JP2010073429A - Lighting fixture for vehicle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem on fixing condition of an assembly case of a light-emitting element and a diode and power supply condition of the light-emitting element to the diode in a conventional lighting fixture for a vehicle. <P>SOLUTION: The lighting fixture for the vehicle includes a heat sink member 2, a semiconductor type light source 3, a power supply holder 4, and a fixing member 5. The semiconductor light source 3 is composed of a substrate 9 and an emitter 30 and a conductive member 32 installed on the substrate 9. The power supply holder 4 is constructed of contacts 35A, 35B of conductive member which electrically contact the conductive member 32 of the semiconductor light source 3, and a housing 19 of conductive member which supports the contacts 35A, 35B and fixes by interposing the substrate 9 of the semiconductor light source 3 between the heat sink member 2. As a result, fixing of the semiconductor light source 3 is positively secured. Furthermore, power supply to the semiconductor light source 3 is stabilized. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a vehicular lamp that uses a semiconductor-type light source such as an LED as a light source.

  This type of vehicular lamp is conventionally known (for example, Patent Document 1). Hereinafter, the vehicle lamp will be described. A conventional vehicular lamp includes a bracket composed of a vertical panel portion having an opening and a unit mounting portion, a light emitting element as an LED assembly in which a diode is housed in a synthetic resin assembly case, and the light emitting element as a unit through the opening. A plate-like spring member fixedly held on the mounting portion, and a power feeding connector is mounted on the connector insertion port of the LED assembly case of the light emitting element. In a conventional vehicular lamp, when an LED of a light emitting element is turned on, light from the LED is irradiated to the outside to illuminate the outside.

  However, the conventional vehicular lamp is configured to fix and hold a light emitting element, in which a diode is housed in an assembly case, with a plate spring member on a unit mounting portion through an opening. For this reason, the conventional vehicular lamp has a problem with respect to the fixed state of the assembly case of the light emitting element and the diode and the power supply state of the light emitting element to the diode.

JP 2007-48695 A

  The problem to be solved by the present invention is that the conventional vehicular lamp has problems with respect to the fixed state of the light emitting element assembly case and the diode and the power supply state of the light emitting element to the diode.

  The present invention (invention according to claim 1) includes a heat sink member, a semiconductor light source mounted on the heat sink member, a power supply holder for holding the semiconductor light source toward the heat sink member and supplying power to the semiconductor light source, and a heat sink A fixing member that is fixed to the member, fixes the power supply holder to the heat sink member, and fixes the semiconductor light source between the power supply holder and the heat sink member. The power supply holder includes a contact of a conductive member that is in electrical contact with the conductive member of the semiconductor type light source, and a substrate of the semiconductor type light source that holds the contact and the heat sink member. And an insulating member housing that is sandwiched and fixed therebetween.

  Further, according to the present invention (the invention according to claim 2), the substrate of the semiconductor light source has a rectangular shape, the light emitter of the semiconductor light source is provided at the center of one surface of the substrate, and the conductive member of the semiconductor light source is the substrate. The opening of the power supply holder is provided with an opening where the semiconductor light source is located, and the edge of the opening of the power supply holder is provided with the substrate of the semiconductor light source. There are four holding projections that hold the four corners of the surface toward the heat sink member. The contacts of the power supply holder protrude from the edge of the opening and are electrically elastically applied to the conductive member of the semiconductor light source. A connecting portion that contacts is provided.

  Further, according to the present invention (the invention according to claim 3), on the surface of the heat sink member on which the semiconductor-type light source is mounted, a positioning portion that determines a position in one direction of the semiconductor-type light source, and a positioning direction of the positioning portion A spring portion in which a spring force acts in a direction intersecting with the semiconductor portion, and a semiconductor light source is pressed against the spring portion with the semiconductor light source sandwiched in the spring force acting direction of the spring portion. Each of which is provided with a receiving portion, and a positioning portion for determining a mutual position of the heat sink member and the power supply holder is provided between the housing of the power supply holder and the heat sink member facing each other with the substrate of the semiconductor light source interposed therebetween Are provided, respectively.

  According to the vehicle lamp of the present invention (the invention according to claim 1), the means for solving the above-described problems is fixed by sandwiching the substrate of the semiconductor light source between the housing of the power supply holder and the heat sink member. The contact of the power supply holder is electrically connected to the conductive member of the semiconductor type light source. As a result, the vehicular lamp of the present invention (the invention according to claim 1) can securely fix the semiconductor-type light source by sandwiching the semiconductor-type light source between the power supply holder and the heat sink member. Can be electrically connected in a stable state (pressing force). As a result, the vehicular lamp according to the present invention (the invention according to claim 1) reduces wear (rubbing) between the conductive member of the semiconductor light source and the contact of the power supply holder due to the backlash or misalignment of the semiconductor light source. On the other hand, stable power supply can be performed to the semiconductor light source.

  In the vehicle lamp of the present invention (the invention according to claim 2), the four corners of the rectangular substrate of the semiconductor light source are sandwiched between the four pressing projections of the housing of the power supply holder and the heat sink member. Since it is fixed, the semiconductor-type light source can be sandwiched between the power supply holder and the heat sink member and fixed more reliably. In addition, in the vehicular lamp according to the present invention (the invention according to claim 2), since the connection portion of the contact of the power supply holder is electrically elastically contacted with the conductive member of the semiconductor light source, the four holding members of the housing of the power supply holder are provided. The degree of adhesion between the heat sink member and the substrate of the semiconductor light source is increased by the pressing force of the convex portion and the elastic contact force of the contact portion of the contact of the power supply holder. Improves the heat dissipation effect.

  Furthermore, the vehicle lamp of the present invention (the invention according to claim 3) can position the heat sink member and the semiconductor-type light source by the positioning portion, the spring portion and the receiving portion of the heat sink member, and the heat sink member The heat sink member and the power supply holder can be positioned by the positioning portion of the power supply holder and the semiconductor light source and the power supply holder can be positioned via the heat sink member. As a result, the vehicular lamp of the present invention (the invention according to claim 3) can position the heat sink member, the semiconductor-type light source, and the power supply holder with high accuracy relative to each other, and the heat sink positioned with high accuracy. Since the member, the semiconductor light source, and the power supply holder are fixed by the fixing member, the light from the semiconductor light source can be controlled with high accuracy, and the light distribution can be controlled with high accuracy.

  Embodiments of a vehicular lamp according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. Further, in this specification and claims, “upper” means “upper” in the attractive direction when the vehicle lamp according to the present invention is assembled. Further, in this specification and claims, “up, down, front, back, left, right” means “up, down, front,” and “up, down, front” of the automobile when the vehicular lamp according to the present invention is attached to the automobile. , Back, left, right ".

  Hereinafter, the configuration of the vehicular lamp in this embodiment will be described. In the figure, reference numeral 1 denotes a vehicular lamp in this embodiment. The vehicle lamp 1 is, for example, an automotive headlamp and has a projector type unit structure. As shown in FIGS. 1 to 3, the vehicle lamp 1 includes a heat sink member 2, a semiconductor light source 3, a power supply holder 4, a fixing member 5, a reflector 6, a projection lens 7, and an automobile not shown. A lamp housing of a general headlamp and a lamp lens (for example, a transparent outer lens).

  The heat sink member 2, the semiconductor light source 3, the power supply holder 4, the fixing member 5, the reflector 6 and the projection lens 7 constitute a lamp unit. One or a plurality of the lamp units are arranged, for example, via an optical axis adjusting mechanism in a lamp chamber defined by the lamp housing and the lamp lens of the automotive headlamp.

  The heat sink member 2 is made of a material having high thermal conductivity such as resin or metallic die casting. As shown in FIG. 3, the heat sink member 2 has a semicylindrical frame shape at the front portion and a rectangular parallelepiped block shape at the rear portion. The upper surface 56 of the rear part of the block shape of the heat sink member 2 is substantially flat, and the lower part of the rear part of the block shape of the heat sink member 2 has a fin shape. On the other hand, the upper half of the frame-shaped front portion of the heat sink member 2 is opened, and the lower half is closed into a semicylindrical shape. A window portion 64 is provided in the closed portion of the frame-shaped front portion of the heat sink member 2.

  As shown in FIGS. 8, 10, and 11, a rectangular housing recess 57 is provided in the rear half of the upper surface 56 of the rear part of the block shape of the heat sink member 2. The upper surface 58 of the housing recess 57 is flat and is one step lower than the upper surface 56 of the rear part of the block shape of the heat sink member 2.

  A square mounting table 8 is integrally provided at the center of the upper surface 58 of the receiving recess 57 of the heat sink member 2. The upper surface 59 of the mounting table 8 has a flat surface, is lower by one step than the upper surface 56 of the rear part of the block shape of the heat sink member 2, and is raised by one step from the upper surface 58 of the housing recess. The mounting table 8 has a quadrangle substantially equal to the rectangular substrate 9 of the semiconductor-type light source 3, and the substrate 9 of the semiconductor-type light source 3 is directly mounted from above. The mounting table 8 may not be provided. In this case, the upper surface 58 of the housing recess 57 is a mounting surface.

  Two rectangular columnar positioning portions (stoppers) 10 and 10 are integrally provided on both the left and right sides of the mounting table 8 on the upper surface 58 of the housing recess 57 of the heat sink member 2. . The positioning portions 10 and 10 determine the position of the semiconductor light source 3 and determine the position of the semiconductor light source 3 in one direction on the upper surface 59 of the mounting table 8, that is, in the left-right direction. is there. The two positioning portions 10 and 10 have one side surface facing each other, and are separated from each other by the long side of the substrate 9 of the semiconductor light source 3. As shown in FIG. 11, the two positioning portions 10, 10 have upper end portions facing each other forming an inclined surface, and the semiconductor-type light source 3 is placed on the mounting table 8 of the heat sink member 2. It is configured so that it can be easily placed.

  An elongated rectangular storage groove 11 is provided in the center of the upper surface 58 of the storage recess 57 of the heat sink member 2 on the front side of the mounting table 8. As shown in FIGS. 9 to 11, a spring portion 12 of a U-shaped spring is press-fitted into the storage groove 11 from above. The spring portion 12 has a spring force acting in a direction intersecting the upper surface 59 of the mounting table 8 with respect to the positioning direction (left and right direction) of the positioning portions 10 and 10, that is, in the front-rear direction. The spring part 12 has a rear vertical part longer than the front vertical part, and the upper end 13 of the rear vertical part is above the upper surface 59 of the mounting table 8 of the heat sink member 2. Protruding. The upper end portion 13 of the vertical portion on the rear side is slightly inclined to the front side so that the semiconductor light source 3 can be easily placed on the mounting table 8 of the heat sink member 2.

  An elongated rectangular pillar-shaped receiving portion (stopper) 14 is integrally provided at a central portion on the rear side of the mounting table 8 in the upper surface 58 of the housing recess 57 of the heat sink member 2. The receiving part 14 is opposed to the spring part 12 with the semiconductor light source 3 sandwiched in the spring force acting direction of the spring part 12, that is, in the rearward direction, and the semiconductor type is caused by the spring force of the spring part 12. The substrate 9 of the light source 3 is pressed against. As shown in FIG. 11, the receiving portion 14 is configured such that the upper end portion on the front side forms an inclined surface so that the semiconductor light source 3 can be easily placed on the mounting table 8 of the heat sink member 2. ing.

  As shown in FIG. 3, a shade 15 is integrally provided at the upper end of the front half of the rear part of the block shape of the heat sink member 2. The shade 15 is provided with an edge 16 that forms a cut-off line (not shown) of a light distribution pattern (not shown). The edge 16 is provided at the boundary between the frame-shaped front portion of the heat sink member 2 and the block-shaped rear portion. The upper surface 56 of the rear part of the block shape of the heat sink member 2 is also the upper surface of the shade 15.

  A concave storage portion 17 is provided in a portion of the storage recess 57 of the heat sink member 2 on the rear side of the receiving portion 14. The upper surface 60 of the storage portion 17 is one step lower than the upper surface 58 of the storage recess 57. The storage portion 17 stores at least the light source side connector 34 of the power supply holder 4.

  Circular recesses 21 and 21 of positioning portions are respectively provided in portions of the upper surface 58 of the receiving recess 57 of the heat sink member 2 that are slightly separated from the central portions on the left and right sides of the mounting table 8. The circular recesses 21 and 21 determine the mutual positions of the heat sink member 2 and the power supply holder 4 together with the circular protrusions 22 and 22 of the power supply holder 4. As shown in the figure, one of the two circular concave portions 21 and 21 and the two circular convex portions 22 and 22 may be an oval shape, or two may be circular.

  Of the housing recess 57 of the heat sink member 2, the power feeding is housed and set in the housing recess 57 while being positioned by the positioning portion (the circular recesses 21, 21 and the circular projections 22, 22). An insertion hole 55 into which the four vertical plate portions 50 of the fixing member 5 are inserted is provided in a portion corresponding to the outer side surface of the power supply fixing portion 33 of the holder 4. As shown in FIG. 12, a stepped engagement portion 54 is provided on a wall surface in the middle of the insertion hole 55.

  As the semiconductor-type light source 3, for example, a self-luminous semiconductor-type light source (LED in this embodiment) such as LED or EL (organic EL) is used. As shown in FIGS. 3 to 7 and FIGS. 9 to 11, the semiconductor-type light source 3 has a rectangular plate shape of the substrate 9 and a circular plate shape fixed to one surface (upper surface) of the substrate 9. , The light emitter 30 of a light source chip (semiconductor chip) having a small rectangular parallelepiped shape fixed to one surface (upper surface) of the base 23, and a hemispherical shape (dome shape) covering the light emitter 30 and the base 23 ) Light transmitting member (lens) 31 and two opposing sides of one surface (upper surface) of the substrate 9, that is, conductive members 32 and 32 provided at the centers of both left and right ends, respectively. As shown in FIG. 9, the light emitter 30 of the semiconductor-type light source 3 is positioned substantially on the same plane as the upper surface 56 of the heat sink member 2.

  As shown in FIGS. 3 to 6 and FIGS. 9 to 19, the power supply holder 4 is set on the heat sink member 2 and the semiconductor light source 3, and includes a power supply fixing portion 33, A light source side connector 34. The power supply fixing portion 33 of the power supply holder 4 is sized to be placed on almost the middle portion of the upper surface 58 of the storage recess 57 of the heat sink member 2 excluding the front side portion and the rear side portion. The table 8 and the positioning portions 10 and 10, the storage groove 11, the receiving portion 14, and the circular recesses 21 and 21 can be covered, and the insertion hole 55 is not covered. is there. On the other hand, the light source side connector 34 of the power supply holder 4 is sized to be stored in the storage portion 17 of the heat sink member 2.

  The power supply fixing portion 33 of the power supply holder 4 presses the semiconductor light source 3 toward the heat sink member 2 and supplies power to the semiconductor light source 3. Further, the power feeding fixing portion 33 of the power feeding holder 4 is housed in the housing recess 57 of the heat sink member 2. On the other hand, the light source side connector 34 of the power supply holder 4 is integrated with a portion of the power supply fixing portion 33 opposite to the direction (front direction) where light from the semiconductor light source 3 is irradiated (rear side). It is provided and is electrically connected to the power supply side connector 20. The light source side connector 34 of the power supply holder 4 is housed in the housing portion 17 of the heat sink member 2. The light source side connector 34 is provided with a rectangular lock hole 24 in which the lock portion 18 of the power source side connector 20 is locked. The light source side connector 34 is provided with an insertion hole 44 into which the power source side connector 20 is inserted.

  Further, the power supply holder 4 includes two contacts 35A and 35B of an elastic conductive member that comes into electrical contact with the conductive members 32 and 32 of the semiconductor-type light source 3, and the two contacts 35A and 35B. 6 and 19, and a housing 19 of an insulating member that holds and fixes the substrate 9 of the semiconductor light source 3 between the mounting base 8 of the heat sink member 2. Has been. The two contacts 35A and 35B are integrally molded (insert molding) in the housing 19 in the state shown in FIGS. Or it is pinched | interposed and fixed between the said housings 19 divided into two up and down in the horizontal direction. The two contacts 35A and 35B include a positive contact 35A and a negative contact 35B.

  The housing 19 of the power supply fixing portion 33 of the power supply holder 4 is composed of a central portion 25 and a peripheral portion 26 that are formed of two upper and lower layers. The upper surface 27 of the central portion 25 is located below the upper surface 56 of the heat sink member 2. Alternatively, the upper surface 27 of the central portion 25 is located at a position substantially equivalent to the upper surface 56 of the heat sink member 2. The upper surface 28 of the peripheral edge portion 26 is located below the upper surface 27 of the central portion 25. The upper surface of the light source side connector 34 of the power supply holder 4 is located at a position substantially equivalent to the upper surface 28 of the peripheral edge portion 26. Further, the lower surface of the light source side connector 34 of the power supply holder 4 is lowered by one step from the lower surface of the power supply fixing portion 33.

  As shown in FIG. 15, an opening 40 in which the semiconductor light source 3 is located is provided in the central portion 25 of the housing 19 of the power supply fixing portion 33 of the power supply holder 4. The two contacts 35 </ b> A and 35 </ b> B that are in elastic contact with the conductive members 32 and 32 of the semiconductor-type light source 3 at a position below the upper surface 56 of the heat sink member 2 at the edge of the opening 40. The connecting portions 36, 36, 36, 36 are provided so as to protrude. Further, at the edge of the opening 40, a pressing projection that presses the substrate 9 of the semiconductor light source 3 toward the mounting table 8 side of the heat sink member 2 at a position below the upper surface 56 of the heat sink member 2. 41, 41, 41, 41 are provided.

  On the lower surface of the power supply fixing portion 33 of the power supply holder 4, that is, the surface opposite to the upper surface 58 of the housing recess 57 of the heat sink member 2, there are two circular convex portions 22 and 22 as positioning portions, The heat sink member 2 is provided corresponding to the two circular recesses 21, 21.

  The two contacts 35A and 35B are electrically connected to the conductive members 32 and 32 of the semiconductor light source 3 in the vertical direction (from top to bottom) as shown in FIGS. 6, 13, 14, and 19. Two connecting portions 36, 36, 36, 36 that contact each other, male terminal portions 42, 42 that are electrically connected to the power supply side connector 20 in the horizontal direction (front-rear direction), and the connecting portions 36, 36, 36, 36 and the male terminal portions 42, 42 are arranged in a horizontal direction and are connected wiring portions 37, 37, 38, 38, 39, 39 for electrical connection wiring.

  The connection wiring portion includes horizontal plate portions 37, 37, vertical plate portions 38, 38 between the horizontal plate portions 37, 37 and the connection portions 36, 36, 36, 36, the horizontal plate portion 37, 37 and vertical plate portions 39, 39 between the male terminal portions 42, 42. As shown in FIGS. 6 and 19, the horizontal plate portions 37 and 37 are provided with circular through holes. The circular through hole is formed by inserting a part of the resin of the housing 19 into the circular through hole when the power supply holder 4 is insert-molded, and the housing 19 and the two contacts 35A, 35B. Are securely fixed.

  The connecting portions 36, 36, 36, 36 are formed by bending the tip of a bifurcated horizontal plate portion into a V or U shape. The bifurcated horizontal plate portion has elasticity. The connecting portions 36, 36, 36, 36 of the two contacts 35A, 35B protrude from the edge of the opening 40 of the power feed fixing portion 33 and face each other. The two connection portions 36, 36, 36, 36 are electrically elastically contacted with the conductive members 32, 32 of the substrate 9 of the semiconductor light source 3 from above to supply power to the semiconductor light source 3. And the said board | substrate 9 of the said semiconductor type light source 3 is elastically pressed by the mounting base 8 side of the said heat sink member 2. As shown in FIG.

  On the other hand, the male terminal portions 42 and 42 of the two contacts 35 </ b> A and 35 </ b> B protrude into the insertion hole 44 of the light source side connector 34. The male terminal portions 42 and 42 are detachably and electrically connected to the female terminal portions 43 and 43 of the power connector 20.

  The power connector 20 uses a ready-made automobile connector, for example. As shown in FIG. 13, the power connector 20 includes the harnesses 29 and 29 that are electrically connected to the power source side, and the females that electrically connect and fix the harnesses 29 and 29 by caulking or the like. It comprises terminal portions 43, 43 and a casing 46 for integrally molding (insert molding) the harnesses 29, 29 and the female terminal portions 43, 43. The casing 46 is integrally provided with an elastic portion 47. The elastic portion 47 is integrally provided with the lock portion 18.

  FIG. 13A is a longitudinal sectional view showing a state where the light source side connector 34 and the power source side connector 20 are connected. FIG. 13B is a longitudinal sectional view showing a state where the connection between the light source side connector 34 and the power source side connector 20 is released. As shown in FIG. 13B, the casing 46 of the power supply side connector 20 is inserted into the insertion hole 44 of the light source side connector 34 of the power supply holder 4, and the light source side connector of the power supply holder 4 is inserted. By locking the lock portion 18 of the power supply side connector 20 in the lock hole 24 of the power supply 34, the male terminal portions 42 and 42 of the light source side connector 34 of the power supply holder 4 and the female of the power supply side connector 20 are provided. Terminal portions 43 and 43 are electrically connected. Further, as shown in FIG. 13A, the elastic portion 47 of the power connector 20 is pushed down in the direction of the solid arrow, and the lock hole 24 of the light source connector 34 and the lock portion 18 of the power connector 20 are Is released, and the casing 46 of the power supply side connector 20 is extracted from the insertion hole 44 of the light source side connector 34, whereby the male terminal portions 42 and 42 of the light source side connector 34 and the The electrical connection with the female terminal portions 43 and 43 of the power supply side connector 20 can be released. In addition, by adjusting the lock hole 24 of the light source side connector 34, the lock state of the lock hole 24 of the light source side connector 34 and the lock portion 18 of the power source side connector 20 is matched to the vehicle type. It can be in a state where it cannot be released.

  Here, as shown in FIG. 14, on the opposite side of the heat sink member 2 from the direction in which the light from the semiconductor-type light source 3 is irradiated, that is, on the back side (rear side), the back member 48 ( 14 is provided, and the rear member 48 is provided with an accommodation hole 65 in which the light source side connector 34 is accommodated. In some cases. The back member 48 is, for example, a heat sink member, a lamp housing, a bracket or the like. The back member 48 includes a thin back member 48A and a thick back member 48B depending on the vehicle type.

  The fixing member 5 is made of a member having elasticity and high thermal conductivity, and is constituted by a cover member that is covered on the power supply fixing portion 33 of the power supply holder 4. The fixing member 5 is covered on the power supply holder 4 and is fixed to the heat sink member 2, the power supply holder 4 is fixed to the heat sink member 2, and the semiconductor-type light source 3 is sandwiched and fixed between the power supply holder 4 and the heat sink member 2.

  As shown in FIGS. 3, 4, 9 to 12, and 16 to 19, the fixing member 5 includes a rectangular plate-shaped horizontal plate portion 49 and a vertical portion from the four corners of the horizontal plate portion 49. And four vertical plate portions 50 bent substantially vertically. A rectangular opening 51 is provided at the center of the horizontal plate portion 49. In the middle part of the left and right sides of the horizontal plate part 49, elastic pressing parts 52 having a slightly curved shape are provided respectively. The elastic pressing portion 52 elastically presses the power supply fixing portion 33 of the power supply holder 4 from above to the heat sink member 2 side by pressing the fixing member 5 into the heat sink member 2 from above.

  Each of the four vertical plate portions 50 is provided with an elastic engagement portion 53 having a square plate shape (square hook shape). The left and right sides and the upper side of the elastic engagement portion 53 are separated from the vertical plate portion 50, and the lower side of the elastic engagement portion 53 is connected to the vertical plate portion 50, and the elastic engagement portion 53 is bent on the lower side so that the upper side slightly faces outward. The elastic engaging portion 53 is elastically engaged with the engaging portion 54 of the heat sink member 2 when the elastic pressing portion 52 elastically presses the power supply holder 4 from above to the heat sink member 2 side. The fixing member 5 is fixed to the heat sink member 2, and the power supply holder 4 is fixed to the heat sink member 2 together with the elastic pressing portion 52.

  The horizontal plate portion 49 of the fixing member 5 is covered with the upper surface 28 of the peripheral edge portion 26 of the power supply fixing portion 33 of the housing 19 of the power supply holder 4. The upper surface 61 of the horizontal plate portion 49 of the fixing member 5 is located below the upper surface 56 of the heat sink member 2. In the case of a thin steel plate, the fixing member 5 is formed by press bending a thin steel plate, and in the case of a resin, it is formed by integral molding. That is, the fixing member 5 is composed of one part.

  The reflector 6 is made of a light impermeable resin member or the like. In addition, as shown in FIGS. 1 to 3, the reflector 6 has a semicircular opening at the front portion and an opening at the lower portion, while the rear portion passes through the central portion (upper portion) from the front portion. The part is blocked. The reflector 6 is attached to the heat sink member 2 by appropriate fixing means such as screws, bolts and nuts, caulking, fitting and fixing. A reflective surface 45 is provided on the concave inner surface of the closed portion of at least the central portion of the reflector 6 from the substantially rear half to the rear side portion by aluminum deposition or silver coating.

  The reflection surface 45 is a convergent elliptical reflection surface. That is, the reflecting surface 45 is a free-form surface (NURBS surface) reflecting surface having an ellipse as a basis (reference, basic tone). The free curved surface (NURBS curved surface) reflecting surface based on the ellipse is a reflecting surface in which the vertical cross section in FIG. 3 forms an ellipse, and the horizontal cross section (not shown) forms a parabola or a deformed parabola. The reflective surface 45 has a first focal point (not shown), a second focal point (not shown), and an optical axis (not shown). The second focal point is a focal line on a horizontal section, that is, a curved focal line with both ends positioned on the front side and the center positioned on the rear side as viewed from above (plane). The free-form surface (NURBS surface) of the reflecting surface 45 is a NURBS free-form surface (Non-Uniform Rational B-Spline Surface) described in “Mathematical Elements for Computer Graphics” (Devid F. Rogers, J Alan Adams). is there. The reflection surface 45 may be a reflection surface composed of a simple spheroidal surface having a first focal point, a second focal point, and an optical axis. In this case, the second focal point is not a focal line but a focal point. The reflection surface 45 of the reflector 6 reflects light from the semiconductor light source 3.

  As shown in FIGS. 1 to 3, the projection lens 7 is a convex lens that is an aspherical lens having a circular shape when viewed from the front. The front side (external side) of the projection lens 7 has a convex aspheric surface with a large curvature (small curvature radius), while the rear side (the semiconductor-type light source 3 side) of the projection lens 7 has a small curvature. Convex aspherical surface (large curvature radius). By using such a projection lens 7, the focal length of the projection lens 7 is reduced, and accordingly, the dimension of the projection lens 7 of the vehicle lamp 1 in this embodiment is compact. . The rear side of the projection lens 7 may be a flat aspheric surface (plane).

  As shown in FIGS. 1 to 3, the projection lens 7 is fixed to the frame-shaped front portion of the heat sink member 2. That is, the lower half of the peripheral convex portion of the projection lens 7 is fixed to the front end of the semicylindrical frame-shaped front portion of the heat sink member 2 by appropriate fixing means. Therefore, a gap 62 is formed between the upper half of the projection lens 7 and the reflector 6, and the lower half of the projection lens 7 and the block-shaped rear portion of the heat sink member 2 are formed. A gap 63 is formed between them. As a result, an air flow (heat convection) is generated by the gaps 62 and 63 and the window portion 64 of the front portion of the frame shape of the heat sink member 2, thereby improving the heat dissipation effect.

  The projection lens 7 includes a front focal point (a focal point on the semiconductor-type light source 3 side, not shown), a rear focal point (an external focal point, not shown), the front focal point, and the rear focal point. And an optical axis (not shown) connecting the side focal points. The optical axis of the reflecting surface 45 and the optical axis of the projection lens 7 are coincident or substantially coincident with each other. The front focal point of the projection lens 7 is a lens focal point (a meridional image plane that is a focal plane on the object space side). The lens focal point of the projection lens 7 is located at or near the second focal point of the reflecting surface 45. The light from the semiconductor-type light source 3 does not have high heat, so that a resin lens can be used as the projection lens 7. The projection lens 7 uses acrylic in this example. The projection lens 7 projects (irradiates) the reflected light from the reflecting surface 45 of the reflector 6 to the outside (in front of the vehicle).

  The vehicular lamp 1 in this embodiment is configured as described above, that is, the heat sink member 2 and the semiconductor-type light source 3 (the substrate 9, the light emitter 30, the light transmitting member 31, and the pedestal 23). ) And the power feeding holder 4 (consisting of the two contacts 35A and 35B and the housing 19), the fixing member 5, the reflector 6 and the projection lens 7. Hereinafter, how to assemble each of the above-described components will be described.

  First, the U-shaped spring portion 12 is press-fitted from above into the housing groove 11 of the heat sink member 2 shown in FIG. 8 with the curved portion down and the long vertical portion at the rear side. (See FIGS. 10, 11, and 19).

  Next, the semiconductor light source 3 is directly placed on the mounting table 8 of the heat sink member 2 from above (see FIGS. 7, 10, 11, and 19). At this time, using the positioning portions 10 and 10 and the receiving portion 14 of the heat sink member 2 as a guide, the semiconductor light source 3 is positioned between the positioning portions 10 and 10 and the vertical portion on the rear side of the spring portion 12. Between the upper end portion 13 and the receiving portion 14. Further, due to the spring force of the spring portion 12, the semiconductor light source 3 crosses the positioning direction (left and right direction) of the positioning portions 10 and 10 on the plane of the mounting table 8, that is, the rear direction. Is pressed against the receiving portion 14 side. As a result, the semiconductor-type light source 3 is positioned on the mounting table 8 of the heat sink member 2 in a position in two directions (left-right direction and front-rear direction) intersecting each other on the plane of the mounting table 8 Therefore, it is placed directly.

  When the semiconductor-type light source 3 is directly placed on the mounting table 8 of the heat sink member 2 from above, the rear vertical portion of the spring portion 12 protruding upward from the upper surface of the heat sink member 2 is provided. The upper end portion 13 is slightly inclined to the front side, the upper end portion on the front side of the receiving portion 14 forms an inclined surface, and the upper end portions on the opposite sides of the two positioning portions 10 and 10. Has an inclined surface, it is easy to directly place the semiconductor light source 3 on the mounting table 8 of the heat sink member 2.

  In addition, the operation | work which press-fits the said U-shaped spring part 12 in the said storage groove | channel 11 of the heat sink member 2, and the operation | work which mounts the said semiconductor type light source 3 directly on the mounting base 8 mentioned above of the said heat sink member 2 from the top. And the procedure may be reversed.

  Subsequently, the power supply holder 4 is set on the heat sink member 2 and the semiconductor-type light source 3 from above (see FIGS. 5, 6, 10, 11, and 19). That is, the power feeding fixing portion 33 and the connector side portion 34 of the power feeding holder 4 are housed from above in the housing recess 57 and the housing portion 17 of the heat sink member 2. Further, the circular convex portions 22 and 22 of the power supply holder 4 are fitted into the circular concave portions 21 and 21 of the heat sink member 2 from above (see FIG. 17). Further, the connection portions 36, 36, 36, 36 of the power supply holder 4 are brought into elastic contact with the conductive members 32, 32 of the semiconductor light source 3 (see FIGS. 5, 6, and 17). Furthermore, the four pressing projections 41, 41, 41, 41 of the power supply holder 4 are set on the four corners of the substrate 9 of the semiconductor light source 3 (see FIGS. 15 and 16). At this time, since the circular convex portions 22 and 22 of the power supply holder 4 are fitted in the circular concave portions 21 and 21 of the heat sink member 2, the mutual positions of the heat sink member 2 and the power supply holder 4. Is decided. The positions of the heat sink member 2 and the semiconductor-type light source 3 are determined by the positioning portions 10 and 10, the spring portion 12, and the receiving portion 14. Therefore, the positions of the semiconductor light source 3 and the power supply holder 4 are determined via the heat sink member 2. That is, the positions of the heat sink member 2, the semiconductor light source 3 and the power supply holder 4 are determined with respect to each other. Further, the connection portions 36, 36, 36, 36 of the power supply holder 4 are elastically contacted with the conductive members 32, 32 on the substrate 9 of the semiconductor light source 3, so that the semiconductor light source 3 is brought into contact. Can be fed. Furthermore, the pressing projections 41, 41, 41, 41 of the power supply holder 4 are set on four corners of the substrate 9 of the semiconductor type light source 3, so that the semiconductor type light source 3 becomes the heat sink. It is pressed to the member 2 side.

  Then, the vertical plate portion 50 of the fixing member 5 is inserted into the insertion hole 55 of the heat sink member 2 from above. Further, the horizontal plate portion 49 of the fixing member 5 is covered from above on the peripheral edge portion 26 of the power supply fixing portion 33 of the power supply holder 4 (see FIGS. 4, 10, 11, and 19). Then, when the vertical plate portion 50 of the fixing member 5 is inserted into the insertion hole 55 of the heat sink member 2, the elastic engagement portion 53 of the fixing member 5 is bent inward. . When the elastic pressing portion 52 of the fixing member 5 is elastically pressed onto the peripheral edge portion 26 of the power supply fixing portion 33 of the power supply holder 4, the elasticity of the fixing member 5 is bent inward. The engaging portion 53 is elastically restored and protrudes outward to be elastically engaged with the engaging portion 54 of the heat sink member 2. As a result, the elastic pressing portion 52 and the elastic engagement portion 53 of the fixing member 5 are connected to the peripheral edge portion 26 of the power supply fixing portion 33 of the power supply holder 4 and the engagement portion 54 of the heat sink member 2. The heat sink member 2, the semiconductor light source 3, and the power supply holder 4 are fixed by the fixing member 5.

  That is, the fixing member 5 is fixed to the heat sink member 2 by the elastic engagement portion 53 of the fixing member 5 being elastically engaged with the engaging portion 54 of the heat sink member 2. In addition, the peripheral edge portion 26 of the power supply fixing portion 33 of the power supply holder 4 is between the fixing member 5, the horizontal plate portion 49 and the elastic pressing portion 52, and the upper surface 58 of the storage recess 57 of the heat sink member 2. By being sandwiched, the power supply holder 4 is fixed to the heat sink member 2 by the fixing member 5. Further, the four corners of the substrate 9 of the semiconductor light source 3 are sandwiched between the pressing projections 41, 41, 41, 41 of the power supply holder 4 and the upper surface 59 of the mounting table 8 of the heat sink member 2. Thus, the semiconductor light source 3 is fixed to the heat sink member 2.

  Then, the reflector 6 is set on the heat sink member 2 from above, and the reflector 6 is fixed to the heat sink member 2 by an appropriate fixing means. The projection lens 7 is set on the heat sink member 2 from above, and the projection lens 7 is fixed to the heat sink member 2 by an appropriate fixing means (see FIGS. 1, 2, and 3).

  Thus, by assembling the components of the heat sink member 2, the semiconductor light source 3, the power supply holder 4, the fixing member 5, the reflector 6, and the projection lens 7, the vehicle lamp in this embodiment is assembled. 1 is configured. Although not shown in the drawings, a plurality of vehicle lamps 1 in this embodiment are attached to brackets (not shown) in a lamp compartment defined by the lamp housing and the lamp lens of an automotive headlamp. Also good.

  The vehicular lamp 1 in this embodiment is configured as described above, and the operation thereof will be described below.

  First, as shown in FIG. 13, the power supply side connector 20 is inserted into the insertion hole 44 of the light source side connector 34 of the power supply holder 4 of the vehicular lamp 1, and the female terminal portion 43 of the power supply side connector 20 and the vehicular lamp. The male terminal portion 42 of the light source side connector 34 of the one power supply holder 4 is electrically connected.

  Then, the light emitter 30 of the semiconductor-type light source 3 of the vehicular lamp 1 is turned on. Then, light is emitted from the light emitter 30 of the semiconductor-type light source 3. This light passes through the light transmitting member 31 of the semiconductor light source 3 and is reflected by the reflecting surface 45 of the reflector 6, and this reflected light is concentrated on the second focal point of the reflecting surface 45. A part of the reflected light concentrated on the second focus is cut off by the shade 15. The reflected light that is not cut off by the shade 15 forms a predetermined light distribution pattern having a cut-off line. In addition, by providing a reflection surface on the shade 15, the reflected light cut off by the shade 15 can be reflected by the reflection surface of the shade 15 to form a predetermined auxiliary light distribution pattern.

  The predetermined light distribution pattern (or the predetermined light distribution pattern and the predetermined auxiliary light distribution pattern) is transmitted through the projection lens 7, for example, a passing light distribution pattern (or a passing light distribution pattern and an overhead sign). A light distribution pattern) is projected (irradiated) in front of an automobile (vehicle) to illuminate a road surface or the like.

  The vehicular lamp 1 in this embodiment is configured and operated as described above, and the effects thereof will be described below.

  In the vehicle lamp 1 in this embodiment, the substrate 9 of the semiconductor light source 3 is sandwiched and fixed between the housing 19 of the power supply holder 4 and the heat sink member 2. The contacts 35A and 35B of the power supply holder 4 are electrically connected. As a result, the vehicular lamp 1 in this embodiment can securely fix the semiconductor light source 3 by sandwiching it between the power supply holder 4 and the heat sink member 2, while the conductive member 32 of the semiconductor light source 3, The contacts 35A and 35B of the power supply holder 4 can be electrically connected to the power supply holder 4 in a stable state (pressing force). As a result, the vehicular lamp 1 in this embodiment is worn (rubbed) between the conductive members 32 and 32 of the semiconductor-type light source 3 and the contacts 35A and 35B of the power supply holder 4 due to backlash and misalignment of the semiconductor-type light source 3. On the other hand, stable power supply to the semiconductor light source 3 can be performed.

  Further, in the vehicle lamp 1 in this embodiment, the four corners of the square substrate 9 of the semiconductor light source 3 are the four pressing projections 41, 41, 41, 41 of the housing 19 of the power supply holder 4 and the heat sink member 2. Therefore, the semiconductor-type light source 3 can be sandwiched between the power supply holder 4 and the heat sink member 2 and more securely fixed. Moreover, in the vehicular lamp 1 in this embodiment, the connection portions 36, 36, 36, 36 of the contacts 35A, 35B of the power supply holder 4 are electrically elastically brought into contact with the conductive members 32, 32 of the semiconductor type light source 3. Due to the pressing force of the four pressing convex portions 41, 41, 41, 41 of the housing 19 of the power supply holder 4 and the elastic contact force of the connection portions 36, 36, 36, 36 of the contacts 35A, 35B of the power supply holder 4, The degree of adhesion between the mounting table 8 of the heat sink member 2 and the substrate 9 of the semiconductor-type light source 3 is increased, so that the heat conduction from the semiconductor-type light source 3 to the heat sink member 2 is improved and the heat dissipation effect is improved.

  Furthermore, the vehicular lamp 1 in this embodiment can position the heat sink member 2 and the semiconductor-type light source 3 by the positioning portions 10 and 10, the spring portion 12 and the receiving portion 14 of the heat sink member 2. The heat sink member 2 and the power feed holder 4 can be positioned by the circular concave portions 21 and 21 and the circular convex portions 22 and 22 of the positioning portion of the heat sink member 2 and the power feed holder 4. The mold light source 3 and the power supply holder 4 can be positioned. As a result, the vehicular lamp 1 in this embodiment can position the heat sink member 2, the semiconductor light source 3, and the power supply holder 4 with high accuracy relative to each other, and the heat sink member 2 positioned with high accuracy. Since the semiconductor-type light source 3 and the power supply holder 4 are fixed by the fixing member 5, the light from the semiconductor-type light source 3 can be controlled with high accuracy, and the light distribution can be controlled with high accuracy.

  In particular, in the vehicular lamp 1 according to this embodiment, the assembly direction of the components including the heat sink member 2, the semiconductor light source 3, the power supply holder 4, and the fixing member 5 is one direction from top to bottom. That is, the semiconductor-type light source 3 is placed directly on the upper surface 59 of the mounting table 8 of the heat sink member 2, and the power supply holder 4 is set on the semiconductor-type light source 3 and the heat sink member 2 from above. The semiconductor-type light source 3 can be fed while being pressed to the heat-sink member 2 side, the fixing member 5 is covered on the power-supply holder 4 from above, and the power-supply holder 4 is fixed to the heat-sink member 2. The power supply holder 4 and the heat sink member 2 are sandwiched and fixed. As described above, the vehicular lamp 1 in this embodiment has the component assembly direction including the heat sink member 2, the semiconductor light source 3, the power supply holder 4, and the fixing member 5 in one direction from top to bottom. Assembling workability is good, and in addition, assembly of parts can be automated. In particular, since the vehicle lamp 1 in this embodiment can be mounted with the reflector 6 and the projection lens 7 set on the heat sink member 2 from above, the assembly work of the parts including the reflector 6 and the projection lens 7 is possible. In addition, the assembly of parts can be automated.

  Moreover, in the vehicle lamp 1 in this embodiment, the power supply holder 4 is attached to the heat sink member 2 by the fixing member 5 in a state where the semiconductor light source 3 is directly mounted on the upper surface 59 of the mounting table 8 of the heat sink member 2. The semiconductor light source 3 is fixed and sandwiched between the power supply holder 4 and the heat sink member 2. As a result, in the vehicular lamp 1 in this embodiment, since the semiconductor light source 3 is in direct contact with the heat sink member 2, heat transfer from the semiconductor light source 3 to the heat sink member 2 is improved. Great heat dissipation effect.

  In addition, the vehicular lamp 1 in this embodiment is configured such that the light source side connector 34 and the power source side connector 20 of the power supply holder 4 are opposite to the direction in which the light from the semiconductor light source 3 is irradiated, that is, the back side (rear side). Since the light source side connector and the power source side connector of the power supply holder are located on the flat side (upper side), bottom side (lower side), left side side (left side), right side side (right side) In comparison, the vertical and horizontal dimensions can be reduced. Moreover, when viewed from the front side (front side), the light source side connector 34 and the power source side connector 20 of the power supply holder 4 are not visible. For example, as in this embodiment, in a lamp in which a projection lens 7 or a lens such as a lamp lens for an automobile headlamp is located on the front side, the light source side connector 34 and the power source side connector 20 of the power supply holder 4 are the lenses. Since there is nothing that seems to move in, the appearance and design are improved. Further, compared with a lamp in which the light source side connector and the power source side connector of the power supply holder are located on the front side, the light irradiation from the semiconductor type light source is not hindered, so there is no influence on the light distribution.

  In the vehicle lamp 1 in this embodiment, as shown in FIG. 14, the light source side connector 34 is accommodated in the accommodation hole 65 of the rear member 48 (for example, a heat sink member, a lamp housing, a bracket, etc.). For this reason, the vehicular lamp 1 in this embodiment is a lamp in which the back member 48 is provided on the side opposite to the direction in which the light from the semiconductor light source 3 is irradiated, that is, on the back side. Since the light source side connector 34 can be accommodated in the accommodation hole 65, the size on the back side can be reduced as much as the light source side connector 34 is accommodated in the accommodation hole 65 of the back member 48. As a result, the vehicular lamp 1 according to this embodiment can reduce the size of the back side by utilizing the space of the back member 48 provided on the back side, thereby reducing the size of the lamp. be able to.

  In addition, in the case where the back member 48 is a thin back member 48A, it is determined whether or not the lock portion 18 of the power supply side connector 20 is locked to the edge of the lock hole 24 through the lock hole 24 of the light source side connector 34. The state can be visually observed. On the other hand, in the case where the back member 48 is a thick back member 48B, the size for housing the light source connector 34 in the housing hole 65 of the back member 48 is increased, and the size on the back side can be reduced accordingly. Thus, it is possible to reduce the size of the lamp.

  Furthermore, since the vehicular lamp 1 in this embodiment is provided with the lock hole 24 in which the lock portion 18 of the power source side connector 20 is locked in the light source side connector 34, the edge of the lock hole 24 of the light source side connector 34 is provided. And the lock portion 18 of the power supply side connector 20 can be confirmed through the lock hole 24, and the edge of the lock hole 24 of the light source side connector 34 and the lock portion 18 of the power supply side connector 20 are securely locked. The assembly of the light source side connector 34 and the power source side connector 20 is improved.

  In addition, the vehicular lamp 1 in this embodiment can use an off-the-shelf automobile connector as the power supply side connector 20 that is electrically connected to the light source side connector 34 of the power supply holder 4. And reliability of electrical connection between the power supply side connector 20 and the power supply side connector 20 is improved. In addition, the vehicular lamp 1 in this embodiment adjusts the lock hole 24 of the light source side connector 34, so that the lock state between the lock hole 24 of the light source side connector 34 and the lock portion 18 of the power source side connector 20 is According to the vehicle type, it can be in a state where it can not be canceled or can be canceled.

  Furthermore, in the vehicle lamp 1 according to this embodiment of the present invention, the light emitter 30 of the semiconductor-type light source 3 is positioned substantially flush with the upper surface 56 of the heat sink member 2, that is, the upper surface 56 of the shade 15, and the power supply holder 4 and the fixing member. 5 is located below the light emitter 30 of the semiconductor-type light source 3 and the upper surface 56 of the heat sink member 2, that is, the upper surface 56 of the shade 15, so that the power supply holder 4 and the fixing member 5 are light from the light emitter 30 of the semiconductor-type light source 3. If the power supply holder 4 and the fixing member 5 are not seen from the front side (front side) of the lamp, it is a problem in appearance. There is no. Thus, the vehicular lamp 1 in this embodiment can satisfy the optical performance, the optical system is improved, and the design is improved.

  Furthermore, in the vehicle lamp 1 in this embodiment, the contacts 35A and 35B of the power supply holder 4 are located below the light emitter 30 of the semiconductor light source 3 and the upper surface 56 of the heat sink member 2, that is, the upper surface 56 of the shade 15. The conductive member 32 of the semiconductor type light source 3 is in electrical contact with the conductive member 32 and the housing 19 of the power supply holder 4 sandwiches the substrate 9 of the semiconductor type light source 3 between the heat sink member 2 and fixes it. For this reason, the vehicular lamp 1 in this embodiment does not obstruct the light from the light emitting body 30 of the semiconductor light source 3 by the contacts 35A and 35B of the power supply holder 4 and the housing 19 and is optically problematic. In addition, the power supply holder 4 and the fixing member 5 are not seen from the front side (front side) of the lamp, and there is no case where it is a problem in appearance. Thus, the vehicular lamp 1 in this embodiment can satisfy the optical performance, the optical system is improved, and the design is improved.

  Furthermore, in the vehicular lamp 1 according to this embodiment, since the housing 19 of the power supply holder 4 is composed of two upper and lower layers of the center portion 25 and the peripheral portion 26, the upper surface 28 of the peripheral portion 26 of the housing 19 of the power supply holder 4. The upper surface 61 of the horizontal plate portion 49 of the fixing member 5 covered with the upper surface 27 of the central portion 25 of the housing 19 of the power supply holder 4, that is, the light emitter 30 of the semiconductor light source 3 and the upper surface 56 of the heat sink member 2 (shade). 15 or the upper surface 56 of the heat sink member 2 (the upper surface 56 of the shade 15). Further, the vehicular lamp 1 in this embodiment has a central portion of the housing 19 of the power supply holder 4 at a position below the light emitter 30 of the semiconductor light source 3 and the upper surface 56 of the heat sink member 2 (the upper surface 56 of the shade 15). The connecting portions 36, 36, 36, 36 of the 25 contacts 35 A, 35 B are in electrical contact with the conductive members 32, 32 of the semiconductor light source 3, and the pressing convex portion of the central portion 25 of the housing 19 of the power supply holder 4 41, 41, 41, 41 sandwich and fix the substrate 9 of the semiconductor light source 3 between the heat sink member 2. For this reason, in the vehicular lamp 1 in this embodiment, the fixing member 5, the contacts 35 </ b> A and 35 </ b> B of the power supply holder 4, and the housing 19 may interfere with light from the light emitter 30 of the semiconductor light source 3. In addition, there is no case where it becomes an optical problem, and there is no case where the power supply holder and the fixing member can be seen from the front side (front side) of the lamp. Thus, the vehicular lamp 1 in this embodiment can satisfy the optical performance, the optical system is improved, and the design is improved.

  Furthermore, in the vehicular lamp 1 in this embodiment, the cover member-shaped fixing member 5 made of a member having a high thermal conductivity is above the power supply fixing portion 33 of the power supply holder 4 (the upper surface 28 of the peripheral edge portion 26 of the housing 19). Therefore, the heat of the semiconductor light source 3 is transmitted to the fixing member 5 through the power supply holder 4 or directly, and the heat radiation effect of the semiconductor light source 3 is further increased.

  Furthermore, the vehicular lamp 1 in this embodiment can fix the semiconductor-type light source 3 to the heat sink member 2 without using fixing means such as screws, and also does not use solder or the like. 3 can be supplied with power, so that the assembling workability of the parts is further improved.

  Furthermore, the vehicular lamp 1 in this embodiment enables the power supply holder 4 to hold the semiconductor light source 3 placed directly on the heat sink member 2 toward the heat sink member 2 and to supply power to the semiconductor light source 3. In this state, the semiconductor light source 3 and the power supply holder 4 are fixed to the heat sink member 2 by the fixing member 5. As a result, in the vehicular lamp 1 according to this embodiment, since the semiconductor light source 3 is directly placed on the heat sink member 2, the vertical dimension can be reduced.

  Furthermore, the vehicular lamp 1 according to this embodiment includes the connection portions 36, 36, 36, 36 in which the contacts 35 A, 35 B of the power supply holder 4 are in electrical contact with the semiconductor light source 3 in the vertical direction, and the power supply side connector. 20, male terminal portions 42, 42 that are electrically connected in the horizontal direction, and connection wires 36, 36, 36, 36 and male terminal portions 42, 42 that are arranged in the horizontal direction and are electrically connected and wired. Since the portions 37, 37, 38, 38, 39, 39 are included, the vertical dimension of the power supply holder 4 can be reduced. Thereby, the vehicular lamp 1 in this embodiment can further reduce the vertical dimension, and can provide a vertically compact lamp.

  Furthermore, in the vehicle lamp 1 according to this embodiment, since the heat sink member 2 is provided with the storage portion 17 in which the light source side connector 34 of the power supply holder 4 is stored, the vertical dimension can be further reduced. Can provide compact lamps up and down.

  Furthermore, in the vehicular lamp 1 according to the second embodiment, since the fixing member 5 is composed of one component, the number of components can be reduced. Further, in the vehicle lamp 1 according to the first embodiment, the power supply holder 4 is fixed to the heat sink member 2 and the semiconductor light source 3 is fixed to the power supply holder 4 and the heat sink member simply by pressing the fixing member 5 into the heat sink member 2 from above. 2, the fixing operation of the semiconductor light source 3, the power supply holder 4, the heat sink member 2, and the fixing member 5 is simplified, and the assembling workability of the parts is further improved.

  Furthermore, in the vehicular lamp 1 according to the first embodiment, the elastic pressing portion 52 of the fixing member 5 extends from the power supply fixing portion 33 (the peripheral portion 26 of the housing 19) of the power supply holder 4 to the housing recess 57 of the heat sink member 2 from above. Since the elastic pressing is performed on the upper surface 58 side, the semiconductor light source 3 can be pressed against the heat sink member 2 via the power supply holder 4, and the pressing force is adjusted by adjusting the elastic force of the elastic pressing portion 52. be able to. For this reason, the vehicular lamp 1 according to the first embodiment improves the heat transfer to the heat sink member 2 of the semiconductor light source 3, increases the heat radiation effect of the semiconductor light source 3, and damages the semiconductor light source 3. Can be prevented. That is, if the force for pressing the semiconductor-type light source 3 to the heat sink member 2 is small, thermal resistance is generated between the semiconductor-type light source 3 and the heat sink member 2, and if it is large, the semiconductor-type light source 3 may be damaged.

  Hereinafter, examples other than the above-described embodiment will be described. In the embodiment described above, an automotive headlamp will be described as a vehicular lamp. However, in the present invention, the vehicle lamp is a lamp other than the automotive headlamp, such as a fog lamp, an AFS additional lamp, a cornering lamp, a tail lamp of a rear combination lamp, a brake lamp, a tail brake lamp, and a backup lamp. May be.

It is a top view of the lamp unit which shows the Example of the vehicle lamp concerning this invention. Similarly, it is the II arrow directional view (side view) in FIG. Similarly, it is the III-III sectional view taken on the line in FIG. Similarly, it is a partial top view which shows the state which fixed the fixing member on the heat sink member, the semiconductor type light source, and the electric power feeding holder. Similarly, it is a partial top view which shows the state which set the electric power feeding holder on the heat sink member and the semiconductor type light source. Similarly, it is a partial plan view showing a connector part and a contact part of a contact by breaking a part of a housing of a power supply holder set on a heat sink member and a semiconductor type light source. Similarly, it is a partial top view which shows the state which mounted the semiconductor type light source directly on the mounting base of a heat sink member. Similarly, it is the partial top view which showed the mounting base of the heat sink member, and its peripheral part. Similarly, it is the IX-IX sectional view taken on the line in FIG. Similarly, it is an exploded sectional view showing how to assemble each component. Similarly, it is an exploded perspective view showing how to assemble each component. Similarly, it is the XII-XII sectional view taken on the line in FIG. Similarly, it is the XIII-XIII sectional view taken on the line in FIG. 4 which shows the connection state and cancellation | release state of the light source side connector and power supply side connector of an electric power feeding holder. Similarly, it is a partial cross-sectional view showing a connection state between a light source side connector and a power source side connector of a power supply holder in a vehicular lamp having a back member. Similarly, it is a partial perspective view showing the pressing state of the pressing convex portion of the power supply holder and the connection state of the connecting portion. Similarly, it is the XVI-XVI sectional view taken on the line in FIG. Similarly, it is the XVII-XVII sectional view taken on the line in FIG. Similarly, it is a XVIII arrow directional view in FIG. Similarly, it is an exploded rear view showing how to assemble each component. Similarly, it is a perspective view which shows the contact of an electric power feeding holder.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vehicle lamp 2 Heat sink member 3 Semiconductor type light source 4 Feeding holder 5 Fixing member 6 Reflector 7 Projection lens 8 Mounting base 9 Substrate 10, 10 Positioning part 11 Storage groove 12 Spring part 13 Upper end part of rear vertical part 14 Receiving part DESCRIPTION OF SYMBOLS 15 Shade 16 Edge 17 Storage part 18 Lock part 19 Housing 20 Power supply side connector 21, 21 Circular recessed part 22, 22 Circular convex part 23 Base 24 Lock hole 25 Center part 26 Peripheral part 27 Upper surface of peripheral part 28 Upper surface 29 of peripheral part, DESCRIPTION OF SYMBOLS 29 Harness 30 Light-emitting body 31 Light transmissive member 32, 32 Conductive member 33 Feed fixing part 34 Light source side connector 35A, 35B Contact 36, 36, 36, 36 Connection part 37, 37 Horizontal plate part 38, 38 of connection wiring part Connection wiring Vertical plate part 39, 39 Vertical plate part of connection wiring part 40 Opening part 4 , 41, 41, 41 Pressing convex part 42, 42 Male terminal part 43, 43 Female terminal part 44 Insertion hole 45 Reflecting surface 46 Casing 47 Elastic part 48 Back member 49 Horizontal plate part 50 Vertical plate part 51 Rectangular opening part 52 Elasticity Press part 53 Elastic engagement part 54 Engagement part 55 Insertion hole 56 Upper surface of heat sink member (upper surface of shade)
57 receiving recess 58 upper surface of receiving recess 59 upper surface of mounting table 60 upper surface of receiving unit 61 upper surface of fixing member 62, 63 clearance 64 window 65 receiving hole

Claims (3)

In a vehicle lamp that uses a semiconductor-type light source as a light source,
A heat sink member;
A semiconductor light source mounted on the heat sink member;
A power supply holder for holding the semiconductor light source on the heat sink member side and supplying power to the semiconductor light source;
A fixing member fixed to the heat sink member, fixing the power supply holder to the heat sink member, and sandwiching and fixing the semiconductor-type light source between the power supply holder and the heat sink member;
With
The semiconductor-type light source includes a substrate, a light emitter and a conductive member provided on the substrate,
The power supply holder is fixed by sandwiching a contact of a conductive member that is in electrical contact with the conductive member of the semiconductor light source, and holding the contact and sandwiching the substrate of the semiconductor light source with the heat sink member An insulating member housing,
A vehicular lamp characterized by the above. The substrate of the semiconductor-type light source has a rectangular shape,
The light emitter of the semiconductor-type light source is provided at the center of one surface of the substrate,
The conductive member of the semiconductor-type light source is provided on two opposite edges of one surface of the substrate,
The housing of the power supply holder is provided with an opening in which the semiconductor light source is located,
On the edge of the opening of the power supply holder, there are provided four pressing projections that respectively press four corners of one surface of the substrate of the semiconductor light source toward the heat sink member,
The contact of the power supply holder is provided with a connection portion that protrudes from an edge of the opening and electrically contacts the conductive member of the semiconductor-type light source.
The vehicular lamp according to claim 1. On the surface of the heat sink member on which the semiconductor light source is placed,
A positioning portion for determining a position in one direction of the semiconductor-type light source;
A spring part in which a spring force acts in a direction intersecting the positioning direction of the positioning part;
A receiving portion that is opposed to the spring portion with the semiconductor light source sandwiched in a direction in which the spring force acts on the spring portion, and receives the semiconductor light source being pressed by the spring force of the spring portion;
Are provided,
The housing of the power supply holder and the heat sink member facing each other with the substrate of the semiconductor-type light source sandwiched therebetween are provided with positioning portions that determine the mutual position of the heat sink member and the power supply holder, respectively.
The vehicular lamp according to claim 1 or 2.

Images