EP3037573A4 - Plating apparatus and sensing device using same - Google Patents

Plating apparatus and sensing device using same Download PDF

Info

Publication number
EP3037573A4
EP3037573A4 EP14837234.5A EP14837234A EP3037573A4 EP 3037573 A4 EP3037573 A4 EP 3037573A4 EP 14837234 A EP14837234 A EP 14837234A EP 3037573 A4 EP3037573 A4 EP 3037573A4
Authority
EP
European Patent Office
Prior art keywords
same
sensing device
plating apparatus
plating
sensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14837234.5A
Other languages
German (de)
French (fr)
Other versions
EP3037573B1 (en
EP3037573A1 (en
Inventor
Wataru Yamamoto
Kimiko Koiwa
Takayuki Homma
Masahiro Yanagisawa
Mikiko Saito
Tomoyuki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Waseda University
Yamamoto MS Co Ltd
Original Assignee
Waseda University
Yamamoto MS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Waseda University, Yamamoto MS Co Ltd filed Critical Waseda University
Publication of EP3037573A1 publication Critical patent/EP3037573A1/en
Publication of EP3037573A4 publication Critical patent/EP3037573A4/en
Application granted granted Critical
Publication of EP3037573B1 publication Critical patent/EP3037573B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
EP14837234.5A 2013-08-19 2014-07-31 Plating apparatus and sensing device using same Active EP3037573B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013169504A JP6226229B2 (en) 2013-08-19 2013-08-19 Plating apparatus and sensor apparatus using the same
PCT/JP2014/070252 WO2015025693A1 (en) 2013-08-19 2014-07-31 Plating apparatus and sensing device using same

Publications (3)

Publication Number Publication Date
EP3037573A1 EP3037573A1 (en) 2016-06-29
EP3037573A4 true EP3037573A4 (en) 2017-04-19
EP3037573B1 EP3037573B1 (en) 2018-03-14

Family

ID=52483474

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14837234.5A Active EP3037573B1 (en) 2013-08-19 2014-07-31 Plating apparatus and sensing device using same

Country Status (7)

Country Link
US (1) US20160230285A1 (en)
EP (1) EP3037573B1 (en)
JP (1) JP6226229B2 (en)
KR (1) KR101773308B1 (en)
CN (1) CN105473770B (en)
SG (1) SG11201601245VA (en)
WO (1) WO2015025693A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018136769A1 (en) * 2017-01-19 2018-07-26 Aegion Coating Services, Llc Pipe joint inspection
JP6993288B2 (en) * 2018-05-07 2022-01-13 株式会社荏原製作所 Plating equipment
JP7193418B2 (en) * 2019-06-13 2022-12-20 株式会社荏原製作所 Plating equipment
CN115142104B (en) * 2022-07-28 2024-04-26 福州一策仪器有限公司 Electroplating device, multichannel electroplating device group and electroplating reaction system
KR20240079097A (en) * 2022-11-28 2024-06-04 (주)애니캐스팅 S-ECAM printing apparatus for easy connection between substrate and power supply

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060049038A1 (en) * 2003-02-12 2006-03-09 Surfect Technologies, Inc. Dynamic profile anode
WO2012079101A1 (en) * 2010-12-15 2012-06-21 Markus Hacksteiner Device and method for metallizing wafers

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2711270A1 (en) * 1976-03-16 1977-09-22 Ici Ltd ORGANIC MATERIALS WITH SPECIFIC REACTIVE GROUPS
JPS61172167U (en) * 1985-04-15 1986-10-25
KR200142727Y1 (en) * 1996-11-08 1999-06-01 정몽규 Installation structure of egr valve
JPH11195622A (en) * 1997-12-26 1999-07-21 Ebara Corp Plating jig for wafer
US6582580B1 (en) * 1998-03-02 2003-06-24 Ebara Corporation Substrate plating apparatus
JP3939456B2 (en) * 1998-03-05 2007-07-04 株式会社荏原製作所 Substrate plating method and apparatus
JP2006299367A (en) * 2005-04-22 2006-11-02 Yamamoto Mekki Shikenki:Kk Electroplating tester
JP2006348373A (en) * 2005-06-20 2006-12-28 Yamamoto Mekki Shikenki:Kk Holder for electroplating
US7935230B2 (en) * 2006-06-29 2011-05-03 Semitool, Inc. Electro-chemical processor
JP2008076143A (en) * 2006-09-20 2008-04-03 Citizen Holdings Co Ltd Instrument for measuring hemoglobin concentration
CN101250726B (en) * 2007-11-28 2010-08-18 北京矿冶研究总院 Closed electrolytic tank and electrolytic system
JP4939484B2 (en) * 2008-05-30 2012-05-23 株式会社山本鍍金試験器 Cathode cartridge for electroplating
CN201713591U (en) * 2009-12-30 2011-01-19 中国电子科技集团公司第二研究所 Plating equipment for electrode of silicon solar battery plate
JP5540789B2 (en) * 2010-03-17 2014-07-02 マツダ株式会社 Electric vehicle battery and motor mounting structure
JP5719687B2 (en) * 2011-05-19 2015-05-20 日東電工株式会社 Electroless plating apparatus, electroless plating method, and method for manufacturing printed circuit board
JP5576848B2 (en) * 2011-12-07 2014-08-20 株式会社山本鍍金試験器 Jig for holding plate member

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060049038A1 (en) * 2003-02-12 2006-03-09 Surfect Technologies, Inc. Dynamic profile anode
WO2012079101A1 (en) * 2010-12-15 2012-06-21 Markus Hacksteiner Device and method for metallizing wafers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015025693A1 *

Also Published As

Publication number Publication date
SG11201601245VA (en) 2016-03-30
KR20160045758A (en) 2016-04-27
CN105473770A (en) 2016-04-06
JP2015038232A (en) 2015-02-26
US20160230285A1 (en) 2016-08-11
CN105473770B (en) 2017-09-08
JP6226229B2 (en) 2017-11-08
WO2015025693A1 (en) 2015-02-26
EP3037573B1 (en) 2018-03-14
EP3037573A1 (en) 2016-06-29
KR101773308B1 (en) 2017-08-30

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