WO2014173101A1 - Système de dissipation de chaleur de dispositif de communication - Google Patents

Système de dissipation de chaleur de dispositif de communication Download PDF

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Publication number
WO2014173101A1
WO2014173101A1 PCT/CN2013/086258 CN2013086258W WO2014173101A1 WO 2014173101 A1 WO2014173101 A1 WO 2014173101A1 CN 2013086258 W CN2013086258 W CN 2013086258W WO 2014173101 A1 WO2014173101 A1 WO 2014173101A1
Authority
WO
WIPO (PCT)
Prior art keywords
joint
liquid
cooling module
heat dissipation
bracket
Prior art date
Application number
PCT/CN2013/086258
Other languages
English (en)
Chinese (zh)
Inventor
冉苗苗
李尧
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2014173101A1 publication Critical patent/WO2014173101A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards

Definitions

  • the present invention relates to communication technologies, and in particular, to a heat dissipation system for a communication device. Background technique
  • the communication device usually includes a plurality of communication boards, and each communication board is plugged into a slot provided by the backplane of the machine. Since the size of the machine rejection is smaller and smaller, the integration degree of the communication device is higher and higher. Therefore, the heat dissipation problem of the communication device becomes one of the bottlenecks of the design of the single-board frame.
  • conventional air cooling is used for the communication device, that is, the fan is used to cool the running communication device.
  • the conventional fan cooling and cooling can no longer meet the heat dissipation requirements. At this time, the heat capacity and density are much larger than that of air. As a cooling medium, it has become the most efficient and feasible heat dissipation solution at present. It has broad application prospects and has been widely used in military, medical, and large computer fields.
  • Embodiments of the present invention provide a heat dissipation system for a communication device that solves the problem of heat dissipation of a high power consumption and compact device without changing the layout of the device.
  • embodiments of the present invention use the following technical solutions:
  • a heat dissipation system for a communication device comprising an air cooling module and a liquid cooling module matched with an air cooling module mounting position, and a joint bracket fixed on the communication board, the liquid cooling module An external inlet pipe and a return pipe are connected to the end, and the liquid cooling module is internally provided with a first liquid path communicating with the inlet pipe and a second liquid path communicating with the return pipe, and the front end of the liquid cooling module is provided with a first joint communicating with the liquid passage and a second joint communicating with the second liquid passage, wherein the joint bracket is mounted with a third joint communicating with the water supply pipe on the communication board and a fourth joint communicating with the drain pipe on the communication board The first joint cooperates with the third joint, and the second joint cooperates with the fourth joint.
  • first joint, the second joint, the third joint, and the fourth joint are quick connectors.
  • the liquid cooling module includes a frame body matched with an installation position of the air cooling module and a liquid path body disposed in the frame body, and a rear end of the liquid path body is connected to the external water inlet pipe and back In the water pipe, the first liquid path and the second liquid path are provided inside the liquid path main body, and the first joint and the second joint are provided at the front end of the liquid path main body.
  • the liquid cooling module further includes a mounting plate disposed in the frame, and the liquid path body is fixed on the frame by a mounting plate.
  • the joint bracket is provided with a first mounting hole and a second mounting hole
  • the first mounting hole is provided with a first sleeve, the first sleeve and the first mounting hole a gap fit, and one end of the first sleeve is connected to the third joint, the other end is connected to the water supply pipe of the communication board
  • the second mounting hole is provided with a second sleeve, the second sleeve and the second The mounting hole is clearance-fitted, and one end of the second sleeve is connected to the fourth joint, and the other end is connected to the drain pipe of the communication board.
  • the joint bracket includes a snap-fit upper bracket and a lower bracket, and the upper bracket and the lower bracket are connected by bolts.
  • the fixing block fixed on the communication board is further included, and the joint bracket and the fixing block are connected by screws.
  • the heat dissipation system of the communication device provided by the embodiment of the present invention, because the liquid cooling module and the air cooling module are installed in a matching position, when liquid cooling is required due to high power consumption of the communication board, only liquid cooling is required.
  • the module is installed at the position of the air-cooling module, and is connected to the third joint on the joint bracket through the first joint on the liquid cooling module, and the second joint on the liquid cooling module is connected with the fourth joint on the joint bracket, so that the temperature is low.
  • the water flows through the first liquid path, the first joint, and the third joint to the water inlet pipe on the communication board, and the high temperature water heated by the communication board passes through the drain pipe, the fourth joint, the second joint, and the second liquid path. And finally flow to the return pipe to discharge.
  • the heat dissipation system of the present invention can flexibly configure the heat dissipation module according to the heat dissipation requirement of the actual communication board, and the high power consumption single board uses the liquid cooling module to dissipate heat, and the low power consumption single board uses the air cooling module to dissipate heat.
  • the architecture of the device was not changed during use. Therefore, the heat dissipation system of the present invention solves the problem of heat dissipation of a high power consumption and compact communication device without changing the device architecture.
  • FIG. 1 is a schematic structural diagram of a rear side of a heat dissipation system of a communication device according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of an air cooling module according to an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of a liquid cooling module according to an embodiment of the present invention.
  • Figure 4 is a schematic view showing the internal structure of the liquid cooling module shown in Figure 3;
  • FIG. 5 is a schematic structural view of a front side of a heat dissipation system of a communication device according to an embodiment of the present invention
  • FIG. 6 is a schematic structural view of the connector bracket shown in FIG.
  • Figure 7 is a cross-sectional view of the joint bracket shown in Figure 5;
  • Figure 8 is a cross-sectional view of the quick connector shown in Figure 5. detailed description
  • an embodiment of the present invention provides a heat dissipation system for a communication device, where the heat dissipation system includes an air cooling module 1, a liquid cooling module 2 matched with an air cooling module mounting position 10, and a fixed a joint bracket 5 on the communication board, an external inlet pipe 31 and a return pipe 32 are connected to the rear end of the liquid cooling module 2, and a first liquid path (not shown) connected to the inlet pipe 31 is provided inside the liquid cooling module 2.
  • a second liquid passage (not shown) communicating with the return pipe 32, the front end of the liquid cooling module 2 is provided with a first joint 221 communicating with the first liquid passage and a second joint 222 communicating with the second liquid passage, and a joint
  • a third joint 51 1 communicating with a water supply pipe (not shown) on the communication board 6 and a fourth joint 512 communicating with a drain pipe (not shown) on the communication board 6 are mounted on the bracket 5, and the first joint 221 is attached.
  • the second joint 222 mates with the fourth joint 5 12 .
  • the heat dissipation system of the communication device provided by the embodiment of the present invention, because the liquid cooling module 2 is matched with the air cooling module mounting position 10, when the liquid cooling is required due to the high power consumption of the communication board, only the liquid is needed.
  • the cold module 2 is installed at the air-cooling module mounting position 10, and is connected to the third joint 51 1 on the joint bracket 5 through the first joint 22 1 on the liquid-cooling module 2, and the second joint 222 on the liquid-cooling module 2 Connected to the fourth joint on the joint bracket 5, so that the low temperature water flows through the first liquid passage, the first joint, and the third joint to the water inlet pipe on the communication board, and the high temperature water heated by the communication board passes through the drain pipe.
  • This cycle achieves liquid cooling of the communication board.
  • the communication board does not need liquid cooling, simply disconnect the interconnected connectors and install the air-cooling module. Therefore, the heat dissipation system of the present invention can flexibly configure the heat dissipation module according to the heat dissipation requirement of the actual communication board, and the high power consumption single board uses the liquid cooling module to dissipate heat, and the low power consumption single board uses the air cooling module to dissipate heat, during use. There is no change to the architecture of the device. Therefore, the heat dissipation system of the present invention solves the problem of heat dissipation of high power consumption and compact communication equipment without changing the equipment architecture.
  • the communication board 6 is inserted into the slot provided by the machine backplane, and the air cooling module is coupled with the corresponding connector on the back panel of the device by the fan monitoring board.
  • Embodiments design the liquid cooling module to match the air cooling module mounting position, more specifically By designing the liquid-cooled module and the air-cooling module to have the same structure, the two can be flexibly replaced, so the structure of the device is not changed.
  • the air-cooling module 11 is a structure as shown in FIG. 2, and includes a frame 11 and a fan 12 disposed in the frame 11. Therefore, in the embodiment of the present invention, the liquid cooling module is designed to be the same with the frame 11. The shape and structure are the same.
  • the first joint 221, the second joint 222, the third joint 511, and the fourth joint 512 in the above embodiment are quick connectors.
  • the quick connector is used when the male connector is used with the female connector, as shown in Figure 8, which is a schematic diagram of the connection state between the male connector and the female connector.
  • the first joint 801 and the first spring 802 are disposed in the male joint 80
  • the second piston and the second spring 902 are disposed in the female joint 90
  • the second piston includes a piston rod 9012 fixedly coupled to the bottom of the female joint 90 and axially Moving sleeve 9011.
  • the first piston 801 in the male connector 80 is pressed against the top opening (left end) of the male connector 80 by the compressive elastic force of the first spring 802.
  • the road is closed.
  • the sleeve 9011 in the female connector 90 also abuts against the top opening (right end) of the female connector 90 by the compressive spring force of the second spring 902, at which time the head of the piston rod 9012 engages the sleeve to close the fluid path.
  • the male connector 80 When the male connector 80 needs to be connected to the female connector 90, the male connector 80 is forcefully inserted into the female connector 90, and the sleeve 9011 of the second piston moves to the bottom of the female connector 90 under the action of the wall of the male connector 80, the piston rod The head of the 9012 protrudes from the right end of the sleeve, and the piston rod 9012 pushes the first piston 801 in the male joint 80 toward the bottom of the male joint 80, thereby achieving the conduction of the liquid passage.
  • the male connector when it is necessary to disconnect the male connector from the female connector, the male connector is forcedly pulled out from the female connector, and the sleeve is returned by the resilience of the second spring under the resilience of the second spring. In the initial state, the liquid path is closed. There is no liquid leakage during the connection and disconnection of the male connector and the female connector.
  • the first joint, the second joint, the third joint, and the fourth joint may both be a male joint or a female joint, as long as the first joint and the third joint are matched with each other, and the second joint And the fourth joint is a joint that cooperates with each other.
  • FIG. 3 shows three pairs of first joints and second joints, so the liquid cooling module can be connected to three communication boards, but the invention is not limited to three pairs of first joints and second joints, and the specific pair thereof The number depends on the number of communication boards corresponding to a liquid cooling module.
  • the arrangement of the quick connector in the liquid cooling module of the present invention may be lateral, It can also be vertical.
  • the structure of the quick connector can be other types as long as there is no liquid leakage when plugging and disconnecting.
  • the liquid cooling module 2 includes a frame 21 that cooperates with the air cooling module mounting position 10 and a liquid path main body 22 that is disposed in the frame body 21.
  • the rear end of the liquid path main body 22 is connected to the external inlet water pipe 31 and the return water pipe. 32.
  • the first liquid passage and the second liquid passage are provided inside the liquid passage main body 22, and the first joint 221 and the second joint 222 are provided at the front end of the liquid passage main body 22.
  • the general machine rejection has a plurality of air-cooling module mounting positions as shown in Fig. 1.
  • the process becomes complicated. Designing the same structure of the frame is relatively simple.
  • the embodiment can design the frame section into a square shape, and only need to rotate 90. , it can be compatible with liquid cooling of horizontal plug-in and vertical plug-in communication boards.
  • the liquid cooling module further includes a mounting plate 23 provided in the casing, and the liquid path main body 22 is fixed to the frame 21 by a mounting plate 23.
  • a mounting plate 23 provided in the casing, and the liquid path main body 22 is fixed to the frame 21 by a mounting plate 23.
  • the joint bracket 5 is provided with a first mounting hole and a second mounting hole
  • the first mounting hole is provided with a first sleeve 521, a first sleeve 521 and a first The mounting hole is gap-fitted, and one end of the first sleeve 521 is connected to the third joint 511, and the other end is connected to the water supply pipe of the communication board
  • the second mounting hole is provided with a second sleeve 522
  • the second The sleeve 522 is clearance-fitted with the second mounting hole, and one end of the second sleeve 522 is connected to the fourth joint 512 and the other end is connected to the drain pipe of the communication board.
  • the third joint and the fourth joint can be rotated in the respective mounting holes, resulting in less floating in the radial direction, reducing the tolerance effect of the joint design, and reducing the high cooperation of the quick joints. Precision requirements.
  • the joint bracket includes a snap-fit upper bracket 531 and a lower bracket 532, and the upper bracket 531 and the lower bracket 532 are connected by bolts.
  • a bolt hole 541 is disposed on the upper bracket 531
  • a bolt hole 542 corresponding to the bolt hole 541 is disposed on the lower bracket 532, and bolts are bored in the bolt holes 541, 542 to realize the upper bracket 531 and the lower bracket 532. connection. This facilitates the design of the joint bracket and the mounting of the sleeve.
  • the heat dissipation system of the present invention further includes a fixing block fixed to the communication board, and the joint bracket and the fixing block are connected by screws. In this way, the connector bracket and the communication board are detachably connected. When the communication board needs to be liquid-cooled, the connector bracket is mounted on the communication board, otherwise it is removed, which is favorable for air-cooling when hot air is cooled. Exchange.
  • the liquid path main body in the above embodiment may also be designed as a hose with only a quick connector, and the hose is fixed on the frame of the liquid cooling module.
  • the communication is performed.
  • the quick connector on the board can communicate with the quick connector on the hose to achieve liquid cooling of the high power communication board.

Abstract

L'invention concerne un système de dissipation de chaleur d'un dispositif de communication destiné à résoudre le problème de dissipation de chaleur d'un dispositif de communication fortement consommateur d'énergie et compact sans modifier l'agencement du dispositif. La présente invention se rapporte aux technologies de communication. Le système de dissipation de chaleur selon la présente invention comprend : un module de refroidissement par air, un module de refroidissement par liquide correspondant à une position de montage du un module de refroidissement par air, et un support de jonction fixé sur une carte de communication. Une extrémité arrière du module de refroidissement par liquide est raccordée à un tuyau d'arrivée d'eau externe et à un tuyau de retour, une première conduite à liquide en communication avec le tuyau d'arrivée d'eau et une deuxième conduite à liquide en communication avec le tuyau de retour sont disposées dans le module de refroidissement par liquide, une extrémité avant du module de refroidissement par liquide est munie d'une première jonction en communication avec la première conduite à liquide et une deuxième jonction en communication avec la deuxième conduite à liquide, une troisième jonction en communication avec un tuyau d'alimentation en eau sur la carte de communications et une quatrième jonction en communication avec un tuyau d'écoulement d'eau sur la carte de communication sont montées sur le support de jonction, la première jonction coïncidant avec la troisième jonction et la deuxième jonction coïncidant avec la quatrième jonction. L'application de la présente invention est la dissipation thermique sur un dispositif de communications.
PCT/CN2013/086258 2013-04-23 2013-10-30 Système de dissipation de chaleur de dispositif de communication WO2014173101A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310143252.5A CN104125743B (zh) 2013-04-23 2013-04-23 通信设备的散热系统
CN201310143252.5 2013-04-23

Publications (1)

Publication Number Publication Date
WO2014173101A1 true WO2014173101A1 (fr) 2014-10-30

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WO (1) WO2014173101A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105992495A (zh) * 2015-02-10 2016-10-05 中兴通讯股份有限公司 一种散热插箱
CN111970908A (zh) * 2020-08-26 2020-11-20 中航光电科技股份有限公司 一种有源无源两用液冷散热器及制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201210780Y (zh) * 2008-06-19 2009-03-18 张军才 循环水冷和风冷散热装置
EP2088843A1 (fr) * 2008-02-07 2009-08-12 Siemens Aktiengesellschaft Österreich Filtre refroidi par liquide ou composants de filtre
CN201393137Y (zh) * 2009-04-03 2010-01-27 珠海运控电机有限公司 新型散热器及其散热的电机驱动器
CN202103998U (zh) * 2011-06-09 2012-01-04 张君义 风水混合散热装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201601940U (zh) * 2010-01-26 2010-10-06 中兴通讯股份有限公司 一种水冷散热模块
CN102159051B (zh) * 2010-02-12 2013-05-01 台达电子工业股份有限公司 模块化散热装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2088843A1 (fr) * 2008-02-07 2009-08-12 Siemens Aktiengesellschaft Österreich Filtre refroidi par liquide ou composants de filtre
CN201210780Y (zh) * 2008-06-19 2009-03-18 张军才 循环水冷和风冷散热装置
CN201393137Y (zh) * 2009-04-03 2010-01-27 珠海运控电机有限公司 新型散热器及其散热的电机驱动器
CN202103998U (zh) * 2011-06-09 2012-01-04 张君义 风水混合散热装置

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CN104125743A (zh) 2014-10-29
CN104125743B (zh) 2017-11-24

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