WO2015003468A1 - 封框胶及其制备方法和含该封框胶的显示装置 - Google Patents
封框胶及其制备方法和含该封框胶的显示装置 Download PDFInfo
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- WO2015003468A1 WO2015003468A1 PCT/CN2013/090927 CN2013090927W WO2015003468A1 WO 2015003468 A1 WO2015003468 A1 WO 2015003468A1 CN 2013090927 W CN2013090927 W CN 2013090927W WO 2015003468 A1 WO2015003468 A1 WO 2015003468A1
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- Prior art keywords
- acrylic resin
- weight percentage
- epoxy
- frame sealing
- manganese
- Prior art date
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- 239000003292 glue Substances 0.000 title claims abstract description 7
- 238000007789 sealing Methods 0.000 title claims abstract description 7
- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 35
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 34
- 239000002086 nanomaterial Substances 0.000 claims abstract description 27
- 239000011256 inorganic filler Substances 0.000 claims abstract description 14
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 239000007822 coupling agent Substances 0.000 claims abstract description 8
- 239000012766 organic filler Substances 0.000 claims abstract description 8
- 238000001029 thermal curing Methods 0.000 claims abstract description 4
- 239000000565 sealant Substances 0.000 claims description 36
- 239000002070 nanowire Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 26
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 20
- 239000000843 powder Substances 0.000 claims description 18
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 16
- 238000004132 cross linking Methods 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 239000012258 stirred mixture Substances 0.000 claims description 10
- 229910052786 argon Inorganic materials 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 2
- 229910001882 dioxygen Inorganic materials 0.000 claims description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims 3
- 229910052748 manganese Inorganic materials 0.000 claims 2
- 239000011572 manganese Substances 0.000 claims 2
- 239000012945 sealing adhesive Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- 239000002244 precipitate Substances 0.000 description 8
- 238000001556 precipitation Methods 0.000 description 6
- 239000013618 particulate matter Substances 0.000 description 5
- 238000013007 heat curing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229910052573 porcelain Inorganic materials 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 206010034960 Photophobia Diseases 0.000 description 1
- 206010047571 Visual impairment Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/062—Copolymers with monomers not covered by C08L33/06
- C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
Definitions
- Embodiments of the present invention relate to a frame sealant, a method of preparing the same, and a display device including the frame sealant. Background technique
- the liquid crystal display panel has been rapidly developed, and the liquid crystal display panel largely determines the brightness, contrast, color, viewing angle, and the like of the liquid crystal display device. Therefore, the manufacturing process of the liquid crystal display panel directly affects the quality of the display.
- the conventional liquid crystal display panel is generally formed by an array substrate and a color film substrate pair box.
- a schematic cross-sectional structure of the conventional liquid crystal panel includes an array substrate 1 , a color filter substrate 2 , and an array substrate 1 and color
- the sealant 3 is used as an adhesive to bond the two together to form a complete liquid crystal panel, and is sealed by the sealant 3 on the array substrate 1 and color.
- the inorganic filler in the existing sealant is generally composed of silica nanoparticles as a main component, and has a certain bond strength after curing, which can serve as a support, but the sealant is in the curing process and the array substrate.
- the inorganic filler containing silica nanoparticles as a main component can play a good supporting role, but does not prevent the particulate precipitates.
- the precipitated particulate precipitate easily causes an afterimage to appear on the screen, resulting in poor display.
- the embodiment of the invention aims to provide a frame sealant, a preparation method thereof and a curing method, and a display device sealed by the frame sealant, so as to solve the problem that the frame sealant cannot prevent the precipitation of particulate precipitates in the prior art, resulting in display. Bad problem. Summary of the invention
- the embodiment of the invention provides a frame sealant, which comprises an epoxy-acrylic resin, an acrylic resin, a heat curing agent, a coupling agent, a photoinitiator and an organic filler, and further comprises a ring and the ring
- the oxygen-acrylic resin undergoes a crosslinking reaction as a one-dimensional nanomaterial as an inorganic filler.
- the one-dimensional nanomaterial is an oxidized nanowire.
- the one-dimensional nanomaterial has a weight percentage of 10% to 20%.
- the oxidized nanowire has an outer diameter of 5 to 20 nm and a length of 50 to 500 nm.
- the embodiment of the invention further provides a display device comprising an array substrate and a color filter substrate, and the frame sealant is disposed between the array substrate and the color filter substrate.
- the embodiment of the invention further provides a preparation method of the above sealant, comprising:
- the kneaded mixture was defoamed.
- the one-dimensional nanomaterial is an oxidized nanowire or a carbon nanowire.
- the oxidized nanowires were produced by chemical vapor deposition using powdered powder and manganese oxide powder.
- the oxidized nanowires are produced by chemical vapor deposition using pulverized powder and manganese oxide powder, including:
- the powdered and manganese oxide powder having a weight ratio of 9:1 is continuously subjected to a mixed gas of oxygen and argon at a temperature of 600 to 700 ° C for 20 to 40 minutes to form the oxidized nanowire.
- the flow rate of argon gas is SOO - SSOcm ⁇ min- 1
- the flow rate of oxygen gas is 10 ⁇ 15 cm 3 'min -1 .
- FIG. 1 is a schematic structural view of a liquid crystal display panel in the prior art
- FIG. 2 is a schematic diagram of generating an interlaced network structure according to an embodiment of the present invention.
- FIG. 3 is a schematic view showing the fabrication of an oxidized nanowire according to an embodiment of the present invention.
- the frame sealant provided by the embodiment of the invention comprises an epoxy-acrylic resin, an acrylic resin, a heat curing agent, a coupling agent, a photoinitiator and an organic filler, and further comprises a one-dimensional nano material as an inorganic filler, the one The nano-materials can crosslink with the epoxy-acrylic resin to form a staggered network structure.
- the epoxy-acrylic resin has a cross-linking group, and the one-dimensional nano material is used as an inorganic filler. After the cross-linking reaction between the one-dimensional nano material and the epoxy-acrylic resin, a network-like staggered structure is formed, and the mesh is formed. The staggered structure prevents the precipitation of particulate matter and improves display quality.
- the epoxy-acrylic resin is an epoxy-acrylic resin known in the art and can be used for this purpose, and is commercially available, for example, from Showa Polymer Co., Ltd., Tianhong Yunda, Nanjing Jing Culture, and the like.
- the oxidized nanowire is preferably used as an inorganic filler, instead of the existing sealant with silica nanoparticles as a filler, because the cost of preparing the oxidized nanowire is low, and the production method can be promoted. application.
- the one-dimensional nanomaterial is not limited, and as long as it can be cross-linked with the epoxy-acrylic resin, a network-like staggered structure may be formed, for example, a carbon nanowire.
- the oxidized nanowire can be cross-linked with the epoxy-acrylic resin cross-linking group, as shown in FIG. 2, which is a schematic diagram of cross-linking reaction between the oxidized nanowire and the epoxy-acrylic resin cross-linking group.
- FIG. 2 is a schematic diagram of cross-linking reaction between the oxidized nanowire and the epoxy-acrylic resin cross-linking group.
- the oxidized nanowire is selected as the inorganic filler, and when ultraviolet curing is performed, when the framed rubber containing the oxidized nanowire is irradiated with ultraviolet light, the oxidized nanowire can act as a photocatalyst and accelerate the ring.
- the curing speed of the oxygen structure material, the ordinary oxidation material is the non-light sensitivity of the inorganic non-metal material, and the nanowire structure oxidation word migrates when the ultraviolet radiation is received, generates electricity, generates electricity, and then generates heat, and promotes the epoxy. - Curing of acrylic resin.
- the size of the oxidized nanowires is not too large or too small, and the size is too large to make it unevenly distributed in the sealant composition, and the adhesion of the sealant composition is lowered, and the size is too small, the price is relatively low.
- the outer diameter of the oxidized nanowire as the inorganic filler in the embodiment of the present invention is preferably 5 to 20 nm, and the length is preferably 50 to 500 nm.
- the oxidized nanowire is preferably prepared by using a re-edulating powder as a raw material, adding a certain amount of manganese oxide powder, and using a thermal evaporation chemical vapor deposition method. As shown in Figure 3, the powder is mixed with manganese oxide powder and evenly placed on the bottom of the porcelain boat. The cleaned silicon wafer is fixed on the top of the porcelain boat, and the temperature is set at 600 ⁇ 700 °C.
- a mixed gas of argon and oxygen is introduced, the flow rate of argon gas is 300 ⁇ 320cm 3 -mm 1 , the flow rate of oxygen is 10 ⁇ 15 cm ⁇ min" 1 , and the reaction is 20-40 minutes, and a large number of uniform one-dimensional lines can be obtained.
- the oxidized nanostructures are prepared to have a diameter of 5 to 20 nm and a length of 50 to 500 nm.
- the weight percentage of the oxidized nanowire as the inorganic filler is preferably 10 to 20%. Specifically, it may be 10%, 12%, 13% or 15%, 18%, 20%, preferably 15%.
- the components included in the sealant in the embodiment of the present invention may be as shown in the following table.
- the ratio ranges are only illustrative and are not limited, and are acceptable within the set range. of.
- the proportion of the precipitates can be reduced to 0%, and the original sealant with silica nanoparticles as the filler is precipitated.
- the defect ratio is generally about 2%, that is, the sealant in the embodiment of the present invention can better prevent the precipitation of particulate matter, improve the precipitate defects during the curing process, and further improve the display quality.
- Embodiment 2 The embodiment of the invention further provides a display device, which comprises an array substrate and a color filter substrate, and a frame sealant according to the first embodiment is disposed between the array substrate and the color filter substrate.
- the display device may be: a liquid crystal panel, an electronic paper, an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like, or any display product or component.
- the display device provided in the embodiment of the invention includes a one-dimensional nano material capable of cross-linking reaction with an epoxy-acrylic resin, a one-dimensional nano material and an epoxy, which are disposed between the color film substrate and the array substrate. - After the cross-linking reaction of the acrylic resin, a network-like staggered structure can be formed, and the network-like staggered structure can prevent the precipitation of particulate matter and improve the display quality.
- the third embodiment of the present invention further provides a method for preparing a sealant, as shown in FIG. 4, comprising:
- S401 A one-dimensional nano material as an inorganic filler is mixed with other components in the sealant to form a stirred mixture.
- a one-dimensional nanometer material having a weight percentage of 10% to 20% (specifically, 10%, 12%, 13% or 15%, 18%, 20%) and a weight percentage of 20% to 30% of the ring Oxygen-acrylic resin (specifically, 20%, 22%, 23% or 25%, 28%, 30%), 30% to 40% by weight of acrylic resin (specifically 30%, 32%, 33%) Or 35%, 38%, 40%), 10% to 20% by weight of heat curing agent (specifically, 10%, 12%, 13% or 15%, 18%, 20%), weight percentage 4 % ⁇ 5% coupling agent, 0.1% ⁇ 1% by weight of photoinitiator (specifically 0.1%, 0.2%, 0.3% or 0.5%, 0.8%, 1%) and 1% by weight ⁇ 10% organic filler (specifically, 1%, 2%, 3% or 5%, 8%, 10%), stirred at a temperature of 10 to 30 ° C for 30 to 60 minutes to form a stirred mixture.
- the one-dimensional nano material contained in the inorganic filler and the epoxy-acrylic resin in the sealant can undergo cross-linking reaction to form a staggered network structure, and the network-shaped interlaced structure can block the particulate matter. Precipitate to improve display quality.
- the process of forming the agitating mixture in the embodiment of the present invention may preferably be as follows: 25% by weight of epoxy-acrylic resin, 35% by weight of acrylic resin, and 5% by weight of epoxy-acrylic acid Resin, 15% by weight of heat curing agent, 4.5% by weight of coupling agent (4.5%), 0.5% by weight of photoinitiator, 5% by weight of organic filler, and weight percent 15% of the oxidation of nanowires in 10 ⁇ 30 Stir at a temperature of °C for 30 to 60 minutes to form a stirred mixture.
- the one-dimensional nanomaterial in the embodiment of the present invention is preferably an oxidized nanowire, and may of course be other one-dimensional nanomaterial, which is not limited herein, and may be, for example, a carbon nanowire.
- the method further comprises:
- the oxidized nanowires were produced by chemical vapor deposition using powdered powder and manganese oxide powder. The process of making the oxidized nanowires can be repeated. Referring to Figure 3, the powder with a weight ratio of 9:1 is mixed with the manganese oxide powder and evenly placed on the bottom of the porcelain boat. The cleaned silicon wafer is fixed on the porcelain boat. Above, the temperature is set at 600 ⁇ 700 °C, and a mixed gas of argon and oxygen is continuously supplied into the tube, and the reaction is carried out for 30 minutes to prepare an oxidized nanowire having a diameter of 5 to 20 nm and a length of 50 to 500 nm.
- the flow rate of the argon gas is controlled to be SOO - SSOcm ⁇ min - 1
- the flow rate of oxygen is lO - lS cn ⁇ min - 1 , and a large number of uniform one-dimensional linear oxidation atoms are obtained. structure.
- the stirred mixture obtained in S401 is kneaded at 30 to 50 °C.
- S403 Defoaming the mixture after kneading in S402.
- the mixture after kneading in S402 can be defoamed using a SIENOX defoaming machine.
- the inorganic filler comprises a one-dimensional nano material, which is mixed with other components in the sealant to form a stirring mixture, and is subjected to a sealing and defoaming process to form a sealant.
- a network-like staggered structure can be formed, and the network-like staggered structure can prevent the precipitation of the particulate matter, thereby improving the display quality.
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
Description
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CN103305133B (zh) | 2013-06-18 | 2015-02-18 | 北京京东方光电科技有限公司 | 一种封框胶及其制备方法、液晶显示面板和液晶显示器 |
CN103436203B (zh) * | 2013-07-08 | 2015-06-03 | 北京京东方光电科技有限公司 | 封框胶及其制备方法和显示装置 |
CN103785596A (zh) * | 2014-01-20 | 2014-05-14 | 北京京东方光电科技有限公司 | 一种封框胶的涂布方法、设备以及显示装置 |
CN103865407B (zh) * | 2014-02-12 | 2015-12-09 | 北京京东方光电科技有限公司 | 一种树脂组合物及液晶显示面板 |
CN103965821B (zh) * | 2014-04-30 | 2016-03-16 | 京东方科技集团股份有限公司 | 一种封框胶组合物及显示装置 |
CN108594541B (zh) * | 2018-05-04 | 2021-03-16 | 京东方科技集团股份有限公司 | 一种封框胶及其制备方法、液晶显示面板 |
CN110112323B (zh) | 2019-06-14 | 2022-05-13 | 京东方科技集团股份有限公司 | 一种oled封装结构、封装方法及显示器件 |
CN110903793A (zh) * | 2019-11-22 | 2020-03-24 | Tcl华星光电技术有限公司 | 封框胶材料和液晶显示面板 |
CN112904625B (zh) * | 2021-01-25 | 2022-09-27 | 北海惠科光电技术有限公司 | 导电边框胶的制备方法、导电边框胶及显示面板 |
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- 2013-12-30 WO PCT/CN2013/090927 patent/WO2015003468A1/zh active Application Filing
- 2013-12-30 US US14/386,491 patent/US20160251551A1/en not_active Abandoned
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CN102775921A (zh) * | 2011-07-21 | 2012-11-14 | 北京京东方光电科技有限公司 | 一种封框胶及其制备方法、以及一种液晶面板的制备方法 |
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CN103436203A (zh) * | 2013-07-08 | 2013-12-11 | 北京京东方光电科技有限公司 | 封框胶及其制备方法和显示装置 |
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