WO2015020082A1 - Outil de polissage et procédé de traitement pour élément - Google Patents

Outil de polissage et procédé de traitement pour élément Download PDF

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Publication number
WO2015020082A1
WO2015020082A1 PCT/JP2014/070712 JP2014070712W WO2015020082A1 WO 2015020082 A1 WO2015020082 A1 WO 2015020082A1 JP 2014070712 W JP2014070712 W JP 2014070712W WO 2015020082 A1 WO2015020082 A1 WO 2015020082A1
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WO
WIPO (PCT)
Prior art keywords
polishing
workpiece
polished
curved surface
processing
Prior art date
Application number
PCT/JP2014/070712
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English (en)
Japanese (ja)
Inventor
伸悟 大月
均 森永
玉井　一誠
宏 浅野
伊藤　友一
創万 田口
Original Assignee
株式会社 フジミインコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 フジミインコーポレーテッド filed Critical 株式会社 フジミインコーポレーテッド
Priority to KR1020167002949A priority Critical patent/KR20160041908A/ko
Priority to US14/910,059 priority patent/US20160167192A1/en
Priority to JP2015530920A priority patent/JPWO2015020082A1/ja
Priority to CN201480044902.3A priority patent/CN105451938A/zh
Priority to EP14834968.1A priority patent/EP3031577A4/fr
Publication of WO2015020082A1 publication Critical patent/WO2015020082A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Definitions

  • the present invention relates to a polishing method for a workpiece to be polished having a specific end shape, and in particular, a polishing pad that has been processed to have an edge having a curved surface in the workpiece to be polished efficiently and uniformly.
  • the present invention relates to a polishing method using a held rotary polishing tool.
  • a polishing method using a rotary polishing tool holding a polishing pad is generally a method in which a rotating polishing tool is pressed and held on the end of a workpiece to be polished, and the contact surface is polished. It is. For example, for polishing at an edge portion of a silicon wafer or the like, a chamfered portion is formed while pressing the silicon wafer at a certain angle. (For example, see Patent Documents 1 and 2)
  • the present invention presses a rotary polishing tool having a polishing pad having a polishing surface corresponding to the curved surface against the curved surface portion of the workpiece to be uniformly contacted with the curved surface of the workpiece. Then, processing is performed by a polishing method including a step of polishing the workpiece by supplying a processing liquid to the pressed portion and moving the polishing pad relative to the workpiece to be polished. It has been found that the curved surface of the polished product can be uniformly polished.
  • a polishing is characterized by having a polishing pad having a polishing surface having a shape corresponding to the curved surface so as to be in uniform contact with the curved surface of the workpiece.
  • a processing tool is provided.
  • the polishing tool is preferably in the shape of a disk having a diameter of 20 mm or more, and the hardness of the polishing pad is preferably 5 or more in Shore A hardness.
  • the polishing pad is covered with a polishing tool having a polishing pad having a polishing surface having a shape corresponding to the curved surface so as to uniformly contact the curved surface of the workpiece.
  • the curved surface of the workpiece to be polished is polished by rotating the polishing tool while pressing and holding on the curved end surface of the polishing workpiece and supplying the processing liquid to the contact portion between the polishing pad and the workpiece to be polished.
  • a processing method characterized by the above. In order to increase the diameter of the processing tool to 20 mm or more and further suppress the scattering of the processing liquid, it is preferable to control the rotational speed of the processing tool to suppress the centrifugal force on the polishing surface.
  • a processing method using a processing apparatus having a pressure control device measures a contact pressure at a contact portion between a curved surface of a workpiece to be polished and a polishing tool surface.
  • the shape and the processing pressure of the processing portion in the polishing tool are controlled so that the surface distribution of the contact pressure becomes uniform.
  • the figure which shows an example of the shape of a polishing pad The figure which shows an example of the shape of a polishing pad.
  • a groove for supplying the machining fluid from the center of the pad is machined.
  • Two pads of the same shape are prepared and used in combination.
  • a hole for supplying a processing liquid is processed near the center of the pad.
  • polishing processing apparatus The figure which shows an example of a grinding
  • polishing processing apparatus An example in which a pressure sensor or a device with a similar function is provided.
  • the partial side view which shows the modification of a polishing tool which has a polishing pad, and a to-be-polished member.
  • the partial side view which shows the modification of a polishing tool which has a polishing pad, and a to-be-polished member.
  • the partial side view which shows the modification of a polishing tool which has a polishing pad, and a to-be-polished member.
  • the partial side view which shows the modification of the shape of a polishing pad.
  • the polishing tool of this embodiment has a polishing pad having a polishing surface having a shape corresponding to the curved surface so as to be in uniform contact with the curved surface of the workpiece (member to be polished) (FIG. 1). reference).
  • the polishing tool of the present embodiment is characterized in that it has a shape corresponding to the curved surface so that the contact with the curved surface of the workpiece is uniform.
  • the workpiece to be polished used in this embodiment has a curved surface.
  • a curved surface means that the polished surface is curved in a cross section perpendicular to the polished surface of the workpiece, and the curved shape is the same or similar in a plurality of cross sections on the polished surface. Show. If the polishing surface of the workpiece is processed using a polishing tool having a polishing surface having a shape corresponding to the curved surface of the workpiece, the curved surface of the workpiece is even with the polishing surface of the polishing tool. Uniform processing can be performed by contact.
  • the curved shape of the cross section of the polished surface of the workpiece can be arbitrarily selected, and a circular arc or a combination of a plurality of circular arcs can be used, and a linear portion may be partly included.
  • the curved surface on the polishing surface of the workpiece to be polished is a curved surface curved toward the outside of the workpiece to be polished (see an example shown in FIG. 9) or depressed toward the inside of the workpiece to be polished. It may be a curved surface (see the example shown in FIG. 10).
  • the polished surface of the workpiece to be polished has a substantially triangular cross section and a rounded top (see the example shown in FIG.
  • the polishing of the workpiece to be polished by using a polishing tool having a polishing surface having a shape corresponding to the curved surface of the workpiece to be polished. If the surface is machined, the curved surface of the work piece to be polished is in uniform contact with the polishing surface of the polishing tool so that uniform processing can be performed.
  • the polishing tool of this embodiment is characterized by having a polishing pad having a polishing surface having a shape corresponding to the curved surface of the workpiece.
  • the polishing pad of the present embodiment only needs to be provided at the end portion or the peripheral portion of the polishing tool, and is attached to the periphery of the polishing tool, assembled to the periphery of the polishing tool, polishing processing What was shape
  • the material of the polishing tool other than the polishing part (polishing pad) is not particularly limited, and may be any of resin, metal, ceramics, or may be composed of a plurality of materials.
  • any synthetic resin can be used.
  • thermosetting resins such as phenol resins, epoxy resins, urethane resins, and polyimides
  • thermoplastic resins such as polyethylene, polypropylene, acrylic resins, polyamides, and polycarbonates.
  • metal magnesium, aluminum, titanium, iron, nickel, cobalt copper, zinc, manganese, or an alloy containing the same as a main component can be used.
  • ceramics when ceramics are used as the material for polishing tools, ceramics, glass, oxides such as silicon, aluminum, zirconium, calcium, barium, nitrides, borides, carbides, aluminum oxide, oxidation Zirconium, silicon oxide, silicon carbide, silicon nitride, boron nitride and the like can be used.
  • any material can be used for the workpiece.
  • resin arbitrary synthetic resins can be used. Examples thereof include thermosetting resins (such as phenol resins, epoxy resins, urethane resins, and polyimides) and thermoplastic resins (such as polyethylene, polypropylene, acrylic resins, polyamides, and polycarbonates).
  • thermosetting resins such as phenol resins, epoxy resins, urethane resins, and polyimides
  • thermoplastic resins such as polyethylene, polypropylene, acrylic resins, polyamides, and polycarbonates
  • ceramics when using ceramics as the material of the workpiece to be polished, ceramics, glass, fine ceramics, oxides such as silicon, aluminum, zirconium, calcium, barium, carbides, nitrides, borides, etc. Can be used.
  • a metal when used as the material of the workpiece, magnesium, aluminum, titanium, iron, nickel, cobalt, copper, zinc, manganese, an alloy containing the main component thereof, or the like can be used.
  • the specific use of the workpiece is also arbitrary.
  • a wheel, a shaft, a container, a housing (a case, a housing, etc.), a frame (a frame, etc.), a ball, a wire, a decorative article, and the like can be used.
  • the polishing tool of the present embodiment is preferably a disc having a diameter of 20 mm or more. If the size of the polishing tool is large, a large linear velocity can be obtained even at the same rotation speed, so there is no need to increase the number of rotations of the processing tool for polishing processing, and centrifugal force is generated on the polishing surface due to rotation. Therefore, it is possible to prevent the machining fluid from scattering.
  • the size of the polishing tool is more preferably 30 mm or more, and still more preferably 50 mm or more.
  • the size of the polishing tool is preferably 1000 mm or less, more preferably 400 mm or less.
  • a linear velocity of 300 m / min can be obtained by setting the rotation speed to 80 rpm. If the diameter is larger, a higher linear velocity can be obtained at a smaller rotational speed, and the centrifugal force on the polishing surface can be suppressed, thereby preventing the machining liquid from scattering.
  • the size of the polishing tool is preferably 1000 mm or less from an economical viewpoint because there is a problem that the processing apparatus becomes large and not economical. .
  • a larger processing tool may be used.
  • the processing efficiency can be improved and the number of processing devices required for processing can be reduced.
  • the hardness of the polishing pad in the polishing tool of the present embodiment is preferably 5 or more in Shore A hardness.
  • a Shore A hardness of 5 or more means that a polishing pad, which is a specimen whose hardness is to be measured, is allowed to stand at room temperature for 60 minutes or more in a dry state with a humidity of 20 to 60%, and the hardness of the subsequent polishing pad is set to JIS K6253
  • the value measured with a compliant rubber hardness meter (A type) is 5 or more. If the Shore A hardness of the polishing pad is 5 or more, the surface of the workpiece can be processed favorably, and the shape of the surface of the polishing pad can be prevented from being deformed by a short polishing process.
  • the material of the polishing pad in the polishing tool of this embodiment is characterized in that it is composed of at least one of woven fabric, non-woven fabric, non-woven fabric resin processed product, synthetic leather, synthetic resin foam, or a composite product thereof.
  • the polishing pad may also have abrasive grains.
  • the type of abrasive grains to be used is not particularly limited, but silicon oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, oxidation Metal oxide particles such as chromium, carbides such as silicon carbide, other nitrides, borides, diamond, and the like can be used.
  • the polishing method according to the present embodiment uses a polishing tool having a polishing pad having a polishing surface having a shape corresponding to the curved surface so as to uniformly contact the curved surface of the workpiece to be polished. Pressing and holding on the curved surface of the workpiece, and polishing the curved surface of the workpiece by rotating the polishing tool while supplying a processing liquid to the contact portion between the polishing pad and the workpiece to be polished. Is done.
  • a processing liquid is supplied to a contact portion between the polishing pad and the workpiece to be polished.
  • the machining fluid may be supplied directly from the outside to the contact portion.
  • a machining fluid supply mechanism such as a rotary joint is arranged at the connection portion of the polishing tool.
  • the polishing liquid can also be supplied directly from the inside of the polishing tool to the processing site (see FIGS. 2 to 4 and 7). By supplying the machining fluid from the inside, the machining fluid can be supplied more efficiently.
  • a known composition used for polishing, lapping or cutting can be used for the working fluid.
  • the processing fluid can be water-based, oil-based or ether-based processing fluid, but if necessary, pH adjuster, etching agent, oxidizing agent, complexing agent, surfactant, emulsifier, antioxidant Additives such as anticorrosives, protective film forming agents, thickeners, stabilizers, dispersants, preservatives, and antifungal agents are mixed and used. Abrasive grains can be further added to the working fluid.
  • the type of abrasive grains used in the machining fluid is not particularly limited, but metal oxide particles such as silicon oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, and chromium oxide Further, carbides such as silicon carbide, other nitrides, borides, diamonds, and the like can be used. As the abrasive grains, organic particles using a thermoplastic resin or the like can also be used.
  • the linear velocity in the polishing process is preferably 10 m / min or more. If the linear velocity is 10 m / min or more, the end portion of the workpiece can be efficiently polished.
  • the number of rotations of the polishing tool in the polishing process is preferably 5000 rotations / minute or less, and more preferably 2000 rotations / minute or less.
  • the rotational speed is set to a high value of 5000 revolutions / minute or more, the machining liquid is scattered by the centrifugal force applied to the polishing surface. Therefore, it is necessary to replenish the scattered machining liquid to maintain the machining. Therefore, in order that the machining fluid is appropriately held by the machining tool and stable machining is performed, it is preferable that the machining fluid is within 5000 revolutions / minute.
  • the polishing tool is used by being attached to an arbitrary processing device.
  • the processing device is not particularly limited as long as it has a mechanism capable of holding and rotating the polishing tool, and for example, a known processing device can be used.
  • Examples of the processing device include a grinding device such as a cylindrical grinder, a table grinder, and a grinder.
  • the relative position between the polishing tool and the workpiece to be polished needs to be arranged so that the curved surface of the workpiece can be polished, but the positional relationship is arbitrary. (See FIG. 6) or vertically (see FIG. 5), and the workpiece can be pressed and processed from any direction around it.
  • a jig for fixing the workpiece to be polished at an arbitrary angle and position is used. It is preferable to use a jig that is movable and can be sequentially processed while moving the end of the workpiece.
  • the polishing tool and / or the workpiece to be polished is mounted on a processing apparatus having a pressure control unit,
  • the measurement is performed by measuring the contact pressure of the contact portion between the curved surface and the surface of the polishing tool, and controlling the shape and processing pressure of the processing portion in the polishing tool so that the contact pressure becomes uniform.
  • a pressure sensor or a device having a similar function that is, a pressure control device, is attached to the rotating shaft of the workpiece, the rotating shaft of the polishing tool, or the polishing tool itself.
  • FIG. 13 and FIG. 14 show one modification of the present embodiment.
  • a polishing tool 10 having a polishing pad formed of the above-described material that is, a material having a certain degree of elasticity and elastically deforming is prepared.
  • the width H1 of the polishing surface 11 in the direction parallel to the rotation axis of the polishing tool 10 is the thickness T1 of the workpiece K before processing (that is, the workpiece K to be polished).
  • the length between the upper surface KU and the lower surface KD) by a predetermined amount ⁇ As described above, in an example in which the polishing pad is formed of an elastic body and the shape of the polishing surface 11 is smaller than the shape of the portion to be polished of the workpiece K, the following effects are obtained.
  • the workpiece K can be appropriately processed.
  • the polishing tool 10 when the polishing tool itself is molded as a polishing pad, the polishing tool 10 is formed of a material having a certain degree of elasticity such as a resin and elastically deforming. Similarly to the modification shown in FIG. 13, the width H1 of the polishing surface 11 of the polishing tool 10 is made smaller by a predetermined amount ⁇ than the thickness T1 of the workpiece K to be polished before processing. Thus, the polishing tool 10 having a function as a polishing pad is formed of an elastic body, and the shape of the polishing surface 11 of the polishing tool 10 is smaller than the shape of the portion to be polished of the workpiece K to be polished. By doing so, the effect according to the modification shown in previous FIG. 13 can be obtained.
  • the present invention is useful as a polishing tool and a processing method for precisely processing a curved surface of a workpiece to be polished, and in particular, processing a surface of a workpiece having a curved surface with high accuracy. And can be performed more efficiently than the conventional method.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

La présente invention concerne un procédé de polissage pour un article destiné à être poli qui possède une forme désignée, et concerne spécifiquement un procédé de polissage au moyen d'un outil de polissage caractérisé en ce qu'il comporte un tampon de polissage avec une surface de polissage profilée pour correspondre à la forme d'une surface courbée de l'article destiné à être poli, afin de polir efficacement et uniformément cette surface courbée. Cet outil de polissage est caractérisé en ce qu'il possède un tampon de polissage avec une surface de polissage correspondant à la surface courbée de l'article destiné à être poli de façon à venir en contact régulier avec la surface courbée. La dureté du tampon de polissage est d'au moins 5 sur l'échelle de dureté Shore A et il est préférable que le matériau de surface comprenne au moins un tissu, un textile non tissé, un textile non tissé traité avec une résine, un cuir synthétique, une mousse de résine synthétique, ou un composite de ceux-ci. De plus, ce procédé de traitement est caractérisé en ce que la surface courbée de l'article destiné à être poli est traitée au moyen d'un outil de polissage possédant une surface de polissage avec une forme correspondant à la forme de la surface courbée de l'article destiné à être poli de façon à venir en contact régulier avec la surface courbée.
PCT/JP2014/070712 2013-08-09 2014-08-06 Outil de polissage et procédé de traitement pour élément WO2015020082A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020167002949A KR20160041908A (ko) 2013-08-09 2014-08-06 연마 가공 공구 및 부재의 가공 방법
US14/910,059 US20160167192A1 (en) 2013-08-09 2014-08-06 Polishing tool and processing method for member
JP2015530920A JPWO2015020082A1 (ja) 2013-08-09 2014-08-06 研磨加工工具及び部材の加工方法
CN201480044902.3A CN105451938A (zh) 2013-08-09 2014-08-06 研磨加工工具以及构件的加工方法
EP14834968.1A EP3031577A4 (fr) 2013-08-09 2014-08-06 Outil de polissage et procédé de traitement pour élément

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-167116 2013-08-09
JP2013167116 2013-08-09

Publications (1)

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WO2015020082A1 true WO2015020082A1 (fr) 2015-02-12

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US (1) US20160167192A1 (fr)
EP (1) EP3031577A4 (fr)
JP (1) JPWO2015020082A1 (fr)
KR (1) KR20160041908A (fr)
CN (1) CN105451938A (fr)
TW (1) TW201527048A (fr)
WO (1) WO2015020082A1 (fr)

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WO2015163136A1 (fr) * 2014-04-23 2015-10-29 富士紡ホールディングス株式会社 Tampon abrasif
JP6446590B1 (ja) * 2018-08-09 2018-12-26 国立大学法人 東京大学 局所研磨加工方法、および局所研磨加工装置、並びに該局所研磨加工装置を用いた修正研磨加工装置

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US20170312880A1 (en) * 2014-10-31 2017-11-02 Ebara Corporation Chemical mechanical polishing apparatus for polishing workpiece
KR102648921B1 (ko) * 2016-08-09 2024-03-19 삼성디스플레이 주식회사 임프린트 마스터 템플릿 및 이의 제조 방법
CN106985059B (zh) * 2017-04-27 2018-12-28 厦门大学 一种空心球体内外球面研抛方法及装置
JP7093875B2 (ja) * 2021-06-24 2022-06-30 一郎 片山 ワーク加工装置、砥石、およびワーク加工方法

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Title
See also references of EP3031577A4

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015163136A1 (fr) * 2014-04-23 2015-10-29 富士紡ホールディングス株式会社 Tampon abrasif
JP6446590B1 (ja) * 2018-08-09 2018-12-26 国立大学法人 東京大学 局所研磨加工方法、および局所研磨加工装置、並びに該局所研磨加工装置を用いた修正研磨加工装置
WO2020032106A1 (fr) * 2018-08-09 2020-02-13 国立大学法人東京大学 Procédé de polissage local, dispositif de polissage local et appareil de polissage correctif utilisant ledit dispositif de polissage local

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Publication number Publication date
EP3031577A4 (fr) 2017-03-22
US20160167192A1 (en) 2016-06-16
JPWO2015020082A1 (ja) 2017-03-02
KR20160041908A (ko) 2016-04-18
TW201527048A (zh) 2015-07-16
EP3031577A1 (fr) 2016-06-15
CN105451938A (zh) 2016-03-30

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