WO2014177102A3 - 封闭式电子平台的热控制系统 - Google Patents

封闭式电子平台的热控制系统 Download PDF

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Publication number
WO2014177102A3
WO2014177102A3 PCT/CN2014/078831 CN2014078831W WO2014177102A3 WO 2014177102 A3 WO2014177102 A3 WO 2014177102A3 CN 2014078831 W CN2014078831 W CN 2014078831W WO 2014177102 A3 WO2014177102 A3 WO 2014177102A3
Authority
WO
WIPO (PCT)
Prior art keywords
control system
micro
electronic platform
thermal control
heat exchange
Prior art date
Application number
PCT/CN2014/078831
Other languages
English (en)
French (fr)
Other versions
WO2014177102A2 (zh
Inventor
吴琼
景佰亨
王标华
李帅
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to US15/033,075 priority Critical patent/US20160299544A1/en
Priority to EP14791464.2A priority patent/EP3091826A4/en
Publication of WO2014177102A2 publication Critical patent/WO2014177102A2/zh
Publication of WO2014177102A3 publication Critical patent/WO2014177102A3/zh

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/02Tubular elements of cross-section which is non-circular
    • F28F1/022Tubular elements of cross-section which is non-circular with multiple channels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/206Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309Evaporators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318Condensers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

本发明公开了一种封闭式电子平台的热控制系统,包括两相互独立的换热腔室,每一换热腔室均具有进风口(10)和出风口(20),在每一换热腔室内各设有一换热器,两换热器通过导管连通形成工质的循环回路,换热器包括若干微槽道热毛细管(140)和两集流槽(80),若干微槽道热毛细管(140)相互并联设置在两集流槽(80)之间,两换热器的集流槽(80)通过导管连通,其中,微槽道热毛细管(140)具有若干相互平行设置的微槽道(141)。本发明提升了封闭式电子平台的热控制系统内工质流动的驱动能力,进而提高热控制系统的散热效率,从而提高电子平台运行的可靠性。
PCT/CN2014/078831 2013-12-31 2014-05-29 封闭式电子平台的热控制系统 WO2014177102A2 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/033,075 US20160299544A1 (en) 2013-12-31 2014-05-29 Thermal Control System for Closed Electronic Platform
EP14791464.2A EP3091826A4 (en) 2013-12-31 2014-05-29 Thermal control system for closed electronic platform

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310753812.9 2013-12-31
CN201310753812.9A CN104754917A (zh) 2013-12-31 2013-12-31 封闭式电子平台的热控制系统

Publications (2)

Publication Number Publication Date
WO2014177102A2 WO2014177102A2 (zh) 2014-11-06
WO2014177102A3 true WO2014177102A3 (zh) 2014-12-18

Family

ID=51844031

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/078831 WO2014177102A2 (zh) 2013-12-31 2014-05-29 封闭式电子平台的热控制系统

Country Status (4)

Country Link
US (1) US20160299544A1 (zh)
EP (1) EP3091826A4 (zh)
CN (1) CN104754917A (zh)
WO (1) WO2014177102A2 (zh)

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EP3286513B1 (en) * 2015-04-21 2019-09-04 Aavid Thermalloy, LLC Thermosiphon with multiport tube and flow arrangement
CN105813437B (zh) * 2016-03-21 2018-01-09 何祉欣 一种精密机床类密封式电控柜换热装置
CN106568334B (zh) * 2016-10-21 2019-05-31 东莞市丰瑞德温控技术有限公司 一种户外移动通信基站用高效微通道热交换系统
CN110145953A (zh) * 2019-05-28 2019-08-20 苏州科技大学 一种分离式微槽道毛细虹吸管式热交换机
US20210267099A1 (en) * 2020-02-21 2021-08-26 North American Electric, Inc. Vortex cooling tunnel in variable frequency drive
CN112135483B (zh) * 2020-09-23 2022-11-04 江西中绿北斗科技控股有限公司 一种车载定位用主板的散热通风结构
US11342731B1 (en) 2021-01-19 2022-05-24 Peopleflo Manufacturing, Inc. Electrical control panel with cooling system

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CN103307917A (zh) * 2013-06-27 2013-09-18 高诗白 一种微通道散热器
CN103307658A (zh) * 2012-03-13 2013-09-18 华为技术有限公司 一种热交换器及一种机柜
CN203340448U (zh) * 2013-06-05 2013-12-11 苏州昆拓热控系统股份有限公司 集成式通讯机柜系统
CN203349682U (zh) * 2013-05-15 2013-12-18 上海鹰峰电子科技有限公司 高性能复合结构超导平板热管

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CN203349682U (zh) * 2013-05-15 2013-12-18 上海鹰峰电子科技有限公司 高性能复合结构超导平板热管
CN203340448U (zh) * 2013-06-05 2013-12-11 苏州昆拓热控系统股份有限公司 集成式通讯机柜系统
CN103307917A (zh) * 2013-06-27 2013-09-18 高诗白 一种微通道散热器

Also Published As

Publication number Publication date
US20160299544A1 (en) 2016-10-13
EP3091826A4 (en) 2017-01-11
CN104754917A (zh) 2015-07-01
EP3091826A2 (en) 2016-11-09
WO2014177102A2 (zh) 2014-11-06

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