WO2014173101A1

WO2014173101A1 - Heat dissipation system of communications device

Info

Publication number: WO2014173101A1
Application number: PCT/CN2013/086258
Authority: WO
Inventors: 冉苗苗; 李尧
Original assignee: 华为技术有限公司
Priority date: 2013-04-23
Filing date: 2013-10-30
Publication date: 2014-10-30
Also published as: CN104125743A; CN104125743B

Abstract

Disclosed is a heat dissipation system of a communications system, so as to solve a heat dissipation problem of a large-power-consuming and compact communications device without changing a device layout. The present invention relates to communications technologies. The heat dissipation system of the present invention comprises: an air cooling module, a liquid cooling module matching a mounting position of the air cooling module, and a joint bracket fixed on a communications board. A rear end of the liquid cooling module is connected with an external water inlet pipe and a return pipe, a first liquid pipeline communicated with the water inlet pipe and a second liquid pipeline communicated with the return pipe are disposed in the liquid cooling module, a front end of the liquid cooling module is provided with a first joint communicated with the first liquid pipeline and a second joint communicated with the second liquid pipeline, a third joint communicated with a water supply pipe on the communications board and a fourth joint communicated with a water drain pipe on the communications board are mounted on the joint bracket, the first joint matches the third joint, and the second joint matches the fourth joint. The present invention is applied to perform heat dissipation on a communications device.

Description

The present invention claims priority to Chinese Patent Application No. 201310143252.5, entitled "Dissipation System for Communication Equipment", filed on April 23, 2013, the entire contents of which are incorporated herein by reference. In this application. Technical field

The present invention relates to communication technologies, and in particular, to a heat dissipation system for a communication device. Background technique

With the rapid development of the communication industry and the increasing demand for information services, network operators need to add more and more equipment to meet the growing needs of customers. However, due to the limitation of the installation space of the equipment room, the density of communication equipment is getting higher and higher. The size of the device is getting smaller and smaller, but the power of the device is getting higher and higher. Therefore, how to solve the heat dissipation problem of the high-power and compact device has become a problem to be solved in the design of the communication device.

At present, the communication device usually includes a plurality of communication boards, and each communication board is plugged into a slot provided by the backplane of the machine. Since the size of the machine rejection is smaller and smaller, the integration degree of the communication device is higher and higher. Therefore, the heat dissipation problem of the communication device becomes one of the bottlenecks of the design of the single-board frame. In the prior art, conventional air cooling is used for the communication device, that is, the fan is used to cool the running communication device. However, as device integration becomes higher and higher, the heating power consumption continues to increase, and the conventional fan cooling and cooling can no longer meet the heat dissipation requirements. At this time, the heat capacity and density are much larger than that of air. As a cooling medium, it has become the most efficient and feasible heat dissipation solution at present. It has broad application prospects and has been widely used in military, medical, and large computer fields.

However, existing liquid cooling systems typically use a hose placed on the front panel of the veneer to allow cooling of the communication device by circulating the liquid through the hose, but this can affect device routing and equipment architecture. Summary of the invention

Embodiments of the present invention provide a heat dissipation system for a communication device that solves the problem of heat dissipation of a high power consumption and compact device without changing the layout of the device. In order to achieve the above object, embodiments of the present invention use the following technical solutions:

In one aspect, a heat dissipation system for a communication device is provided, the heat dissipation system comprising an air cooling module and a liquid cooling module matched with an air cooling module mounting position, and a joint bracket fixed on the communication board, the liquid cooling module An external inlet pipe and a return pipe are connected to the end, and the liquid cooling module is internally provided with a first liquid path communicating with the inlet pipe and a second liquid path communicating with the return pipe, and the front end of the liquid cooling module is provided with a first joint communicating with the liquid passage and a second joint communicating with the second liquid passage, wherein the joint bracket is mounted with a third joint communicating with the water supply pipe on the communication board and a fourth joint communicating with the drain pipe on the communication board The first joint cooperates with the third joint, and the second joint cooperates with the fourth joint.

In a first possible implementation, the first joint, the second joint, the third joint, and the fourth joint are quick connectors.

In a second possible implementation manner, the liquid cooling module includes a frame body matched with an installation position of the air cooling module and a liquid path body disposed in the frame body, and a rear end of the liquid path body is connected to the external water inlet pipe and back In the water pipe, the first liquid path and the second liquid path are provided inside the liquid path main body, and the first joint and the second joint are provided at the front end of the liquid path main body.

In a third possible implementation, the liquid cooling module further includes a mounting plate disposed in the frame, and the liquid path body is fixed on the frame by a mounting plate.

In a fourth possible implementation, the joint bracket is provided with a first mounting hole and a second mounting hole, and the first mounting hole is provided with a first sleeve, the first sleeve and the first mounting hole a gap fit, and one end of the first sleeve is connected to the third joint, the other end is connected to the water supply pipe of the communication board, and the second mounting hole is provided with a second sleeve, the second sleeve and the second The mounting hole is clearance-fitted, and one end of the second sleeve is connected to the fourth joint, and the other end is connected to the drain pipe of the communication board.

In a fifth possible implementation, the joint bracket includes a snap-fit upper bracket and a lower bracket, and the upper bracket and the lower bracket are connected by bolts.

In a sixth possible implementation, the fixing block fixed on the communication board is further included, and the joint bracket and the fixing block are connected by screws.

The heat dissipation system of the communication device provided by the embodiment of the present invention, because the liquid cooling module and the air cooling module are installed in a matching position, when liquid cooling is required due to high power consumption of the communication board, only liquid cooling is required. The module is installed at the position of the air-cooling module, and is connected to the third joint on the joint bracket through the first joint on the liquid cooling module, and the second joint on the liquid cooling module is connected with the fourth joint on the joint bracket, so that the temperature is low. The water flows through the first liquid path, the first joint, and the third joint to the water inlet pipe on the communication board, and the high temperature water heated by the communication board passes through the drain pipe, the fourth joint, the second joint, and the second liquid path. And finally flow to the return pipe to discharge. This cycle achieves liquid cooling of the communication board. When the communication board does not need liquid cooling, it is only necessary to disconnect the interconnected connectors and install the upper air cooling module. Therefore, the heat dissipation system of the present invention can flexibly configure the heat dissipation module according to the heat dissipation requirement of the actual communication board, and the high power consumption single board uses the liquid cooling module to dissipate heat, and the low power consumption single board uses the air cooling module to dissipate heat. The architecture of the device was not changed during use. Therefore, the heat dissipation system of the present invention solves the problem of heat dissipation of a high power consumption and compact communication device without changing the device architecture. DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any creative work.

1 is a schematic structural diagram of a rear side of a heat dissipation system of a communication device according to an embodiment of the present invention; FIG. 2 is a schematic structural diagram of an air cooling module according to an embodiment of the present invention;

3 is a schematic structural diagram of a liquid cooling module according to an embodiment of the present invention;

Figure 4 is a schematic view showing the internal structure of the liquid cooling module shown in Figure 3;

5 is a schematic structural view of a front side of a heat dissipation system of a communication device according to an embodiment of the present invention; FIG. 6 is a schematic structural view of the connector bracket shown in FIG.

Figure 7 is a cross-sectional view of the joint bracket shown in Figure 5;

Figure 8 is a cross-sectional view of the quick connector shown in Figure 5. detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and Not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

As shown in FIG. 1 to FIG. 5, an embodiment of the present invention provides a heat dissipation system for a communication device, where the heat dissipation system includes an air cooling module 1, a liquid cooling module 2 matched with an air cooling module mounting position 10, and a fixed a joint bracket 5 on the communication board, an external inlet pipe 31 and a return pipe 32 are connected to the rear end of the liquid cooling module 2, and a first liquid path (not shown) connected to the inlet pipe 31 is provided inside the liquid cooling module 2. And a second liquid passage (not shown) communicating with the return pipe 32, the front end of the liquid cooling module 2 is provided with a first joint 221 communicating with the first liquid passage and a second joint 222 communicating with the second liquid passage, and a joint A third joint 51 1 communicating with a water supply pipe (not shown) on the communication board 6 and a fourth joint 512 communicating with a drain pipe (not shown) on the communication board 6 are mounted on the bracket 5, and the first joint 221 is attached. Cooperating with the third joint 51 1 , the second joint 222 mates with the fourth joint 5 12 .

The heat dissipation system of the communication device provided by the embodiment of the present invention, because the liquid cooling module 2 is matched with the air cooling module mounting position 10, when the liquid cooling is required due to the high power consumption of the communication board, only the liquid is needed. The cold module 2 is installed at the air-cooling module mounting position 10, and is connected to the third joint 51 1 on the joint bracket 5 through the first joint 22 1 on the liquid-cooling module 2, and the second joint 222 on the liquid-cooling module 2 Connected to the fourth joint on the joint bracket 5, so that the low temperature water flows through the first liquid passage, the first joint, and the third joint to the water inlet pipe on the communication board, and the high temperature water heated by the communication board passes through the drain pipe. The fourth joint, the second joint, the second liquid passage and finally flow to the return water pipe. This cycle achieves liquid cooling of the communication board. When the communication board does not need liquid cooling, simply disconnect the interconnected connectors and install the air-cooling module. Therefore, the heat dissipation system of the present invention can flexibly configure the heat dissipation module according to the heat dissipation requirement of the actual communication board, and the high power consumption single board uses the liquid cooling module to dissipate heat, and the low power consumption single board uses the air cooling module to dissipate heat, during use. There is no change to the architecture of the device. Therefore, the heat dissipation system of the present invention solves the problem of heat dissipation of high power consumption and compact communication equipment without changing the equipment architecture.

It should be further explained that, in general, the communication board 6 is inserted into the slot provided by the machine backplane, and the air cooling module is coupled with the corresponding connector on the back panel of the device by the fan monitoring board. Embodiments design the liquid cooling module to match the air cooling module mounting position, more specifically By designing the liquid-cooled module and the air-cooling module to have the same structure, the two can be flexibly replaced, so the structure of the device is not changed. Generally, the air-cooling module 11 is a structure as shown in FIG. 2, and includes a frame 11 and a fan 12 disposed in the frame 11. Therefore, in the embodiment of the present invention, the liquid cooling module is designed to be the same with the frame 11. The shape and structure are the same.

Specifically, the first joint 221, the second joint 222, the third joint 511, and the fourth joint 512 in the above embodiment are quick connectors. When the quick connector is used to connect the liquid pipe, it has the function of quick connection and leakage prevention. The quick connector is used when the male connector is used with the female connector, as shown in Figure 8, which is a schematic diagram of the connection state between the male connector and the female connector. The first joint 801 and the first spring 802 are disposed in the male joint 80, the second piston and the second spring 902 are disposed in the female joint 90, and the second piston includes a piston rod 9012 fixedly coupled to the bottom of the female joint 90 and axially Moving sleeve 9011. When the male connector 80 and the female connector 90 are in a freely separated state, the first piston 801 in the male connector 80 is pressed against the top opening (left end) of the male connector 80 by the compressive elastic force of the first spring 802. The road is closed. The sleeve 9011 in the female connector 90 also abuts against the top opening (right end) of the female connector 90 by the compressive spring force of the second spring 902, at which time the head of the piston rod 9012 engages the sleeve to close the fluid path. When the male connector 80 needs to be connected to the female connector 90, the male connector 80 is forcefully inserted into the female connector 90, and the sleeve 9011 of the second piston moves to the bottom of the female connector 90 under the action of the wall of the male connector 80, the piston rod The head of the 9012 protrudes from the right end of the sleeve, and the piston rod 9012 pushes the first piston 801 in the male joint 80 toward the bottom of the male joint 80, thereby achieving the conduction of the liquid passage. On the contrary, when it is necessary to disconnect the male connector from the female connector, the male connector is forcedly pulled out from the female connector, and the sleeve is returned by the resilience of the second spring under the resilience of the second spring. In the initial state, the liquid path is closed. There is no liquid leakage during the connection and disconnection of the male connector and the female connector.

It should be noted that in the embodiment, the first joint, the second joint, the third joint, and the fourth joint may both be a male joint or a female joint, as long as the first joint and the third joint are matched with each other, and the second joint And the fourth joint is a joint that cooperates with each other. In addition, FIG. 3 shows three pairs of first joints and second joints, so the liquid cooling module can be connected to three communication boards, but the invention is not limited to three pairs of first joints and second joints, and the specific pair thereof The number depends on the number of communication boards corresponding to a liquid cooling module. Secondly, the arrangement of the quick connector in the liquid cooling module of the present invention may be lateral, It can also be vertical. In the horizontal arrangement, it satisfies the liquid cooling and heat dissipation requirements of the vertical insertion communication board, and satisfies the liquid cooling and heat dissipation requirements of the horizontally inserted communication board when the vertical arrangement is performed. Moreover, the structure of the quick connector can be other types as long as there is no liquid leakage when plugging and disconnecting.

Specifically, the liquid cooling module 2 includes a frame 21 that cooperates with the air cooling module mounting position 10 and a liquid path main body 22 that is disposed in the frame body 21. The rear end of the liquid path main body 22 is connected to the external inlet water pipe 31 and the return water pipe. 32. The first liquid passage and the second liquid passage are provided inside the liquid passage main body 22, and the first joint 221 and the second joint 222 are provided at the front end of the liquid passage main body 22. In this way, when the liquid cooling module is prepared, the frame body only needs to be processed into a structure matching the installation position of the air cooling module, and the structure of the liquid path main body can be designed freely, thereby reducing the process requirements for the liquid cooling module. In particular, the general machine rejection has a plurality of air-cooling module mounting positions as shown in Fig. 1. In the production, if the respective liquid path bodies require the same manufacturing precision, the process becomes complicated. Designing the same structure of the frame is relatively simple. Moreover, in order to meet the liquid cooling requirements of the horizontal insertion communication board and the vertical insertion communication board, the embodiment can design the frame section into a square shape, and only need to rotate 90. , it can be compatible with liquid cooling of horizontal plug-in and vertical plug-in communication boards.

Next, as shown in FIGS. 3 and 4, the liquid cooling module further includes a mounting plate 23 provided in the casing, and the liquid path main body 22 is fixed to the frame 21 by a mounting plate 23. This is because if the main body of the liquid path is directly fixed to the frame body, it is necessary to open or slot the side of the liquid path, and the liquid path body is provided with a liquid path. If the opening or the groove is improper, the liquid path may be affected. damage. Therefore, in the present embodiment, by providing the mounting plate 2 3 behind the liquid path main body 22, a hole is formed in the liquid path main body between the first liquid path and the second liquid path, and the liquid path main body 22 is first fixed at Mounting plate 23, and then fixing the mounting plate

Next, as shown in FIG. 6 and FIG. 5, the joint bracket 5 is provided with a first mounting hole and a second mounting hole, and the first mounting hole is provided with a first sleeve 521, a first sleeve 521 and a first The mounting hole is gap-fitted, and one end of the first sleeve 521 is connected to the third joint 511, and the other end is connected to the water supply pipe of the communication board, and the second mounting hole is provided with a second sleeve 522, the second The sleeve 522 is clearance-fitted with the second mounting hole, and one end of the second sleeve 522 is connected to the fourth joint 512 and the other end is connected to the drain pipe of the communication board. In this way, the third joint and the fourth joint can be rotated in the respective mounting holes, resulting in less floating in the radial direction, reducing the tolerance effect of the joint design, and reducing the high cooperation of the quick joints. Precision requirements.

Preferably, as shown in Figs. 6 and ,, the joint bracket includes a snap-fit upper bracket 531 and a lower bracket 532, and the upper bracket 531 and the lower bracket 532 are connected by bolts. Specifically, a bolt hole 541 is disposed on the upper bracket 531, and a bolt hole 542 corresponding to the bolt hole 541 is disposed on the lower bracket 532, and bolts are bored in the bolt holes 541, 542 to realize the upper bracket 531 and the lower bracket 532. connection. This facilitates the design of the joint bracket and the mounting of the sleeve.

The heat dissipation system of the present invention further includes a fixing block fixed to the communication board, and the joint bracket and the fixing block are connected by screws. In this way, the connector bracket and the communication board are detachably connected. When the communication board needs to be liquid-cooled, the connector bracket is mounted on the communication board, otherwise it is removed, which is favorable for air-cooling when hot air is cooled. Exchange.

In addition, the liquid path main body in the above embodiment may also be designed as a hose with only a quick connector, and the hose is fixed on the frame of the liquid cooling module. When the high power communication board is inserted, the communication is performed. The quick connector on the board can communicate with the quick connector on the hose to achieve liquid cooling of the high power communication board.

The above is only the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any change or replacement that can be easily conceived by those skilled in the art within the technical scope of the present invention is All should be covered by the scope of the present invention. Accordingly, the scope of the invention should be determined by the scope of the appended claims.

Claims

claims

1. A heat dissipation system for communication equipment, including an air-cooling module. It is characterized in that it also includes a liquid-cooling module that matches the installation position of the air-cooling module and a connector bracket fixed on the communication single board. The rear of the liquid-cooling module The end of the liquid cooling module is connected with an external water inlet pipe and a return pipe. The inside of the liquid cooling module is provided with a first liquid path connected with the water inlet pipe and a second liquid path connected with the return water pipe. The front end of the liquid cooling module is provided with a first liquid path connected with the water inlet pipe and a second liquid path connected with the return water pipe. A first joint connected with a liquid line and a second joint connected with a second liquid line. The joint bracket is equipped with a third joint connected with the water supply pipe on the communication single board and a fourth joint connected with the drainage pipe on the communication single board. , the first joint is matched with the third joint, and the second joint is matched with the fourth joint.

2. The heat dissipation system according to claim 1, wherein the first connector, the second connector, the third connector and the fourth connector are quick-connect connectors.

3. The heat dissipation system according to claim 1 or 2, characterized in that, the liquid cooling module includes a frame that matches the installation position of the air cooling module and a liquid circuit main body located in the frame, the rear end of the liquid circuit main body The external water inlet pipe and the return pipe are connected, the first liquid circuit and the second liquid circuit are provided inside the liquid circuit main body, and the first joint and the second joint are provided at the front end of the liquid circuit main body.

4. The heat dissipation system according to claim 3, characterized in that the liquid cooling module further includes a mounting plate provided in the frame, and the liquid circuit main body is fixed on the frame through the mounting plate.

5. The heat dissipation system according to claim 1, wherein the connector bracket is provided with a first mounting hole and a second mounting hole, and a first sleeve is provided in the first mounting hole. The barrel has a clearance fit with the first installation hole, and one end of the first sleeve is connected to the third connector, and the other end is connected to the water supply pipe of the communication single board. A second sleeve is provided in the second installation hole. The second sleeve has a clearance fit with the second installation hole, and one end of the second sleeve is connected to the fourth connector, and the other end is connected to the drainage pipe of the communication single board.

6. The heat dissipation system according to claim 5, characterized in that the joint bracket includes an upper bracket and a lower bracket that interlock, and the upper bracket and the lower bracket are connected by bolts.

7. The heat dissipation system according to claim 1, further comprising a fixing block fixed on the communication single board, and the joint bracket and the fixing block are connected by screws.