WO2015029243A1

WO2015029243A1 - Refrigeration device

Info

Publication number: WO2015029243A1
Application number: PCT/JP2013/073486
Authority: WO
Inventors: 達也 ▲雑▼賀; 杉本　猛
Original assignee: 三菱電機株式会社
Priority date: 2013-09-02
Filing date: 2013-09-02
Publication date: 2015-03-05
Also published as: JPWO2015029243A1

Abstract

A refrigeration device (100) which has a compressor (1), a condenser (2), a throttle device (7), and an evaporator (8), and has a refrigerant circuit formed by connecting these by means of refrigerant piping (70), and which performs a hot gas defrost operation whereby a refrigerant discharged from the compressor (1) is supplied to the evaporator (8). The refrigerant circulating in the refrigeration circuit contains at least 65 wt% of R32 refrigerant. The refrigeration device is configured so as to have a heat storage vat (11), which has a first flow path (11A) connecting the discharge side of the compressor (1) and the condenser (2), and a second flow path (11B) connecting the evaporator (8) and the suction side of the compressor (1), and which stores the heat of the refrigerant flowing in the first flow path (11A) and transfers this heat to the refrigerant flowing in the second flow path (11B). During the hot gas defrost operation the refrigerant discharged from the evaporator (8) is returned to the compressor (1) through the second flow path (11B).

Description

Refrigeration equipment

The present invention relates to a refrigeration apparatus.

The refrigeration apparatus includes, for example, a compressor, a condenser, a throttling device, an evaporator, and the like, and a refrigerant circuit configured by connecting them with a refrigerant pipe is provided. Here, if the use of the refrigeration apparatus is continued, frost is generated in the evaporator, and the heat exchange efficiency between the air around the evaporator and the refrigerant supplied to the evaporator may be reduced. Therefore, a refrigeration apparatus has been proposed in which a heater is attached to the evaporator and the frost attached to the evaporator is melted by the heat of the heater (see, for example, Patent Document 1). In a refrigeration apparatus equipped with a defrosting heater as in Patent Document 1, for example, a defrosting heater is attached to the lower part of the evaporator, around the refrigerant pipe (hairpin) of the evaporator, and the like.

In addition, a refrigeration apparatus capable of supplying a gas refrigerant (hot gas) discharged from the compressor to the evaporator and flowing a hot gas through the evaporator to melt frost adhering to the evaporator. Have also been proposed (see, for example, Patent Document 2). The technique described in Patent Document 2 relates to a thermobank refrigeration apparatus including a heat storage tank that stores heat of refrigerant discharged from a compressor. When the defrost operation is performed, the refrigerant returning from the evaporator side to the compressor side may contain liquid refrigerant. Therefore, the technology described in Patent Document 2 suppresses the liquid refrigerant from being sucked into the compressor by transferring the heat from the heat storage tank to the refrigerant returning from the evaporator side to the compressor side to be gasified. .

Japanese Patent Laid-Open No. 9-250850 (see, for example, FIG. 3) Japanese Patent Laid-Open No. 59-112161 (see, for example, FIG. 1)

Recently, as an alternative refrigerant to replace R410A and R404A, an air conditioner and a refrigeration apparatus using a slightly flammable refrigerant such as R32 having a low global warming potential (GWP) value have been proposed. R32 is characterized by not only low GWP but also high discharge gas temperature and slightly flammability compared to refrigerants such as R410A and R404A that are widely used at present. When a slightly flammable refrigerant comes into contact with an open flame or a metal heated to a high temperature of 300 to 400 ° C. or higher, it may be thermally decomposed to generate hydrogen fluoride.

When the R32 refrigerant is employed in the refrigeration apparatus described in Patent Document 1, when the refrigerant leaks from the refrigerant pipe (hairpin) of the evaporator, the refrigerant pipe connected to the evaporator, etc., the R32 refrigerant touches the defrosting heater, and R32 There exists a subject that a refrigerant | coolant raise | generates thermal decomposition and hydrogen fluoride etc. may generate | occur | produce.

When R410 refrigerant, R404 refrigerant or the like is employed in the refrigeration apparatus described in Patent Document 2, the temperature of the refrigerant discharged from the compressor is lower than that of the R32 refrigerant, and accordingly, the temperature of the heat medium in the heat storage tank. Is difficult to raise. Thus, when the temperature of the refrigerant discharged from the compressor is lowered, it is necessary to lengthen the pipe length in the heat storage tank in order to ensure the increase in the temperature of the heat medium in the heat storage tank.
That is, when R410 refrigerant, R404 refrigerant or the like is employed in the refrigeration apparatus described in Patent Document 2, if the piping length in the heat storage tank is increased in order to ensure an increase in the temperature of the heat medium in the heat storage tank, There is a problem that the heat storage tank is enlarged.

The present invention was made to solve the above-described problems, and suppresses thermal decomposition of the refrigerant when there is refrigerant leakage, and realizes a compact heat storage tank. It is an object.

A refrigerating apparatus according to the present invention includes a compressor, a condenser, a throttling device, and an evaporator, and includes a refrigerant circuit configured by connecting these via a refrigerant pipe, and the refrigerant discharged from the compressor is evaporated to the evaporator. In the refrigeration apparatus performing the hot gas defrost operation to be supplied to the refrigerant, the refrigerant circulating in the refrigerant circuit is a refrigerant containing 65% by weight or more of the R32 refrigerant, and is connected between the discharge side of the compressor and the condenser. 1 and a second flow path connected between the evaporator and the suction side of the compressor, and stores the heat of the refrigerant flowing through the first flow path to store the second flow path. A heat storage tank in which a heat medium to be transmitted to the flowing refrigerant is stored is configured to return the refrigerant that has flowed out of the evaporator to the compressor via the second flow path during hot gas defrost operation. is there.

The refrigeration apparatus according to the present invention does not include a defrosting heater, performs defrosting operation to melt the frost of the evaporator, and suppresses thermal decomposition of the refrigerant when there is refrigerant leakage. be able to.

Further, the refrigeration apparatus according to the present invention is of a thermo bank type having a heat storage tank, and the refrigerant circulating in the refrigerant circuit is a refrigerant containing 65% by weight or more of R32 refrigerant. Here, the refrigerant containing 65 wt% or more of the R32 refrigerant has a higher discharge refrigerant temperature than the R410A refrigerant and the R404A refrigerant. For this reason, when the length of the piping (first flow path) in the heat storage tank is the same, the heat in the heat storage tank is higher than the heat storage tank of the refrigeration apparatus employing the R410A refrigerant, the R404A refrigerant, or the like. The temperature of the medium can be increased. That is, the refrigeration apparatus according to the present invention shortens the length of the pipes (first flow path and second flow path) in the heat storage tank as compared with the refrigeration apparatus that employs the R410A refrigerant, the R404A refrigerant, or the like. It is possible to realize a compact heat storage tank.

1 is a schematic configuration example of a refrigeration apparatus according to an embodiment of the present invention. It is explanatory drawing, such as a drain pan mounted in the refrigeration apparatus shown in FIG. It is explanatory drawing of the thermal storage tank of the freezing apparatus shown in FIG. It is explanatory drawing of the thermal storage tank different from the thermal storage tank shown in FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Embodiment.
FIG. 1 is a schematic configuration example diagram of a refrigeration apparatus 100 according to an embodiment. FIG. 2 is an explanatory diagram of the drain pan 15 and the like mounted on the refrigeration apparatus 100 shown in FIG.
The refrigeration apparatus 100 is provided with improvements for suppressing thermal decomposition of the refrigerant when there is a refrigerant leak and for realizing a compact heat storage tank 11.

[Description of configuration]
The refrigeration apparatus 100 includes a compressor 1, a condenser 2, a throttling device 7, an evaporator 8, and the like, and includes a refrigerant circuit configured by connecting them through a refrigerant pipe 70. The refrigeration apparatus 100 is a thermobank refrigeration apparatus including a heat storage tank 11 that stores the heat of the refrigerant discharged from the compressor 1. In the refrigeration apparatus 100, when the refrigerant is circulated through the refrigerant circuit, the evaporator 8 may be frosted. For this reason, the refrigeration apparatus 100 can perform a hot gas defrost operation in which hot gas discharged from the compressor 1 is supplied to the evaporator 8 to melt frost adhering to the evaporator 8.

Note that the refrigeration apparatus 100 is provided with a mechanism for switching the flow path of the refrigerant circuit in order to switch between the operation of supplying the refrigerant to the evaporator 8 (cooling operation) and the hot gas defrost operation. That is, the refrigeration apparatus 100 includes a first bypass pipe 71, a second bypass pipe 72, and a refrigerant pipe 70 that connects the compressor 1, the heat storage tank 11, the condenser 2, the expansion device 7, and the evaporator 8. The connecting pipe 73, the solenoid valve 3, the solenoid valve 4, the solenoid valve 5, the solenoid valve 6, the solenoid valve 9, and the pressure reducing valve 10 are provided.

(Compressor 1)
The compressor 1 sucks a refrigerant, compresses the refrigerant, and discharges the refrigerant in a high temperature and high pressure state. In the compressor 1, the refrigerant discharge side is connected to the first flow path 11 A of the heat storage tank 11, and the suction side is connected to the second flow path 11 B of the heat storage tank 11 and the electromagnetic valve 9.

(Condenser 2)
The condenser 2 performs heat exchange between the air around the condenser 2 and the refrigerant supplied to the condenser 2 to condense and liquefy the refrigerant. The condenser 2 is composed of, for example, a fin tube heat exchanger. The condenser 2 has an upstream side connected to the heat storage tank 11 and the electromagnetic valve 3, and a downstream side connected to the electromagnetic valve 4. The condenser 2 is provided with a blower fan 2A used to promote heat exchange between air and the refrigerant.

(Aperture device 7)
The expansion device 7 is for expanding the refrigerant. For the expansion device 7, for example, an electronic expansion valve having a variable opening or a capillary tube may be used. The expansion device 7 has an upstream side connected to the electromagnetic valve 5 and a downstream side connected to the evaporator 8.

(Evaporator 8)
The evaporator 8 performs heat exchange between the air around the evaporator 8 and the refrigerant supplied to the evaporator 8 to evaporate the refrigerant. The evaporator 8 is comprised by a fin tube heat exchanger, for example. The evaporator 8 has an upstream side connected to the expansion device 7 and the electromagnetic valve 6, and a downstream side connected to the electromagnetic valve 9 and the pressure reducing valve 10. The evaporator 8 is provided with a blower fan 8A used to promote heat exchange between air and the refrigerant.

In addition, as shown in FIG. 2, the refrigeration apparatus 100 includes a drain pan 15 that stores drain water generated by the evaporator 8 below the evaporator 8. A second bypass pipe 72 or the like through which hot gas flows may be disposed below the drain pan 15. The refrigeration apparatus 100 according to the present embodiment is not provided with a defrosting heater. However, there is a possibility that a heating element other than the defrosting heater is arranged, but even if hot gas leaks in the second bypass pipe 72, the heating element is provided above the drain pan 15. It can suppress that a hot gas thermally decomposes. Since the R32 refrigerant is heavier than air, even if the R32 refrigerant leaks from the second bypass pipe 72, the refrigerant does not leak to the upper side where the drain pan 15 or the like is provided and stays below the drain pan 15. is there.

Further, since the drain pan 15 is attached to the evaporator 8, the cool water of the evaporator 8 is also transmitted to the drain water stored in the drain pan 15, and the drain water freezes, resulting in poor drainage. Thus, the refrigeration apparatus 100 may be configured by bringing the refrigerant pipe 70 connected to the evaporator 8 into contact with the drain pan 15, for example. Thereby, the heat of the hot gas flowing during the hot gas defrosting operation can be transmitted to the drain pan 15 and the drain water frozen in the drain pan 15 can be melted.

(Heat storage tank 11)
The heat storage tank 11 stores a heat medium 12, and heat is stored in the heat medium 12. As the heat medium 12, for example, water, antifreeze, or the like can be used. Moreover, the heat medium 12 is not limited to liquids such as water and antifreeze, and a solid heat storage material or the like may be used. The heat storage tank 11 includes a first flow path 11A connected to the discharge side of the compressor 1 and a second flow path 11B connected to the pressure reducing valve 10. The first channel 11 A has an upstream side connected to the discharge side of the compressor 1 and a downstream side connected to the condenser 2 and the electromagnetic valve 3. The second channel 11 B has an upstream side connected to the pressure reducing valve 10 and a downstream side connected to the suction side of the compressor 1. The first flow path 11A and the second flow path 11B correspond to, for example, a pipe through which a refrigerant can flow.

1st flow path 11A is arrange | positioned in the tank of the thermal storage tank 11 so that the heat | fever of a refrigerant | coolant can be transmitted to the heat medium 12 of the thermal storage tank 11, as shown in FIG. Since the gas refrigerant (hot gas) discharged from the compressor 1 flows through the first flow path 11A, heat is transferred from the first flow path 11A to the heat medium 12 in the heat storage tank 11. The heat storage tank 11 can store the transmitted heat in the heat medium 12. 11 A of 1st flow paths are arrange | positioned under the 2nd flow path 11B.

As shown in FIG. 1, the second flow path 11 B is also arranged in the tank of the heat storage tank 11 so that the heat of the refrigerant can be transmitted to the heat medium 12 of the heat storage tank 11, for example. When the hot gas defrost operation is not performed, the pressure reducing valve 10 is closed and the electromagnetic valve 9 is opened, so that the refrigerant flowing out of the evaporator 8 is not supplied to the second flow path 11B. On the other hand, when the hot gas defrost operation is performed, the pressure reducing valve 10 is opened and the electromagnetic valve 9 is closed, so that the refrigerant flowing out of the evaporator 8 is supplied to the second flow path 11B. The During the hot gas defrost operation, the refrigerant flowing out of the evaporator 8 contains liquid refrigerant in order to supply the refrigerant (hot gas) to the evaporator 8 without passing through the condenser 2 and the expansion device 7. Yes. For this reason, if a refrigerant is returned to the compressor 1 with a liquid refrigerant, the compressor 1 may break down. Therefore, during the hot gas defrost operation, the refrigerant flowing out of the evaporator 8 is depressurized by the pressure reducing valve 10 and then flows into the second flow path 11B of the heat storage tank 11. Thereby, the heat which the heat carrier 12 in the heat storage tank 11 has is transmitted to the refrigerant flowing through the second flow path 11B, and gasification of the refrigerant flowing through the second flow path 11B is promoted. The second channel 11B is disposed on the upper side of the first channel 11A. This is because the upper side of the heat medium 12 is hotter than the lower side, so that heat can be transferred to the refrigerant flowing through the second flow path 11B with high efficiency and gasified.

(First bypass pipe 71 etc.)
The first bypass pipe 71 is a pipe used for flowing the refrigerant flowing out of the heat storage tank 11 during the hot gas defrost operation to the downstream side of the condenser 2 so as not to pass through the condenser 2. The first bypass pipe 71 is a pipe connected so as to bypass the condenser 2. That is, one of the first bypass pipes 71 is connected between the heat storage tank 11 and the condenser 2 in the refrigerant pipe 70, and the other is between the electromagnetic valve 4 and the electromagnetic valve 5 in the refrigerant pipe 70. Is connected to. The second bypass pipe 72 is used to flow the refrigerant flowing out from the first bypass pipe 71 during the hot gas defrost operation to the evaporator 8 on the downstream side of the expansion device 7 so as not to pass through the expansion device 7. It is piping. The second bypass pipe 72 is a pipe connected so as to bypass the expansion device 7. That is, one of the second bypass pipes 72 is connected between the connection position of the first bypass pipe 71 in the refrigerant pipe 70 and the solenoid valve 5, and the other is connected to the expansion device 7 in the refrigerant pipe 70. It is connected between the evaporator 8.

The connection pipe 73 is a pipe through which the refrigerant flowing out of the evaporator 8 during the hot gas defrost operation passes through the heat storage tank 11. One of the connection pipes 73 is connected to the upstream side of the electromagnetic valve 9 in the refrigerant pipe 70, and the other is connected to the downstream side of the electromagnetic valve 9 in the refrigerant pipe 70. The connection pipe 73 communicates with the second flow path 11 B of the heat storage tank 11.

(Solenoid valves 3-6, 9 and pressure reducing valve 10)
The solenoid valve 3 is provided in the first bypass pipe 71. The solenoid valve 4 is provided in the refrigerant pipe 70 on the downstream side of the condenser 2 and on the upstream side of the connection position of the first bypass pipe 71. The solenoid valve 5 is provided on the downstream side of the connection position of the second bypass pipe 72 in the refrigerant pipe 70 and on the upstream side of the expansion device 7. The solenoid valve 6 is provided in the second bypass pipe 72. The solenoid valve 9 is provided between one of the connection pipes 73 connected to the refrigerant pipe 70 and the other. The pressure reducing valve 10 is provided on the upstream side of the heat storage tank 11 in the connection pipe 73.

(Control device 50)
The control device 50 includes the frequency of the compressor 1 (including operation / stop), the rotational speed of the blower fan 2A and the blower fan 8A (including operation / stop), the opening degree of the expansion device 7 and the pressure reducing valve 10, The opening / closing of the solenoid valve 4, the solenoid valve 5 and the solenoid valve 6 is controlled. The control device 50 is constituted by, for example, a microcomputer.

[Flow of refrigerant in refrigeration apparatus 100]
The refrigerant flowing through the refrigerant circuit shown in FIG. 1 will be described with reference to FIG. The solid arrows in FIG. 1 indicate the flow of the refrigerant during the cooling operation, and the broken arrows indicate the flow of the refrigerant during the hot gas defrost operation.

First, the flow of the refrigerant during the cooling operation will be described.
During the cooling operation, the solenoid valve 4, the solenoid valve 5 and the solenoid valve 9 are open, and the solenoid valve 3 and the solenoid valve 6 are closed. The pressure reducing valve 10 is closed.
The gas refrigerant compressed and discharged by the compressor 1 flows into the heat storage tank 11 and heats the heat medium 12 in the heat storage tank 11, then flows out of the heat storage tank 11 and flows into the condenser 2. The gas refrigerant flowing into the condenser 2 condenses by exchanging heat with the air supplied from the blower fan 2 A and flows out of the condenser 2. The refrigerant flowing out of the condenser 2 flows into the expansion device 7 and is expanded and depressurized by the expansion device 7. The decompressed refrigerant flows into the evaporator 8, performs heat exchange with the air supplied from the blower fan 8 A, evaporates, and flows out of the evaporator 8. The gas refrigerant that has flowed out of the evaporator 8 is sucked into the compressor 1.

Next, the flow of the refrigerant during hot gas defrost operation will be described.
During hot gas defrost operation, the solenoid valve 4, the solenoid valve 5 and the solenoid valve 9 are closed, and the solenoid valve 3 and the solenoid valve 6 are open. The pressure reducing valve 10 is opened at a preset opening degree.
The gas refrigerant (hot gas) compressed and discharged by the compressor 1 flows into the heat storage tank 11 and heats the heat medium 12 in the heat storage tank 11, then flows out of the heat storage tank 11, and the first bypass pipe 71. Flow into. The gas refrigerant that has flowed into the first bypass pipe 71 flows into the evaporator 8 through the refrigerant pipe 70 and the second bypass pipe 72. The hot gas that has flowed into the evaporator 8 dissolves frost adhering to the evaporator 8. The refrigerant that has flowed out of the evaporator 8 contains liquid refrigerant. The refrigerant that has flowed out of the evaporator 8 is depressurized by the pressure reducing valve 10, and then flows into the second flow path 11B of the heat storage tank 11 to receive heat from the heat medium 12 stored in the heat storage tank 11, and gas Turn into. Then, the refrigerant gasified in the second flow path 11 B is sucked into the compressor 1.

[About miniaturization of refrigerant and heat storage tank 11]
FIG. 3 is an explanatory diagram of the heat storage tank 11 of the refrigeration apparatus 100 shown in FIG. FIG. 4 is an explanatory diagram of the heat storage tank 11 different from the heat storage tank 11 shown in FIG. 3. 4 shows that the second flow path 11B is shorter than the heat storage tank 11 shown in FIG. 3, and the tank of the heat storage tank 11 is miniaturized in accordance with the shortening of the second flow path 11B. Is shown. With reference to FIG.3 and FIG.4, description of the refrigerant | coolant enclosed with the freezing apparatus 100 and the length of 11 A of 1st flow paths and the 2nd flow path 11B of the thermal storage tank 11 are demonstrated.

First, the refrigerant of the refrigeration apparatus 100 will be described.
The refrigerating apparatus 100 employs R32 refrigerant having a higher discharge refrigerant temperature than the R410A refrigerant, R404A refrigerant, and the like. More specifically, the refrigerant circulating in the refrigerant circuit of the refrigeration apparatus 100 contains 65% by weight or more of R32 refrigerant. That is, all the refrigerants may be R32 refrigerants, or may be a mixed refrigerant in which 65% by weight or more of the refrigerant circulating in the refrigerant circuit of the refrigeration apparatus 100 is R32 refrigerant.

Next, the downsizing of the heat storage tank 11 of the refrigeration apparatus 100 will be described.
The refrigeration apparatus 100 includes a heat storage tank 11 and has a thermobank hot gas defrost system. In the heat storage tank 11, heat is stored by exchanging heat between the gas refrigerant discharged from the compressor 1 and the heat medium 12 inside the heat storage tank 11. When R32 refrigerant or the like is employed as the refrigerant, the temperature of the refrigerant discharged from the compressor 1 increases. Therefore, if the heat transfer area of the first flow path 11A is the same and the amount of the heat medium 12 stored in the tank is also the same, the direction when the R32 refrigerant or the like is adopted. However, the temperature of the heat medium 12 in the heat storage tank 11 can be made higher than when R410A refrigerant or the like is employed. For this reason, for example, when R410A refrigerant or the like is caused to flow into the heat storage tank 11 shown in FIG. 3 and R410 refrigerant or the like can be gasified in the second flow path 11B, the R32 refrigerant is used as shown in FIG. That is, the length of the second flow path 11B of the heat storage tank 11 can be further shortened to make the tank of the heat storage tank 11 smaller, and the heat storage tank 11 as shown in FIG. 4 can be used.

3 and 4 are compared, only the second flow path 11B is shortened, and the first flow path 11A is not shortened, but the first flow path 11A can be shortened. This is because the temperature of the refrigerant discharged from the compressor 1 is higher in the R32 refrigerant than in the R410A refrigerant or the like, so that the temperature of the heat medium 12 is necessary even if the first flow path 11A is shortened. It is because it can cover the heat.

[Effects of refrigeration apparatus 100 according to embodiment]
The refrigeration apparatus 100 according to the present embodiment is a thermobank type refrigeration apparatus provided with a heat storage tank 11, and the refrigerant circulating in the refrigerant circuit is a refrigerant containing 65% by weight or more of R32 refrigerant. . Here, the refrigerant containing 65 wt% or more of the R32 refrigerant has a higher discharge refrigerant temperature than the R410A refrigerant and the R404A refrigerant. For this reason, as already explained, the length of the piping (the first flow path 11A and the second flow path 11B) in the heat storage tank 11 is made shorter than the refrigeration apparatus employing the R410A refrigerant, the R404A refrigerant, and the like. Therefore, the heat storage tank 11 can be downsized.

In addition, the refrigeration apparatus 100 according to the present embodiment does not perform defrosting by providing a defrosting heater, but performs a defrosting operation by performing a hot gas defrosting operation using hot gas discharged from the compressor 1. It is something to do. For this reason, even if the refrigerant piping 70 is damaged and refrigerant leakage occurs, the R32 refrigerant does not touch the defrosting heater, and the R32 refrigerant can be prevented from being thermally decomposed.

If a defrosting heater is attached to the evaporator 8, the second bypass pipe 72 through which hot gas flows is connected to the drain pan 15 at the lower part of the evaporator 8 disposed in the indoor unit or in the unit cooler. It should be provided on the lower side. Since R32 refrigerant is heavier than air, it stays in the lower part of indoor units, unit coolers, etc., so that when high-temperature R32 refrigerant leaks, it prevents the refrigerant from touching the defrosting heater and thermally decomposing. Because it can.

1 compressor, 2 condenser, 2A blower fan, 3 solenoid valve, 4 solenoid valve, 5 solenoid valve, 6 solenoid valve, 7 throttle device, 8 evaporator, 8A blower fan, 9 solenoid valve, 10 pressure reducing valve, 11 heat storage Tank, 11A first flow path, 11B second flow path, 12 heat medium, 15 drain pan, 50 control device, 70 refrigerant pipe, 71 first bypass pipe, 72 second bypass pipe, 73 connection pipe, 100 Refrigeration equipment.

Claims

A hot gas defrost having a compressor, a condenser, a throttling device, and an evaporator, each having a refrigerant circuit configured by being connected by refrigerant piping, and supplying refrigerant discharged from the compressor to the evaporator In the refrigeration apparatus that operates,
The refrigerant circulating in the refrigerant circuit is a refrigerant containing 65% by weight or more of R32 refrigerant,
A first flow path connected between the discharge side of the compressor and the condenser; and a second flow path connected between the evaporator and the suction side of the compressor. A heat storage tank storing a heat medium that stores heat of the refrigerant flowing through the first flow path and transmits the heat to the refrigerant flowing through the second flow path;
A refrigerating apparatus configured to return the refrigerant flowing out of the evaporator to the compressor through a second flow path during the hot gas defrost operation.
In the heat storage tank,
The refrigeration apparatus according to claim 1, wherein the second flow path is disposed above the first flow path.
Provided on the lower side of the evaporator, comprising a drain pan for storing drain water,
The piping used for defrosting the evaporator by flowing hot gas discharged from the compressor during the hot gas defrosting operation is disposed below the drain pan. Or the refrigeration apparatus of 2.