CN216600605U - Liquid cooling heat dissipation computing device - Google Patents
Liquid cooling heat dissipation computing device Download PDFInfo
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- CN216600605U CN216600605U CN202123087319.7U CN202123087319U CN216600605U CN 216600605 U CN216600605 U CN 216600605U CN 202123087319 U CN202123087319 U CN 202123087319U CN 216600605 U CN216600605 U CN 216600605U
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- 238000001816 cooling Methods 0.000 title claims abstract description 89
- 239000007788 liquid Substances 0.000 title claims abstract description 81
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 82
- 239000000110 cooling liquid Substances 0.000 claims abstract description 10
- 238000004891 communication Methods 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a liquid cooling heat dissipation computing device, which comprises: the system comprises a case, a control panel, a liquid cooling operation device, a liquid cooling structure and a power supply; the liquid cooling arithmetic device comprises an arithmetic unit and a liquid cooling plate; the liquid cooling structure comprises a water separator, a water collector and a water pipe; the control board, the liquid cooling operation device and the power supply are arranged in the case, the control board is in communication connection with the operation unit, and the power supply is electrically connected with the control board; the water separator and the water collector are oppositely arranged on one side of the case, and the power connection port and the switch of the power supply are arranged on the other outer side of the case opposite to the liquid cooling structure; the liquid cooling plate is attached to the operation unit; the cooling liquid is conveyed to the liquid cooling plate through a water pipe connected with the water separator to cool the operation unit; and the heat of the arithmetic unit in the cooling liquid is transmitted to the outside of the case through a water pipe connected with the water collector. The liquid cooling heat dissipation computing equipment is water-electricity separated, and high in safety; the liquid cooling is efficient, and complete machine compact structure, small in size, the installation is firm, and loading and unloading are convenient.
Description
Technical Field
The utility model relates to the technical field of computer equipment, in particular to liquid cooling heat dissipation computing equipment.
Background
With the development of computing technology, the computing performance requirements of computing equipment are higher and higher, the power consumption is increased rapidly, the computing equipment needs to process a large amount of data and perform high-speed operation, a large amount of heat is generated in operation, and if the heat cannot be dissipated in time, the element failure or the element damage caused by thermal stress can be caused, and further the server failure is caused.
At present, the heat dissipation scheme of mainstream is forced air cooling, and this scheme is simple easily to be realized, but the heat-sinking capability is limited, along with the sharp increase of the consumption of computing equipment, forced air cooling scheme is difficult to satisfy the heat dissipation demand of high-power consumption computing equipment, and simultaneously air-cooled cooling system has the heat dissipation efficiency low, and the noise is high, requires high scheduling problem to ambient temperature, and traditional forced air cooling heat dissipation scheme is difficult to satisfy the demand of heat dissipation accuse temperature to adopt more efficient liquid cooling heat dissipation technique gradually.
Although the liquid cooling heat dissipation technology is more efficient and can effectively take away heat generated by computing equipment, the liquid cooling heat dissipation technology is not mature enough in the field of computing equipment, and has many problems in the aspect of complete machine integration, for example, water and electricity are not designed separately, so that potential safety hazards exist; the water separator and the water pipe are unreasonably arranged, and cold water and hot water influence each other; a power supply, a control panel and the like are often hung outside the computing unit, and an independent air duct is not arranged, so that hot air of the power supply flows back and the like; the problems of difficulty in assembling the whole machine and the like caused by the fact that a computing unit is not installed are not considered, and the functionality and the appearance of the whole machine are poor.
SUMMERY OF THE UTILITY MODEL
In view of the above, embodiments of the present invention are proposed to provide a liquid-cooled heat dissipation computing device that overcomes or at least partially solves the above mentioned problems.
In order to solve the above problem, an embodiment of the present invention discloses a liquid cooling heat dissipation computing device, including: the system comprises a case, a control panel, a liquid cooling operation device, a liquid cooling structure and a power supply; the liquid cooling operation device comprises an operation unit and a liquid cooling plate; the liquid cooling structure comprises a water separator, a water collector and a water pipe;
the control panel, the liquid cooling operation device and the power supply are arranged in the case, the control panel is in communication connection with the operation unit, and the power supply is electrically connected with the control panel;
the water separator and the water collector are oppositely arranged on one side of the case, and the power connection port and the switch of the power supply are arranged on the other outer side of the case opposite to the liquid cooling structure;
the liquid cooling plate is attached to the operation unit; when the computing equipment works, the cooling liquid is conveyed to the liquid cooling plate through the water pipe connected with the water segregator to cool the operation unit; and the heat of the arithmetic unit in the cooling liquid is transmitted to the outside of the case through the water pipe connected with the water collector.
Preferably, the water separator and the water collector are connected with the water pipe through a leakage-proof quick-connection plug.
Preferably, the liquid cooling plate is connected with the water pipe through the anti-leakage quick-connection plug.
Preferably, an upper guide rail structural part and a lower guide rail structural part are fixedly arranged in the case;
the upper guide rail structural part comprises an upper guide rail and a power supply fixing part arranged opposite to the upper end of the power supply;
the lower guide rail structural part comprises a lower guide rail and a limiting structural part arranged relative to the arithmetic unit.
Preferably, a convex slider is disposed on the operation unit at a position corresponding to the upper guide rail and the lower guide rail.
Preferably, a power supply mounting structural part matched with the lower guide rail is arranged at the bottom of the power supply;
and one side of the power supply mounting structural part, which is opposite to the case, is provided with a limiting hole position matched with the lower guide rail.
Preferably, a fan is arranged inside the power supply;
a first air port matched with the area of the fan is formed in one side of the case;
and the other side of the case is provided with a second air opening relative to the position of the fan.
Preferably, the power supply is electrically connected to the arithmetic unit.
Preferably, the control panel is provided on a control panel mount.
The present application specifically includes the following advantages:
in an embodiment of the present application, a liquid-cooled heat dissipating computing device includes: the system comprises a case, a control panel, a liquid cooling operation device, a liquid cooling structure and a power supply; the liquid cooling operation device comprises an operation unit and a liquid cooling plate; the liquid cooling structure comprises a water separator, a water collector and a water pipe; the liquid cooling structure is arranged on one outer side of the case, and the power connection port and the switch of the power supply are arranged on the other outer side of the case opposite to the liquid cooling structure; the control panel and the arithmetic unit are arranged in the case, and the control panel is in communication connection with the arithmetic unit; the power supply is arranged in the case and is electrically connected with the control panel; the liquid cooling plate is attached to the operation unit; when the computing equipment works, the cooling liquid is conveyed to the liquid cooling plate through the water pipe connected with the water segregator to cool the operation unit; and the heat of the arithmetic unit in the cooling liquid is transmitted to the outside of the case through a water pipe connected with the water collector. The liquid cooling heat dissipation computing equipment adopts water-electricity separation, and the power receiving port, the switch and the water path are respectively arranged at two sides of the case, so that the water-electricity separation is realized, and the safety is high; the liquid cooling efficiency is high, the heat dissipation is fast, and the noise is low; the whole machine has compact structure, small volume, firm installation, convenient assembly and disassembly and high safety; the arithmetic unit and the power supply are installed by adopting a slide rail type structure, and meanwhile, a limit structural part is added, so that the all-round limit of the front and back, the up and down and the left and right is realized, and the structure is firm and reliable and can be conveniently installed and disassembled; the water separator, the water collector and the liquid cooling plate are respectively connected with the water pipe through the anti-leakage quick plug connector, so that the anti-leakage effect can be realized, and the plugging is convenient.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
FIG. 1 is a schematic diagram of a liquid-cooled heat dissipation computing device of the present invention;
FIG. 2 is a schematic diagram of a liquid cooling plate and a liquid cooling structure of a liquid cooling heat dissipation computing device according to the present invention;
fig. 3 is a schematic diagram of a liquid cooling and heat dissipating computing device according to the present invention.
The reference numbers are as follows:
1. a chassis; 11. a first tuyere; 12. a second tuyere; 2. a control panel; 3. a liquid cooling arithmetic device; 31. an arithmetic unit; 32. a liquid-cooled plate; 4. a liquid cooling structure; 41. a water separator; 42. a water collector; 43. a water pipe; 44. a leak-proof quick connector; 5. a power source; 51. an electric connection port; 52. a switch; 53 power supply mounting structure; 6. an upper rail structure; 61. an upper guide rail; 62. a power supply fixing member; 7. a lower guide rail structural member; 71. a lower guide rail; 72. a limiting structural member; 8. control panel installation spare.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, a schematic structural diagram of a liquid cooling heat dissipation computing device according to an embodiment of the present application is shown; a liquid-cooled heat dissipating computing device, comprising: the device comprises a case 1, a control panel 2, a liquid cooling arithmetic device 3, a liquid cooling structure 4 and a power supply 5; the liquid-cooling arithmetic device 3 comprises an arithmetic unit 31 and a liquid-cooling plate 32; the liquid cooling structure 4 comprises a water separator 41, a water collector 42 and a water pipe 43;
the control board 2, the liquid cooling operation device 3 and the power supply 5 are arranged in the case 1, the control board 2 is in communication connection with the operation unit 31, and the power supply 5 is electrically connected with the control board 2;
the water separator 42 and the water collector 42 are oppositely arranged on one side of the case 1, and the power connection port 51 and the switch 52 of the power supply 5 are arranged on the other outer side of the case 1 opposite to the liquid cooling structure 4;
the liquid cooling plate 32 is attached to the arithmetic unit 31; when the computing equipment works, the cooling liquid is conveyed to the liquid cooling plate 32 through the water pipe 43 connected with the water separator 41 to cool the operation unit 31; the water pipe 43 connected to the water collector 42 transports heat of the arithmetic unit 31 in the coolant to the outside of the housing 1.
In an embodiment of the present application, a liquid-cooled heat dissipating computing device includes: the device comprises a case 1, a control panel 2, a liquid cooling arithmetic device 3, a liquid cooling structure 4 and a power supply 5; the liquid-cooling arithmetic device 3 comprises an arithmetic unit 31 and a liquid-cooling plate 32; the liquid cooling structure 4 comprises a water separator 41, a water collector 42 and a water pipe 43; the control board 2, the liquid cooling operation device 3 and the power supply 5 are arranged in the case 1, the control board 2 is in communication connection with the operation unit 31, and the power supply 5 is electrically connected with the control board 2; the water separator 42 and the water collector 42 are oppositely arranged on one side of the case 1, and the power connection port 51 and the switch 52 of the power supply 5 are arranged on the other outer side of the case 1 opposite to the liquid cooling structure 4; the position of the electrical connection and the position of the switch are separated from the position of the water separator, water and electricity are separated, and the safety is high. The liquid cooling plate 32 is attached to the arithmetic unit 31; when the computing equipment works, the cooling liquid is conveyed to the liquid cooling plate 32 through the water pipe 43 connected with the water separator 41 to cool the operation unit 31; the water pipe 43 connected to the water collector 42 transports heat of the arithmetic unit 31 in the coolant to the outside of the housing 1. For air cooling and other modes, liquid cooling is efficient, and the heat dissipation is fast, and the noise is low, and through the structure setting of water and electricity separation, improve the security of equipment greatly.
Hereinafter, a liquid-cooled heat dissipation computing apparatus in the present exemplary embodiment will be further described.
Referring to fig. 2, a schematic diagram of connection between a liquid cooling plate and a liquid cooling structure of a liquid cooling heat dissipation computing device according to the present invention is shown; referring to fig. 3, a schematic diagram of a liquid cooling heat dissipation computing device of the present invention is shown.
In an embodiment of the present invention, the water separator 41 and the water collector 42 are respectively connected to the water pipe 43 through a leakage-proof quick connector 44, so as to prevent leakage, facilitate insertion and extraction, and facilitate operation.
In an embodiment of the present invention, the liquid cooling plate 32 is connected to the water pipe 43 through the anti-leakage quick connector 44, so as to prevent leakage, facilitate insertion and extraction, and facilitate operation.
In an embodiment of the present invention, an upper rail structural member 6 and a lower rail structural member 7 are further fixedly disposed in the chassis 1; the upper guide rail structure 6 comprises an upper guide rail 61 and a power supply fixing part 62 arranged relative to the upper end of the power supply 5; the lower rail structure 7 includes a lower rail 71 and a limit structure 72 provided with respect to the arithmetic unit 31.
In an embodiment of the present invention, a convex slider is disposed on the operation unit 31 at a position corresponding to the upper guide rail 61 and the lower guide rail 71. The arithmetic unit 31 is installed by adopting a sliding rail type structure, an upper guide rail structure and a lower guide rail structure are adopted, the arithmetic unit 31 can be installed and disassembled quickly, meanwhile, the limiting structural part 72 is additionally arranged on the lower guide rail 71, the arithmetic unit 31 is limited in combination with the rear side of the case 1, all-directional limiting is realized, and the structure is firm and reliable and can be installed and disassembled conveniently.
In an embodiment of the present invention, a power supply mounting structure 53 matched with the lower rail 71 is disposed at the bottom of the power supply 5; a limiting hole position matched with the lower guide rail 71 is arranged on one side of the power supply mounting structural part 53 relative to the case 1; the power supply 5 also adopts a slide rail type installation mode, and the power supply 5 is firmly installed by limiting the position of the limit vacancy and the power supply fixing part 62 and fixedly locking the power supply and one side of the case by screws.
In an embodiment of the present invention, a fan is disposed inside the power supply 5; a first air port 11 matched with the area of the fan 5 is arranged at one side of the case 1; the other side of the case 1 is provided with a second air port 12 corresponding to the position of the fan; the specific first air port is an air inlet, the second air port is an air outlet, when the air inlet is matched with the air inlet area of the fan, and the air outlet area is large enough, smooth circulation of air quantity can be achieved, and the best heat dissipation performance of the power supply is guaranteed.
In an embodiment of the present invention, the power source 5 is electrically connected to the operation unit 31.
In an embodiment of the utility model, the control panel 2 is arranged on a control panel mounting 8.
Compared with the prior art, the liquid cooling heat dissipation computing equipment has the advantages that the whole machine assembly, the air duct design, the pipeline flow passage design and the safety design are optimized; water and electricity are separated, and the power receiving port, the switch and the water path are respectively arranged on two sides of the case, so that the water and electricity are separated, and the safety is high; the liquid cooling efficiency is high, the heat dissipation is fast, and the noise is low; the whole machine has compact structure, small volume, firm installation, convenient assembly and disassembly and high safety.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above detailed description is given to the liquid cooling heat dissipation computing device provided by the present application, and a specific example is applied in the detailed description to explain the principle and the implementation of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (9)
1. A liquid-cooled heat-dissipating computing device, comprising: the system comprises a case, a control panel, a liquid cooling operation device, a liquid cooling structure and a power supply; the liquid cooling operation device comprises an operation unit and a liquid cooling plate; the liquid cooling structure comprises a water separator, a water collector and a water pipe;
the control panel, the liquid cooling operation device and the power supply are arranged in the case, the control panel is in communication connection with the operation unit, and the power supply is electrically connected with the control panel;
the water separator and the water collector are oppositely arranged on one side of the case, and the power connection port and the switch of the power supply are arranged on the other outer side of the case opposite to the liquid cooling structure;
the liquid cooling plate is attached to the operation unit; when the computing equipment works, the cooling liquid is conveyed to the liquid cooling plate through the water pipe connected with the water segregator to cool the operation unit; and the heat of the arithmetic unit in the cooling liquid is transmitted to the outside of the case through the water pipe connected with the water collector.
2. The liquid-cooled, heat-dissipating computing device of claim 1, wherein the water diverter and the water collector are connected to the water pipe by a leak-proof quick-connect fitting.
3. The liquid-cooled, heat-dissipating computing device of claim 2, wherein the liquid-cooled plate is connected to the water pipe by the quick-connect leak-proof connector.
4. The liquid-cooled heat dissipating computing device of claim 1, wherein an upper rail structure and a lower rail structure are also fixedly disposed within the chassis;
the upper guide rail structural part comprises an upper guide rail and a power supply fixing part arranged opposite to the upper end of the power supply;
the lower guide rail structural part comprises a lower guide rail and a limiting structural part arranged relative to the arithmetic unit.
5. The liquid-cooled heat dissipation computing device of claim 4, wherein the computing unit has raised sliders at locations corresponding to the upper and lower rails.
6. The liquid-cooled heat dissipating computing device of claim 1, wherein a power mounting structure is provided on a bottom of the power supply that mates with the lower rail;
and one side of the power supply mounting structural part, which is opposite to the case, is provided with a limiting hole position matched with the lower guide rail.
7. The liquid-cooled, heat-dissipating computing device of claim 6, wherein a fan is disposed within the power supply;
a first air port matched with the area of the fan is formed in one side of the case;
and the other side of the case is provided with a second air opening relative to the position of the fan.
8. The liquid-cooled heat dissipating computing device of claim 1, wherein the power source is electrically connected to the arithmetic unit.
9. The liquid cooled, heat dissipating computing device of claim 1, wherein the control board is disposed on a control board mount.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202123087319.7U CN216600605U (en) | 2021-12-09 | 2021-12-09 | Liquid cooling heat dissipation computing device |
Applications Claiming Priority (1)
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CN202123087319.7U CN216600605U (en) | 2021-12-09 | 2021-12-09 | Liquid cooling heat dissipation computing device |
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CN216600605U true CN216600605U (en) | 2022-05-24 |
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CN202123087319.7U Active CN216600605U (en) | 2021-12-09 | 2021-12-09 | Liquid cooling heat dissipation computing device |
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- 2021-12-09 CN CN202123087319.7U patent/CN216600605U/en active Active
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Address after: 1101, Building D1, Nanshan Zhiyuan, No. 1001 Xueyuan Avenue, Changyuan Community, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province, 518055 Patentee after: SHENZHEN HANQIANG TECHNOLOGY Co.,Ltd. Address before: Unit ghijklm, block B, 7 / F, building 7, Baoneng Science Park, Qinghu village, Qinghu community, Longhua street, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN HANQIANG TECHNOLOGY Co.,Ltd. |
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