WO2015036253A1 - Strahlungsemittierendes bauelement mit organischem schichtenstapel - Google Patents
Strahlungsemittierendes bauelement mit organischem schichtenstapel Download PDFInfo
- Publication number
- WO2015036253A1 WO2015036253A1 PCT/EP2014/068263 EP2014068263W WO2015036253A1 WO 2015036253 A1 WO2015036253 A1 WO 2015036253A1 EP 2014068263 W EP2014068263 W EP 2014068263W WO 2015036253 A1 WO2015036253 A1 WO 2015036253A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- radiation
- substrate
- layer
- organic layer
- emitting component
- Prior art date
Links
- 239000012044 organic layer Substances 0.000 title claims abstract description 57
- 239000010410 layer Substances 0.000 claims abstract description 164
- 230000003287 optical effect Effects 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 230000005855 radiation Effects 0.000 claims description 53
- 239000011521 glass Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000002310 reflectometry Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 239000002073 nanorod Substances 0.000 description 5
- 230000001419 dependent effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/854—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2101/00—Properties of the organic materials covered by group H10K85/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
Definitions
- the present application relates to
- OLEDs are often limited by the coupling efficiency of the generated radiation.
- One object is to specify a radiation-emitting component which is characterized by a high coupling-out efficiency and at the same time is easy to produce.
- This task is inter alia by a
- the device has an organic layer stack.
- the organic one is
- Layer stack comprises in particular an active area provided for generating radiation.
- the active region is arranged between a first transport layer of a first charge type and a second transport layer of a second charge type different from the first charge type.
- the first transport layer is an electron transport layer and the second
- the active region contains organic
- the device has a substrate on which the organic layer stack
- the substrate supports the organic compound
- Layer stack mechanically and can be rigid or flexible.
- An interface of the substrate facing away from the organic layer stack is designed, for example, as a radiation exit surface of the radiation-emitting component.
- the substrate is transparent or at least translucent, for example, for the radiation generated in the active region.
- the device has a first electrode layer.
- the first electrode layer is in particular formed on a side of the organic layer stack facing the substrate.
- the component has a second electrode layer on the side of the organic layer stack facing away from the first electrode layer.
- radiation-emitting component can be injected via the first electrode layer and the second electrode layer electrons and holes from different sides in the active region and recombine there under the emission of radiation.
- the device has a Coupling-out structure.
- the coupling-out structure is arranged in particular on a side of the substrate facing the organic layer stack.
- the decoupling structure is intended to redirect radiation generated in the organic layer stack, in particular in the active region, for example due to scattering and / or diffraction.
- the additional optical layer is arranged in particular between the substrate and the coupling-out structure.
- the additional optical layer is intended, in particular in addition to the coupling-out structure, to increase the radiation coupling-out efficiency for radiation generated during operation in the radiation-emitting component.
- Radiation-emitting device has the optical
- Additional layer has a refractive index which is smaller than the refractive index of the substrate. Furthermore, the
- Refractive index of the additional optical layer smaller than the refractive index of the organic layer stack. The lower the refractive index of the additional optical layer, the greater is the proportion of radiation that is incident on the optical additional layer due to total reflection in
- This radiation component can be deflected at the outcoupling structure and subsequently at least partially at a smaller angle to the normal on the organic
- the total through the optical additional layer thus passing radiation component has a reduced proportion of incident at a large angle
- angles which are smaller than the critical angle for are regarded as small angles
- Radiation-emitting device forms the optical
- Additional layer an angle-selective mirror that allows only such in the organic layer stack in operation generated light to pass through, on the on the organic
- Layer sequence remote interface of the substrate can be coupled out of the substrate. This means in particular that the angle-dependent reflectivity of the optical
- Additional layer for radiation which would be coupled into the substrate at a coupling angle at which the radiation can no longer be coupled out at the interface is at least 50%.
- the reflectivity for this proportion of radiation averaged is at least 80%. In other words, the optical additional layer is so
- Radiation fraction are deflected by means of the coupling-out and then impinge on the optical additional layer at a small angle to the normal and after the
- Passage be coupled through the substrate at the interface.
- the device has an organic layer stack, which is arranged on a substrate. On a side of the substrate facing the organic layer stack, a coupling-out structure is arranged. Between the substrate and the coupling-out structure, an additional optical layer is arranged.
- the optical additional layer has a refractive index which is smaller than the refractive index of the substrate, or the optical
- Additional layer forms an angle-selective mirror, which allows only those in the organic layer stack in operation produced light to pass, which on one of the organic
- Layer sequence remote interface of the substrate can be coupled out of the substrate.
- Radiation component is already reflected at the optical additional layer and can thereby the coupling-out again be supplied. This increases the total
- Substrate for example a structuring of the interface of the substrate, can be dispensed with.
- the interface of the substrate may be, for example, apart from
- An elaborate structuring of the interface of the substrate for example for the formation of microlenses, can be dispensed with.
- Radiation-emitting device is the optical
- Radiation-emitting device is the first
- Electrode layer in direct contact with the optical additional layer and / or to the coupling-out structure.
- the first electrode layer adjoins the optical additional layer on the side facing the substrate and on the side facing away from the substrate
- the coupling-out structure is arranged between the first electrode layer and the additional optical layer.
- the first electrode layer only adjoins the coupling-out structure and not the optical one
- the refractive index of the optical additional layer is less than or equal to 1.49.
- Such an additional optical layer has, for example, a refractive index which is smaller than the refractive index of glass, which is typically 1.5 or more.
- the refractive index of the optical lens Preferably, the refractive index of the optical lens
- a refractive index of 1 can be realized by an optical intermediate layer designed as a vacuum gap. With a gas, for example air, a refractive index of approximately 1 can be achieved.
- An optical additional layer with a refractive index in this range can be formed, for example, by a dielectric layer having a structure with cavities.
- the additional optical layer may have a structure with so-called nanorods, wherein cavities are formed between the nanorods.
- Such nanorods can be produced, for example, by deposition of the material for the optical additional layer at a large angle to the normal, for example an angle of 45 ° or more.
- the cavities can be filled or evacuated with a gas, for example air.
- an oxide such as titanium oxide or silicon oxide, is suitable as the dielectric layer.
- Radiation-emitting device is a maximum
- Passage angle of the angle-selective mirror with respect to the normal to the optical additional layer so small that the passing through the optical additional layer radiation is coupled into the substrate in a coupling angle which is less than or equal to the critical angle for total reflection at the organic layer sequence facing away from the interface of the substrate.
- the coupling angle is thus the angle at which the radiation in the substrate extends.
- the maximum transmission angle of the angle-selective mirror is in doubt the angle at which the angle-dependent reflectivity is half of the maximum reflectivity.
- the maximum transmission angle is 40 °.
- Additional layer can pass, the impact on impact the interface of the substrate is at least partially decoupled from the substrate through the interface.
- the angle-selective mirror is
- the coupling-out structure is formed by means of Streustellen.
- the patches have a refractive index that is greater or less than that
- Refractive indices at least 0.05.
- Streeten formed in the first transport layer and / or in the second transport layer it is possible to dispense with a layer for the coupling-out structure provided in addition to the transport layers. Alternatively or additionally, a separate to the transport layers
- decoupling layer may be provided. Such a decoupling layer is also independent of its particular electrical conductivity to form a most efficient decoupling optimized.
- Radiation-emitting device is the coupling-out structure by means of a lateral structuring of the organic
- the recess may extend in the vertical direction, ie in a direction perpendicular to a main extension plane of the organic layer stack, completely or only partially through the organic layer stack.
- the at least one recess is filled, for example, by means of a filling material, wherein the filling material has a larger refractive index or a smaller refractive index than the material of the organic layer stack. Material of the organic layer stack points
- the refractive index averaged over the individual layers of the organic layer stack can be used as the refractive index for the organic layer stack.
- the refractive index difference between the filler and the material of the organic layer stack is
- Radiation deflection by means of the coupling-out structure can thus be achieved in a simplified manner.
- Main extension plane of the organic layer stack is the geometric design of the structuring can be varied within wide limits.
- the structuring has a lattice-shaped structure. According to at least one embodiment of the
- Radiation-emitting device is the organic
- Layer stack divided by means of at least one recess in at least two laterally separate subregions. For example, arise by means of a
- Subareas each a trench-shaped recess extends.
- the at least one recess can also be designed such that the organic
- Layer stack in plan view of the radiation-emitting device forms a coherent surface.
- the laterally spaced-apart partial regions can be connected to one another in an electrically conductive manner via the first electrode layer and furthermore also via the second electrode layer.
- Radiation-emitting device has the optical
- Additional layer has a thickness of at least 0.2 ⁇ , preferably of at least 0.5 ⁇ on. It has been shown that one
- optical additional layer in this thickness can increase the coupling efficiency particularly effective.
- Radiation-emitting device is the surface of the substrate facing away from the organic layer sequence free from a coupling-out structure.
- the interface is free of a deliberately introduced structuring.
- Outcoupling can be dispensed with. According to at least one embodiment of the
- the substrate contains a glass or consists of glass.
- a substrate is characterized by a high mechanical stability and optical transparency. Deviating but can also be
- Plastic film find application.
- Figures 1A and 1B a first embodiment of a radiation-emitting device in a schematic sectional view ( Figure 1A) and
- Figure 2A shows a second embodiment of a
- FIG. 2B shows an exemplary embodiment for a schematic progression of the reflectivity R of the angle-selective mirror as a function of the angle of incidence ⁇ ; and
- FIG. 3 shows a third exemplary embodiment of a
- the radiation-emitting component 1 is formed by way of example as an organic light-emitting diode.
- Radiation-emitting device has an organic
- the organic layer stack comprises an active region 20 which is between a first
- Transport layer 21 and a second transport layer 22 is arranged.
- the first transport layer 21 is formed as a hole transport layer and the second transport layer 22 as an electron transport layer or vice versa.
- the organic layer stack in particular for the active area 20, for example, are in the
- the organic layer stack 2 is arranged on a substrate 4, for example a glass substrate or a flexible substrate, for example a flexible one
- the organic layer stack 2 is arranged between a first electrode layer 61, for example a cathode, and a second electrode layer 62, for example an anode. These electrode layers are intended to inject charge carriers into the active region.
- Electrode layers are, for example, on one
- a boundary surface 40 of the substrate 4 facing away from the organic layer stack 2 forms a radiation exit surface for the radiation-emitting component 1.
- Electrode layer 61 is expediently designed to be permeable to the radiation generated in active region 20.
- the first electrode layer 61 contains a TCO (Transparent Conductive Oxide) material, for example
- ITO Indium tin oxide
- the second electrode layer 62 may be for those in the active
- Radiation emission of the device 1 radiation-permeable or in the event of radiation emission in only one
- the radiation-emitting component furthermore has a coupling-out structure 5.
- the coupling-out structure is formed by a lateral structuring by means of recesses 50.
- the recesses 50 are formed by a lateral structuring by means of recesses 50.
- Recesses formed, wherein first trenches along a first direction parallel to each other and in a direction perpendicular thereto extending second trenches parallel to each other, so that the organic layer stack 2 is subdivided into matrix-shaped juxtaposed partial regions 25.
- the geometric arrangement of the recesses 50 is variable within wide limits.
- the coupling-out structure 5 may be formed so that the organic layer stack 2 is formed contiguous in plan view of the component.
- the recesses 50 are filled with a filler having a smaller refractive index or larger
- an additional optical layer 3 is arranged between the substrate 4 and the organic layer stack 2. Furthermore, the optical additional layer 3 is in direct contact with the first electrode layer 61. The first electrode layer is furthermore in direct contact with the coupling-out structure 5.
- the additional optical layer 3 has, for example, a thickness of between 0.2 ⁇ and 10 ⁇ , preferably between 0.5 ⁇ and 5 ⁇ on. In the embodiment shown, the optical
- Additional layer 3 has a refractive index which is smaller than the refractive index of the substrate 4.
- a glass substrate has a refractive index of 1.5.
- Refractive index of the additional optical layer is less than or equal to 1.49, preferably between 1 and
- a refractive index of 1 is achievable by an additional optical layer formed as an evacuated gap.
- the refractive index of the optical additional layer can be very close to the ideal value of a
- the refractive index of the additional optical layer may be between 1.02 and 1.3 inclusive.
- a dielectric layer with cavities introduced in the layer is suitable.
- the additional optical layer may have a nanorod structure with between the nanorods be trained cavities.
- an oxide, such as silicon oxide or titanium oxide is suitable as a dielectric material for the additional optical layer 3.
- Interface 40 from the substrate at least partially
- Radiation components which impinge on the boundary surface 40 at an angle to the normal which is greater than the limiting angle for total reflection can not pass through the additional optical layer 3 but are already deposited on this additional optical layer 3
- the critical angle for total reflection for example, to air is about 41.8 °.
- Decoupling structure 5 increases and increased the coupling-out efficiency of the radiation-emitting component.
- Figures 1A and 1B described first embodiment.
- the optical intermediate layer 3 formed an angle-selective mirror.
- the optical additional layer 3 has a plurality of
- Reflectivity for radiation that strikes the optical additional layer at a small angle to the normal is lower than for radiation that is at a large angle to the
- Reflection are deflected at the coupling-out structure 5 and subsequently emerge from the device 1.
- the additional optical layer only passes radiation that can be coupled out at the interface 40.
- a coupling-in angle 72, with which the emitted radiation is coupled into the substrate 4 is smaller than the limit angle 73 for total reflection at the interface 40. This ensures that only radiation can impinge on the boundary surface 40, at least partially at the interface is decoupled and only one
- Refractive index of one or more of the layers 30 of the additional optical layer 3 also greater than or equal to
- Refractive index of the substrate 4 be.
- Reflectivity R of the optical additional layer is shown schematically in FIG. 2B. Here is simplifying the
- Reflectivity for small angles also be greater than 0 and for large angles also less than 1.
- the reflectivity for ⁇ 0 ° is at most 0.1.
- the reflectivity for angles of ⁇ ⁇ 50 ° is preferably
- angle-selective mirror has a maximum transmission angle ⁇ of about 35 °.
- the maximum transmission angle of the angle-selective mirror may also be greater or less than 35 °.
- the maximum transmission angle is between 25 ° and 50 ° inclusive.
- the third exemplary embodiment shown in FIG. 3 essentially corresponds to the first exemplary embodiment described in connection with FIG.
- the decoupling structure 5 is formed by Streustellen 52.
- the Streustellen 52 are in this
- Embodiment arranged in a decoupling layer 51.
- This decoupling layer 51 is arranged outside the electrically conductive material arranged between the first electrode layer 61 and the second electrode layer 61 and may therefore also be designed to be electrically insulating.
- On a lateral structuring of the organic layer to form a coupling-out structure can be dispensed with in this case. However, such structuring can also be provided in addition.
- spots 52 may also be arranged within the organic layer stack, for example in the first transport layer 21 or in the second transport layer 22 or in the first electrode layer 61.
- An additional decoupling layer is not in this case
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/917,048 US10263219B2 (en) | 2013-09-12 | 2014-08-28 | Radiation-emitting component with organic layer stack |
KR1020167008699A KR20160056904A (ko) | 2013-09-12 | 2014-08-28 | 유기 층 스택을 구비한 방사선 방출 소자 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013110024.4 | 2013-09-12 | ||
DE102013110024.4A DE102013110024B9 (de) | 2013-09-12 | 2013-09-12 | Strahlungsemittierendes Bauelement mit organischem Schichtenstapel |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015036253A1 true WO2015036253A1 (de) | 2015-03-19 |
Family
ID=51422086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2014/068263 WO2015036253A1 (de) | 2013-09-12 | 2014-08-28 | Strahlungsemittierendes bauelement mit organischem schichtenstapel |
Country Status (4)
Country | Link |
---|---|
US (1) | US10263219B2 (de) |
KR (1) | KR20160056904A (de) |
DE (1) | DE102013110024B9 (de) |
WO (1) | WO2015036253A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019217771A1 (en) * | 2018-05-11 | 2019-11-14 | University Of Washington | Laser with perovskite gain layer |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013038971A1 (ja) * | 2011-09-12 | 2013-03-21 | シャープ株式会社 | 発光デバイス、表示装置、及び照明装置 |
WO2013039072A1 (ja) * | 2011-09-16 | 2013-03-21 | シャープ株式会社 | 発光デバイス、表示装置、照明装置および発電装置 |
US20130082244A1 (en) * | 2011-09-30 | 2013-04-04 | General Electric Company | Oled devices comprising hollow objects |
WO2013065649A1 (ja) * | 2011-10-31 | 2013-05-10 | シャープ株式会社 | 有機発光素子 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20010024923A (ko) | 1998-12-17 | 2001-03-26 | 야스카와 히데아키 | 발광 장치 |
JP2002008868A (ja) | 2000-06-16 | 2002-01-11 | Seiko Epson Corp | 面発光装置 |
CN101393967A (zh) | 2000-08-23 | 2009-03-25 | 出光兴产株式会社 | 有机场致发光显示装置 |
JP2003142262A (ja) | 2001-11-06 | 2003-05-16 | Seiko Epson Corp | 電気光学装置、膜状部材、積層膜、低屈折率膜、多層積層膜、電子機器 |
JP3773865B2 (ja) * | 2002-03-06 | 2006-05-10 | 三洋電機株式会社 | 導光板および表示装置 |
US6965197B2 (en) | 2002-10-01 | 2005-11-15 | Eastman Kodak Company | Organic light-emitting device having enhanced light extraction efficiency |
JP4693593B2 (ja) | 2004-11-16 | 2011-06-01 | 京セラ株式会社 | 発光装置 |
US7602118B2 (en) | 2005-02-24 | 2009-10-13 | Eastman Kodak Company | OLED device having improved light output |
DE102007058453A1 (de) | 2007-09-10 | 2009-03-12 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
EP2151876A1 (de) | 2008-08-05 | 2010-02-10 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Elektrische Transportkomponente, Herstellungsverfahren dafür sowie elektro-optische Vorrichtung und opto-elektrische Vorrichtung |
WO2011055440A1 (ja) | 2009-11-05 | 2011-05-12 | キヤノン株式会社 | 表示装置 |
JP5297991B2 (ja) * | 2009-12-11 | 2013-09-25 | 株式会社日立製作所 | 有機発光ダイオード及びこれを用いた光源装置 |
DE102011079004A1 (de) | 2011-07-12 | 2013-01-17 | Osram Opto Semiconductors Gmbh | Organisches lichtemittierendes bauelement und verfahren zum herstellen eines organischen lichtemittierenden bauelements |
DE102011079063A1 (de) * | 2011-07-13 | 2013-01-17 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement und Verfahren zum Herstellen eines lichtemittierenden Bauelements |
DE102012204934A1 (de) | 2012-03-28 | 2013-10-02 | Osram Opto Semiconductors Gmbh | Organisches Licht emittierendes Bauelement und Verfahren zur Herstellung eines organischen Licht emittierenden Bauelements |
-
2013
- 2013-09-12 DE DE102013110024.4A patent/DE102013110024B9/de active Active
-
2014
- 2014-08-28 US US14/917,048 patent/US10263219B2/en active Active
- 2014-08-28 KR KR1020167008699A patent/KR20160056904A/ko not_active Application Discontinuation
- 2014-08-28 WO PCT/EP2014/068263 patent/WO2015036253A1/de active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013038971A1 (ja) * | 2011-09-12 | 2013-03-21 | シャープ株式会社 | 発光デバイス、表示装置、及び照明装置 |
WO2013039072A1 (ja) * | 2011-09-16 | 2013-03-21 | シャープ株式会社 | 発光デバイス、表示装置、照明装置および発電装置 |
US20130082244A1 (en) * | 2011-09-30 | 2013-04-04 | General Electric Company | Oled devices comprising hollow objects |
WO2013065649A1 (ja) * | 2011-10-31 | 2013-05-10 | シャープ株式会社 | 有機発光素子 |
Also Published As
Publication number | Publication date |
---|---|
KR20160056904A (ko) | 2016-05-20 |
DE102013110024B4 (de) | 2023-08-31 |
US20160204386A1 (en) | 2016-07-14 |
DE102013110024B9 (de) | 2023-11-09 |
US10263219B2 (en) | 2019-04-16 |
DE102013110024A1 (de) | 2015-03-12 |
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