WO2015029243A1 - Dispositif de réfrigération - Google Patents

Dispositif de réfrigération Download PDF

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Publication number
WO2015029243A1
WO2015029243A1 PCT/JP2013/073486 JP2013073486W WO2015029243A1 WO 2015029243 A1 WO2015029243 A1 WO 2015029243A1 JP 2013073486 W JP2013073486 W JP 2013073486W WO 2015029243 A1 WO2015029243 A1 WO 2015029243A1
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WO
WIPO (PCT)
Prior art keywords
refrigerant
evaporator
flow path
compressor
storage tank
Prior art date
Application number
PCT/JP2013/073486
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English (en)
Japanese (ja)
Inventor
達也 ▲雑▼賀
杉本　猛
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2013/073486 priority Critical patent/WO2015029243A1/fr
Priority to JP2015533910A priority patent/JPWO2015029243A1/ja
Publication of WO2015029243A1 publication Critical patent/WO2015029243A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B47/00—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass
    • F25B47/02—Defrosting cycles
    • F25B47/022—Defrosting cycles hot gas defrosting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
    • F25B41/24—Arrangement of shut-off valves for disconnecting a part of the refrigerant cycle, e.g. an outdoor part
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/04—Refrigeration circuit bypassing means
    • F25B2400/0403—Refrigeration circuit bypassing means for the condenser
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/04—Refrigeration circuit bypassing means
    • F25B2400/0411—Refrigeration circuit bypassing means for the expansion valve or capillary tube
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/24—Storage receiver heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/02—Compressor control
    • F25B2600/025—Compressor control by controlling speed
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/11—Fan speed control
    • F25B2600/111—Fan speed control of condenser fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/11—Fan speed control
    • F25B2600/112—Fan speed control of evaporator fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F25B2600/2501—Bypass valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F25B2600/2513—Expansion valves
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Definitions

  • the present invention relates to a refrigeration apparatus.
  • the refrigeration apparatus includes, for example, a compressor, a condenser, a throttling device, an evaporator, and the like, and a refrigerant circuit configured by connecting them with a refrigerant pipe is provided.
  • a refrigeration apparatus has been proposed in which a heater is attached to the evaporator and the frost attached to the evaporator is melted by the heat of the heater (see, for example, Patent Document 1).
  • a defrosting heater is attached to the lower part of the evaporator, around the refrigerant pipe (hairpin) of the evaporator, and the like.
  • Patent Document 2 a refrigeration apparatus capable of supplying a gas refrigerant (hot gas) discharged from the compressor to the evaporator and flowing a hot gas through the evaporator to melt frost adhering to the evaporator.
  • a gas refrigerant hot gas
  • Patent Document 2 relates to a thermobank refrigeration apparatus including a heat storage tank that stores heat of refrigerant discharged from a compressor.
  • the refrigerant returning from the evaporator side to the compressor side may contain liquid refrigerant. Therefore, the technology described in Patent Document 2 suppresses the liquid refrigerant from being sucked into the compressor by transferring the heat from the heat storage tank to the refrigerant returning from the evaporator side to the compressor side to be gasified. .
  • Japanese Patent Laid-Open No. 9-250850 see, for example, FIG. 3
  • Japanese Patent Laid-Open No. 59-112161 see, for example, FIG. 1
  • R32 is characterized by not only low GWP but also high discharge gas temperature and slightly flammability compared to refrigerants such as R410A and R404A that are widely used at present.
  • a slightly flammable refrigerant comes into contact with an open flame or a metal heated to a high temperature of 300 to 400 ° C. or higher, it may be thermally decomposed to generate hydrogen fluoride.
  • the present invention was made to solve the above-described problems, and suppresses thermal decomposition of the refrigerant when there is refrigerant leakage, and realizes a compact heat storage tank. It is an object.
  • a refrigerating apparatus includes a compressor, a condenser, a throttling device, and an evaporator, and includes a refrigerant circuit configured by connecting these via a refrigerant pipe, and the refrigerant discharged from the compressor is evaporated to the evaporator.
  • the refrigerant circulating in the refrigerant circuit is a refrigerant containing 65% by weight or more of the R32 refrigerant, and is connected between the discharge side of the compressor and the condenser.
  • a heat storage tank in which a heat medium to be transmitted to the flowing refrigerant is stored is configured to return the refrigerant that has flowed out of the evaporator to the compressor via the second flow path during hot gas defrost operation. is there.
  • the refrigeration apparatus does not include a defrosting heater, performs defrosting operation to melt the frost of the evaporator, and suppresses thermal decomposition of the refrigerant when there is refrigerant leakage. be able to.
  • the refrigeration apparatus is of a thermo bank type having a heat storage tank, and the refrigerant circulating in the refrigerant circuit is a refrigerant containing 65% by weight or more of R32 refrigerant.
  • the refrigerant containing 65 wt% or more of the R32 refrigerant has a higher discharge refrigerant temperature than the R410A refrigerant and the R404A refrigerant.
  • the length of the piping (first flow path) in the heat storage tank is the same, the heat in the heat storage tank is higher than the heat storage tank of the refrigeration apparatus employing the R410A refrigerant, the R404A refrigerant, or the like.
  • the temperature of the medium can be increased.
  • the refrigeration apparatus according to the present invention shortens the length of the pipes (first flow path and second flow path) in the heat storage tank as compared with the refrigeration apparatus that employs the R410A refrigerant, the R404A refrigerant, or the like. It is possible to realize a compact heat storage tank.
  • FIG. 1 is a schematic configuration example of a refrigeration apparatus according to an embodiment of the present invention. It is explanatory drawing, such as a drain pan mounted in the refrigeration apparatus shown in FIG. It is explanatory drawing of the thermal storage tank of the freezing apparatus shown in FIG. It is explanatory drawing of the thermal storage tank different from the thermal storage tank shown in FIG.
  • FIG. 1 is a schematic configuration example diagram of a refrigeration apparatus 100 according to an embodiment.
  • FIG. 2 is an explanatory diagram of the drain pan 15 and the like mounted on the refrigeration apparatus 100 shown in FIG.
  • the refrigeration apparatus 100 is provided with improvements for suppressing thermal decomposition of the refrigerant when there is a refrigerant leak and for realizing a compact heat storage tank 11.
  • the refrigeration apparatus 100 includes a compressor 1, a condenser 2, a throttling device 7, an evaporator 8, and the like, and includes a refrigerant circuit configured by connecting them through a refrigerant pipe 70.
  • the refrigeration apparatus 100 is a thermobank refrigeration apparatus including a heat storage tank 11 that stores the heat of the refrigerant discharged from the compressor 1.
  • the evaporator 8 may be frosted. For this reason, the refrigeration apparatus 100 can perform a hot gas defrost operation in which hot gas discharged from the compressor 1 is supplied to the evaporator 8 to melt frost adhering to the evaporator 8.
  • the refrigeration apparatus 100 is provided with a mechanism for switching the flow path of the refrigerant circuit in order to switch between the operation of supplying the refrigerant to the evaporator 8 (cooling operation) and the hot gas defrost operation. That is, the refrigeration apparatus 100 includes a first bypass pipe 71, a second bypass pipe 72, and a refrigerant pipe 70 that connects the compressor 1, the heat storage tank 11, the condenser 2, the expansion device 7, and the evaporator 8.
  • the connecting pipe 73, the solenoid valve 3, the solenoid valve 4, the solenoid valve 5, the solenoid valve 6, the solenoid valve 9, and the pressure reducing valve 10 are provided.
  • the compressor 1 sucks a refrigerant, compresses the refrigerant, and discharges the refrigerant in a high temperature and high pressure state.
  • the refrigerant discharge side is connected to the first flow path 11 ⁇ / b> A of the heat storage tank 11, and the suction side is connected to the second flow path 11 ⁇ / b> B of the heat storage tank 11 and the electromagnetic valve 9.
  • the condenser 2 performs heat exchange between the air around the condenser 2 and the refrigerant supplied to the condenser 2 to condense and liquefy the refrigerant.
  • the condenser 2 is composed of, for example, a fin tube heat exchanger.
  • the condenser 2 has an upstream side connected to the heat storage tank 11 and the electromagnetic valve 3, and a downstream side connected to the electromagnetic valve 4.
  • the condenser 2 is provided with a blower fan 2A used to promote heat exchange between air and the refrigerant.
  • the expansion device 7 is for expanding the refrigerant.
  • an electronic expansion valve having a variable opening or a capillary tube may be used.
  • the expansion device 7 has an upstream side connected to the electromagnetic valve 5 and a downstream side connected to the evaporator 8.
  • the evaporator 8 performs heat exchange between the air around the evaporator 8 and the refrigerant supplied to the evaporator 8 to evaporate the refrigerant.
  • the evaporator 8 is comprised by a fin tube heat exchanger, for example.
  • the evaporator 8 has an upstream side connected to the expansion device 7 and the electromagnetic valve 6, and a downstream side connected to the electromagnetic valve 9 and the pressure reducing valve 10.
  • the evaporator 8 is provided with a blower fan 8A used to promote heat exchange between air and the refrigerant.
  • the refrigeration apparatus 100 includes a drain pan 15 that stores drain water generated by the evaporator 8 below the evaporator 8.
  • a second bypass pipe 72 or the like through which hot gas flows may be disposed below the drain pan 15.
  • the refrigeration apparatus 100 according to the present embodiment is not provided with a defrosting heater. However, there is a possibility that a heating element other than the defrosting heater is arranged, but even if hot gas leaks in the second bypass pipe 72, the heating element is provided above the drain pan 15. It can suppress that a hot gas thermally decomposes.
  • the refrigeration apparatus 100 may be configured by bringing the refrigerant pipe 70 connected to the evaporator 8 into contact with the drain pan 15, for example. Thereby, the heat of the hot gas flowing during the hot gas defrosting operation can be transmitted to the drain pan 15 and the drain water frozen in the drain pan 15 can be melted.
  • the heat storage tank 11 stores a heat medium 12, and heat is stored in the heat medium 12.
  • the heat medium 12 for example, water, antifreeze, or the like can be used.
  • the heat medium 12 is not limited to liquids such as water and antifreeze, and a solid heat storage material or the like may be used.
  • the heat storage tank 11 includes a first flow path 11A connected to the discharge side of the compressor 1 and a second flow path 11B connected to the pressure reducing valve 10.
  • the first channel 11 ⁇ / b> A has an upstream side connected to the discharge side of the compressor 1 and a downstream side connected to the condenser 2 and the electromagnetic valve 3.
  • the second channel 11 ⁇ / b> B has an upstream side connected to the pressure reducing valve 10 and a downstream side connected to the suction side of the compressor 1.
  • the first flow path 11A and the second flow path 11B correspond to, for example, a pipe through which a refrigerant can flow.
  • 1st flow path 11A is arrange
  • coolant can be transmitted to the heat medium 12 of the thermal storage tank 11, as shown in FIG. Since the gas refrigerant (hot gas) discharged from the compressor 1 flows through the first flow path 11A, heat is transferred from the first flow path 11A to the heat medium 12 in the heat storage tank 11.
  • the heat storage tank 11 can store the transmitted heat in the heat medium 12.
  • 11 A of 1st flow paths are arrange
  • the second flow path 11 ⁇ / b> B is also arranged in the tank of the heat storage tank 11 so that the heat of the refrigerant can be transmitted to the heat medium 12 of the heat storage tank 11, for example.
  • the pressure reducing valve 10 is closed and the electromagnetic valve 9 is opened, so that the refrigerant flowing out of the evaporator 8 is not supplied to the second flow path 11B.
  • the pressure reducing valve 10 is opened and the electromagnetic valve 9 is closed, so that the refrigerant flowing out of the evaporator 8 is supplied to the second flow path 11B.
  • the refrigerant flowing out of the evaporator 8 contains liquid refrigerant in order to supply the refrigerant (hot gas) to the evaporator 8 without passing through the condenser 2 and the expansion device 7. Yes.
  • the compressor 1 may break down. Therefore, during the hot gas defrost operation, the refrigerant flowing out of the evaporator 8 is depressurized by the pressure reducing valve 10 and then flows into the second flow path 11B of the heat storage tank 11.
  • the second channel 11B is disposed on the upper side of the first channel 11A. This is because the upper side of the heat medium 12 is hotter than the lower side, so that heat can be transferred to the refrigerant flowing through the second flow path 11B with high efficiency and gasified.
  • the first bypass pipe 71 is a pipe used for flowing the refrigerant flowing out of the heat storage tank 11 during the hot gas defrost operation to the downstream side of the condenser 2 so as not to pass through the condenser 2.
  • the first bypass pipe 71 is a pipe connected so as to bypass the condenser 2. That is, one of the first bypass pipes 71 is connected between the heat storage tank 11 and the condenser 2 in the refrigerant pipe 70, and the other is between the electromagnetic valve 4 and the electromagnetic valve 5 in the refrigerant pipe 70. Is connected to.
  • the second bypass pipe 72 is used to flow the refrigerant flowing out from the first bypass pipe 71 during the hot gas defrost operation to the evaporator 8 on the downstream side of the expansion device 7 so as not to pass through the expansion device 7. It is piping.
  • the second bypass pipe 72 is a pipe connected so as to bypass the expansion device 7. That is, one of the second bypass pipes 72 is connected between the connection position of the first bypass pipe 71 in the refrigerant pipe 70 and the solenoid valve 5, and the other is connected to the expansion device 7 in the refrigerant pipe 70. It is connected between the evaporator 8.
  • connection pipe 73 is a pipe through which the refrigerant flowing out of the evaporator 8 during the hot gas defrost operation passes through the heat storage tank 11.
  • One of the connection pipes 73 is connected to the upstream side of the electromagnetic valve 9 in the refrigerant pipe 70, and the other is connected to the downstream side of the electromagnetic valve 9 in the refrigerant pipe 70.
  • the connection pipe 73 communicates with the second flow path 11 ⁇ / b> B of the heat storage tank 11.
  • the solenoid valve 3 is provided in the first bypass pipe 71.
  • the solenoid valve 4 is provided in the refrigerant pipe 70 on the downstream side of the condenser 2 and on the upstream side of the connection position of the first bypass pipe 71.
  • the solenoid valve 5 is provided on the downstream side of the connection position of the second bypass pipe 72 in the refrigerant pipe 70 and on the upstream side of the expansion device 7.
  • the solenoid valve 6 is provided in the second bypass pipe 72.
  • the solenoid valve 9 is provided between one of the connection pipes 73 connected to the refrigerant pipe 70 and the other.
  • the pressure reducing valve 10 is provided on the upstream side of the heat storage tank 11 in the connection pipe 73.
  • the control device 50 includes the frequency of the compressor 1 (including operation / stop), the rotational speed of the blower fan 2A and the blower fan 8A (including operation / stop), the opening degree of the expansion device 7 and the pressure reducing valve 10, The opening / closing of the solenoid valve 4, the solenoid valve 5 and the solenoid valve 6 is controlled.
  • the control device 50 is constituted by, for example, a microcomputer.
  • the solenoid valve 4 the solenoid valve 5 and the solenoid valve 9 are open, and the solenoid valve 3 and the solenoid valve 6 are closed.
  • the pressure reducing valve 10 is closed.
  • the gas refrigerant compressed and discharged by the compressor 1 flows into the heat storage tank 11 and heats the heat medium 12 in the heat storage tank 11, then flows out of the heat storage tank 11 and flows into the condenser 2.
  • the gas refrigerant flowing into the condenser 2 condenses by exchanging heat with the air supplied from the blower fan 2 ⁇ / b> A and flows out of the condenser 2.
  • the refrigerant flowing out of the condenser 2 flows into the expansion device 7 and is expanded and depressurized by the expansion device 7.
  • the decompressed refrigerant flows into the evaporator 8, performs heat exchange with the air supplied from the blower fan 8 ⁇ / b> A, evaporates, and flows out of the evaporator 8.
  • the gas refrigerant that has flowed out of the evaporator 8 is sucked into the compressor 1.
  • the solenoid valve 4 the solenoid valve 5 and the solenoid valve 9 are closed, and the solenoid valve 3 and the solenoid valve 6 are open.
  • the pressure reducing valve 10 is opened at a preset opening degree.
  • the gas refrigerant (hot gas) compressed and discharged by the compressor 1 flows into the heat storage tank 11 and heats the heat medium 12 in the heat storage tank 11, then flows out of the heat storage tank 11, and the first bypass pipe 71. Flow into.
  • the gas refrigerant that has flowed into the first bypass pipe 71 flows into the evaporator 8 through the refrigerant pipe 70 and the second bypass pipe 72.
  • the hot gas that has flowed into the evaporator 8 dissolves frost adhering to the evaporator 8.
  • the refrigerant that has flowed out of the evaporator 8 contains liquid refrigerant.
  • the refrigerant that has flowed out of the evaporator 8 is depressurized by the pressure reducing valve 10, and then flows into the second flow path 11B of the heat storage tank 11 to receive heat from the heat medium 12 stored in the heat storage tank 11, and gas Turn into. Then, the refrigerant gasified in the second flow path 11 ⁇ / b> B is sucked into the compressor 1.
  • FIG. 3 is an explanatory diagram of the heat storage tank 11 of the refrigeration apparatus 100 shown in FIG.
  • FIG. 4 is an explanatory diagram of the heat storage tank 11 different from the heat storage tank 11 shown in FIG. 3. 4 shows that the second flow path 11B is shorter than the heat storage tank 11 shown in FIG. 3, and the tank of the heat storage tank 11 is miniaturized in accordance with the shortening of the second flow path 11B. Is shown.
  • coolant enclosed with the freezing apparatus 100 and the length of 11 A of 1st flow paths and the 2nd flow path 11B of the thermal storage tank 11 are demonstrated.
  • the refrigerating apparatus 100 employs R32 refrigerant having a higher discharge refrigerant temperature than the R410A refrigerant, R404A refrigerant, and the like. More specifically, the refrigerant circulating in the refrigerant circuit of the refrigeration apparatus 100 contains 65% by weight or more of R32 refrigerant. That is, all the refrigerants may be R32 refrigerants, or may be a mixed refrigerant in which 65% by weight or more of the refrigerant circulating in the refrigerant circuit of the refrigeration apparatus 100 is R32 refrigerant.
  • the refrigeration apparatus 100 includes a heat storage tank 11 and has a thermobank hot gas defrost system.
  • heat is stored by exchanging heat between the gas refrigerant discharged from the compressor 1 and the heat medium 12 inside the heat storage tank 11.
  • R32 refrigerant or the like is employed as the refrigerant
  • the temperature of the refrigerant discharged from the compressor 1 increases. Therefore, if the heat transfer area of the first flow path 11A is the same and the amount of the heat medium 12 stored in the tank is also the same, the direction when the R32 refrigerant or the like is adopted.
  • the temperature of the heat medium 12 in the heat storage tank 11 can be made higher than when R410A refrigerant or the like is employed.
  • R410A refrigerant or the like when R410A refrigerant or the like is caused to flow into the heat storage tank 11 shown in FIG. 3 and R410 refrigerant or the like can be gasified in the second flow path 11B, the R32 refrigerant is used as shown in FIG. That is, the length of the second flow path 11B of the heat storage tank 11 can be further shortened to make the tank of the heat storage tank 11 smaller, and the heat storage tank 11 as shown in FIG. 4 can be used.
  • the refrigeration apparatus 100 is a thermobank type refrigeration apparatus provided with a heat storage tank 11, and the refrigerant circulating in the refrigerant circuit is a refrigerant containing 65% by weight or more of R32 refrigerant. .
  • the refrigerant containing 65 wt% or more of the R32 refrigerant has a higher discharge refrigerant temperature than the R410A refrigerant and the R404A refrigerant.
  • the length of the piping (the first flow path 11A and the second flow path 11B) in the heat storage tank 11 is made shorter than the refrigeration apparatus employing the R410A refrigerant, the R404A refrigerant, and the like. Therefore, the heat storage tank 11 can be downsized.
  • the refrigeration apparatus 100 does not perform defrosting by providing a defrosting heater, but performs a defrosting operation by performing a hot gas defrosting operation using hot gas discharged from the compressor 1. It is something to do. For this reason, even if the refrigerant piping 70 is damaged and refrigerant leakage occurs, the R32 refrigerant does not touch the defrosting heater, and the R32 refrigerant can be prevented from being thermally decomposed.
  • the second bypass pipe 72 through which hot gas flows is connected to the drain pan 15 at the lower part of the evaporator 8 disposed in the indoor unit or in the unit cooler. It should be provided on the lower side. Since R32 refrigerant is heavier than air, it stays in the lower part of indoor units, unit coolers, etc., so that when high-temperature R32 refrigerant leaks, it prevents the refrigerant from touching the defrosting heater and thermally decomposing. Because it can.

Abstract

La présente invention concerne un dispositif (100) de réfrigération qui possède un compresseur (1), un condensateur (2), un dispositif (7) d'étranglement et un évaporateur (8) et possède un circuit de réfrigérant formé par liaison de ces éléments au moyen de tuyauterie de réfrigérant (70) et qui effectue une opération de dégivrage par gaz chaud, le réfrigérant ainsi évacué du compresseur (1) étant fourni à l'évaporateur (8). Le réfrigérant circulant dans le circuit de réfrigération contient au moins 65 % en poids de réfrigérant R32. Le dispositif de réfrigération est conçu pour disposer d'une cuve (11) de stockage de chaleur qui présente un premier chemin (11A) d'écoulement reliant le côté évacuation du compresseur (1) et le condensateur (2) et un second chemin (11B) d'écoulement reliant l'évaporateur (8) et le côté aspiration du compresseur (1) et qui stocke la chaleur du réfrigérant s'écoulant dans le premier chemin (11A) d'écoulement et transfère ladite chaleur au réfrigérant s'écoulant dans le second chemin (11B) d'écoulement. Pendant l'opération de dégivrage par gaz chaud, le réfrigérant évacué par l'évaporateur (8) est retourné au compresseur (1) par le second chemin (11B) d'écoulement.
PCT/JP2013/073486 2013-09-02 2013-09-02 Dispositif de réfrigération WO2015029243A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58172791U (ja) * 1982-05-11 1983-11-18 三菱電機株式会社 冷却装置
JPS59112161A (ja) * 1982-12-17 1984-06-28 三菱電機株式会社 冷凍装置
JPH07146057A (ja) * 1993-11-25 1995-06-06 Zexel Corp 冷凍庫
JP2002098393A (ja) * 2000-09-26 2002-04-05 Daikin Ind Ltd 空気調和機
JP2002228307A (ja) * 2001-02-01 2002-08-14 Matsushita Electric Ind Co Ltd 混合冷媒充填方法および充填された装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58172791U (ja) * 1982-05-11 1983-11-18 三菱電機株式会社 冷却装置
JPS59112161A (ja) * 1982-12-17 1984-06-28 三菱電機株式会社 冷凍装置
JPH07146057A (ja) * 1993-11-25 1995-06-06 Zexel Corp 冷凍庫
JP2002098393A (ja) * 2000-09-26 2002-04-05 Daikin Ind Ltd 空気調和機
JP2002228307A (ja) * 2001-02-01 2002-08-14 Matsushita Electric Ind Co Ltd 混合冷媒充填方法および充填された装置

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