WO2015036368A1 - Dispositif et procédé pour tester des composants optoélectroniques - Google Patents

Dispositif et procédé pour tester des composants optoélectroniques Download PDF

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Publication number
WO2015036368A1
WO2015036368A1 PCT/EP2014/069097 EP2014069097W WO2015036368A1 WO 2015036368 A1 WO2015036368 A1 WO 2015036368A1 EP 2014069097 W EP2014069097 W EP 2014069097W WO 2015036368 A1 WO2015036368 A1 WO 2015036368A1
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WO
WIPO (PCT)
Prior art keywords
test
optoelectronic
contact
contact carrier
test unit
Prior art date
Application number
PCT/EP2014/069097
Other languages
German (de)
English (en)
Inventor
Roland Zeisel
Anton Vogl
Tobias Niebling
Nikolaus Gmeinwieser
Christian LEIRER
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2015036368A1 publication Critical patent/WO2015036368A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes

Definitions

  • the present invention relates to a device for Tes ⁇ th arranged in a wafer composite optoelectronic devices according to claim 1 and a method for testing arranged in a wafer composite optoelectronic devices according to claim see sixteenth
  • the German priority application DE 10 2013 218 062.4 which expressly forms part of the disclosure of the present application, also describes an apparatus for testing optoelectronic components arranged in a wafer assemblage and a method for testing optoelectronic components arranged in a wafer assemblage.
  • Microelectronic devices are made ge ⁇ in wafer Connected and then separated. It is known to test in a wafer assembly arranged electronic components before separating the electronic components on functionality. In the case of optoelectronic components, it is customary to contact and test all the optoelectronic components of a wafer composite individually or in small groups one after the other by means of a test device. This is associated with a high amount of time.
  • An object of the present invention is to provide a device for testing optoelectronic devices arranged in a wafer assembly. This object is achieved by a device having the features of claim 1.
  • a further object of the present invention is to provide a method for testing optoelectronic components arranged in a wafer composite. to admit. This object is achieved by a method having the features of claim 16. In the dependent claims various developments are given.
  • a device for testing optoelectronic components arranged in a wafer composite comprises a contact carrier which has a plurality of test units. Each test unit has at least one contact element arranged on an underside of the contact carrier. In addition, each test unit to an optically transmissive window that extends between the bottom and a top of the Kon ⁇ balance carrier.
  • this device is suitable for testing a plurality of optoelectronic components arranged in a wafer composite. In this case, the device only has to be arranged once on the wafer assembly in order to test all the optoelectronic components of the wafer composite. This advantageously allows rapid testing of a large number of optoelectronic components.
  • each test unit of the contact carrier of the apparatus electromagnetic Strah ⁇ lung can pass to a detector of the device, or electromagnetic radiation are guided to the test optoelectronic component to a response of the opto-electro ⁇ African device during testing radiated from a optoelekt ⁇ tronic device to detect the electromagnetic radiation.
  • the windows of the test units are designed as openings of the contact carrier.
  • electromagnetic radiation then pass through the openings formed as window of the test units the contact carrier of the device in ⁇ game as visible light,.
  • an optically transparent material is arranged in each window.
  • Advantageously ⁇ as the optical material may be a by jewei- poor windows current electromagnetic radiation manipulie ⁇ Ren, for example, distract or filter.
  • the optically transmissive material may also be configured to let pass electromag netic radiation ⁇ unhindered and unaffected.
  • an optical lens is arranged in each window.
  • the optical lens can focus or widen electromagnetic radiation passing through the respective window.
  • the optical lens arranged in a window of a test unit of the contact carrier of the device can focus a light emitted by an optoelectronic component to be tested onto a detector.
  • each test unit has at least two contact elements.
  • the contact elements may for example serve to apply a voltage to a to be tested optoelectronic component between the Mixele ⁇ elements or feed a current.
  • the contact elements can also serve to increase a measurement accuracy by means of a multipoint measurement when testing an opto ⁇ electronic device.
  • each test unit can have four contact elements in order to determine an electrical resistance of an optoelectronic component to be tested by means of a four-point measurement.
  • the contact elements are designed as contact needles.
  • the contact elements are thereby suitable for the simple electrical contacting of electrical contact surfaces of the optoelectronic components to be tested.
  • this device includes a valve disposed over the top of the contact carrier optical ele ment ⁇ .
  • the optical element can advantageously be used for beam shaping of an electromagnetic radiation emitted by the optoelectronic components to be tested serve.
  • the optical element can also be used for beam shaping of an electromagnetic radiation directed onto the optoelectronic components to be tested.
  • the optical element comprises an optical lens.
  • the optical lens can serve as game at ⁇ for bundling or expansion of electromagnetic radiation.
  • the optical element comprises a beam splitter.
  • the beam splitter can serve, for example, to divide a light beam emitted by an optoelectronic component to be tested in order to supply it to two different detectors. This advantageously enables a simultaneous measurement of two different properties of an optoelectronic component to be tested.
  • the optical element comprises a diffuser.
  • the diffuser may for example be used to cause a more homogeneous illumination of a detector with egg ⁇ ner by a to be tested optoelectronic component emitted electromagnetic radiation.
  • the optical element comprises a plurality of glass fibers.
  • the glass fibers can be used to by the optoelectronic devices to be tested emitted electromagnetic radiation to a De ⁇ Tektor to conduct.
  • the glass fibers can advantageously also deflect the electromagnetic radiation sideways, which makes it possible to arrange the detector at a favorable position, for example laterally next to the optical element.
  • each test unit is assigned a glass fiber.
  • the optical element is rigidly connected to the Kunststofferä ⁇ ger via a connecting element. This advantageously makes it possible to press the contact carrier by means of a force exerted on the contact carrier via the connecting element against a wafer composite to be tested optoelectronic components.
  • the optical element is at least partially embeds ⁇ in the connecting element.
  • ⁇ in the connecting element.
  • the connecting element can, for example ⁇ consist of an optically transparent material.
  • this has a detector arranged above the upper side of the contact carrier.
  • the detector can serve to detect a light emitted by an optoelectronic component to be tested, in order to gain information about the operability of the optoelectronic component to be tested.
  • the detector comprises a camera.
  • the camera can for example serve a presence and / or a brightness and / or power emit a ⁇ oriented by A scan optoelectronic component electromagnetic radiation to be detected.
  • the detector comprises a spectrometer.
  • the spectrometer can be used to analyze a wavelength of an electromagnetic radiation emitted by an optoelectronic component to be tested.
  • the device is to be tested, each optoelectronic component is a test unit zugeord ⁇ net.
  • the device must be placed just a ⁇ times over the wafer composite by around each to tes ⁇ tend optoelectronic component of the composite wafer to tes ⁇ th. This advantageously permits a time-saving testing of the optoelectronic components of the wafer assembly.
  • a method for testing optoelectronic components arranged in a wafer composite comprises steps for arranging a contact carrier with a plurality of test units over the wafer composite, wherein a test unit is assigned to each optoelectronic component to be tested, each test unit having at least one contact element arranged on a bottom side of the contact carrier , each to be tested opto-electronic component is electrically contacted by the Kon ⁇ clock element of the associated test unit, each test unit comprises an optically transmissive window that extends between the bottom and a top of the contact carrier, and for sequentially testing a plurality of in the wafer composite arranged optoelectronic components.
  • this method requires only a one-time locating the contact carrier to the wafer assembly to then test a multi ⁇ number of optoelectronic components. As a result, the method is advantageously particularly time-saving feasible.
  • each test unit is thus attached above the associated optoelectronic component. orders that the window of the test unit is arranged above a radiation passage area of the associated optoelectronic component.
  • a light emitted from the test opto-electronic component ⁇ light can pass to a detector through the window of the associated one optoelectronic component test unit of the contact carrier.
  • electromagnetic radiation can reach the optoelectronic component to be tested, which makes it possible to check a response of the optoelectronic component to be tested to the electromagnetic radiation.
  • the testing of an optoelectronic component comprises steps for applying an electrical voltage to the optoelectronic component or for feeding an electrical current into the optoelectronic component and for detecting an electromagnetic radiation emitted by the optoelectronic component.
  • the method is suitable, for example, for testing light emitting diodes formed as components or as La ⁇ serbauieri optoelectronic components.
  • a brightness and / or a power of the radiation emitted by the optoelectronic component is detected.
  • this enables a check whether an emitted by the opto-electronic component ⁇ radiation reaches a specified differently bene brightness and / or performance.
  • a wavelength of the electromagnetic radiation emitted by the optoelectronic component is detected.
  • this makes it possible to check whether the electromagnetic radiation emitted by the optoelectronic component has a predetermined wavelength.
  • Figure 1 is a schematic representation of a first test device
  • Figure 2 is a schematic representation of a second test device.
  • FIG. 1 shows a highly schematic representation of a first test device 100.
  • the first test device 100 is used for testing optoelectronic components 310 arranged in a wafer composite 300.
  • the optoelectronic devices 310 can be trained det to electromagnetic radiation, for example visual ⁇ bares light to emit.
  • the opto ⁇ electronic components 310 may be formed as light emitting diode devices (LED devices) or as laser devices.
  • the optoelectronic devices 310 can also be configured to emit electromagnetic radiation to absorbie ⁇ ren.
  • the optoelectronic devices 310 for example, as solar cells or as photo diodes being ⁇ forms to be.
  • the opto-electronic components 310 are connected in the wafer assembly 300 with each other and in the wafer assembly 300 in ge ⁇ common operations have been manufactured in parallel.
  • the wafer composite 300 has the shape of a disk.
  • the optoelectronic components 310 are arranged laterally next to one another in the wafer composite 300.
  • the optoelectronic components 310 are preferably in a regular array of rows and columns in the wafer assembly 300 angeord ⁇ net.
  • Each optoelectronic component 310 of the wafer composite 300 has a first electrical contact surface 311, which is accessible on an upper side 301 of the wafer composite 300. Furthermore, each optoelectronic component 310 of the
  • each optoelectronic component 310 may also be lent accessible on the upper side 301 of the wafer assembly 300th
  • the second electrical contact surface may also be accessible on one of the upper surface 301 of the wafer assembly 300 against ⁇ opposite bottom 302 of the wafer assembly 300th
  • the optoelectronic components 310 may be adjacent to the first electrical contact surface 311 and the second
  • Wafer composite 300 Wafer composite 300, a radiation passage surface 312, which is formed on the upper side 301 of the wafer composite 300. If the optoelectronic components 310 are light-emitting components, then the radiation passage area 312 forms a radiation emission surface . If the optoelectronic components 310 are light-absorbing components, then the radiation passage area 312 forms a radiation absorption area.
  • the first electrical contact surface 311 and the second electrical contact surface of each optoelectronic component 310 can serve to apply an electrical voltage to the respective optoelectronic component 310 or to generate a current feed to the respective optoelectronic
  • the opto-electronic Bauele ⁇ elements 310 may be configured to output 311, and their respective second electrical contact surfaces, an electrical voltage or an electrical current between its respective first electrical contact surface, provided that suitable electromagnetic radiation falls on the respective radiation passage surface 312.
  • the optoelectronic components 310 of the wafer composite 300 must be tested for their ability to function after their production and before the separation of the optoelectronic components 310 by dividing the wafer composite 300.
  • each optoelectronic device 310 If it is in the optoelectronic devices 310 to light-emitting devices, it can be checked ⁇ as this example, if each optoelectronic device 310 emits electromagnetic Strah ⁇ lung when an electric voltage or in feeding an electric current. It can also be checked, a brightness and / or performance and / or a wavelength of an optionally emitted by the optoelectronic component 310 electromag netic radiation ⁇ . If the optoelectronic components 310 of the wafer composite 300 are light-absorbing components, then it can be checked whether each optoelectronic component 310 outputs an electrical voltage or an electrical current in response to an impingement of suitable electromagnetic radiation on its radiation passage area 312. It is also possible to check a value of an optionally output electrical voltage or of an optionally output electric current.
  • the first test device 100 comprises a carrier 150 with a substantially planar upper side.
  • the carrier 150 may also be referred to as chuck.
  • the wafer composite 300 is arranged on the upper side of the carrier 150.
  • the bottom 302 of the wafer assembly 300 of the top of the Trä ⁇ gers 150 faces.
  • the carrier 150 may be formed be to suck the wafer assembly 300 to fix the wafer assembly 300 to the carrier 150.
  • the first test device 100 further comprises a contact carrier 110.
  • the contact carrier 110 has a disc-shaped basic shape with an upper side 111 and an underside 112 opposite the upper side 111.
  • the contact carrier 110 preferably has at least the same size as the Waferver ⁇ bund 300.
  • the contact carrier 110 has a plurality of test units 120.
  • Each test unit 120 of contact carrier 110 of the ERS ⁇ th test device 100 is provided for testing an optoelectronic device 310 of the wafer assembly 300th Loading vorzugt corresponds to the number of the test units 120 of the Kon ⁇ balance carrier 110, the number of optoelectronic devices 310 of the wafer assembly 300.
  • the individual test units 120 of the contact carrier 110 are arranged laterally next to one another.
  • the arrangement of the test units 120 corresponds to the arrangement of the optoelectronic components 310 in the wafer assembly 300.
  • the Testeinhei ⁇ th 120 are preferably in a regular array of rows and columns on the contact carrier 110 is formed.
  • Each test unit 120 of the contact carrier 110 has at least one contact element 121.
  • the contact element 121 may be formed at ⁇ example, as a contact needle or contact tip.
  • the contact elements 121 of all test units 120 of the contact carrier 110 are arranged on the underside 112 of the Kunststoffträ ⁇ gers 110.
  • the contact element 121, each test unit 120 is used for electrically contacting the first electrical contact area 311 of the respective test unit 120 of contact carrier 110 associated optoelectronic construction elements 310 of the wafer assembly 300.
  • Each test unit 120 of contact carrier 110 may be a further contact element aufwei ⁇ sen that the electrical Contacting the second electrical see contact surface of the respective optoelectronic component 310 of the wafer composite 300 is provided if the second electrical contact surfaces of the optoelectronic components 310 are formed on the upper side 301 of the wafer composite 300.
  • the contacting of the second electrical contact surfaces of the optoelectronic devices 310 of the wafer assembly 300 may also for example, via the Trä ⁇ ger 150, if the second electrical contact surfaces of the optoelectronic components are formed on the bottom 302 of the wafer assembly 300 310th
  • the test units 120 of the contact carrier 110 of the first test device 100 may also have additional contact elements which are intended to be ⁇ sharmlichen contacting the first electrical contact surface 311 and / or the second electrical contact surfaces of the respective associated optoelectronic components 310th This allows multipoint measurements.
  • the test units 120 of the contact carrier 110 of the first test ⁇ device 100 can also contact elements aufwei ⁇ sen, the surfaces for contacting further electrical Kunststoffflä- the respectively associated optoelectronic components
  • test units 120 of the contact carrier 110 of the first test device 100 each include a window 122 which extends between the bottom 112 and the top 111 through the contact carrier 110.
  • the window 122 is formed as an opening of the contact carrier 110. However, it could be located in the window 122 and an optically transparent mate rial ⁇ , for example a glass.
  • test unit 120 of contact carrier 110 of the first test ⁇ apparatus 100 is such arranged on the upper side 301 of the wafer assembly 300 that each test unit 120 of the Kon ⁇ balance carrier 110 seen on the respectively assigned optoelectronic device 310 of the wafer assembly is arranged 300th
  • the contact element 121 contacts the first electrical contact surface
  • test unit 120 con ⁇ tact the first electrical contact surface 311 or wei ⁇ tere electrical contact surfaces of the optoelectronic device 310.
  • the window 122 of the test unit 120 is disposed over the radiation passage surface 312 of the associated opto ⁇ electronic component 310.
  • the first test device 100 further comprises an optical element 130, which is arranged above the contact carrier 110, that is to say above the upper side 111 of the contact carrier 110 on the side of the contact carrier 110 facing away from the wafer composite 300.
  • the optical element 130 comprises a diffuser 131.
  • the diffuser 131 is provided to homogeneously distribute electromagnetic radiation emitted by one of the optoelectronic components 310 of the wafer composite 300. However, the diffuser 131 could also be omitted.
  • the optical element 130 may further optical components umfas ⁇ sen.
  • the first test device 100 further comprises a detector unit 140, which is likewise arranged above the upper side 111 of the contact carrier 110.
  • the optical element 130 is arranged between the contact carrier 110 and the detector unit 140.
  • the detector unit 140 includes a camera 141.
  • the camera 141 is provided to detect light emitted from egg ⁇ nem of the optoelectronic devices 310 of the wafer assembly 300 electromagnetic radiation.
  • the camera 141 can also be designed to detect a brightness and / or a power of an electromagnetic radiation emitted by one of the optoelectronic components 310 of the wafer composite 300.
  • the detector unit 140 could comprise, instead of the camera 141 or in addition to the camera 141, further detector components.
  • the first test device 100 may have a light source instead of the detector unit 140.
  • the light source can be designed to emit electromagnetic radiation of a predetermined wavelength or a predetermined spectral composition.
  • the wafer composite 300 is arranged on the upper side of the carrier 150 of the first test apparatus 100. Subsequently, the contact carrier 110 is placed above the upper surface 301 of the wafer assembly 300 so that the test units 120 of the contact carrier 110, the optoelectronic devices 310 of the wafer assembly 300 kontak ⁇ animals in the manner described. Subsequently, all components 310 of the wafer composite 300 to be tested are tested sequentially one after the other. Since ⁇ with no further modification or repositioning of the contact carrier ⁇ 110 or other parts of the first test device 100 is required.
  • the optoelectronic devices 310 of the wafer assembly 300 If it is in the optoelectronic devices 310 of the wafer assembly 300 to light emitting devices, so is used for testing each of the optoelectronic component 310 by means of the contact element 121 and any further Kon ⁇ of the optoelectronic component 310 conces- assigned test unit 120 clocking elements an electrical voltage to the to testing optoelectronic device 310 is applied or an electric current is fed. Characterized the opto-electro ⁇ African device 310 for emitting a light beam 160 is excited at ⁇ . The light beam 160 passes through the window 122 of the optoelectronic component 310 associated test unit 120 of the contact carrier 110 to the optical element 130.
  • the diffuser 131 of optical element 130 distributes the light of the light beam 160 in a the wafer assembly 300 pa ⁇ rallelen level. From the optical element 130, the light of the light beam 160 reaches the camera 141 of the detector unit 140 of the first test device 100 and is detected there. The camera 141 of the detector unit 140 may also determine a Hellig ⁇ resistance and / or a power of light beam 160th , The detected by the detector unit 140 radiating light ⁇ 160 is not the desired brightness and / or power on, or no light beam 160 is detected, the tested opto-electronic device 310 is defective.
  • the optoelectronic components 310 of the wafer composite 300 are light-absorbing components, then for testing each optoelectronic component 310 by means of the light source of the first test apparatus 100 through the window 122 of the test unit 120 of the contact carrier 110 assigned to the respective optoelectronic component 310 electromagnetic radiation wavelength absorbable by the optoelectronic component 310 is radiated onto the radiation passage area 312 of the respective optoelectronic component 310.
  • electromagnetic radiation wavelength absorbable by the optoelectronic component 310 is radiated onto the radiation passage area 312 of the respective optoelectronic component 310.
  • FIG. 2 shows a highly diagrammatic representation of a second test device 200.
  • the second test device 200 is used to test in a wafer assembly 300 is arrange ⁇ ten optoelectronic devices 310.
  • the second test device 200 comprises a support 250, on the top side of the wafer assembly 300 arranged who ⁇ can that the bottom 302 of the wafer composite 300 faces the top of the carrier 250.
  • the carrier 250 can be designed to suck the wafer assembly 300 to fix the wafer assembly 300 to the carrier 250.
  • the second test device comprises a contact carrier 210 having a top 211 and one of the upper surface 211 against ⁇ opposite bottom 212.
  • the contact carrier 210 includes a plurality of test units 220.
  • Each test unit 220 is provided to one of the respective test unit 220 associated optoelectronic device 310 of the wafer assembly 300 to test.
  • Each test unit 220 comprises at least one Kon ⁇ clock element 221, which is disposed on the underside 212 of the contact carrier 210 and serves to which the respective test ⁇ unit 220 associated opto-electronic device 310 electrically contact.
  • each test unit 220 a window 222 that extends between the bottom 212 and the top 211 of the contact carrier 210 through the contact carrier ⁇ 210 extends.
  • the contact carrier 210 of the second test device 200 corresponds to the contact carrier 110 of the first test device 100.
  • an optical lens 223 is disposed in the window 222 formed as a through hole.
  • the optical lens 223 serves to focus a light emitted by the optoelectronic component 310 assigned to the test unit 220 or a light directed to the optoelectronic component 310 assigned to the test unit 220.
  • the second test device 200 comprises an optical
  • the optical element 230 of the second test apparatus 200 includes an optical lens 231 and an optical lens 231 in the direction of
  • Wafer composite 300 downstream beam splitter 232 The optical lens 231 is adapted to each of the optoelectronic ⁇ 310 components of the wafer composite 300 emitted to direct electromagnetic radiation to the beam splitter 232.
  • the beam splitter 232 is designed to divide a light beam emitted by one of the optoelectronic components 310 of the wafer composite 300 into two partial beams.
  • the second test device 200 comprises a detector unit 240 disposed above the top surface 211 of the contact carrier ⁇ 210th
  • the optical element 230 is arranged between the contact carrier 210 and the detector unit 240.
  • the detector unit 240 includes a camera
  • the camera 241 of the detector unit 240 is arranged so that one of the partial beams generated by the beam splitter ⁇ 232 of the optical element 230 is incident on the camera 241st
  • the spectrometer 242 of the detector unit 240 is arranged such that the second of the partial beams generated by the beam splitter 232 impinges on the spectrometer 242.
  • the camera 241 of the detector unit 240 can serve to detect a light emitted by one of the optoelectronic components 310 of the wafer composite 300 and, if appropriate, a brightness and / or a power of this light.
  • the spectrometer 242 of the detector unit 240 can serve to analyze a spectral composition of an electromagnetic radiation emitted by one of the optoelectronic components 310 of the wafer composite 300.
  • the wafer composite 300 is arranged on the carrier 250. Subsequently, the contact carrier is positioned 210 in such a way over the top 301 of the optoelectronic component 310 that each test unit 220 of the contact carrier 210 to one of the opto-electro ⁇ African components is assigned 310 and the respective opto-electronic device 310 in the manner described with reference to the Figure 1 example, contacted. Then all the optoelectronic components 310 of the wafer composite 300 to be tested are tested sequentially one after the other without the need for further repositioning of the contact carrier 210.
  • each optoelectronic device 310 For testing each optoelectronic device 310 if it is at the optoelectronic devices 310 of the wafer assembly 300 to light emitting devices, it is of the wafer assembly 300 by means of the optoelectronic construction ⁇ element 310 associated test unit 220 of contact carrier 210, an electrical voltage to the optoelectronic construction ⁇ element 310 applied or fed an electric current.
  • a light beam 260 emitted thereon by the optoelectronic component 310 passes through the window 222 of the test unit 220 of the contact carrier 210 assigned to the optoelectronic component 310 and is thereby collimated by the optical lens 223 arranged in the window 222.
  • the light beam 260 reaches the optical lens 231 of the optical element 230 and becomes the optical lens 231
  • Beam splitter 232 of the optical element 230 of the second test apparatus 200 directed.
  • the beam splitter 232 divides the
  • Light beam 260 into two partial beams, one of which passes to the camera 241 of the detector unit 240 and the other to the spectrometer 242 of the detector unit 240.
  • the camera 241 de- the presence of the light beam 260 and, where ⁇ appropriate, a brightness and / or a power of the light ⁇ beam 260.
  • the spectrometer 242 analyzes a spectral composition of the light beam 260. If the camera 241 of the detection unit 240 the light beam 260 is not tektiert detected, the light beam 260 does not have a desired brightness and / or power or the spectral composition of the light beam 260 does not correspond to a desired spectral composition, the tested optoelectronic component 310 is detected as defective.
  • the optoelectronic components 310 of the wafer composite 300 are light-absorbing components
  • a light source may be present instead of the detector unit 240.
  • the beam splitter 232 of the optical element 230 may be omitted in this case.
  • the beam splitter 232 of the optical element 230 may also be omitted.
  • the testing The opto ⁇ electronic components 310 of the wafer composite 300 formed by means of the second test apparatus 200 as light-absorbing components then take place analogously to the testing of the optical components 310 formed as light-absorbing components by means of the first test apparatus 100.
  • Fig. 3 shows a schematic representation of a third test device 400.
  • the third test apparatus 400 is used as the first test device 100 and the second Testvorrich ⁇ tung 200, for testing arranged in a wafer composite optoelectronic components.
  • the wafer composite and a support of the third test device 400 carrying the wafer composite are not shown in the simplified representation of FIG. 3 and may be formed as explained with reference to FIGS. 1 and 2.
  • the third test device 400 comprises a contact carrier 410 with an upper side 411 and a lower side 412 lying opposite the upper side 411.
  • the contact carrier 410 has a plurality of test units 420.
  • Each test unit 420 is provided to test an optoelectronic component of the wafer assembly assigned to the respective test unit 420.
  • Each test unit 420 comprises at least one contact element 421, which is arranged on the underside 412 of the contact carrier 410 and serves to make contact with the optoelectronic component assigned to the respective test unit 420.
  • each test unit 420 has a window 422 that extends between the bottom 412 and the top 411 of the contact carrier 410 through the contact carrier 410.
  • the contact carrier 410 of the third test ⁇ device 400 corresponds to the contact carrier 110 of the first test device 100.
  • the third test apparatus 400 includes an optical element 430, which is attached ⁇ arranged above the upper surface 411 of the contact carrier 410th
  • the optical element 430 of the third Testvorrich ⁇ tung 400 includes an optical lens 431 and a diffuser 432. In this case, the diffuser 432 between the contact carrier 410 and the optical lens 431 is arranged.
  • the third test device 400 has a detector unit 440.
  • the detector unit 440 of the third test device 400 may be formed as the detector unit 140 of the first test device 100, or as the detector unit 240 of the second test device 200.
  • the De ⁇ tektoratti 440 may for example comprise a camera and / or a spectrometer.
  • the detector unit 440 is provided to detect electromagnetic radiation emitted by one of the optoelectronic components of the wafer composite to be tested and, if appropriate, to analyze its brightness and / or power and / or its wavelength.
  • the diffuser 432 may be formed like the diffuser 131 of the optical element 130 of the first test device 100.
  • the diffuser 432 may serve to homogeneously distribute electromagnetic radiation emitted by one of the optoelectronic components of the wafer composite to be tested.
  • the optical lens 431 of the optical element 430 of the third test device 400 may be formed like the optical lens 231 of the optical element 230 of the second test device 200.
  • the optical lens 431 may serve to detect one of the optoelectronic components of the wafer composite to be tested emitted electromagnetic radiation to the detec ⁇ gate unit 440 of the third test device 400 divert and bundle.
  • optical lens 431 and the diffuser 432 are merely exemplary components of the optical element 430 optical element 430 may also include other or additional Components ⁇ th, such as a beam splitter.
  • the components of the optical element 430 of the third test device 400 are rigidly connected to the contact carrier 410 of the third test device 400 via a connecting element 435.
  • the optical lens 431 and the diffuser 432 are at least partially embedded in the connecting element 435.
  • the connecting element 435 has an optically transparent material, for example a glass or an optically transparent plastic.
  • the optical lens 431, the diffuser 432 and the connecting element 435 are preferably produced monolithically or joined together seamlessly, for example glued together.
  • the connecting element 435 is directly adjacent to the upper ⁇ page 411 of the contact carrier 410 of the third test apparatus 400, and preferably covers a large part of the upper surface 411 of the contact carrier 410.
  • the connection member 435 preferably has a mechanically robust material. This allowed ⁇ light to exert a force on the contact carrier 410 via the connecting member 435, by means of which the contact elements 421 of the test units 420 of the contact carrier 410 against the electrical contact surfaces of the test opto-electronic components of the wafer composite are pressed. Here ⁇ by a high pressure can be applied, allowing a reliable electrical contact of the test opto ⁇ electronic components.
  • the third test device 400 comprises a contact pressure device 470, which serves to exert the contact force for the purpose of reliable electrical contacting of the optoelectronic components to be tested on the connecting element 435.
  • the pressing device 470 is designed as a ring which, on a side remote from the contact carrier 410, is attached to the connection. fitting element 435.
  • the formation of the pressing device 470 as a ring makes it possible to arrange the detector unit 440 of the third test device 400 inside or above this ring so that electromagnetic radiation emitted by the optoelectronic components to be tested passes through the components 431, 432 of the optical element 430 and the connecting element 435 can reach the detector unit 440.
  • 4 shows a schematic representation of a fourth test device 500.
  • the fourth test device 500 is also used for testing optoelectronic components arranged in a wafer composite.
  • the wafer composite and a carrier supporting the wafer composite of the fourth test device 500 are not shown in the simplified illustration of FIG. 4 and may be formed as explained with reference to FIGS. 1 and 2.
  • the fourth test apparatus 500 includes a contact carrier 510 having a top 511 and one of the top 511 ge ⁇ genüberkeep bottom 512.
  • the contact carrier 510 includes a plurality of test units 520.
  • Each test unit 520 is provided to one of the respective test unit 520 associated optoelectronic component of the wafer composite to test.
  • Each test unit 520 comprises at least one Kon ⁇ clock element 521, which is disposed on the underside 512 of the contact carrier 510 and serves to which the respective test ⁇ unit 520 associated optoelectronic component
  • each test unit 520 a window 522 that extends through the contact carrier ⁇ 510 between the bottom 512 and the top 511 of the contact carrier 510th
  • the contact carrier 510 of the fourth test device 500 corresponds to the contact carrier 110 of the first test device 100.
  • optical lenses it is possible to arrange optical lenses in the windows 522 of the test unit 520 of the fourth test device 500, as is the case with the contact carrier 210 of the second test device 200.
  • the fourth test device 500 comprises an optical element 530, which is located on the side of the contact carrier 510 facing away from the wafer composite, above the upper side 511 of the contact carrier
  • the optical element 530 comprises a plurality of glass fibers 531, which in a connecting element
  • the connecting element 535 rigidly connects the glass fibers 531 to the contact carrier 510.
  • the connecting element 535 has a hard and mechanically robust material, for example a metal.
  • the Verbin ⁇ -making element 535 need not be transparent visually.
  • the glass fibers 531 may, for example, be glued into bores of the connecting element 535.
  • the glass fibers 531 may also be cast into the connecting element 535.
  • the connecting element 535 is located directly at the top
  • the fourth test device 500 on a pressing device 570, by means of a in the direction force acting on the contact carrier 510 can be exerted on the connecting element 535.
  • the rigid connecting element 535 transmits this force to the contact carrier 510, which makes it possible to press the contact elements 521 of the test units 520 of the contact carrier 510 of the fourth test device 500 with the force exerted by the pressing device 570 against electrical contact surfaces of the optoelectronic components of the wafer composite, in order to ensure a secure electrical connection between the optoelectronic components to be tested and the contact elements 521 of the test units 520 of the fourth test device 500.
  • the pressing device 570 is purchasedbil ⁇ det as a pressing.
  • the pressing device 570 can also be designed differently.
  • the fourth test device 500 comprises a detector unit 540, which serves for the detection of electromagnetic radiation emitted by the optoelectronic components to be tested.
  • the detector unit 540 may be formed like the detector unit 140 of the first test apparatus 100 or as the detector unit 240 of the second test apparatus 200 and may include, for example, a camera and / or a spectrometer.
  • the detector unit 540 of the fourth test device 500 is arranged laterally next to the connecting element 535 in the example shown.
  • the plurality of optical fibers 531 of the optical element 530 preferably comprises at least one optical fiber per 531 ⁇ testing equipment 520 of the fourth integrated test apparatus 500.
  • Each test unit 520 is associated with at least one glass fiber 531st
  • a first longitudinal end of each optical fiber 531 assigned to a test unit 520 is arranged in the region of the window 522 of the respective test unit 520 so that electromagnetic radiation emitted by an optoelectronic component assigned to the respective test unit 520 can be coupled into the glass fiber 531 at the first longitudinal end of the respective glass fiber 531. This can optionally be done by means of an arranged in the respective window 522 optical lens.
  • a second longitudinal end of the respective glass fiber 531 is arranged on the detector unit 540, so that electromagnetic radiation coupled into the glass fiber 531 at the first longitudinal end can emerge at the second longitudinal end of the glass fiber 531 and can be detected by the detector unit 540.
  • first longitudinal end and its second longitudinal end of each optical fiber 531 extends through the connecting member 535th
  • FIG. 6 shows a schematic illustration of a fifth test device 600.
  • the fifth test device 600 is also used for testing optoelectronic components arranged in a wafer composite.
  • the fifth test device 600 includes a contact carrier 610 having a top 611 and one of the top 611 ge ⁇ genüberproof bottom 612.
  • the contact carrier 610 includes a plurality of test units 620.
  • Each test unit 620 is provided to one of the respective test unit 620 associated optoelectronic component to test the wafer composite.
  • Each test unit 620 comprises at least one Kon ⁇ clock element 621, which is disposed on the underside 612 of the contact carrier 610 and serves to which the respective test ⁇ unit 620 associated opto-electronic device 610 electrically contact.
  • each test unit 620 has a window 622 extending between the bottom 612 and the top 611 of the contact carrier 610 through the contact carrier 610.
  • the contact carrier corresponds
  • the 610 of the fifth test device 600 may be the contact carrier 110 of the first test device 100.
  • Optical windows may also be provided in the windows 622 of the test units 620 of the fifth test device 600, as is the case with the contact carrier 210 of the second test device 200.
  • the fifth test device 600 has an optical element 630.
  • the optical element 630 comprises a light guide 631, which is formed for example as a cylindrical or cuboid block.
  • the light guide 631 is arranged above the upper side 611 of the contact carrier 610 of the fifth test device 600 and directly adjoins the upper side 611 of the contact carrier 610. In this case, the light guide 631 preferably covers as much of the upper side 611 of the contact carrier 610 as possible.
  • the light guide 631 has an optically transparent or translucent material.
  • the light guide 631 is preferably designed as a diffuser. Electromagnetic radiation emitted by the optoelectronic components to be tested, which enters the light guide 631 through the windows 622 of the test units 620 of the fifth test apparatus 600, then becomes diffused diffusely in the light guide 631 and can emerge from the light guide 631 on side surfaces of the light guide 631 perpendicular to the upper side 611 of the contact support 610. On the side surfaces of the light guide 631 from the light guide 631 outgoing electromagnetic radiation can be de- tektiert 600 by ei ⁇ ner detector unit 640 of the fifth test device. For this purpose the detector unit 640 may be UNMIT ⁇ telbar disposed on a side surface of the light guide 631st At one or more side surfaces of the light guide
  • the detector unit 640 of the fifth test device 600 may be formed as the detector unit 140 of the first test device 100 or the detector unit 240
  • the second test device 200 may include, for example, a camera and / or a spectrometer.
  • the light guide 631 has a rigid and mechanically robust material. On the side facing away from the contact carrier 610 side of the light guide 631, a pressing device 670 is arranged.
  • the pressing device 670 makes it possible to exert a force on the contact carrier 610 of the fifth test device 600 via the light guide 631, by means of which the contact elements 621 of the test units 620 of the contact carrier 610 can be pressed against electrical contact surfaces of the optoelectronic components to be tested of the wafer composite to be tested to ensure a reliable electrical connection between the contact elements 621 of the test units 620 and the electrical contact surfaces of the optoelectronic devices.

Abstract

L'invention concerne un dispositif destiné à tester des composants optoélectroniques disposés dans une plaque de silicium composite, comprenant un support de contacts qui comporte une pluralité d'unités à tester. Chaque unité à tester comporte au moins une élément de contact disposé sur un côté inférieur du support de contacts. En outre, chaque unité à tester comporte une fenêtre optiquement transparente qui s'étend entre le fond et un côté supérieur du support de contacts.
PCT/EP2014/069097 2013-09-10 2014-09-08 Dispositif et procédé pour tester des composants optoélectroniques WO2015036368A1 (fr)

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DE102013218062.4 2013-09-10
DE201310218062 DE102013218062A1 (de) 2013-09-10 2013-09-10 Testvorrichtung und Verfahren zum Testen von optoelektronischen Bauelementen

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WO2020070148A1 (fr) * 2018-10-04 2020-04-09 Osram Opto Semiconductors Gmbh Dispositif et procédé de traitement d'une pluralité de puces semi-conductrices
CN112385027A (zh) * 2018-07-10 2021-02-19 三星电子株式会社 电子装置、用于制造led模块的方法和计算机可读记录介质
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DE102016114459A1 (de) * 2016-08-04 2018-02-08 Osram Opto Semiconductors Gmbh Verfahren und Vorrichtung zur Vermessung einer Vielzahl an Halbleiterchips in einem Waferverbund
JP6449830B2 (ja) * 2016-10-11 2019-01-09 日機装株式会社 試験装置および発光装置の製造方法

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