WO2014168053A1 - 単結晶ダイヤモンドおよびダイヤモンド工具 - Google Patents
単結晶ダイヤモンドおよびダイヤモンド工具 Download PDFInfo
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- WO2014168053A1 WO2014168053A1 PCT/JP2014/059713 JP2014059713W WO2014168053A1 WO 2014168053 A1 WO2014168053 A1 WO 2014168053A1 JP 2014059713 W JP2014059713 W JP 2014059713W WO 2014168053 A1 WO2014168053 A1 WO 2014168053A1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
- C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/04—Diamond
Definitions
- the present invention relates to a single crystal diamond and a diamond tool, and more particularly to a single crystal diamond having a defect introduced therein and a diamond tool including the single crystal diamond.
- diamonds produced by natural diamond or high temperature high pressure method are used as diamond tools such as cutting tools and wear-resistant tools.
- Natural diamonds vary greatly in quality and the supply is not stable.
- diamond produced by the high-temperature and high-pressure synthesis method has a small quality variation and a stable supply amount, but has a problem that the cost of production equipment is high.
- Patent Document 1 Japanese Unexamined Patent Application Publication No. 2005-162525 (hereinafter referred to as Patent Document 1) discloses a diamond produced by a gas phase synthesis method and transparent in the ultraviolet region and having small crystal defects and distortions.
- Patent Document 2 Japanese Patent Application Laid-Open No. 2006-315942 (hereinafter referred to as Patent Document 2) discloses a diamond single crystal used for a semiconductor device substrate and having a small strain.
- Patent Document 3 discloses a CVD single crystal diamond material suitable for use in an optical device or element.
- diamond produced by such a gas phase synthesis method has a problem that chipping is likely to occur when used as a tool material.
- Single crystal diamond has the property of being easily cleaved on the (111) plane. For this reason, in single crystal diamond with few impurities and defects, a crack is generated in part along the cleavage plane ((111) plane) due to mechanical impact, and this crack propagates through the crystal, resulting in macro chipping. appear.
- the present inventor has found that when impurities such as nitrogen and boron are present in the crystal, these impurities work to prevent the development of cracks, so that the generation of large chips is suppressed.
- defects such as atomic vacancies and dislocations in the crystal have the effect of preventing the growth of cracks as well as impurities.
- the present inventor has predicted that a diamond having high mechanical strength and hardly chipped can be obtained by introducing impurities and defects in the diamond crystal in a controlled state.
- the present invention has been made in view of the above problems, and an object of the present invention is to provide a single crystal diamond in which generation of a chip is suppressed by introducing the defect in a controlled state, and the single crystal diamond. Thus, it is to provide a diamond tool having excellent durability.
- the single crystal diamond according to the present invention is a single crystal diamond having a defect introduced therein.
- the defect portion can be detected by a phase difference generated when the single crystal diamond is irradiated with circularly polarized light.
- the maximum of the average value of the retardation measured in a measurement region having a square shape with a side length of 1 mm is 30 nm or more.
- the present inventor has intensively studied about introducing a defect portion while controlling the single crystal diamond. As a result, it has been found that the introduction of the defect portion in the crystal in such a manner that the maximum of the average value of the phase difference is within the above range can significantly suppress the occurrence of diamond chipping. did.
- the defect portion is introduced into the crystal so that the maximum of the average value of the retardation is 30 nm or more. Therefore, according to the single crystal diamond according to the present invention, it is possible to provide a single crystal diamond in which the occurrence of chipping is suppressed.
- the maximum average value of the phase differences is 30 nm or more.
- the standard deviation of the phase difference measured in the measurement region may be 30 nm or more.
- a plurality of peaks may exist in the frequency distribution of the phase difference measured in the measurement region.
- the first peak that exists at a value smaller than the average value of the phase difference and a value that is larger than the average value of the phase difference exist.
- a second peak may be present.
- the defect portion may be introduced in a straight line. Moreover, the defect part may be introduced along with the circular arc shape.
- the defect portions may be introduced in a state of being arranged so as to form an arbitrary shape.
- the single crystal diamond may be formed by a gas phase synthesis method. Thereby, it becomes easy to introduce the defect portion in the controlled state in the single crystal diamond.
- the single crystal diamond may be used for a diamond tool.
- the single crystal diamond in which the occurrence of chipping is suppressed is suitable as a diamond used in a diamond tool.
- the diamond tool according to the present invention includes the above-described single crystal diamond in which the occurrence of chipping is suppressed. Therefore, according to the diamond tool according to the present invention, a diamond tool having excellent durability can be provided.
- the single crystal diamond according to the present invention it is possible to provide a single crystal diamond in which the occurrence of chipping is suppressed. Moreover, according to the diamond tool according to the present invention, a diamond tool having excellent durability can be provided.
- FIG. 8 is a diagram showing a height profile on the surface of the single crystal substrate along the line segment VIII-VIII in FIG. It is the schematic for demonstrating the process (S30) in the manufacturing method of the single crystal diamond which concerns on this Embodiment. It is the schematic for demonstrating the process (S40) in the manufacturing method of the single crystal diamond which concerns on this Embodiment. It is the schematic for demonstrating the process (S50) in the manufacturing method of the single crystal diamond which concerns on this Embodiment. It is a phase difference distribution photograph of single crystal diamond in an example. It is a phase difference distribution photograph of single crystal diamond in a comparative example. It is a graph which shows the relationship between feed and the surface roughness of a workpiece
- a diamond tool 1 will be described as an example of a diamond tool according to an embodiment of the present invention.
- a diamond tool 1 according to the present embodiment mainly includes a base metal 2, a brazing layer 3, a metallized layer 4, and a single crystal diamond 10.
- the single crystal diamond 10 is fixed to the base metal 2 through the brazing layer 3 and the metallized layer 4.
- Single crystal diamond 10 includes rake face 10b and flank face 10c, and a cutting edge 10d is formed at the contact portion between rake face 10b and flank face 10c.
- the single crystal diamond 10 is a single crystal diamond according to the present embodiment in which generation of chips is suppressed as will be described later. Therefore, the diamond tool 1 is a diamond tool with improved durability.
- the diamond tool of the present invention is not limited to the diamond tool 1 described above, and may be another cutting tool (not shown) such as a drill or an end mill. ) Also in these cutting tools and wear-resistant tools, the durability can be improved in the same manner as the diamond tool 1 by providing the single crystal diamond 10.
- FIG. 2 is a schematic plan view of the single crystal diamond 10 as viewed from the main surface 10a side.
- single crystal diamond 10 is manufactured by a vapor phase synthesis method such as a CVD (Chemical Vapor Deposition) method, and has, for example, a flat plate shape (square shape, rectangular shape or octagonal shape).
- CVD Chemical Vapor Deposition
- defects 11 such as strain, atomic vacancies or dislocations are randomly scattered in the main surface 10a.
- the defect portion 11 is schematically shown by two straight lines orthogonal to each other. However, the defect portion 11 can be detected by, for example, birefringence distribution measurement described below.
- the single crystal diamond 10 is processed into a plate shape having a thickness of 700 ⁇ m.
- the thickness of the single crystal diamond 10 may be processed by, for example, polishing or etching.
- the single crystal diamond 10 is a thin plate that cannot be processed to a thickness of 700 ⁇ m, the following measurement is performed without performing the above processing, and the measured value is proportional to the plate thickness and the thickness is 700 ⁇ m. You may convert into a case.
- circularly polarized light is irradiated from one main surface side of the single crystal diamond 10 substantially perpendicularly to the main surface. Since diamond is an isotropic crystal, it usually has an isotropic refractive index (dielectric constant), whereas the portion where the defect 11 is introduced has a birefringence that differs in refractive index depending on the direction. . For this reason, when the circularly polarized light is irradiated on the defect portion 11, a phase difference is generated and the light is emitted as elliptically polarized light (including linearly polarized light), while the circular light is irradiated on the portion excluding the defective portion 11.
- the optical axis and the phase difference can be obtained by obtaining the orientation of the major and minor axes of the ellipse in elliptically polarized light and the ratio of the major and minor axes. Further, by combining a lens and a microscope, it is possible to obtain information on a local phase difference in a fine part. Further, by disposing an integrated polarizer in front of the pixel of the digital detector, information in each pixel (that is, information on the local position of the sample) can be obtained two-dimensionally. By measuring the value of the phase difference (nm) due to the presence of the defect portion 11 using such a principle, the defect portion 11 introduced into the single crystal diamond 10 can be detected.
- the above measurement can be performed using, for example, a birefringence distribution measuring apparatus (manufactured by Photonic Lattice Co., Ltd., WPA-micro or WPA-100). Generally, it is difficult to discriminate when the phase difference exceeds 90 degrees (1/4 of the wavelength). However, since the birefringence distribution measuring apparatus is changed from the integrated polarizer method to the integrated wavelength plate method, the measurement range is limited. The phase difference is expanded to 180 degrees (1/2 wavelength). It has been experimentally verified that when three types of wavelengths (one central wavelength and two wavelengths close thereto) are used, the measurement range is extended to 5 to 6 times the wavelength.
- the maximum average value of the phase difference is 30 nm or more, preferably 50 nm or more, more preferably 100 nm or more. It is. Further, the standard deviation of the phase difference measured in the measurement region M is 30 nm or more, preferably 100 nm or more, and more preferably 200 nm or more. Further, the maximum value of the phase difference measured in the measurement region M is 100 nm or more.
- the defect portion 11 is controlled so that the maximum of the average value of the phase difference, the standard deviation of the phase difference, and the maximum value of the phase difference are in the above range (mainly In a state of being scattered at high density and randomly in the surface 10a). Therefore, the single crystal diamond 10 is a diamond in which the occurrence of chipping is suppressed.
- FIG. 3 is a graph showing the frequency distribution of the phase difference measured in the measurement region M (see FIG. 2) in the single crystal diamond 10.
- the horizontal axis and the vertical axis indicate the phase difference and the frequency, respectively, and the broken line along the vertical axis indicates the average value of the phase difference.
- the first peak P1 that exists at a value smaller than the average value of the phase difference and the first peak P1 that exists at a value larger than the average value of the phase difference, and the frequency is smaller than the first peak P1.
- the second peak P2 has a value of 5% or more of the maximum value of the phase difference, preferably 10% or more of the maximum value of the phase difference, more preferably 20% or more of the maximum value of the phase difference. Exists in the value of.
- the frequency distribution is not limited to the case where two peaks are present, and for example, three peaks may be present or more peaks may be present.
- the single crystal diamond 10 is not limited to the case where the defect portions 11 are introduced so as to be randomly scattered, and may be introduced in a straight line as shown in FIG. As shown, they may be introduced side by side in an arc. Moreover, the straight line and the circular arc in which the defect portions 11 are arranged may be periodically formed along each other. The number of straight lines and arcs is not particularly limited, and may be four as shown in FIGS. 4 and 5 or more.
- the defect portion 11 is introduced into the crystal in a controlled state so that the maximum average value of the phase difference is 30 nm or more. Therefore, the single crystal diamond 10 is a diamond in which the occurrence of chipping is suppressed.
- the standard deviation of the phase difference measured in the measurement region M may be 30 nm or more.
- the defect portions 11 are more uniformly dispersed.
- the occurrence of chipping in the single crystal diamond 10 can be more effectively suppressed.
- a plurality of peaks may exist in the frequency distribution of the phase difference measured in the measurement region M. Further, the first peak P1 may exist at a value smaller than the average value of the phase difference, and the second peak P2 may exist at a value larger than the average value of the phase difference.
- the defect portions 11 are further uniformly dispersed. As a result, the occurrence of chipping in the single crystal diamond 10 can be more effectively suppressed.
- steps (S10) to (S50) are sequentially performed to produce single crystal diamond 10 according to the present embodiment. can do.
- a single crystal substrate preparation step is performed.
- step (S10) referring to FIG. 7, single crystal substrate 20 (type: Ib) having a flat plate shape (square shape) and made of diamond manufactured by a high-temperature high-pressure synthesis method is prepared.
- the single crystal substrate 20 has a surface 20a composed of a (100) plane and a side surface 20b composed of a (001) plane perpendicular to the surface 20a.
- the shape of single crystal substrate 20 is not limited to a square shape as shown in FIG. 7, and may be, for example, a rectangular shape or an octagonal shape.
- a plurality of grooves 21 are formed on the surface 20a of the single crystal substrate 20 so as to be along each other.
- An interval L between adjacent grooves 21 is more than 10 ⁇ m and 100 ⁇ m or less, preferably more than 10 ⁇ m and less than 20 ⁇ m, or 20 ⁇ m or more and 100 ⁇ m or less.
- Groove 21 forms a line-shaped resist pattern on surface 20a using, for example, photolithography, and then etches surface 20a of single crystal substrate 20 with plasma in a portion where the resist pattern is not formed. May be formed.
- the groove part 21 may be formed by processing the surface 20a of the single crystal substrate 20 into a line shape (grooving process) using a laser processing machine.
- the groove 21 may be formed by mechanically cutting the surface 20a of the single crystal substrate 20 (mechanical polishing). In this mechanical polishing, for example, a polishing machine in which diamond abrasive grains are embedded, a polishing machine using cast iron, or a polishing machine using silicon dioxide (SiO 2 ) can be used.
- the line-shaped groove portions 21 can be formed, and a plurality of line-shaped groove portions 21 can be formed in a lattice shape.
- a groove portion having an arc shape or another shape can be formed.
- it can also cut
- a periodic height difference can be formed on the surface 20 a of the single crystal substrate 20.
- the grooves 21 can be formed in a state of being appropriately dispersed on the surface 20a of the single crystal substrate 20.
- the groove part 21 should just be formed in the surface 20a in appropriate dispersion
- FIG. 8 shows a height profile on the surface 20a of the single crystal substrate 20 along the line segment VIII-VIII in FIG.
- the horizontal direction indicates the distance along the surface 20a of the single crystal substrate 20
- the vertical direction indicates the height.
- the height difference H which is the difference between the minimum height (portion where the groove 21 is formed) and the maximum height is 15 nm or more, preferably 50 nm or more, more preferably 300 nm or more. It is.
- the surface 20a of the single crystal substrate 20 is processed so that the distance L between the grooves 21 and the height difference H are within the above ranges. Therefore, in the step (S40) described later, an epitaxial growth layer introduced in a state where the defect portion is controlled can be grown on the single crystal substrate 20.
- an etching process is implemented as process (S20).
- the surface 20a is formed by reactive ion etching (RIE) using, for example, oxygen (O 2 ) gas and carbon tetrafluoride (CF 4 ) gas. Etched.
- RIE reactive ion etching
- the etching method is not limited to RIE, and may be sputtering using, for example, argon (Ar) gas as a main gas.
- this step (S20) is a very important step when the surface 20a is processed using a polishing machine in which diamond abrasive grains are embedded. That is, in the case of mechanical polishing using the polishing disk, a large level difference is formed on the surface 20a, so that polishing damage on the surface 20a increases. As a result, abnormal particles grow on the surface 20a and polycrystals are formed. On the other hand, the removal of polishing damage on the surface 20a by ion etching can suppress the formation of polycrystals due to the growth of abnormal particles. When mechanical polishing with a polishing disk using SiO 2 , surface cutting with a laser, or heat treatment in an oxygen atmosphere is performed, polishing damage on the surface 20a is small, so the above step (S20) can be omitted. It is.
- step (S30) an ion implantation step is performed.
- this step (S30) referring to FIG. 9, carbon (C) or phosphorus (P) is implanted into single crystal substrate 20 from the surface 20a side. Thereby, the conductive layer 22 is formed in a region including the surface 20a.
- an epitaxial growth step is performed as a step (S40).
- step (S40) referring to FIG. 10, epitaxial growth layer 23 made of single-crystal diamond is grown on conductive layer 22 by, for example, microwave plasma (MP: Microwave Plasma) CVD.
- MP microwave plasma
- the method of forming the epitaxial growth layer 23 is not limited to the MP-CVD method, and may be, for example, a hot filament (HF) CVD method or a DC plasma method.
- the epitaxial growth layer 23 has a growth parameter ( ⁇ ) of 2 or more and a temperature of the single crystal substrate 20 of 1050 at least in the region of 1 to 7 ⁇ m at the beginning of growth (region of 1 ⁇ m to 7 ⁇ m in the growth direction from the surface 20a). It is preferable to grow under the condition of °C or less.
- the growth parameter ( ⁇ ) is a value that is ⁇ 3 times the ratio of the growth rate in the ⁇ 100> direction to the growth rate in the ⁇ 111> direction. Thereby, even when the height difference on the surface 20a of the single crystal substrate 20 is large, the single crystal diamond (epitaxial growth layer 23) can be stably grown.
- a separation step is performed as a step (S50).
- step (S50) referring to FIG. 11, conductive layer 22 is electrochemically etched to separate single crystal substrate 20 and epitaxial growth layer 23 from each other.
- the single crystal diamond 10 epitaxial growth layer 23
- the steps (S10) to (S50) are performed to manufacture the single crystal diamond 10, and the method for manufacturing the single crystal diamond according to the present embodiment is completed.
- single crystal diamond 10 was manufactured using the method for manufacturing single crystal diamond according to the present embodiment (see FIGS. 6 to 11).
- step (S10) a single crystal substrate 20 having a 5 mm ⁇ 5 mm square shape and a thickness of 0.7 mm was prepared (see FIG. 7). Further, the height difference H on the surface 20a of the single crystal substrate 20 was 15 nm or more, and the distance L between the grooves 21 was more than 10 ⁇ m and 100 ⁇ m or less (see FIG. 8).
- etching was performed from the surface 20a to a depth region of 0.3 ⁇ m by RIE, or etching was performed from the surface 20a to a depth region of 0.1 ⁇ m by sputtering (see FIG. 7).
- the conductive layer 22 is formed by implanting carbon ions with an ion implantation energy of 300 to 350 keV and a dose of 5 ⁇ 10 15 to 5 ⁇ 10 17 ions / cm 2 (see FIG. 9). ).
- an epitaxial growth layer 23 having a thickness of 0.7 mm was formed (see FIG. 10). Further, hydrogen (H 2 ) gas, methane (CH 4 ) gas and nitrogen (N 2 ) gas are used, the concentration of CH 4 gas with respect to H 2 gas is set to 5 to 20%, and the N 2 gas with respect to CH 4 gas is The concentration was 0.5-4%.
- the pressure was set to 9.3 to 14.7 kPa, and the substrate temperature was set to 800 to 1100 ° C.
- the size of the single crystal diamond 10 was 1 mm ⁇ 1 mm, 3 mm ⁇ 3 mm, or 6 mm ⁇ 6 mm. In this way, single crystal diamond 10 of Examples 1 to 6 was produced. Comparative examples 1 to 3 were produced by producing single crystal diamond with the height difference H on the surface 20a of the single crystal substrate 20 and the interval L between the grooves 21 outside the above ranges.
- the workpiece was cut using the single crystal diamonds of Examples 1 to 6 and Comparative Examples 1 to 3, polycrystalline diamond (D1000), and high-pressure synthetic diamond as cutter blades.
- the presence or absence of chipping was investigated.
- RF4080R made by Sumitomo Electric Hardmetal Co., Ltd. was used for the cutter.
- SNEW1204ADFR-WS manufactured by Sumitomo Electric Hardmetal Co., Ltd. was used as the wiper chip.
- As a lathe NV5000 manufactured by Mori Seiki Co., Ltd. was used.
- the cutting speed was 2000 m / min.
- the incision was 0.05 mm.
- the feed was 0.05 mm / blade, 0.1 mm / blade, or 0.15 mm / blade.
- An aluminum material (A5052) was used for the workpiece. After cutting the workpiece under the above conditions, the presence or absence of diamond chipping was investigated. Further, for each feed (mm / blade) condition, the surface roughness ( ⁇ m) of the workpiece and the presence / absence of burrs were also investigated.
- the single crystal diamonds of Examples 1 to 6 and Comparative Examples 1 to 3 were subjected to polishing for cutting out the cutting edge for a bite tool. And the number of chippings (chipping) when observed over a length of 2 mm after processing was investigated.
- the investigation object was a chip with a size of 5 ⁇ m or more.
- Table 1 shows the result of the phase difference measurement, the investigation result of the chipping occurrence during the blade seat polishing process, and the investigation result of the chipping generation after the cutting process.
- Table 2 shows the investigation results of the occurrence of burrs after cutting.
- 12 and 13 show birefringence photographs of the single crystal diamonds of Examples 1 to 6 and Comparative Examples 1 to 3, respectively.
- FIG. 14 is a graph showing the relationship between the feed (mm / blade) and the surface roughness ( ⁇ m) of the workpiece. The horizontal axis shows the feed (mm / blade), and the vertical axis shows the surface roughness of the workpiece. ( ⁇ m).
- the phase difference was measured using a wavelength of 543 nm, and the maximum value of the phase difference was 2000 nm or less. From this result, in the single crystal diamond formed on the single crystal substrate, the height difference H on the surface of the single crystal substrate is set to 15 nm or more, and the interval L between the grooves 21 is set to more than 10 ⁇ m and 100 ⁇ m or less. It was found that the maximum average value of the phase difference was 30 nm or more.
- the single crystal diamond and diamond tool of the present invention can be particularly advantageously applied to single crystal diamond required to suppress the occurrence of chipping and diamond tool required to improve durability.
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Abstract
Description
単結晶ダイヤモンドにおける欠けの発生の抑制について、本発明の効果を確認する実験を行った。まず、上記本実施の形態に係る単結晶ダイヤモンドの製造方法を用いて単結晶ダイヤモンド10を製造した(図6~図11参照)。工程(S10)では、5mm×5mmの正方形状を有し、厚みが0.7mmの単結晶基板20を準備した(図7参照)。また、単結晶基板20の表面20aにおける高低差Hは15nm以上であり、かつ溝21同士の間隔Lは10μmを超え100μm以下であった(図8参照)。工程(S20)では、RIEにより表面20aから0.3μmの深さ領域までエッチングし、またはスパッタリングにより表面20aから0.1μmの深さ領域までエッチングした(図7参照)。
上記実施例1~6および比較例1~3の単結晶ダイヤモンドの成長表面を研磨し、その後位相差の測定を行った。位相差の測定には、複屈折分布測定装置(株式会社フォトニックラティス社製、WPA-100)を用い、上述のように単結晶ダイヤモンド10の主面10a内に複数の測定領域M(1mm×1mm)を設定して測定を行った(図2参照)。また、サンプル(単結晶ダイヤモンド)中において20μm×20μmの情報を得ることができるように、レンズを用いて上記測定装置を調整した。なお、上記測定装置では、3種類の波長(523nm、543nm、575nm)を用いて、0~3000nmの位相差の範囲で測定することが可能である。
上記実施例1~6および比較例1~3の単結晶ダイヤモンド、ならびに多結晶ダイヤモンド(D1000)および高圧合成ダイヤモンドの各々をカッター刃に用いて被削材(ワーク)の切削加工を行い、その際の欠けの発生の有無を調査した。カッターには、住友電工ハードメタル株式会社製のRF4080Rを用いた。ワイパーチップには、住友電工ハードメタル株式会社製のSNEW1204ADFR-WSを用いた。旋盤には、株式会社森精機社製のNV5000を用いた。切削速度は、2000m/minとした。切込みは、0.05mmとした。送りは、0.05mm/刃、0.1mm/刃、または0.15mm/刃とした。ワークには、アルミ材(A5052)を用いた。上記条件によりワークの切削加工を行った後、ダイヤモンドの欠けの発生の有無を調査した。また、各々の送り(mm/刃)条件について、ワークの面粗さ(μm)およびバリの発生の有無も調査した。
上記実施例1~6および比較例1~3の単結晶ダイヤモンドについて、バイト工具用の刃先出しのための研磨加工を行った。そして、加工後に2mmの長さに亘り観察した場合の欠け(チッピング)の数を調査した。なお、調査対象は、5μm以上の大きさの欠けとした。
位相差の測定結果について説明する。図12および図13の位相差分布写真において、位相差が大きい領域(欠陥部が導入された領域)は白く観察され、一方で位相差が小さい領域は黒く観察された。図12および図13から明らかなように、実施例1~6では、位相差分布写真において白く観察される領域が面内に広く形成されていたのに対し(図12)、比較例1~3では白く観察される領域がほぼ形成されていなかった(図13)。また、表1から明らかなように、実施例1~6では位相差の平均値の最大がいずれも30nm以上となったのに対し、比較例1~3ではいずれも30nm未満であった。また、位相差は543nmの波長を用いて測定されており、位相差の最大値は2000nm以下であった。この結果より、単結晶基板の表面における高低差Hを15nm以上とし、かつ溝21同士の間隔Lを10μmを超え100μm以下に設定することにより、当該単結晶基板上に形成される単結晶ダイヤモンドにおける位相差の平均値の最大が30nm以上になることが分かった。
切削加工後の欠け発生の調査結果について説明する。表1を参照して、送りを0.15mm/刃とした場合には、実施例1~6では切削加工後の欠けの発生が見られなかったのに対して、比較例1~3では欠けの発生が見られた。この結果より、単結晶ダイヤモンドにおける位相差の平均値の最大を30nm以上とすることにより、欠けの発生が抑制されることが分かった。
切削加工後のワークの面粗さの調査結果について説明する。図14を参照して、多結晶ダイヤモンドでは、送り(mm/刃)が大きくなるのに伴いワークの面粗さが大きくなったのに対して、実施例1~6の単結晶ダイヤモンドでは送りが0.15mm/刃の時にワークの面粗さが大きく低下した。また、比較例1~3の単結晶ダイヤモンドでは、上述のように送りが0.15mm/刃の時に欠けが発生した。
切削加工後のバリ発生の調査結果について説明する。表2を参照して、多結晶ダイヤモンドでは切削加工後にワークにバリの発生が見られたのに対して、高圧合成ダイヤモンド、実施例1~6および比較例1~3の単結晶ダイヤモンドでは、いずれもバリの発生が見られなかった。
刃先研磨加工時の欠け(チッピング)の発生の調査結果について説明する。表1を参照して、実施例1~6ではチッピングの発生数が0個であったのに対して、比較例1~3では3個以上のチッピングが見られた。この結果より、単結晶ダイヤモンドにおける位相差の平均値の最大を30nm以上とすることにより、欠けの発生が抑制されることが分かった。
Claims (9)
- 欠陥部が導入された単結晶ダイヤモンドであって、
前記欠陥部は、前記単結晶ダイヤモンドに円偏光を照射した場合に発生する位相差により検出可能であり、
1辺の長さが1mmである正方形状を有する測定領域内で測定された前記位相差の平均値の最大が30nm以上である、単結晶ダイヤモンド。 - 前記測定領域内で測定された前記位相差の標準偏差が30nm以上である、請求項1に記載の単結晶ダイヤモンド。
- 前記測定領域内で測定された前記位相差の度数分布では、複数のピークが存在する、請求項1または2に記載の単結晶ダイヤモンド。
- 前記測定領域内で測定された前記位相差の度数分布では、前記位相差の平均値よりも小さい値において存在する第1のピークと、前記位相差の平均値よりも大きい値において存在する第2のピークとが存在する、請求項3に記載の単結晶ダイヤモンド。
- 前記欠陥部が直線状に並んで導入されている、請求項1~4のいずれか1項に記載の単結晶ダイヤモンド。
- 前記欠陥部が円弧状に並んで導入されている、請求項1~5のいずれか1項に記載の単結晶ダイヤモンド。
- 気相合成法により形成されている、請求項1~6のいずれか1項に記載の単結晶ダイヤモンド。
- ダイヤモンド工具に用いられる、請求項1~7のいずれか1項に記載の単結晶ダイヤモンド。
- 請求項1~8のいずれか1項に記載の単結晶ダイヤモンドを備える、ダイヤモンド工具。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016013588A1 (ja) * | 2014-07-22 | 2016-01-28 | 住友電気工業株式会社 | 単結晶ダイヤモンドおよびその製造方法、単結晶ダイヤモンドを含む工具、ならびに単結晶ダイヤモンドを含む部品 |
EP2848716A4 (en) * | 2013-04-30 | 2016-02-24 | Sumitomo Electric Industries | CRYSTALLINE DIAMOND AND DIAMOND TOOL |
WO2021065258A1 (ja) * | 2019-10-01 | 2021-04-08 | 住友電工ハードメタル株式会社 | ダイヤモンド棒状体、ダイヤモンド工具およびカンチレバー |
WO2022209512A1 (ja) * | 2021-03-31 | 2022-10-06 | 住友電気工業株式会社 | 単結晶ダイヤモンド及びその製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016024564A1 (ja) * | 2014-08-11 | 2016-02-18 | 住友電気工業株式会社 | ダイヤモンド複合体、基板、ダイヤモンド、ダイヤモンドを備える工具およびダイヤモンドの製造方法 |
GB201620413D0 (en) | 2016-12-01 | 2017-01-18 | Element Six Tech Ltd | Single crystal synthetic diamond material via chemical vapour deposition |
CN111996581B (zh) * | 2020-07-08 | 2021-10-26 | 西安电子科技大学 | 一种单晶金刚石与衬底无损耗快速分离方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005162525A (ja) | 2003-12-02 | 2005-06-23 | Sumitomo Electric Ind Ltd | 単結晶ダイヤモンド |
JP2005225746A (ja) * | 2004-01-16 | 2005-08-25 | Sumitomo Electric Ind Ltd | ダイヤモンド単結晶基板の製造方法およびダイヤモンド単結晶基板 |
JP2006507204A (ja) | 2002-11-21 | 2006-03-02 | エレメント シックス リミテッド | 光学品質のダイヤモンド材料 |
JP2006062923A (ja) * | 2004-08-27 | 2006-03-09 | Sumitomo Electric Ind Ltd | ダイヤモンドドーム部品およびその製造方法 |
JP2006518699A (ja) * | 2003-02-19 | 2006-08-17 | エレメント シックス リミテッド | 摩耗用途のcvdダイヤモンド |
JP2006315942A (ja) | 2005-04-15 | 2006-11-24 | Sumitomo Electric Ind Ltd | 単結晶ダイヤモンドおよびその製造方法 |
WO2011076642A1 (en) * | 2009-12-21 | 2011-06-30 | Element Six Limited | Single crystal diamond material |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4316385A (en) * | 1980-06-18 | 1982-02-23 | General Electric Company | Fingerprinting crystals |
KR100837033B1 (ko) | 2000-06-15 | 2008-06-10 | 엘리먼트 씩스 (프티) 리미티드 | 화학 증착에 의해 제조된 단결정 다이아몬드 |
GB0221949D0 (en) * | 2002-09-20 | 2002-10-30 | Diamanx Products Ltd | Single crystal diamond |
US7481879B2 (en) | 2004-01-16 | 2009-01-27 | Sumitomo Electric Industries, Ltd. | Diamond single crystal substrate manufacturing method and diamond single crystal substrate |
US7615203B2 (en) * | 2004-11-05 | 2009-11-10 | Sumitomo Electric Industries, Ltd. | Single crystal diamond |
JP5594613B2 (ja) * | 2005-04-15 | 2014-09-24 | 住友電気工業株式会社 | 単結晶ダイヤモンドおよびその製造方法 |
WO2007066215A2 (en) | 2005-12-09 | 2007-06-14 | Element Six Technologies (Pty) Ltd | High crystalline quality synthetic diamond |
ATE506464T1 (de) * | 2005-12-09 | 2011-05-15 | Element Six Technologies Pty Ltd | Synthetischer diamant mit hoher kristalliner qualität |
JP2007230807A (ja) * | 2006-02-28 | 2007-09-13 | Allied Material Corp | ダイヤモンド製品の製造方法 |
-
2014
- 2014-04-02 WO PCT/JP2014/059713 patent/WO2014168053A1/ja active Application Filing
- 2014-04-02 US US14/423,884 patent/US9963801B2/en active Active
- 2014-04-02 CN CN201480002248.XA patent/CN104603335B/zh active Active
- 2014-04-02 EP EP14783086.3A patent/EP2985368B1/en active Active
- 2014-04-02 JP JP2015511223A patent/JP6360041B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006507204A (ja) | 2002-11-21 | 2006-03-02 | エレメント シックス リミテッド | 光学品質のダイヤモンド材料 |
JP2006518699A (ja) * | 2003-02-19 | 2006-08-17 | エレメント シックス リミテッド | 摩耗用途のcvdダイヤモンド |
JP2005162525A (ja) | 2003-12-02 | 2005-06-23 | Sumitomo Electric Ind Ltd | 単結晶ダイヤモンド |
JP2005225746A (ja) * | 2004-01-16 | 2005-08-25 | Sumitomo Electric Ind Ltd | ダイヤモンド単結晶基板の製造方法およびダイヤモンド単結晶基板 |
JP2006062923A (ja) * | 2004-08-27 | 2006-03-09 | Sumitomo Electric Ind Ltd | ダイヤモンドドーム部品およびその製造方法 |
JP2006315942A (ja) | 2005-04-15 | 2006-11-24 | Sumitomo Electric Ind Ltd | 単結晶ダイヤモンドおよびその製造方法 |
WO2011076642A1 (en) * | 2009-12-21 | 2011-06-30 | Element Six Limited | Single crystal diamond material |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2848716A4 (en) * | 2013-04-30 | 2016-02-24 | Sumitomo Electric Industries | CRYSTALLINE DIAMOND AND DIAMOND TOOL |
US9957640B2 (en) | 2013-04-30 | 2018-05-01 | Sumitomo Electric Industries, Ltd. | Single crystal diamond and diamond tool |
WO2016013588A1 (ja) * | 2014-07-22 | 2016-01-28 | 住友電気工業株式会社 | 単結晶ダイヤモンドおよびその製造方法、単結晶ダイヤモンドを含む工具、ならびに単結晶ダイヤモンドを含む部品 |
JPWO2016013588A1 (ja) * | 2014-07-22 | 2017-04-27 | 住友電気工業株式会社 | 単結晶ダイヤモンドおよびその製造方法、単結晶ダイヤモンドを含む工具、ならびに単結晶ダイヤモンドを含む部品 |
US10697058B2 (en) | 2014-07-22 | 2020-06-30 | Sumitomo Electric Industries, Ltd. | Single-crystal diamond, method of producing same, tool including single-crystal diamond, and component including single-crystal diamond |
WO2021065258A1 (ja) * | 2019-10-01 | 2021-04-08 | 住友電工ハードメタル株式会社 | ダイヤモンド棒状体、ダイヤモンド工具およびカンチレバー |
WO2022209512A1 (ja) * | 2021-03-31 | 2022-10-06 | 住友電気工業株式会社 | 単結晶ダイヤモンド及びその製造方法 |
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