WO2014171268A1 - Open reel - Google Patents
Open reel Download PDFInfo
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- WO2014171268A1 WO2014171268A1 PCT/JP2014/058055 JP2014058055W WO2014171268A1 WO 2014171268 A1 WO2014171268 A1 WO 2014171268A1 JP 2014058055 W JP2014058055 W JP 2014058055W WO 2014171268 A1 WO2014171268 A1 WO 2014171268A1
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- WO
- WIPO (PCT)
- Prior art keywords
- phosphor
- containing resin
- string
- resin
- reel
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H55/00—Wound packages of filamentary material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
- B65H75/08—Kinds or types of circular or polygonal cross-section
- B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Definitions
- the present invention relates to an open reel for storing and transporting a string-like phosphor-containing resin.
- the LED chip is sealed with a sealing resin, and the phosphor is contained in the sealing resin. Is distributed.
- the micron phosphor used for sealing the LED chip has to be stored strictly in order to prevent adhesion and adsorption of moisture and the like, as well as scattering. Therefore, conventionally, phosphors are sealed in storage bottles or storage bags, and are further stored and transported in a moisture-proof box.
- Patent Document 1 proposes forming a phosphor-containing sealing resin in which a phosphor is dispersed into a sheet shape. According to Patent Document 1, since the phosphor can be stored and transported in a state of being dispersed in the resin, there is an advantage that it is not necessary to strictly store the phosphor in a storage box or a storage bottle. .
- Japanese Patent Publication Japanese Patent Laid-Open No. 2011-138831 (published on July 14, 2011)
- the sheet-shaped phosphor-containing sealing resin of Patent Document 1 has a problem that the outer dimensions are large, so that portability is low and it is difficult to carry.
- the present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide an open reel with improved handling of the phosphor-containing resin.
- an open reel includes a reel and a string-like phosphor-containing resin wound around the reel.
- FIG. 1 is a perspective view illustrating an external configuration of an open reel according to the first embodiment.
- FIG. 2 is a graph conceptually showing the viscosity characteristics of the silicone resin contained in the string-like phosphor-containing resin shown in FIG. 3 (a) to 3 (d) are schematic views showing an example of a method for forming the string-like phosphor-containing resin shown in FIG.
- FIG. 4 is a schematic view showing an example of a method of winding a string-like phosphor-containing resin around a reel.
- FIG. 5 is a perspective view showing an external configuration of a light-emitting device manufactured using the string-like phosphor-containing resin shown in FIG. FIGS.
- FIGS. 7A to 7D are schematic views showing a process of mounting the light emitting element in the cavity in the manufacturing process of the light emitting device shown in FIG.
- FIGS. 7A to 7D are schematic views showing a step of sealing the light emitting element with a string-like phosphor-containing resin in the manufacturing steps of the light emitting device shown in FIG.
- FIG. 8 is a schematic view showing a step of dividing the multi-cavity circuit board in the manufacturing steps of the light emitting device shown in FIG. 9A is a perspective view showing a modification of the open reel shown in FIG. 1, and FIG. 9B is a top perspective view thereof.
- FIGS. 13A to 13D are schematic views showing an example of a method for forming the string-like phosphor-containing resin shown in FIG.
- FIG. 14 is a table showing changes in the viscosity and elastic modulus of the silicone resin depending on whether or not the plasticizer shown in FIG. 13 is added.
- FIGS. 1 An embodiment relating to an open reel according to the present invention will be described below with reference to FIGS.
- the open reel according to the present embodiment is used for sealing a light emitting element such as an LED chip mounted on a light emitting device.
- FIG. 1 is a perspective view showing an external configuration of an open reel 1 according to the present embodiment.
- the open reel 1 includes a phosphor-containing resin 20 and a reel 30.
- the string-like phosphor-containing resin 20 seals the light emitting element mounted on the light emitting device.
- the string-like phosphor-containing resin 20 is formed by stringing a thermoplastic resin in which a phosphor as a wavelength converting substance is uniformly dispersed.
- an oxynitride phosphor such as a sialon phosphor
- a group III-V compound semiconductor nanoparticle phosphor such as indium phosphorus: InP
- a YAG phosphor can be used.
- the phosphor is not limited to those described above, and may be another phosphor such as a nitride phosphor (such as a KSF phosphor or a KTF phosphor).
- a phosphor is used as the wavelength conversion material, but other wavelength conversion materials may be used.
- the wavelength converting substance may be any substance that has a function of converting the wavelength of light emitted from the light emitting element to emit light of different wavelengths.
- thermoplastic resin in which the phosphor is dispersed is not particularly limited as long as it can be used for sealing a light emitting element, but has thermoplasticity at a temperature lower than a predetermined crosslinking temperature, and the crosslinking temperature. Those having the property of irreversibly curing at the above temperatures are preferred.
- a silicone resin having the above characteristics is used as the thermoplastic resin.
- the silicone resin is formed with primary crosslinks, and is obtained by removing the solvent amount of the semi-cured material diluted with BTX (benzene / toluene / xylene) or the like by appropriately reducing the pressure.
- This silicone resin has thermoplasticity at a temperature lower than a predetermined secondary crosslinking temperature (crosslinking temperature) described later, and has a property of irreversibly curing at a temperature equal to or higher than the secondary crosslinking temperature.
- FIG. 2 is a graph conceptually showing the viscosity characteristics of the silicone resin contained in the string-like phosphor-containing resin 20 shown in FIG. As shown in FIG. 2, this silicone resin has a viscosity V 0 at room temperature T 0 (about 25 ° C.) (see P 0 in the figure).
- the viscosity V 0 is a viscosity capable of maintaining the shape of the string-like phosphor-containing resin 20.
- the viscosity of the silicone resin decreases and the silicone resin immediately before the secondary crosslinking temperature T 1 is decreased.
- the viscosity is a viscosity V 1 (see P 1 in the figure).
- the viscosity V 1 was a viscosity silicone resin has melted flowable.
- the change of the silicone resin in the temperature range from the room temperature T 0 to the secondary crosslinking temperature T 1 is a thermoreversible change. Therefore, when the temperature is lowered from the vicinity of the secondary crosslinking temperature T 1 to the room temperature T 0 , the viscosity of the silicone resin increases and returns to the original viscosity V 0 at the room temperature T 0 . Therefore, the viscosity of the silicone resin can be repeatedly adjusted between the viscosity V 0 and the viscosity V 1 by changing the temperature in the temperature range from room temperature T 0 to less than the secondary crosslinking temperature T 1 .
- the viscosity of the silicone resin after curing can not be substantially defined viscosity if the viscosity of the silicone resin after curing when conceptually defined as the viscosity V 2, the viscosity of the silicone resin is from viscosity V 1 It rises to V 2 (see P 2 in the figure).
- the viscosity V 2 is obtained by conceptually defines a viscosity in the secondary crosslinking temperature T 1 of the when the silicone resin to form a secondary crosslinking.
- the secondary cross-linking means that the curing further proceeds, for example, by a cross-linking reaction with a reaction catalyst different from that at the time of synthesis, and means a state in which a reversible viscosity change does not occur depending on the temperature as described above.
- the string-like phosphor-containing resin 20 includes various phosphors depending on the required optical characteristics of the light-emitting device, and the concentration (content ratio) of the phosphor is adjusted. If used, the viscosity can be repeatedly adjusted as long as it is in a state before secondary crosslinking. Therefore, as will be described later, a string-like phosphor-containing resin 20 in which the phosphor is uniformly dispersed can be obtained.
- silicone resin contained in the string-like phosphor-containing resin for example, trade name “TX-2506 series” manufactured by Dow Corning Co. can be preferably used.
- the string-like phosphor-containing resin 20 since the phosphor can be stored in a state dispersed in the silicone resin, the conventional handling of storing the powdered phosphor and the liquid resin separately is eliminated. be able to.
- the reel 30 is for winding the string-like phosphor-containing resin 20.
- the reel 30 includes a core portion and two flange portions provided in parallel to each other at both ends of the core portion.
- the string-like phosphor-containing resin 20 is wound around the core portion of the reel 30.
- the reel 30 is made of various materials such as metal or resin.
- the string-like phosphor-containing resin 20 is wound around the reel 30, so that the string-like phosphor-containing resin 20 can be stored in a small bundle. Therefore, the portability of the phosphor-containing resin 20 can be improved and easily carried.
- a necessary amount of the phosphor-containing resin 20 can be easily obtained by cutting the string-like phosphor-containing resin 20 wound around the reel 30 into a desired length.
- the tensile strength of the phosphor-containing resin 20 is increased by forming the phosphor-containing resin 20 in a string shape. Therefore, the string-like phosphor-containing resin 20 is difficult to be cut off and can be easily wound around the reel 30.
- the diameter of the string-like phosphor-containing resin 20 can be appropriately selected.
- the diameter of the string-like phosphor-containing resin 20 can be set to about several hundred ⁇ m to several tens of mm depending on the usage mode of the string-like phosphor-containing resin 20.
- 3 (a) to 3 (d) are schematic views showing an example of a method for forming the string-like phosphor-containing resin 20 shown in FIG.
- the powder of the silicone resin 21 on which the primary cross-linking is formed and the powder of the phosphor 22 are dry-mixed until the mixed state becomes uniform to obtain a powder mixture 24. .
- the powder mixture 24 was placed in a twin-screw extruder 37, and kneaded while heating melt below the secondary crosslinking temperature T 1.
- the twin screw extrusion device 37 includes two screws 37a provided in parallel in the cylinder, and the two screws 37a rotate in opposite directions to melt the silicone resin 21 by heating, The powder mixture 24 can be kneaded.
- the powder mixture 24 becomes a kneaded material 25 in which the phosphor 22 is uniformly dispersed in the molten silicone resin 21.
- the kneaded material 25 is extruded in a string shape from the discharge port 37b of the twin screw extruder 37, whereby the phosphor 22 is uniformly dispersed in the silicone resin 21 as shown in FIG.
- the phosphor-containing resin 20 can be formed.
- the open reel 1 can be manufactured by winding the string-like phosphor-containing resin 20 around the core portion of the reel 30.
- FIG. 4 is a schematic view showing an example of a method of winding the string-like phosphor-containing resin 20 around the reel 30.
- the string-like phosphor-containing resin 20 extruded from the discharge port 37 b of the twin-screw extruder 37 may be directly wound around the reel 30.
- the reel 30 is provided so as to be rotatable in the direction of the arrow in the drawing by a rotation driving means using a motor or the like.
- the length (amount) of the string-like phosphor-containing resin 20 that the reel 30 takes up per unit time is equal to the length of the string-like phosphor-containing resin 20 that is pushed out from the discharge port 37b per unit time ( It is preferable to control the rotational speed of the reel 30 so that it is equal to or slightly shorter than the amount.
- the length (amount) of the string-like phosphor-containing resin 20 extruded from the discharge port 37b per unit time is the length (amount) of the string-like phosphor-containing resin 20 that the reel 30 takes up per unit time. )
- the rotational speed of the screw 37a is preferably controlled so as to be slightly longer than that. Thereby, the string-like phosphor-containing resin 20 can be automatically wound by the reel 30 while suppressing the string-like phosphor-containing resin 20 from being broken.
- a plurality of phosphor-containing resins 20 having the same phosphor content can be easily obtained by cutting the string-like phosphor-containing resin 20 into the same length. Can do. Therefore, by sealing each light emitting element using these phosphor-containing resins 20, it is possible to equalize the phosphor content among the light emitting devices and reduce chromaticity variation.
- the melting efficiency of the silicone resin 21 at the time of heating can be improved as compared with a bulk shape. Therefore, the phosphor 22 is uniformly melted in the silicone resin 21 by heating and melting the string-like phosphor-containing resin 20 at a temperature lower than the secondary crosslinking temperature T 1 so that the phosphor 22 is not settled. As it is, the string-like phosphor-containing resin 20 can be easily processed into a desired shape.
- the twin screw extruder 37 provided with two screws 37a is used.
- a single screw extruder provided with one screw 37a may be used. good.
- a multi-screw extruder having three or more screws 37a may be used.
- the number, size, and shape of the discharge ports 37b of these extrusion apparatuses are not particularly limited, and can be appropriately changed as necessary. Thereby, the diameter etc. of the string-like fluorescent substance containing resin 20 formed can be changed easily.
- the diameter of the discharge port 37b of the extrusion device can be set to about several hundred ⁇ m to several tens of mm depending on the thickness (diameter) of the string-like phosphor-containing resin 20 to be formed.
- the string-like phosphor-containing resin 20 is formed using the twin screw extruder 37, but the string-like phosphor-containing resin 20 may be formed by other methods.
- FIG. 5 is a perspective view showing an external configuration of the light emitting device 40 manufactured using the string-like phosphor-containing resin 20.
- the light emitting device 40 has a rectangular cavity 12 that opens upward on a circuit board 11 that is a rectangular parallelepiped MID (Molded Interconnection Device) having a side of about 1 mm. Is formed.
- the cavity 12 is a recess formed on the upper surface of the circuit board 11.
- a light emitting element 13 such as an LED chip is mounted in the cavity 12.
- the lower surface of the light emitting element 13 is connected to a mounting wiring pattern 14 provided at the bottom of the cavity 12 by a conductive adhesive 15 (die bonding).
- the upper surface of the light emitting element 13 is connected to a connection wiring pattern 16 provided at the bottom of the cavity 12 by a conductive wire 17 composed of a gold wire or the like (wire bonding).
- the inside of the cavity 12 of the circuit board 11 is sealed with a phosphor-containing resin 20.
- the inner surface of the cavity 12 of the circuit board 11 may have a reflector function. Thereby, the utilization efficiency of the light in the light emitting device 40 can be improved.
- the method for mounting the light emitting element 13 on the circuit board 11 is not particularly limited, and the light emitting element 13 may be mounted on the circuit board 11 by, for example, a flip chip method instead of the wire bonding method.
- 6 (a) to 6 (d) are schematic views showing a process of mounting the light emitting element 13 in the cavity 12 in the manufacturing process of the light emitting device 40 shown in FIG.
- a multiple cavity circuit board 10 in which a large number of cavities 12 are formed in a matrix in the vertical and horizontal directions is used.
- the multi-cavity circuit board 10 has a thickness of 1 mm, for example, and the depth of each cavity 12 is 0.6 mm.
- a mounting wiring pattern 14 and a connecting wiring pattern 16 are provided side by side at the bottom of each cavity 12.
- a conductive adhesive 15 is applied on the mounting wiring pattern 14 provided at the bottom of each cavity 12.
- the light emitting element 13 is die-bonded on the conductive adhesive 15 applied on the mounting wiring pattern 14. Then, as shown in FIG. 6D, the upper surface of the light emitting element 13 and the connection wiring pattern 16 provided on the bottom of the cavity 12 are wire-bonded with a conductive wire 17 made of a gold wire or the like.
- each cavity 12 of the multiple cavity circuit board 10 is sealed with the phosphor-containing resin 20.
- FIGS. 7A to 7D are schematic views showing a process of sealing the light emitting element 13 with the string-like phosphor-containing resin 20 in the manufacturing process of the light emitting device 40 shown in FIG. It is.
- the multiple cavity circuit board 10 having the light emitting element 13 mounted thereon is placed on the heater plate 31, and each cavity 12 contains phosphors cut to the same length. Resin 20 is disposed. Since the phosphor-containing resins 20 cut to the same length have almost the same phosphor content, the phosphors between the light-emitting devices 40 are sealed by sealing each light-emitting element 13 using these phosphor-containing resins 20. The content can be equalized and variations in chromaticity can be reduced.
- the phosphor-containing resin 20 is disposed in each cavity 12, as shown in FIG. 7B, the phosphor-containing resin is heated by the heater plate 31 at the secondary crosslinking temperature T 1 (for example, 125 ° C.). 20 is melted.
- T 1 for example, 125 ° C.
- the cavity 12 is filled with the phosphor-containing resin 20, and a part of the silicone resin 21 forms secondary cross-linking and curing begins.
- the phosphor-containing resin 20 in the cavity 12 is cured from the bottom side of the cavity 12 by the heater plate 31. Therefore, since stress due to curing shrinkage of the phosphor-containing resin 20 can be distributed on the upper portion of the phosphor-containing resin 20, that is, on the opening side of the cavity 12, the occurrence of cracks and the like is suppressed, and the light emitting device 40 Reliability can be improved.
- FIG. 8 is a schematic view showing a process of dividing the multiple cavity circuit board 10 in the manufacturing process of the light emitting device 40 shown in FIG. As shown in FIG. 8, when the light emitting element 13 mounted in each cavity 12 is sealed with the phosphor-containing resin 20 in which secondary crosslinking is formed, the multiple cavity circuit board 10 is separated for each cavity 12. To divide. Thereby, the several light emitting device 40 with uniform fluorescent substance content can be manufactured simultaneously.
- the chromaticity distribution range between the light emitting devices 40 manufactured in this way can satisfy the McAdam ellipse 2-step chromaticity management standard.
- the MacAdam ellipse is an xy chromaticity diagram showing the standard deviation of identification variation with respect to a specific central color, and can realize a level at which variations in chromaticity cannot be identified by human eyes.
- the phosphor content between the light-emitting devices 40 is equalized, and the chromaticity variation (the chromaticity distribution range). Can be reduced.
- each light emitting element 13 mounted in the multiple cavity circuit board 10 is sealed using the string-like fluorescent substance containing resin 20, this invention is not limited to this.
- the light emitting elements 13 mounted on the divided circuit board 11 may be individually sealed using a string-like phosphor-containing resin 20.
- the open reel 1 includes the reel 30 and the string-like phosphor-containing resin 20 wound around the reel 30.
- the string-like phosphor-containing resin 20 is wound around the reel 30, the string-like phosphor-containing resin 20 can be stored in a small bundle. Therefore, the portability of the phosphor-containing resin 20 can be improved and easily carried.
- a necessary amount of the phosphor-containing resin 20 can be easily obtained by cutting the string-like phosphor-containing resin 20 wound around the reel 30 into a desired length.
- the handleability of the phosphor-containing resin 20 can be improved.
- a plurality of phosphor-containing resins 20 having the same phosphor content can be easily obtained by cutting the string-like phosphor-containing resin 20 into the same length. Therefore, by sealing each light emitting element 13 using these phosphor-containing resins 20, it is possible to equalize the phosphor content among the light emitting devices 40 and reduce chromaticity variation.
- the open reel 1 can improve the handleability of the phosphor-containing resin 20 and can equalize the phosphor content between the light emitting devices 40 to reduce the variation in chromaticity. Can be realized.
- the string-like phosphor-containing resin 20 may have portions with different phosphor contents along the axial direction of the phosphor-containing resin 20. Thereby, by sealing each light emitting element 13 using a portion having a different phosphor content in the string-like phosphor-containing resin 20, for example, one is daylight white and the other is light bulb color.
- the light emitting device 40 having different light emission characteristics can be manufactured.
- the string-like phosphor-containing resin 20 may have portions having different thixotropy properties along the axial direction of the phosphor-containing resin 20.
- two or more string-like phosphor-containing resins 20 having the same or different phosphor contents may be wound around the reel 30.
- the plurality of phosphor-containing resins 20 can be easily stored and transported.
- the phosphor 22 contained in the string-like phosphor-containing resin 20 is one type, but two or more types of phosphors 22 having different emission colors, particle sizes, specific gravity, and the like may be used.
- a string-like phosphor-containing resin 20 including a combination of a red light-emitting phosphor and a green light-emitting phosphor may be formed, and the blue light-emitting element 13 may be sealed.
- a string-like phosphor-containing resin 20 including a combination of a blue light-emitting phosphor and a yellow light-emitting phosphor may be formed, and the blue-violet light-emitting element 13 may be sealed.
- the powder of the silicone resin 21 on which the primary crosslinking is formed and the powder of the two or more kinds of phosphors 22 are dry-mixed until the mixed state becomes uniform to obtain the powder mixture 24.
- the powder mixture 24 was placed in a twin-screw extruder 37, and kneaded while heating melt below the secondary crosslinking temperature T 1.
- the powder mixture 24 becomes a kneaded material 25 in which two or more kinds of phosphors 22 are uniformly dispersed in the molten silicone resin 21.
- a string-like phosphor-containing resin 20 in which two or more kinds of phosphors 22 are uniformly dispersed in the silicone resin 21 is formed. can do.
- FIG. 9A is a perspective view showing a modification of the open reel 1 shown in FIG. 1, and FIG. 9B is a top perspective view thereof.
- FIG. 9A and FIG. 9B for example, by changing the width of the reel 30, it is also possible to configure a one-roll type open reel 1a.
- the length of the core portion of the reel 30 (that is, the interval between the flange portions) may be adjusted to be slightly larger than the diameter of the string-like phosphor-containing resin 20.
- the string-like phosphor-containing resin 20 can be prevented from being entangled, and the remaining amount of the string-like phosphor-containing resin 20 can be easily managed.
- FIGS. 10 and 11 Another embodiment of the open reel according to the present invention will be described below with reference to FIGS. 10 and 11.
- members having the same functions as those of the drawings described in the above-described embodiments are denoted by the same reference numerals and description thereof is omitted.
- This embodiment is different from the above-described embodiment in that the light emitting element 13 is sealed using a string-like phosphor-containing resin 20 processed into another shape.
- 10 (a) to 10 (d) are schematic views showing a molding method for processing the string-like phosphor-containing resin 20 into a sheet shape.
- molding method which processes the string-like fluorescent substance containing resin 20 to a sheet form by heat press is demonstrated.
- the string-like phosphor-containing resin 20 is arranged on the heater plate 31. Then, as shown in FIG. 10 (b), by heating and melting the string-like phosphor-containing resin 20 is less than the secondary crosslinking temperature T 1, lowering the viscosity of the silicone resin 21 so as not to precipitate the phosphor 22 Let
- the string-like phosphor-containing resin 20 has a high melting efficiency of the silicone resin 21 at the time of heating, and the string-like phosphor-containing resin 20 is less than the secondary crosslinking temperature T 1 so as not to cause the phosphor 22 to settle.
- the string-like phosphor-containing resin 20 can be easily processed into a desired shape while maintaining the state in which the phosphor 22 is uniformly dispersed in the silicone resin 21.
- the molding method for processing the string-like phosphor-containing resin 20 into a sheet shape by heat pressing has been described.
- other methods such as a T-die method may be used to contain the string-like phosphor-containing resin.
- the resin 20 may be processed into a sheet shape.
- FIG. 11A and FIG. 11B are cross-sectional views showing a method for manufacturing the light emitting device 41 using the sheet-like phosphor-containing resin 20 shown in FIG.
- a planar circuit board 10a having a flat surface is used, and the light emitting elements 13 are mounted in a matrix in the vertical and horizontal directions on the flat surface of the planar circuit board 10a.
- a planar circuit board 10a By using such a planar circuit board 10a, a large number of light emitting devices 41 can be manufactured simultaneously.
- a planar circuit board 10a on which a plurality of light emitting elements 13 are mounted in a matrix and a sheet-like phosphor-containing resin 20 are laminated in this order on a heater plate 31.
- a sheet-shaped phosphor-containing resin 20 is heated melt below the secondary crosslinking temperature T 1.
- the body-containing resin 20 is pressurized in the direction of the planar circuit board 10a. Thereby, the sheet-like phosphor-containing resin 20 can be brought into close contact with the upper surface and the side surface of the light emitting element 13.
- the silicone resin 21 is a secondary crosslinked cured to form. Further, by heating the planar circuit board 10a in the secondary crosslinking temperature above T 1 of the temperature in the oven or the like, after completely curing the silicone resin 21, is taken out planar circuit board 10a, to room temperature T 0 Reduce.
- the planar circuit board 10a is divided for each light emitting element 13, thereby manufacturing a plurality of light emitting devices 41 with equal phosphor contents. Can do.
- the method (sheet method) of the present embodiment in which the light-emitting element 13 is sealed using the sheet-like phosphor-containing resin 20 is the sealing of each light-emitting element 13 in the light-emitting device before division where a plurality of light-emitting devices are connected. Applied to stop.
- the method of Embodiment 1 which seals the light emitting element 13 using the string-like phosphor-containing resin 20 is not only the sealing of each light emitting element 13 in the light emitting device before the division, but also the individual divided light emission.
- the present invention can also be applied to sealing each light emitting element 13 in the device.
- the string-like phosphor-containing resin 20 is processed into a sheet shape, but the string-like phosphor-containing resin 20 may be processed into a granular or other desired shape.
- This embodiment is different from the above-described embodiment in that a plasticizer is added in the process of forming the string-like phosphor-containing resin.
- FIG. 12 is a perspective view showing an external configuration of the open reel 101 according to the present embodiment.
- the open reel 101 includes a string-like phosphor-containing resin 120 and a reel 30.
- the string-like phosphor-containing resin 120 seals the light-emitting element 13 mounted on the light-emitting device.
- the string-like phosphor-containing resin 120 is formed by stringing a silicone resin 21 in which phosphors 22 that are wavelength conversion substances are uniformly dispersed.
- a plasticizer that lowers the elastic modulus of the silicone resin 21 after the secondary crosslinking is added to the string-like phosphor-containing resin 120 in the forming step.
- 13 (a) to 13 (d) are schematic views showing an example of a method for forming the string-like phosphor-containing resin 120 shown in FIG.
- the powder of the silicone resin 21 on which the primary cross-link is formed and the powder of the phosphor 22 are dry-mixed until the mixed state becomes uniform to obtain a powder mixture 24. .
- a plasticizer 23 that lowers the elastic modulus (secondarily lowers the viscosity) of the silicone resin 21 after the secondary crosslinking is added to the powder mixture 24. Details of the plasticizer 23 will be described later. Then, by introducing the powder mixture 24 with the addition of plasticizer 23 in a twin-screw extruder 37, and kneaded while heating melt below the secondary crosslinking temperature T 1.
- the powder mixture 24 becomes a kneaded material 125 in which the phosphor 22 is uniformly dispersed in the molten silicone resin 21.
- the kneaded material 125 is extruded in a string form from the discharge port 37b of the twin screw extruder 37, whereby the phosphor 22 is uniformly dispersed in the silicone resin 21 as shown in FIG.
- the phosphor-containing resin 120 can be formed.
- the primary crosslinked silicone resin 21 has a relatively high viscosity at room temperature T 0 , has low meltability due to heating, and low tack (adhesion) and wettability. For this reason, the silicone resins 21 are not sufficiently fused together during heating, and there are many gaps. When the silicone resin 21 forms a secondary crosslink and cures in such a state, cracks and the like are likely to occur in the phosphor-containing resin 120 in which the light emitting element 13 is sealed. In order to suppress the occurrence of cracks, it is preferable to reduce the elastic modulus of the silicone resin 21 after the secondary crosslinking.
- a liquid plasticizer 23 that reduces the elastic modulus of the silicone resin 21 after the secondary crosslinking is added to the powder mixture 24 obtained by dry mixing the powder of the silicone resin 21 and the powder of the phosphor 22. A small amount is added.
- the plasticizer 23 may reduce the crosslink density of the silicone resin 21. Thereby, it becomes possible to reduce the elastic modulus of the silicone resin 21 after the secondary cross-linking, and to prevent the phosphor-containing resin 120 encapsulating the light emitting element 13 from being cracked.
- the plasticizer 23 may be one that lowers the viscosity of the silicone resin 21 in which primary crosslinking is formed. As a result, the processing of the string-like phosphor-containing resin 120 is facilitated, and by making the powder mixture 24 compatible, the silicone resins 21 can be easily combined into one without a gap.
- plasticizer 23 for example, it is mainly composed of silicone, and non-functional silicone oil or monofunctional silicone oil can be suitably used, which reacts with matrix silicone. Or may not react.
- the plasticizer 23 is appropriately selected according to the characteristics of the light emitting device.
- FIG. 14 is a table showing changes in the viscosity and elastic modulus of the silicone resin 21 depending on whether or not the plasticizer 23 shown in FIG. 13 is added.
- FIG. 14 shows the viscosity of the silicone resin 21 before secondary crosslinking (primary crosslinked state) and the elastic modulus of the silicone resin 21 after secondary crosslinking.
- the viscosity of the silicone resin 21 before secondary crosslinking at 25 ° C. is reduced to about 1/3. Can do.
- the viscosity at 120 ° C. of the silicone resin 21 before secondary crosslinking can be reduced to about 1/100.
- the viscosity value of the silicone resin 21 varies depending on the amount of the plasticizer 23 added, it is approximately 1 ⁇ 10 4 Pa ⁇ s to 1 ⁇ 10 5 Pa ⁇ s at 25 ° C., and 1 ⁇ 10 4 at 120 ° C. 2 Pa ⁇ s to 1 ⁇ 10 4 Pa ⁇ s.
- the addition amount of the plasticizer 23 is preferably 5 to 20% by weight, more preferably 8 to 15% by weight, and more preferably about 11% by weight, when expressed by the weight ratio of the plasticizer 23 to the silicone resin 21. is there.
- the elastic modulus at 25 ° C. of the silicone resin 21 after the secondary cross-linking reducing from ⁇ 5 ⁇ 10 7 Pa to ⁇ 1 ⁇ 10 7 Pa Can do.
- the elastic modulus at 125 ° C. of the silicone resin 21 after the secondary crosslinking can be decreased from ⁇ 1 ⁇ 10 7 Pa to ⁇ 2 ⁇ 10 6 Pa.
- the viscosity of the silicone resin 21 before the secondary cross-linking can be reduced, so that the string-like phosphor-containing resin 120 formed with the primary cross-linking can be processed. It becomes easy.
- the crosslinking density of the silicone resin 21 is reduced by adding the plasticizer 23, the elastic modulus of the silicone resin 21 after the secondary crosslinking at 25 ° C. and 125 ° C. can be reduced. Thereby, it becomes possible to suppress the occurrence of cracks or the like in the phosphor-containing resin 120 in which the light emitting element 13 is sealed.
- the open reel 101 includes the string-like phosphor-containing resin 120 to which the plasticizer 23 that decreases the elastic modulus of the silicone resin 21 after the secondary crosslinking is added in the forming step. Yes.
- the string-like phosphor-containing resin 120 that can improve the reliability of the light-emitting device can be obtained.
- the string-like phosphor-containing resin 120 is formed by using a twin screw extruder 37 provided with two screws 37a.
- the liquid plasticizer 23 is quantitatively and uniformly added to the powder mixture 24.
- a batch method may be employed.
- a batch-type kneader can be used, but it is particularly preferable to use an internal feedback type high-speed shear stirrer.
- the powder mixture 24 and the plasticizer 23 introduced into the cylinder from the rear end side of the screw are placed on the front end side of the screw. Move in the cylinder. Then, a shearing force is applied to the powder mixture 24 between the tip of the screw and the inner wall of the cylinder, and the mixture is stirred. In this case, the powder mixture 24 in the cylinder is heated in less than secondary crosslinking temperature T 1, the rotational speed of the screw is kept below 3000rpm than 2500 rpm. The agitated powder mixture 24 and the plasticizer 23 move to the rear end side of the screw through a return path provided inside the screw.
- the powder mixture 24 and the plasticizer 23 are sufficiently stirred to become a kneaded product 125. Thereafter, the kneaded product 125 is extruded in a string shape from the discharge port of the cylinder, whereby the string-shaped phosphor-containing resin 120 in which the phosphor 22 is uniformly dispersed in the silicone resin 21 can be formed.
- a composite fluoride phosphor activated with Mn 4+ is selected as the phosphor contained in the phosphor-containing resins 20 and 120 of Embodiments 1 to 3 described above.
- the composite fluoride phosphor for example, the following substances can be used.
- the composite fluoride phosphor activated with Mn 4+ is kneaded with the silicone resin 21, thereby enabling long-term storage without deteriorating the phosphor 22.
- this composite fluoride phosphor contains fluorine and dissolves in water (solubility is about 1%) to generate hydrofluoric acid (HF).
- HF hydrofluoric acid
- the phosphor-containing resins 20 and 120 including such a composite fluoride phosphor in a string shape and winding them around the reel 30.
- An open reel according to aspect 1 of the present invention includes a reel and a string-like phosphor-containing resin wound around the reel.
- the string-like phosphor-containing resin is wound around the reel, so that the phosphor-containing resin can be stored in a small package. Therefore, the portability of the phosphor-containing resin can be improved and easily carried.
- the phosphor-containing resin is obtained by dispersing at least a phosphor in a thermoplastic resin (silicone resin 21), and the thermoplastic resin is It is preferable that the resin has thermoplasticity at a temperature lower than a predetermined crosslinking temperature (secondary crosslinking temperature T 1 ) and is irreversibly cured at a temperature equal to or higher than the crosslinking temperature.
- a predetermined crosslinking temperature secondary crosslinking temperature T 1
- thermoplastic resin in which the phosphor is dispersed has thermoplasticity at a temperature lower than a predetermined crosslinking temperature and has a property of irreversibly curing at a temperature equal to or higher than the crosslinking temperature. Therefore, the viscosity of the thermoplastic resin can be repeatedly adjusted by changing the temperature in a temperature region below a predetermined crosslinking temperature.
- the phosphor when the phosphor is kneaded into the thermoplastic resin, the phosphor can be uniformly dispersed in the thermoplastic resin by controlling the viscosity of the thermoplastic resin so that the kneaded phosphor does not settle. It becomes possible.
- the crosslinking temperature may be 120 ° C. or higher and 170 ° C. or lower.
- the thermoplastic resin may contain a solvent composed of benzene, toluene and xylene.
- the said fluorescent substance containing resin is a part from which fluorescent substance content mutually differs along the axial direction of the said fluorescent substance containing resin. It is preferable to have.
- the string-like phosphor-containing resin has portions having different phosphor contents along the axial direction of the phosphor-containing resin.
- the phosphor-containing resins By sealing each light emitting element using portions having different phosphor contents, light emitting devices having different light emitting characteristics can be manufactured.
- a light emitting device having various light emission characteristics can be manufactured using one string-like phosphor-containing resin.
- two or more phosphor-containing resins having the same or different phosphor contents are wound on one reel.
- it is.
- string-like fluorescent substance containing resin was used for sealing of a light emitting element
- the use of string-like fluorescent substance containing resin is not limited to sealing of a light emitting element
- Other uses It can also be used.
- a string-like phosphor-containing resin may be used when applying the phosphor-containing resin to the globe of the LED bulb.
- the heat of the phosphor can be released to the globe. For this reason, when the phosphor is excited, it is converted into heat and light, but this heat is transmitted to the globe, and heat is transmitted from the globe to the entire surface (in the air) or from the globe to the housing, so heat dissipation is excellent.
- the open reel according to the present invention can also be expressed as follows. That is, the reel winding sealing resin according to the present invention is characterized by comprising a reel and a string-like phosphor-containing sealing resin wound around the reel.
- the phosphor-containing sealing resin includes at least a thermoplastic resin and a phosphor, and the thermoplastic resin is thermoplastic at a temperature lower than a predetermined crosslinking temperature. And irreversibly curing at a temperature equal to or higher than the crosslinking temperature.
- the crosslinking temperature is preferably 120 ° C. or higher and 170 ° C. or lower.
- thermoplastic resin contains a solvent composed of benzene, toluene and xylene.
- the string-like phosphor-containing sealing resin has the phosphor content varied partially (for each region).
- the reel winding sealing resin according to the present invention it is preferable to bundle two or more string-like resins having the same or different phosphor content and wind them around the reel.
- the present invention can be widely used for the manufacture of light emitting devices used for display devices and lighting fixtures using LEDs or the like, backlights for displays, traffic lights, outdoor large displays, advertising billboards, and the like.
Abstract
Description
本発明に係るオープンリールに関する実施の一形態について、図1~図9に基づいて説明すれば以下のとおりである。本実施形態に係るオープンリールは、発光デバイスに搭載されるLEDチップ等の発光素子を封止するために用いられるものである。 [Embodiment 1]
An embodiment relating to an open reel according to the present invention will be described below with reference to FIGS. The open reel according to the present embodiment is used for sealing a light emitting element such as an LED chip mounted on a light emitting device.
まず、図1および図2を参照して、本実施形態に係るオープンリール1の構成について説明する。 <Configuration of
First, with reference to FIG. 1 and FIG. 2, the structure of the
紐状の蛍光体含有樹脂20は、発光デバイスに搭載される発光素子を封止するものである。具体的には、紐状の蛍光体含有樹脂20は、波長変換物質である蛍光体を均一に分散させた熱可塑性樹脂を紐状に成形したものである。 (String-like phosphor-containing resin 20)
The string-like phosphor-containing
できるため、粉末状蛍光体および液状樹脂を個別に保管していた従来の取り扱いの煩雑さを解消することができる。 According to the string-like phosphor-containing
リール30は、紐状の蛍光体含有樹脂20を巻き付けるためのものである。リール30は、コア部と、該コア部の両端に、互いに平行に設けられた2つのフランジ部とにより構成されている。紐状の蛍光体含有樹脂20は、リール30のコア部に巻かれている。このリール30は、金属または樹脂等の各種の材料から成る。 (Reel 30)
The
次に、図3および図4を参照して、オープンリール1の製造方法について説明する。 <Method for manufacturing
Next, with reference to FIG. 3 and FIG. 4, the manufacturing method of the
た紐状の蛍光体含有樹脂20をリール30で直接巻き取っても良い。この場合、リール30はモーターなどを用いた回転駆動手段により、図中の矢印の方向に回転可能に設けられる。 FIG. 4 is a schematic view showing an example of a method of winding the string-like phosphor-containing
そのため、蛍光体22を沈降させないように2次架橋温度T1未満で紐状の蛍光体含有樹脂20を加熱溶融することで、蛍光体22をシリコーン樹脂21に均一に分散させた状態を維持したまま、紐状の蛍光体含有樹脂20を所望の形状に容易に加工することができる。 Moreover, by making the phosphor-containing
Therefore, the phosphor 22 is uniformly melted in the silicone resin 21 by heating and melting the string-like phosphor-containing
次に、図5~図8を参照して、紐状の蛍光体含有樹脂20を用いた発光デバイスの製造方法について説明する。 <Method for manufacturing light emitting device>
Next, a method for manufacturing a light emitting device using the string-like phosphor-containing
ある。このキャビティ12内には、LEDチップ等の発光素子13が実装されている。 FIG. 5 is a perspective view showing an external configuration of the light emitting device 40 manufactured using the string-like phosphor-containing
できる。 As shown in FIG. 7A, the multiple
以上のように、本実施形態に係るオープンリール1は、リール30と、リール30に巻かれた紐状の蛍光体含有樹脂20とを備えている。 <Effect of
As described above, the
本実施形態では、紐状の蛍光体含有樹脂20に含まれる蛍光体22を1種類としたが、発光色、粒径または比重等が異なる2種類以上の蛍光体22を用いても良い。たとえば、赤色発光蛍光体および緑色発光蛍光体の組み合わせを含む紐状の蛍光体含有樹脂20を形成し、青色の発光素子13を封止しても良い。また、青色発光蛍光体および黄色発光蛍光体の組み合わせを含む紐状の蛍光体含有樹脂20を形成し、青紫色の発光素子13を封止しても良い。 <Modification>
In the present embodiment, the phosphor 22 contained in the string-like phosphor-containing
一巻方式にすることにより、紐状の蛍光体含有樹脂20の絡みを防止することができるとともに、紐状の蛍光体含有樹脂20の残量管理が容易となる。 9A is a perspective view showing a modification of the
By adopting the one-winding method, the string-like phosphor-containing
本発明に係るオープンリールに関する他の実施の一形態について、図10および図11に基づいて説明すれば以下のとおりである。なお、説明の便宜上、上述した実施形態にて説明した図面と同じ機能を有する部材については、同じ符号を付記し、その説明を省略する。 [Embodiment 2]
Another embodiment of the open reel according to the present invention will be described below with reference to FIGS. 10 and 11. For convenience of explanation, members having the same functions as those of the drawings described in the above-described embodiments are denoted by the same reference numerals and description thereof is omitted.
まず、図10を参照して、紐状の蛍光体含有樹脂20を、シート状に加工する成形方法について説明する。 <Method of molding sheet-like phosphor-containing
First, with reference to FIG. 10, the shaping | molding method which processes the string-like fluorescent
次に、図11を参照して、シート状の蛍光体含有樹脂20を用いた発光デバイス41の製造方法について説明する。 <Method for Manufacturing Light-Emitting Device 41>
Next, with reference to FIG. 11, the manufacturing method of the light-emitting device 41 using the sheet-like fluorescent
造することができる。 FIG. 11A and FIG. 11B are cross-sectional views showing a method for manufacturing the light emitting device 41 using the sheet-like phosphor-containing
以上のように、紐状の蛍光体含有樹脂20によれば、たとえば、バルク状のものに比べて、加熱時のシリコーン樹脂21の溶融効率を向上させることができる。そのため、用途に応じたて所望の形状に加工することが容易となる。そのため、紐状の蛍光体含有樹脂20をシート状に加工し、このシート状の蛍光体含有樹脂20を用いて発光素子13を封止することにより、発光デバイス41間の蛍光体含有量を均等化することができる。 <Effect of
As described above, according to the string-like phosphor-containing
本発明に係るオープンリールに関する他の実施の一形態について、図12~図14に基づいて説明すれば以下のとおりである。なお、説明の便宜上、上述した実施形態にて説明した図面と同じ機能を有する部材については、同じ符号を付記し、その説明を省略する。 [Embodiment 3]
Another embodiment of the open reel according to the present invention will be described below with reference to FIGS. For convenience of explanation, members having the same functions as those of the drawings described in the above-described embodiments are denoted by the same reference numerals and description thereof is omitted.
まず、図12を参照して、本実施形態に係るオープンリール101の構成について説明する。 <Configuration of open reel 101>
First, the configuration of the open reel 101 according to the present embodiment will be described with reference to FIG.
紐状の蛍光体含有樹脂120は、発光デバイスに搭載される発光素子13を封止するものである。具体的には、紐状の蛍光体含有樹脂120は、波長変換物質である蛍光体22を均一に分散させたシリコーン樹脂21を紐状に成形したものである。この紐状の蛍光体含有樹脂120には、後述するように、その形成工程において、2次架橋後のシリコーン樹脂21の弾性率を低下させる可塑剤が添加されている。 (String-like phosphor-containing resin 120)
The string-like phosphor-containing resin 120 seals the light-emitting
次に、図13を参照して、紐状の蛍光体含有樹脂120の形成方法についてして説明する。 <Method for forming string-like phosphor-containing resin 120>
Next, a method for forming the string-like phosphor-containing resin 120 will be described with reference to FIG.
次に、図14を参照して、紐状の蛍光体含有樹脂120の形成工程において添加される可塑剤23の詳細について説明する。 <Details of plasticizer 23>
Next, with reference to FIG. 14, the detail of the plasticizer 23 added in the formation process of the string-like fluorescent substance containing resin 120 is demonstrated.
キシングして得た粉末混合物24に、2次架橋後のシリコーン樹脂21の弾性率を低下させる液状の可塑剤23を少量添加している。 Therefore, in the present embodiment, a liquid plasticizer 23 that reduces the elastic modulus of the silicone resin 21 after the secondary crosslinking is added to the
以上のように、本実施形態に係るオープンリール101は、2次架橋後のシリコーン樹
脂21の弾性率を低下させる可塑剤23が形成工程において添加された紐状の蛍光体含有樹脂120を備えている。 <Effect of Embodiment 3>
As described above, the open reel 101 according to the present embodiment includes the string-like phosphor-containing resin 120 to which the plasticizer 23 that decreases the elastic modulus of the silicone resin 21 after the secondary crosslinking is added in the forming step. Yes.
本実施形態では、2つのスクリュー37aを備えた二軸スクリュー押出装置37を用いて、紐状の蛍光体含有樹脂120を形成したが、液状の可塑剤23を粉末混合物24に定量、且つ、均一に混練するためには、バッチ方式を採用しても良い。たとえば、バッチ方式のニーダーを用いることができるが、特に、内部帰還式の高速剪断攪拌装置を用いることが好ましい。 <Modification>
In this embodiment, the string-like phosphor-containing resin 120 is formed by using a
上述した実施形態1~3の蛍光体含有樹脂20・120に含まれる蛍光体として、本実施の形態ではMn4+で活性化された複合フッ化物蛍光体が選択される。この複合フッ化物蛍光体として、たとえば、以下の物質を用いることができる。 [Embodiment 4]
In this embodiment, a composite fluoride phosphor activated with Mn 4+ is selected as the phosphor contained in the phosphor-containing
(1)A2[MF5]:Mn4+
(但し、AはLi,Na,K,Rb,Cs,NH4およびその組み合せから選択され、MはAl,Ga,Inおよびその組み合せから選択される。)
(2)A3[MF6]:Mn4+
(但し、AはLi,Na,K,Rb,Cs,NH4およびその組合せから選択され、MはAl,Ga,Inおよびその組合せから選択される。)
(3)Zn2[MF7]:Mn4+
(但し、MはAl,Ga,Inおよびその組合せから選択される。)
(4)A[In2F7]:Mn4+
(但し、AはLi,Na,K,Rb,Cs,NH4およびその組み合わせから選択される。)
(5)A2[MF6]:Mn4+
(但し、AはLi,Na,K,Rb,Cs,NH4およびその組合せから選択され、MはGe,Si,Sn,Ti,Zrおよびその組合せから選択される。)
(6)E[MF6]:Mn4+
(但し、EはMg,Ca,Sr,Ba,Znおよびその組合せから選択され、MはGe,Si,Sn,Ti,Zrおよびその組合せから選択される。)
(7)Ba0.65Zr0.35F2.70:Mn4+
(8)A3[ZrF7]:Mn4+
(但し、AはLi,Na,K,Rb,Cs,NH4およびその組合せから選択される。)。 <Specific examples of composite fluoride phosphor>
(1) A 2 [MF 5 ]: Mn 4+
(However, A is selected from Li, Na, K, Rb, Cs, NH 4 and combinations thereof, and M is selected from Al, Ga, In and combinations thereof.)
(2) A 3 [MF 6 ]: Mn 4+
(However, A is selected from Li, Na, K, Rb, Cs, NH 4 and combinations thereof, and M is selected from Al, Ga, In and combinations thereof.)
(3) Zn 2 [MF 7 ]: Mn 4+
(However, M is selected from Al, Ga, In and combinations thereof.)
(4) A [In 2 F 7 ]: Mn 4+
(However, A is selected from Li, Na, K, Rb, Cs, NH 4 and combinations thereof.)
(5) A 2 [MF 6 ]: Mn 4+
(However, A is selected from Li, Na, K, Rb, Cs, NH 4 and combinations thereof, and M is selected from Ge, Si, Sn, Ti, Zr and combinations thereof.)
(6) E [MF 6 ]: Mn 4+
(However, E is selected from Mg, Ca, Sr, Ba, Zn and combinations thereof, and M is selected from Ge, Si, Sn, Ti, Zr and combinations thereof.)
(7) Ba 0.65 Zr 0.35 F 2.70 : Mn 4+
(8) A 3 [ZrF 7 ]: Mn 4+
(However, A is selected from Li, Na, K, Rb, Cs, NH 4 and combinations thereof.)
以上のように、本実施形態では、Mn4+で活性化された複合フッ化物蛍光体をシリコーン樹脂21に混練することにより、蛍光体22を劣化させることなく長期間の保管が可能となる。 <Effect of
As described above, in the present embodiment, the composite fluoride phosphor activated with Mn 4+ is kneaded with the silicone resin 21, thereby enabling long-term storage without deteriorating the phosphor 22.
本発明の態様1に係るオープンリールは、リールと、前記リールに巻かれた紐状の蛍光体含有樹脂とを備えることを特徴とする。 [Summary]
An open reel according to
が可能となる。 Therefore, when the phosphor is kneaded into the thermoplastic resin, the phosphor can be uniformly dispersed in the thermoplastic resin by controlling the viscosity of the thermoplastic resin so that the kneaded phosphor does not settle. It becomes possible.
したがって、上記の構成によれば、複数の蛍光体含有樹脂の保管・運搬等を容易に行うことができる。 In the above configuration, since two or more string-like phosphor-containing resins are wound on a reel, a plurality of phosphor-containing resins can be stored together in one reel.
Therefore, according to said structure, storage, conveyance, etc. of several fluorescent substance containing resin can be performed easily.
なお、本発明に係るオープンリールは、以下のように表現するともできる。すなわち、本発明に係るリール巻き封止樹脂は、リールと、前記リールに巻かれた紐状の蛍光体含有封止樹脂とから成ることを特徴としている。 [Supplement]
The open reel according to the present invention can also be expressed as follows. That is, the reel winding sealing resin according to the present invention is characterized by comprising a reel and a string-like phosphor-containing sealing resin wound around the reel.
1a オープンリール
20 蛍光体含有樹脂
21 シリコーン樹脂(熱可塑性樹脂)
22 蛍光体
23 可塑剤
24 粉末混合物
25 混練物
30 リール
37 二軸スクリュー押出装置
37a スクリュー
37b 排出口
101 オープンリール
120 蛍光体含有樹脂
125 混練物
T1 2次架橋温度(架橋温度) 1
22 phosphor 23
Claims (6)
- リールと、
前記リールに巻かれた紐状の蛍光体含有樹脂とを備えることを特徴とするオープンリール。 With reel,
An open reel comprising: a string-like phosphor-containing resin wound around the reel. - 前記蛍光体含有樹脂は、少なくとも蛍光体を熱可塑性樹脂に分散させたものであり、
前記熱可塑性樹脂は、所定の架橋温度未満の温度において熱可塑性を有し、前記架橋温度以上の温度で不可逆的に硬化することを特徴とする請求項1に記載のオープンリール。 The phosphor-containing resin is obtained by dispersing at least a phosphor in a thermoplastic resin,
The open reel according to claim 1, wherein the thermoplastic resin has thermoplasticity at a temperature lower than a predetermined crosslinking temperature, and is irreversibly cured at a temperature equal to or higher than the crosslinking temperature. - 前記架橋温度は、120℃以上170℃以下であることを特徴とする請求項2に記載のオープンリール。 The open reel according to claim 2, wherein the crosslinking temperature is 120 ° C or higher and 170 ° C or lower.
- 前記熱可塑性樹脂は、ベンゼン、トルエンおよびキシレンから成る溶剤を含有していることを特徴とする請求項2または3に記載のオープンリール。 The open reel according to claim 2 or 3, wherein the thermoplastic resin contains a solvent composed of benzene, toluene, and xylene.
- 前記蛍光体含有樹脂は、当該蛍光体含有樹脂の軸線方向に沿って、蛍光体含有量が互いに異なる部分を有していることを特徴とする請求項1から4のいずれか一項に記載のオープンリール。 The said fluorescent substance containing resin has a part from which fluorescent substance content differs mutually along the axial direction of the said fluorescent substance containing resin, The Claim 1 characterized by the above-mentioned. Open reel.
- 蛍光体含有量が同一または異なる2つ以上の前記蛍光体含有樹脂が、1つの前記リールに巻かれていることを特徴とする請求項1から4のいずれか一項に記載のオープンリール。 The open reel according to any one of claims 1 to 4, wherein two or more phosphor-containing resins having the same or different phosphor contents are wound on one reel.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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US14/783,517 US20160060073A1 (en) | 2013-04-15 | 2014-03-24 | Open reel |
JP2015512374A JP6092372B2 (en) | 2013-04-15 | 2014-03-24 | Open reel |
CN201480021178.2A CN105164824B (en) | 2013-04-15 | 2014-03-24 | Open reel |
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Application Number | Priority Date | Filing Date | Title |
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JP2013085293 | 2013-04-15 | ||
JP2013-085293 | 2013-04-15 |
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WO2014171268A1 true WO2014171268A1 (en) | 2014-10-23 |
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Family Applications (1)
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PCT/JP2014/058055 WO2014171268A1 (en) | 2013-04-15 | 2014-03-24 | Open reel |
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US (1) | US20160060073A1 (en) |
JP (1) | JP6092372B2 (en) |
CN (1) | CN105164824B (en) |
WO (1) | WO2014171268A1 (en) |
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US9704834B2 (en) | 2013-05-28 | 2017-07-11 | Sharp Kabushiki Kaisha | Method for manufacturing light-emitting device |
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US9985182B2 (en) * | 2015-12-25 | 2018-05-29 | Citizen Electronics Co., Ltd. | Light-emitting apparatus and color-matching apparatus |
USD948994S1 (en) * | 2019-09-24 | 2022-04-19 | Ralph Mugerdichian | Construction line reel |
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- 2014-03-24 JP JP2015512374A patent/JP6092372B2/en not_active Expired - Fee Related
- 2014-03-24 US US14/783,517 patent/US20160060073A1/en not_active Abandoned
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JPWO2014171268A1 (en) | 2017-02-23 |
CN105164824A (en) | 2015-12-16 |
JP6092372B2 (en) | 2017-03-08 |
US20160060073A1 (en) | 2016-03-03 |
CN105164824B (en) | 2018-06-12 |
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