WO2014181913A1 - Led bar device for lighting - Google Patents

Led bar device for lighting Download PDF

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Publication number
WO2014181913A1
WO2014181913A1 PCT/KR2013/005268 KR2013005268W WO2014181913A1 WO 2014181913 A1 WO2014181913 A1 WO 2014181913A1 KR 2013005268 W KR2013005268 W KR 2013005268W WO 2014181913 A1 WO2014181913 A1 WO 2014181913A1
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WO
WIPO (PCT)
Prior art keywords
led
unit
circuit board
chip
light sources
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Application number
PCT/KR2013/005268
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French (fr)
Korean (ko)
Inventor
안종욱
박정환
박노준
Original Assignee
엘이디에스티 주식회사
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Publication of WO2014181913A1 publication Critical patent/WO2014181913A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to a lighting device, and more particularly to an LED device for lighting.
  • LED Light Emitting Diode
  • LED Light Emitting Diode
  • LED bar apparatuses having a plurality of LED light sources arranged in a line.
  • 1 shows an example of a conventional LED lighting device.
  • a conventional LED lighting device 10 is arranged in a line along a length direction of a printed circuit board (PCB) 11 extending in the form of a bar and the printed circuit board 11 to form a PCB ( 11, a plurality of LED packages 12 mounted thereon.
  • the LED package 12 is mounted on the PCB 11 using surface mount technology.
  • the LED package 12 generally includes a package body, an LED chip accommodated in the package body, and a resin encapsulating material filled in the package body to surround the LED chip.
  • the conventional technology in which the LED package is mounted on the PCB has a limitation in reducing the size of the LED lighting device due to the size occupied by the LED package itself, and there is a difficulty in efficiently arranging a plurality of LEDs.
  • a rod-shaped circuit board portion extending in a straight direction; A plurality of unit LED light sources mounted in the circuit board unit and aligned in a line; A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And a filling phosphor filled in the inner space of the mask part, wherein the unit LED light source is a bare chip type LED chip mounted on the circuit board part in a COB manner.
  • the circuit board part includes an aluminum-based base board, and a circuit part on which the plurality of unit LED light sources are mounted, forming a terminal part, and attached to the base substrate by an adhesive sheet, wherein the circuit part is sequentially stacked on the adhesive sheet.
  • a dielectric layer, a copper layer, and a nickel-silver alloy layer may be provided.
  • the mask part may be formed of a non-resin resin.
  • the plurality of LED chips may include at least one blue chip having a wavelength band of 440 to 475 nm; At least one blue green chip having a wavelength range of 500 to 510 nm, and the filling phosphor may be a phosphor that is excited by light emitted from the blue green chip and the blue green chip to emit light.
  • the rod-shaped circuit board portion extending in a straight direction; A plurality of unit LED light sources mounted in the circuit board unit and aligned in a line; A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And a filling phosphor filled in the inner space of the mask part, wherein the unit LED light source is an LED chip for lighting, wherein the LED chip device is provided in a bare chip type mounted on the circuit board part in a COB manner.
  • the device can be miniaturized and the mounting efficiency is dramatically improved.
  • FIG. 1 is a perspective view showing a conventional LED device for lighting.
  • FIG. 2 is a perspective view showing the LED device for illumination according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view showing a cross-sectional structure of the LED device for illumination shown in FIG.
  • FIG. 4 is an enlarged plan view of a part of the LED device for illumination shown in FIG.
  • the LED device for illumination 100 includes a circuit board unit 110, a plurality of unit LED light sources 120, a mask unit 130, Filled phosphor 140 is included. Now, each component constituting the LED device for illumination 100 will be described in detail.
  • the circuit board unit 110 includes a base substrate 111, an adhesive sheet 112, and a circuit unit 113.
  • the circuit board unit 110 will be described as having a typical MCPCB structure.
  • MCPCB is a substrate formed of a dielectric on a metal-based substrate and a circuit pattern formed thereon, and is widely used in a chip on board (COB) packaging technology.
  • the base substrate 111 is an aluminum based substrate. In the present embodiment, the base substrate 111 is described as being made of Al 1085. The base substrate 111 extends in a straight line in a thin rod shape.
  • a bonding sheet 112 is positioned on the base substrate 111.
  • the adhesive sheet 112 bonds the circuit unit 113 on the base substrate 111.
  • the circuit unit 113 is bonded to the base substrate 111 by the adhesive sheet 112 and formed.
  • the circuit portion 113 includes a dielectric layer 114, a first wiring portion 113a, a second wiring portion 113b, a plurality of third wiring portions 113c, and a photo solder resist (PSR).
  • PSR photo solder resist
  • the dielectric layer 114 is formed by being bonded on the adhesive sheet 112.
  • the dielectric layer 114 will be described as being made of BT resin.
  • the first wiring portion 113a is formed to extend on one side on the dielectric layer 114.
  • the first wiring portion 113a includes a copper layer 115 formed on the dielectric layer 114 and a nickel-silver alloy layer 116 formed on the copper layer 115.
  • the nickel-silver alloy layer may be formed by plating.
  • the second wiring portion 113b is formed to extend on the other side of the first wiring portion 113a on the other side of the dielectric layer 114. Since the cross-sectional structure of the first wiring portion 113a is the same as that of the first wiring portion 113a, a detailed description thereof will be omitted.
  • the plurality of third wiring units 113c are arranged in a line between the first wiring units 113a and the second wiring units 113b on the dielectric layer 114. Since the plurality of third wiring portions 113c are formed on the dielectric layer 114, and the cross-sectional structure thereof is the same as that of the first wiring portion 113a, a detailed description thereof will be omitted.
  • Each third wiring portion 113c functions as a chip pad on which the LED light source 120, which is an LED chip, is mounted.
  • the PSR printed layer 117 is formed over the circuit portion 113.
  • the PSR printed layer 117 includes the entirety of the plurality of third wiring portions 113c, the portion of the first wiring portion 113a adjacent to the plurality of third wiring portions 113c, and the second wiring portion 113b. It is not formed in the part adjacent to many 3rd wiring part 113c. Accordingly, the first exposed portion 113a1 is formed in the first wiring portion 113a, and the second exposed portion 113b1 is formed in the second wiring portion 113b.
  • Two first terminal portions 1162a and 1162b are formed in the first exposed portion 113a1 and are further extended to the outside of the side surface.
  • Two second terminal portions 1161a and 1161b are formed in the second exposed portion 113a2 and are further extended to the outside of the side surface.
  • the plurality of unit LED light sources 120 are bare chips. Each LED chip 120 is mounted on a plurality of third wiring units 113c serving as chip pads in a COB manner. Since the bare chip type LED chip 120 is directly mounted, the LED device 100 is dramatically miniaturized, and the mounting efficiency is also greatly increased.
  • the mask part 130 is fixed on the circuit part 113 by the adhesive sheet 118 to surround the plurality of LED light sources 120.
  • the plurality of LED light sources 120, the first exposed part 113a1, and the second exposed part 113a2 are exposed to the outside.
  • two first exposed grooves 132a and 132b exposing two first terminal portions 1162a and 1162b, and two exposing two second terminal portions 1161a and 1161b.
  • Second exposed grooves 131a and 131b are provided.
  • the filling phosphor 140 is filled in the internal space 110a of the mask unit 130.
  • the present invention to provide a multi-chip LED device having an excellent color rendering index, at least one blue chip having a wavelength range of 440 ⁇ 475nm; One or more bluish green chips having a wavelength band of 500 to 510 nm; And a phosphor 140 that is excited by and emits light by the blue green chip and the blue green chip.
  • the phosphor 140 may be a composite phosphor in which red, yellow, and green phosphors that emit red, yellow, and green light are mixed.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a lighting device and, specifically, to an LED bar device for lighting. According the present invention, provided is an LED bar device for lighting, comprising: a circuit board, of a bar shape, elongated in the linear direction; a plurality of unit LED light sources mounted on the circuit board and arranged in a line; a mask unit, formed on the circuit board, surrounding the plurality of unit LED light sources; and a filling phosphor filled in the internal space of the mask unit, wherein the unit LED light sources are LED chips in the form of bare chips mounted on the circuit board in a COB manner.

Description

조명용 엘이디바 장치LED device for lighting
본 발명은 조명장치에 관한 것으로서, 특히 조명용 엘이디바 장치에 관한 것이다.The present invention relates to a lighting device, and more particularly to an LED device for lighting.
엘이디(LED : Light Emitting Diode)는 기존의 광원에 비해 소형이고 소비전력이 적으며 반영구적인 수명을 갖고 있어서, 최근 다양한 형태의 조명장치로 응용되고 있다.LED (Light Emitting Diode) has a small size, low power consumption and a semi-permanent life compared to the existing light source, has recently been applied to various types of lighting devices.
엘이디 조명장치 중에는 다수 개의 엘이디 광원이 일렬로 정렬된 형태를 갖는 엘이디바(LED BAR) 장치가 있다. 도 1에는 종래의 엘이디바 조명장치의 일예가 도시되어 있다. 도 1을 참조하면, 종래의 엘이디바 조명장치(10)는 바 형태로 길게 연장된 인쇄회로기판(PCB)(11)과, 인쇄회로기판(11)의 길이방향을 따라서 일렬로 정렬되어서 PCB(11)에 장착된 다수의 엘이디 패키지(LED Package)(12)를 구비한다. LED 패키지(12)는 PCB(11)에 표면실장 기술을 이용하여 실장된다. LED 패키지(12)는 일반적으로 패키지 본체와 패키지 본체의 내부에 수용된 엘이디 칩(LED Chip)과 LED 칩을 감싸도록 패키지 본체 내부에 채워지는 수지 봉지재로 이루어진다. LED 패키지가 PCB에 실장되는 종래의 기술에서는 LED 패키지 자체가 차지하는 크기로 인해 엘이디바 조명장치의 크기를 줄이는데 한계가 있고, 다수의 LED를 효율적으로 어레이하는데 어려움이 있어서, 개선이 요구되고 있다.Among LED lighting apparatuses, there are LED bar apparatuses having a plurality of LED light sources arranged in a line. 1 shows an example of a conventional LED lighting device. Referring to FIG. 1, a conventional LED lighting device 10 is arranged in a line along a length direction of a printed circuit board (PCB) 11 extending in the form of a bar and the printed circuit board 11 to form a PCB ( 11, a plurality of LED packages 12 mounted thereon. The LED package 12 is mounted on the PCB 11 using surface mount technology. The LED package 12 generally includes a package body, an LED chip accommodated in the package body, and a resin encapsulating material filled in the package body to surround the LED chip. The conventional technology in which the LED package is mounted on the PCB has a limitation in reducing the size of the LED lighting device due to the size occupied by the LED package itself, and there is a difficulty in efficiently arranging a plurality of LEDs.
본 발명의 목적은 다수의 LED 광원이 일렬로 배치되도록 PCB에 실장된 조명용 엘이디바 장치를 제공하는 것이다. 본 발명의 다른 목적은 소형화가 가능한 조명용 엘이디 장치를 제공하는 것이다. 본 발명의 또 다른 목적은 LED 광원의 실장효율이 향상된 조명용 엘이디바 장치를 제공하는 것이다.It is an object of the present invention to provide an LED device for illumination mounted on a PCB such that a plurality of LED light sources are arranged in a row. Another object of the present invention is to provide an LED device for lighting that can be miniaturized. Still another object of the present invention is to provide a lighting LED device for improving the mounting efficiency of the LED light source.
상기한 본 발명의 목적을 달성하기 위하여 본 발명의 일 측면에 따르면,According to an aspect of the present invention to achieve the above object of the present invention,
직선방향으로 길게 연장된 막대 형상의 회로 기판부; 상기 회로 기판부에 장착되어서 일렬로 정렬되는 다수의 단위 엘이디 광원; 상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원을 둘러싸는 마스크부; 및 상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며, 상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩인 것을 특징으로 하는 조명용 엘이디바 장치가 제공된다.A rod-shaped circuit board portion extending in a straight direction; A plurality of unit LED light sources mounted in the circuit board unit and aligned in a line; A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And a filling phosphor filled in the inner space of the mask part, wherein the unit LED light source is a bare chip type LED chip mounted on the circuit board part in a COB manner.
상기 회로 기판부는 알루미늄 기반의 베이스 기판과, 상기 다수의 단위 엘이디 광원이 장착되고 단자부를 형성하며 상기 베이스 기판에 접착시트에 의해 부착되는 회로부를 구비하며, 상기 회로부는 상기 접착시트 위에 차례대로 적층된 유전체층, 구리층 및 니켈-은 합금층을 구비할 수 있다.The circuit board part includes an aluminum-based base board, and a circuit part on which the plurality of unit LED light sources are mounted, forming a terminal part, and attached to the base substrate by an adhesive sheet, wherein the circuit part is sequentially stacked on the adhesive sheet. A dielectric layer, a copper layer, and a nickel-silver alloy layer may be provided.
상기 마스크부는 비티레진으로 형성될 수 있다.The mask part may be formed of a non-resin resin.
상기 다수의 엘이디칩은 440 내지 475nm 파장대를 갖는 하나 이상의 청색칩; 500 내지 510nm 파장대를 갖는 하나 이상의 청녹색칩을 구비하며, 상기 충진 형광체는 상기 청녹색칩 및 청녹색칩으로 발광하는 빛에 의하여 여기되어 발광하는 형광체일 수 있다.The plurality of LED chips may include at least one blue chip having a wavelength band of 440 to 475 nm; At least one blue green chip having a wavelength range of 500 to 510 nm, and the filling phosphor may be a phosphor that is excited by light emitted from the blue green chip and the blue green chip to emit light.
본 발명에 의하면 앞서서 기재한 본 발명의 목적을 모두 달성할 수 있다. 구체적으로는, 직선방향으로 길게 연장된 막대 형상의 회로 기판부; 상기 회로 기판부에 장착되어서 일렬로 정렬되는 다수의 단위 엘이디 광원; 상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원을 둘러싸는 마스크부; 및 상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며, 상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩인 것을 특징으로 하는 조명용 엘이디바 장치가 제공되므로, 엘이디바 장치의 소형화 가능하고, 실장효율도 비약적으로 향상된다.According to the present invention, all the objects of the present invention described above can be achieved. Specifically, the rod-shaped circuit board portion extending in a straight direction; A plurality of unit LED light sources mounted in the circuit board unit and aligned in a line; A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And a filling phosphor filled in the inner space of the mask part, wherein the unit LED light source is an LED chip for lighting, wherein the LED chip device is provided in a bare chip type mounted on the circuit board part in a COB manner. The device can be miniaturized and the mounting efficiency is dramatically improved.
도 1은 종래의 조명용 엘이디바 장치를 도시한 사시도이다.1 is a perspective view showing a conventional LED device for lighting.
도 2는 본 발명의 일 실시예에 따른 조명용 엘이디바 장치를 도시한 사시도이다.2 is a perspective view showing the LED device for illumination according to an embodiment of the present invention.
도 3은 도 2에 도시된 조명용 엘이디바 장치의 횡단면 구조를 도시한 단면도이다.3 is a cross-sectional view showing a cross-sectional structure of the LED device for illumination shown in FIG.
도 4는 도 2에 도시된 조명용 엘이디바 장치의 일부를 확대하여 도시한 평면도이다.4 is an enlarged plan view of a part of the LED device for illumination shown in FIG.
이하, 도면을 참조하여 본 발명의 실시예를 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
도 2는 본 발명의 일 실시예에 따른 조명용 엘이디바 장치를 도시한 사시도이고, 도 3은 도 2에 도시된 조명용 엘이디바 장치의 횡단면 구조를 도시한 단면도이며, 도 4는 도 2에 도시된 조명용 엘이디바 장치의 일부를 확대하여 도시한 평면도이다. 도 2 내지 도 4를 참조하면, 본 발명의 일 실시예에 따른 조명용 엘이디바 장치(100)는 회로 기판부(110)와, 다수의 단위 엘이디 광원(120)과, 마스크부(130)와, 충진 형광체(140)를 포함한다. 이제, 조명용 엘이디바 장치(100)의 구성하는 각 구성요소를 상세히 설명한다.2 is a perspective view showing the LED device for lighting according to an embodiment of the present invention, Figure 3 is a cross-sectional view showing a cross-sectional structure of the LED device for lighting shown in Figure 2, Figure 4 is shown in FIG. An enlarged plan view of a part of an LED device for lighting. 2 to 4, the LED device for illumination 100 according to an embodiment of the present invention includes a circuit board unit 110, a plurality of unit LED light sources 120, a mask unit 130, Filled phosphor 140 is included. Now, each component constituting the LED device for illumination 100 will be described in detail.
회로 기판부(110)는 베이스 기판(111)과, 접착시트(112)와, 회로부(113)를 구비한다. 본 실시예에서는 회로 기판부(110)가 통상적인 MCPCB 구조를 갖는 것으로 설명한다. MCPCB는 금속 기반 기판에 유전체를 형성하고 그 위에 회로 패턴을 형성한 것으로서, COB(Chip on Board) 패키지 기술에서 널리 사용되고 있는 기판이다.The circuit board unit 110 includes a base substrate 111, an adhesive sheet 112, and a circuit unit 113. In this embodiment, the circuit board unit 110 will be described as having a typical MCPCB structure. MCPCB is a substrate formed of a dielectric on a metal-based substrate and a circuit pattern formed thereon, and is widely used in a chip on board (COB) packaging technology.
베이스 기판(111)은 알루미늄 기반 기판이다. 본 실시예에서는 베이스 기판(111)은 Al 1085로 이루어지는 것으로 설명한다. 베이스 기판(111)은 얇은 막대 형태로서 직선으로 길게 연장된다.The base substrate 111 is an aluminum based substrate. In the present embodiment, the base substrate 111 is described as being made of Al 1085. The base substrate 111 extends in a straight line in a thin rod shape.
접착시트(bonding sheet))(112)는 베이스 기판(111) 위에 위치한다. 접착시트(112)는 베이스 기판(111) 위에 회로부(113)를 접착시킨다.A bonding sheet 112 is positioned on the base substrate 111. The adhesive sheet 112 bonds the circuit unit 113 on the base substrate 111.
회로부(113)는 접착시트(112)에 의해 베이스 기판(111) 상에 접착되어 형성된다. 회로부(113)는 유전체층(114)과, 제1 배선부(113a)와, 제2 배선부(113b)와, 다수의 제3 배선부(113c)와, 포토솔더레지스트(PSR : Photo solder resist)인쇄층(117)을 구비한다.The circuit unit 113 is bonded to the base substrate 111 by the adhesive sheet 112 and formed. The circuit portion 113 includes a dielectric layer 114, a first wiring portion 113a, a second wiring portion 113b, a plurality of third wiring portions 113c, and a photo solder resist (PSR). The print layer 117 is provided.
유전체층(114)은 접착시트(112) 위에 접착되어서 형성된다. 본 실시예에서는 유전체층(114)이 비티레진(BT resin)으로 이루어지는 것으로 설명한다.The dielectric layer 114 is formed by being bonded on the adhesive sheet 112. In this embodiment, the dielectric layer 114 will be described as being made of BT resin.
제1 배선부(113a)는 유전체층(114) 상에서 일측에 길게 연장되어서 형성된다. 제1 배선부(113a)는 유전체층(114) 위에 형성되는 구리층(115)과, 구리층(115) 위에 형성된 니켈-은 합금층(116)을 구비한다. 니켈-은 합금층은 도금에 의해 형성될 수 있다. The first wiring portion 113a is formed to extend on one side on the dielectric layer 114. The first wiring portion 113a includes a copper layer 115 formed on the dielectric layer 114 and a nickel-silver alloy layer 116 formed on the copper layer 115. The nickel-silver alloy layer may be formed by plating.
제2 배선부(113b)는 유전체층(114) 상에서 제1 배선부(113a)의 반대편 타측에 길게 연장되어서 형성된다. 제1 배선부(113a)의 단면구조는 제1 배선부(113a)의 단면구조와 동일하므로 이에 대한 상세한 설명은 생략한다.The second wiring portion 113b is formed to extend on the other side of the first wiring portion 113a on the other side of the dielectric layer 114. Since the cross-sectional structure of the first wiring portion 113a is the same as that of the first wiring portion 113a, a detailed description thereof will be omitted.
다수의 제3 배선부(113c)는 유전체층(114) 상에서 제1 배선부(113a)와 제2 배선부(113b)의 사이에 일렬로 정렬되어서 위치한다. 다수의 제3 배선부(113c)는 유전체층(114) 상에 형성되며 그 단면구조는 제1 배선부(113a)의 단면구조와 동일하므로 이에 대한 상세한 설명은 생략한다. 각 제3 배선부(113c)는 엘이디칩(LED chip)인 엘이디 광원(120)이 장착되는 칩 패드로서 기능한다.The plurality of third wiring units 113c are arranged in a line between the first wiring units 113a and the second wiring units 113b on the dielectric layer 114. Since the plurality of third wiring portions 113c are formed on the dielectric layer 114, and the cross-sectional structure thereof is the same as that of the first wiring portion 113a, a detailed description thereof will be omitted. Each third wiring portion 113c functions as a chip pad on which the LED light source 120, which is an LED chip, is mounted.
PSR 인쇄층(117)은 회로부(113) 위에 형성된다. PSR 인쇄층(117)은 다수의 제3 배선부(113c) 전체와, 제1 배선부(113a)에서 다수의 제3 배선부(113c)와 인접하는 부분과, 제2 배선부(113b)에서 다수의 제3 배선부(113c)와 인접하는 부분에는 형성되는 않는다. 그에 따라, 제1 배선부(113a)에는 제1 노출부(113a1)이 형성되고, 제2 배선부(113b)에는 제2 노출부(113b1)가 형성된다. 제1 노출부(113a1)에는 측면 바깥쪽으로 더 확장되어서 노출된 2개의 제1 단자부(1162a, 1162b)가 형성된다. 제2 노출부(113a2)에는 측면 바깥쪽으로 더 확장되어서 노출된 2개의 제2 단자부(1161a, 1161b)가 형성된다.The PSR printed layer 117 is formed over the circuit portion 113. The PSR printed layer 117 includes the entirety of the plurality of third wiring portions 113c, the portion of the first wiring portion 113a adjacent to the plurality of third wiring portions 113c, and the second wiring portion 113b. It is not formed in the part adjacent to many 3rd wiring part 113c. Accordingly, the first exposed portion 113a1 is formed in the first wiring portion 113a, and the second exposed portion 113b1 is formed in the second wiring portion 113b. Two first terminal portions 1162a and 1162b are formed in the first exposed portion 113a1 and are further extended to the outside of the side surface. Two second terminal portions 1161a and 1161b are formed in the second exposed portion 113a2 and are further extended to the outside of the side surface.
다수의 단위 엘이디 광원(120)은 베어칩(bare chip) 형태의 엘이디칩이다. 각 엘이디칩(120)은 칩 패드 역할을 하는 다수의 제3 배선부(113c)에 각각 COB 방식으로 실장된다. 베어칩 형태의 엘이디칩(120)이 바로 장착되므로 엘이디바 장치(100)가 비약적으로 소형화되고, 실장효율도 크게 증가한다. The plurality of unit LED light sources 120 are bare chips. Each LED chip 120 is mounted on a plurality of third wiring units 113c serving as chip pads in a COB manner. Since the bare chip type LED chip 120 is directly mounted, the LED device 100 is dramatically miniaturized, and the mounting efficiency is also greatly increased.
마스크부(130)는 다수의 엘이디 광원(120)을 둘러싸도록 접착시트(118)에 의해 회로부(113) 위에 고정된다. 마스크부(130)는 내부 영역에는 다수의 엘이디 광원(120)과 제1 노출부(113a1)와, 제2 노출부(113a2)가 외부로 노출된다. 마스크부(130)의 바깥쪽에는 2개의 제1 단자부(1162a, 1162b)를 노출시키는 2개의 제1 노출 홈(132a, 132b)와, 2개의 제2 단자부(1161a, 1161b)를 노출시키는 2개의 제2 노출 홈(131a, 131b)이 마련된다.The mask part 130 is fixed on the circuit part 113 by the adhesive sheet 118 to surround the plurality of LED light sources 120. In the mask area 130, the plurality of LED light sources 120, the first exposed part 113a1, and the second exposed part 113a2 are exposed to the outside. Outside the mask portion 130, two first exposed grooves 132a and 132b exposing two first terminal portions 1162a and 1162b, and two exposing two second terminal portions 1161a and 1161b. Second exposed grooves 131a and 131b are provided.
충진 형광체(140)는 마스크부(130)의 내부 공간(110a)에 채워진다. The filling phosphor 140 is filled in the internal space 110a of the mask unit 130.
본 발명은 우수한 연색지수를 갖는 멀티 칩 방식의 엘이디바 장치를 제공하기 위하여, 440 내지 475nm 파장대를 갖는 하나 이상의 청색칩; 500 내지 510nm 파장대를 갖는 하나 이상의 청녹색칩; 및 상기 청녹색칩 및 청녹색칩으로 발광하는 빛에 의하여 여기되어 발광하는 형광체(140)를 포함한다. 여기에서 형광체(140)는 적색, 황색 및 녹색빛을 발광하는 적색, 황색 및 녹색 형광체가 혼합된 복합 형광체일 수 있다.The present invention to provide a multi-chip LED device having an excellent color rendering index, at least one blue chip having a wavelength range of 440 ~ 475nm; One or more bluish green chips having a wavelength band of 500 to 510 nm; And a phosphor 140 that is excited by and emits light by the blue green chip and the blue green chip. The phosphor 140 may be a composite phosphor in which red, yellow, and green phosphors that emit red, yellow, and green light are mixed.
이상 실시예를 통해 본 발명을 설명하였으나, 본 발명은 이에 제한되는 것은 아니다. 상기 실시예는 본 발명의 취지 및 범위를 벗어나지 않고 수정되거나 변경될 수 있으며, 본 기술분야의 통상의 기술자는 이러한 수정과 변경도 본 발명에 속하는 것임을 알 수 있을 것이다.Although the present invention has been described through the above embodiments, the present invention is not limited thereto. The above embodiments may be modified or changed without departing from the spirit and scope of the present invention, and those skilled in the art will recognize that such modifications and changes also belong to the present invention.

Claims (4)

  1. 직선방향으로 길게 연장된 막대 형상의 회로 기판부;A rod-shaped circuit board portion extending in a straight direction;
    상기 회로 기판부에 장착되어서 일렬로 정렬되는 다수의 단위 엘이디 광원;A plurality of unit LED light sources mounted in the circuit board unit and aligned in a line;
    상기 회로 기판부 상에 형성되며 상기 다수의 단위 엘이디 광원을 둘러싸는 마스크부; 및A mask part formed on the circuit board part and surrounding the plurality of unit LED light sources; And
    상기 마스크부 내부 공간에 채워진 충진 형광체를 포함하며,Filled phosphor filled in the inner space of the mask portion,
    상기 단위 엘이디 광원은 상기 회로 기판부에 COB 방식으로 실장되는 베어칩 형태의 엘이디칩인 것을 특징으로 하는 조명용 엘이디바 장치.The unit LED light source is a LED device for illumination, characterized in that the LED chip of the bare chip type mounted on the circuit board portion in the COB method.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 회로 기판부는 알루미늄 기반의 베이스 기판과, 상기 다수의 단위 엘이디 광원이 장착되고 단자부를 형성하며 상기 베이스 기판에 접착시트에 의해 부착되는 회로부를 구비하며,The circuit board unit includes an aluminum-based base substrate, a circuit unit to which the plurality of unit LED light sources are mounted, form a terminal unit, and be attached to the base substrate by an adhesive sheet.
    상기 회로부는 상기 접착시트 위에 차례대로 적층된 유전체층, 구리층 및 니켈-은 합금층을 구비하는 것을 특징으로 하는 조명용 엘이디바 장치.And the circuit part comprises a dielectric layer, a copper layer, and a nickel-silver alloy layer, which are sequentially stacked on the adhesive sheet.
  3. 청구항 1에 있어서,The method according to claim 1,
    상기 마스크부는 비티레진으로 형성되는 것을 특징으로 하는 조명용 엘이디바 장치.LED device for illumination, characterized in that the mask portion is formed of a non-resin resin.
  4. 청구항 1에 있어서,The method according to claim 1,
    상기 다수의 엘이디칩은 440 내지 475nm 파장대를 갖는 하나 이상의 청색칩; 500 내지 510nm 파장대를 갖는 하나 이상의 청녹색칩을 구비하며,The plurality of LED chips may include at least one blue chip having a wavelength band of 440 to 475 nm; One or more blue-green chips having a wavelength range of 500 to 510 nm,
    상기 충진 형광체는 상기 청녹색칩 및 청녹색칩으로 발광하는 빛에 의하여 여기되어 발광하는 형광체인 것을 특징으로 하는 조명용 엘이디바 장치.The filling phosphor is an LED device for illumination, characterized in that the phosphor is excited by the light emitted by the blue green chip and the blue green chip to emit light.
PCT/KR2013/005268 2013-05-09 2013-06-14 Led bar device for lighting WO2014181913A1 (en)

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