WO2015025403A1 - Procédé de travail de production de substrat, procédé de détermination de condition d'imagerie de substrat, et dispositif de travail de production de substrat - Google Patents

Procédé de travail de production de substrat, procédé de détermination de condition d'imagerie de substrat, et dispositif de travail de production de substrat Download PDF

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Publication number
WO2015025403A1
WO2015025403A1 PCT/JP2013/072435 JP2013072435W WO2015025403A1 WO 2015025403 A1 WO2015025403 A1 WO 2015025403A1 JP 2013072435 W JP2013072435 W JP 2013072435W WO 2015025403 A1 WO2015025403 A1 WO 2015025403A1
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WO
WIPO (PCT)
Prior art keywords
image data
substrate
difference
value
trial
Prior art date
Application number
PCT/JP2013/072435
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English (en)
Japanese (ja)
Inventor
雅史 天野
一也 小谷
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to US14/913,081 priority Critical patent/US10192300B2/en
Priority to PCT/JP2013/072435 priority patent/WO2015025403A1/fr
Priority to JP2015532654A priority patent/JP6109317B2/ja
Priority to EP13891989.9A priority patent/EP3037776B1/fr
Priority to CN201380078989.1A priority patent/CN105473979B/zh
Publication of WO2015025403A1 publication Critical patent/WO2015025403A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/70—Denoising; Smoothing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/72—Combination of two or more compensation controls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10016—Video; Image sequence
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Definitions

  • the present invention relates to a working method for producing a board on which a large number of components are mounted, a method for determining an imaging condition when imaging a board during production, and a working apparatus for producing a board. More specifically, the present invention performs image processing on the original image data acquired by imaging the substrate to detect the position of the detection target object such as paste solder, and based on this, predetermined production on the substrate is performed.
  • the present invention relates to a method and apparatus for performing work.
  • the component mounting machine generally includes a substrate transfer device, a component supply device, and a component transfer device.
  • the substrate transfer device carries in and out the substrate and positions the substrate.
  • the component supply apparatus sequentially supplies components of a plurality of component types to a predetermined supply position.
  • the component transfer device includes a substrate camera that images a positioned substrate, a suction nozzle that picks up and picks up a component from the component supply device using negative pressure, and a mounting head that holds the substrate camera and the suction nozzle A head driving unit for driving the motor.
  • TOP Target On Paste
  • a solder position where paste-like solder is actually printed is detected, and mounting is performed after correcting the coordinate value of the mounting point of the component accordingly.
  • the self-alignment effect is obtained in the reflow furnace. That is, the position of the component mounted at the center of the solder position is automatically corrected to the vicinity of the center of the land, which is the original mounting point, with the flow of the remelted solder.
  • Patent Document 1 and Patent Document 2 disclose a technique example in which a printed solder position can be detected by image processing in order to perform TOP mounting.
  • the three-dimensional measuring apparatus of Patent Document 1 irradiates a measurement object with a light pattern including a plurality of wavelength components and having a striped light intensity, and reflected light from the measurement object for each wavelength component.
  • the embodiment discloses a mode in which pass / fail judgment is performed by three-dimensionally measuring cream solder printed on a printed circuit board.
  • the screen printing machine of Patent Document 2 includes a monochrome imaging unit that images the inspection target area on the substrate to which the solder is transferred from above, a first illumination unit that illuminates the inspection target area from above, and an inspection target.
  • a second illuminating means for illuminating the region obliquely from above, a means for obtaining a first image in which lands are projected by the first illuminating means and a second image in which lands and solder are projected by the second illuminating means; Means for subtracting the first image from the two images to obtain an image on which the solder is projected.
  • the three-dimensional measuring apparatus of Patent Document 1 needs to control the distance between the camera and the measurement object variably by means for changing the relative phase relationship, and has a complicated configuration and is very expensive. For this reason, the technique disclosed in Patent Document 1 cannot be used with a fixed distance monochromatic inexpensive board camera equipped in a general component mounter. Supplementally, even with a monochrome camera, fiducial marks prepared for image processing in advance can provide clear and stable image data, so the position can be detected accurately without performing 3D image processing. It was. However, since the cream-like solder is not printed for image processing, it is difficult to obtain clear and stable image data with a monochrome camera, and it is difficult to accurately detect the solder position by image processing.
  • Patent Document 2 uses an inexpensive monochrome camera, it is preferable that the technique can be applied to a general component mounter.
  • the technique of Patent Document 2 uses an inexpensive monochrome camera, it is preferable that the technique can be applied to a general component mounter.
  • the circuit board camera of the component mounter the operator repeatedly changes various imaging conditions including the direction of illumination, and has a hard time searching for image data that can accurately detect the solder position. In the first place, there are no suitable imaging conditions that can provide clear and stable image data while distinguishing creamy solder from others.
  • the substrate is usually subjected to silk printing such as a print indicating a part abbreviation and a barcode for identifying the substrate for later maintenance.
  • silk prints are printed with a color having a high luminance value in contrast to the base color of the substrate, and the luminance value is often similar to that of land and solder. For this reason, with the technique of patent document 2, the possibility of confusing silk printing with land and solder cannot be eliminated. Therefore, in order to perform TOP mounting with a component mounting machine, a technique capable of accurately detecting the solder position using a monochrome camera is required.
  • the detection object for position detection by image processing is not limited to paste solder, and the camera to be used is not limited to a monochrome camera. That is, as the detection target, components mounted other than paste solder, codes such as silk-printed characters and barcodes, and various markers including fiducial marks can be considered. . Further, a color camera may be used to acquire original image data from which image processing is performed.
  • the present invention has been made in view of the problems of the above-described background art, and a substrate production work method for accurately detecting the arrangement position of a detection object on a substrate by image processing while using a simple apparatus configuration, It is an object to be solved to provide a method for determining imaging conditions for a substrate at that time, and a substrate production work apparatus that accurately detects an arrangement position of a detection target on the substrate.
  • An invention of a substrate production work method according to claim 1 for solving the above-mentioned problems is provided in a position detection step of detecting an arrangement position of a detection object provided on the substrate, and on the substrate based on the detected arrangement position.
  • a board production work method comprising: a work execution process for carrying out a predetermined production work, wherein the position detection step images the board under a plurality of imaging conditions and is arranged on two-dimensional coordinates.
  • An image acquisition step for acquiring a plurality of original image data including a luminance value of a pixel and two of the plurality of original image data as calculation targets, calculating a difference between luminance values of pixels having the same coordinate value, A difference calculating step of acquiring difference image data composed of luminance difference values of pixels; and a position determining step of determining the arrangement position based on the difference image data.
  • the difference between the luminance values of a plurality of original image data acquired by imaging the substrate under a plurality of imaging conditions is calculated to obtain difference image data.
  • the luminance value of each pixel when the imaging condition is changed does not change uniformly.
  • the luminance difference value (difference in luminance value) changes depending on the object in the field of view of each pixel. For example, there is a first case where the luminance difference value is large at the position where the detection target is disposed and the luminance difference value is small at other positions other than the disposed position. Conversely, there is a second case where the luminance difference value is small at the arrangement position and the luminance difference value is large at other positions.
  • the luminance difference value is approximately the same at the arrangement position and at other positions. Therefore, by setting a plurality of suitable imaging conditions in which the first case or the second case occurs remarkably, the detection target object on the substrate is determined based on the difference in brightness difference value of the difference image data. The placement position can be determined.
  • a plurality of specific imaging conditions can be appropriately determined with reference to imaging conditions that have already been produced and are suitable for the preceding substrate with similar substrate base color and material of the detection target. It can also be determined by the substrate imaging condition determination method disclosed in claim 11. As a result, even if another object having a brightness value comparable to that of the detection target exists at another position, and the detection target and another object cannot be distinguished from each other in the original image data, the difference Based on the image data, the arrangement position of the detection object on the substrate can be accurately detected. This is because the first case or the second case described above occurs remarkably on the difference image data, and the luminance difference value at the position where the detection target is disposed and the luminance difference value at another position of another object are large. Because it is different.
  • the arrangement position of the detection target can be detected. Therefore, it is suitable for use in TOP mounting with a component mounter, and it is not necessary to greatly change the device configuration of the component mounter.
  • An invention of a substrate imaging condition determining method includes: an imaging condition determining step for determining in advance a plurality of imaging conditions for imaging a detection object provided on the substrate; and the substrate for the plurality of imaging conditions.
  • An imaging condition determination method for a substrate in the imaging condition determination step wherein a sample substrate on which the detection object is provided and the arrangement position is known is imaged under various imaging conditions,
  • Trial image acquisition step of acquiring various trial image data including the luminance value of each pixel arranged on the dimensional coordinates, and a number of combinations of the two of the various trial image data as calculation targets,
  • a trial difference calculation step of calculating a difference of luminance values of pixels having the same coordinate value or an absolute value of the difference to obtain a large number of trial difference image data composed of the luminance difference values of the pixels;
  • trial difference image data is obtained by calculation for each of a number of combinations obtained by combining two of the various trial image data obtained by imaging the sample board under various imaging conditions. And determining a plurality of imaging conditions from trial difference image data determined to be appropriate. Therefore, instead of relying solely on experience and intuition, the image processing is tried for all combinations that cover the possible imaging conditions and an appropriate combination is selected, so that a plurality of suitable imaging conditions can be determined reliably.
  • FIG. 9 is a diagram exemplifying difference image data including luminance difference values of pixels obtained by subtracting the second original image data of FIG. 8 from the first original image data of FIG. 7.
  • 3rd Embodiment it is the figure which illustrated a part about six of the various trial image data acquired by the trial image acquisition step.
  • 3rd Embodiment it is the figure which illustrated trial difference image data acquired at the trial difference calculation step.
  • a substrate production work method according to the first embodiment of the present invention will be described with reference to FIGS.
  • the component mounter 1 is configured by assembling a substrate transport device 2, a component supply device 3, a component transfer device 4, and a component camera 5 to a machine base 9.
  • the devices 2 to 5 are controlled by a control computer (not shown), and each performs a predetermined production operation.
  • the substrate transport device 2 carries the substrate K into the mounting position, positions it, and carries it out.
  • the substrate transfer device 2 includes first and second guide rails 21 and 22, a pair of conveyor belts, a clamp device, and the like.
  • the first and second guide rails 21 and 22 extend in the transport direction (X-axis direction) across the upper center of the machine base 9 and are assembled to the machine base 9 so as to be parallel to each other.
  • the conveyor belt rotates in a state where the substrate K is placed on the conveyor conveyance surface, and carries the substrate K to and from the mounting position set at the center of the machine base 9.
  • a clamping device (not shown) is provided below the conveyor belt at the mounting position.
  • the clamp device pushes up the substrate K, clamps it in a horizontal posture, and positions it at the mounting position.
  • the component transfer device 4 can perform the component mounting operation at the mounting position.
  • the component supply device 3 supplies components of a plurality of component types.
  • the component supply device 3 is a feeder-type device, and is provided at the front portion in the longitudinal direction of the component mounter 1 (the left front side in FIG. 1).
  • the component supply device 3 includes a number of cassette-type feeders 31 that can be attached and detached.
  • the cassette type feeder 31 includes a main body 32, a supply reel 33 provided at the rear part of the main body 32, and a component take-out part 34 provided at the tip of the main body 32.
  • An elongated tape (not shown) in which a large number of parts are stored at a predetermined pitch is wound and held on the supply reel 33. The tape is pulled out at a predetermined pitch by a sprocket (not shown), and the stored state is released.
  • the components are sequentially fed into the component take-out unit 34.
  • the component transfer device 4 picks up and picks up a component from the component take-out unit 34 of the component supply device 3 and conveys and mounts it to the positioned substrate K.
  • the component transfer device 4 is an XY robot type device that can move horizontally in the X-axis direction and the Y-axis direction.
  • the component transfer device 4 includes a pair of Y-axis rails 41 and 42, a Y-axis slider 43, an X-axis slider 46, a mounting head 44, a suction nozzle 45, a substrate camera 6, and the like.
  • the pair of Y-axis rails 41 and 42 are arranged from the rear part in the longitudinal direction of the machine base 9 (the right back side in FIG. 1) to the upper part of the front part supply device 3.
  • a Y-axis slider 43 is mounted on the Y-axis rails 41 and 42 so as to be movable in the Y-axis direction.
  • An X-axis slider 46 is mounted on the Y-axis slider 43 so as to be movable in the X-axis direction.
  • a mounting head 44 is fixed on the front side of the X-axis slider 46.
  • the mounting head 44 holds the suction nozzle 45 on the lower side thereof in a replaceable manner.
  • the mounting head 44 is driven in two horizontal directions (XY directions) by two servo motors.
  • the head drive unit is configured by the two servo motors, the Y-axis rails 41 and 42, the Y-axis slider 43, the X-axis slider 46, and the like.
  • a substrate camera 6 for imaging the substrate K is provided on the bottom surface of the X-axis slider 46 (details will be described later).
  • the component camera 5 is provided upward on the upper surface of the machine base 9 between the substrate transfer device 2 and the component supply device 3.
  • the component camera 5 captures and detects the state of the component picked and collected while each head 45 to 47 moves from the component supply device 3 onto the substrate K.
  • the component camera 5 detects an error in the suction position of the component, a shift in the rotation angle, or the like, the component mounting operation is finely adjusted as necessary, and components that are difficult to mount are discarded.
  • FIG. 2 to 5 are side views showing the substrate camera 6 together with the substrate K.
  • FIG. The position of the substrate camera 6 is controlled above the positioned substrate K.
  • the board camera 6 picks up an image of the board K on which the paste-like solder P, which is a detection object, is printed, from above.
  • the substrate camera 6 includes an imaging unit 61 that shares a central axis extending in the vertical direction, an epi-illumination light source 62, an inclination light source 63, and the like.
  • the imaging unit 61 has a large number of monochrome imaging elements (pixels) arranged two-dimensionally, performs an imaging operation, and obtains original image data including the brightness values of each pixel.
  • the luminance value can be expressed by, for example, a digital value of 0 to 255 digits (gradation) represented by 8 bits.
  • the number of bits used may be increased to make the number of digits (the number of gradations) fine.
  • the present invention is not limited to a monochrome image sensor, and a color camera having three primary color image sensors (pixels) may be used.
  • the imaging unit 61 is configured so that the exposure time condition (shutter speed) at the time of imaging is variably controlled step by step.
  • the epi-illumination light source 62 irradiates illumination light along the central axis substantially downward.
  • the tilting light source 63 is annularly arranged around the epi-illumination light source 62, and irradiates illumination light in a direction approaching the central axis line substantially obliquely below.
  • the incident light source 62 and the inclined light source 63 are controlled to switch between red light and blue light as light source color conditions at the time of imaging.
  • the incident light source 62 and the tilting light source 63 are individually controlled to be turned on / off so that the irradiation direction condition during imaging can be changed.
  • the component mounter 1 includes a control computer (not shown).
  • the control computer holds design information such as the correspondence between the type of board to be produced and the part type of the component to be mounted and the coordinate value of the mounting point on the substrate K on which the component is mounted.
  • the control computer controls the component mounting operation based on image data captured by the board camera 6 and the component camera 5 and detection information of a sensor (not shown).
  • the control computer controls the imaging conditions of the substrate camera 6. Specifically, when the control computer controls the exposure time condition of the imaging unit 61 stepwise, the contrast of the original image data obtained according to the length of the exposure time changes. Further, the control computer switches and controls the light source colors of the incident light source 62 and the inclined light source 63, and individually controls the incident light source 62 and the inclined light source 63 to be turned on / off.
  • the control computer receives a plurality of original image data acquired by the substrate camera 6 performing an imaging operation under a plurality of imaging conditions.
  • the control computer controls execution of the substrate production work method of the first embodiment in order to perform TOP (Target On Paste) mounting.
  • FIG. 2 illustrates a state where both the epi-illumination light source 62 and the tilting light source 63 are on-controlled by red light (solid arrow in the figure).
  • FIG. 3 illustrates a state where both the epi-illumination light source 62 and the tilting light source 63 are on-controlled to blue light (broken arrows in the figure).
  • FIG. 4 illustrates a state in which the epi-illumination light source 62 is on-controlled to red light (solid arrow in the drawing) and the tilting light source 63 is off-controlled.
  • FIG. 5 exemplarily shows a state in which the incident light source 62 is turned off and the inclined light source 63 is turned on by red light (solid arrow in the figure). 4 and 5 can be switched to blue light.
  • the light source color conditions at the time of imaging are two conditions of red light and blue light.
  • the irradiation direction conditions at the time of imaging are three conditions: only the incident light source 62 is turned on, only the incident light source 63 is turned on, and the incident light source 62 and the incident light source 63 are turned on.
  • the light source for illumination of the substrate camera 6 is not limited to the above.
  • one or more of red light, blue light, and yellow light of the light source may be on-controlled, or each of the three divided light sources may be individually controlled on / off.
  • the exposure time condition of the imaging unit 61 is controlled in stages, and various imaging conditions are set.
  • the board production work method of the first embodiment includes an imaging condition setting step S10, a solder position detection step S2, and a component mounting execution step S3.
  • the solder position detection step S2 the paste-like solder P printed on the substrate K is used as a detection target, and the solder position where the paste-like solder P is present is set as an arrangement position to be detected.
  • Solder position detection process S2 has 1st image acquisition step S21, 2nd image acquisition step S22, difference calculation step S23, and position determination step S24 in order of implementation.
  • the operator sets the first imaging condition and the second imaging condition when imaging the substrate K with the substrate camera 6 in the control computer.
  • the first and second imaging conditions are set in order to discriminate between the solder position where the paste-like solder P is printed and other positions other than that. Therefore, when the first original image data and the second original image data acquired under the respective imaging conditions are compared, it is preferable that the imaging conditions have greatly different luminance variations between the solder position and the other position. In other words, it is preferable that the luminance change amount at the solder position is large and the luminance change amount at the other position is small, or conversely, the luminance change amount at the solder position is small and the luminance change amount at the other position is large. .
  • the operator instructs the control computer to perform the solder position detection step S2 and the component mounting execution step S3. Thereafter, the control computer automatically performs the steps S2 (S21 to S24) and S3.
  • the control computer controls the board camera 6 to the first imaging condition to perform the imaging operation, and acquires the first original image data Bd1.
  • the control computer controls the substrate camera 6 to the second imaging condition to perform the imaging operation, and acquires the second original image data Bd2.
  • the control computer calculates the difference between the luminance values of the pixels having the same coordinate value by using the first original image data Bd1 and the second original image data Bd2 as the calculation target.
  • Difference image data Dd consisting of difference values is acquired.
  • the original image data having a relatively low luminance value (dark) is subtracted from the original image data having a relatively high luminance value (bright) to set the luminance difference value to a positive value.
  • the luminance difference value becomes negative in some pixels, the luminance difference value of the pixel is regarded as zero. The reason why the luminance difference value is not set to a negative value is to prevent an error from occurring when displaying the difference image data Dd, and to eliminate the need for dividing the calculation process.
  • the control computer determines the solder position where the paste solder P is present based on the difference image data Dd.
  • the solder position can be easily determined. Specifically, based on the change amount or rate of change of the luminance difference value of each pixel according to the change of the coordinate value on the difference image data Dd, or the luminance difference value of each pixel of the difference image data Dd The solder position can be determined based on the magnitude relationship with the predetermined threshold.
  • the luminance difference value 100 at the solder position is the luminance difference value 40 at another position
  • the luminance difference value of each pixel is reduced from 100 to 40 in accordance with the change in the coordinate value, and is based on the change amount or the change rate.
  • the boundary line of the solder position can be determined.
  • the luminance difference value 70 can be set as a predetermined threshold value, and an area composed of pixels having a luminance difference value of 70 or more can be determined as the solder position.
  • the determination of the solder position in the solder position detecting step S2 is preferably performed at several locations on the substrate K.
  • control computer corrects the coordinate value of the component mounting point at the beginning of the component mounting execution step S3. This correction is performed when the actual solder position detected in the solder position detecting step S2 is shifted with respect to the design information of the coordinate values of the mounting points held in advance by the control computer.
  • the control computer compensates for the deviation amount of the actual solder position so that the component can be mounted at the center of the solder position.
  • the amount of deviation of the solder position is approximately the same at several places on the substrate K where the solder position detection step S2 is performed. Therefore, the coordinate values of the mounting points of all the parts can be corrected uniformly.
  • the printing deviation of the paste solder P is accompanied by rotational movement
  • the amount of deviation of the solder position differs at several places on the substrate K where the solder position detection step S2 is performed. In this case, the rotation center and the rotation angle of the printing deviation are obtained by calculation, and different corrections are performed for each component.
  • the coordinate value of the mounting point is interpolated and corrected for each part based on the measured deviation amounts at several locations.
  • the control computer performs TOP mounting, in other words, the component is mounted approximately at the center of the paste solder P based on the coordinate value of the corrected mounting point.
  • FIG. 7 is a diagram illustrating the first original image data Bd1 when the board K1 on which the paste solder P1 is printed on the land L1 is imaged under the first imaging condition.
  • FIG. 8 is a diagram illustrating second original image data Bd2 when the same substrate K1 as in FIG. 7 is imaged under the second imaging condition.
  • FIG. 9 is a diagram exemplifying difference image data Dd that is obtained by subtracting the second original image data Bd2 of FIG. 8 from the first original image data Bd1 of FIG.
  • the substrate K1 has a dark gray base color and a circuit pattern. A part of the circuit pattern is a land L1, and paste solder P1 is printed on the land L1.
  • the first imaging condition for imaging the substrate K1 is an exposure time condition of 40 ms for the substrate camera 6.
  • the light source color condition and the irradiation direction condition are such that the incident light source 62 is off-controlled and the tilt light source 63 is on-controlled to blue light. ing.
  • the land L1 with a sign slightly on the right side of the upper part of the image is actually substantially square. Further, the paste-like solder P1 printed at substantially the center of the land L1 is actually substantially circular.
  • both the land L1 and the paste solder P1 have a brightness value higher than that of the substrate K and appear bright.
  • the luminance value is uneven, and the luminance value becomes high in part and approaches the luminance value of the paste solder P1. For this reason, in the first original image data Bd1, the land L1 and the paste solder P1 cannot be accurately determined.
  • the second imaging condition is an exposure time condition of 35 ms of the substrate camera 6, and the incident light source 62 is turned on by the incident light source 62 and the inclined light source 63 is turned off by the light source color condition and the irradiation direction condition.
  • both the land L1 and the paste solder P1 at the same position as the first original image data Bd1 have lower luminance values than the substrate K substrate and appear dark. Yes.
  • the luminance value of the land L1 is slightly uneven, and a part of the luminance value of the land L1 is close to the luminance value of the paste solder P1. For this reason, even the second original image data Bd2 cannot accurately discriminate between the land L1 and the paste solder P1.
  • the difference image data Dd in FIG. 9 has a different aspect. That is, the land L1 at the same position as the first and second original image data Bd1 and Bd2 has a lower luminance difference value than the base of the substrate K and appears darker, and the unevenness of the luminance difference value is slight.
  • the luminance difference value of the paste solder P1 at the approximate center of the land L1 is clearly higher than the luminance difference value of the surrounding land L1. Therefore, based on the difference image data Dd, the solder position of the paste-like solder P1 printed on the land L1 can be accurately detected.
  • FIG. 10 is a plan view schematically showing a state in which components are mounted on the paste solder P2 of the substrate K2 in the component mounting step S3 of the first embodiment.
  • FIG. 11 is a plan view schematically showing a state in which the paste solder P2 on the substrate is remelted in a reflow furnace after the component mounting execution step S3 of FIG.
  • FIG. 12 is a plan view schematically showing a state in which components are mounted on the substrate K2 in the conventional technique in which TOP mounting is not performed. 10 to 12, the paste-like solder P2 and the remelted solder are shown in black for convenience.
  • the substrate K2 is rectangular, and fiducial marks F are provided in the vicinity of each corner.
  • a total of 12 lands L2 are formed in part of the circuit pattern of the substrate K2.
  • Paste solder P2 is printed on each land L2, and a total of twelve leads Lead on both sides of the six parts B are respectively mounted.
  • the control computer holds the coordinate value of the mounting point set at the center of the 12 lands L2 as design information.
  • the printing of the paste solder P2 is shifted from the land L2.
  • the solder position of the paste solder P2 is shifted to the right in the drawing with respect to the 12 lands L2.
  • the deviation amount of the solder position with respect to the land L2 can be obtained. Furthermore, the coordinate value of the mounting point can be corrected by the deviation amount. Therefore, by performing TOP mounting, as shown in FIG. 10, the lead Lead of the component B can be mounted not at the center of the land L2 but at the center of the solder position. Thereby, the self-alignment effect is obtained in the reflow furnace. That is, as shown in FIG. 11, the component B mounted at the center of the solder position is automatically positioned near the center of the land L2 as the remelted solder flows toward the center of the land L2. It is corrected.
  • the lead Lead of the part B is mounted at the center of the land L2 based on the coordinate value of the mounting point as design information.
  • the actual mounting point is close to the end shifted from the center of the solder position even in the center of the land L2. Then, when the solder remelted in the reflow furnace flows to the center of the land L2, there is a problem that the part B is pushed out from the center of the land L2 or falls down. In the first embodiment, this problem does not occur.
  • more than two original image data may be acquired and a plurality of difference image data may be calculated.
  • the plurality of difference image data is, for example, specific first difference image data as regular use, second or later difference image data as spare, and only when the solder position cannot be detected from the first difference image data.
  • Difference image data can be used.
  • a plurality of difference image data may be used regularly, and the detection position may be compared and collated to improve detection reliability.
  • the substrate production work method is a position detection step (solder position detection step) for detecting an arrangement position (solder position) of detection objects (paste-like solders P1 and P2) provided on the substrates K1 and K2. S2) and a work execution step (component mounting step S3) for performing a predetermined production operation (part B mounting operation) on the substrates K1 and K2 based on the detected arrangement positions.
  • the position detection step images of the substrates K1 and K2 are captured under a plurality of imaging conditions, and a plurality of original image data Bd1 and Bd2 including luminance values of the respective pixels arranged on the two-dimensional coordinates are acquired.
  • Difference image data Dd consisting of the luminance difference value of each pixel by calculating the difference between the luminance values of the pixels having the same coordinate value, with the acquisition steps S21 and S22 and the plurality of original image data Bd1 and Bd2 as the calculation target Diff to get It has a calculated step S23, the position determining step S24 for determining the arrangement position based on the difference image data Dd, the.
  • the difference between the luminance values of the plurality of original image data Bd1 and Bd2 acquired by imaging the substrates K1 and K2 under a plurality of imaging conditions is calculated and set as difference image data Dd.
  • the luminance value of each pixel when the imaging condition is changed does not change uniformly.
  • the luminance difference difference in luminance value
  • the amount of change in luminance differs greatly between the arrangement position (solder position) and the other position 2.
  • a set of two imaging conditions can be set.
  • the plurality of imaging conditions in the image acquisition steps S21 and S22 are the exposure time condition of the camera (imaging unit 61) that images the substrate, and the light source that irradiates the substrate with illumination light during the imaging (the incident light source 62). And at least one condition among the light source color condition of the inclined light source 63) and the illumination light irradiation direction condition.
  • the position detection step uses the solder paste P printed on the boards K1 and K2 as a detection target, and the solder position detection step in which the solder position where the paste solder P exists is located.
  • the work execution step is a component mounting execution step S3 in which components are mounted on the paste solder P of the boards K1 and K2 based on the detected solder positions.
  • the solder position can be detected even if a simple and inexpensive monochrome board camera 6 is used. Therefore, it is suitable for an application in which TOP mounting is performed by the component mounter 1, and the device configuration of the component mounter 1 does not need to be greatly modified conventionally.
  • the substrate production work method of the second embodiment will be described mainly with respect to differences from the first embodiment with reference to the work process diagram of FIG.
  • the component mounter 1 to be used is the same as that of the first embodiment.
  • steps S25 to S29 are added in the solder position detection step S2A as compared with the first embodiment.
  • the operator sets the first imaging condition and the second imaging condition set when imaging the substrate K with the substrate camera 6 in the control computer.
  • the control computer automatically executes the steps S2A (S21 to S29) and S3 thereafter.
  • the control computer controls the board camera 6 to the first and second imaging conditions to perform the imaging operation, and the first and second originals are performed. Image data Bd1 and Bd2 are acquired.
  • the control computer smoothes and corrects the first and second original image data Bd1 and Bd2.
  • the luminance value of each pixel can be corrected so as to change smoothly according to the change of the coordinate values on the first and second original image data Bd1 and Bd2.
  • a moving average filter process and a Gaussian filter process on two-dimensional coordinates can be exemplified, and the present invention is not limited to these.
  • the moving average filter process an averaged area is set around the calculation target pixel, the average value of the luminance values of the pixels in the averaged area is obtained as the corrected luminance value of the calculation target pixel, and this process is performed for all pixels. It carries out against.
  • a weighted average value according to a Gaussian distribution normal distribution
  • the control computer calculates the difference between the luminance values of the pixels having the same coordinate value, using the first original image data Bd1 and the second original image data Bd2 after the smoothing correction processing as calculation targets.
  • the difference image data Dd including the luminance difference value of each pixel is acquired.
  • the difference calculation step S23 includes an absolute value calculation step S27 in which the sign is inverted to a positive value when the luminance difference value of each pixel becomes a negative value. The reason why the sign of the negative value of the luminance difference value is inverted is to prevent an error from occurring when displaying the difference image data Dd and to eliminate the need for calculation processing. Since the first and second original image data Bd1 and Bd2 are smoothed and corrected in advance, the luminance difference value of the difference image data Dd also changes smoothly according to the change of the coordinate value.
  • step S28 the control computer determines whether or not it is necessary to invert the difference image data Dd. That is, only when the luminance difference value of the pixel included in the arrangement position (solder position) of the difference image data Dd is smaller than the luminance difference value of the pixel included in a position other than the arrangement position, the inversion calculation step S29 is performed. move on.
  • the control computer inverts the magnitude relationship between the luminance difference values of the respective pixels arranged on the two-dimensional coordinates of the difference image data Dd. For example, the luminance difference values 0, 1, 2,... 126, 127 and the luminance difference values 255, 254, 253,. As a result, the density of the difference image data Dd is inverted, and black and white are switched.
  • the reversal calculation step S29 is not performed in the first case where the luminance difference value is large at the solder position and the luminance difference value is large at the other position, and the second difference is small at the solder position and large at the other position.
  • the luminance difference values at the solder positions are unified so as to be larger than those at other positions. Thereby, when the differential image data Dd is displayed, the solder position always appears brighter (whiter) than the other positions, and the visibility of the operator is simplified. Further, in both the first and second cases, the subsequent arithmetic processing can be made common and simplified.
  • the process proceeds to the position determination step S24, and even if it is determined in step S28 that the reversal is unnecessary, the process proceeds to the position determination step S24.
  • the control computer determines the solder position where the paste solder P exists based on the difference image data Dd. At this time, the luminance difference value is greatly different between the solder position on the difference image data Dd and the other position, and the luminance difference value of the difference image data Dd changes smoothly according to the change of the coordinate value. The solder position can be determined.
  • the control computer corrects the coordinate value of the component mounting point at the beginning of the component mounting execution step S3, and then performs TOP mounting.
  • the difference calculation step S23 includes an absolute value calculation step S27 that inverts the sign to a positive value when the luminance difference value of each pixel becomes a negative value
  • the determination step S24 based on the change amount or change rate at which the luminance difference value of each pixel changes according to the change of the coordinate value on the difference image data Dd, or the luminance difference value of each pixel of the difference image data Dd Based on the magnitude relationship with the predetermined threshold, the arrangement position (solder position) and a position other than the arrangement position are determined.
  • the arrangement position (Solder position) can be detected.
  • the smoothing steps S25 and S26 for performing the smoothing correction processing on the original image data Bd1 and Bd2 so that the luminance value of each pixel changes smoothly according to the change of the coordinate value is performed as the image acquisition step S21. , Next to S22.
  • the arrangement position (solder position) can be detected more reliably on the difference image data Dd.
  • the two-dimensional coordinates only when the luminance difference value of the pixel included in the arrangement position of the difference image data Dd is smaller than the luminance difference value of the pixel included in a position other than the arrangement position.
  • an inversion calculation step S29 for inverting the magnitude relationship of the luminance difference values of the pixels arranged above is provided.
  • the brightness difference value at the solder position is made larger than that at the other position regardless of the original magnitude relationship, so that it becomes brighter. It can be displayed (white). Therefore, the visibility of the difference image data by the operator is simplified.
  • the subsequent arithmetic processing can be made common and simplified regardless of the original magnitude relationship.
  • the component mounter 1 to be used is the same as that of the first and second embodiments.
  • the board production work method of the third embodiment includes an imaging condition determination step S1, a solder position detection step S2B, and a component mounting execution step S3B.
  • the solder position detection step S2B and the component mounting step S3B of the third embodiment are the same as those of the second embodiment, but the present invention is not limited to this and may be a method different from the second embodiment.
  • the third embodiment also serves as an embodiment of the substrate imaging condition determination method of the present invention.
  • the imaging condition determination step S1 of the third embodiment is a step in which a plurality of imaging conditions in the image acquisition steps S21 and S22 of the solder position detection step S2B are determined in advance.
  • the imaging condition determination step S1 includes a trial image acquisition step S11, a trial difference calculation step S12, and a trial determination step S13.
  • the control computer captures various sample image data including the luminance value of each pixel arranged on the two-dimensional coordinates by imaging the sample board under various imaging conditions.
  • the sample substrate is a substrate on which a detection target is provided and the arrangement position is known
  • a substrate on which paste solder is printed and the solder position is known corresponds.
  • the solder image can be made known by displaying trial image data to the operator and having the user specify the solder position using a user interface such as a mouse (position pointer).
  • a solder position may be detected using a high-accuracy camera different from the substrate camera 6 and the detection data may be transferred.
  • FIG. 15 is a diagram illustrating a part of six (trial image data Sd1 to Sd6) of various trial image data acquired in the trial image acquisition step S11 in the third embodiment.
  • the six pieces of trial image data Sd1 to Sd6 shown in the figure have different luminance values for each pixel depending on the imaging conditions. Note that the smoothing correction processing described in the second embodiment may be performed on each of the trial image data Sd1 to Sd6.
  • trial difference calculation step S12 the control computer sets a large number of combinations of two pieces of various trial image data as calculation targets, and the difference between the luminance values of pixels having the same coordinate value in each combination or the absolute value of the difference.
  • the value is calculated to obtain a large number of trial difference image data composed of the luminance difference values of each pixel. For example, when there are 30 pieces of trial image data, there are 435 combinations of these two, which is the maximum number of trial difference image data.
  • FIG. 16 is a diagram illustrating the trial difference image data SDd acquired in the trial difference calculation step S12 in the third embodiment.
  • the trial difference image data SDd in FIG. 16 is obtained by computing the absolute value of the difference between the luminance values of the pixels having the same coordinate value, with the trial image data Sd1 on the upper right in FIG. 15 and the trial image data Sd2 in the upper middle in FIG. It has been demanded.
  • trial determination step S13 the control computer determines the suitability of each of the large number of trial difference image data based on the known arrangement positions, and the two of the trial difference image data determined as appropriate are based on the two.
  • a set of imaging conditions of the trial image data is determined as a plurality of imaging conditions in the image acquisition step. That is, the control computer determines whether or not the solder position can be accurately detected for each of a maximum of 435 trial difference image data. For example, it is determined whether or not the two solder positions SH can be accurately detected by using the trial difference image data SDd illustrated in FIG.
  • FIG. 17 is a process flow diagram illustrating the execution contents of the trial determination step S13 for one trial difference image data in the third embodiment.
  • step S51 of the processing flow in FIG. 17 the control computer acquires information on the above-described known solder positions.
  • step S52 the control computer determines whether the solder position can be properly detected based on the trial difference image data. More specifically, the control computer performs a calculation process corresponding to the position determination step S24 described in the first embodiment on the trial difference image data to determine the solder position, and whether or not this substantially matches the known solder position. To determine. When they do not match or when the solder position cannot be determined, the control computer determines that the trial difference image data is inappropriate and ends the processing flow.
  • step S52 the process proceeds to step S53, and the control computer sets the solder position H, the neutral position N, and the other position T used for the subsequent arithmetic processing.
  • the neutral position N is for reducing the influence of measurement errors and variations in luminance values in the vicinity of the boundary between the solder position H and the other position T.
  • the control computer sets a neutral position N of a predetermined width on both sides of the boundary line of the known solder position or the detected solder position.
  • the control computer does not use the luminance difference value of the pixel in the neutral position N in the subsequent steps S54 to S56, in other words, does not use it for the determination of suitability.
  • FIG. 18 is a diagram illustrating the solder position H, the neutral position N, and the other position T on the trial difference image data used in the trial determination step S13 of the third embodiment.
  • a solid line hatching is applied to the solder position H and a broken line hatching is applied to the other position T.
  • the circular diameter D1 of the solder position SH is used as a reference.
  • An annular region having the circle C1 as the inner boundary and the circle C2 as the outer boundary is defined as a neutral position N.
  • the setting method of the solder position H, the neutral position N, and the other position T used for the determination of suitability is not limited to the above.
  • the neutral position N with a predetermined width can be set on both sides of the boundary line.
  • the inner boundary and the outer boundary of the other position T may be similar to the outer boundary of the solder position H.
  • the area ratio between the solder position H and the other position T that is, the ratio of the number of pixels can be variably set.
  • the other position T is not excessively widened in order to reduce the influence of other lands.
  • step S54 the control computer represents the deviation between the average value of the luminance difference values of the plurality of pixels included in the solder position H and the average value of the luminance difference values of the plurality of pixels included in the other position T. It is determined whether or not a first condition in which the average luminance difference to be performed is equal to or greater than a predetermined luminance difference is satisfied. Subsequently, in step S55, the control computer determines whether or not a second condition in which the variance value of the distribution in which the luminance difference values of the plurality of pixels included in the solder position H vary is equal to or smaller than a predetermined variance value is satisfied. Further, in step S56, the control computer determines whether or not a third condition in which the distribution value of the distribution in which the luminance difference values of the plurality of pixels included in the other position T vary is equal to or smaller than the predetermined dispersion value is satisfied.
  • the first to third conditions are necessary conditions for accurately detecting the solder position. That is, if any one of the first to third conditions is not satisfied, the control computer determines that the trial difference image data is inappropriate and ends the processing flow. If all of the first to third conditions are satisfied, the control computer determines that the trial difference image data is appropriate and proceeds to step S57.
  • step S57 the control computer adopts a set of imaging conditions of two trial image data based on trial difference image data determined to be appropriate.
  • the control computer performs the processing flow of FIG. 17 on all the trial difference image data, and then returns to the solder position detection step S2B of FIG.
  • the imaging condition to be employed is not limited to one set, and there may be a plurality of sets, or even one set may not be employed.
  • the predetermined luminance difference of the first condition and the predetermined dispersion values of the second and third conditions are corrected as appropriate, and the processing flow of FIG. 17 is performed again.
  • solder position detection step S2B and component mounting step S3B in FIG. 14 are the same as those in the first and second embodiments, description thereof will be omitted.
  • the substrate production work method of the third embodiment includes an imaging condition determination step S1 for predetermining a plurality of imaging conditions in the image acquisition steps S21 and S22 before the position detection step S2B.
  • the imaging condition determination step S1 images a sample substrate on which a detection target is provided (a paste-like solder is printed) and an arrangement position (solder position) is known under various imaging conditions.
  • the trial image acquisition step S11 for acquiring various trial image data Sd1 to Sd6 including the luminance values of the respective pixels arranged on the two-dimensional coordinates and a combination of two of the various trial image data Sd1 to Sd6 are combined. And the difference between the luminance values of the pixels having the same coordinate value or the absolute value of the difference in each combination to obtain a large number of trial difference image data SDd composed of the luminance difference values of each pixel.
  • the imaging condition determination step S1 not only relying on experience and intuition but also trying a large number of image processing using a sample substrate to determine a plurality of appropriate imaging conditions. Therefore, in the position detection step S2B, the arrangement position (solder position SH) of the detection target object on the substrate can be reliably detected based on the difference image data.
  • an average value of luminance difference values of a plurality of pixels included in a known arrangement position (solder position H);
  • a first condition in which an average luminance difference expressed by a deviation from an average value of luminance difference values of a plurality of pixels included in a position T other than the known arrangement position is equal to or greater than a predetermined luminance difference; and a known arrangement
  • the second condition in which the variance value of the distribution in which the luminance difference values of the plurality of pixels included in the position (solder position H) vary is equal to or smaller than the predetermined distribution value, and the luminance difference value of the plurality of pixels included in the other position T varies.
  • the suitability is determined based on at least one of the third conditions in which the variance value of the distribution is equal to or less than the predetermined variance value.
  • a neutral position N where the luminance difference value of the pixel is not used for determination of suitability is set between the arrangement position (solder position H) and the other position T.
  • the third embodiment also serves as an embodiment of the substrate imaging condition determination method of the present invention, in which a plurality of imaging conditions for imaging a detection target (printed solder paste) provided on the substrate are preliminarily set.
  • Sd1 to Sd6 The trial image acquisition step S11 to be acquired and a large number of combinations of two types of trial image data Sd1 to Sd6 are set as calculation targets, and the difference between the luminance values of pixels having the same coordinate value in each combination or the absolute value of the difference is obtained.
  • a trial difference calculation step S12 for calculating and obtaining a large number of trial difference image data SDd composed of luminance difference values of each pixel, and a plurality of trial difference image data SDd based on a known arrangement position (solder position SH).
  • a trial determination step S13 that determines the suitability of each, and determines the imaging conditions of the two trial image data based on the trial difference image data SDd determined to be appropriate as a plurality of imaging conditions in the position detection step S2B. .
  • the trial difference image data SDd is obtained by calculation for each of a large number of combinations of the various trial image data Sd1 to Sd6 obtained by imaging the sample board under various imaging conditions. And a plurality of imaging conditions are determined from the trial difference image data SDd determined to be appropriate. Therefore, instead of relying solely on experience and intuition, the image processing is tried for all combinations that cover the possible imaging conditions and an appropriate combination is selected, so that a plurality of suitable imaging conditions can be determined reliably.
  • the substrate imaging condition determination method that the third embodiment also serves is a trial determination step S13 in which a plurality of pixels included in a known arrangement position (solder position H) for each of a large number of trial difference image data SDd.
  • An average luminance difference represented by a deviation between the average value of the luminance difference values and the average value of the luminance difference values of a plurality of pixels included in a position T other than the known arrangement position is equal to or greater than a predetermined luminance difference.
  • a condition a second condition in which a variance value of a distribution in which luminance difference values of a plurality of pixels included in a known arrangement position (solder position H) vary, and a plurality of elements included in another position T
  • the suitability is determined based on at least one condition of the third condition in which the variance value of the distribution in which the luminance difference values of the pixels vary is equal to or less than the predetermined variance value.
  • the methods of the first to third embodiments can also be implemented as the component mounting machine 1 corresponding to the board production work apparatus of the present invention.
  • the effects of the component mounter 1 of the embodiment are the same as the effects of the methods of the first to third embodiments, and the description thereof is omitted.
  • the board production work method and board imaging condition determination method of the present invention are not limited to the TOP mounting of the component mounter described in each embodiment, and can be used in various board production work of other work execution apparatuses. is there.
  • the object to be detected is not limited to paste solder, but can be used to detect the position of installed parts, codes such as silk-printed characters and barcodes, and various markers such as fiducial marks. It is available for.
  • Component mounter 2 Substrate transport device 3: Component supply device 4: Component transfer device 5: Component camera 6: Substrate camera 61: Imaging unit 62: Incident light source 63: Incident light source K, K2: Substrate P, P1 P2: Paste solder L1, L2: Land SH: Solder position H: Solder position T: Other position N: Neutral position Bd1: First original image data Bd2: Second original image data Dd: Difference image data Sd1 to Sd6: Trial image data SDd: Trial difference image data

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Abstract

La présente invention concerne un procédé de travail de production de substrat doté d'un procédé de détection de position pour détecter la position de la disposition d'un objet en cours de détection qui est situé sur un substrat et un procédé d'implémentation de travail pour réaliser un travail de production prescrit sur le substrat sur la base de la position détectée de la disposition, le procédé de détection de position possédant une étape d'acquisition d'images permettant d'imager le substrat sous une pluralité de conditions d'imagerie et d'acquérir une pluralité d'éléments de données d'images d'origine comprenant des valeurs de luminosité pour chaque pixel disposé au niveau de coordonnées bidimensionnelles ; une étape de calcul de différence pour calculer, pour deux des éléments de données d'image d'origine parmi la pluralité d'éléments de données d'images d'origine, les différences entre les valeurs de pixels de luminosité aux mêmes coordonnées et acquérir des données d'images de différence comprenant les valeurs de différence de luminosité pour chaque pixel ; et une étape de détermination de position pour déterminer la position de la disposition sur la base des données d'images de différence. Il en résulte qu'il est possible d'utiliser une configuration de dispositif simple tout en utilisant un traitement d'images pour détecter avec précision la position de la disposition d'un objet en cours de détection sur un substrat.
PCT/JP2013/072435 2013-08-22 2013-08-22 Procédé de travail de production de substrat, procédé de détermination de condition d'imagerie de substrat, et dispositif de travail de production de substrat WO2015025403A1 (fr)

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US14/913,081 US10192300B2 (en) 2013-08-22 2013-08-22 Board production work method, board imaging conditions determination method, and board production work device
PCT/JP2013/072435 WO2015025403A1 (fr) 2013-08-22 2013-08-22 Procédé de travail de production de substrat, procédé de détermination de condition d'imagerie de substrat, et dispositif de travail de production de substrat
JP2015532654A JP6109317B2 (ja) 2013-08-22 2013-08-22 基板の生産作業方法、基板の撮像条件決定方法、および基板の生産作業装置
EP13891989.9A EP3037776B1 (fr) 2013-08-22 2013-08-22 Procédé de travail de production de substrat, procédé de détermination de condition d'imagerie de substrat, et dispositif de travail de production de substrat
CN201380078989.1A CN105473979B (zh) 2013-08-22 2013-08-22 基板的生产作业方法、基板的拍摄条件决定方法及基板的生产作业装置

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JP2022504377A (ja) * 2018-10-12 2022-01-13 テラダイン、 インコーポレイテッド 溶接パス生成のためのシステム及び方法
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EP4007479A4 (fr) * 2019-07-23 2022-08-03 Fuji Corporation Dispositif de gestion de données
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CN105473979A (zh) 2016-04-06
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EP3037776A4 (fr) 2016-08-03
US10192300B2 (en) 2019-01-29
JP6109317B2 (ja) 2017-04-05
CN105473979B (zh) 2018-09-28
EP3037776B1 (fr) 2019-06-19

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