KR20240079097A - S-ECAM printing apparatus for easy connection between substrate and power supply - Google Patents

Abstract

The present invention relates to a S-ECAM (Selective ElectroChemical Additive Manufacturing) printing device capable of selectively depositing metal raw materials on a substrate using electrochemical deposition (ECAM, ElectroChemical Additive Manufacturing), and more specifically, to a substrate. It relates to a S-ECAM printing device that is easy to connect to a power source. The S-ECAM printing device according to an embodiment of the present invention includes: a substrate; An electrode holder located on top of the substrate and having a plurality of electrodes on the bottom; a power supply unit that applies power using the electrode as an anode and the substrate as a cathode; and a control unit that applies power from the power supply unit while the electrode and the substrate are immersed in the electrolyte solution at a predetermined distance apart to electrodeposit metal ions contained in the electrolyte solution on the area of the substrate facing the electrode. Included, a cathode plate connected to the cathode of the power supply is provided on the upper part of the electrode holder, and the electrode holder may be provided with a cathode probe that electrically connects the substrate and the cathode plate.

Description

S-ECAM printing apparatus for easy connection between substrate and power supply}

The present invention relates to a S-ECAM (Selective ElectroChemical Additive Manufacturing) printing device capable of selectively depositing metal raw materials on a substrate using electrochemical deposition (ECAM, ElectroChemical Additive Manufacturing), and more specifically, to a substrate. It relates to a S-ECAM printing device that is easy to connect to a power source.

Korean Patent No. 10-2392201 (3D printing device using selective electrochemical electrodeposition with a multi-electrode module), Korean Patent No. 10-2392199 (control method of 3D printing device using selective electrochemical electrodeposition), Korean Patent No. 10-2382806 (3D printing device using selective electrochemical electrodeposition that performs gap control using pulse peaks) discloses a 3D printing device using selective electrochemical electrodeposition.

Figure 1 is a diagram showing a conventional three-dimensional printing device using selective electrochemical electrodeposition, and Figure 2 is a diagram showing a state in which power is applied to the substrate and electrodes.

Referring to Figures 1 and 2, a three-dimensional printing device 10 using conventional selective electrochemical electrodeposition includes a tub 20 containing an electrolyte 11, and a tub 20 immersed in the electrolyte 11 contained in the tub 20. A substrate 12 placed in a state, a multi-electrode module 30 having an electrode holder 31 and a plurality of electrodes 32 arranged and fixed to the electrode holder 31 at predetermined intervals, the multi-electrode module ( A driving unit 13 for controlling the movement of the 30), a power supply unit 50 for applying power to the substrate 12 and the plurality of electrodes 32, and the driving unit 13 and the power supply unit 50. It includes a control unit 14 that controls and stacks metal ions contained in the electrolyte 11 on the substrate 12 by selectively electrodepositing them.

The bottom surface 33 of the substrate 12 and the plurality of electrodes 32 may be immersed in the electrolyte solution 11 contained in the tub 20 while facing each other and being spaced a predetermined distance apart.

For example, the substrate 12 may be immersed in the electrolyte 11 contained in the tub 20 while placed on the support 21 provided in the tub 20, and the plurality of electrodes 32 The bottom surface 33 of the plurality of electrodes 32 is immersed in the electrolyte solution 11 contained in the tub 20 due to the movement of the multi-electrode module 30 by the operation of the driver 13, thereby forming the substrate. (12) can be faced at a predetermined distance apart.

And, in a state where the substrate 12 and the bottom 33 of the plurality of electrodes 32 face each other at a predetermined distance and are immersed in the electrolyte 11 contained in the tub 20, the control unit 14 Controls the power supply unit 50 to apply power to the substrate 12 and the plurality of electrodes 32 by setting the plurality of electrodes 32 to (+) and the substrate 12 to (-). In this case, metal ions contained in the electrolyte 11 may be deposited on the substrate 12 by electrochemical deposition in the area 17 facing the bottom 33 of the electrode 32.

Accordingly, the control unit 14 can control the driver 13 and the power supply unit 50 to selectively electrodeposit and laminate metal ions contained in the electrolyte 11 on the substrate 12.

The driving unit 13 is a component for controlling the movement of the multi-electrode module 30, and may be provided to drive the multi-electrode module 30 in horizontal and vertical directions.

For example, the driver 13 moves the multi-electrode module 30 horizontally to select a position where it is laminated on the substrate 12, and after lamination to a predetermined height, for example, a preset 1-layer lamination is performed. After this is completed, the multi-electrode module 30 can be moved in the vertical direction by approximately the height of the one-layer stack to adjust the gap between the substrate 12 and the bottom surface 33 of the plurality of electrodes 32. .

That is, the driver 13 can drive the multi-electrode module 30 to control three-dimensional displacement including the gap between the bottom surface 33 of the plurality of electrodes 32 and the substrate 12.

According to the three-dimensional printing device 10 using conventional selective electrochemical electrodeposition having the above configuration, the electrode 32 is electrically connected to the power supply 50 through the multi-electrode module 30, and the substrate 12 ) is directly electrically connected to the power supply unit 50, but as in the prior art, connecting the board 12 directly to the power supply unit 50 is difficult due to space constraints.

The present invention provides an S-ECAM printing device that can selectively deposit metal raw materials on a substrate using a deposition method using electrochemical electrodeposition.

Additionally, the present invention provides a S-ECAM printing device that can easily connect the substrate to a power source.

The S-ECAM printing device according to an embodiment of the present invention includes: a substrate; An electrode holder located on top of the substrate and having a plurality of electrodes on the bottom; a power supply unit that applies power using the electrode as an anode and the substrate as a cathode; and a control unit that applies power from the power supply unit while the electrode and the substrate are immersed in the electrolyte solution at a predetermined distance apart to electrodeposit metal ions contained in the electrolyte solution on the area of the substrate facing the electrode. Included, a cathode plate connected to the cathode of the power supply is provided on the upper part of the electrode holder, and the electrode holder may be provided with a cathode probe that electrically connects the substrate and the cathode plate.

In addition, in the S-ECAM printing device according to an embodiment of the present invention, a cathode probe hole is formed in the electrode holder, the cathode probe is inserted and coupled to the cathode probe hole, and the lower end of the cathode probe is connected to the electrode holder. The probe may extend downward and contact the substrate, and the upper end of the cathode probe may extend toward the upper portion of the electrode holder and contact the cathode plate.

In addition, in the S-ECAM printing device according to an embodiment of the present invention, a plurality of conductive layers that are not connected to each other are formed in the area of the substrate facing the electrode, and the cathode probe is connected to the conductive layer. There may be a plurality of them connected to each other.

In addition, in the S-ECAM printing device according to an embodiment of the present invention, the electrode holder is provided with a plurality of anode probes connected to each of the plurality of electrodes, and the plurality of anode probes may be connected to the anode of the power supply. there is.

In addition, in the S-ECAM printing device according to an embodiment of the present invention, the electrode holder is provided with an anode probe hole into which the anode probe is inserted, and a fixing groove in which the electrode is fixed at the bottom of the anode probe hole, The anode probe may be inserted and coupled into the anode probe hole, so that the lower end of the anode probe may be in contact with the electrode, and the upper end of the anode probe may be connected to the anode of the power supply unit.

Additionally, the S-ECAM printing device according to an embodiment of the present invention may include an electrode control unit that individually controls each of the plurality of electrodes.

In addition, the S-ECAM printing device according to an embodiment of the present invention is provided with an anode plate connected to the anode of the power supply on the electrode holder, and the electrode holder includes the plurality of electrodes and the anode plate. A plurality of connected anode probes may be provided.

In addition, the S-ECAM printing device according to an embodiment of the present invention is provided with a cover on the upper part of the electrode holder to which the cathode plate and the anode plate are fixed, and the anode plate and the cathode plate are raised so as not to contact each other. The car can be left on and secured to the cover.

In addition, in the S-ECAM printing device according to an embodiment of the present invention, the electrode holder is provided with an inlet through which the electrolyte flows and an outlet through which the electrolyte flowing through the inlet is discharged, and the inlet is located on the side of the electrode holder. and the outlet may be formed on the bottom of the electrode holder.

Meanwhile, the S-ECAM printing device according to an embodiment of the present invention includes a bath; a substrate support portion provided in the bath and on which a substrate is placed; an electrode holder located above the substrate support unit and having a plurality of electrodes on its bottom; a driving unit that moves the electrode holder; a power supply unit that applies power using the electrode as an anode and the substrate as a cathode; A storage unit where electrolyte is stored; a pump supplying the electrolyte stored in the storage unit to the bath; and controlling the driving unit and the pump so that the electrode and the substrate are immersed in the electrolyte while being spaced at a predetermined distance, and applying power from the power supply unit while the electrode and the substrate are immersed in the electrolyte. and a control unit that electrodeposits metal ions contained in the electrolyte on a predetermined area of the substrate facing the electrode, wherein a cathode plate connected to the cathode of the power supply is provided on an upper part of the electrode holder, and the electrode holder has the cathode plate connected to the cathode of the power supply unit. A cathode probe may be provided to electrically connect the substrate and the cathode plate.

According to the S-ECAM printing device according to an embodiment of the present invention, the substrate can be easily connected to a power source.

In addition, according to the S-ECAM printing device according to an embodiment of the present invention, a bonding layer for mounting bumps or chips on a circuit board without using a mask using a lamination method by electrochemical electrodeposition, etc. can be formed, eliminating the need for the exposure process and strip process to remove photoresist when using a mask, which has the effect of lowering equipment price and investment cost, shortening process time, and minimizing environmental costs.

The effects according to the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the claims and detailed description. You will be able to.

Figure 1 is a diagram showing a conventional three-dimensional printing device using selective electrochemical electrodeposition;
Figure 2 is a diagram showing a state in which power is applied to the substrate and electrodes.
Figure 3 is a perspective view of a S-ECAM printing device according to an embodiment of the present invention;
Figure 4 is a rear view of the S-ECAM printing device according to an embodiment of the present invention;
Figure 5 is a top perspective view of the S-ECAM printing device according to an embodiment of the present invention;
Figure 6 is a combined perspective view of an electrode module according to an embodiment of the present invention;
Figure 7 is an exploded perspective view of an electrode module according to an embodiment of the present invention;
Figure 8 is a vertical cross-sectional view of an electrode module according to an embodiment of the present invention.
Figure 9 is a bottom view of a cover according to an embodiment of the present invention;
Figure 10 is a view showing the bottom of an electrode module according to an embodiment of the present invention.
Figure 11 is a diagram schematically showing a state in which power is applied while the substrate and electrode are immersed in an electrolyte. Figure 11 shows an electrode module according to another embodiment.
Figure 12 is a plan view of a substrate according to an embodiment of the present invention.

Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the accompanying drawings, like reference numerals are assigned to like components, and duplicate description thereof is omitted.

Terms such as first and second may be used to describe components, but the components are not limited to these terms and are used only for the purpose of distinguishing one component from another component.

When a part is said to "include" a certain component, this means that it does not exclude other components, but may further include other components, unless specifically stated to the contrary.

The thickness or size of each layer (film), region, pattern, or structure in the drawings may be modified for clarity and convenience of explanation, and therefore does not entirely reflect the actual size. In the description of the embodiments, each layer (film), region, pattern or structure is “over”, “on” or “below” the substrate, each layer (film), region, pad or pattern. In the case where it is described as being formed in “under,” “over,” “on,” and “under” mean “directly” or “indirectly through another layer.” )" includes everything that is formed.

In addition, “on” means located above or below the target member, and does not necessarily mean located at the top based on the direction of gravity.

In this specification, relative terms such as 'upper', 'lower', 'upper surface', 'bottom', 'upper', 'lower', etc. may be used to describe the relationship between components based on the direction shown in the drawing. , the present invention is not limited by such terms.

Each embodiment may be implemented independently or together, and some components may be excluded to suit the purpose of the invention.

Figure 3 is a perspective view of a S-ECAM printing device according to an embodiment of the present invention, Figure 4 is a rear view of a S-ECAM printing device according to an embodiment of the present invention, and Figure 5 is an embodiment of the present invention. This is an upper perspective view of the S-ECAM printing device according to .

Referring to FIGS. 3 to 5, the S-ECAM printing device 100 according to an embodiment of the present invention includes a bath 120, which is provided in the bath 120 and a substrate 130 is placed on top. It may include a substrate support portion 200 and an electrode module 300 positioned on top of the substrate support portion 200 at a predetermined distance apart.

The substrate 130 may be a circuit board. For example, the S-ECAM printing device 100 according to the present invention can be used to form a bump or a bonding layer for mounting a chip on a circuit board.

The electrode module 300 may include an electrode holder on the bottom of which a plurality of electrodes are provided at predetermined intervals. A detailed description of this will be provided later.

In addition, the S-ECAM printing device 100 according to an embodiment of the present invention includes a driving unit 101 that moves the electrode module 300, and an electrode formed on the bottom of the electrode holder as an anode. ) as a cathode, a power supply unit 102 for applying power, a storage unit 103 for storing electrolyte, and a pump 104 for supplying the electrolyte stored in the storage unit 103 to the bath 120. may include.

Additionally, the S-ECAM printing device 100 according to an embodiment of the present invention may include a control unit 110 that controls the driving unit 101, the power supply unit 102, and the pump 104.

Therefore, when power is applied to the power supply unit 102 while the electrode and the substrate 130 are immersed in the electrolyte supplied by the pump 104 at a predetermined distance apart, the electrode facing the electrode Metal ions contained in the electrolyte solution may be electrodeposited on a predetermined area of the substrate 130.

For example, the control unit 110 may control the operation of the driving unit 101 so that the electrode and the substrate 130 are spaced a predetermined distance apart from each other. The operation of the pump 104 can be controlled so that the electrode and the substrate 130 are immersed in the electrolyte solution, and in a state where the electrode and the substrate 130 are immersed in the electrolyte solution, the electrode and the substrate ( The operation of the power supply unit 102 can be controlled so that power is applied to 130). Then, printing can be performed by electrodepositing the metal ions contained in the electrolyte solution on a predetermined area of the substrate 130 facing the electrode.

The bath 120 has a space for receiving the electrolyte supplied by the pump 104, and the bath 120 may be provided with an outlet for discharging the received electrolyte into the storage unit 103. Then, the electrolyte solution collected in the storage unit 103 is supplied back to the bath 120 by the operation of the pump 104, so that the electrolyte solution can be circulated.

In addition, the S-ECMA printing device 100 according to an embodiment of the present invention is printing conditions, such as electrolyte conditions such as pressure and flow rate, gap conditions between the substrate 130 and the electrode, constant current, constant voltage, etc. It may include an input unit 105 through which power supply conditions can be input, a UI through which the user can input the conditions, and a display unit 106 that displays the state of electrodeposition on the substrate.

In addition, the S-ECAM printing device 100 according to an embodiment of the present invention includes a vacuum pump that fixes the substrate placed on the substrate support 200 through a vacuum hole formed in the substrate support 200. It may include (108) and an air compressor (109) that generates pneumatic pressure, and the control unit (110) can control the operation of the vacuum pump (108) and the air compressor (109).

In addition, the upper part (see FIG. 5) of the S-ECAM printing device 100 according to an embodiment of the present invention is a space where metal ions contained in the electrolyte solution are electrodeposited on the substrate 120, that is, printing is performed, A base frame 111, an upper frame 112, and a support frame 113 provided at an edge of the base frame 111 to support the upper frame 112 may be provided.

The bath 120 may be fixed to the upper part of the base frame 11, and the driving unit 101 may be fixed to the upper frame 112.

Figure 6 is a combined perspective view of an electrode module according to an embodiment of the present invention, Figure 7 is an exploded perspective view of an electrode module according to an embodiment of the present invention, and Figure 8 is a combined perspective view of an electrode module according to an embodiment of the present invention. It is a vertical cross-sectional view, Figure 9 is a bottom view of the cover according to an embodiment of the present invention, and Figure 10 is a view showing the bottom of the electrode module according to an embodiment of the present invention.

In the conventional three-dimensional printing device 10 using selective electrochemical electrodeposition (see FIGS. 1 and 2), the electrode 32 is electrically connected to the power supply 50 through the multi-electrode module 30, and the substrate 12 ) is disclosed to be electrically connected directly to the power supply unit 50. However, as in the prior art, connecting the board 12 directly to the power supply unit 50 is difficult due to space constraints.

In particular, the S-ECAM printing device 100 according to an embodiment of the present invention can be used to form a bonding layer for mounting bumps or chips on a semiconductor circuit board, where the substrate is a semiconductor circuit board. The electrode is an area where a bump or bonding layer will be formed on the semiconductor circuit board, so in order to print in the area, the electrode must be electrically connected to the area around the area, but there are several areas on the substrate that are not electrically connected to each other. Therefore, it is very difficult to electrically connect the board directly to the power supply.

In order to solve the above problems, the electrode module 300 according to an embodiment of the present invention is configured so that not only the electrode but also the substrate is electrically connected to the power supply unit 102.

Referring to FIGS. 6 to 10, the electrode module 300 according to an embodiment of the present invention is located on the upper part of the substrate 130 and includes an electrode holder 310 having the plurality of electrodes 320 on the bottom, and , It may include a cover 330 coupled to the top of the electrode holder 310, an anode plate 340 fixed to the cover 330, and a cathode plate 350 fixed to the cover 330. there is.

The anode plate 340 may be connected to the anode of the power supply unit 102, and the cathode plate 350 may be connected to the cathode of the power supply unit 102.

For example, the anode plate 340 is provided with an anode connection part 342 connected to the anode of the power supply unit 102, and the cathode plate 350 is provided with a cathode connection part connected to the cathode of the power supply unit 102. 352 is provided, and a power connection groove 331 may be formed in the cover 330 so that the anode connection part 342 and the cathode connection part 352 protrude to the outside of the cover 330.

The electrode holder 310 includes an anode probe 360 connecting the electrode 320 and the anode plate 340, and a cathode probe 370 connecting the substrate 130 and the cathode plate 350. It can be provided.

The upper end of the cathode probe 370 may be connected to the cathode plate 350, the lower end may protrude below the electrode holder 310, and the protruding lower end may be connected to the substrate 130.

The electrode holder 310 includes an anode probe hole 315 into which the anode probe 360 is inserted, a fixing groove 316 into which the electrode 320 is fixed at the bottom of the anode probe hole 315, and the cathode. A cathode probe hole 317 into which the probe 370 is inserted may be formed.

The anode probe 360 is inserted into the anode probe hole 315, the lower end contacts the electrode 320, and the upper end contacts the anode plate 340 to form the electrode 320 and the anode plate 340. can be electrically connected.

The cathode probe 370 is inserted into the cathode probe hole 317, so that its lower end protrudes below the electrode holder 310, its upper end contacts the cathode plate 350, and the protruding lower end is connected to the substrate. By contacting 130, the substrate 130 and the cathode plate 350 can be electrically connected.

Then, in the electrode module 300 according to an embodiment of the present invention, not only the electrode 320 but also the substrate 130 can be electrically connected to the power supply unit 102.

The anode probe 360 includes an anode probe body 361, an anode upper contact portion 362 fixed to the top of the anode probe body 361 and in contact with the anode plate 340, and an anode probe body 361. It may include an anode bottom contact portion 363 that is fixed to the bottom and contacts the electrode 320.

Additionally, the anode probe 360 may include an anode top elastic member 364 provided between the top of the anode probe body 361 and the anode top contact portion 362 to provide an upward elastic force. Then, the anode top contact portion 362 can stably contact the anode plate 340 by the anode top elastic member 364.

In addition, the anode probe 360 may include an anode lower elastic member 365 that is provided between the bottom of the anode probe body 361 and the anode lower contact portion 363 and applies a downward elastic force. Then, the anode lower contact portion 363 can stably contact the electrode 320 by the anode lower elastic member 365.

The anode upper elastic member 364 and the anode lower elastic member 365 may be springs.

The anode probe 360 may be configured to electrically connect the electrode 320 and the anode plate 340. For example, the anode probe body 361, the anode upper contact portion 362, and the anode lower contact portion 363 may be made of an electrically conductive material, such as copper or a gold-plated metal material. Alternatively, the anode upper contact portion 362 and the anode lower contact portion 363 are made of an electrically conductive material, such as copper or a gold-plated metal material, and the anode probe body 361 has the anode upper contact portion. A wire 366 may be provided to electrically connect 362 and the anode lower contact portion 363.

Likewise, the cathode probe 370 includes a cathode probe body 371 inserted into the cathode probe hole 317, a cathode upper contact portion ( 372), and may include a cathode lower contact portion 373 that is coupled to the lower portion of the cathode probe body 371 and protrudes toward the lower portion of the electrode holder 310 and contacts the substrate 130.

In addition, the cathode probe 370 may include a cathode upper elastic member 374 provided between the upper part of the cathode probe body 371 and the cathode upper contact portion 372 to provide an upward elastic force.

Then, the negative electrode upper contact portion 372 can stably contact the negative electrode plate 350 by the negative electrode upper elastic member 374.

Additionally, the cathode probe 370 may include a cathode lower elastic member 375 that is provided between the lower end of the cathode probe body 371 and the cathode lower contact portion 373 and applies a downward elastic force. Then, the cathode bottom contact portion 373 can stably contact the substrate 130 by the cathode bottom elastic member 375.

The negative electrode upper elastic member 374 and the negative electrode lower elastic member 375 may be springs.

The cathode probe 370 may be configured to electrically connect the substrate 130 and the cathode plate 350. For example, the cathode probe body 371, the cathode upper contact portion 372, and the cathode lower contact portion 373 may be made of an electrically conductive material, such as copper or a gold-plated metal material. Alternatively, the cathode upper contact portion 372 and the cathode lower contact portion 373 are made of an electrically conductive material, such as copper or a gold-plated metal material, and the cathode probe body 371 has the cathode upper contact portion. A wire 376 may be provided to electrically connect 372 and the negative electrode lower contact portion 373.

Meanwhile, the anode plate 340 and the cathode plate 350 may be fixed to the cover 330 with a height difference so as not to contact each other.

For example, a stepped portion 333 and a seating groove 334 having a height difference from each other are formed on the cover 330, and one of the anode plate 340 and the negative electrode plate 350 is positioned at the stepped portion. One may be fixed in a supported state at 333, and the other may be fixed in a state seated in the seating groove 334.

As shown in FIG. 9, the stepped portion 333 is formed on the edge of the cover, and the seating groove 334 may be formed inside the stepped portion 333, and the seating groove 334 has the A fixing block 335 may be provided to secure the anode plate 340 or the cathode plate 350 seated in the seating groove 334.

Additionally, the positive electrode plate 340 or the negative electrode plate 350 seated in the seating groove 334 may have a shape that matches the shape of the seating groove 334.

In addition, the anode plate 340 or the cathode plate 350, which is supported and fixed on the step portion 333, may have a contact prevention hole formed therein.

For example, as shown in the drawing, the cathode plate 350 is fixed while being supported on the step portion 333, and the anode plate 340 is fixed while being seated in the seating groove 334. In this case, a contact prevention hole 353 may be formed in the cathode plate 350 to prevent the anode probe 360 from contacting the cathode plate 350.

Conversely, when the anode plate 340 is fixed while supported on the step portion 333 and the cathode plate 350 is fixed while seated in the seating groove 334, the anode plate 340 ), a contact prevention hole may be formed to prevent the cathode probe 370 from contacting the anode plate 350.

Meanwhile, the electrode module 300 according to an embodiment of the present invention may include a bracket 304 provided on the cover 330 and coupled and fixed to the driving unit 101.

Additionally, the electrode module 300 according to an embodiment of the present invention may be provided with at least three gap sensors 307.

Then, the control unit 110 may control the operation of the driving unit 101 according to detection by the gap sensor 307 so that the bottom of the electrode module 300 is parallel to the upper surface of the substrate 130.

The electrode holder 310 includes a gap sensor hole 318 into which the gap sensor 307 is inserted, an inlet 312 through which the electrolyte supplied from the pump 104 flows, and an inlet 312 through which the electrolyte solution supplied from the pump 104 flows. An outlet 313 through which the electrolyte is discharged and a connection passage 314 connecting the inlet 312 and the outlet 313 may be formed, and the electrode module 300 is located on the bottom of the electrode holder 310. ) and at least two electrode alignment marks 145 may be formed to align the substrate 130.

The electrode 320 may be a PT sheet attached and fixed to the fixing groove 316, and the fixing groove 316 is configured so that the bottom of the attached PT sheet is level with the bottom of the electrode holder 310. can be formed.

Additionally, the inlet 312 may be formed on the side of the electrode holder 310, and the outlet 313 may be formed on the bottom of the electrode holder 310.

FIG. 11 is a diagram schematically showing a state in which power is applied while a substrate and an electrode are immersed in an electrolyte, and FIG. 11 shows an electrode module according to another embodiment.

Referring to FIG. 11, the electrode module 400 according to this embodiment is located on the upper part of the substrate 130 and may include an electrode holder 310 on the bottom of which a plurality of electrodes 320 are provided. Since the configuration of the electrode holder 310 is the same as that in the above embodiment, the detailed description thereof will refer to the detailed description in the above embodiment.

A cathode plate 350 connected to the cathode of the power supply unit 102 may be provided on the upper part of the electrode holder 310, and the substrate 130 and the cathode plate 350 are installed in the electrode holder 310. A cathode probe 370 that is electrically connected may be provided.

Then, the board 130 can be easily connected to the power supply unit 102.

As shown in FIG. 11, when the electrode 320 and the substrate 130 are immersed in the electrolyte 11 and spaced apart by a predetermined distance, the substrate 130 is connected to the cathode probe 370 and the substrate 130. It can be easily connected to the cathode of the power supply unit 102 by the cathode plate 350.

Therefore, according to the electrode module 400 according to an embodiment of the present invention, not only the electrode 320 but also the substrate 130 can be electrically connected to the power supply unit 102.

Since the configuration of the cathode plate 350 and the cathode probe 370 is the same as that in the above embodiment, the detailed description thereof will refer to the detailed description in the above embodiment.

Meanwhile, the electrode holder 310 is provided with a plurality of anode probes 410 connected to each of the plurality of electrodes 320, and the plurality of anode probes 410 can be connected to the anode of the power supply unit 102. there is.

The anode probe 410 is inserted into the anode probe hole 315, the lower end of the anode probe 360 is in contact with the electrode 320, and the upper end of the anode probe 360 is connected to the power supply unit 102. ) can be connected to the positive pole.

For example, the anode probe 410 includes an anode probe body 361, an anode bottom contact portion 363 that is coupled to the bottom of the anode probe body 361 and contacts the electrode 320, and an anode probe body 361. (361) an anode lower elastic member 365 that is provided between the lower end and the anode lower contact part 363 and applies a downward elastic force, and is fixed to the upper part of the anode probe body 361 and is attached to the anode of the power supply unit 102. It may include an anode upper connection part 415 that is connected.

Since the configuration of the anode probe body 361, the anode lower contact portion 363, and the anode lower elastic member 365 are the same as those in the above embodiment, a detailed description thereof is provided in the above embodiment. I use it.

That is, the electrode module 400 according to this embodiment is different in that the configuration of the anode plate 340 is omitted and each of the plurality of electrodes 320 is connected to the anode of the power supply unit 102. .

A plurality of electrodes 320 according to the above embodiment are connected to the anode of the power supply unit 102 through the anode plate 340 and the same current or voltage is applied in bulk from the power supply unit 102. On the other hand, the plurality of electrodes 320 according to this embodiment are different in that each is connected to the anode of the power supply unit 102 and can be individually controlled.

The size of the electrode 320 corresponds to the size of the metal layer to be formed on the substrate 130, and the size of the plurality of electrodes 320 may vary depending on the size of the metal layer to be formed. Therefore, It is necessary to individually control the current or voltage output amount of each of the plurality of electrodes 320.

In addition, even if the size of the plurality of electrodes 320 is the same, the stacking speed of the metal layer by each of the plurality of electrodes 320 may be different, and therefore the current or voltage of each of the plurality of electrodes 320 It is necessary to control the output amount individually.

In addition, it is necessary to turn off the connection of one of the plurality of electrodes 320 with the power supply unit 102, so that each of the plurality of electrodes 320 is connected to the power supply unit 102 on/off. It needs to be individually controlled to make it happen.

To this end, the S-ECAM printing device 100 according to an embodiment of the present invention may include an electrode control unit 380 that individually controls each of the plurality of electrodes 320.

The electrode control unit 330 may be formed as a board in the form of a circuit board and may be provided together with other control boards inside the power supply unit 102.

The electrode control unit 330 may be configured to differently control the current or voltage output amount of each of the plurality of electrodes 320, and the connection between each of the plurality of electrodes 320 and the power supply unit 102 is individually controlled. It may be configured to be controlled on/off.

In addition, the S-ECAM printing device 100 according to an embodiment of the present invention may include a sensor that measures at least one of resistance, current, and voltage of each of the plurality of electrodes 320, and the electrode control unit. 330 may be configured to control the current or voltage output amount of each of the plurality of electrodes 320 according to the value measured by the sensor.

For example, the resistance of each of the plurality of electrodes 320 may vary depending on the degree of metal layer stacking by each of the plurality of electrodes 320. The sensor measures the resistance value, and the electrode control unit 330 ) If controls the amount of current or voltage output of each of the plurality of electrodes 320 according to the measured resistance value, uniform metal layer stacking may be possible.

Figure 12 is a plan view of a substrate according to an embodiment of the present invention.

Referring to FIG. 12, the substrate 133 according to this embodiment may be a semiconductor substrate for forming a bump or a bonding layer for mounting a chip. In this case, the substrate facing the electrode 320 A plurality of conductive layers 135 that are not connected to each other may be formed in the region 134 on (133).

At this time, a plurality of cathode probes 370 may be provided to be connected to each of the plurality of conductive layers 135. This means that in order to form a metal layer in the area 134 on the substrate 133 facing the electrode 320, all of the plurality of conductive layers 135 that are not connected to each other must be electrically connected to the power supply unit 102. Because it has to be.

In this way, when a plurality of conductive layers 135 that are not connected to each other are formed in the area 134 on the substrate 133 facing the electrode 320, the electrode modules 300 and 400 according to an embodiment of the present invention ), each of the plurality of conductive layers 135 can be easily connected to the power supply unit 102.

That is, the electrode modules 300 and 400 according to an embodiment of the present invention can provide a great advantage when forming a metal layer on the substrate 133 on which the plurality of conductive layers 135 that are not connected to each other are formed. .

As discussed above, the present invention relates to a S-ECAM (Selective ElectroChemical Additive Manufacturing) printing device that can be easily connected to a substrate and a power source, and its embodiment can be changed into various forms. Therefore, the present invention is not limited to the embodiments disclosed in this specification, and any form that can be changed by a person skilled in the art to which the present invention pertains will fall within the scope of the present invention.

100: S-ECAM printing device 101: driving unit
102: power supply unit 104: pump
110: control unit 120: bath
130, 133: substrate 135: conductive layer
200: substrate support 300, 400: electrode module
310: electrode holder 320: electrode
330: Cover 340: Anode plate
350: anode plate 360, 410: anode probe
370: cathode probe

Claims (20)

Board;
An electrode holder located on top of the substrate and having a plurality of electrodes on the bottom;
a power supply unit that applies power using the electrode as an anode and the substrate as a cathode; and
A control unit that applies power from the power supply unit while the electrode and the substrate are immersed in the electrolyte solution at a predetermined distance apart and electrodeposits metal ions contained in the electrolyte solution on the area of the substrate facing the electrode. do,
A cathode plate connected to the cathode of the power supply is provided on the upper part of the electrode holder, and the electrode holder is provided with a cathode probe that electrically connects the substrate and the cathode plate. According to claim 1,
A cathode probe hole is formed in the electrode holder,
The cathode probe is inserted and coupled into the cathode probe hole, so that the lower end of the cathode probe extends to the lower part of the electrode holder and contacts the substrate, and the upper end of the cathode probe extends to the upper part of the electrode holder and contacts the cathode plate. S-ECAM printing device characterized in that. According to claim 2,
The cathode probe includes a cathode probe body inserted into the cathode probe hole, a cathode lower contact part coupled to the lower part of the cathode probe body and in contact with the substrate, and a cathode coupled to the upper part of the cathode probe body and in contact with the cathode plate. An upper contact part, a cathode lower elastic member provided between the lower part of the cathode probe body and the lower cathode contact part to provide downward elastic force, and a cathode lower elastic member provided between the upper part of the cathode probe body and the cathode upper contact part to provide elastic force upward. S-ECAM printing device comprising a negative upper elastic member. According to claim 1,
A plurality of conductive layers that are not connected to each other are formed in the area of the substrate facing the electrode, and a plurality of cathode probes are provided to be connected to each of the conductive layers. According to claim 1,
The electrode holder is provided with a plurality of anode probes connected to each of the plurality of electrodes, and the plurality of anode probes are connected to the anode of the power supply unit. According to claim 5,
The electrode holder is provided with an anode probe hole into which the anode probe is inserted, and a fixing groove into which the electrode is fixed at the bottom of the anode probe hole,
The anode probe is inserted and coupled into the anode probe hole, the lower end of the anode probe is in contact with the electrode, and the upper end of the anode probe is connected to the anode of the power supply unit. According to claim 5,
The S-ECAM printing device is characterized in that it includes an electrode control unit that individually controls each of the plurality of electrodes. According to claim 1,
An anode plate connected to the anode of the power supply is provided on the upper part of the electrode holder, and the electrode holder is provided with a plurality of anode probes connecting the plurality of electrodes and the anode plate. . According to claim 8,
A cover on which the cathode plate and the anode plate are fixed is provided on the electrode holder,
S-ECAM printing device, characterized in that the anode plate and the cathode plate are fixed to the cover with a height difference so as not to contact each other. According to clause 9,
A step and a seating groove are formed on the cover, and one of the positive electrode plate and the negative electrode plate is fixed while being supported on the step, and the other is fixed in a state of being seated in the seating groove. S-ECAM printing device. According to claim 8,
The electrode holder is provided with an anode probe hole into which the anode probe is inserted, and a fixing groove into which the electrode is fixed at the bottom of the anode probe hole,
The anode probe is inserted into the anode probe hole, and the lower end contacts the electrode and the upper end contacts the anode plate to electrically connect the electrode and the anode plate. In clause 9
The anode probe includes an anode probe body inserted into the anode probe hole, an anode upper contact part coupled to the upper part of the anode probe body and in contact with the anode plate, and an anode lower part coupled to the lower part of the anode probe body and in contact with the electrode. A contact part, an anode upper elastic member provided between the upper part of the anode probe body and the anode upper contact part to provide elastic force upward, and an anode provided between the lower part of the anode probe body and the lower anode contact part to provide elastic force downward. S-ECAM printing device comprising a bottom elastic member. According to claim 1,
The electrode holder is provided with an inlet through which the electrolyte flows and an outlet through which the electrolyte flowing through the inlet is discharged,
The S-ECAM printing device, characterized in that the inlet is formed on the side of the electrode holder, and the outlet is formed on the bottom of the electrode holder. bass;
a substrate support portion provided in the bath and on which a substrate is placed;
an electrode holder located above the substrate support unit and having a plurality of electrodes on its bottom;
a driving unit that moves the electrode holder;
a power supply unit that applies power using the electrode as an anode and the substrate as a cathode;
A storage unit where electrolyte is stored;
a pump supplying the electrolyte stored in the storage unit to the bath; and
The driver and the pump are controlled so that the electrode and the substrate are immersed in the electrolyte while spaced apart from each other at a predetermined distance, and while the electrode and the substrate are immersed in the electrolyte, power from the power supply is applied to the electrode. A control unit that electrodeposits metal ions contained in the electrolyte solution on a predetermined area of the substrate facing the
A cathode plate connected to the cathode of the power supply is provided on the upper part of the electrode holder, and the electrode holder is provided with a cathode probe that electrically connects the substrate and the cathode plate. According to claim 14,
A conductive layer that is not connected to each other is formed in the area of the substrate facing the electrode, and a plurality of cathode probes are provided to be connected to each of the conductive layers. According to claim 14,
The electrode holder is provided with a plurality of anode probes connected to each of the plurality of electrodes, and the plurality of anode probes are connected to the anode of the power supply unit. According to claim 16,
The S-ECAM printing device is characterized in that it includes an electrode control unit that individually controls each of the plurality of electrodes. According to claim 14,
An S-ECAM printing device, characterized in that an anode plate connected to the anode of the power supply is provided on the upper part of the electrode holder, and an anode probe is provided on the electrode holder to connect the electrode and the anode plate. According to claim 18,
A cover on which the cathode plate and the anode plate are fixed is provided on the electrode holder,
S-ECAM printing device, characterized in that the anode plate and the cathode plate are fixed to the cover with a height difference so as not to contact each other. According to claim 14,
The electrode holder is provided with an inlet through which the electrolyte supplied by the pump flows and an outlet through which the electrolyte supplied through the inlet is discharged,
The S-ECAM printing device, characterized in that the inlet is formed on the side of the electrode holder, and the outlet is formed on the bottom of the electrode holder.

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