductor light source fixed to the support can pass, and fixed to the support;
    At least three holding portions made of an insulating material formed at the edge of the opening;
    With
    Each of the at least three holding portions is configured to press a part of the semiconductor light source toward the support when the frame is fixed to the support.
    attachment.
  2. 　前記少なくとも３つの保持部の各々は、前記開口の内側に向かって延びており、先端側の幅が基端側よりも狭くなっている、
    請求項１に記載のアタッチメント。     Each of the at least three holding portions extends toward the inside of the opening, and the width on the distal end side is narrower than the proximal end side.
    The attachment according to claim 1.
  3. 　前記枠体を前記支持体に締結する第１締結部材が挿通される第１貫通孔が形成された第１固定部と、
    　前記枠体を前記支持体に締結する第２締結部材が挿通される第２貫通孔が形成された第２固定部と、
    を備えており、
    　前記少なくとも３つの保持部は、前記第１貫通孔と前記第２貫通孔の中心同士を結ぶ直線に対して線対称となるように配置されている、
    請求項１または２に記載のアタッチメント。     A first fixing part formed with a first through hole through which a first fastening member for fastening the frame body to the support body is inserted;
    A second fixing part formed with a second through hole through which a second fastening member for fastening the frame body to the support body is inserted;
    With
    The at least three holding portions are arranged so as to be line symmetric with respect to a straight line connecting the centers of the first through hole and the second through hole.
    The attachment according to claim 1 or 2.
  4. 　前記少なくとも３つの保持部の各々は、前記枠体と一体に成形されている、
    請求項１から３のいずれか一項に記載のアタッチメント。     Each of the at least three holding portions is formed integrally with the frame.
    The attachment according to any one of claims 1 to 3.
  5. 　支持体と、
    　前記支持体上に配置された半導体光源と、
    　前記半導体光源を前記支持体に固定するアタッチメントと、
    を備えており、
    　前記アタッチメントは、
    　　前記半導体光源から出射された光が通過可能な開口を有し、前記支持体に固定される枠体と、
    　　前記開口の縁に形成され、絶縁性材料からなる少なくとも３つの保持部と、
    を備えており、
    　前記少なくとも３つの保持部の各々は、前記半導体光源の一部を前記支持体に向けて押圧している、
    照明装置。     A support;
    A semiconductor light source disposed on the support;
    An attachment for fixing the semiconductor light source to the support;
    With
    The attachment is
    A frame having an opening through which light emitted from the semiconductor light source can pass and fixed to the support;
    At least three holding portions made of an insulating material formed at the edge of the opening;
    With
    Each of the at least three holding portions presses a part of the semiconductor light source toward the support,
    Lighting device.
PCT/JP2014/074296 2013-09-17 2014-09-12 Attachment and lighting device WO2015041182A1 (en)

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WO2012120979A1 (en) * 2011-03-07 2012-09-13 株式会社小糸製作所 Light source module
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JP2013127882A (en) * 2011-12-17 2013-06-27 Toyoda Gosei Co Ltd Lighting device

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JP2007194173A (en) * 2006-01-23 2007-08-02 Koito Mfg Co Ltd Light source module
JP2010073429A (en) * 2008-09-17 2010-04-02 Ichikoh Ind Ltd Lighting fixture for vehicle
WO2012120979A1 (en) * 2011-03-07 2012-09-13 株式会社小糸製作所 Light source module
JP2013045601A (en) * 2011-08-24 2013-03-04 Koito Mfg Co Ltd Vehicular lamp
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