CN220545332U - Cooling structure and electronic equipment - Google Patents
Cooling structure and electronic equipment Download PDFInfo
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- CN220545332U CN220545332U CN202321368695.XU CN202321368695U CN220545332U CN 220545332 U CN220545332 U CN 220545332U CN 202321368695 U CN202321368695 U CN 202321368695U CN 220545332 U CN220545332 U CN 220545332U
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- electronic equipment
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- 238000001816 cooling Methods 0.000 title claims abstract description 113
- 238000004891 communication Methods 0.000 claims abstract description 66
- 238000012545 processing Methods 0.000 claims abstract description 10
- 238000012546 transfer Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 29
- 239000002826 coolant Substances 0.000 claims description 16
- 210000001503 joint Anatomy 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- 238000003032 molecular docking Methods 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a cooling structure and electronic equipment, relates to electronic equipment technical field. The cooling structure comprises at least one cooling unit, and each cooling unit is arranged at one processing module; a first transfer member in communication with the inlet of the at least one cooling unit; the second adapter is communicated with the outlet of the at least one cooling unit; the first adapter and the second adapter are respectively connected to the electronic equipment shell. According to the technical scheme, the inlet and outlet of each cooling unit can be respectively communicated through each adapter, the first adapter and the second adapter are connected with the shell of the electronic equipment, the communication of the pipeline can be switched, occupation of the IO board is avoided, and the technical problems that in the prior art, the occupied space of the water-cooled pipeline support is large, configuration is influenced, maintenance and wire harness plugging of the IO board are not facilitated, and the produced die cost is high can be solved.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a cooling structure and electronic equipment.
Background
The heat dissipation modes of the processing equipment such as the server are mainly divided into air cooling and water cooling, and compared with air cooling, the heat dissipation effect of water cooling is better, and the heat dissipation method is more applicable to the products with large power consumption such as the server in performance. The water cooling scheme of the current 2U server mainly comprises the following steps: the water cooling plates of the two CPUs are connected in series through pipelines, one end of the water cooling plates is communicated with the water inlet pipeline, the other end of the water cooling plates is communicated with the water outlet pipeline, and the water inlet pipeline and the water outlet pipeline extend out of the middle of the upper part of the server main board and are fixed on the server shell through pipeline brackets. This arrangement has the following drawbacks: the lower part of the pipeline bracket is usually fixed on the IO board, which is not beneficial to the maintenance of the IO board; the pipeline of the water cooling scheme occupies the corresponding position of the external socket, so that the support of each configuration is influenced; the space area occupied by the wiring of the pipeline on the main board is large, so that the plugging of the wire harness on the main board is influenced; for different configurations or products, the structures of the pipeline brackets are different, so that various pipeline brackets with different models are generated, and the mold cost is superposed, which is not beneficial to cost control.
Accordingly, there is a need for a cooling structure to address at least the above-mentioned problems.
Disclosure of Invention
The utility model provides a cooling structure and electronic equipment to at least, solve the problem that current scheme water-cooled pipeline support occupation space is big, influence the configuration and be unfavorable for the maintenance of IO board and pencil plug, and the mould expense of production is many.
In order to solve the technical problems, the embodiment of the application provides the following technical scheme:
a first aspect of the present application provides a cooling structure for a processing module of an electronic device, comprising: at least one cooling unit, each of said cooling units being disposed at one of said process modules; a first adapter in communication with an inlet of at least one of the cooling units; a second adapter in communication with an outlet of at least one of the cooling units; the first adapter and the second adapter are respectively connected to the electronic equipment shell.
In some embodiments of the present application, the first adapter and the second adapter respectively comprise an adapter housing, a cavity is arranged in the adapter housing, one end of the adapter housing is provided with a first communication port, the other end of the adapter housing is provided with a second communication port, and the first communication port and the second communication port are respectively communicated with the cavity.
In some embodiments of the present application, the electronic device further comprises a liquid inlet pipeline and a liquid outlet pipeline, wherein the liquid inlet pipeline is located outside the electronic device casing and is used for providing a cooling medium, the second communication port of the first adapter is communicated with the liquid inlet pipeline, and the second communication port of the second adapter is communicated with the liquid outlet pipeline.
In some embodiments of the present application, the transfer housing is rectangular in cross-section perpendicular to the direction of ingress and egress of the cooling medium.
In some embodiments of the present application, the cooling units are a plurality of, and the plurality of cooling units are sequentially communicated; the first communication port of the first adapter communicates with an inlet of the cooling unit located upstream, and the first communication port of the second adapter communicates with an outlet of the cooling unit located downstream.
In some embodiments of the present application, the first adapter and the second adapter are disposed opposite to each other, and the first communication ports of the first adapter and the second adapter are disposed on opposite surfaces of the first adapter and the second adapter, respectively, or on end surfaces of the first adapter and the second adapter facing the cooling unit, respectively.
In some embodiments of the present application, at least one connection portion is disposed on the adapter housing, and the electronic device housing is provided with a docking portion, and the connection portion is connected with the docking portion.
In some embodiments of the present application, the connection portion is a mounting hole, the mounting hole penetrates through the first adapter or the second adapter along a connection direction of the first adapter and the second adapter, and a hole wall of the mounting hole is in sealing connection with the cavity.
In some embodiments of the present application, the docking portion is a docking hole, and the mounting hole is connected to the docking hole through a connector.
A second aspect of the present application provides an electronic device comprising the cooling structure provided in the first aspect of the present application.
Compared with the prior art, the cooling structure provided by the first aspect of the application is connected with the electronic equipment shell through the first adapter and the second adapter, so that the communication and the switchover of pipelines are realized, the arrangement of different pipeline brackets is avoided, and the die opening cost caused by different configuration requirements is saved; the first adapter and the second adapter are connected with the electronic equipment shell, occupation of the IO board can be avoided, maintenance of the IO board is prevented from being influenced, and wiring space on the main board can be occupied less.
The electronic device provided in the second aspect of the present application has the same or similar technical effects as the cooling structure provided in the first aspect of the present application.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like reference numerals refer to similar or corresponding parts and in which:
FIG. 1 illustrates a top view of a cooling structure within an electronic device according to one exemplary embodiment of the present application;
FIG. 2 illustrates a schematic diagram of a cooling structure within an electronic device according to an exemplary embodiment of the present application;
FIG. 3 illustrates a schematic structural view of a first adapter in a cooling structure of an exemplary embodiment of the present application;
FIG. 4 illustrates a top view of a first adapter in a cooling structure of an exemplary embodiment of the present application;
FIG. 5 illustrates a front view of a first adapter in a cooling structure of an exemplary embodiment of the present application;
fig. 6 illustrates a top view of a second adapter in a cooling structure of an exemplary embodiment of the present application.
Reference numerals illustrate:
1. a cooling unit; 2. a first adapter; 201. a transfer housing; 202. a first communication port; 203. a second communication port; 204. a mounting hole; 3. a second adapter; 4. a liquid inlet pipeline; 5. a liquid outlet pipeline; 6. an electronic device housing; 601. and (5) butting holes.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.
The heat dissipation modes of the processing equipment such as the server are mainly divided into air cooling and water cooling, and compared with air cooling, the heat dissipation effect of water cooling is better, and the heat dissipation method is more applicable to the products with large power consumption such as the server in performance. The water cooling scheme of the 2U server in the prior art mainly comprises the following steps: the water cooling plates of the two CPUs are connected in series through pipelines, one end of the water cooling plates is communicated with the water inlet pipeline, the other end of the water cooling plates is communicated with the water outlet pipeline, and the water inlet pipeline and the water outlet pipeline extend out of the middle of the upper part of the server main board and are fixed on the server shell through pipeline brackets. This arrangement has the following drawbacks: the water inlet pipeline and the water outlet pipeline are fixed through the pipeline bracket, and the pipeline bracket is usually fixed on the IO plate, so that the maintenance of the IO plate is not facilitated; the pipeline of the water cooling scheme occupies the corresponding position of the external socket, so that the support of each configuration is influenced; the space area occupied by the wiring of the pipeline on the main board is large, so that the plugging of the wire harness on the main board is influenced; for different configurations or products, the structures of the pipeline brackets are different, so that various pipeline brackets with different models are generated, and the mold cost is superposed, which is not beneficial to cost control.
Example 1
In order to solve the problems existing in the prior art, embodiments of the present application provide a cooling structure, as shown in fig. 1 and 2, for a processing module of an electronic device, including at least one cooling unit 1, where each cooling unit 1 is disposed at one processing module; a first adapter 2, the first adapter 2 being in communication with an inlet of at least one cooling unit 1; a second adaptor 3, the second adaptor 3 being in communication with an outlet of at least one cooling unit 1; wherein the first adapter 2 and the second adapter 3 are respectively connected to the electronic device housing 6.
The electronic equipment can be the server, also can use the computer of water-cooled heat dissipation scheme, or other mobile terminals, the cooling structure that the embodiment of this application provided, first adaptor 2 and second adaptor 3 are fixed in electronic equipment's casing, compare in the scheme that the pipeline support took the IO board among the prior art, can practice thrift installation space, avoid taking the IO board, perhaps influence the maintenance of IO board and the plug of pencil on the mainboard.
According to the cooling structure provided by the embodiment of the application, the first adapter 2 is communicated with the inlet of the cooling unit 1, the second adapter 3 is communicated with the outlet of the cooling unit 1, and the whole cooling structure is communicated, wherein the electronic equipment shell 6 is in a frame shape, the first adapter 2 and the second adapter 3 are respectively arranged at the frame, pipelines respectively communicated with the cooling unit 1 and the first adapter 2 and/or communicated with the second adapter 3 and the cooling unit 1 can be distributed along the electronic equipment shell 6, and can be fixed through the electronic equipment shell 6, so that the arrangement of pipeline brackets with different structures can be avoided, and the die sinking cost caused by different configuration requirements is saved; the first adapter 2 and the second adapter 3 are connected with the electronic equipment shell 6, so that occupation of the IO board can be avoided, the influence on maintenance of the IO board and the plugging of the wire harness on the main board can be avoided, and the wiring space on the main board can be occupied less.
Specifically, the cooling units 1 are cold plates, each for cooling one of the process modules, with which the first adapter 2 and the second adapter 3 can communicate via pipes, respectively.
As shown in fig. 3 to 6, the first adaptor 2 and the second adaptor 3 respectively include a adaptor housing 201, a cavity is provided in the adaptor housing 201, one end of the adaptor housing 201 is provided with a first communication port 202, the other end of the adaptor housing 201 is provided with a second communication port 203, and the first communication port 202 and the second communication port 203 are respectively communicated with the cavity. The first communication port 202 is for communication with the cooling unit 1, and the second communication port 203 is for communication with an external cooling circuit.
The first communication port 202 and the second communication port 203 are respectively communicated with the cavity, so that some medium with fluidity can flow in the cavity and flow in or out from the first communication port 202 and the second communication port 203.
Specifically, as shown in fig. 3 to 6, the first communication port 202 and the second communication port 203 may be provided to protrude from the adaptor housing 201, respectively, to facilitate connection of the pipes.
In some embodiments of the present application, as shown in fig. 1 and 2, the cooling structure further includes a liquid inlet pipe 4 and a liquid outlet pipe 5 located outside the electronic device housing 6, the liquid inlet pipe 4 is used for providing a cooling medium, the second communication port 203 of the first adapter 2 is communicated with the liquid inlet pipe 4, and the second communication port 203 of the second adapter 3 is communicated with the liquid outlet pipe 5, so as to form a cooling circuit.
The cooling medium plays a role in cooling the electronic processing module, and can be various media with fluidity, for example, the cooling medium can be cooling water, and the water is ideal cooling medium, is universal and rich, is convenient to take and recycle, is low in cost and easy to process, can not be obviously expanded and compressed in a commonly used temperature range, and is not easy to decompose.
The cooling medium enters the cavity of the first adapter 2 from the liquid inlet pipeline 4 through the second communication port 203 of the first adapter 2, and then enters the cavity of the second adapter 3 through the first communication port 202 of the second adapter 3 after passing through the cooling units 1 in turn for cooling and heat exchange through the first communication port 202 of the first adapter 2, and enters the liquid outlet pipeline from the second communication port 203 of the second adapter 3, and returns to the cooling medium supply source to realize cooling circulation.
The first adaptor 2 is communicated with the liquid inlet pipeline 4, the second adaptor 3 is communicated with the liquid outlet pipeline 5, so that the cooling medium flows into the cavity of the first adaptor 2 from the liquid inlet pipeline 4 through the second communication port 203 of the first adaptor 2, flows out of the first communication port 202 of the first adaptor 2, is used for cooling the cooling unit 1, flows into the cavity of the second adaptor 3 through the first communication port 202 of the second adaptor 3, and flows into the liquid outlet pipeline 5 from the second communication port 203 of the second adaptor 3.
Specifically, the adaptor housing 201 has a rectangular cross section perpendicular to the in-out direction of the cooling medium.
The structures of the first adaptor 2 and the second adaptor 3 may be identical or symmetrical, so that unnecessary mold opening cost caused by molds of different types is avoided, the adaptor housing 201 may be rectangular, L-shaped or irregular square structure, the specific shape is not limited, and the cavity arranged inside is set according to the mold of the adaptor housing 201.
In some embodiments of the present application, the cooling units 1 are plural, and the plural cooling units 1 are sequentially communicated; the first communication port 202 of the first adapter 2 communicates with the inlet of the cooling unit 1 located upstream, and the first communication port 202 of the second adapter 3 communicates with the outlet of the cooling unit 1 located downstream.
Between adjacent cooling units 1, the cooling units 1 and the first adapter 2 or the second adapter 3 can be communicated by utilizing a pipeline, the pipeline can be a hose which is convenient to bend, and each cooling unit 1 and each first adapter 2 and each second adapter 3 are communicated in series by utilizing the hose, so that a cooling medium flows to each cooling unit 1 in the hose.
In some embodiments of the present application, as shown in fig. 1, the first adapter 2 and the second adapter 3 are disposed opposite to each other, and the first communication ports 202 of the first adapter 2 and the second adapter 3 are disposed on opposite surfaces of the first adapter 2 and the second adapter 3, or on end surfaces of the first adapter 2 and the second adapter 3 facing the cooling unit 1, respectively, and may also be disposed on surfaces of the first adapter 2 and the second adapter 3 facing away from the substrate of the electronic device.
The first connecting piece 2 and the second connecting piece 3 are oppositely arranged and connected to the electronic equipment shell 6, wiring space on the main board can be occupied less, maintenance of the IO board is avoided, the first communication ports 202 of the first connecting piece 2 and the second connecting piece 3 are respectively arranged on opposite surfaces of the first connecting piece 2 and the second connecting piece 3, or the first communication ports 203 of the first connecting piece 2 and the second connecting piece 3 are respectively arranged on end surfaces of the first connecting piece 2 and the second connecting piece 3, which face the cooling unit 1, the second communication ports 203 of the first connecting piece 2 and the second connecting piece 3 are respectively arranged at one ends of the first connecting piece 2 and the second connecting piece 3, which face the outside of the electronic equipment and extend out, connection with the liquid inlet pipeline 4 and the liquid outlet pipeline 5 can be facilitated, wiring space on an external socket and the main board is avoided, and plugging of a wire harness on the main board is affected.
Specifically, at least one connection portion is provided on the adapter housing 201, and the electronic device housing 6 is provided with a docking portion, and the connection portion is connected to the docking portion.
The connection part and the butt joint part can be correspondingly arranged, and the connection part is connected with the butt joint part, so that the connection piece is fixed on the electronic equipment shell 6.
Specifically, the connection portion is a mounting hole 204, the mounting hole 204 penetrates through the first adaptor 2 or the second adaptor 3 along the connection direction of the first adaptor 2 and the second adaptor 3, and the hole wall of the mounting hole 204 is in sealing connection with the cavity.
The size of the mounting hole 204 must not exceed the range of the edge of the adapter housing 201, so that the first communication port 202 and the second communication port 203 can still be communicated with the cavity, the cooling medium can flow out from the first communication port 202 through the cavity, the tightness of the cavity needs to be ensured at the mounting hole 204, and the cooling medium is not leaked.
Specifically, the docking portion includes a docking hole 601, and the mounting hole 204 is connected to the docking hole 601 through a connector.
The connector may be a commercially available standard such as a bolt, and is not limited herein.
The first adapter 2 or the second adapter 3 can be directly fixed at the frame of the electronic equipment shell 6 in a bolt connection mode, so that interference with the functional module is avoided, the space at the frame is fully utilized, and wiring is easy.
The abutting portion and the connecting portion may also be a clamping structure, for example, a clamping hole and a clamping block are matched, so that the first adapter 2 or the second adapter 3 and the electronic device housing are clamped and fixed.
The cooling structure provided by the embodiment of the application has the following working process:
the liquid inlet pipeline 4 is communicated with the second communication port 203 of the first adapter 2, the first communication port 202 of the first adapter 2 is communicated with the inlet of the cooling unit 1 positioned at the upstream through a pipeline, a plurality of cooling units 1 are sequentially communicated through pipelines, the outlet of the cooling unit 1 positioned at the tail position at the downstream is communicated with the first communication port 202 of the second adapter 3, the second communication port 203 of the second adapter 3 is communicated with the liquid outlet pipeline 5, and the first adapter 2 and the second adapter 3 are oppositely arranged and are respectively connected and fixed with the electronic equipment shell 6 through connecting pieces. The cooling medium flowing out of the liquid inlet pipeline 4 sequentially enters each cooling unit through the first adapter 2 to cool the functional module of the electronic equipment, and then flows out of the electronic equipment through the liquid outlet pipeline 5 through the second adapter 3.
The cooling structure that this application embodiment provided can save the use of pipeline support, need not to carry out the die sinking design again, utilizes first adaptor 2 and second adaptor 3 to realize cooling unit 1 and external cooling circuit's intercommunication, and the commonality is strong to can avoid the occupation to the IO board, avoid influencing the maintenance of IO board, and can less occupation the space of walking on the mainboard.
Example 2
Embodiments of the present application provide an electronic device including the cooling structure provided in embodiment 1 of the present application.
The application provides electronic equipment, can be for the 2U server that present computer field used, including such as processing module, cooling unit sets up one side of keeping away from the base plate on processing module, the server still includes the IO board, compare the pipeline support in prior art and fix on the IO board, influence its maintenance, the electronic equipment that this application provided, cooling structure's pipeline can be laid along the frame of electronic equipment casing, practices thrift and occupies the space of walking on the mainboard, avoids influencing the plug of pencil and the maintenance of IO board on the mainboard.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A cooling structure for a processing module of an electronic device, comprising:
at least one cooling unit, each of said cooling units being disposed at one of said process modules;
a first adapter in communication with an inlet of at least one of the cooling units;
a second adapter in communication with an outlet of at least one of the cooling units;
the first adapter and the second adapter are respectively connected to the electronic equipment shell.
2. The cooling structure according to claim 1, wherein,
the first adapting piece and the second adapting piece respectively comprise an adapting shell, a cavity is arranged in the adapting shell, a first communication port is formed in one end of the adapting shell, a second communication port is formed in the other end of the adapting shell, and the first communication port and the second communication port are respectively communicated with the cavity.
3. The cooling structure according to claim 2, wherein,
the electronic equipment comprises an electronic equipment shell, and is characterized by further comprising a liquid inlet pipeline and a liquid outlet pipeline which are positioned outside the electronic equipment shell, wherein the liquid inlet pipeline is used for providing a cooling medium, the second communication port of the first adapter is communicated with the liquid inlet pipeline, and the second communication port of the second adapter is communicated with the liquid outlet pipeline.
4. A cooling structure according to claim 3, wherein,
the cross section of the transfer shell perpendicular to the inlet and outlet direction of the cooling medium is rectangular.
5. The cooling structure according to claim 2, wherein,
the plurality of cooling units are sequentially communicated; the first communication port of the first adapter communicates with an inlet of the cooling unit located upstream, and the first communication port of the second adapter communicates with an outlet of the cooling unit located downstream.
6. The cooling structure according to claim 2, wherein,
the first adapter piece and the second adapter piece are oppositely arranged, and the first communication ports of the first adapter piece and the second adapter piece are respectively arranged on the opposite surfaces of the first adapter piece and the second adapter piece or on the end surfaces of the first adapter piece and the second adapter piece, which face the cooling unit.
7. The cooling structure according to claim 2, wherein,
the switching shell is provided with at least one connecting part, the electronic equipment shell is provided with a butt joint part, and the connecting part is connected with the butt joint part.
8. The cooling structure according to claim 7, wherein,
the connecting portion is a mounting hole, the mounting hole penetrates through the first adapting piece or the second adapting piece along the connecting direction of the first adapting piece and the second adapting piece, and the hole wall of the mounting hole is in sealing connection with the cavity.
9. The cooling structure according to claim 8, wherein,
the butt joint part comprises a butt joint hole, and the mounting hole is connected with the butt joint hole through a connecting piece.
10. An electronic device characterized by comprising a cooling structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321368695.XU CN220545332U (en) | 2023-05-31 | 2023-05-31 | Cooling structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321368695.XU CN220545332U (en) | 2023-05-31 | 2023-05-31 | Cooling structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220545332U true CN220545332U (en) | 2024-02-27 |
Family
ID=89965320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321368695.XU Active CN220545332U (en) | 2023-05-31 | 2023-05-31 | Cooling structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220545332U (en) |
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2023
- 2023-05-31 CN CN202321368695.XU patent/CN220545332U/en active Active
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