WO2014181913A1 - Dispositif barre de led destiné à l'éclairage - Google Patents

Dispositif barre de led destiné à l'éclairage Download PDF

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Publication number
WO2014181913A1
WO2014181913A1 PCT/KR2013/005268 KR2013005268W WO2014181913A1 WO 2014181913 A1 WO2014181913 A1 WO 2014181913A1 KR 2013005268 W KR2013005268 W KR 2013005268W WO 2014181913 A1 WO2014181913 A1 WO 2014181913A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
unit
circuit board
chip
light sources
Prior art date
Application number
PCT/KR2013/005268
Other languages
English (en)
Korean (ko)
Inventor
안종욱
박정환
박노준
Original Assignee
엘이디에스티 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘이디에스티 주식회사 filed Critical 엘이디에스티 주식회사
Publication of WO2014181913A1 publication Critical patent/WO2014181913A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Abstract

L'invention se rapporte à un dispositif d'éclairage, et en particulier à un dispositif barre de LED destiné à l'éclairage. Selon l'invention, un dispositif barre de LED destiné à l'éclairage comprend : une carte de circuit imprimé en forme de barre et allongée dans la direction linéaire ; une pluralité de sources de lumière à LED unitaires montées sur la carte de circuit imprimé et disposées de manière à créer une ligne ; une unité masque, formée sur la carte de circuit imprimé, qui entoure la pluralité de sources de lumière à LED unitaires ; ainsi qu'une substance luminescente de remplissage qui remplit l'espace interne de l'unité masque. Lesdites sources de lumière à LED unitaires sont des puces de LED qui se présentent sous la forme de puces nues montées sur la carte de circuit imprimé selon un montage direct sur carte.
PCT/KR2013/005268 2013-05-09 2013-06-14 Dispositif barre de led destiné à l'éclairage WO2014181913A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0052716 2013-05-09
KR1020130052716A KR101451012B1 (ko) 2013-05-09 2013-05-09 조명용 엘이디바 장치

Publications (1)

Publication Number Publication Date
WO2014181913A1 true WO2014181913A1 (fr) 2014-11-13

Family

ID=51867379

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2013/005268 WO2014181913A1 (fr) 2013-05-09 2013-06-14 Dispositif barre de led destiné à l'éclairage

Country Status (2)

Country Link
KR (1) KR101451012B1 (fr)
WO (1) WO2014181913A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102175096B1 (ko) 2018-11-14 2020-11-05 그린맥스 주식회사 Led 모듈의 병렬연결이 가능한 led 조명장치
KR102511973B1 (ko) 2021-07-21 2023-03-22 주식회사 이엠테크 방폭용 엘이디 조명등

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09114401A (ja) * 1995-10-18 1997-05-02 Takiron Co Ltd 発光表示体
JP2005018048A (ja) * 2003-05-30 2005-01-20 Nichia Chem Ind Ltd Ｌｅｄ表示器
US20060208271A1 (en) * 2005-03-21 2006-09-21 Lg Electronics Inc. Light source apparatus and fabrication method thereof
JP2007042307A (ja) * 2005-06-28 2007-02-15 Seiko Instruments Inc 照明装置及びこれを備える表示装置
KR20130014333A (ko) * 2011-07-28 2013-02-07 류웅렬 백색 ｌｅｄ 장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8440500B2 (en) * 2009-05-20 2013-05-14 Interlight Optotech Corporation Light emitting device
KR101236715B1 (ko) * 2012-08-28 2013-02-25 주식회사 썬엘이디 실리콘 성형 방식을 이용한 칩온보드댐을 포함한 ｌｅｄ 모듈의 제조방법 및 상기 제조방법에 의해 제조된 ｌｅｄ 모듈

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09114401A (ja) * 1995-10-18 1997-05-02 Takiron Co Ltd 発光表示体
JP2005018048A (ja) * 2003-05-30 2005-01-20 Nichia Chem Ind Ltd Ｌｅｄ表示器
US20060208271A1 (en) * 2005-03-21 2006-09-21 Lg Electronics Inc. Light source apparatus and fabrication method thereof
JP2007042307A (ja) * 2005-06-28 2007-02-15 Seiko Instruments Inc 照明装置及びこれを備える表示装置
KR20130014333A (ko) * 2011-07-28 2013-02-07 류웅렬 백색 ｌｅｄ 장치

Also Published As

Publication number Publication date
KR101451012B1 (ko) 2014-10-14

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