EP1675453A2 - Dispositif pour illuminer des objets et dispositif capteur - Google Patents

Dispositif pour illuminer des objets et dispositif capteur Download PDF

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Publication number
EP1675453A2
EP1675453A2 EP05110130A EP05110130A EP1675453A2 EP 1675453 A2 EP1675453 A2 EP 1675453A2 EP 05110130 A EP05110130 A EP 05110130A EP 05110130 A EP05110130 A EP 05110130A EP 1675453 A2 EP1675453 A2 EP 1675453A2
Authority
EP
European Patent Office
Prior art keywords
illumination
light
illumination unit
illuminating
measuring field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05110130A
Other languages
German (de)
English (en)
Other versions
EP1675453A3 (fr
Inventor
Karl-Heinz Besch
Rüdiger FROESE-PEECK
Christian Schauer
Bernhard Stredele
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1675453A2 publication Critical patent/EP1675453A2/fr
Publication of EP1675453A3 publication Critical patent/EP1675453A3/fr
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Definitions

  • the invention relates to a device for illuminating objects, in particular for illuminating electronic components and / or applied to component carriers markers, wherein different illumination units illuminate the object to be illuminated at different illumination angles.
  • the invention further relates to a sensor device for the visual detection of objects, in particular for the detection of electronic components and / or applied to component carriers markings, which has a light detector and a lighting device of the type mentioned above.
  • components are provided by a component feeder at certain pickup positions and picked up by a placement, which can be positioned by means of a positioning within a work area.
  • the fetched components are transported from the placement to a placement position and placed on the component carrier to be fitted to defined by corresponding pads installation positions.
  • placement performance is to be understood in this context as the maximum number of components that can be picked up within a certain time unit of the component feeder and placed on the circuit board.
  • the position measurement of the component and circuit board must be both very precise and very fast.
  • a lighting device which illuminates the objects to be detected at different illumination angles and / or with a light having different spectral components with high light intensity, so that a large number of different objects with different optical properties can be reliably measured.
  • the choice of illumination angle or illumination spectrum depends on the optical behavior of the respective object to be detected and possibly also on the optical behavior of the background, in front of which the respective object is recorded.
  • an optical sensor device in which three different illumination units are provided, which illuminate the object to be detected in each case from a different angle. Some of the lighting units have at least two light elements emitting in different spectral ranges. All lighting elements can be controlled independently of each other by means of a control device, so that the illumination spectrum can be optimally adapted to the respective situation.
  • the optical sensor device has the disadvantage that the three lighting units having lighting device can only be produced in a complex manner, since the corresponding Lighting elements must be mounted at different positions on different levels within the lighting device.
  • the invention has for its object to provide a device for illuminating or a device for detecting objects, which allows a variety of different lighting and can be constructed by means of a simple and therefore inexpensive assembly activity.
  • This object is achieved by a device for illuminating objects, in particular for illuminating electronic components and / or applied to component carriers markings having the features of independent claim 1.
  • the illumination device comprises a first illumination unit for illuminating a measurement field at a first illumination angle and a second illumination unit for illuminating the measurement field at a second illumination angle. Between the second illumination unit and the measurement field, an optical element is arranged, which influences the beam path between the second illumination unit and the measurement field such that the beam path extends outside the direct geometric connection between the second illumination unit and the measurement field.
  • a simple mounting of the lighting device is inventively achieved in that both the first and the second lighting unit are mounted on a common circuit board.
  • a third illumination unit is additionally provided for illuminating the measurement field at a third illumination angle, wherein the third illumination unit is likewise attached to the common circuit carrier.
  • the common circuit carrier having all the lighting units can then in particular be simple Be prepared, if the lighting elements, which are provided for the three lighting units, so-called SMD (Surface Mount Device) components. Accordingly, light-emitting diodes which are inexpensive and deliver a high luminous efficacy at low power consumption are suitable as light-emitting elements.
  • the sensor device additionally has a partially transmissive mirror arranged above the measuring field, which allows a vertical illumination of the measuring field by the third illumination unit.
  • the beam path of the third illumination light can also extend via an additional reflector and / or via a light scattering element for producing diffuse illumination light.
  • the lighting units are set up so that they can emit illumination light in different spectral ranges.
  • the illumination light can thus be optimally adapted to a multiplicity of different situations, which are determined by the optical behavior of the objects to be detected.
  • the different spectral ranges can be realized either in that different illumination units emit different spectral distributions to illumination light or that a lighting unit covers different spectral ranges, which can be realized most simply by providing a plurality of spectrally different light elements for one lighting unit.
  • an electronic driver circuit for driving the lighting units is also attached to the common circuit carrier.
  • the lighting device additionally has a scattering element, which is arranged in the beam path of the first illumination light and thus enables diffuse illumination of the objects to be detected by the first illumination unit.
  • a diffuse illumination is particularly advantageous when the objects to be detected are reflective at least in some areas, since light reflections are considerably weakened in a diffuse illumination, which complicate the detection of the respective object.
  • the scattering element may also be integrally formed with the optical element, so that not only the first illumination unit, but also the second illumination unit causes a diffuse illumination with the said advantages. An integration of the scattering element in the optical element allows a further simplified installation of the lighting device.
  • the optical element is a light-guiding element which has a light entry surface optically coupled to the second illumination unit and a light exit surface spaced from the common circuit carrier.
  • a steep illumination is characterized by the fact that the illumination angle is in the range between 45 ° and 90 °, with an illumination angle of 90 ° is a vertical illumination of the measurement field.
  • the light-guiding element is, for example, a conventional optical waveguide or an optically transparent plastic part, which can be produced in a simple manner, in particular by known injection molding methods.
  • the optical element is a refraction element which is arranged at a distance from the second illumination unit and influences the beam path between the second illumination unit and the measurement field by refraction at at least one interface of the refraction element.
  • a very steep illumination can thus already be realized with a small circuit carrier, so that in this case too, the entire lighting device can be constructed in a very compact design.
  • the refraction element on an optical prism which represents a simple and inexpensive realization of the refraction element.
  • the advantageous embodiment according to claim 11 with a cylindrical lens as a refraction element has the advantage that Both a high illumination intensity and a wide bandwidth of illumination angles can be realized within the measurement field.
  • the wide range of illumination angles has the advantage that the illumination is particularly suitable for round or cylindrical bodies with a reflective surface, since the intensity of interfering reflections are significantly reduced, which reflections the evaluation of an image taken by a camera significantly disturb.
  • the refractive element having a cylindrical lens may have a rotational symmetry, wherein the corresponding axis of rotation coincides with the optical axis of the illumination device.
  • the cylindrical lenses also have a shape concentric about the optical axis. This allows a largely homogeneous illumination with different azimuth angles, d. H. with different illumination directions, which have all the same illumination angle relative to the measurement plane.
  • a good compromise between production cost and uniform illumination under different azimuth angles is obtained with a polygonal, in particular with an octagonal arrangement, which also has a symmetry to the optical axis.
  • the refraction element is designed such that it additionally causes light scattering.
  • the optical element has two functions: (a) the advantageous influence of the illumination angle to realize a compact design and (b) the generation of diffused light for the reduction of disturbing direct light reflections.
  • the object underlying the invention is further achieved by a sensor device for visual detection of objects, in particular for the detection of electronic components and / or of markers applied to component carriers with the features of claim 13.
  • the sensor device according to the invention comprises a light detector and a device for illuminating objects according to one of claims 1 to 12.
  • the light detector is a line or area sensor, which can be used in particular by means of a conventional CCD (Charge Coupled Device) chip or realized by means of a CMOS (Complementary Metal Oxide Semiconductor) chip.
  • CCD sensors have the advantage that they have high sensitivity and are also low-cost standard electronic components.
  • the measurement of an object is carried out by a relative movement between the object and the sensor device.
  • a plurality of one-dimensional image lines are successively recorded and assembled in an image evaluation unit connected downstream of the sensor device to form a two-dimensional image of the object.
  • FIG. 1 shows an image recognition system 100 according to a first exemplary embodiment of the invention.
  • the image recognition system 100 comprises a camera 110 and a lighting device 130.
  • the camera 110 has a housing 111 in which a CCD sensor 112 and an electronic circuit, not shown, are arranged, which controls the CCD sensor 112 and via which of the CCD Sensor 112 recorded image data are transmitted to an image evaluation unit, also not shown.
  • the camera 110 is further associated with a tube 120, which is fixed symmetrically to the optical axis of the CCD sensor 112 and which has an optic 121 and a splitter cube 122 with a semi-reflective interface 122a.
  • the divider cube 122 permits a vertical illumination of a measuring field 170, which is detected by the camera 110 via the optics 121.
  • the lighting device 130 has a housing 131 in which a printed circuit board 135 is arranged.
  • the printed circuit board 135 serves as a common circuit carrier for a plurality of electronic and optoelectronic components. All electronic and optoelectronic components are typically SMD components, which are mounted in a conventional manner on the common printed circuit board 135, so that the illumination unit 130 can be produced inexpensively. In addition, since all the components required for the illumination are located on the common printed circuit board 135, the lighting unit 130 can be easily mounted with a suitably populated printed circuit board 135.
  • a plurality of electronic components 136 are further arranged, which as driver circuits for three lighting units, a first illumination unit 140, a second illumination unit 150 and a third illumination unit 160 serve.
  • the first illumination unit 140 and the second illumination unit 150 each have light-emitting diodes which are arranged symmetrically to the optical axis of the illumination device 130, wherein the optical axis of the illumination device 130 coincides with the optical axis of the camera 110. It should be noted at this point that the number of light emitting diodes of the respective lighting unit is not limited to the number shown in FIG. In order to achieve an intense and even illumination possible without preferential directions, a plurality of LEDs can be arranged not only in the drawing plane of Figure 1, but also in other sectional planes, not shown, symmetrical to the optical axis of the illumination device 130.
  • the light-emitting diodes may be arranged on a concentric circle about the optical axis of the illumination device 130 or on the side edges of a rectangle, in particular a square, which rectangle or square likewise lies symmetrically with respect to the optical axis of the illumination device 130.
  • the first illumination unit 140 comprises a plurality of inner light-emitting diodes 141 and a plurality of outer light-emitting diodes 142, of which only two light-emitting diodes 141 and 142 can be seen in the cross-sectional view illustrated in FIG.
  • the inner light emitting diodes 141 can emit light having a first illumination spectrum
  • the outer light emitting diodes 142 emit light having a second illumination spectrum which is different from the first illumination spectrum.
  • the light-emitting diodes 141 and 142 can also be of the same type and emit light with the same wavelength spectrum, so that a high illumination intensity is achieved by the first illumination unit 140 through a high number of identical light-emitting diodes on the measurement field 170.
  • Different illumination spectra of the light emitting diodes 141 and the light emitting diodes 142 have the advantage that, provided that the individual light emitting diodes 141, 142 are individually controlled, the illumination spectrum can be optimally adapted to the optical properties of a measuring object 171 to be detected, which is positioned for detection in such a way. the surface of the measuring object 171 coincides with the measuring field 170.
  • the first illumination light emitted by the light emitting diodes 141 and 142 strikes a diffusing screen 141, which ensures that the measuring field 170 is illuminated by a diffused first illumination light. So that the camera 110 can detect the measuring field 170 largely without interference, an opening 145 which is symmetrical to the optical axis of the lighting device 130 is formed in the diffusion plate 144.
  • the second lighting device 150 has according to the embodiment shown here only a group of LEDs. It should be noted, however, that a plurality of groups of light-emitting diodes may also be used for the second lighting unit 150, so that the advantages of a high light intensity or a spectrally tunable illumination light explained above in connection with the description of the first lighting device 141 also apply to the second lighting unit 150 can be used profitably.
  • the light-emitting diodes 150 are each coupled to a light-conducting element 151, which has a light-entry surface 151a and a light-exit surface 151b.
  • the light-guiding elements 151 are preferably made of an optically transparent plastic by known injection molding methods. With a good optical coupling of the entrance surfaces 151a to the respective light-emitting diodes 150 and with a low optical attenuation of the light-guiding elements 151 Thus, the exit surfaces 151b is a quasi-light source spaced by a distance d from the common circuit board 135.
  • the resulting illumination angle ⁇ which is preferably about 45 °, smaller than that angle that would cause direct illumination of the measuring field 170 by the LEDs 150.
  • a relatively flat illumination by the second illumination unit 150 can also be realized with a relatively compact illumination unit 130, ie with a small spacing of the light emitting diodes 150 from the optical axis of the illumination device 130.
  • the light-emitting diodes of the second illumination unit 150 would have to be further apart from the optical axis of the illumination unit 130 or be arranged on separate circuit carriers.
  • the third illumination unit 160 comprises two light-emitting diodes 161 and 162 which, like the light-emitting diodes 141 and 142 of the first illumination unit 140, can emit the same or spectrally different illumination light.
  • a deflecting mirror 164 the light emitted by the light emitting diodes 161 and 162 is directed onto the divider cube 122, so that at a reflection coefficient of the boundary surface 122a of 0.5 half of the illumination light strikes the measured object 171 to be detected as vertical illumination, which For example, a held by a holding device of a mounting head not shown component is.
  • the illumination device 130 has the advantage that all light-emitting diodes and components required for illumination for driving these light-emitting diodes in SMD technology are constructed on the common printed circuit board 135. Greatly different lighting angles are used in a compact Construction of the illumination device 130 achieved in that (a) an oblique and preferably diffuse illumination by the light emitting diodes 141 and 142 of the first illumination unit 140, (b) a flat illumination by the second illumination unit 150 in conjunction with the light guide elements 151 and (c) a vertical illumination is achieved by the third illumination unit 160 in conjunction with the deflection mirror 164 and the divider cube 122.
  • FIG. 2 shows an image recognition system 200 with a camera 210 and an illumination device 230, in which two illumination units are arranged in a plane perpendicular to a measurement field 270 to be illuminated.
  • the camera 210 includes a housing 211 in which a CCD sensor 212 is disposed.
  • the camera 210 is associated with a tube 220, which serves as a holder for an optic 221, via which the measuring field 270 is imaged onto the flat CCD sensor 212.
  • the lighting device 230 includes a housing 231 in which at least two printed circuit boards 235a and 235b are mounted.
  • the two printed circuit boards 235a and 235b which can be seen in the illustrated cross-sectional view, may be separate printed circuit boards or preferably a single printed circuit board, which has a round shape and is arranged around an optical axis 290 of the lighting device 230.
  • a common printed circuit board can also be realized in that a plurality of rigid sub-printed circuit boards 235a and 235b are connected in a known manner by so-called flex connections in an angular arrangement, in particular in the form of an octagon, and are arranged symmetrically around the optical axis 290.
  • the common circuit board 235a or 235b serves as a support for a first illumination unit 240 and for a second illumination unit 250, so that the illumination device 230 can also be mounted in a simple manner.
  • the first illumination unit 240 comprises a lower light-emitting diode 241 and an upper light-emitting diode 242, which, as described above with reference to FIG. 1, emit either spectrally identical or spectrally different light.
  • the illumination light emitted by the light-emitting diodes 241 and 242 strikes a scattering element 244, which is fastened to the housing 231 via a holder 246.
  • the light-emitting diodes 241 and 242 of the first illumination unit 240 thus cause a diffuse illumination of a measurement object 270 arranged in the measuring object 270.
  • the measurement object 272 is illuminated at different angles, so that even with a domed and highly reflective measurement object, for example, a device with curved metallic pads , is realized in comparison to a direct illumination under a fixed illumination angle, a uniform illumination and thus only reflections occur with significantly lower intensity.
  • FIG. 2 schematically shows such a curved component 272, which is placed on a connection surface 275 of a printed circuit board 260.
  • the second illumination unit 250 comprises a light-emitting diode whose emitted light strikes a chamfered part of the scattering element 244, which part as prism represents a so-called refraction element 252.
  • a refraction element 252 As a result of the refraction of the illumination light emitted by the light emitting diode 250 at an entrance surface 252a and at an exit surface 252b of the prism 252, the measurement object 272 is illuminated as a result at a relatively steep illumination angle ⁇ . As can be seen from FIG. 2, this angle ⁇ is clearly smaller than the angle ⁇ 0 below which the measurement object 272 would be illuminated without the influence of the refraction element 252.
  • an optical element which is a light-guiding element 151 in the exemplary embodiment shown in FIG. 1 and a refraction element 252 in the exemplary embodiment illustrated in FIG. 2, contributes to an illumination device which permits illumination at widely differing illumination angles within a compact design can be constructed.
  • the lighting device 230 is further distinguished by the fact that a plurality of light sources for different illumination angles are arranged on a common printed circuit board 235a or 235b and thus permits a simple and rapid assembly of the lighting device 230.
  • a diffuse illumination can be realized at a multiplicity of different illumination angles, even with a compact design of the illumination device 230.
  • the scattering element 244 combined with the refraction element 252 is made of a transparent plastic and can be produced, for example, in an injection molding process.
  • the refraction element 252 has a cylindrically symmetrical or octagonal shape and is arranged symmetrically with respect to the optical axis 290 of the illumination device 230. In this way, in a compact design with a high illumination intensity, a homogeneous illumination at a wide range of illumination angles can be achieved.
  • FIG. 3 shows, according to a further exemplary embodiment of the invention, an image recognition system 300 which has a camera 310 and a lighting device 330.
  • the camera 310 is identical to the camera 210 shown in FIG. 2 and will therefore not be explained again at this point.
  • the lighting device 330 includes printed circuit boards 335a and 335b. As already described above with reference to FIG. 2, the printed circuit boards can also be constructed in the form of a one-piece printed circuit board.
  • the printed circuit board 335a or 335b serves as a support for a first illumination unit 340 and a second illumination unit 350. According to the exemplary embodiment shown here, both illumination units each have a light-emitting diode.
  • the illumination light emitted by the two light-emitting diodes 340 and 350 initially strikes a scattering element 344 before it reaches a measurement object 372 positioned in a measurement field 370.
  • the measurement object 372 is, for example, an electronic component with arched connection contacts, which are placed on a connection surface 375 of a printed circuit board 376.
  • a refracting element 348 or 352 designed as a cylindrical lens is provided in each case, which is preferably formed integrally with the scattering element.
  • the cylindrical lenses each have an entrance surface 348a or 352a and an exit surface 348b or 352b.
  • the refraction elements 348 and 352 increase the bandwidth of the effective illumination angles, so that the measurement object 372 to be measured is illuminated with a large bandwidth of different illumination angles in a compact design of the illumination device 330.
  • a homogeneous illumination is achieved with a high illumination intensity, wherein the homogeneity of the lighting in addition is further improved by the light-scattering properties of the scattering element 344.
  • the image taken by the camera 310 of the measurement object 372 is largely free of light reflections, which would interfere with a subsequent image analysis.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Geophysics And Detection Of Objects (AREA)
EP05110130A 2004-12-22 2005-10-28 Dispositif pour illuminer des objets et dispositif capteur Withdrawn EP1675453A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004061910 2004-12-22

Publications (2)

Publication Number Publication Date
EP1675453A2 true EP1675453A2 (fr) 2006-06-28
EP1675453A3 EP1675453A3 (fr) 2007-07-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP05110130A Withdrawn EP1675453A3 (fr) 2004-12-22 2005-10-28 Dispositif pour illuminer des objets et dispositif capteur

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EP (1) EP1675453A3 (fr)
CN (1) CN1798500A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008011469U1 (de) * 2008-08-28 2010-01-07 Sick Ag Optoelektronischer Sensor
DE102014205701A1 (de) * 2014-03-27 2015-10-01 Robert Bosch Gmbh Verfahren und Vorrichtung zur Bestimmung der Position und/oder Orientierung zumindest eines Steckkontakts
EP2807905B1 (fr) 2013-02-28 2015-11-18 A.B. Mikroelektronik Gesellschaft mit beschränkter Haftung Procédé de montage de composants sur un support de circuits

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10128476C2 (de) 2001-06-12 2003-06-12 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5058982A (en) * 1989-06-21 1991-10-22 Orbot Systems Ltd. Illumination system and inspection apparatus including same
DE4003983C1 (en) * 1990-02-09 1991-08-29 Abos Automation, Bildverarbeitung, Optische Systeme Gmbh, 8057 Eching, De Automated monitoring of space=shape data for mfg. semiconductors - compares image signals for defined illumination angle range with master signals, to determine defects
JP3668383B2 (ja) * 1998-02-27 2005-07-06 松下電器産業株式会社 電子部品実装装置
DE10162270B4 (de) * 2001-12-18 2004-05-13 Siemens Ag Optische Sensorvorrichtung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10128476C2 (de) 2001-06-12 2003-06-12 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008011469U1 (de) * 2008-08-28 2010-01-07 Sick Ag Optoelektronischer Sensor
EP2807905B1 (fr) 2013-02-28 2015-11-18 A.B. Mikroelektronik Gesellschaft mit beschränkter Haftung Procédé de montage de composants sur un support de circuits
US10217675B2 (en) 2013-02-28 2019-02-26 A.B. Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
US10672672B2 (en) 2013-02-28 2020-06-02 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Placement method for circuit carrier and circuit carrier
US10991632B2 (en) 2013-02-28 2021-04-27 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Assembly process for circuit carrier and circuit carrier
DE102014205701A1 (de) * 2014-03-27 2015-10-01 Robert Bosch Gmbh Verfahren und Vorrichtung zur Bestimmung der Position und/oder Orientierung zumindest eines Steckkontakts

Also Published As

Publication number Publication date
EP1675453A3 (fr) 2007-07-11
CN1798500A (zh) 2006-07-05

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