WO2014185047A1 - Dispositif électrique et procédé pour le fabriquer - Google Patents

Dispositif électrique et procédé pour le fabriquer Download PDF

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Publication number
WO2014185047A1
WO2014185047A1 PCT/JP2014/002488 JP2014002488W WO2014185047A1 WO 2014185047 A1 WO2014185047 A1 WO 2014185047A1 JP 2014002488 W JP2014002488 W JP 2014002488W WO 2014185047 A1 WO2014185047 A1 WO 2014185047A1
Authority
WO
WIPO (PCT)
Prior art keywords
case
terminal
substrate
electric device
accommodation space
Prior art date
Application number
PCT/JP2014/002488
Other languages
English (en)
Japanese (ja)
Inventor
渉 廣瀬
俊洋 林
Original Assignee
アンデン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アンデン株式会社 filed Critical アンデン株式会社
Priority to BR112015028192A priority Critical patent/BR112015028192A2/pt
Publication of WO2014185047A1 publication Critical patent/WO2014185047A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB

Definitions

  • This disclosure relates to an electrical device apparatus in which an electrical device is housed in a case and a method for manufacturing the electrical device.
  • an electrical device such as a semiconductor relay is accommodated in an accommodation space formed in the case, a potting agent is filled around the electrical device in the accommodation space, and an opening of the accommodation space is closed with a base
  • a potting agent is filled around the electrical device in the accommodation space, and an opening of the accommodation space is closed with a base
  • a rubber attachment member is attached to the case for vibration absorption, and the attachment member is engaged with a vehicle stay or the like.
  • the present disclosure aims to reduce the number of parts and the number of assembling steps in an electric device.
  • the electric device is made of rubber, and is housed in the housing space, a case having a bottomed cylindrical case portion having a mounting portion that engages with the mounted member, and a housing space. And a potting layer having a potting agent filled around the electric device in the accommodation space.
  • the electrical equipment includes a board, an electrical / electronic component mounted on the board, a terminal made of a conductive metal whose one end is bonded to the board and the other end projects outside the potting layer and is connected to the external terminal, Is provided.
  • the terminal and the case are coupled, and the electric device and the case are positioned in a state where the substrate and the electric / electronic component do not contact the case.
  • a potting agent is interposed between the electrical device and the case in the accommodation space.
  • the mounting portion and the case portion are integrally formed of rubber, it is possible to reduce the number of parts and the number of assembling steps while ensuring the vibration absorbing function and the function of accommodating the electric device.
  • the case is made of rubber, the interface between the case and the potting layer is easily peeled off.
  • the potting agent cannot enter the contact portion between the substrate and the case. Therefore, when the interface between the case and the potting layer is peeled off, a gap is generated between the case and the potting layer. Further, a gap is also generated between the substrate and the case, and there is a possibility that corrosion or a short circuit may occur due to moisture or metal foreign matter entering from the gap.
  • the substrate and the electrical / electronic component do not contact the case, the substrate and the electrical / electronic component are embedded in the potting layer. Therefore, the interface between the case and the potting layer is Even if moisture peels off from the gap between the case and the potting layer, the moisture or the like can be prevented from reaching the substrate and the electric / electronic component.
  • the terminal is made of metal, the interface between the terminal and the potting layer is difficult to peel off. Therefore, it is possible to prevent moisture and the like from reaching the substrate and the electric / electronic component through the interface between the terminal and the potting layer. it can.
  • the terminal in the electric device apparatus according to the first aspect, may have a notch, and the case may have a protrusion that meshes with the notch of the terminal. .
  • the terminal and the case may be coupled by fitting the notch and the protrusion.
  • the relative position between the electric device and the case can be reliably maintained until the potting agent is filled around the electric device and the potting layer is formed.
  • the case and the terminal include an engaging portion that restricts relative movement between the case and the electric device in a direction in which the electric device is removed from the accommodation space. You may prepare.
  • a case in the method for manufacturing an electrical device, a case is prepared that has a bottomed cylindrical case portion that is made of rubber and includes an attachment portion that engages with a member to be attached and an accommodation space.
  • an electric device is prepared that includes a substrate, an electric / electronic component mounted on the substrate, and a terminal made of a conductive metal having one end bonded to the substrate and the other end connected to an external terminal.
  • a terminal and a case are couple
  • a potting agent is filled around the electric device in the accommodation space to form a potting layer.
  • the electrical device apparatus according to the first aspect can be manufactured.
  • FIG. 2B is a sectional view taken along the line IIB-IIB in FIG. 2A. It is sectional drawing which shows the electric equipment apparatus which concerns on the 1st modification of one Embodiment of this indication. It is sectional drawing which shows the electric equipment apparatus which concerns on the 2nd modification of one Embodiment of this indication. It is a bottom view showing an electric equipment device concerning the 3rd modification of one embodiment of this indication.
  • FIG. 5B is a VB-VB sectional view of FIG. 5A. It is a bottom view showing an electric equipment device concerning the 4th modification of one embodiment of this indication.
  • FIG. 6B is a cross-sectional view taken along the line VIB-VIB of FIG. 6A.
  • the electric device apparatus of this embodiment is used for energization control of an electric device (not shown) mounted on a vehicle (not shown).
  • the electric device apparatus includes an electric device 1.
  • the electrical device 1 includes a substrate 11, a semiconductor relay 12 that is mounted on the substrate 11 and opens and closes an electric circuit, a capacitor 13 that is mounted on the substrate 11, and is mounted on the substrate 11 and electrically connected to the semiconductor relay 12.
  • the two terminals 14 and 15 are provided.
  • the semiconductor relay 12 and the capacitor 13 may be used as an example of the electric / electronic component of the present disclosure.
  • the first terminal 14 and the second terminal 15 are made of a conductive metal plate, and one end side is joined to the substrate 11 by soldering, and the other end side is connected to a vehicle side terminal (not shown) as an external terminal.
  • the 1st terminal 14 is connected to the electric equipment of a vehicle via a vehicle side terminal and wiring (not shown), and the 2nd terminal 15 is a vehicle side terminal and wiring (not shown). Connected to a storage battery (not shown).
  • the electrical equipment device includes a case 2 formed of rubber (for example, EPDM, NBR, CR).
  • the case 2 has an attachment portion 20 that engages with a stay 100 fixed to the vehicle, and a case portion 30 in which the electric device 1 is accommodated.
  • the mounting portion 20 has a mounting hole 21 into which the stay 100 is inserted.
  • the stay 100 may be used as an example of a mounted member that engages with the mounting portion 20.
  • the case portion 30 includes a cylindrical case side wall 31, a case bottom portion 32 that closes one end side of the case side wall 31, and an opening portion 30 a provided on the other end side of the case side wall 31, and has a bottomed cylindrical shape. ing.
  • a housing space 33 is provided inside the case portion 30, and the housing space 33 is opened at the opening 30 a of the case portion 30. That is, the accommodating space 33 is partitioned by the case side wall 31 and the case bottom 32.
  • the electrical device 1 is accommodated in the accommodation space 33.
  • a potting layer 4 that is a potting agent filled around the electric device 1 is formed. In other words, by forming the potting layer 4 in the accommodation space 33, the electric device 1 is fixed in the accommodation space.
  • the potting layer 4 is filled up to the vicinity of the opening in the case portion 30, and the entire area of the substrate 11, the semiconductor relay 12, and the capacitor 13 is embedded in the potting layer 4. Further, in the first terminal 14 and the second terminal 15, a portion bonded to the substrate 11 is embedded in the potting layer 4, and a portion far from the substrate 11 protrudes from the potting layer 4 to the outside.
  • FIG. 1C in order to clarify the range of the potting layer 4, the part of the potting layer 4 is shown by hatching.
  • the direction B in which the potting layer 4 exits from the accommodation space 33 in other words, the direction B from the case bottom 32 toward the opening 30 a is referred to as a removal direction B.
  • the case side wall 31 is a rectangular parallelepiped projecting into the accommodation space 33 and has a plate-like case first protrusion 34.
  • the case first protrusion 34 extends toward the opening 30 a, in other words, extends along the detaching direction B from the inner peripheral surface of the case side wall 31.
  • the first terminal 14 has a terminal first notch 141 that fits into the case first protrusion 34.
  • the first terminal 14 and the case 2 are joined by fitting the case first protrusion 34 and the terminal first notch 141.
  • the fitting portion between the case first protrusion 34 and the terminal first notch 141 is embedded in the potting layer 4.
  • electrical equipment 1 and case 2 are prepared, and then a positioning process and a potting process are performed.
  • the first terminal 14 and the case 2 are coupled by fitting the case first protrusion 34 and the terminal first notch 141.
  • the electric device 1 and the case 2 are positioned in a state where the substrate 11, the semiconductor relay 12, and the capacitor 13 are not in contact with the case side wall 31 and the case bottom 32.
  • the potting layer 4 is formed by filling a potting agent around the electric device 1 in the accommodation space 33.
  • the potting layer 4 is formed in a state where the substrate 11, the semiconductor relay 12 and the capacitor 13 are not in contact with the case sidewall 31 and the case bottom 32, the substrate 11, the semiconductor relay 12 and the capacitor 13, the case sidewall 31 and the case bottom 32 are formed.
  • the potting agent is surely filled between the substrate 11, the semiconductor relay 12, and the capacitor 13 are embedded in the potting layer 4.
  • attachment portion 20 and the case portion 30 are integrally formed of rubber, it is possible to reduce the number of parts and the number of assembling steps while securing the vibration absorbing function and the function of housing the electric device 1. it can.
  • the electrical device 1 is embedded in the potting layer 4 except for a part of the first terminal 14 and the second terminal 15, it is possible to prevent adhesion of moisture and the like to the substrate 11, the semiconductor relay 12, and the capacitor 13.
  • the base for closing the opening of the accommodation space 33 can be eliminated.
  • the potting agent is reliably filled between the substrate 11, the semiconductor relay 12 and the capacitor 13 and the case side wall 31 and the case bottom 32, and the substrate 11, the semiconductor relay 12 and the capacitor 13 are embedded in the potting layer 4. Become. Therefore, even if the interface between the case 2 and the potting layer 4 is peeled off and moisture enters from the gap between the case 2 and the potting layer 4, the moisture etc. reaches the substrate 11, the semiconductor relay 12 and the capacitor 13. Can be prevented.
  • first terminal 14 and the second terminal 15 are made of metal, the interface between the first terminal 14 and the second terminal 15 and the potting layer 4 is difficult to peel off. Therefore, it is possible to prevent moisture and the like from reaching the substrate 11, the semiconductor relay 12 and the capacitor 13 through the interface between the first terminal 14 and the second terminal 15 and the potting layer 4.
  • the case first protrusion 34 is provided on the case side wall 31 and the terminal first notch 141 is provided on the first terminal 14.
  • the notch is provided on the case side wall 31 to provide the first terminal. 14 may be provided, and the first terminal 14 and the case 2 may be coupled by fitting the notch portion of the case side wall 31 with the protrusion portion of the first terminal 14.
  • the case side wall 31 protrudes into the accommodation space 33 and extends from the inner peripheral surface of the case side wall 31 along the direction perpendicular to the detachment direction B.
  • a second protrusion 35 is further provided.
  • the first terminal 14 further includes a terminal second notch 142 that fits into the case second protrusion 35.
  • the case second protrusion 35 and the terminal second notch 142 may be used as an example of an engaging part that restricts relative movement of the case 2 and the electric device 1 in the detaching direction B.
  • the case side wall 34 communicates with the accommodation space 33 and is recessed from the inner peripheral surface of the case side wall 31 along the direction perpendicular to the detachment direction B.
  • a recess 36 is further provided.
  • the first terminal 14 further includes a terminal first protrusion 143 that fits into the case recess 36.
  • the case recessed part 36 and the terminal 1st protrusion part 143 may be used as an example of the said engaging part.
  • the first terminal 14 can be prevented from falling until the potting layer 4 is formed by the fitting of the case recess 36 and the terminal first protrusion 143. Further, the relative movement between the case 2 and the electric device 1 in which the electric device 1 faces in the detaching direction B is restricted by the fitting of the case recess 36 and the terminal first protrusion 143. Therefore, it is possible to reliably prevent the electric device 1 from coming out of the accommodation space 33 until the potting layer 4 is formed.
  • the case side wall 34 further includes a case groove portion 37 that is a rectangular parallelepiped space communicating with the accommodation space 33.
  • the first terminal 14 and the case 2 are coupled by inserting a part of the first terminal 14 into the case groove portion 37.
  • the first terminal 14 further has a terminal second protrusion 144 extending toward the case bottom 32.
  • the terminal second protrusion 144 is brought into contact with the inner peripheral surface of the case side wall 31 to prevent the first terminal 14 from falling before the potting layer 4 is formed.
  • the case side wall 34 further includes a case third protrusion 38
  • the first terminal 14 further includes a terminal hole 145. Have.
  • the case third protrusion 38 provided on the case 2 protrudes toward the case groove 37 in a direction perpendicular to the detaching direction B.
  • Two case third protrusions 38 are arranged along the detachment direction B.
  • Two terminal holes 145 provided in the first terminal 14 are arranged along the detachment direction B.
  • the case third projecting portion 38 and the terminal hole 145 may be used as examples of the engaging portion.
  • the first terminal 14 and the case 2 are coupled by inserting a part of the first terminal 14 into the case groove 37 and inserting the case third protrusion 38 into the terminal hole 145.
  • the first terminal 14 can be more reliably prevented from falling until the potting layer 4 is formed. Moreover, the relative position of the electric equipment 1 and the case 2 can be maintained more reliably.
  • the relative movement of the electrical device 1 between the case 2 and the electrical device 1 in the detaching direction B is restricted by the fitting of the case third protrusion 38 and the terminal hole 145. Therefore, it is possible to reliably prevent the electric device 1 from coming out of the accommodation space 33 until the potting layer 4 is formed.
  • the electric device 1 of the above embodiment includes a semiconductor relay 12 that opens and closes an electric circuit, and is used for energization control of an electric device for a vehicle.
  • the electric device 1 may include a microcomputer, a drive circuit, and the like and be used for operation control of the vehicle electric device.
  • the electrical device 1 may be used for energization control or operation control of electrical devices other than those for vehicles.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)

Abstract

　Selon l'invention, une partie de montage (20), qui s'engage dans un élément monté, et une partie de boîtier cylindrique munie d'un fond (30), formant un espace de logement (33), sont formées en caoutchouc en une seule pièce, le nombre de composants et d'heures-homme étant réduits. Une première saillie de boîtier (34) et une première découpe de borne (141) sont adaptées l'une à l'autre, et un appareil électrique (1) et un boîtier (2) sont placés dans un état dans lequel un substrat (11), un relais à semi-conducteurs (12) et un condensateur (13) ne sont pas en contact avec la surface périphérique intérieure d'une paroi latérale de boîtier (31). Le remplissage de l'espace de logement (33) par un agent d'enrobage et la formation d'une couche d'enrobage (4) dans cet état garantissent que l'agent d'enrobage remplisse l'espace entre la surface périphérique intérieure de la paroi latérale de boîtier (31) et le substrat (11), le relais à semi-conducteurs (12) et le condensateur (13), et noie le substrat (11), le relais à semi-conducteurs (12) et le condensateur (13) dans la couche d'enrobage (4). Cela permet d'éviter la corrosion et les courts-circuits provoqués par l'eau ou les corps métalliques étrangers.
PCT/JP2014/002488 2013-05-14 2014-05-12 Dispositif électrique et procédé pour le fabriquer WO2014185047A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
BR112015028192A BR112015028192A2 (pt) 2013-05-14 2014-05-12 dispositivo de equipamento elétrico, e, método para fabricar um dispositivo de equipamento elétrico

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-102415 2013-05-14
JP2013102415A JP5929827B2 (ja) 2013-05-14 2013-05-14 電気機器装置

Publications (1)

Publication Number Publication Date
WO2014185047A1 true WO2014185047A1 (fr) 2014-11-20

Family

ID=51898038

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/002488 WO2014185047A1 (fr) 2013-05-14 2014-05-12 Dispositif électrique et procédé pour le fabriquer

Country Status (3)

Country Link
JP (1) JP5929827B2 (fr)
BR (1) BR112015028192A2 (fr)
WO (1) WO2014185047A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245882U (fr) * 1985-09-06 1987-03-19
JPS62147352U (fr) * 1986-03-11 1987-09-17
JPS63276251A (ja) * 1987-05-08 1988-11-14 Mitsubishi Electric Corp 半導体装置
JPS6429875U (fr) * 1987-08-13 1989-02-22

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6245882U (fr) * 1985-09-06 1987-03-19
JPS62147352U (fr) * 1986-03-11 1987-09-17
JPS63276251A (ja) * 1987-05-08 1988-11-14 Mitsubishi Electric Corp 半導体装置
JPS6429875U (fr) * 1987-08-13 1989-02-22

Also Published As

Publication number Publication date
JP2014222736A (ja) 2014-11-27
JP5929827B2 (ja) 2016-06-08
BR112015028192A2 (pt) 2017-07-25

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