US20170312880A1 - Chemical mechanical polishing apparatus for polishing workpiece - Google Patents
Chemical mechanical polishing apparatus for polishing workpiece Download PDFInfo
- Publication number
- US20170312880A1 US20170312880A1 US15/520,515 US201515520515A US2017312880A1 US 20170312880 A1 US20170312880 A1 US 20170312880A1 US 201515520515 A US201515520515 A US 201515520515A US 2017312880 A1 US2017312880 A1 US 2017312880A1
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- Prior art keywords
- workpiece
- polishing
- annular
- chemical mechanical
- periphery
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
- B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
- B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
- B24B5/047—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally of workpieces turning about a vertical axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/36—Single-purpose machines or devices
- B24B5/363—Single-purpose machines or devices for grinding surfaces of revolution in situ
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
- B24B9/107—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning
Definitions
- the present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish.
- CMP chemical mechanical polishing
- a workpiece having a three-dimensional surface constituted by a combination of a planar surface and a curved surface.
- a workpiece include a metal body made of aluminum, stainless steel, or the like, and a resin body.
- metal body and resin body may be used in, for example, a cellular phone, a smart phone, a multifunction mobile terminal, a portable game device, a camera, a watch, a music media player, a personal computer, an electronic device, car parts, ornaments, medical equipment, or the like.
- a conventional lapping technique and a conventional polishing technique can polish the planar surface to a mirror finish.
- a chemical mechanical polishing apparatus for polishing a workpiece having a polygonal shape, comprising: a polishing pad having an annular polishing surface which has a curved vertical cross-section; a rotatable polishing table supporting the polishing pad; a workpiece holder for holding the workpiece; a rotating device configured to rotate the workpiece holder about an axis of the workpiece; a pressing device configured to press a periphery of the workpiece against the annular polishing surface; a polishing-liquid supply nozzle configured to supply a polishing liquid onto the annular polishing surface; and an operation controller configured to change a speed at which the rotating device rotates the workpiece according to a rotation angle of the workpiece, wherein the pressing device is disposed more inwardly than the workpiece holder in a radial direction of the polishing table.
- the chemical mechanical polishing apparatus further comprises a polished-state monitoring device configured to monitor a polished state of the periphery of the workpiece.
- the polishing pad has an annular shape, and the polishing pad has an inner peripheral surface which constitutes the annular polishing surface.
- the periphery of the workpiece is polished by the sliding contact with the annular polishing surface.
- the annular polishing surface has a curved vertical cross-section. Therefore, a curved surface, constituting the periphery of the workpiece, uniformly contacts the annular polishing surface and is polished to a mirror finish.
- FIG. 1 is a side view of a chemical mechanical polishing apparatus according to an embodiment of the present invention
- FIG. 2 is a plan view of the chemical mechanical polishing apparatus shown in FIG. 1 ;
- FIG. 3 is a diagram showing a rectangular workpiece at a rotation angle of 0 degrees
- FIG. 4 is a diagram showing the rectangular workpiece at a rotation angle of 45 degrees
- FIG. 5 is a graph showing a relationship between rotation angle of a workpiece and rotational speed of the workpiece
- FIG. 6 is a plan view of a chemical mechanical polishing apparatus including a plurality of polishing heads
- FIG. 7 is a side view of a chemical mechanical polishing apparatus including a surface-condition monitoring device for monitoring a surface condition of a periphery of a workpiece;
- FIG. 8 is a side view of a chemical mechanical polishing apparatus including a motor ammeter for monitoring an electric current supplied to a table motor for rotating a polishing table;
- FIG. 9 is a side view of a chemical mechanical polishing apparatus according to another embodiment.
- FIG. 10 is a plan view of the chemical mechanical polishing apparatus shown in FIG. 9 ;
- FIG. 11 is a side view of a chemical mechanical polishing apparatus according to yet another embodiment.
- FIG. 12 is a plan view of the chemical mechanical polishing apparatus shown in FIG. 11 ;
- FIG. 13 is a plan view of an embodiment of a chemical mechanical polishing apparatus including a plurality of polishing heads shown in FIGS. 11 and 12 .
- FIG. 1 is a side view of a chemical mechanical polishing apparatus according to an embodiment of the present invention
- FIG. 2 is a plan view of the chemical mechanical polishing apparatus.
- the chemical mechanical polishing apparatus includes a polishing pad 2 having an annular polishing surface 2 a , a rotatable polishing table 3 supporting the polishing pad 2 , a polishing-liquid supply nozzle 5 for supplying a polishing liquid onto the annular polishing surface 2 a , and a polishing head 1 for pressing a periphery of a workpiece W against the annular polishing surface 2 a of the polishing pad 2 to polish the periphery of the workpiece W.
- the periphery, of the workpiece W is composed of a curved surface.
- the annular polishing surface 2 a has an inwardly-curved vertical cross-section that follows a shape of a vertical cross-section of the periphery of the workpiece W.
- the curvature of the curved vertical cross-section of the annular polishing surface 2 a is equal to or slightly larger than the curvature of the vertical cross-section of the periphery of the workpiece W.
- the polishing head 1 includes a workpiece holder 11 for holding the workpiece W, a servomotor 15 as a rotating device for rotating the workpiece holder 11 about an axis of the workpiece W, and an air cylinder 14 as a pressing device for pushing the servomotor 15 toward the center of the polishing pad 2 to thereby press the periphery of the workpiece W, held by the workpiece holder 11 , against the annular polishing surface 2 a.
- the polishing pad 2 of this embodiment has a disk shape, and the annular polishing surface 2 a constitutes at least a part of a circumferential surface of the polishing pad 2 .
- the polishing pad 2 is attached to an upper surface of the polishing table 3 .
- the polishing table 3 is configured to be rotated about its axis by a table motor 18 , so that the polishing pad 2 rotates about its axis together with the polishing table 3 .
- the workpiece holder 11 is configured to be able to detachably hold the workpiece W by screwing, magnetic force, vacuum suction, freezing chuck, vacuum attraction chuck, or other technique.
- the workpiece holder 11 is configured to hold the workpiece W in a horizontal position.
- the workpiece holder 11 is coupled to the servomotor 15 .
- the servomotor 15 is a rotating device for rotating the workpiece holder 11 and the workpiece W, held by the workpiece holder 11 , about their axis.
- the servomotor 15 has a built-in rotary encoder (not shown) for measuring a rotation angle of the workpiece holder 11 and the workpiece W.
- the servomotor 15 is held by a horizontally-extending linear guide 20 , and is horizontally movable along a longitudinal direction of the linear guide 20 .
- the longitudinal direction of the linear guide 20 is parallel to a radial direction of the polishing pad 2 . Therefore, the servomotor 15 , the workpiece holder 11 , and the workpiece W are movable in the radial direction of the polishing pad 2 .
- the servomotor 15 is coupled to the air cylinder 14 .
- This air cylinder 14 is configured to move the servomotor 15 , the workpiece holder 11 , and the workpiece W together in a horizontal direction (i.e., in the radial direction of the polishing pad 2 ). More specifically, the air cylinder 14 is capable of moving the workpiece W in directions away from and closer to the annular polishing surface 2 a of the polishing pad 2 .
- the air cylinder 14 pushes the servomotor 15 toward the center of the polishing pad 2 , the workpiece holder 11 and the workpiece W, together with the servomotor 15 , move toward the annular polishing surface 2 a , until the periphery of the workpiece W is pressed against the annular polishing surface 2 a .
- the force with which the periphery of the workpiece W is pressed against the annular polishing surface 2 a is regulated by the air cylinder 14 .
- An operation controller 25 is coupled to the air cylinder 14 and the servomotor 15 .
- the operation controller 25 is configured to control operations of the air cylinder 14 and the servomotor 15 . More specifically, the operation controller 25 controls the force generated by the air cylinder 14 , i.e., the force with which the periphery of the workpiece W is pressed against the annular polishing surface 2 a , and also controls the speed at which the servomotor 15 rotates the workpiece W.
- the linear guide 20 and the air cylinder 14 are secured to a base 27 .
- the base 27 is coupled to a positioning mechanism 29 for adjusting a vertical position of the base 27 .
- the vertical positions of the air cylinder 14 , the linear guide 20 , and the workpiece holder 11 are adjusted by the positioning mechanism 29 . Accordingly, the vertical position of the workpiece W, held by the workpiece holder 11 , relative to the annular polishing surface 2 a is also adjusted by the positioning mechanism 29 .
- An outlet of the polishing-liquid supply nozzle 5 is directed to the annular polishing surface 2 a of the polishing pad 2 so that a polishing liquid, such as a slurry, is supplied onto the annular polishing surface 2 a .
- the outlet of the polishing-liquid supply nozzle 5 is disposed upstream of the workpiece W in a direction of rotation of the polishing pad 2 and the polishing table 3 . Therefore, the polishing liquid, supplied from the polishing-liquid supply nozzle 5 , is carried by the rotating annular polishing surface 2 a to the periphery of the workpiece W, which is a portion to be polished.
- polishing operation of the chemical mechanical polishing apparatus will now be described. While the polishing pad 2 and the polishing table 3 are being rotated as shown in FIGS. 1 and 2 , a polishing liquid (slurry) is supplied from the polishing-liquid supply nozzle 5 onto the annular polishing surface 2 a of the polishing pad 2 . Further, the workpiece holder 11 and the workpiece W are rotated by the servomotor 15 . The air cylinder 14 pushes the servomotor 15 , the workpiece holder 11 , and the workpiece W toward the center of the polishing pad 2 , thereby pressing the periphery of the workpiece W against the annular polishing surface 2 a .
- a polishing liquid slurry
- the periphery of the workpiece W is rubbed against the annular polishing surface 2 a in the presence of the polishing liquid.
- the periphery of the workpiece W is polished to have a mirror surface by a chemical component of the polishing liquid and abrasive particles contained in the polishing liquid. Since the annular polishing surface 2 a has a vertical cross-section that follows the shape of the vertical cross-section of the periphery of the workpiece W, the curved surface, constituting the periphery of the workpiece W, uniformly contacts the annular polishing surface 2 a and is polished to a mirror finish.
- the operation controller 25 is configured to change the rotational speed of the workpiece W according to the rotation angle of the workpiece W.
- FIG. 3 is a diagram showing the rectangular workpiece W at a rotation angle of 0 degrees
- FIG. 4 is a diagram showing the rectangular workpiece W at a rotation angle of 45 degrees.
- FIG. 5 is a graph showing a relationship between the rotation angle of the workpiece W and the rotational speed of the workpiece W. A vertical axis of FIG. 5 represents the rotational speed [angular degrees/min] of the workpiece W, and a horizontal axis represents the rotation angle of the workpiece W.
- the workpiece W is in the state shown in FIG. 3 when the rotation angle of the workpiece W is 0 degrees: a linear portion of the periphery of the workpiece W is in contact with the polishing pad 2 . As shown in FIG. 5 , the rotational speed of the workpiece W is lowered each time the workpiece W rotates 90 degrees, i.e., with a period of 90 degrees.
- the rotation angle of the workpiece W is obtained by the above-described rotary encoder installed in the servomotor 15 .
- a measured value of the rotation angle is sent from the rotary encoder to the operation controller 25 .
- the operation controller 25 changes the rotational speed of the workpiece W based on the measured value of the rotation angle.
- a time of contact between the workpiece W and the annular polishing surface 2 a can be uniform over the entire periphery of the workpiece W.
- the polishing pad 2 can therefore uniformly polish the periphery of the workpiece W.
- FIG. 6 is a plan view of a chemical mechanical polishing apparatus including a plurality of polishing heads 1 . As shown in FIG. 6 , a plurality of polishing heads 1 may be arranged along a circumferential direction of the polishing pad 2 . A plurality of polishing-liquid supply nozzles 5 are disposed adjacent to the polishing heads 1 , respectively.
- the chemical mechanical polishing apparatus may include a polished-state monitoring device for monitoring a polished state of the periphery of the workpiece W.
- the chemical mechanical polishing apparatus includes a surface-condition monitoring device 32 as the polished-state monitoring device, which monitors a surface condition of the periphery of the workpiece W held by the workpiece holder 11 .
- Examples of such a surface-condition monitoring device 32 may include a camera (e.g., a digital camera equipped with an image sensor such as CCD) for imaging the periphery of the workpiece W, and a photometer for measuring an intensity of light reflected from the periphery of the workpiece W.
- the surface-condition monitoring device 32 quantifies the surface condition of the periphery of the workpiece W, and sends a numerical value obtained to the operation controller 25 .
- the surface-condition monitoring device 32 may obtain a numerical value of a color or irregularities of the peripheral surface of the workpiece W, or may obtain a numerical value of the intensity of light reflected from the peripheral surface.
- paint may be applied to the peripheral surface of the workpiece W in advance.
- the operation controller 25 determines a polishing end point of the workpiece W based on the numerical value (i.e., the surface condition of the periphery of the workpiece W) sent from the surface-condition monitoring device 32 .
- the chemical mechanical polishing apparatus includes a motor ammeter 33 as the polished-state monitoring device, which monitors an electric current supplied to the table motor 18 that rotates the polishing table 3 .
- a frictional force that acts between the workpiece W and the polishing pad 2 changes as the peripheral surface of the workpiece W becomes smoother as a result of polishing.
- the change in the frictional force leads to a change in the electric current supplied to the table motor 18 .
- the motor ammeter 33 measures the electric current that flows to the table motor 18 , and sends a measured value of the electric current to the operation controller 25 .
- the operation controller 25 determines a polishing end point of the workpiece W based on the measured value of the electric current (i.e., the surface condition of the periphery of the workpiece W) sent from the motor ammeter 33 .
- FIG. 9 is a side view of a chemical mechanical polishing apparatus according to yet another embodiment
- FIG. 10 is a plan view of the chemical mechanical polishing apparatus shown in FIG. 9
- An annular polishing pad 2 is used in this embodiment.
- An inner peripheral surface of the annular polishing pad 2 constitutes an annular polishing surface 2 a .
- the annular polishing surface 2 a has an outwardly curved vertical cross-section.
- the polishing liquid is supplied onto an area located inside the annular polishing surface 2 a , and flows outwardly due to a centrifugal force until the polishing liquid reaches the annular polishing surface 2 a .
- the annular polishing pad 2 can easily hold the polishing liquid on its annular polishing surface 2 a , and can therefore reduce an amount of the polishing liquid used.
- FIG. 11 is a side view of a chemical mechanical polishing apparatus according to yet another embodiment
- FIG. 12 is a plan view of the chemical mechanical polishing apparatus shown in FIG. 11 .
- the air cylinder 14 is disposed more inwardly than the workpiece holder 11 (preferably along the radially inner side of the workpiece holder 11 ) in the radial direction of the polishing table 3 (and the polishing pad 2 ).
- the air cylinder 14 is located above the polishing table 3 and the polishing pad 2 .
- the air cylinder 14 may be located below the polishing table 3 and the polishing pad 2 .
- the air cylinder 14 moves the servomotor 15 , the workpiece holder 11 , and the workpiece W toward the center of the polishing pad 2 , thereby pressing the periphery of the workpiece W against the annular polishing surface 2 a.
- FIG. 13 is a plan view of an embodiment of a chemical mechanical polishing apparatus including a plurality of polishing heads 1 , each of which is shown in FIGS. 11 and 12 .
- the air cylinders 14 of the polishing heads 1 are located inside the polishing table 3 and the polishing pad 2 . Therefore, as can be seen in FIG. 13 , the overall width of the chemical mechanical polishing apparatus can be small.
- the surface-condition monitoring device 32 shown in FIG. 7 , and the motor ammeter 33 as another exemplary surface-condition monitoring device, shown in FIG. 8 , can be applied also to the embodiments shown in FIGS. 11 through 13 . Further, the annular polishing pad 2 shown in FIGS. 9 and 10 may be applied to the embodiments shown in FIGS. 11 through 13 .
- the workpiece W in its entirety, has a rectangular shape, and its periphery has an outwardly curved vertical cross-section.
- the chemical mechanical polishing apparatuses according to the above-described embodiments can be used not only for polishing of a workpiece having, in its entirety, a polygonal shape, but also for polishing of a workpiece having, in its entirety, a circular shape.
- the present invention is applicable to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish.
- CMP chemical mechanical polishing
Abstract
Description
- The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish.
- From viewpoints of functionality and design, there has been a demand for mirror-polishing a workpiece having a three-dimensional surface constituted by a combination of a planar surface and a curved surface. Examples of such a workpiece include a metal body made of aluminum, stainless steel, or the like, and a resin body. Such metal body and resin body may be used in, for example, a cellular phone, a smart phone, a multifunction mobile terminal, a portable game device, a camera, a watch, a music media player, a personal computer, an electronic device, car parts, ornaments, medical equipment, or the like.
- A conventional lapping technique and a conventional polishing technique can polish the planar surface to a mirror finish. However, it is very difficult for these techniques to polish the curved surface to a mirror finish.
- It is an object of the present invention to provide a chemical mechanical polishing apparatus capable of polishing a workpiece, having a periphery constituted by a curved surface, to a mirror finish.
- In an aspect of the present invention, there is provided a chemical mechanical polishing apparatus for polishing a workpiece having a polygonal shape, comprising: a polishing pad having an annular polishing surface which has a curved vertical cross-section; a rotatable polishing table supporting the polishing pad; a workpiece holder for holding the workpiece; a rotating device configured to rotate the workpiece holder about an axis of the workpiece; a pressing device configured to press a periphery of the workpiece against the annular polishing surface; a polishing-liquid supply nozzle configured to supply a polishing liquid onto the annular polishing surface; and an operation controller configured to change a speed at which the rotating device rotates the workpiece according to a rotation angle of the workpiece, wherein the pressing device is disposed more inwardly than the workpiece holder in a radial direction of the polishing table.
- In a preferred aspect, the chemical mechanical polishing apparatus further comprises a polished-state monitoring device configured to monitor a polished state of the periphery of the workpiece.
- In a preferred aspect, the polishing pad has an annular shape, and the polishing pad has an inner peripheral surface which constitutes the annular polishing surface.
- According to the present invention, the periphery of the workpiece is polished by the sliding contact with the annular polishing surface. The annular polishing surface has a curved vertical cross-section. Therefore, a curved surface, constituting the periphery of the workpiece, uniformly contacts the annular polishing surface and is polished to a mirror finish.
-
FIG. 1 is a side view of a chemical mechanical polishing apparatus according to an embodiment of the present invention; -
FIG. 2 is a plan view of the chemical mechanical polishing apparatus shown inFIG. 1 ; -
FIG. 3 is a diagram showing a rectangular workpiece at a rotation angle of 0 degrees; -
FIG. 4 is a diagram showing the rectangular workpiece at a rotation angle of 45 degrees; -
FIG. 5 is a graph showing a relationship between rotation angle of a workpiece and rotational speed of the workpiece; -
FIG. 6 is a plan view of a chemical mechanical polishing apparatus including a plurality of polishing heads; -
FIG. 7 is a side view of a chemical mechanical polishing apparatus including a surface-condition monitoring device for monitoring a surface condition of a periphery of a workpiece; -
FIG. 8 is a side view of a chemical mechanical polishing apparatus including a motor ammeter for monitoring an electric current supplied to a table motor for rotating a polishing table; -
FIG. 9 is a side view of a chemical mechanical polishing apparatus according to another embodiment; -
FIG. 10 is a plan view of the chemical mechanical polishing apparatus shown inFIG. 9 ; -
FIG. 11 is a side view of a chemical mechanical polishing apparatus according to yet another embodiment; -
FIG. 12 is a plan view of the chemical mechanical polishing apparatus shown inFIG. 11 ; and -
FIG. 13 is a plan view of an embodiment of a chemical mechanical polishing apparatus including a plurality of polishing heads shown inFIGS. 11 and 12 . - Embodiments of the present invention will now be described with reference to the drawings.
FIG. 1 is a side view of a chemical mechanical polishing apparatus according to an embodiment of the present invention, andFIG. 2 is a plan view of the chemical mechanical polishing apparatus. The chemical mechanical polishing apparatus includes apolishing pad 2 having anannular polishing surface 2 a, a rotatable polishing table 3 supporting thepolishing pad 2, a polishing-liquid supply nozzle 5 for supplying a polishing liquid onto theannular polishing surface 2 a, and apolishing head 1 for pressing a periphery of a workpiece W against theannular polishing surface 2 a of thepolishing pad 2 to polish the periphery of the workpiece W. - The periphery, of the workpiece W is composed of a curved surface. The
annular polishing surface 2 a has an inwardly-curved vertical cross-section that follows a shape of a vertical cross-section of the periphery of the workpiece W. The curvature of the curved vertical cross-section of theannular polishing surface 2 a is equal to or slightly larger than the curvature of the vertical cross-section of the periphery of the workpiece W. - The
polishing head 1 includes aworkpiece holder 11 for holding the workpiece W, aservomotor 15 as a rotating device for rotating theworkpiece holder 11 about an axis of the workpiece W, and anair cylinder 14 as a pressing device for pushing theservomotor 15 toward the center of thepolishing pad 2 to thereby press the periphery of the workpiece W, held by theworkpiece holder 11, against theannular polishing surface 2 a. - The
polishing pad 2 of this embodiment has a disk shape, and theannular polishing surface 2 a constitutes at least a part of a circumferential surface of thepolishing pad 2. Thepolishing pad 2 is attached to an upper surface of the polishing table 3. The polishing table 3 is configured to be rotated about its axis by atable motor 18, so that thepolishing pad 2 rotates about its axis together with the polishing table 3. - The
workpiece holder 11 is configured to be able to detachably hold the workpiece W by screwing, magnetic force, vacuum suction, freezing chuck, vacuum attraction chuck, or other technique. Theworkpiece holder 11 is configured to hold the workpiece W in a horizontal position. - The
workpiece holder 11 is coupled to theservomotor 15. Theservomotor 15 is a rotating device for rotating theworkpiece holder 11 and the workpiece W, held by theworkpiece holder 11, about their axis. Theservomotor 15 has a built-in rotary encoder (not shown) for measuring a rotation angle of theworkpiece holder 11 and the workpiece W. - The
servomotor 15 is held by a horizontally-extendinglinear guide 20, and is horizontally movable along a longitudinal direction of thelinear guide 20. The longitudinal direction of thelinear guide 20 is parallel to a radial direction of thepolishing pad 2. Therefore, theservomotor 15, theworkpiece holder 11, and the workpiece W are movable in the radial direction of thepolishing pad 2. - The
servomotor 15 is coupled to theair cylinder 14. Thisair cylinder 14 is configured to move theservomotor 15, theworkpiece holder 11, and the workpiece W together in a horizontal direction (i.e., in the radial direction of the polishing pad 2). More specifically, theair cylinder 14 is capable of moving the workpiece W in directions away from and closer to theannular polishing surface 2 a of thepolishing pad 2. - When the
air cylinder 14 pushes theservomotor 15 toward the center of thepolishing pad 2, theworkpiece holder 11 and the workpiece W, together with theservomotor 15, move toward theannular polishing surface 2 a, until the periphery of the workpiece W is pressed against theannular polishing surface 2 a. The force with which the periphery of the workpiece W is pressed against theannular polishing surface 2 a is regulated by theair cylinder 14. - An
operation controller 25 is coupled to theair cylinder 14 and theservomotor 15. Theoperation controller 25 is configured to control operations of theair cylinder 14 and theservomotor 15. More specifically, theoperation controller 25 controls the force generated by theair cylinder 14, i.e., the force with which the periphery of the workpiece W is pressed against theannular polishing surface 2 a, and also controls the speed at which theservomotor 15 rotates the workpiece W. - The
linear guide 20 and theair cylinder 14 are secured to abase 27. Thebase 27 is coupled to apositioning mechanism 29 for adjusting a vertical position of thebase 27. The vertical positions of theair cylinder 14, thelinear guide 20, and theworkpiece holder 11 are adjusted by thepositioning mechanism 29. Accordingly, the vertical position of the workpiece W, held by theworkpiece holder 11, relative to theannular polishing surface 2 a is also adjusted by thepositioning mechanism 29. - An outlet of the polishing-
liquid supply nozzle 5 is directed to theannular polishing surface 2 a of thepolishing pad 2 so that a polishing liquid, such as a slurry, is supplied onto theannular polishing surface 2 a. The outlet of the polishing-liquid supply nozzle 5 is disposed upstream of the workpiece W in a direction of rotation of thepolishing pad 2 and the polishing table 3. Therefore, the polishing liquid, supplied from the polishing-liquid supply nozzle 5, is carried by the rotatingannular polishing surface 2 a to the periphery of the workpiece W, which is a portion to be polished. - The polishing operation of the chemical mechanical polishing apparatus will now be described. While the
polishing pad 2 and the polishing table 3 are being rotated as shown inFIGS. 1 and 2 , a polishing liquid (slurry) is supplied from the polishing-liquid supply nozzle 5 onto theannular polishing surface 2 a of thepolishing pad 2. Further, theworkpiece holder 11 and the workpiece W are rotated by theservomotor 15. Theair cylinder 14 pushes theservomotor 15, theworkpiece holder 11, and the workpiece W toward the center of thepolishing pad 2, thereby pressing the periphery of the workpiece W against theannular polishing surface 2 a. The periphery of the workpiece W is rubbed against theannular polishing surface 2 a in the presence of the polishing liquid. The periphery of the workpiece W is polished to have a mirror surface by a chemical component of the polishing liquid and abrasive particles contained in the polishing liquid. Since theannular polishing surface 2 a has a vertical cross-section that follows the shape of the vertical cross-section of the periphery of the workpiece W, the curved surface, constituting the periphery of the workpiece W, uniformly contacts theannular polishing surface 2 a and is polished to a mirror finish. - When the workpiece W has a rectangular shape, it is preferred that an entire periphery of the workpiece W be polished uniformly. In view of this, the
operation controller 25 is configured to change the rotational speed of the workpiece W according to the rotation angle of the workpiece W.FIG. 3 is a diagram showing the rectangular workpiece W at a rotation angle of 0 degrees, andFIG. 4 is a diagram showing the rectangular workpiece W at a rotation angle of 45 degrees.FIG. 5 is a graph showing a relationship between the rotation angle of the workpiece W and the rotational speed of the workpiece W. A vertical axis ofFIG. 5 represents the rotational speed [angular degrees/min] of the workpiece W, and a horizontal axis represents the rotation angle of the workpiece W. The workpiece W is in the state shown inFIG. 3 when the rotation angle of the workpiece W is 0 degrees: a linear portion of the periphery of the workpiece W is in contact with thepolishing pad 2. As shown inFIG. 5 , the rotational speed of the workpiece W is lowered each time the workpiece W rotates 90 degrees, i.e., with a period of 90 degrees. - The rotation angle of the workpiece W is obtained by the above-described rotary encoder installed in the
servomotor 15. A measured value of the rotation angle is sent from the rotary encoder to theoperation controller 25. Theoperation controller 25 changes the rotational speed of the workpiece W based on the measured value of the rotation angle. - According to the embodiment shown in
FIG. 5 , a time of contact between the workpiece W and theannular polishing surface 2 a can be uniform over the entire periphery of the workpiece W. Thepolishing pad 2 can therefore uniformly polish the periphery of the workpiece W. -
FIG. 6 is a plan view of a chemical mechanical polishing apparatus including a plurality of polishing heads 1. As shown inFIG. 6 , a plurality of polishingheads 1 may be arranged along a circumferential direction of thepolishing pad 2. A plurality of polishing-liquid supply nozzles 5 are disposed adjacent to the polishing heads 1, respectively. - The chemical mechanical polishing apparatus may include a polished-state monitoring device for monitoring a polished state of the periphery of the workpiece W. In the embodiment shown in
FIG. 7 , the chemical mechanical polishing apparatus includes a surface-condition monitoring device 32 as the polished-state monitoring device, which monitors a surface condition of the periphery of the workpiece W held by theworkpiece holder 11. Examples of such a surface-condition monitoring device 32 may include a camera (e.g., a digital camera equipped with an image sensor such as CCD) for imaging the periphery of the workpiece W, and a photometer for measuring an intensity of light reflected from the periphery of the workpiece W. - The surface-
condition monitoring device 32 quantifies the surface condition of the periphery of the workpiece W, and sends a numerical value obtained to theoperation controller 25. For example, the surface-condition monitoring device 32 may obtain a numerical value of a color or irregularities of the peripheral surface of the workpiece W, or may obtain a numerical value of the intensity of light reflected from the peripheral surface. In order to make it easy to detect a change in the color, paint may be applied to the peripheral surface of the workpiece W in advance. Theoperation controller 25 determines a polishing end point of the workpiece W based on the numerical value (i.e., the surface condition of the periphery of the workpiece W) sent from the surface-condition monitoring device 32. - In the embodiment shown in
FIG. 8 , the chemical mechanical polishing apparatus includes amotor ammeter 33 as the polished-state monitoring device, which monitors an electric current supplied to thetable motor 18 that rotates the polishing table 3. A frictional force that acts between the workpiece W and thepolishing pad 2 changes as the peripheral surface of the workpiece W becomes smoother as a result of polishing. The change in the frictional force leads to a change in the electric current supplied to thetable motor 18. Themotor ammeter 33 measures the electric current that flows to thetable motor 18, and sends a measured value of the electric current to theoperation controller 25. Theoperation controller 25 determines a polishing end point of the workpiece W based on the measured value of the electric current (i.e., the surface condition of the periphery of the workpiece W) sent from themotor ammeter 33. -
FIG. 9 is a side view of a chemical mechanical polishing apparatus according to yet another embodiment, andFIG. 10 is a plan view of the chemical mechanical polishing apparatus shown inFIG. 9 . Anannular polishing pad 2 is used in this embodiment. An inner peripheral surface of theannular polishing pad 2 constitutes anannular polishing surface 2 a. Theannular polishing surface 2 a has an outwardly curved vertical cross-section. The polishing liquid is supplied onto an area located inside theannular polishing surface 2 a, and flows outwardly due to a centrifugal force until the polishing liquid reaches theannular polishing surface 2 a. Theannular polishing pad 2 can easily hold the polishing liquid on itsannular polishing surface 2 a, and can therefore reduce an amount of the polishing liquid used. -
FIG. 11 is a side view of a chemical mechanical polishing apparatus according to yet another embodiment, andFIG. 12 is a plan view of the chemical mechanical polishing apparatus shown inFIG. 11 . The construction and the operation of this embodiment, not particularly described here, are the same as those of the embodiment shown inFIGS. 1 and 2 , and duplicate descriptions thereof are omitted. In this embodiment, theair cylinder 14 is disposed more inwardly than the workpiece holder 11 (preferably along the radially inner side of the workpiece holder 11) in the radial direction of the polishing table 3 (and the polishing pad 2). InFIG. 11 , theair cylinder 14 is located above the polishing table 3 and thepolishing pad 2. Theair cylinder 14 may be located below the polishing table 3 and thepolishing pad 2. Theair cylinder 14 moves theservomotor 15, theworkpiece holder 11, and the workpiece W toward the center of thepolishing pad 2, thereby pressing the periphery of the workpiece W against theannular polishing surface 2 a. -
FIG. 13 is a plan view of an embodiment of a chemical mechanical polishing apparatus including a plurality of polishingheads 1, each of which is shown inFIGS. 11 and 12 . Theair cylinders 14 of the polishing heads 1 are located inside the polishing table 3 and thepolishing pad 2. Therefore, as can be seen inFIG. 13 , the overall width of the chemical mechanical polishing apparatus can be small. - The surface-
condition monitoring device 32 shown inFIG. 7 , and themotor ammeter 33 as another exemplary surface-condition monitoring device, shown inFIG. 8 , can be applied also to the embodiments shown inFIGS. 11 through 13 . Further, theannular polishing pad 2 shown inFIGS. 9 and 10 may be applied to the embodiments shown inFIGS. 11 through 13 . - In the above-described embodiments, the workpiece W, in its entirety, has a rectangular shape, and its periphery has an outwardly curved vertical cross-section. The chemical mechanical polishing apparatuses according to the above-described embodiments can be used not only for polishing of a workpiece having, in its entirety, a polygonal shape, but also for polishing of a workpiece having, in its entirety, a circular shape.
- The previous description of embodiments is provided to enable a person skilled in the art to make and use the present invention. Moreover, various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles and specific examples defined herein may be applied to other embodiments. Therefore, the present invention is not intended to be limited to the embodiments described herein but is to be accorded the widest scope as defined by limitation of the claims.
- The present invention is applicable to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish.
-
-
- 1 polishing head
- 2 polishing pad
- 2 a annular polishing surface
- 3 polishing table
- 5 polishing-liquid supply nozzle
- 11 workpiece holder
- 14 air cylinder
- 15 servomotor
- 18 table motor
- 20 linear guide
- 25 operation controller
- 27 base
- 29 positioning mechanism
- 32 surface-condition monitoring device
- 33 motor ammeter
- W workpiece
Claims (3)
Applications Claiming Priority (3)
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JP2014223292 | 2014-10-31 | ||
JP2014-223292 | 2014-10-31 | ||
PCT/JP2015/080823 WO2016068327A1 (en) | 2014-10-31 | 2015-10-30 | Chemical mechanical polishing device for polishing work piece |
Related Parent Applications (1)
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PCT/JP2015/080823 A-371-Of-International WO2016068327A1 (en) | 2014-10-31 | 2015-10-30 | Chemical mechanical polishing device for polishing work piece |
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US16/412,562 Continuation US11446784B2 (en) | 2014-10-31 | 2019-05-15 | Chemical mechanical polishing apparatus for polishing workpiece |
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US20170312880A1 true US20170312880A1 (en) | 2017-11-02 |
Family
ID=55857660
Family Applications (2)
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US15/520,515 Abandoned US20170312880A1 (en) | 2014-10-31 | 2015-10-30 | Chemical mechanical polishing apparatus for polishing workpiece |
US16/412,562 Active 2037-10-23 US11446784B2 (en) | 2014-10-31 | 2019-05-15 | Chemical mechanical polishing apparatus for polishing workpiece |
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US16/412,562 Active 2037-10-23 US11446784B2 (en) | 2014-10-31 | 2019-05-15 | Chemical mechanical polishing apparatus for polishing workpiece |
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US (2) | US20170312880A1 (en) |
JP (1) | JP6532884B2 (en) |
CN (1) | CN107073674B (en) |
WO (1) | WO2016068327A1 (en) |
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US20200192055A1 (en) * | 2017-08-28 | 2020-06-18 | Canon Kabushiki Kaisha | Driving apparatus |
US11660723B2 (en) * | 2018-04-13 | 2023-05-30 | Taikisha Ltd. | Automatic polishing system |
FR3137857A1 (en) * | 2022-07-18 | 2024-01-19 | Safran Aircraft Engines Mexico Sa De C.V. | System for electrode sharpening |
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Also Published As
Publication number | Publication date |
---|---|
JPWO2016068327A1 (en) | 2017-08-17 |
JP6532884B2 (en) | 2019-06-19 |
CN107073674B (en) | 2020-01-21 |
US11446784B2 (en) | 2022-09-20 |
CN107073674A (en) | 2017-08-18 |
WO2016068327A1 (en) | 2016-05-06 |
US20190262968A1 (en) | 2019-08-29 |
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