WO2014173101A1 - Heat dissipation system of communications device - Google Patents
Heat dissipation system of communications device Download PDFInfo
- Publication number
- WO2014173101A1 WO2014173101A1 PCT/CN2013/086258 CN2013086258W WO2014173101A1 WO 2014173101 A1 WO2014173101 A1 WO 2014173101A1 CN 2013086258 W CN2013086258 W CN 2013086258W WO 2014173101 A1 WO2014173101 A1 WO 2014173101A1
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- WO
- WIPO (PCT)
- Prior art keywords
- joint
- liquid
- cooling module
- heat dissipation
- bracket
- Prior art date
Links
- 238000004891 communication Methods 0.000 title claims abstract description 76
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 40
- 239000007788 liquid Substances 0.000 claims abstract description 113
- 238000001816 cooling Methods 0.000 claims abstract description 85
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000009434 installation Methods 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000013461 design Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
Definitions
- the present invention relates to communication technologies, and in particular, to a heat dissipation system for a communication device. Background technique
- the communication device usually includes a plurality of communication boards, and each communication board is plugged into a slot provided by the backplane of the machine. Since the size of the machine rejection is smaller and smaller, the integration degree of the communication device is higher and higher. Therefore, the heat dissipation problem of the communication device becomes one of the bottlenecks of the design of the single-board frame.
- conventional air cooling is used for the communication device, that is, the fan is used to cool the running communication device.
- the conventional fan cooling and cooling can no longer meet the heat dissipation requirements. At this time, the heat capacity and density are much larger than that of air. As a cooling medium, it has become the most efficient and feasible heat dissipation solution at present. It has broad application prospects and has been widely used in military, medical, and large computer fields.
- Embodiments of the present invention provide a heat dissipation system for a communication device that solves the problem of heat dissipation of a high power consumption and compact device without changing the layout of the device.
- embodiments of the present invention use the following technical solutions:
- a heat dissipation system for a communication device comprising an air cooling module and a liquid cooling module matched with an air cooling module mounting position, and a joint bracket fixed on the communication board, the liquid cooling module An external inlet pipe and a return pipe are connected to the end, and the liquid cooling module is internally provided with a first liquid path communicating with the inlet pipe and a second liquid path communicating with the return pipe, and the front end of the liquid cooling module is provided with a first joint communicating with the liquid passage and a second joint communicating with the second liquid passage, wherein the joint bracket is mounted with a third joint communicating with the water supply pipe on the communication board and a fourth joint communicating with the drain pipe on the communication board The first joint cooperates with the third joint, and the second joint cooperates with the fourth joint.
- first joint, the second joint, the third joint, and the fourth joint are quick connectors.
- the liquid cooling module includes a frame body matched with an installation position of the air cooling module and a liquid path body disposed in the frame body, and a rear end of the liquid path body is connected to the external water inlet pipe and back In the water pipe, the first liquid path and the second liquid path are provided inside the liquid path main body, and the first joint and the second joint are provided at the front end of the liquid path main body.
- the liquid cooling module further includes a mounting plate disposed in the frame, and the liquid path body is fixed on the frame by a mounting plate.
- the joint bracket is provided with a first mounting hole and a second mounting hole
- the first mounting hole is provided with a first sleeve, the first sleeve and the first mounting hole a gap fit, and one end of the first sleeve is connected to the third joint, the other end is connected to the water supply pipe of the communication board
- the second mounting hole is provided with a second sleeve, the second sleeve and the second The mounting hole is clearance-fitted, and one end of the second sleeve is connected to the fourth joint, and the other end is connected to the drain pipe of the communication board.
- the joint bracket includes a snap-fit upper bracket and a lower bracket, and the upper bracket and the lower bracket are connected by bolts.
- the fixing block fixed on the communication board is further included, and the joint bracket and the fixing block are connected by screws.
- the heat dissipation system of the communication device provided by the embodiment of the present invention, because the liquid cooling module and the air cooling module are installed in a matching position, when liquid cooling is required due to high power consumption of the communication board, only liquid cooling is required.
- the module is installed at the position of the air-cooling module, and is connected to the third joint on the joint bracket through the first joint on the liquid cooling module, and the second joint on the liquid cooling module is connected with the fourth joint on the joint bracket, so that the temperature is low.
- the water flows through the first liquid path, the first joint, and the third joint to the water inlet pipe on the communication board, and the high temperature water heated by the communication board passes through the drain pipe, the fourth joint, the second joint, and the second liquid path. And finally flow to the return pipe to discharge.
- the heat dissipation system of the present invention can flexibly configure the heat dissipation module according to the heat dissipation requirement of the actual communication board, and the high power consumption single board uses the liquid cooling module to dissipate heat, and the low power consumption single board uses the air cooling module to dissipate heat.
- the architecture of the device was not changed during use. Therefore, the heat dissipation system of the present invention solves the problem of heat dissipation of a high power consumption and compact communication device without changing the device architecture.
- FIG. 1 is a schematic structural diagram of a rear side of a heat dissipation system of a communication device according to an embodiment of the present invention
- FIG. 2 is a schematic structural diagram of an air cooling module according to an embodiment of the present invention
- FIG. 3 is a schematic structural diagram of a liquid cooling module according to an embodiment of the present invention.
- Figure 4 is a schematic view showing the internal structure of the liquid cooling module shown in Figure 3;
- FIG. 5 is a schematic structural view of a front side of a heat dissipation system of a communication device according to an embodiment of the present invention
- FIG. 6 is a schematic structural view of the connector bracket shown in FIG.
- Figure 7 is a cross-sectional view of the joint bracket shown in Figure 5;
- Figure 8 is a cross-sectional view of the quick connector shown in Figure 5. detailed description
- an embodiment of the present invention provides a heat dissipation system for a communication device, where the heat dissipation system includes an air cooling module 1, a liquid cooling module 2 matched with an air cooling module mounting position 10, and a fixed a joint bracket 5 on the communication board, an external inlet pipe 31 and a return pipe 32 are connected to the rear end of the liquid cooling module 2, and a first liquid path (not shown) connected to the inlet pipe 31 is provided inside the liquid cooling module 2.
- a second liquid passage (not shown) communicating with the return pipe 32, the front end of the liquid cooling module 2 is provided with a first joint 221 communicating with the first liquid passage and a second joint 222 communicating with the second liquid passage, and a joint
- a third joint 51 1 communicating with a water supply pipe (not shown) on the communication board 6 and a fourth joint 512 communicating with a drain pipe (not shown) on the communication board 6 are mounted on the bracket 5, and the first joint 221 is attached.
- the second joint 222 mates with the fourth joint 5 12 .
- the heat dissipation system of the communication device provided by the embodiment of the present invention, because the liquid cooling module 2 is matched with the air cooling module mounting position 10, when the liquid cooling is required due to the high power consumption of the communication board, only the liquid is needed.
- the cold module 2 is installed at the air-cooling module mounting position 10, and is connected to the third joint 51 1 on the joint bracket 5 through the first joint 22 1 on the liquid-cooling module 2, and the second joint 222 on the liquid-cooling module 2 Connected to the fourth joint on the joint bracket 5, so that the low temperature water flows through the first liquid passage, the first joint, and the third joint to the water inlet pipe on the communication board, and the high temperature water heated by the communication board passes through the drain pipe.
- This cycle achieves liquid cooling of the communication board.
- the communication board does not need liquid cooling, simply disconnect the interconnected connectors and install the air-cooling module. Therefore, the heat dissipation system of the present invention can flexibly configure the heat dissipation module according to the heat dissipation requirement of the actual communication board, and the high power consumption single board uses the liquid cooling module to dissipate heat, and the low power consumption single board uses the air cooling module to dissipate heat, during use. There is no change to the architecture of the device. Therefore, the heat dissipation system of the present invention solves the problem of heat dissipation of high power consumption and compact communication equipment without changing the equipment architecture.
- the communication board 6 is inserted into the slot provided by the machine backplane, and the air cooling module is coupled with the corresponding connector on the back panel of the device by the fan monitoring board.
- Embodiments design the liquid cooling module to match the air cooling module mounting position, more specifically By designing the liquid-cooled module and the air-cooling module to have the same structure, the two can be flexibly replaced, so the structure of the device is not changed.
- the air-cooling module 11 is a structure as shown in FIG. 2, and includes a frame 11 and a fan 12 disposed in the frame 11. Therefore, in the embodiment of the present invention, the liquid cooling module is designed to be the same with the frame 11. The shape and structure are the same.
- the first joint 221, the second joint 222, the third joint 511, and the fourth joint 512 in the above embodiment are quick connectors.
- the quick connector is used when the male connector is used with the female connector, as shown in Figure 8, which is a schematic diagram of the connection state between the male connector and the female connector.
- the first joint 801 and the first spring 802 are disposed in the male joint 80
- the second piston and the second spring 902 are disposed in the female joint 90
- the second piston includes a piston rod 9012 fixedly coupled to the bottom of the female joint 90 and axially Moving sleeve 9011.
- the first piston 801 in the male connector 80 is pressed against the top opening (left end) of the male connector 80 by the compressive elastic force of the first spring 802.
- the road is closed.
- the sleeve 9011 in the female connector 90 also abuts against the top opening (right end) of the female connector 90 by the compressive spring force of the second spring 902, at which time the head of the piston rod 9012 engages the sleeve to close the fluid path.
- the male connector 80 When the male connector 80 needs to be connected to the female connector 90, the male connector 80 is forcefully inserted into the female connector 90, and the sleeve 9011 of the second piston moves to the bottom of the female connector 90 under the action of the wall of the male connector 80, the piston rod The head of the 9012 protrudes from the right end of the sleeve, and the piston rod 9012 pushes the first piston 801 in the male joint 80 toward the bottom of the male joint 80, thereby achieving the conduction of the liquid passage.
- the male connector when it is necessary to disconnect the male connector from the female connector, the male connector is forcedly pulled out from the female connector, and the sleeve is returned by the resilience of the second spring under the resilience of the second spring. In the initial state, the liquid path is closed. There is no liquid leakage during the connection and disconnection of the male connector and the female connector.
- the first joint, the second joint, the third joint, and the fourth joint may both be a male joint or a female joint, as long as the first joint and the third joint are matched with each other, and the second joint And the fourth joint is a joint that cooperates with each other.
- FIG. 3 shows three pairs of first joints and second joints, so the liquid cooling module can be connected to three communication boards, but the invention is not limited to three pairs of first joints and second joints, and the specific pair thereof The number depends on the number of communication boards corresponding to a liquid cooling module.
- the arrangement of the quick connector in the liquid cooling module of the present invention may be lateral, It can also be vertical.
- the structure of the quick connector can be other types as long as there is no liquid leakage when plugging and disconnecting.
- the liquid cooling module 2 includes a frame 21 that cooperates with the air cooling module mounting position 10 and a liquid path main body 22 that is disposed in the frame body 21.
- the rear end of the liquid path main body 22 is connected to the external inlet water pipe 31 and the return water pipe. 32.
- the first liquid passage and the second liquid passage are provided inside the liquid passage main body 22, and the first joint 221 and the second joint 222 are provided at the front end of the liquid passage main body 22.
- the general machine rejection has a plurality of air-cooling module mounting positions as shown in Fig. 1.
- the process becomes complicated. Designing the same structure of the frame is relatively simple.
- the embodiment can design the frame section into a square shape, and only need to rotate 90. , it can be compatible with liquid cooling of horizontal plug-in and vertical plug-in communication boards.
- the liquid cooling module further includes a mounting plate 23 provided in the casing, and the liquid path main body 22 is fixed to the frame 21 by a mounting plate 23.
- a mounting plate 23 provided in the casing, and the liquid path main body 22 is fixed to the frame 21 by a mounting plate 23.
- the joint bracket 5 is provided with a first mounting hole and a second mounting hole
- the first mounting hole is provided with a first sleeve 521, a first sleeve 521 and a first The mounting hole is gap-fitted, and one end of the first sleeve 521 is connected to the third joint 511, and the other end is connected to the water supply pipe of the communication board
- the second mounting hole is provided with a second sleeve 522
- the second The sleeve 522 is clearance-fitted with the second mounting hole, and one end of the second sleeve 522 is connected to the fourth joint 512 and the other end is connected to the drain pipe of the communication board.
- the third joint and the fourth joint can be rotated in the respective mounting holes, resulting in less floating in the radial direction, reducing the tolerance effect of the joint design, and reducing the high cooperation of the quick joints. Precision requirements.
- the joint bracket includes a snap-fit upper bracket 531 and a lower bracket 532, and the upper bracket 531 and the lower bracket 532 are connected by bolts.
- a bolt hole 541 is disposed on the upper bracket 531
- a bolt hole 542 corresponding to the bolt hole 541 is disposed on the lower bracket 532, and bolts are bored in the bolt holes 541, 542 to realize the upper bracket 531 and the lower bracket 532. connection. This facilitates the design of the joint bracket and the mounting of the sleeve.
- the heat dissipation system of the present invention further includes a fixing block fixed to the communication board, and the joint bracket and the fixing block are connected by screws. In this way, the connector bracket and the communication board are detachably connected. When the communication board needs to be liquid-cooled, the connector bracket is mounted on the communication board, otherwise it is removed, which is favorable for air-cooling when hot air is cooled. Exchange.
- the liquid path main body in the above embodiment may also be designed as a hose with only a quick connector, and the hose is fixed on the frame of the liquid cooling module.
- the communication is performed.
- the quick connector on the board can communicate with the quick connector on the hose to achieve liquid cooling of the high power communication board.
Abstract
Disclosed is a heat dissipation system of a communications system, so as to solve a heat dissipation problem of a large-power-consuming and compact communications device without changing a device layout. The present invention relates to communications technologies. The heat dissipation system of the present invention comprises: an air cooling module, a liquid cooling module matching a mounting position of the air cooling module, and a joint bracket fixed on a communications board. A rear end of the liquid cooling module is connected with an external water inlet pipe and a return pipe, a first liquid pipeline communicated with the water inlet pipe and a second liquid pipeline communicated with the return pipe are disposed in the liquid cooling module, a front end of the liquid cooling module is provided with a first joint communicated with the first liquid pipeline and a second joint communicated with the second liquid pipeline, a third joint communicated with a water supply pipe on the communications board and a fourth joint communicated with a water drain pipe on the communications board are mounted on the joint bracket, the first joint matches the third joint, and the second joint matches the fourth joint. The present invention is applied to perform heat dissipation on a communications device.
Description
通信设备的散热系统 本申请要求于 2013 年 04 月 23 日提交中国专利局、 申请号为 201310143252.5、 发明名称为 "通信设备的散热系统" 的中国专利申请 的优先权, 其全部内容通过引用结合在本申请中。 技术领域 The present invention claims priority to Chinese Patent Application No. 201310143252.5, entitled "Dissipation System for Communication Equipment", filed on April 23, 2013, the entire contents of which are incorporated herein by reference. In this application. Technical field
本发明涉及通信技术, 尤其涉及一种通信设备的散热系统。 背景技术 The present invention relates to communication technologies, and in particular, to a heat dissipation system for a communication device. Background technique
随着通信行业的迅速发展, 信息服务需求的日益膨胀, 网络运营商为满 足不断增长的客户需求, 需添置越来越多的设备, 但是由于机房安装空间的 限制, 通信设备密度越来越高, 设备的尺寸越来越小, 但设备功率越来越高, 因此如何解决高功耗、 紧凑型设备散热问题, 成为通信设备设计中噬待解决 的问题。 With the rapid development of the communication industry and the increasing demand for information services, network operators need to add more and more equipment to meet the growing needs of customers. However, due to the limitation of the installation space of the equipment room, the density of communication equipment is getting higher and higher. The size of the device is getting smaller and smaller, but the power of the device is getting higher and higher. Therefore, how to solve the heat dissipation problem of the high-power and compact device has become a problem to be solved in the design of the communication device.
目前通信设备通常包括多个通信单板, 各个通信单板插接在机拒中背板 提供的插槽中, 由于机拒的尺寸越来越小, 而通信设备的集成度越来越高, 因此对通信设备的散热问题成为单板插框设计的瓶颈之一。 现有技术中对通 信设备釆用传统的风冷, 即釆用风扇对运行中的通信设备进行冷却。 但随着 设备集成度越来越高, 发热功耗持续增大, 传统的风扇冷却降温已不能满足 散热需求。 此时, 热容和密度远大于空气的液体, 作为冷却介质, 逐步成为 当前最高效和可行的散热解决方案, 有着广阔的应用前景, 在军工、 医疗、 大型计算机领域已经得到广泛应用。 At present, the communication device usually includes a plurality of communication boards, and each communication board is plugged into a slot provided by the backplane of the machine. Since the size of the machine rejection is smaller and smaller, the integration degree of the communication device is higher and higher. Therefore, the heat dissipation problem of the communication device becomes one of the bottlenecks of the design of the single-board frame. In the prior art, conventional air cooling is used for the communication device, that is, the fan is used to cool the running communication device. However, as device integration becomes higher and higher, the heating power consumption continues to increase, and the conventional fan cooling and cooling can no longer meet the heat dissipation requirements. At this time, the heat capacity and density are much larger than that of air. As a cooling medium, it has become the most efficient and feasible heat dissipation solution at present. It has broad application prospects and has been widely used in military, medical, and large computer fields.
然而现有的液冷系统一般釆用将软管布置在单板的前面板, 通过液体在 软管中流通来实现对通信设备的冷却, 但这会影响设备走线和设备架构。 发明内容 However, existing liquid cooling systems typically use a hose placed on the front panel of the veneer to allow cooling of the communication device by circulating the liquid through the hose, but this can affect device routing and equipment architecture. Summary of the invention
本发明的实施例提供一种通信设备的散热系统, 在不改变设备布局的前 提下解决高功耗、 紧凑型设备散热的问题。
为达到上述目的, 本发明的实施例釆用如下技术方案: Embodiments of the present invention provide a heat dissipation system for a communication device that solves the problem of heat dissipation of a high power consumption and compact device without changing the layout of the device. In order to achieve the above object, embodiments of the present invention use the following technical solutions:
一方面, 提供了一种通信设备的散热系统, 该散热系统包括风冷模块和 与风冷模块安装位相配合的液冷模块以及固定在通信单板上的接头支架, 所 述液冷模块的后端连接有外接进水管和回水管, 所述液冷模块的内部设有与 进水管连通的第一液路和与回水管连通的第二液路, 所述液冷模块的前端设 有与第一液路连通的第一接头和与第二液路连通的第二接头, 接头支架上安 装有与通信单板上供水管连通的第三接头和与通信单板上排水管连通的第四 接头, 第一接头与第三接头相配合, 第二接头与第四接头相配合。 In one aspect, a heat dissipation system for a communication device is provided, the heat dissipation system comprising an air cooling module and a liquid cooling module matched with an air cooling module mounting position, and a joint bracket fixed on the communication board, the liquid cooling module An external inlet pipe and a return pipe are connected to the end, and the liquid cooling module is internally provided with a first liquid path communicating with the inlet pipe and a second liquid path communicating with the return pipe, and the front end of the liquid cooling module is provided with a first joint communicating with the liquid passage and a second joint communicating with the second liquid passage, wherein the joint bracket is mounted with a third joint communicating with the water supply pipe on the communication board and a fourth joint communicating with the drain pipe on the communication board The first joint cooperates with the third joint, and the second joint cooperates with the fourth joint.
在第一种可能的实现方式中, 所述第一接头、 第二接头、 第三接头和第 四接头为快接接头。 In a first possible implementation, the first joint, the second joint, the third joint, and the fourth joint are quick connectors.
在第二种可能的实现方式中, 所述液冷模块包括与风冷模块安装位相配 合的框体和设在框体内的液路主体, 液路主体的后端连接所述外接进水管和 回水管, 所述液路主体的内部设有所述第一液路和第二液路, 所述液路主体 的前端设有所述第一接头和第二接头。 In a second possible implementation manner, the liquid cooling module includes a frame body matched with an installation position of the air cooling module and a liquid path body disposed in the frame body, and a rear end of the liquid path body is connected to the external water inlet pipe and back In the water pipe, the first liquid path and the second liquid path are provided inside the liquid path main body, and the first joint and the second joint are provided at the front end of the liquid path main body.
在第三种可能的实现方式中, 所述液冷模块还包括设在所述框体内的安 装板, 所述液路主体通过安装板固定在所述框体上。 In a third possible implementation, the liquid cooling module further includes a mounting plate disposed in the frame, and the liquid path body is fixed on the frame by a mounting plate.
在第四种可能的实现方式中, 所述接头支架上设有第一安装孔和第二安 装孔, 所述第一安装孔内设有第一套筒, 第一套筒与第一安装孔间隙配合, 且第一套筒的一端与第三接头连接、 另一端与通信单板的供水管连接, 所述 第二安装孔内设有第二套筒, 所述第二套筒与第二安装孔间隙配合, 且第二 套筒的一端与第四接头连接、 另一端与通信单板的排水管连接。 In a fourth possible implementation, the joint bracket is provided with a first mounting hole and a second mounting hole, and the first mounting hole is provided with a first sleeve, the first sleeve and the first mounting hole a gap fit, and one end of the first sleeve is connected to the third joint, the other end is connected to the water supply pipe of the communication board, and the second mounting hole is provided with a second sleeve, the second sleeve and the second The mounting hole is clearance-fitted, and one end of the second sleeve is connected to the fourth joint, and the other end is connected to the drain pipe of the communication board.
在第五种可能的实现方式中, 所述接头支架包括相扣合的上部支架和下 部支架, 所述上部支架和下部支架通过螺栓连接。 In a fifth possible implementation, the joint bracket includes a snap-fit upper bracket and a lower bracket, and the upper bracket and the lower bracket are connected by bolts.
在第六种可能的实现方式中, 还包括固定在通信单板上的固定块, 所述 接头支架和所述固定块通过螺钉连接。 In a sixth possible implementation, the fixing block fixed on the communication board is further included, and the joint bracket and the fixing block are connected by screws.
本发明实施例提供的通信设备的散热系统, 由于液冷模块与风冷模块安 装位相配合, 因此当因通信单板功耗高而需要对其实施液冷时, 只需将液冷
模块安装在风冷模块的位置, 并通过液冷模块上的第一接头与接头支架上的 第三接头相连接, 液冷模块上的第二接头与接头支架上的第四接头连接, 这 样低温水便经过第一液路、 第一接头、 第三接头流向通信单板上的进水管, 经通信单板加热后的高温水再经排水管、 第四接头、 第二接头、 第二液路并 最终流向回水管排出。 如此循环便实现了对通信单板的液冷冷却。 而当通信 单板不需要液冷时, 只需将相互连接的接头断开连接, 安装上风冷模块即可。 因此, 本发明的散热系统可根据实际通信单板的散热需求灵活配置散热模块, 功耗高的单板釆用液冷模块散热, 功耗低的单板釆用风冷模块散热。 在使用 过程中没有改变设备的架构。 因此本发明的散热系统在不改变设备架构的前 提下解决了高功耗、 紧凑型通信设备散热的问题。 附图说明 The heat dissipation system of the communication device provided by the embodiment of the present invention, because the liquid cooling module and the air cooling module are installed in a matching position, when liquid cooling is required due to high power consumption of the communication board, only liquid cooling is required. The module is installed at the position of the air-cooling module, and is connected to the third joint on the joint bracket through the first joint on the liquid cooling module, and the second joint on the liquid cooling module is connected with the fourth joint on the joint bracket, so that the temperature is low. The water flows through the first liquid path, the first joint, and the third joint to the water inlet pipe on the communication board, and the high temperature water heated by the communication board passes through the drain pipe, the fourth joint, the second joint, and the second liquid path. And finally flow to the return pipe to discharge. This cycle achieves liquid cooling of the communication board. When the communication board does not need liquid cooling, it is only necessary to disconnect the interconnected connectors and install the upper air cooling module. Therefore, the heat dissipation system of the present invention can flexibly configure the heat dissipation module according to the heat dissipation requirement of the actual communication board, and the high power consumption single board uses the liquid cooling module to dissipate heat, and the low power consumption single board uses the air cooling module to dissipate heat. The architecture of the device was not changed during use. Therefore, the heat dissipation system of the present invention solves the problem of heat dissipation of a high power consumption and compact communication device without changing the device architecture. DRAWINGS
为了更清楚地说明本发明实施例或现有技术中的技术方案, 下面将对实 施例或现有技术描述中所需要使用的附图作简单地介绍, 显而易见地, 下面 描述中的附图仅仅是本发明的一些实施例, 对于本领域普通技术人员来讲, 在不付出创造性劳动的前提下, 还可以根据这些附图获得其他的附图。 In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any creative work.
图 1为本发明实施例提供的通信设备的散热系统的后侧结构示意图; 图 2为本发明实施例提供的风冷模块的结构示意图; 1 is a schematic structural diagram of a rear side of a heat dissipation system of a communication device according to an embodiment of the present invention; FIG. 2 is a schematic structural diagram of an air cooling module according to an embodiment of the present invention;
图 3为本发明实施例提供的液冷模块的结构示意图; 3 is a schematic structural diagram of a liquid cooling module according to an embodiment of the present invention;
图 4为图 3所示液冷模块的内部结构示意图; Figure 4 is a schematic view showing the internal structure of the liquid cooling module shown in Figure 3;
图 5为本发明实施例提供的通信设备的散热系统的前侧结构示意图; 图 6为图 5所示接头支架的结构示意图; 5 is a schematic structural view of a front side of a heat dissipation system of a communication device according to an embodiment of the present invention; FIG. 6 is a schematic structural view of the connector bracket shown in FIG.
图 7为图 5所示接头支架的剖视图; Figure 7 is a cross-sectional view of the joint bracket shown in Figure 5;
图 8为图 5所示快接接头的剖视图。 具体实施方式 Figure 8 is a cross-sectional view of the quick connector shown in Figure 5. detailed description
下面将结合本发明实施例中的附图, 对本发明实施例中的技术方案进行 清楚、 完整地描述, 显然, 所描述的实施例仅仅是本发明一部分实施例, 而
不是全部的实施例。 基于本发明中的实施例, 本领域普通技术人员在没有作 出创造性劳动的前提下所获得的所有其他实施例, 都属于本发明保护的范围。 The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and Not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
如图 1-图 5所示, 本发明实施例提供了一种通信设备的散热系统, 该散 热系统包括风冷模块 1、 与风冷模块安装位 1 0相配合的液冷模块 2和固定在 通信单板上的接头支架 5 , 液冷模块 2的后端连接有外接进水管 31和回水管 32 , 液冷模块 2的内部设有与进水管 31连通的第一液路(未图示)和与回水 管 32连通的第二液路(未图示), 液冷模块 2的前端设有与第一液路连通的 第一接头 221和与第二液路连通的第二接头 222 ,接头支架 5上安装有与通信 单板 6上供水管(未图示)连通的第三接头 51 1和与通信单板 6上排水管(未 图示)连通的第四接头 512 , 第一接头 221与第三接头 51 1相配合, 第二接头 222与第四接头 5 12相配合。 As shown in FIG. 1 to FIG. 5, an embodiment of the present invention provides a heat dissipation system for a communication device, where the heat dissipation system includes an air cooling module 1, a liquid cooling module 2 matched with an air cooling module mounting position 10, and a fixed a joint bracket 5 on the communication board, an external inlet pipe 31 and a return pipe 32 are connected to the rear end of the liquid cooling module 2, and a first liquid path (not shown) connected to the inlet pipe 31 is provided inside the liquid cooling module 2. And a second liquid passage (not shown) communicating with the return pipe 32, the front end of the liquid cooling module 2 is provided with a first joint 221 communicating with the first liquid passage and a second joint 222 communicating with the second liquid passage, and a joint A third joint 51 1 communicating with a water supply pipe (not shown) on the communication board 6 and a fourth joint 512 communicating with a drain pipe (not shown) on the communication board 6 are mounted on the bracket 5, and the first joint 221 is attached. Cooperating with the third joint 51 1 , the second joint 222 mates with the fourth joint 5 12 .
本发明实施例提供的通信设备的散热系统, 由于液冷模块 2 与风冷模块 安装位 1 0相配合, 因此当因通信单板功耗高而需要对其实施液冷时, 只需将 液冷模块 2安装在风冷模块安装位 1 0 , 并通过液冷模块 2上的第一接头 22 1 与接头支架 5上的第三接头 51 1相连接, 液冷模块 2上的第二接头 222与接 头支架 5 上的第四接头连接, 这样低温水便经过第一液路、 第一接头、 第三 接头流向通信单板上的进水管, 经通信单板加热后的高温水再经排水管、 第 四接头、 第二接头、 第二液路并最终流向回水管排出。 如此循环便实现了对 通信单板的液冷冷却。 而当通信单板不需要液冷时, 只需将相互连接的接头 断开连接, 安装上风冷模块即可。 因此, 本发明的散热系统可根据实际通信 单板的散热需求灵活配置散热模块, 功耗高的单板釆用液冷模块散热, 功耗 低的单板釆用风冷模块散热, 在使用过程中没有改变设备的架构。 因此本发 明的散热系统在不改变设备架构的前提下解决了高功耗、 紧凑型通信设备散 热的问题。 The heat dissipation system of the communication device provided by the embodiment of the present invention, because the liquid cooling module 2 is matched with the air cooling module mounting position 10, when the liquid cooling is required due to the high power consumption of the communication board, only the liquid is needed. The cold module 2 is installed at the air-cooling module mounting position 10, and is connected to the third joint 51 1 on the joint bracket 5 through the first joint 22 1 on the liquid-cooling module 2, and the second joint 222 on the liquid-cooling module 2 Connected to the fourth joint on the joint bracket 5, so that the low temperature water flows through the first liquid passage, the first joint, and the third joint to the water inlet pipe on the communication board, and the high temperature water heated by the communication board passes through the drain pipe. The fourth joint, the second joint, the second liquid passage and finally flow to the return water pipe. This cycle achieves liquid cooling of the communication board. When the communication board does not need liquid cooling, simply disconnect the interconnected connectors and install the air-cooling module. Therefore, the heat dissipation system of the present invention can flexibly configure the heat dissipation module according to the heat dissipation requirement of the actual communication board, and the high power consumption single board uses the liquid cooling module to dissipate heat, and the low power consumption single board uses the air cooling module to dissipate heat, during use. There is no change to the architecture of the device. Therefore, the heat dissipation system of the present invention solves the problem of heat dissipation of high power consumption and compact communication equipment without changing the equipment architecture.
需要进一步解释的是, 通常情况下是通信单板 6插接在机拒背板 Ί提供 的插槽中, 风冷模块通过风扇监控板与设备背板上对应的连接器配合实现联 接, 本发明实施例将液冷模块设计成与风冷模块安装位相配合, 更具体地是
通过将液冷模块与风冷模块设计成外形结构完全相同的结构, 使二者可灵活 替换, 因此不会改变设备的架构。 一般而言, 风冷模块 11为如图 2所示的结 构, 它包括框体 11和设在框体 11 内的风扇 12 , 所以在本发明实施例中将液 冷模块设计成与框体 11的外形结构相同即可。 It should be further explained that, in general, the communication board 6 is inserted into the slot provided by the machine backplane, and the air cooling module is coupled with the corresponding connector on the back panel of the device by the fan monitoring board. Embodiments design the liquid cooling module to match the air cooling module mounting position, more specifically By designing the liquid-cooled module and the air-cooling module to have the same structure, the two can be flexibly replaced, so the structure of the device is not changed. Generally, the air-cooling module 11 is a structure as shown in FIG. 2, and includes a frame 11 and a fan 12 disposed in the frame 11. Therefore, in the embodiment of the present invention, the liquid cooling module is designed to be the same with the frame 11. The shape and structure are the same.
具体而言, 上述实施例中的第一接头 221、 第二接头 222、 第三接头 511 和第四接头 512 为快接接头。 快接接头用于连接液路管道时, 具有连接快速 而且防溢漏的功能。 快接接头在使用时是阳接头与阴接头配套使用的,如图 8 所示, 为阳接头与阴接头连接状态的示意图。 阳接头 80内设有第一活塞 801 和第一弹簧 802 , 阴接头 90 内设有第二活塞和第二弹簧 902 , 第二活塞包括 固定连接在阴接头 90底部的活塞杆 9012和沿轴向移动的套筒 9011。 当阳接 头 80与阴接头 90处于自由的分离状态时, 阳接头 80内的第一活塞 801在第 一弹簧 802的压缩弹力作用下被抵在阳接头 80的顶部开口处(左端), 将液 路封闭。 阴接头 90内的套筒 9011也在第二弹簧 902的压缩弹力作用下抵在 阴接头 90的顶部开口处(右端), 此时活塞杆 9012的头部与套筒配合从而将 液路封闭。 当需要将阳接头 80与阴接头 90连接时, 用力将阳接头 80插向阴 接头 90 ,第二活塞的套筒 9011在阳接头 80管壁的作用下向阴接头 90的底部 运动, 活塞杆 9012的头部便从套筒的右端伸出, 同时活塞杆 9012推动阳接 头 80内的第一活塞 801向阳接头 80的底部运动, 便实现了液路的导通。 相 反当需要将阳接头与阴接头断开时, 用力将阳接头从阴接头中拔出, 套筒在 第二弹簧的回弹力作用下, 第一活塞在第一弹簧的回弹力作用下回到初始状 态, 将液路封闭。 在阳接头与阴接头的连接与断开过程中无液体溢漏。 Specifically, the first joint 221, the second joint 222, the third joint 511, and the fourth joint 512 in the above embodiment are quick connectors. When the quick connector is used to connect the liquid pipe, it has the function of quick connection and leakage prevention. The quick connector is used when the male connector is used with the female connector, as shown in Figure 8, which is a schematic diagram of the connection state between the male connector and the female connector. The first joint 801 and the first spring 802 are disposed in the male joint 80, the second piston and the second spring 902 are disposed in the female joint 90, and the second piston includes a piston rod 9012 fixedly coupled to the bottom of the female joint 90 and axially Moving sleeve 9011. When the male connector 80 and the female connector 90 are in a freely separated state, the first piston 801 in the male connector 80 is pressed against the top opening (left end) of the male connector 80 by the compressive elastic force of the first spring 802. The road is closed. The sleeve 9011 in the female connector 90 also abuts against the top opening (right end) of the female connector 90 by the compressive spring force of the second spring 902, at which time the head of the piston rod 9012 engages the sleeve to close the fluid path. When the male connector 80 needs to be connected to the female connector 90, the male connector 80 is forcefully inserted into the female connector 90, and the sleeve 9011 of the second piston moves to the bottom of the female connector 90 under the action of the wall of the male connector 80, the piston rod The head of the 9012 protrudes from the right end of the sleeve, and the piston rod 9012 pushes the first piston 801 in the male joint 80 toward the bottom of the male joint 80, thereby achieving the conduction of the liquid passage. On the contrary, when it is necessary to disconnect the male connector from the female connector, the male connector is forcedly pulled out from the female connector, and the sleeve is returned by the resilience of the second spring under the resilience of the second spring. In the initial state, the liquid path is closed. There is no liquid leakage during the connection and disconnection of the male connector and the female connector.
需要说明的是本实施例中第一接头、 第二接头、 第三接头和第四接头均 可以为阳接头或阴接头, 只要满足第一接头与第三接头是相互配合的接头, 第二接头和第四接头是相互配合的接头即可。 另外图 3 示出的是三对第一接 头和第二接头, 因此该液冷模块可以与三块通信单板连接, 但本发明并不限 于三对第一接头和第二接头, 其具体对数根据一个液冷模块对应的通信单板 的数量而定。 其次, 本发明中液冷模块中的快接接头的排布可以是横向的,
也可以是纵向的。 横向排布时, 满足竖插通信单板的液冷散热需求, 纵向排 布时, 满足横插通信单板的液冷散热需求。 而且快接接头的结构形式也可以 为其它类型, 只要满足插接与断开时无液体溢漏即可。 It should be noted that in the embodiment, the first joint, the second joint, the third joint, and the fourth joint may both be a male joint or a female joint, as long as the first joint and the third joint are matched with each other, and the second joint And the fourth joint is a joint that cooperates with each other. In addition, FIG. 3 shows three pairs of first joints and second joints, so the liquid cooling module can be connected to three communication boards, but the invention is not limited to three pairs of first joints and second joints, and the specific pair thereof The number depends on the number of communication boards corresponding to a liquid cooling module. Secondly, the arrangement of the quick connector in the liquid cooling module of the present invention may be lateral, It can also be vertical. In the horizontal arrangement, it satisfies the liquid cooling and heat dissipation requirements of the vertical insertion communication board, and satisfies the liquid cooling and heat dissipation requirements of the horizontally inserted communication board when the vertical arrangement is performed. Moreover, the structure of the quick connector can be other types as long as there is no liquid leakage when plugging and disconnecting.
具体而言, 液冷模块 2 包括与风冷模块安装位 10相配合的框体 21和设 在框体 21内的液路主体 22 ,液路主体 22的后端连接外接进水管 31和回水管 32 , 液路主体 22的内部设有第一液路和第二液路, 液路主体 22的前端设有 第一接头 221和第二接头 222。 这样, 在制作液冷模块时只需将框体加工成与 风冷模块安装位相配合的结构, 而对于液路主体的结构可以设计的随意一些, 降低了对液冷模块制作的工艺要求。 尤其是一般机拒都设有如图 1 所示的多 个风冷模块安装位, 在制作上如果各个液路主体都要求相同的制作精度会使 工艺变得很复杂。 而设计同样结构的框体要相对简单些。 而且为了满足横插 通信单板和竖插通信单板的液冷需求, 本实施例可以将框体截面设计成正方 形, 只需旋转 90。 , 即可同时兼容对横插和竖插通信单板的液冷冷却。 Specifically, the liquid cooling module 2 includes a frame 21 that cooperates with the air cooling module mounting position 10 and a liquid path main body 22 that is disposed in the frame body 21. The rear end of the liquid path main body 22 is connected to the external inlet water pipe 31 and the return water pipe. 32. The first liquid passage and the second liquid passage are provided inside the liquid passage main body 22, and the first joint 221 and the second joint 222 are provided at the front end of the liquid passage main body 22. In this way, when the liquid cooling module is prepared, the frame body only needs to be processed into a structure matching the installation position of the air cooling module, and the structure of the liquid path main body can be designed freely, thereby reducing the process requirements for the liquid cooling module. In particular, the general machine rejection has a plurality of air-cooling module mounting positions as shown in Fig. 1. In the production, if the respective liquid path bodies require the same manufacturing precision, the process becomes complicated. Designing the same structure of the frame is relatively simple. Moreover, in order to meet the liquid cooling requirements of the horizontal insertion communication board and the vertical insertion communication board, the embodiment can design the frame section into a square shape, and only need to rotate 90. , it can be compatible with liquid cooling of horizontal plug-in and vertical plug-in communication boards.
其次, 如图 3和 4所示, 所述液冷模块还包括设在所述框体内的安装板 23 , 液路主体 22通过安装板 23固定在框体 21上。 这是因为如果将其液路主 体直接固定在框体上就需要在其侧面开孔或开槽, 而液路主体内设有液路, 一旦开孔或开槽不当就可能导致液路通道受损。 因此, 本实施例中可以通过 在液路主体 22的后方设置安装板 2 3 ,而在第一液路和第二液路之间的液路主 体上开孔, 首先将液路主体 22 固定在安装板 23上, 然后再将安装板固定在
Next, as shown in FIGS. 3 and 4, the liquid cooling module further includes a mounting plate 23 provided in the casing, and the liquid path main body 22 is fixed to the frame 21 by a mounting plate 23. This is because if the main body of the liquid path is directly fixed to the frame body, it is necessary to open or slot the side of the liquid path, and the liquid path body is provided with a liquid path. If the opening or the groove is improper, the liquid path may be affected. damage. Therefore, in the present embodiment, by providing the mounting plate 2 3 behind the liquid path main body 22, a hole is formed in the liquid path main body between the first liquid path and the second liquid path, and the liquid path main body 22 is first fixed at Mounting plate 23, and then fixing the mounting plate
其次, 如图 6和图 Ί所示, 接头支架 5上设有第一安装孔和第二安装孔, 所述第一安装孔内设有第一套筒 521 , 第一套筒 521与第一安装孔间隙配合, 且第一套筒 521 的一端与第三接头 511连接、 另一端与通信单板的供水管连 接, 所述第二安装孔内设有第二套筒 522 , 所述第二套筒 522与第二安装孔间 隙配合, 且第二套筒 522的一端与第四接头 512连接、 另一端与通信单板的 排水管连接。 这样, 第三接头和第四接头可在各自的安装孔内转动, 产生径 向上的较小浮动, 减小接头设计的公差影响, 降低了快接接头相互配合的高
精度要求。 Next, as shown in FIG. 6 and FIG. 5, the joint bracket 5 is provided with a first mounting hole and a second mounting hole, and the first mounting hole is provided with a first sleeve 521, a first sleeve 521 and a first The mounting hole is gap-fitted, and one end of the first sleeve 521 is connected to the third joint 511, and the other end is connected to the water supply pipe of the communication board, and the second mounting hole is provided with a second sleeve 522, the second The sleeve 522 is clearance-fitted with the second mounting hole, and one end of the second sleeve 522 is connected to the fourth joint 512 and the other end is connected to the drain pipe of the communication board. In this way, the third joint and the fourth joint can be rotated in the respective mounting holes, resulting in less floating in the radial direction, reducing the tolerance effect of the joint design, and reducing the high cooperation of the quick joints. Precision requirements.
优选地, 如图 6和图 Ί所示, 所述接头支架包括相扣合的上部支架 531 和下部支架 532 , 所述上部支架 531和下部支架 532通过螺栓连接。 具体为在 上部支架 531上设置螺栓孔 541和在下部支架 532上设置与螺栓孔 541相对 应的螺栓孔 542 , 并在螺栓孔 541、 542中穿设螺栓以实现上部支架 531和下 部支架 532的连接。 这样便于接头支架的设计和套筒的安装。 Preferably, as shown in Figs. 6 and ,, the joint bracket includes a snap-fit upper bracket 531 and a lower bracket 532, and the upper bracket 531 and the lower bracket 532 are connected by bolts. Specifically, a bolt hole 541 is disposed on the upper bracket 531, and a bolt hole 542 corresponding to the bolt hole 541 is disposed on the lower bracket 532, and bolts are bored in the bolt holes 541, 542 to realize the upper bracket 531 and the lower bracket 532. connection. This facilitates the design of the joint bracket and the mounting of the sleeve.
本发明的散热系统还包括固定在通信单板上的固定块, 所述接头支架和 所述固定块通过螺钉连接。 这样, 接头支架与通信单板为可拆卸地连接, 当 需要对通信单板实施液冷时便将接头支架安装在通信单板上, 否则便将其拆 下, 有利于风冷时冷热空气的交换。 The heat dissipation system of the present invention further includes a fixing block fixed to the communication board, and the joint bracket and the fixing block are connected by screws. In this way, the connector bracket and the communication board are detachably connected. When the communication board needs to be liquid-cooled, the connector bracket is mounted on the communication board, otherwise it is removed, which is favorable for air-cooling when hot air is cooled. Exchange.
另外以上所述实施例中的液路主体, 也可以设计成只带快接接头的软管, 并将软管固定在液冷模块的框体上, 当高功耗通信单板插入时, 通信单板上 的快接接头与软管上的快接接头连通即可, 从而实现对高功耗通信单板的液 冷。 In addition, the liquid path main body in the above embodiment may also be designed as a hose with only a quick connector, and the hose is fixed on the frame of the liquid cooling module. When the high power communication board is inserted, the communication is performed. The quick connector on the board can communicate with the quick connector on the hose to achieve liquid cooling of the high power communication board.
以上所述, 仅为本发明的具体实施方式, 但本发明的保护范围并不局限 于此, 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内, 可轻易 想到的变化或替换, 都应涵盖在本发明的保护范围之内。 因此, 本发明的保 护范围应以所述权利要求的保护范围为准。
The above is only the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any change or replacement that can be easily conceived by those skilled in the art within the technical scope of the present invention is All should be covered by the scope of the present invention. Accordingly, the scope of the invention should be determined by the scope of the appended claims.
Claims
1、 一种通信设备的散热系统, 包括风冷模块, 其特征在于, 还包括与风冷 模块安装位相配合的液冷模块和固定在通信单板上的接头支架, 所述液冷模块 的后端连接有外接进水管和回水管, 所述液冷模块的内部设有与进水管连通的 第一液路和与回水管连通的第二液路, 所述液冷模块的前端设有与第一液路连 通的第一接头和与第二液路连通的第二接头, 接头支架上安装有与通信单板上 供水管连通的第三接头和与通信单板上排水管连通的第四接头, 第一接头与第 三接头相配合, 第二接头与第四接头相配合。 1. A heat dissipation system for communication equipment, including an air-cooling module. It is characterized in that it also includes a liquid-cooling module that matches the installation position of the air-cooling module and a connector bracket fixed on the communication single board. The rear of the liquid-cooling module The end of the liquid cooling module is connected with an external water inlet pipe and a return pipe. The inside of the liquid cooling module is provided with a first liquid path connected with the water inlet pipe and a second liquid path connected with the return water pipe. The front end of the liquid cooling module is provided with a first liquid path connected with the water inlet pipe and a second liquid path connected with the return water pipe. A first joint connected with a liquid line and a second joint connected with a second liquid line. The joint bracket is equipped with a third joint connected with the water supply pipe on the communication single board and a fourth joint connected with the drainage pipe on the communication single board. , the first joint is matched with the third joint, and the second joint is matched with the fourth joint.
2、 根据权利要求 1所述的散热系统, 其特征在于, 所述第一接头、 第二接 头、 第三接头和第四接头为快接接头。 2. The heat dissipation system according to claim 1, wherein the first connector, the second connector, the third connector and the fourth connector are quick-connect connectors.
3、 根据权利要求 1或 2所述的散热系统, 其特征在于, 所述液冷模块包括 与风冷模块安装位相配合的框体和设在框体内的液路主体, 液路主体的后端连 接所述外接进水管和回水管, 所述液路主体的内部设有所述第一液路和第二液 路, 所述液路主体的前端设有所述第一接头和第二接头。 3. The heat dissipation system according to claim 1 or 2, characterized in that, the liquid cooling module includes a frame that matches the installation position of the air cooling module and a liquid circuit main body located in the frame, the rear end of the liquid circuit main body The external water inlet pipe and the return pipe are connected, the first liquid circuit and the second liquid circuit are provided inside the liquid circuit main body, and the first joint and the second joint are provided at the front end of the liquid circuit main body.
4、 根据权利要求 3所述的散热系统, 其特征在于, 所述液冷模块还包括设 在所述框体内的安装板, 所述液路主体通过安装板固定在所述框体上。 4. The heat dissipation system according to claim 3, characterized in that the liquid cooling module further includes a mounting plate provided in the frame, and the liquid circuit main body is fixed on the frame through the mounting plate.
5、 根据权利要求 1所述的散热系统, 其特征在于, 所述接头支架上设有第 一安装孔和第二安装孔, 所述第一安装孔内设有第一套筒, 第一套筒与第一安 装孔间隙配合, 且第一套筒的一端与第三接头连接、 另一端与通信单板的供水 管连接, 所述第二安装孔内设有第二套筒, 所述第二套筒与第二安装孔间隙配 合, 且第二套筒的一端与第四接头连接、 另一端与通信单板的排水管连接。 5. The heat dissipation system according to claim 1, wherein the connector bracket is provided with a first mounting hole and a second mounting hole, and a first sleeve is provided in the first mounting hole. The barrel has a clearance fit with the first installation hole, and one end of the first sleeve is connected to the third connector, and the other end is connected to the water supply pipe of the communication single board. A second sleeve is provided in the second installation hole. The second sleeve has a clearance fit with the second installation hole, and one end of the second sleeve is connected to the fourth connector, and the other end is connected to the drainage pipe of the communication single board.
6、 根据权利要求 5所述的散热系统, 其特征在于, 所述接头支架包括相扣 合的上部支架和下部支架, 所述上部支架和下部支架通过螺栓连接。 6. The heat dissipation system according to claim 5, characterized in that the joint bracket includes an upper bracket and a lower bracket that interlock, and the upper bracket and the lower bracket are connected by bolts.
7、 根据权利要求 1所述的散热系统, 其特征在于, 还包括固定在通信单板 上的固定块, 所述接头支架和所述固定块通过螺钉连接。
7. The heat dissipation system according to claim 1, further comprising a fixing block fixed on the communication single board, and the joint bracket and the fixing block are connected by screws.
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CN201310143252.5 | 2013-04-23 | ||
CN201310143252.5A CN104125743B (en) | 2013-04-23 | 2013-04-23 | The cooling system of communication equipment |
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WO2014173101A1 true WO2014173101A1 (en) | 2014-10-30 |
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CN105992495A (en) * | 2015-02-10 | 2016-10-05 | 中兴通讯股份有限公司 | Heat-dissipation plug-in box |
CN111970908A (en) * | 2020-08-26 | 2020-11-20 | 中航光电科技股份有限公司 | Active and passive dual-purpose liquid cooling radiator and manufacturing method thereof |
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CN201210780Y (en) * | 2008-06-19 | 2009-03-18 | 张军才 | Recirculated water-cooling and air-cooling heat radiating device |
EP2088843A1 (en) * | 2008-02-07 | 2009-08-12 | Siemens Aktiengesellschaft Österreich | Fluid-cooled filter or filter components |
CN201393137Y (en) * | 2009-04-03 | 2010-01-27 | 珠海运控电机有限公司 | Novel heat radiator and heat radiating motor driver thereof |
CN202103998U (en) * | 2011-06-09 | 2012-01-04 | 张君义 | Wind and water mixed heat radiator |
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CN201601940U (en) * | 2010-01-26 | 2010-10-06 | 中兴通讯股份有限公司 | Water-cooled radiating module |
CN102159051B (en) * | 2010-02-12 | 2013-05-01 | 台达电子工业股份有限公司 | Modular heat-radiating device |
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EP2088843A1 (en) * | 2008-02-07 | 2009-08-12 | Siemens Aktiengesellschaft Österreich | Fluid-cooled filter or filter components |
CN201210780Y (en) * | 2008-06-19 | 2009-03-18 | 张军才 | Recirculated water-cooling and air-cooling heat radiating device |
CN201393137Y (en) * | 2009-04-03 | 2010-01-27 | 珠海运控电机有限公司 | Novel heat radiator and heat radiating motor driver thereof |
CN202103998U (en) * | 2011-06-09 | 2012-01-04 | 张君义 | Wind and water mixed heat radiator |
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