WO2014167840A1 - Ｌｅｄ製造装置およびｌｅｄ製造方法 - Google Patents

Ｌｅｄ製造装置およびｌｅｄ製造方法 Download PDF

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Publication number
WO2014167840A1
WO2014167840A1 PCT/JP2014/002007 JP2014002007W WO2014167840A1 WO 2014167840 A1 WO2014167840 A1 WO 2014167840A1 JP 2014002007 W JP2014002007 W JP 2014002007W WO 2014167840 A1 WO2014167840 A1 WO 2014167840A1
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WO
WIPO (PCT)
Prior art keywords
phosphor sheet
collet
led
led chip
led manufacturing
Prior art date
Application number
PCT/JP2014/002007
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English (en)
French (fr)
Japanese (ja)
Inventor
浩光 和田
英知 梅田
武治郎 井上
Original Assignee
東レエンジニアリング株式会社
東レ株式会社
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Publication date
Application filed by 東レエンジニアリング株式会社, 東レ株式会社 filed Critical 東レエンジニアリング株式会社
Publication of WO2014167840A1 publication Critical patent/WO2014167840A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Definitions

  • the present invention relates to an LED (Light Emitting Diode) manufacturing apparatus and manufacturing method, and more particularly to an LED manufacturing apparatus and manufacturing method in which a phosphor sheet is placed on a light emitting surface.
  • LED Light Emitting Diode
  • ⁇ LEDs are used for lighting because of their power saving and long life. In order to use for illumination, it is required to emit white light.
  • the emission spectrum of an LED depends on the semiconductor material that forms the LED chip, and its emission color is limited. Therefore, in order to obtain white light using the LED chip, the fluorescence that matches each chip on the LED chip is used. It is necessary to install the body and convert the emission wavelength.
  • a method of installing a yellow phosphor on an LED chip that emits blue light a method of installing red and green phosphors on a blue LED chip, a red, green, and blue color on an LED chip that emits ultraviolet light
  • a method of installing a phosphor has been proposed.
  • the method of installing a yellow phosphor on a blue LED chip and the method of installing red and green phosphors on a blue LED chip are currently the most in view of the luminous efficiency and cost of the LED chip. Widely adopted.
  • a combination of a blue LED and a YAG: Ce yellow phosphor (yttrium aluminate garnet phosphor) is preferably used.
  • LED chips are die-bonded and wire-bonded in a package in which a reflecting mirror is formed on the inclined surface of a recess called a SMD (Surface Mount Device) package, and yellow phosphors or red and green phosphors are dispersed. Manufactured by dispensing dispensed resin.
  • SMD Surface Mount Device
  • the white LED is manufactured by combining the blue LED chip and the phosphor, there is a problem that the color changes slightly depending on the ratio of the phosphor to the blue light from the blue LED chip. This is because a resin material in which phosphors are dispersed in the SMD package is dispensed, so that it is not easy to make the same amount of phosphors in each product.
  • a method has been proposed in which a sheet in which phosphors are dispersed in a predetermined concentration is prepared in advance and the sheet is adhered to the light emitting surface of the LED chip. Since the phosphor sheet can previously manage the concentration and thickness of the phosphor, there is an advantage that a large number of LEDs having the same white color can be produced.
  • Patent Document 1 discloses an invention in which a phosphor sheet is pasted together on an LED chip and a mounting substrate, and then unnecessary portions are cut.
  • Patent Document 2 discloses an invention in which phosphor sheets individually separated to a size suitable for an LED chip are individually attached to the LED chip.
  • the phosphor sheet By using the phosphor sheet, it is possible to make the difference in color of the LED chips uniform. However, in order to handle the phosphor sheet, whether it is pasted together or individually, a certain level of strength is required for the phosphor sheet. In order to increase the strength of the phosphor sheet, it is necessary to increase the ratio of the resin to the phosphor. However, this causes a problem that the phosphor content is reduced. In addition, since the excess portion of the phosphor sheet is cut, a wasteful material is generated, resulting in an increase in cost.
  • the phosphor sheets having low strength are placed on each LED chip one by one so as not to be broken. Therefore, a manufacturing apparatus and a manufacturing method are desired.
  • the present invention has been conceived in view of the above problems, and in particular, a phosphor sheet having a high phosphor content and having adhesiveness to the phosphor sheet itself is formed on a light emitting surface of an LED chip with a die bonder.
  • the LED manufacturing apparatus and the manufacturing method which can be mounted on and completed the LED are provided.
  • the LED manufacturing apparatus is: An LED manufacturing apparatus in which a phosphor sheet is bonded on a light emitting surface, A collet in contact with the phosphor sheet; An arm with the collet; A pressure adjusting unit for applying a negative pressure to the collet; A moving part for displacing the arm in three dimensions; The stage on which the LED on which the phosphor sheet is placed is arranged and a heating unit for heating the LED is provided; It has a controller which controls the pressure adjustment part and the movement part.
  • the collet has a rigidity of Shore hardness of 75 to 85 and has a suction hole having a diameter of 0.1 to 0.15 mm.
  • the LED manufacturing method according to the present invention includes: A step of adsorbing a phosphor sheet having a tensile elongation at break of 0.5% or more and 20% or less to a collet; Moving the collet to the LED mounting position; Placing the phosphor sheet on the light emitting surface of the LED; It has the process of heating the said LED.
  • the LED manufacturing apparatus uses an elastic material for the collet and also has a very fine suction hole, so that the phosphor sheet that is brittle and easily damaged is stably placed on the stage from the supply tray. It can be transferred to the LED chip.
  • FIG. 1 shows the configuration of the LED manufacturing apparatus of the present invention.
  • the LED manufacturing apparatus 1 includes a stage 10, a gantry 12 movable on the stage 10 in the Y-axis direction, a head 14 movable on the gantry 12 in the X-axis direction, and a supply tray 16 placed on the stage 10. And a mounting table 18 having a heating unit (heater) 18a.
  • the head 14 is provided with an arm 14a supported so as to be movable in the Z-axis direction.
  • the flatness of the stage 10 is ensured. This is because the collet 20 at the tip of the arm 14a can approach the object placed on the stage 10 from above the stage 10 with high accuracy.
  • the gantry 12 has a gate shape in which a beam 12c is passed between a pair of support columns 12a and 12b provided in parallel on both sides of the stage 10. The direction in which the columns 12a and 12b are extended is referred to as the Y-axis direction.
  • the beam 12c is supported so as to be movable in the Y-axis direction on the columns 12a and 12b.
  • the beam 12c is secured to the stage 10 with high accuracy. That is, the distance from the beam 12c to the surface of the stage 10 is the same within the allowable error range regardless of where the beam 12c is measured. Moreover, the beam 12c is arrange
  • a head 14 that is movable along the beam 12c of the gantry 12 is attached to the beam 12c.
  • An arm 14a is disposed on the head 14 so as to be movable in a direction perpendicular to the X axis and the Y axis. This direction is called the Z-axis direction.
  • the Z-axis direction is a direction of a perpendicular line dropped from the head 14 onto the stage 10.
  • the head 14 can also impart a rotational motion about the Z-axis direction to the arm 14a. This is called the ⁇ -axis direction.
  • a collet 20 is attached to the tip of the arm 14a. Since the collet 20 sucks the object, a suction pipe 22 for suction is disposed in the arm 14a.
  • the suction tube 22 communicates with the blower 24. In the middle of the suction tube 22, the blower 24 and the suction tube 22 are hermetically sealed to make the suction tube 22 negative pressure, or the connection with the blower 24 is disconnected, and the space between the collet 20 leaks to atmospheric pressure.
  • a suction valve 26 is provided for controlling whether or not.
  • the suction pipe 22, the blower 24, and the suction valve 26 constitute a pressure adjusting unit that applies a negative pressure to the collet 20.
  • the head 14 may be provided with a camera 28.
  • the camera 28 checks the object to be sucked up by the collet 20 and the placement position of the object. With the configuration having the camera 28, accurate mounting (mounting) is possible even if there is a slight shift in the position and inclination when the object is placed on the supply tray 16. Moreover, you may confirm the mounting position of the LED chip which mounts the target object which the collet 20 sucked up.
  • the controller 30 controls a drive motor (not shown) that controls movement in the X-axis direction, the Y-axis direction, the Z-axis direction, and the ⁇ -axis direction using control signals Cx, Cy, Cz, and C ⁇ .
  • the “moving part” of the die bonder is configured including the drive motors in these four directions and the controller 30 for controlling the drive motors.
  • the image signal Sc from the camera 28 may be subjected to image processing, and the moving unit may be controlled based on the result.
  • the controller 30 is connected to the suction valve 26 and controls the opening and closing of the suction valve 26. That is, it can be said that the controller 30 controls the pressure adjustment unit.
  • FIG. 2 shows a view (FIG. 2A) and a side view (FIG. 2B) of the suction surface 20a of the collet 20.
  • FIG. The collet 20 has a size of several mm square, and a suction hole 20b for suction is formed on the suction surface 20a. A groove 20c that connects the suction holes 20b for suction may be formed.
  • the adsorption surface of the collet 20 is a plane.
  • the collet 20 is a part that directly touches the phosphor sheet 40 (see FIG. 1) that is easily damaged and easily deformed.
  • the material of the collet 20 that directly touches the fragile phosphor sheet 40 is too hard for a metal that is normally used.
  • the material needs to be more elastic.
  • the suction hole 20b also needs to be a “small suction hole”.
  • the “small suction hole” is a hole having a diameter of about 0.1 to 0.2 mm as described later. This is because the phosphor sheet 40 may be deformed or damaged by the pressure at the time of suction, or air bubbles may be caught when mounted on the LED chip 41 (see FIG. 1).
  • the material of the collet 20 is made elastic, it is difficult to form a small suction hole 20b. This is because a soft material having elasticity is easily deformed, and the small suction hole 20b is closed simultaneously with the processing or due to the ambient temperature after the processing.
  • a material that is not as hard as a metal and can reliably open a suction hole of about 0.1 mm As a material satisfying this requirement, a rubber or resin material having a Shore hardness of 75 to 85 (A75 to A85) is preferably selected. The Shore hardness is measured based on New JIS 6253 using a durometer (type A).
  • the adsorption surface 20a of the collet 20 is about 1 mm square to 1.5 mm square.
  • the shape is substantially square and, for example, 12 suction holes 20b are formed.
  • the size of the suction hole 20b is preferably 0.1 to 0.15 mm. If the thickness is 0.2 mm or more, the phosphor sheet 40 is deformed. Moreover, at 0.1 mm or less, it cannot adsorb
  • the suction hole 20b has a depth of about 0.5 to 0.7 mm.
  • the phosphor sheet 40 is obtained by dispersing yellow phosphor fine particles such as YAG: Ce-based in a silicone-based resin, applying it in a sheet shape, and cutting it into a predetermined size (for example, a special product). (See JP 2013-1791).
  • the film thickness is preferably 10 ⁇ m to 200 ⁇ m.
  • the phosphor sheet 40 is softened and has adhesiveness at a temperature of 100 ° C. to 130 ° C. Therefore, it is not necessary to use an adhesive if the LED chip 41 is heated when it is placed on the LED chip 41.
  • the tensile elongation at break is 0.1% to 20%, and the tensile elastic modulus is about 270 MPa to 1500 MPa. Therefore, in the case of a very thin state, even if it is about 1 mm square, there is no elasticity and it is damaged by slight deformation.
  • the tensile elongation at break and the tensile modulus of the phosphor sheet 40 are measured as follows.
  • the phosphor sheet 40 produced with a predetermined thickness is cut with a razor to produce 10 test pieces having a size of 10 mm ⁇ 60 mm (the gripping part is 5 mm at both ends).
  • Tensilon UTM-II-20 manufactured by Toyo Baldwin Co., Ltd. which is a tensile tester according to JIS-B-7721 (2009) is used.
  • the collet 20 in which suction holes 20b having various diameters were formed on the phosphor sheet 40 was prepared and subjected to a suction test.
  • the suction blower 24 is usually used.
  • the phosphor sheet 40 used for the test has a thickness of 10 ⁇ m and a size of 1.5 mm square. In the test, the phosphor sheet 40 is picked up from the supply tray 16 and placed on the LED chip 41. If it is placed on the LED chip 41 and there is no air bubble between the light emitting surface and the phosphor sheet 40 and the phosphor sheet 40 is not damaged, it is “OK”. “NG”. The results are shown in Table 1.
  • the supply tray 16 is placed on the stage 10. It has a bottom surface that is secured parallel to the surface of the stage 10.
  • a gel pack 16 a is disposed in the supply tray 16.
  • the phosphor sheet 40 that has been cut in advance to be placed on the LED chip 41 is disposed on the gel pack 16a. Since the gel pack 16 a is soft, the gel pack 16 a absorbs an impact when the collet 20 contacts the phosphor sheet 40. Therefore, damage to the phosphor sheet 40 is suppressed.
  • the mounting table 18 is also placed on the stage 10. Similar to the supply tray 16, it has a bottom face that is secured parallel to the surface of the stage 10.
  • the mounting table 18 is provided with an LED chip 41 on which the phosphor sheet 40 is mounted.
  • the mounting table 18 is provided with a heater 18a.
  • the heater 18a is a heating unit. The heating unit can heat the LED chip 41 on the mounting table 18 to 100 ° C. to 130 ° C.
  • the mounting table 18 may be provided with a temperature sensor 32.
  • the power supply of the temperature sensor 32 and the heater 18a may be connected to the controller 30 so that the controller 30 controls the heating unit.
  • the phosphor sheet 40 is preliminarily formed into a sheet shape, cut into a predetermined size, placed on the supply tray 16, and placed on the stage 10. The position on the stage 10 where the supply tray 16 is placed is determined in advance.
  • the LED chip 41 is also arranged at the mounting position on the mounting table 18.
  • step S100 initial setting is performed (step S102). In the initial setting, the positions of the supply tray 16 and the mounting table 18, the mounting order, and the like are set. Next, an end determination is made (step S104). If it is ended (Y branch of step S104), the process is ended (step S150). The end determination can be made when all the prepared phosphor sheets 40 are mounted on the LED chip 41 or when some trouble occurs. If not finished (N branch of step S104), the process is passed to the next flow.
  • the controller 30 confirms the temperature of the LED chip 41 on the mounting table 18 (step S106).
  • the head 14 is moved to the phosphor sheet 40 of the supply tray 16 (step S108).
  • the position and angle of the phosphor sheet 40 are confirmed by the camera 28.
  • the angle is an angle between the orientation of the phosphor sheet 40 on the supply tray 16 and the reference line on the collet 20.
  • the head 14 When the position of the phosphor sheet 40 does not coincide with the position of the collet 20, the head 14 is finely moved for alignment. If there is a difference in angle, the ⁇ axis of the arm 14a is rotated so that the reference line of the collet 20 and the phosphor sheet 40 are aligned. Note that these fine adjustments may also be included in step S108.
  • the controller 30 moves the arm 14a in the Z-axis direction and lowers the suction surface 20a of the collet 20 to the contact position of the phosphor sheet 40 (step S110). At this time, an operation of slowing the descending speed immediately before contact may be performed. Then, the suction valve 26 is opened, and the phosphor sheet 40 is adsorbed on the adsorption surface 20 a of the collet 20.
  • the suction valve 26 may be opened before the phosphor sheet 40 is approached. If it does in this way, before the collet 20 contacts the phosphor sheet 40, the phosphor sheet 40 will stick to the collet 20. That is, since the phosphor sheet 40 is attracted to the collet 20, the phosphor sheet 40 does not receive an impact when the collet 20 comes into contact.
  • This operation may be a step of adsorbing the phosphor sheet 40 (step S110).
  • the operation of opening the suction valve 26 and sucking air from the suction hole 20b may be referred to as “applying a negative pressure to the collet”.
  • the arm 14a is moved upward in the Z-axis direction, moved in the Y-axis direction, and moved to a predetermined position on the mounting table 18 (step S112).
  • the predetermined position is a mounting position of the LED chip 41.
  • the LED chip 41 on which the phosphor sheet 40 is placed is confirmed by the camera 28, and the position and angle are confirmed. If the position is off, fine-tune.
  • the placement location and the reference line of the collet 20 are deviated, they are aligned on the ⁇ axis.
  • the collet 20 is lowered downward in the Z-axis direction, and the lower surface of the phosphor sheet 40 is moved to the light emitting surface (mounting place) of the LED chip 41.
  • the controller 30 closes the suction valve 26, releases the phosphor sheet 40 (step S114), and moves up in the Z-axis direction.
  • heating is continued for a predetermined time to adhere the phosphor sheet 40 to the light emitting surface (step S116). Thereafter, the flow returns to step S104.
  • an LED in which the phosphor sheet is bonded to the light emitting surface can be manufactured. Since the LED manufacturing apparatus of this invention mounts each cut
  • the LED manufacturing apparatus can be suitably used for manufacturing an LED of a type in which a phosphor sheet is attached to the light emitting surface of an LED chip, and also picks up and moves a fragile film-like sheet, It can be used for general purposes such as mounting on the Internet.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
PCT/JP2014/002007 2013-04-12 2014-04-08 Ｌｅｄ製造装置およびｌｅｄ製造方法 WO2014167840A1 (ja)

Applications Claiming Priority (2)

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JP2013-084239 2013-04-12
JP2013084239 2013-04-12

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WO2014167840A1 true WO2014167840A1 (ja) 2014-10-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016084678A1 (ja) * 2014-11-26 2016-06-02 東レ株式会社 コレット並びに発光装置の製造装置及び製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303373A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd 発光装置の製造方法と該発光装置を用いた照明器具
JP2008251653A (ja) * 2007-03-29 2008-10-16 Sharp Corp 低負荷搬送装置
JP2008290170A (ja) * 2007-05-23 2008-12-04 Renesas Technology Corp 半導体装置の製造方法
JP2011183478A (ja) * 2010-03-05 2011-09-22 Nitto Denko Corp 吸着装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303373A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd 発光装置の製造方法と該発光装置を用いた照明器具
JP2008251653A (ja) * 2007-03-29 2008-10-16 Sharp Corp 低負荷搬送装置
JP2008290170A (ja) * 2007-05-23 2008-12-04 Renesas Technology Corp 半導体装置の製造方法
JP2011183478A (ja) * 2010-03-05 2011-09-22 Nitto Denko Corp 吸着装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016084678A1 (ja) * 2014-11-26 2016-06-02 東レ株式会社 コレット並びに発光装置の製造装置及び製造方法

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