WO2015025693A1 - めっき装置及びこれを用いたセンサ装置 - Google Patents

めっき装置及びこれを用いたセンサ装置 Download PDF

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Publication number
WO2015025693A1
WO2015025693A1 PCT/JP2014/070252 JP2014070252W WO2015025693A1 WO 2015025693 A1 WO2015025693 A1 WO 2015025693A1 JP 2014070252 W JP2014070252 W JP 2014070252W WO 2015025693 A1 WO2015025693 A1 WO 2015025693A1
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Prior art keywords
anode
spacer
conductive layer
plating apparatus
layer
Prior art date
Application number
PCT/JP2014/070252
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English (en)
French (fr)
Japanese (ja)
Inventor
渡 山本
仁子 小岩
本間　敬之
雅広 柳沢
美紀子 齋藤
智之 山本
Original Assignee
株式会社山本鍍金試験器
学校法人早稲田大学
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 株式会社山本鍍金試験器, 学校法人早稲田大学 filed Critical 株式会社山本鍍金試験器
Priority to CN201480045566.4A priority Critical patent/CN105473770B/zh
Priority to US14/912,698 priority patent/US20160230285A1/en
Priority to EP14837234.5A priority patent/EP3037573B1/de
Priority to SG11201601245VA priority patent/SG11201601245VA/en
Priority to KR1020167006661A priority patent/KR101773308B1/ko
Publication of WO2015025693A1 publication Critical patent/WO2015025693A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Definitions

  • the present invention relates to a plating apparatus for performing electrolytic plating or electroless plating on the surface of an object to be plated, and a sensor apparatus using the same.
  • Patent Document 1 includes a water tank that has at least a bottom plate and a side plate and into which a plating solution is injected, and a cathode plate and an anode plate that are horizontally disposed opposite to each other in the plating solution of the water tank.
  • An electroplating tester equipped with one of a cathode plate and an anode plate to be plated placed below the other plate, and the side plate of the water tank is provided with a cathode plate and an anode plate, respectively
  • An electroplating tester is disclosed in which an opening for insertion into the inside is provided and a closing plate for closing the opening is detachably provided in the water tank.
  • the side plate of the water tank is provided with a plurality of groove portions for holding at least one of the cathode plate and the anode plate in a horizontal state, and the interval between the cathode plate and the anode plate can be adjusted. Yes.
  • JP 2006-299367 A (Claim 1-3, FIG. 1)
  • Patent Document 1 since the plating apparatus described in Patent Document 1 needs to prepare a water tank for accommodating the cathode plate and the anode plate and provide an opening and a groove in the side plate of the water tank, the structure is increased in size and complexity. There is a problem that costs and material costs increase. Therefore, development of a simpler and more compact plating apparatus has been demanded.
  • the present invention has been made in view of the above points, and it is a first object of the present invention to provide a plating apparatus that is simpler and easier to miniaturize than the prior art and a sensor apparatus using the same. Moreover, this invention makes it the 2nd subject to provide the plating apparatus which can observe the production
  • a plating apparatus includes a holding member (2) for holding an object to be plated (W) serving as a cathode, and an annular first seal surrounding the object to be plated (W).
  • a spacer (4) that is laminated on the holding member (2) via a member (3), exposes the object to be plated (W) and stores a plating solution, and a spacer (4), and the through part ( 45) an anode disposed on the spacer (4) through an annular second seal member (5) that surrounds the anode (45) and disposed opposite to the object to be plated (W) exposed from the through portion (45).
  • 62) and an anode member (6) that is laminated on the holding member (2) via a member (3), exposes the object to be plated (W) and stores a plating solution, and a spacer (4), and the through part ( 45) an anode disposed on the spacer (4) through an annular second seal member (5) that surrounds the anode (45) and disposed opposite to
  • the plating apparatus (1) can be easily configured by simply laminating via the first and second seal members (3, 5). Therefore, for example, compared to the plating apparatus described in Patent Document 1, a water tank having a complicated structure is not required, so that the plating apparatus (1) can be simplified and downsized. Further, according to the present invention, the distance between the cathode and the anode can be easily adjusted by replacing the spacer (4) with one having a different thickness.
  • the spacer (4) includes a spacer main body (41) made of an insulator, and an anode-side conductive layer (43) provided on the surface of the spacer main body (41) on the anode member (6) side.
  • the anode member (6) includes an anode member body portion (61) made of an insulator, and the anode provided on the spacer (4) side surface of the anode member body portion (61).
  • the anode side conductive layer (43) is connected to the anode layer (62) inside the second seal member (5), and the second seal member (5)
  • the anode-side conductive layer (43) is connected to the power supply device (PW) outside the power source.
  • the anode side conductive layer (43) is connected to the anode layer (62) inside the second seal member (5), and the anode side conductive layer (outside of the second seal member (5)). 43) is connected to the power supply device (PW), so that electricity can be supplied to the anode layer (62) while maintaining watertightness between the spacer (4) and the anode member (6).
  • PW power supply device
  • the anode member main body part (61) includes a window part (64) having translucency for observing the object to be plated (W) exposed from the through part (45), and the anode layer (62) is preferably formed so as to avoid the window (64). According to such a configuration, it is possible to observe (or observe) the plating itself generated on the object to be plated (W) through the window (64) during plating.
  • the window (64) preferably has a thickness dimension (t1) smaller than other portions of the anode member main body (61).
  • the microscope (M) used for observation can be arranged close to the cathode.
  • the state of the object to be plated (W) during plating can be preferably observed.
  • the thickness t1 of the window portion (64) is preferably in the range of 0.05 mm ⁇ t1 ⁇ 2 mm. According to such a configuration, since refraction and scattering of light transmitted through the window (64) can be suitably suppressed, the influence of the window (64) is reduced, and the object to be plated (W ) Can be preferably observed.
  • the anode member main body (61) preferably has a tapered portion (64a) that is inclined downward toward the window (64) around the window (64). According to such a configuration, the anode member main body portion (61) has the tapered portion (64a) inclined downward toward the window portion (64) around the window portion (64). ) To observe the object to be plated (W), the microscope (M) can be prevented from coming into contact with the anode member (6).
  • the thickness t2 of the spacer (4) is preferably in the range of 0.05 mm ⁇ t2 ⁇ 1 mm. According to such a configuration, since the thickness (depth) of the plating solution stored in the through portion (45) is reduced, for example, even if the plating solution is colored, the state of the object to be plated (W) Can be observed. In addition, the ion concentration diffusion gradient can be made steep by making the distance between the electrodes extremely close.
  • the spacer (4) includes a cathode-side conductive layer (42) provided on a surface of the spacer main body (41) on the holding member (2) side, and the spacer (4) has a first seal member (3)
  • the cathode side conductive layer (42) is connected to the object to be plated (W) on the inner side, and the cathode side conductive layer (42) is connected to the power supply device (PW) on the outer side of the first seal member (3). It is preferable to adopt a configuration. According to such a configuration, electricity can be supplied to the object to be plated (W) while maintaining watertightness between the spacer (4) and the holding member (2).
  • the spacer (4) has a reference electrode conductive layer (44) insulated from the anode side conductive layer (43) on the surface of the spacer main body (41) on the anode member (6) side.
  • the anode member (6) has a reference electrode layer (63) insulated from the anode layer (62) on the surface of the anode member main body (61) on the spacer (4) side, and the second member
  • the reference electrode conductive layer (44) is connected to the reference electrode layer (63) inside the seal member (5), and the reference electrode conductive layer (44) is connected to the outside of the second seal member (5). It is preferable to be configured to be connected to a measuring device. According to such a configuration, the potential of the anode can be measured using the reference electrode layer (63) while maintaining the watertightness between the spacer (4) and the anode member (6).
  • the holding member (2) or the anode member (6) is provided with a plating solution supply path (27) for supplying a plating solution to the penetrating portion (45), and the holding member (2) or the anode member is provided.
  • the member (6) is preferably provided with a plating solution discharge passage (28) for discharging the plating solution from the through portion (45).
  • the plating solution is supplied from the plating solution supply path (27) to the through portion (45), and the plating solution is discharged from the through portion (45) to the plating solution discharge passage (28).
  • the plating solution in the penetration part (45) can be maintained in a suitable state.
  • the plating solution is an electroless plating solution
  • PW power supply device
  • the present invention is a sensor device using the plating apparatus (1), wherein the anode side conductive layer (43) is composed of a plurality of anode side conductive layers (43B) insulated from each other, the anode side conductive layer (43B)
  • the layer (62) is composed of the same number of mutually isolated anode layers (62B) as the anode-side conductive layer (43B), and a portion (62Bb) exposed from the through portion (45) of each anode layer (62B).
  • the plating apparatus (1) can be used as a sensor apparatus by modifying different reactive groups on the plurality of anode layers (62B).
  • the present invention it is possible to provide a plating apparatus that is simpler and easier to miniaturize than the prior art, and a sensor apparatus using the plating apparatus. Moreover, in this invention, the plating apparatus which can observe the production
  • FIG. 3 is an exploded sectional view taken along the line III-III in FIG.
  • FIG. 4 is an exploded cross-sectional view taken along arrows IV-IV in FIG. 1.
  • FIG. 3 is an assembled cross-sectional view taken along the line III-III in FIG.
  • A) is a plan view of the holding member, and
  • (b) is a sectional view taken along arrow VIb-VIb of (a).
  • A) is a top view of a spacer
  • (b) is a bottom view of a spacer.
  • (A) is a plan view of the anode member
  • (b) is a sectional view taken along the line VIIIb-VIIIb of (a)
  • (c) is a bottom view of the anode member. It is an exploded sectional view of the plating apparatus concerning a 2nd embodiment. It is a top view of the spacer in the sensor apparatus using a plating apparatus. It is a bottom view of the anode member in the sensor apparatus using a plating apparatus.
  • the plating apparatus 1 is a thin plating apparatus configured with a simple laminated structure.
  • the plating apparatus 1 is characterized in that it is possible to observe the generation state of the plated product and the reaction state of the solid-liquid interface during plating using a special microscope such as a Raman microscope.
  • the plating apparatus 1 is an apparatus that performs plating on an object to be plated W, and as main components, in order from the bottom, a holding member 2, a first seal member 3, The spacer 4, the second seal member 5, and the anode member 6 are provided.
  • the plating apparatus 1 includes a cathode side energizing member 7 and an insulating member 8 below the holding member 2.
  • the plating apparatus 1 includes an anode-side energizing member 9 on the upper side of the anode member 6.
  • an object to be plated W is an object to be plated, and is composed of, for example, a thin plate member that has a square shape in plan view.
  • the object to be plated W is not particularly limited, and various electronic parts such as a circuit board, a semiconductor chip, and a device package can be used.
  • the to-be-plated object W may use the test piece comprised with the mere metal plate.
  • the object to be plated W includes an insulating substrate W1 and a layer to be plated W2 stacked on the insulating substrate W1.
  • the plated layer W2 is connected to the negative electrode of the power supply device PW and becomes a cathode.
  • the holding member 2 is a member for holding the workpiece W.
  • the holding member 2 is made of an insulator such as PEEK resin (Poly Ether Ether Ketone).
  • the holding member 2 has a rectangular bottom wall 21 in a plan view and side walls 22 rising from four sides around the bottom wall 21.
  • the object to be plated W, the first seal member 3, the spacer 4, the second seal member 5, and the anode member 6 are accommodated in the space surrounded by the four side walls 22. .
  • a recess 23 for installing the workpiece W is provided in the central portion of the upper surface of the bottom wall 21 in the central portion of the upper surface of the bottom wall 21, a recess 23 for installing the workpiece W is provided. Further, an annular concave groove 24 for installing the first seal member 3 is provided on the upper surface of the bottom wall 21 so as to surround the concave portion 23. Further, the bottom wall 21 has a plurality of (eight in the first embodiment) probe insertion holes 25 for inserting a probe P described later on the outside of the concave groove 24.
  • the bottom wall 21 has a plating solution supply path 27 for supplying a plating solution to a through portion 45 of the spacer 4 to be described later, and a plating solution discharge passage 28 for discharging the plating solution from the through portion 45. is doing.
  • the opening 27 a on the inlet side of the plating solution supply path 27 is provided at the tip of a cylindrical portion 27 c protruding from the right side surface of the bottom wall 21, and the outlet of the plating solution supply path 27.
  • the opening 27 b on the side is provided on the upper surface of the bottom wall 21, on the front side of the recess 23 and on the inner side of the annular recess 24.
  • the opening 28 a on the inlet side of the plating solution discharge path 28 is provided on the upper surface of the bottom wall 21, on the rear side of the recess 23 and on the inner side of the annular groove 24.
  • the outlet-side opening 28 b is provided at the tip of a cylindrical portion 28 c that projects from the left side surface of the bottom wall 21.
  • Caps 27d and 28d are attached to the cylindrical portions 27c and 28c. The caps 27d and 28d prevent the plating solution flow pipe (not shown) connected to the cylindrical portions 27c and 28c from dropping off.
  • the first seal member 3 is an elastic member that seals between the holding member 2 and the spacer 4, and is composed of, for example, an O-ring that has an annular shape in plan view.
  • the first seal member 3 is installed in the concave groove 24 of the bottom wall 21.
  • the first seal member 3 is disposed so as to surround the workpiece W. Further, the first seal member 3 is disposed so as to surround a through portion 45 of the spacer 4 described later.
  • the spacer 4 is a member for keeping the distance between the workpiece W and the anode described later at a predetermined distance.
  • the spacer 4 is formed of a thin plate member that has a square shape in a plan view, for example.
  • the spacer 4 is provided on a spacer main body 41 made of an insulator, a cathode-side conductive layer 42 provided on the surface of the spacer main body 41 on the holding member 2 side, and a surface of the spacer main body 41 on the anode member 6 side.
  • the spacer body 41 is a part that insulates the cathode-side conductive layer 42 and the anode-side conductive layer 43, and is made of an insulator such as borosilicate glass.
  • the cathode-side conductive layer 42 is a conductive layer for supplying electricity to the workpiece W, and is formed of a metal material such as platinum, for example.
  • the cathode side conductive layer 42 is formed by a technique such as sputtering or vacuum deposition.
  • the cathode-side conductive layer 42 is connected to the object to be plated W inside the first seal member 3 and is connected to the power supply device PW via the probe P and the cathode-side energization member 7 outside the first seal member 3. It is connected to the negative pole (see FIGS. 1 and 5).
  • the anode side conductive layer 43 is a conductive layer for supplying electricity to the anode layer 62 to be described later, and is formed of a metal material such as platinum, for example.
  • the anode side conductive layer 43 is formed by a technique such as sputtering or vacuum deposition.
  • the anode-side conductive layer 43 is connected to an anode layer 62 described later inside the second seal member 5, and the power supply device PW via the probe P and the anode-side energization member 9 outside the second seal member 5. (See FIGS. 1 and 5).
  • the reference electrode conductive layer 44 is a conductive layer that is electrically connected to a reference electrode layer 63 described later, and is formed of a metal material such as platinum, for example.
  • the reference electrode conductive layer 44 is formed by a technique such as sputtering or vacuum deposition. On both sides of the reference electrode conductive layer 44 (more specifically, between the reference electrode conductive layer 44 and the anode-side conductive layer 43), portions where no conductive layer is formed are provided. Is insulated against.
  • the reference electrode conductive layer 44 is connected to a reference electrode layer 63 which will be described later on the inside of the second seal member 5 and a measuring device (not shown) via a probe P which will be described later on the outside of the second seal member 5. )It is connected to the.
  • the penetrating portion 45 is an opening for exposing a part of the workpiece W and storing a plating solution, and is penetratingly formed in a substantially central portion of the spacer 4 in the vertical direction.
  • the penetration part 45 is formed in a substantially rhombus shape whose longitudinal direction is longer than the lateral direction in plan view.
  • An opening 27b on the outlet side of the plating solution supply path 27 is exposed in the vicinity of the front end of the through portion 45 (see FIG. 2).
  • an opening 28a on the inlet side of the plating solution discharge path 28 is exposed near the rear end of the through portion 45 (see FIG. 2).
  • the plating solution which flowed into the penetration part 45 from the opening part 27b flows through the inside of the penetration part 45 from the front to the back, and flows out from the opening part 28a.
  • the thickness t2 of the spacer 4 is not particularly limited, but is preferably within a range of 0.05 mm ⁇ t2 ⁇ 1 mm, and preferably within a range of 0.10 mm ⁇ t2 ⁇ 0.20 mm. Further preferred. In the first embodiment, the thickness t2 of the spacer 4 is about 0.10 mm. By making the thickness dimension t2 of the spacer 4 very small, the object to be plated W can be observed from the window portion 64 described later even when the transparency of the plating solution is low.
  • a plurality of spacers 4 having different thickness dimensions t2 may be prepared in advance, and may be replaced and used depending on the application. For example, when the transparency of the plating solution is high, the spacer 4 having a relatively large thickness dimension t2 can be used. In the first embodiment, since the thickness dimension t2 of the spacer 4 is extremely thin, about 0.10 mm, it is possible to observe the reaction state of the solid-liquid interface in more detail.
  • the second seal member 5 is an elastic member that seals between the spacer 4 and the anode member 6, and is composed of, for example, an O-ring that has an annular shape in plan view.
  • the second seal member 5 is installed in a groove 65 formed on the lower surface of the anode member 6.
  • the second seal member 5 is disposed so as to surround the through portion 45 of the spacer 4.
  • the first seal member 3 is arranged so as to surround the window portion 64 of the anode member 6.
  • the anode member 6 includes an anode member main body 61, an anode layer 62 provided on the surface of the anode member main body 61 on the holding member 2 side, and It has mainly the reference electrode layer 63, the window part 64 provided in the center part of the anode member main-body part 61, and the ditch
  • the anode member 6 closes the through portion 45 of the spacer 4 from above.
  • the anode member main body 61 is a plate-like member having a quadrangular shape in plan view.
  • the anode member main body 61 is made of an insulator, and is made of, for example, transparent (translucent) quartz glass or the like.
  • the anode layer 62 is a part that is electrically connected to the positive electrode of the power supply device PW and becomes an anode.
  • a window 64 and a groove 65 described later are formed. It is formed in the range between. That is, the anode layer 62 is formed avoiding the window portion 64.
  • the anode layer 62 is made of a metal material such as platinum, for example.
  • the anode layer 62 is formed by a technique such as sputtering or vacuum deposition.
  • the anode layer 62 is connected to the anode-side conductive layer 43 inside the second seal member 5.
  • the reference electrode layer 63 is a portion that is electrically connected to a measurement device (not shown) to become a reference electrode.
  • the reference electrode layer 63 is provided at a position facing the reference electrode conductive layer 44.
  • the reference electrode layer 63 is made of a metal material such as platinum, for example.
  • the reference electrode layer 63 is formed by a technique such as sputtering or vacuum deposition. On both sides of the reference electrode layer 63 (more specifically, between the reference electrode layer 63 and the anode layer 62), portions where no conductive layer is formed are provided and insulated from the anode layer 62.
  • the reference electrode layer 63 is connected to a reference electrode conductive layer 44 described later inside the second seal member 5.
  • the reference electrode layer 63 can measure the potential of the anode (anode layer 62) that is the working electrode.
  • the window portion 64 is a transparent observation window for observing (or observing) the workpiece W.
  • the window part 64 is provided in the center part of the anode member main-body part 61, and is formed circularly by planar view.
  • the window portion 64 is made of, for example, quartz glass that is the same material as the anode member main body portion 61.
  • the thickness dimension t1 of the window part 64 is smaller than the thickness dimension of other parts of the anode member main body part 61 (for example, the outer peripheral part of the anode member main body part 61).
  • the thickness t1 of the window portion 64 is preferably in the range of 0.05 mm ⁇ t1 ⁇ 2 mm, and more preferably in the range of 0.10 mm ⁇ t2 ⁇ 0.20 mm. In the first embodiment, the thickness dimension t1 of the window portion 64 is formed to be about 0.13 mm. By making the thickness dimension t1 of the window portion 64 extremely small, refraction and scattering of light transmitted through the window portion 64 can be suppressed when observed with a microscope, and the object can be accurately observed. .
  • a truncated cone-shaped taper part 64a that is inclined downward toward the window part 64 is provided.
  • the taper portion 64a suppresses interference between the microscope and the anode member main body portion 61 when the microscope is disposed on the window portion 64.
  • the tapered portion 64 a is provided around the window portion 64, a larger microscope can be disposed close to the window portion 64.
  • the concave groove 65 is an annular groove for installing the second seal member 5, and is formed on the lower surface of the anode member main body 61.
  • the concave groove 65 is provided so as to surround the window portion 64.
  • the concave groove 65 has a function of making the anode layer 62 and the anode-side conductive layer 43 easily contact with each other while suppressing the displacement of the second seal member 5.
  • the anode member 6 has a plurality (eight in the first embodiment) of probe insertion holes 66 for inserting a probe P described later on the outside of the concave groove 65.
  • One of the probe insertion holes 66A is formed at a position corresponding to the reference electrode conductive layer 44 (see FIG. 7A).
  • the cathode side energizing member 7 is a member for supplying a current to the workpiece W to be the cathode.
  • the cathode-side energizing member 7 is made of a rectangular metal plate in plan view, and is laminated below the holding member 2.
  • the cathode side energizing member 7 has a plurality of probe installation holes 71 for installing the probes P. Further, the cathode side energizing member 7 is connected to a negative pole of a power supply device PW (not shown) via a protrusion 72 protruding from the left side surface.
  • the negative electrode of the power supply device PW is in a state of being electrically connected to the object to be plated W through the cathode-side current-carrying member 7, the probe P, and the cathode-side conductive layer 42.
  • the insulating member 8 is a member for bringing the cathode-side current-carrying member 7 into an insulating state with respect to the installation surface (for example, the floor surface) of the plating apparatus 1.
  • the insulating member 8 is made of an insulating material such as PEEK resin (Poly Ether Ether Ketone).
  • the insulating member 8 is made of a rectangular plate in plan view, and covers the lower surface of the cathode side energizing member 7.
  • the anode side energization member 9 is a member for supplying current to the anode layer 62.
  • the anode side energizing member 9 is made of an annular metal plate in plan view and is laminated on the upper side of the anode member 6.
  • the anode side energizing member 9 has an opening 91 at the center, and the window 64 is exposed from the opening 91.
  • the anode side energizing member 9 has a plurality of probe installation holes 92 for installing the probes P.
  • the anode-side energizing member 9 is connected to a positive electrode of a power supply device PW (not shown) via a protrusion 93 protruding from the front side surface.
  • the positive electrode of the power supply device PW is electrically connected to the anode layer 62 via the anode-side energizing member 9, the probe P, and the anode-side conductive layer 43.
  • the probe P is a metal member for electrically connecting the cathode-side current-carrying member 7 and the cathode-side conductive layer 42, or the anode-side current-carrying member 9 and the anode-side conductive layer 43, respectively.
  • the probe P has a bottomed cylindrical cylinder P1 and a piston P2 provided in the cylinder P1 so as to be able to appear and retract.
  • the cylinder P1 is fitted into the probe installation holes 71 and 92 and inserted into the probe insertion holes 25 and 66 with the piston P2 facing the cathode side conductive layer 42 or the anode side conductive layer 43.
  • the piston P2 is biased in the protruding direction by a spring (not shown) accommodated in the cylinder P1, and is in contact with the cathode side conductive layer 42 or the anode side conductive layer 43.
  • one of the eight probes P on the anode side disposed at a position corresponding to the reference electrode conductive layer 44 has an insulator disposed around the cylinder P1. It is insulated from the anode side energizing member 9.
  • the probe P corresponding to the reference electrode conductive layer 44 is connected to a measuring device (not shown), and the piston P2 is in contact with the reference electrode conductive layer 44.
  • the reference electrode conductive layer 44 is connected to the reference electrode layer 63 inside the second seal member 5. Thereby, the electric potential of the reference electrode layer 63 is measured by the measuring device.
  • the holding member 2, the spacer 4, the anode member 6, the cathode side energizing member 7, the insulating member 8, and the anode side energizing member 9 are respectively bolts B (FIG. 1) that fasten the respective members in a stacked state.
  • a plurality of bolt insertion holes 26, 46, 67, 73, 81, 94 are provided for inserting the reference).
  • the plating apparatus 1 according to the first embodiment is basically configured as described above. Next, referring to FIGS. 1 to 8 (particularly FIG. 5), the usage state and operation of the plating apparatus 1 are described. The effect will be described.
  • the plating apparatus 1 includes a holding member 2 that holds an object to be plated W, a spacer 4 that has a through portion 45, and an anode member 6 that has an anode layer 62.
  • the first seal member 3 and the second seal member 5 are stacked.
  • the workpiece W and the anode layer 62 face each other through the through portion 45, and the through portion 45 is closed in a watertight manner so that the plating solution can be stored. Therefore, the plating apparatus 1 can be easily configured by simply laminating each member.
  • a water tank having a complicated structure is not required. Can be simplified and downsized.
  • the to-be-plated object W and the anode layer 62 are prepared by preparing beforehand the spacer 4 from which thickness dimension t2 differs, and replacing
  • the anode side conductive layer 43 is connected to the anode layer 62 inside the second seal member 5, and the anode side conductive layer 43 is connected to the probe P outside the second seal member 5.
  • electricity can be supplied to the anode layer 62 while maintaining watertightness between the spacer 4 and the anode member 6.
  • the anode member main body 61 has a window 64 having translucency for observing the workpiece W exposed from the through portion 45, and the anode layer 62 is formed avoiding the window 64. Yes. Therefore, as shown in FIG. 5, the state of the workpiece W during plating can be observed (or observed) from the window portion 64 using, for example, a Raman microscope M or the like.
  • the thickness t1 of the window portion 64 is set to be very thin, for example, 0.13 mm, refraction and scattering of light transmitted through the window portion 64 are suitably suppressed, and Raman The observation accuracy of the microscope M can be improved.
  • the anode member 6 has the taper part 64a and the anode side electricity supply member 9 has the opening part 91, the interference with the anode member 6, the anode side electricity supply member 9, and the Raman microscope M is suppressed, for example.
  • the Raman microscope M can be disposed close to the window portion 64.
  • the thickness dimension t2 of the spacer 4 is set very thin, for example, 0.10 mm. Therefore, since the thickness (depth) of the plating solution stored in the penetration part 45 becomes small, for example, even if the plating solution is colored, the state of the object to be plated W can be observed. In the first embodiment, the thickness t2 of the spacer 4 is extremely thin, about 0.10 mm, so that the reaction state at the solid-liquid interface can be observed in more detail.
  • the cathode-side conductive layer 42 is connected to the object to be plated W inside the first seal member 3, and the cathode-side conductive layer 42 is a probe outside the first seal member 3. Since it is connected to the power supply device PW via P, it is possible to supply electricity to the workpiece W while maintaining the watertightness between the spacer 4 and the holding member 2.
  • the holding member 2 is provided with a plating solution supply path 27 for supplying a plating solution to the through portion 45 and a plating solution discharge passage 28 for discharging the plating solution from the through portion 45.
  • a plating solution supply path 27 for supplying a plating solution to the through portion 45
  • a plating solution discharge passage 28 for discharging the plating solution from the through portion 45.
  • the probe P is in direct contact with the lower surface of the workpiece WA, and the spacer 4A is not provided with the cathode-side conductive layer 42.
  • this is mainly different from the first embodiment described above.
  • the object WA to be plated used in the plating apparatus 1A according to the second embodiment is a member in which the lower surface (back surface) on the holding member 2A side and the upper surface (front surface) on which plating is performed are electrically connected.
  • a simple metal plate or the like For example, a simple metal plate or the like.
  • an annular concave groove 23a is formed on the bottom surface of the concave portion 23 for installing the workpiece WA. Further, a probe insertion hole 23b for inserting the probe P is formed through the bottom surface of the recess 23 and inside the recess groove 23a.
  • the cathode side energizing member 7 is formed with a probe installation hole 74 through which the probe P is fitted at a position corresponding to the probe insertion hole 23b.
  • the third seal member 10 is disposed between the holding member 2A and the workpiece WA.
  • the third seal member 10 is installed along the concave groove 23a. Since the third seal member 10 keeps the space between the holding member 2 ⁇ / b> A and the workpiece WA to be watertight, the plating solution can be prevented from leaking from the probe insertion hole 23 b or the probe installation hole 74.
  • the spacer 4A has a spacer body 41 and an anode-side conductive layer 43, and does not have a cathode-side conductive layer 42 (see FIG. 3). This is because the probe P is in direct contact with the lower surface of the workpiece WA.
  • the probe P is in direct contact with the lower surface of the workpiece WA and the cathode-side conductive layer 42 of the spacer 4A is omitted. Simplification can be achieved.
  • the window portion 64 is provided on the anode member 6, but the present invention is not limited to this, and the window portion 64 is not provided when observation with a microscope is not performed. Also good.
  • the anode member main body 61 and the window 64 are formed of the same material (for example, quartz glass), but the present invention is not limited to this.
  • the anode member main body 61 And the window portion 64 may be formed of separate members.
  • the window part 64 may be comprised with the material which has translucency, and the anode member main-body part 61 may be comprised with an opaque material.
  • the reference electrode layer 63 is provided on the lower surface of the anode member main body 61 and the reference electrode conductive layer 44 is provided on the surface of the spacer 4 on the anode member 6 side.
  • the reference electrode layer 63 and the reference electrode conductive layer 44 may be omitted.
  • the plating solution supply path 27 and the plating solution discharge path 28 are provided in the holding member 2, but the present invention is not limited to this.
  • the plating solution supply path is provided in the anode member 6.
  • 27 and a plating solution discharge path 28 may be provided.
  • One of the plating solution supply path 27 and the plating solution discharge path 28 is provided on one of the holding member 2 and the anode member 6, and the other of the plating solution supply path 27 and the plating solution discharge path 28 is provided on the holding member 2 and the anode member 6. You may provide in the other.
  • the plating solution supply path 27 and the plating solution discharge path 28 may be omitted.
  • the cathode-side energizing member 7 and the anode-side energizing member 9 are connected to the power supply device PW to perform electrolytic plating.
  • the present invention is not limited to this, and the cathode-side energizing is performed.
  • the member 7 and the anode side energizing member 9 may be connected to a measuring device (not shown) instead of the power supply device PW, and an electroless plating solution may be supplied to the through portion 45 as a plating solution. If it does in this way, while being able to perform electroless plating with the plating apparatus 1, the electric potential of the to-be-plated object W and the anode layer 62 in electroless plating can be measured using a measuring device.
  • FIG. 10 is a plan view of a spacer in a sensor device using a plating apparatus.
  • FIG. 11 is a bottom view of the anode member in the sensor device using the plating apparatus. Since the sensor device has the same configuration as the first embodiment except for the anode side conductive layer 43B of the spacer 4B and the anode layer 62B of the anode member 6B, the anode side conductive layer 43B and the anode will be described in the following description. The description will focus on the layer 62B, and description of the other components will be omitted.
  • the spacer 4B has a plurality (eight in this modification) of anode-side conductive layers 43B arranged radially on the surface of the anode member 6B.
  • the anode side conductive layers 43B are insulated from each other.
  • the outer end 43Ba of each anode-side conductive layer 43B is provided at a position corresponding to the probe insertion hole 66 of the anode member 6.
  • the inner end portion 43 ⁇ / b> Bb of each anode-side conductive layer 43 ⁇ / b> B extends to the periphery of the through portion 45.
  • the anode member 6B has a plurality of (eight in this modification) anode layers 62B arranged radially on the surface on the spacer 4B side.
  • the anode layers 62B are insulated from each other.
  • Each anode layer 62B is provided at a position corresponding to the anode-side conductive layer 43B.
  • the outer end 62Ba of each anode layer 62B extends to the inner peripheral edge of the groove 65, and is in contact with the anode-side conductive layer 43B in an assembled state. Further, the inner end portion 62Bb of each anode layer 62B extends to the outer peripheral edge of the window portion 64 and is exposed from the through portion 45.
  • the reactive group is a substance that reacts with a substance that may be contained in the reagent supplied to the penetrating portion 45 (see FIG. 2) of the sensor device.
  • the reagent include a liquid (for example, blood) containing an electrolyte.
  • the reactive group include a self-assembled monolayer (SAM) having a specific binding receptor.
  • SAM self-assembled monolayer
  • the inner end portion 62Bb of each anode layer 62B is modified with aminopropyltriethoxysilane (3-aminopropyltriethoxy silane) to react with Pd ions.
  • the probes P are inserted into the probe insertion holes 66 of the anode member 6B.
  • Each probe P is connected to a measuring device (not shown) while being insulated from each other.
  • the measuring device measures the change in potential of the anode layer 62B when the reactive group modified on the inner end 62Bb of the anode layer 62B reacts with the substance contained in the reagent.
  • the substance contained in the reagent can be detected.
  • the measurement by a 3 pole system is also possible by making a cathode side a counter electrode and using one of eight as a reference electrode.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
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PCT/JP2014/070252 2013-08-19 2014-07-31 めっき装置及びこれを用いたセンサ装置 WO2015025693A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201480045566.4A CN105473770B (zh) 2013-08-19 2014-07-31 一种电镀装置及传感装置
US14/912,698 US20160230285A1 (en) 2013-08-19 2014-07-31 Plating apparatus and sensing device using same
EP14837234.5A EP3037573B1 (de) 2013-08-19 2014-07-31 Plattierungsvorrichtung und erfassungsvorrichtung damit
SG11201601245VA SG11201601245VA (en) 2013-08-19 2014-07-31 Plating apparatus and sensing device using same
KR1020167006661A KR101773308B1 (ko) 2013-08-19 2014-07-31 도금 장치 및 이것을 이용한 센서 장치

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JP2013169504A JP6226229B2 (ja) 2013-08-19 2013-08-19 めっき装置及びこれを用いたセンサ装置

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WO2018136769A1 (en) * 2017-01-19 2018-07-26 Aegion Coating Services, Llc Pipe joint inspection
JP6993288B2 (ja) * 2018-05-07 2022-01-13 株式会社荏原製作所 めっき装置
JP7193418B2 (ja) * 2019-06-13 2022-12-20 株式会社荏原製作所 めっき装置
CN115142104B (zh) * 2022-07-28 2024-04-26 福州一策仪器有限公司 电镀装置、多通道电镀装置组和电镀反应系统
KR20240079097A (ko) * 2022-11-28 2024-06-04 (주)애니캐스팅 기판과 전원 연결이 용이한 ｓ-ｅｃａｍ 프린팅 장치

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EP3037573B1 (de) 2018-03-14
KR101773308B1 (ko) 2017-08-30
CN105473770A (zh) 2016-04-06
EP3037573A4 (de) 2017-04-19
US20160230285A1 (en) 2016-08-11
JP6226229B2 (ja) 2017-11-08
EP3037573A1 (de) 2016-06-29
CN105473770B (zh) 2017-09-08
SG11201601245VA (en) 2016-03-30
KR20160045758A (ko) 2016-04-27
JP2015038232A (ja) 2015-02-26

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