WO2014163409A1 - Led module for flash and manufacturing method therefor - Google Patents

Led module for flash and manufacturing method therefor Download PDF

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Publication number
WO2014163409A1
WO2014163409A1 PCT/KR2014/002882 KR2014002882W WO2014163409A1 WO 2014163409 A1 WO2014163409 A1 WO 2014163409A1 KR 2014002882 W KR2014002882 W KR 2014002882W WO 2014163409 A1 WO2014163409 A1 WO 2014163409A1
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WO
WIPO (PCT)
Prior art keywords
electrode
flash
lead frame
mold body
led module
Prior art date
Application number
PCT/KR2014/002882
Other languages
French (fr)
Korean (ko)
Inventor
이승수
김대영
이장원
이현열
한상훈
이민종
임원규
홍경의
Original Assignee
크루셜텍(주)
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Publication of WO2014163409A1 publication Critical patent/WO2014163409A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to an LED module and a manufacturing method thereof, and more particularly, to a flash LED module having a new structure that is easy to control optically to a desired state in light quantity and light distribution, and has excellent mechanical assembly and / or design freedom. It is about.
  • LED Lighting Emitting Diode
  • LED Lighting Emitting Diode
  • LED is a semiconductor p-n junction device is a light emitting semiconductor that converts electrical energy into light energy.
  • LED operation when voltage is applied between terminals, current flows and emits light by the combination of electrons and holes in the vicinity of pn junction or active layer, and various colors (wavelengths) are realized according to the change of energy band gap, a characteristic of semiconductor. .
  • LEDs are used for various purposes due to their low power consumption and durability, robustness, and environmentally friendly characteristics.
  • LED is a light source that converts electrical energy into light energy and emits light of high brightness.
  • the LED has advantages such as high energy efficiency, long lifespan, and high-quality light. It is being developed.
  • the LED is used in various fields such as a display device, a street light or an indoor light, or a decoration such as a light source of a mobile communication terminal, a TV, a monitor, a signboard, a billboard, a backlight unit, and the like, and the fields of application are different. It is also rapidly expanding into the field.
  • LED is widely applied as a light source of a camera flash module of a mobile communication terminal, and a flash module having almost the same performance as that of a digital camera is applied to a recently released mobile phone.
  • the flash module is mounted on a surface of a printed circuit board (PCB) so that the light source is radiated to the outside through a condenser lens installed in the mobile communication terminal, and the LED emits light through power supplied from the mobile communication terminal itself. do.
  • PCB printed circuit board
  • the irradiation angle of the light emitted from the LED is generally about 120 °, which is larger than the camera's angle of view (eg, 75 °), the ratio of the light emitted from the LED to the camera's shooting area when only the LED is used without the lens is used. Is very small, resulting in poor light efficiency.
  • a secondary optical system such as a reflector or a lens is installed in front of the LED so that the irradiation angle of the light exiting the front of the flash module can be narrowed to a desired angle so that the desired light distribution of the shooting area can be narrowed.
  • Such a conventional flash module has a structure in which a reflector, which is a secondary optical system, is assembled on an LED package in which an LED chip is packaged, so that the height and size of the flash module have to be increased.
  • the reflector 4 is again installed on the top of the ready-made LED package formed by encapsulating the LED chip mounted on the substrate 1 with the resin 3.
  • the optical design it is an obstacle to realizing the light and small size of the mobile flash module.
  • the conventional flash module shown in FIG. 1 has a structure in which another printed circuit board 5 is used to install the reflector 4 in the LED package provided as a ready-made product, and the LED chip is mounted on the substrate 1.
  • the reflector 4 is surface-mounted on the printed circuit board 5, the assembly tolerance is large, and the component is easily distorted in the horizontal, vertical, and height directions.
  • the conventional flash module illustrated in FIG. 1 is a main board (ie, a printed circuit) of a product such as a mobile communication terminal in which a flash module having a printed circuit board 5 is used to mount a reflector when applied to a product such as a mobile communication terminal. Since it is surface mounted on the substrate, there is a disadvantage in that the printed circuit board is used twice, and thus there is a structural limitation in reducing the thickness and size of the actual product to which the flash module is applied, including the mobile communication terminal.
  • the present invention is to solve the above problems, and to provide a new structure of the LED module for flash and its manufacturing method which is easy to control to a desired state in light quantity and light distribution, and excellent in mechanical assembly and design freedom.
  • the purpose is.
  • the insert in manufacturing a flash LED module, by inserting a resin into the mold body in the state that the lead frame strip is supplied from the take-up roll, the insert can be injected into the mold body, a large number at once
  • the purpose of the present invention is to improve the productivity in manufacturing a flash LED module by allowing a mold frame to be formed.
  • the present invention includes a lead frame comprising a first electrode provided with a chip mounting portion and a second electrode spaced apart therefrom; A mold body formed of a resin material (eg, PPA: Polyphthalamide) installed to surround an upper edge of the lead frame to form a cavity therein; An LED chip attached directly to the chip mounting portion of the first electrode and electrically connected to the second electrode; A translucent encapsulant for encapsulating the LED chip; The LED module for flash is provided, which is installed inside the mold body and includes a reflector for directing light emitted from the LED chip in a desired direction.
  • a resin material eg, PPA: Polyphthalamide
  • a cover glass may be further provided on the reflector. And the cover glass is characterized in that translucent.
  • the upper end of the mold body may be formed to be higher than the upper end of the reflector.
  • the mold body may be configured to fill a space between the first electrode and the second electrode of the lead frame.
  • the inner surface of the mold body may be provided with a support portion protruding inward to allow the reflector to be seated and to limit the insertion depth, and the mold body and the lead frame are formed to form a body by insert injection.
  • the bottom portion of the opened portion between the first electrode and the second electrode spaced apart from the first electrode may have a space extension part for improving the bonding force with the mold body.
  • one side edge of the reflector and the mold body may be provided with a cutting portion for holding the assembly position.
  • one example of the flash LED module manufacturing method of the present invention for achieving the above object comprises the steps of preparing a lead frame consisting of a first electrode on which the LED chip is mounted and a second electrode spaced apart therefrom; Forming a mold body made of a resin material formed around the upper edge of the lead frame to form a cavity therein; Attaching an LED chip to a chip mounting portion of the first electrode; Electrically connecting the LED chip to the second electrode using a conductive connection member; Encapsulating with a transparent resin to protect the LED chip and the conductive connection member; And installing a reflector inside the mold body.
  • a lead frame having a first electrode provided with an LED chip mounting portion and a second electrode spaced apart from the first electrode array
  • the leadframe strips arranged in series are released from the take-up roll and provided to the workspace; Stopping the movement of the lead frame strip when the lead frame strip released from the winding roll reaches a predetermined position; Positioning a mold for forming a mold body on the lead frame strip by lowering and positioning the mold body; Forming a mold frame by injecting resin into the mold to insert insert the lead frame into a mold body; Attaching LED chips to chip mounting portions of respective first electrodes of the lead frame strip; Electrically connecting each LED chip and the second electrode with a conductive connection member; Sealing each LED chip with a conductive resin so as to protect the conductive connection member; It may be configured to include; a step of installing a reflector inside each mold body.
  • the present invention it is easy to control to a desired state in light quantity, light distribution, and the like.
  • the mechanical assembly and design freedom of the LED module is excellent.
  • productivity in manufacture of the LED module for flash can be improved. That is, in the manufacture of the LED module for the flash, the resin can be injected into the mold body by inserting the resin into the mold in the state continuously supplied by the lead frame strip, thereby producing a flash LED module Productivity can be improved.
  • the LED chip is attached to the lead frame substrate made of metal, it is possible to effectively secure the heat dissipation performance of the LED chip.
  • 1 is a configuration diagram showing an example of the structure of an LED module for a conventional flash
  • Figure 2 is a perspective view of the LED module for flash of the present invention
  • FIG. 3 is an exploded perspective view of FIG.
  • FIG. 4A and 4B are plan and bottom views of FIG. 2, respectively.
  • FIG. 5 is a cross-sectional view taken along the line I-I of FIG.
  • (A) is a cross-sectional view showing the lead frame is ready.
  • (B) is a cross-sectional view showing a state in which a mold body is formed
  • (C) is a cross-sectional view showing the state after the chip attach
  • (D) is a cross-sectional view showing after wire bonding
  • FIG. 7 is a schematic diagram showing another embodiment of the LED module for flash of the present invention.
  • Figure 8 is a schematic diagram showing another example of the LED module manufacturing method of the flash of the present invention, the figure in the circle is an enlarged perspective view of the lead frame strip
  • FIG. 9 is a flow chart of the LED module manufacturing method for flash according to FIG.
  • FIGS. 10 (a) and (b) are optical schematic diagrams comparing the light quantity and illuminance characteristics of the existing LED module for flash and the LED module for flash according to the present invention.
  • (B) is a light schematic diagram of the LED module for flash according to the present invention
  • FIG. 2 is a perspective view of a flash LED module of the present invention
  • Figure 3 is an exploded perspective view of Figure 2
  • Figure 4 (a) and (b) is a plan view and a bottom view of FIG.
  • FIG. 5 is a cross-sectional view taken along the line I-I of FIG.
  • the flash LED module according to the present embodiment, the first electrode 110a provided with a chip mounting portion and the second spaced apart therefrom
  • a lead frame 110 having an electrode 110b and a mold body 120 made of a resin material (eg, PPA: Polyphthalamide) installed to surround the upper edge of the lead frame 110 to form a cavity therein;
  • the LED chip 130 is attached to the chip mounting portion of the first electrode 110a to be electrically connected to the second electrode 110b, and a light-transmissive encapsulant to encapsulate the LED chip 130 ( 150, and a reflector 160 installed inside the mold body 120 to direct light emitted from the LED chip 130 in a desired direction.
  • the first electrode 110a may be one of the cathode and the anode
  • the second electrode 110b may be the other pole.
  • the first electrode may be the cathode part (Cathode). Part) and the second electrode may be an anode part.
  • the LED chip 130 is directly attached to the chip mounting portion of the first electrode 110a to be electrically connected to the second electrode 110b.
  • the inner surface of the reflector 160 is formed as an aspherical surface, the aspherical surface in the front and rear direction and the aspherical surface in the left and right direction may be designed as different aspherical surfaces.
  • the inner surface of the mold body 120 is provided with a support part 120a protruding inwardly to allow the reflector 160 to be seated and to limit the insertion depth.
  • the mold body 120 is configured to fill a space between the first electrode 110a and the second electrode 110b of the lead frame 110.
  • the lead frame 110 to be integrated with the mold body 120, the mold body 120 and the lead frame 110 is formed to form a body by insert injection.
  • a space extension part E for improving coupling force with the mold body 120 is provided on the lower side of the opened portion between the first electrode 110a of the lead frame 110 and the second electrode 110b spaced apart from the lead frame 110. ) Is formed.
  • one side edges of the reflector 160 and the mold body 120 are provided with a cutting part C for holding the assembly position, which is attached to the LED chip and the wire bonding, and the surface mounting of the LED module for the flash. In the process of the process to give the direction so that the work can proceed efficiently.
  • a P-type zener diode 180 is attached to the second electrode 110b, and the P-type zener diode 180 is connected to the first electrode 110a by the conductive connecting member 140.
  • the zener diode is an N-type zener diode, it is attached to the first electrode, which is the opposite region, and is connected to the second electrode by a conductive connecting member.
  • a lead frame 110 including a first electrode 110a on which the LED chip 130 is mounted and a second electrode 110b spaced therefrom is prepared.
  • the edge of the lead frame 110 is formed to surround the upper side to form a mold body 120 of a resin material forming a cavity therein.
  • the mold body 120 is made of, for example, polyphthalamide (PPA).
  • the LED chip 130 and the second electrode 110b are electrically connected by using a conductive connection member 140 such as a gold wire.
  • the LED chip 130 and the conductive connection member 140 is sealed with a transparent resin to protect.
  • the reflector 160 is inserted into the mold body 120 to complete the installation.
  • inserting the reflector 160 into the mold body 120 in the state that the hardening of the encapsulant 150 is not completed the bonding force between the encapsulant 150 and the reflector 160 during the hardening process of the encapsulant 150. This is to make it work.
  • the lead frame 110 and the mold body 120 is formed by insert injection, and may be introduced for the packaging process after chip bonding in a pre-integrated state through a separate process. have.
  • FIG. 7 is a block diagram showing another embodiment of the flash LED module of the present invention, the basic structure of the flash LED module of the present embodiment is the same as that of the first embodiment described above.
  • the flash LED module of the present embodiment has a difference in that a cover glass 170 is further provided on the reflector 160.
  • the cover glass 170 may be configured to be transparent or translucent, but in order to prevent the internal structure of the LED module from being visually exposed to the outside to reduce aesthetics, the cover glass 170 may have a translucent white color. It can be configured to.
  • the flash LED module of the present embodiment is formed so that the upper end of the mold body 120 is positioned higher than the upper end of the reflector 160 so that the cover glass 170 is seated on the reflector 160. It is not limited to this. That is, the cover glass 170 may be positioned only on the reflector 160 without being seated on the reflector 160.
  • the manufacturing process of the LED module for the flash of the present embodiment configured as described above is to follow the process of the first embodiment described above, but it further comprises the step of covering the cover glass 170 on the reflector 160. .
  • FIG 8 is a schematic diagram showing another example of the LED module manufacturing method for flash of the present invention, the figure in the circle is an enlarged perspective view showing the shape of the lead frame strip (S), Figure 9 is for the flash according to Figure 8 This is a flowchart of the LED module manufacturing method.
  • the lead frame provided on the lead frame strip (S) is preferably arranged in an array (Array) type for the horizontal and vertical direction on the strip.
  • first electrode 110a and the second electrode 110b are connected to only the bridge B (see FIG. 8) with respect to the strip body on the lead frame strip S, the bridge B is connected. When cut, the leadframe strip S is separated.
  • the winding roll (R) wound around the lead frame strip (S) having the first electrode (110a) and the second electrode (110b) spaced therefrom as a metal material ) Is prepared, the lead frame strip (S) released from the take-up roll (R) is provided to the workspace where the insert injection is made.
  • the mold body M for forming the mold body 120 is lowered and positioned on the lead frame strip S, and the resin is injected into the mold M to form the mold body 120.
  • the lead frame 110 is inserted into the mold body 120 to be injected.
  • the lead frame 110 and the mold body 120 are formed in one body by insert injection.
  • the mold frame 100 is formed by forming the body by insert injection.
  • the mold M is lifted and withdrawn. After forming the mold frame 100 by insert injection as described above, the mold frame 100 should be separated from the lead frame strip S.
  • the mold frame 100 is cut from the lead frame strip S by a group including a plurality of mold frames 100 or by individual unit mold frames 100 and cut from the lead frame strip S. Will be separated.
  • the lead frame strip S released from the take-up roll R is newly provided as a work space for the next insert injection operation.
  • the insert injection operation to be performed by a predetermined group with respect to the lead frame strip (S) released from the take-up roll (R) can be made continuously.
  • the mold frame 100 disposed on the strip in an array type is cut for each group or for each individual mold frame 100, and then a packaging process after chip bonding is performed using the mold frame 100.
  • chip bonding and conductive connection attaching the LED chip 130 directly onto the strip.
  • a singer that separates the unit LED module from the leadframe strip S after performing all the subsequent processes for manufacturing the LED module such as wire bonding connecting the member 140, encapsulation process using a transparent resin, and installing the reflector 160. You can also perform a migration process.
  • Figure 10 (a) and (b) is an optical schematic diagram showing the comparison of the light quantity and illuminance characteristics of the conventional LED module for flash and the flash LED module according to the present invention
  • (A) is a conventional LED module for flash It is an optical schematic diagram
  • (b) is an optical schematic diagram of the LED module for flashes which concerns on this invention.
  • the conventional LED module for flash shown in (a) is lower than the flash LED module of the present invention shown in (b) in the center light amount and corner light amount. can confirm.
  • the flash LED module of the present invention can increase the amount of light in the center and corner compared to the conventional.
  • the flash LED module of the present invention has a size loss and a process loss as described above, whereas the flash LED module of the present invention can simplify the process and slim the size.
  • the present invention is easy to optical control to the desired state in the light quantity and light distribution in the LED module for flash, excellent mechanical assembly and freedom of assembly (or design), can effectively secure heat dissipation performance, mobile When applied to products such as flash modules, it can be used as a high-efficiency LED module to realize high-quality images and high-pixel resolution. It is a high invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

The objective of the present invention is to provide an LED module for a flash having a new structure, which facilitates the control of light quantity, light distribution and the like in a desired state and has excellent mechanical assembly efficiency and freedom of design, and a manufacturing method therefor. To this end, the present invention provides the LED module for the flash, comprising: a lead frame including a first electrode provided with a chip mounting portion, and a second electrode arranged separately from the first electrode; a mold body formed from resin material (example: polyphthalamide (PPA)) and is provided to surround the upper side of the edge of the lead frame such that a cavity is formed therein; an LED chip directly attached to the chip mounting portion of the first electrode so as to be electrically connected to the second electrode; a light-transmitting encapsulating material for encapsulating the LED chip; and a reflector provided at the inner side of the mold body so as to direct the light emitted from the LED chip to a desired direction.

Description

플래시용 ＬＥＤ 모듈 및 그 제조방법LED module for flash and manufacturing method thereof
본 발명은 LED 모듈 및 그 제조방법에 관한 것으로서, 더욱 상세하게는 광량과 광분포 등에 있어서 원하는 상태로의 광학 컨트롤이 용이하며 기구적 조립성 및 혹은 설계 자유도가 우수한 새로운 구조의 플래시용 LED 모듈에 관한 것이다.The present invention relates to an LED module and a manufacturing method thereof, and more particularly, to a flash LED module having a new structure that is easy to control optically to a desired state in light quantity and light distribution, and has excellent mechanical assembly and / or design freedom. It is about.
일반적으로, LED(Lighting Emitting Diode)는 반도체 p-n 접합소자로써 전기에너지를 빛에너지로 바꿔주는 발광반도체이다.In general, LED (Lighting Emitting Diode) is a semiconductor p-n junction device is a light emitting semiconductor that converts electrical energy into light energy.
LED 동작원리를 살펴보면, 단자 간에 전압을 가하면 전류가 흘러 p-n접합 부근 혹은 활성층에서 전자와 홀의 결합에 의해 빛을 방출하여 반도체의 고유특성인 에너지 밴드 갭의 변화에 따라 다양한 색(파장)이 구현된다.Looking at the principle of LED operation, when voltage is applied between terminals, current flows and emits light by the combination of electrons and holes in the vicinity of pn junction or active layer, and various colors (wavelengths) are realized according to the change of energy band gap, a characteristic of semiconductor. .
이러한 LED는 기존의 조명제품에 비하여 전력소모가 적을 뿐만 아니라 내구성과 견고성, 나아가 친환경적 특성으로 인하여 다양한 용도로 이용되고 있다.These LEDs are used for various purposes due to their low power consumption and durability, robustness, and environmentally friendly characteristics.
즉 LED는 전기 에너지를 빛 에너지로 변환하여 고휘도의 광을 출사하는 광원으로서, 에너지 효율이 높고 수명이 길며, 광의 고급화 등과 같은 장점을 가지므로 그 활용분야가 확대되고 있으며, LED 관련 기술이 다양하게 개발되고 있는 실정이다. In other words, LED is a light source that converts electrical energy into light energy and emits light of high brightness. The LED has advantages such as high energy efficiency, long lifespan, and high-quality light. It is being developed.
상기 LED는, 이동통신 단말기, TV, 모니터, 간판, 광고판, 백라이트 유닛의 광원과 같이 디스플레이 장치, 가로등이나 실내 조명 등과 같은 조명용이나 장식용 등 다양한 분야에서 사용되고 있으며, 전술한 바와 같이 그 적용분야가 다른 분야로도 급격히 확대되고 있는 추세이다. The LED is used in various fields such as a display device, a street light or an indoor light, or a decoration such as a light source of a mobile communication terminal, a TV, a monitor, a signboard, a billboard, a backlight unit, and the like, and the fields of application are different. It is also rapidly expanding into the field.
특히, LED는 이동통신 단말기의 카메라 플래시 모듈의 광원으로서 많이 적용되고 있는데, 최근 출시되는 휴대폰에는 디지털 카메라에 장착된 것과 거의 동일한 성능을 발휘하는 플래시 모듈이 적용되고 있다.In particular, LED is widely applied as a light source of a camera flash module of a mobile communication terminal, and a flash module having almost the same performance as that of a digital camera is applied to a recently released mobile phone.
이러한 플래시 모듈은 이동통신 단말기에 설치된 집광렌즈를 통해 광원이 외부로 방사되도록 인쇄회로기판(Printed Circuit Board, PCB) 표면에 LED가 실장되고, 이동통신 단말기 자체로부터 공급되는 전원을 통해 LED가 발광하게 된다.The flash module is mounted on a surface of a printed circuit board (PCB) so that the light source is radiated to the outside through a condenser lens installed in the mobile communication terminal, and the LED emits light through power supplied from the mobile communication terminal itself. do.
플래시 광원으로서 백색 LED가 최근 각광을 받고 있다.White LEDs have recently been spotlighted as flash light sources.
이동통신 단말기 등 카메라 플래시 모듈에서 LED를 효율적으로 활용하기 위해서는 단순히 빛을 조사하는 것이 아니라 카메라 화각에 맞추어 조사할 수 있어야 한다. 즉, 카메라의 특성상 LED의 조명 범위와 카메라에서 요구하는 빛의 범위가 차이가 나게 되므로, 리플렉터나 렌즈를 사용하여 LED에서 나오는 빛의 조사 영역을 변경하게 된다.In order to utilize LED effectively in camera flash module such as mobile communication terminal, it should be able to irradiate according to camera angle of view rather than simply irradiating light. That is, since the illumination range of the LED and the light range required by the camera are different due to the characteristics of the camera, the reflecting area or the lens is used to change the irradiation area of the light emitted from the LED.
즉, LED에서 나오는 빛의 조사각이 통상 약 120°로서 카메라의 화각(예; 75°)보다 크기 때문에 렌즈를 사용하지 않고 LED만을 사용할 경우 LED에서 출사하는 광이 카메라의 촬영 영역에 입사되는 비율은 매우 작아 광 효율이 떨어진다.That is, since the irradiation angle of the light emitted from the LED is generally about 120 °, which is larger than the camera's angle of view (eg, 75 °), the ratio of the light emitted from the LED to the camera's shooting area when only the LED is used without the lens is used. Is very small, resulting in poor light efficiency.
이 때문에, 기존에는 LED 앞쪽에 리플렉터(Reflector)나 렌즈(Lens)와 같은 2차 광학계를 설치하여 플래시 모듈 전방으로 나가는 빛의 조사각이 원하는 각도로 좁아질 수 있도록 함으로써 촬영 영역에 대해 원하는 광 분포도를 달성하고 있다.For this reason, conventionally, a secondary optical system such as a reflector or a lens is installed in front of the LED so that the irradiation angle of the light exiting the front of the flash module can be narrowed to a desired angle so that the desired light distribution of the shooting area can be narrowed. To achieve that.
그러나, 이러한 기존의 플래시 모듈은, LED칩이 패키징된 LED 패키지 상부에 2차 광학계인 리플렉터를 어셈블리하는 구조이므로, 플래시 모듈의 높이 및 사이즈가 커질 수밖에 없었다.However, such a conventional flash module has a structure in which a reflector, which is a secondary optical system, is assembled on an LED package in which an LED chip is packaged, so that the height and size of the flash module have to be increased.
즉, 도 1을 참조하면, 기존의 플래시 모듈은, 기판(1)에 탑재된 LED칩을 수지(3)로 봉지(Encapsulation)하여 만들어진 기성품인 LED 패키지 상측에 다시 리플렉터(4)를 설치하는 형태로 광학 디자인이 이루어지므로 모바일용 플래시 모듈의 경박단소화를 구현하는데에 장애가 되고 있는 실정이다.That is, referring to FIG. 1, in the existing flash module, the reflector 4 is again installed on the top of the ready-made LED package formed by encapsulating the LED chip mounted on the substrate 1 with the resin 3. As a result of the optical design, it is an obstacle to realizing the light and small size of the mobile flash module.
또한, 도 1에 도시된 기존의 플래시 모듈은, 기성품으로서 제공되는 LED패키지에 리플렉터(4)를 설치하기 위하여 또 다른 인쇄회로기판(5)을 이용하는 구조로서, LED칩을 기판(1)에 실장하고 또한 리플렉터(4)를 인쇄회로기판(5)에 표면 실장하는 타입이어서 조립 공차가 크고, 또한 가로 및 세로, 높이 방향에 있어서 부품 간에 틀어짐이 발생하기 쉬웠다.In addition, the conventional flash module shown in FIG. 1 has a structure in which another printed circuit board 5 is used to install the reflector 4 in the LED package provided as a ready-made product, and the LED chip is mounted on the substrate 1. In addition, since the reflector 4 is surface-mounted on the printed circuit board 5, the assembly tolerance is large, and the component is easily distorted in the horizontal, vertical, and height directions.
그리고, 도 1에 도시된 기존의 플래시 모듈은 이동통신 단말기 등 제품에 적용시 리플렉터 탑재를 위해 인쇄회로기판(5)이 사용된 플래시 모듈을 다시 이동통신 단말기 등 제품의 메인보드(즉, 인쇄회로기판)에 표면 실장하게 되므로, 인쇄회로기판이 이중으로 사용되는 단점이 있으며, 이로 인해 이동통신 단말기를 비롯하여 플래시 모듈이 적용되는 실제 제품의 두께 및 사이즈를 줄이는데 구조적으로 한계가 있었다.In addition, the conventional flash module illustrated in FIG. 1 is a main board (ie, a printed circuit) of a product such as a mobile communication terminal in which a flash module having a printed circuit board 5 is used to mount a reflector when applied to a product such as a mobile communication terminal. Since it is surface mounted on the substrate, there is a disadvantage in that the printed circuit board is used twice, and thus there is a structural limitation in reducing the thickness and size of the actual product to which the flash module is applied, including the mobile communication terminal.
본 발명은 상기한 제반 문제점을 해결하기 위한 것으로서, 광량과 광분포 등에 있어서 원하는 상태로의 컨트롤이 용이하며 기구적 조립성 및 설계 자유도가 우수한 새로운 구조의 플래시용 LED 모듈 및 그 제조방법을 제공하는데 그 목적이 있다.The present invention is to solve the above problems, and to provide a new structure of the LED module for flash and its manufacturing method which is easy to control to a desired state in light quantity and light distribution, and excellent in mechanical assembly and design freedom. The purpose is.
또한, 본 발명의 다른 목적에 따르면, 플래시용 LED 모듈을 제조함에 있어서, 권취롤로부터 리드프레임 스트립이 공급된 상태에서 금형 내부에 수지를 주입하여 몰드바디에 인서트 사출될 수 있도록 함으로써, 한꺼번에 많은 수의 몰드프레임이 형성될 수 있도록 하여 플래시용 LED 모듈 제조에 있어서의 생산성을 향상시킬 수 있도록 하는데 그 목적이 있다.In addition, according to another object of the present invention, in manufacturing a flash LED module, by inserting a resin into the mold body in the state that the lead frame strip is supplied from the take-up roll, the insert can be injected into the mold body, a large number at once The purpose of the present invention is to improve the productivity in manufacturing a flash LED module by allowing a mold frame to be formed.
상기한 목적을 달성하기 위해 본 발명은, 칩 탑재부가 구비된 제1전극와 이로부터 이격 배치되는 제2전극으로 이루어지는 리드프레임과; 상기 리드프레임의 가장자리 상측을 둘러싸도록 설치되어 내측에 캐비티를 형성하는 수지재질(예: PPA : Polyphthalamide)의 몰드바디와; 상기 제1전극의 칩 탑재부에 직접 어태치(attach)되어 제2전극에 전기적으로 연결되는 LED칩과; 상기 LED칩을 봉지하는 투광성의 봉지재와; 상기 몰드바디 내측에 설치되어 상기 LED칩으로부터 나오는 빛을 원하는 방향으로 지향시키는 리플렉터를 포함하여 구성되는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈이 제공된다.In order to achieve the above object, the present invention includes a lead frame comprising a first electrode provided with a chip mounting portion and a second electrode spaced apart therefrom; A mold body formed of a resin material (eg, PPA: Polyphthalamide) installed to surround an upper edge of the lead frame to form a cavity therein; An LED chip attached directly to the chip mounting portion of the first electrode and electrically connected to the second electrode; A translucent encapsulant for encapsulating the LED chip; The LED module for flash is provided, which is installed inside the mold body and includes a reflector for directing light emitted from the LED chip in a desired direction.
전술한 구성에 있어서, 상기 리플렉터 상부에 커버글래스가 더 구비될 수 있다. 그리고 상기 커버글래스는 반투명한 것을 특징으로 한다.In the above-described configuration, a cover glass may be further provided on the reflector. And the cover glass is characterized in that translucent.
그리고, 상기 몰드바디의 상단부는 상기 리플렉터의 상단부에 비해 높게 위치하도록 형성될 수도 있다. 또한 상기 몰드바디는 상기 리드프레임의 제1전극과 제2전극 사이의 이격 공간을 채우도록 구성될 수도 있다.The upper end of the mold body may be formed to be higher than the upper end of the reflector. In addition, the mold body may be configured to fill a space between the first electrode and the second electrode of the lead frame.
상기 몰드바디의 내측면에는 상기 리플렉터가 안착되도록 함과 아울러 삽입 깊이를 한정하도록 내측으로 돌출된 지지부가 구비될 수 있고, 상기 몰드바디와 리드프레임은 인서트 사출에 의해 한 몸을 이루도록 형성된다. The inner surface of the mold body may be provided with a support portion protruding inward to allow the reflector to be seated and to limit the insertion depth, and the mold body and the lead frame are formed to form a body by insert injection.
상기 제1전극과 상기 제1전극으로부터 이격 배치되는 상기 제2전극 사이의 오프닝된 부분의 바탐(bottom)에는 상기 몰드바디와의 결합력 향상을 위한 공간 확장부가 형성될 수 있다. The bottom portion of the opened portion between the first electrode and the second electrode spaced apart from the first electrode may have a space extension part for improving the bonding force with the mold body.
그리고 상기 리플렉터 및 몰드바디 일측 모서리는 조립 위치를 잡아주기 위한 컷팅부가 구비될 수도 있다.And one side edge of the reflector and the mold body may be provided with a cutting portion for holding the assembly position.
한편, 상기한 목적을 달성하기 위한 본 발명의 플래시용 ＬＥＤ 모듈 제조 방법의 일 예는, LED칩이 탑재되는 제1전극과 이로부터 이격 배치되는 제2전극로 이루어지는 리드프레임을 준비하는 단계와; 상기 리드프레임의 가장자리를 상측을 둘러싸도록 설치되어 내측에 캐비티를 형성하는 수지재질의 몰드바디를 형성하는 단계와; 상기 제1전극의 칩 탑재부에 LED칩을 어태치하는 단계와; 상기 LED칩과 제2전극을 전도성 연결부재를 이용하여 전기적으로 연결하는 단계와; 상기 LED칩과 전도성 연결부재가 보호되도록 투명 수지로 봉지하는 단계와; 상기 몰드바디 내측에 리플렉터를 설치하는 단계;를 포함하여 구성되는 것을 특징으로 한다.On the other hand, one example of the flash LED module manufacturing method of the present invention for achieving the above object comprises the steps of preparing a lead frame consisting of a first electrode on which the LED chip is mounted and a second electrode spaced apart therefrom; Forming a mold body made of a resin material formed around the upper edge of the lead frame to form a cavity therein; Attaching an LED chip to a chip mounting portion of the first electrode; Electrically connecting the LED chip to the second electrode using a conductive connection member; Encapsulating with a transparent resin to protect the LED chip and the conductive connection member; And installing a reflector inside the mold body.
한편, 상기한 목적을 달성하기 위한 본 발명의 플래시용 LED 모듈의 또 다른 제조 방법은, LED칩 탑재부가 구비된 제1전극과 상기 제1전극으로부터 이격 배치되는 제2전극을 갖는 리드프레임이 어레이 타입으로 연속 배치된 리드프레임 스트립이 권취롤로부터 풀려나 작업공간으로 제공되는 단계와; 상기 권취롤로부터 풀려난 리드프레임 스트립이 정해진 위치에 도달시, 리드프레임 스트립의 이동이 멈추는 단계와; 상기 리드프레임 스트립 위로 몰드바디 형성용 금형이 하강하여 정위치하는 단계와; 상기 금형 내부로 수지를 주입하여 상기 리드프레임이 몰드바디에 인서트 사출되도록 함으로써 몰드프레임을 형성하는 단계와; 상기 리드프레임 스트립에 구비된 각 제1전극의 칩 탑재부에 LED칩을 각각 어태치하는 단계와; 각 LED칩과 제2전극을 전도성 연결부재를 이용하여 전기적으로 연결하는 단계와; 각 LED칩과 전도성 연결부재가 보호되도록 투명 수지로 봉지하는 단계와; 각 몰드바디 내측에 리플렉터를 설치하는 단계;를 포함하여 구성될 수 있다.On the other hand, in another method of manufacturing the LED module for flash of the present invention for achieving the above object, a lead frame having a first electrode provided with an LED chip mounting portion and a second electrode spaced apart from the first electrode array The leadframe strips arranged in series are released from the take-up roll and provided to the workspace; Stopping the movement of the lead frame strip when the lead frame strip released from the winding roll reaches a predetermined position; Positioning a mold for forming a mold body on the lead frame strip by lowering and positioning the mold body; Forming a mold frame by injecting resin into the mold to insert insert the lead frame into a mold body; Attaching LED chips to chip mounting portions of respective first electrodes of the lead frame strip; Electrically connecting each LED chip and the second electrode with a conductive connection member; Sealing each LED chip with a conductive resin so as to protect the conductive connection member; It may be configured to include; a step of installing a reflector inside each mold body.
본 발명의 플래시용 ＬＥＤ 모듈 및 그 제조방법에 따른 효과는 다음과 같다.Effects of the LED module for flash of the present invention and its manufacturing method are as follows.
먼저, 본 발명에 따르면, 광량과 광분포 등에 있어서 원하는 상태로의 컨트롤이 용이하다.First, according to the present invention, it is easy to control to a desired state in light quantity, light distribution, and the like.
그리고, 본 발명에 따르면, LED 모듈의 기구적 조립성 및 설계 자유도가 우수하다.In addition, according to the present invention, the mechanical assembly and design freedom of the LED module is excellent.
또한, 본 발명에 따르면, 플래시용 LED 모듈 제조에 있어서의 생산성을 향상시킬 수 있다. 즉, 본 발명은 플래시용 LED 모듈을 제조함에 있어서, 리드프레임 스트립에 의해 연속적으로 공급된 상태에서 금형 내부에 수지를 주입하여 몰드바디에 인서트 사출될 수 있도록 함으로써, 플래시용 LED 모듈 제조에 있어서의 생산성을 향상시킬 수 있게 된다.Moreover, according to this invention, productivity in manufacture of the LED module for flash can be improved. That is, in the manufacture of the LED module for the flash, the resin can be injected into the mold body by inserting the resin into the mold in the state continuously supplied by the lead frame strip, thereby producing a flash LED module Productivity can be improved.
한편, 본 발명에 따르면, LED 칩이 금속 재질인 리드프레임 기판에 어태치되므로 LED 칩의 열 방출 성능을 효과적으로 확보할 수 있게 된다.Meanwhile, according to the present invention, since the LED chip is attached to the lead frame substrate made of metal, it is possible to effectively secure the heat dissipation performance of the LED chip.
도 1은 기존 플래시용 LED 모듈의 구조 예를 보여주는 구성도1 is a configuration diagram showing an example of the structure of an LED module for a conventional flash
도 2는 본 발명의 플래시용 LED 모듈의 사시도Figure 2 is a perspective view of the LED module for flash of the present invention
도 3은 도 2의 분해 사시도3 is an exploded perspective view of FIG.
도 4의 (가) 및 (나)는 도 2의 평면도 및 저면도4A and 4B are plan and bottom views of FIG. 2, respectively.
도 5는 도 4의 (가)의 Ⅰ-Ⅰ선을 따른 구성 단면도5 is a cross-sectional view taken along the line I-I of FIG.
도 6의 (가) 내지 (바)는 본 발명의 플래시용 LED 모듈의 제조 과정을 순차적으로 보여주는 단면도로서,6 (a) to (bar) are cross-sectional views sequentially showing a manufacturing process of the LED module for flash of the present invention,
(가)는 리드프레임이 준비된 상태를 보여주는 단면도(A) is a cross-sectional view showing the lead frame is ready.
(나)는 몰드바디가 형성된 상태를 보여주는 단면도(B) is a cross-sectional view showing a state in which a mold body is formed
(다)는 칩 어태치 후의 상태를 보여주는 단면도(C) is a cross-sectional view showing the state after the chip attach
(라)는 와이어 본딩 후를 보여주는 단면도(D) is a cross-sectional view showing after wire bonding
(마)는 투명재질의 수지로 봉지한 후의 상태를 보여주는 단면도(E) is sectional drawing which shows the state after sealing with resin of transparent material
(바)는 리플렉터 설치 후 상태를 보여주는 단면도 (Bar) is sectional drawing which shows the state after installing the reflector
도 7은 본 발명의 플래시용 LED 모듈의 다른 실시예를 보여주는 개략도Figure 7 is a schematic diagram showing another embodiment of the LED module for flash of the present invention
도 8은 본 발명의 플래시용 LED 모듈 제조 방식의 다른 예를 보여주는 개략도로서, 원(圓)안의 그림은 리드프레임 스트립의 확대 사시도Figure 8 is a schematic diagram showing another example of the LED module manufacturing method of the flash of the present invention, the figure in the circle is an enlarged perspective view of the lead frame strip
도 9는 도 8에 따른 플래시용 LED 모듈 제조 방식의 흐름도9 is a flow chart of the LED module manufacturing method for flash according to FIG.
도 10의 (가) 및 (나)는 기존 플래시용 LED 모듈과 본 발명에 따른 플래시용 LED 모듈의 광량 및 조도 특성을 비교하여 나타낸 광 모식도로서, 10 (a) and (b) are optical schematic diagrams comparing the light quantity and illuminance characteristics of the existing LED module for flash and the LED module for flash according to the present invention.
(가)는 기존 플래시용 LED 모듈의 광 모식도(A) Optical schematic diagram of LED module for conventional flash
(나)는 본 발명에 따른 플래시용 LED 모듈의 광 모식도 (B) is a light schematic diagram of the LED module for flash according to the present invention
이하, 본 발명을 실시하기 위한 구체적인 내용에 대해 도 2 내지 도 10을 참조하여 상세히 살명하면 다음과 같다.Hereinafter, specific details for carrying out the present invention will be described in detail with reference to FIGS. 2 to 10.
[실시예1]Example 1
도 2는 본 발명의 플래시용 LED 모듈의 사시도이고, 도 3은 도 2의 분해 사시도이며, 도 4의 (가) 및 (나)는 도 2의 평면도 및 저면도이다.2 is a perspective view of a flash LED module of the present invention, Figure 3 is an exploded perspective view of Figure 2, Figure 4 (a) and (b) is a plan view and a bottom view of FIG.
그리고, 도 5는 도 4의 (가)의 Ⅰ-Ⅰ선을 따른 구성 단면도이다.5 is a cross-sectional view taken along the line I-I of FIG.
이들 도면을 참조하여 본 실시 예에 따른 플래시용 LED 모듈의 구성을 먼저 살펴보면, 본 실시 예에 따른 플래시용 LED 모듈은, 칩 탑재부가 구비된 제1전극(110a)과 이로부터 이격 배치되는 제2전극(110b)을 갖는 리드프레임(110)과, 상기 리드프레임(110)의 가장자리 상측을 둘러싸도록 설치되어 내측에 캐비티를 형성하는 수지재질(예: PPA : Polyphthalamide)로 된 몰드바디(120)와, 상기 제1전극(110a)의 칩 탑재부에 어태치(attach)되어 제2전극(110b)과 전기적으로 연결되는 LED칩(130)과, 상기 LED칩(130)을 봉지하는 투광성의 봉지재(150)와, 상기 몰드바디(120) 내측에 설치되어 상기 LED칩(130)으로부터 나오는 빛을 원하는 방향으로 지향시키는 리플렉터(160)를 포함하여 구성된다.Referring to the configuration of the flash LED module according to the present embodiment with reference to these drawings, the flash LED module according to the present embodiment, the first electrode 110a provided with a chip mounting portion and the second spaced apart therefrom A lead frame 110 having an electrode 110b and a mold body 120 made of a resin material (eg, PPA: Polyphthalamide) installed to surround the upper edge of the lead frame 110 to form a cavity therein; The LED chip 130 is attached to the chip mounting portion of the first electrode 110a to be electrically connected to the second electrode 110b, and a light-transmissive encapsulant to encapsulate the LED chip 130 ( 150, and a reflector 160 installed inside the mold body 120 to direct light emitted from the LED chip 130 in a desired direction.
본 실시예에서 상기 제1전극(110a)은 캐소드와 애노드 중 어느 하나의 극이며, 제2전극(110b)은 다른 하나의 극이 될 수 있는데, 예를 들어 상기 제1전극은 캐소드 파트(Cathode Part)가 되고 제2전극은 애노드 파트(Anode Part)가 될 수 있다. 그리고 상기 LED칩(130)은 상기 제1전극(110a)의 칩 탑재부에 직접 어태치(attach)되어 제2전극(110b)과 전기적으로 연결된다.In the present embodiment, the first electrode 110a may be one of the cathode and the anode, and the second electrode 110b may be the other pole. For example, the first electrode may be the cathode part (Cathode). Part) and the second electrode may be an anode part. The LED chip 130 is directly attached to the chip mounting portion of the first electrode 110a to be electrically connected to the second electrode 110b.
상기 리플렉터(160)의 내측면은 비구면으로 형성되며, 전후 방향의 비구면과 좌우 방향의 비구면은 서로 다른 비구면으로 설계될 수 있다.The inner surface of the reflector 160 is formed as an aspherical surface, the aspherical surface in the front and rear direction and the aspherical surface in the left and right direction may be designed as different aspherical surfaces.
그리고, 상기 몰드바디(120) 내측면에는 상기 리플렉터(160)가 안착되도록 함과 아울러 삽입 깊이를 한정하도록 내측으로 돌출된 지지부(120a)가 구비된다.In addition, the inner surface of the mold body 120 is provided with a support part 120a protruding inwardly to allow the reflector 160 to be seated and to limit the insertion depth.
또한, 상기 몰드바디(120)는 상기 리드프레임(110)의 제1전극(110a)과 제2전극(110b) 사이의 이격 공간을 채우도록 구성된다.In addition, the mold body 120 is configured to fill a space between the first electrode 110a and the second electrode 110b of the lead frame 110.
이는, 상기 리드프레임(110)이 몰드바디(120)와 일체를 이루도록 하기 위한 것으로서, 상기 몰드바디(120)와 리드프레임(110)은 인서트 사출에 의해 한 몸을 이루도록 형성된다.This is for the lead frame 110 to be integrated with the mold body 120, the mold body 120 and the lead frame 110 is formed to form a body by insert injection.
한편, 상기 리드프레임(110)의 제1전극(110a)과 이로부터 이격 배치되는 제2전극(110b) 사이의 오프닝된 부분 하부측에는 상기 몰드바디(120)와의 결합력 향상을 위한 공간 확장부(E)가 형성된다.Meanwhile, a space extension part E for improving coupling force with the mold body 120 is provided on the lower side of the opened portion between the first electrode 110a of the lead frame 110 and the second electrode 110b spaced apart from the lead frame 110. ) Is formed.
이는 인서트 사출에 의해 몰드바디(120)와 리드프레임(110)이 한 몸을 이룰 때, 상기 공간 확장부(E)에 몰드바디(120)를 이루는 수지가 채워짐으로써 두 부재 사이의 결합력을 향상시키기 위함이다.This is because when the mold body 120 and the lead frame 110 form a body by insert injection, the resin forming the mold body 120 is filled in the space expansion part E to improve the bonding force between the two members. For sake.
그리고, 상기 리플렉터(160) 및 몰드바디(120)의 일측 모서리에는 조립 위치를 잡아주기 위한 컷팅부(C)가 구비되는데, 이는 LED 칩의 어태치 및 와이어 본딩, 그리고 플래시용 LED 모듈의 표면실장 등 공정 진행에 있어서 작업이 효율적으로 진행될 수 있도록 방향성을 부여해주게 된다.In addition, one side edges of the reflector 160 and the mold body 120 are provided with a cutting part C for holding the assembly position, which is attached to the LED chip and the wire bonding, and the surface mounting of the LED module for the flash. In the process of the process to give the direction so that the work can proceed efficiently.
한편, 상기 제2전극(110b)에는 P형 제너다이오드(180)가 부착되고, 상기 P형 제너다이오드(180)는 전도성 연결부재(140)에 의해 제1전극(110a)에 연결된다. 본 실시 예와는 달리, 만약 제너다이오드가 N형 제너다이오드인 경우에는 반대 영역인 제1전극에 부착되고, 전도성 연결부재에 의해 제2전극에 연결된다.Meanwhile, a P-type zener diode 180 is attached to the second electrode 110b, and the P-type zener diode 180 is connected to the first electrode 110a by the conductive connecting member 140. Unlike the present embodiment, if the zener diode is an N-type zener diode, it is attached to the first electrode, which is the opposite region, and is connected to the second electrode by a conductive connecting member.
이와 같이 구성된 본 발명의 플래시용 ＬＥＤ 모듈의 제조 과정을 살펴본다.It looks at the manufacturing process of the LED module for flash of the present invention configured as described above.
먼저, LED칩(130)이 탑재되는 제1전극(110a)와 이로부터 이격 배치되는 제2전극(110b)로 이루어지는 리드프레임(110)을 준비한다.First, a lead frame 110 including a first electrode 110a on which the LED chip 130 is mounted and a second electrode 110b spaced therefrom is prepared.
이어, 상기 리드프레임(110)의 가장자리를 상측을 둘러싸도록 설치되어 내측에 캐비티를 형성하는 수지재질의 몰드바디(120)를 형성한다. 이때, 몰드바디(120)는 예컨대 PPA(Polyphthalamide)로 이루어진다.Subsequently, the edge of the lead frame 110 is formed to surround the upper side to form a mold body 120 of a resin material forming a cavity therein. At this time, the mold body 120 is made of, for example, polyphthalamide (PPA).
그리고 상기 몰드바디(120)가 형성된 후에는, 상기 제1전극(110a)의 칩 탑재부에 LED칩(130)을 어태치하는 칩 본딩을 진행한다. 이때, LED칩(130)의 어태치 전에 상기 칩 탑재부에는 전도성 접착제인 Ag 페이스트가 도포된다.After the mold body 120 is formed, chip bonding for attaching the LED chip 130 to the chip mounting portion of the first electrode 110a is performed. At this time, Ag paste, which is a conductive adhesive, is applied to the chip mounting portion before attaching the LED chip 130.
이어 상기 LED칩(130)과 제2전극(110b)를 골드 와이어(Gold Wire) 등과 같은 전도성 연결부재(140)를 이용하여 전기적으로 연결한다.Subsequently, the LED chip 130 and the second electrode 110b are electrically connected by using a conductive connection member 140 such as a gold wire.
그리고, 상기 LED칩(130)과 전도성 연결부재(140)가 보호되도록 투명 수지로 봉지하게 된다. Then, the LED chip 130 and the conductive connection member 140 is sealed with a transparent resin to protect.
그리고, 봉지재(150)의 경화가 완료되지 않은 상태에서, 상기 몰드바디(120) 내측에 리플렉터(160)를 삽입하여 설치를 완료하게 된다. 여기서, 봉지재(150)의 경화가 완료되지 않은 상태에서, 상기 몰드바디(120) 내측으로 리플렉터(160)를 삽입하는 것은 봉지재의 경화과정에서 봉지재(150)와 리플렉터(160) 사이에도 접합력이 작용하도록 하기 위함이다.In addition, in the state where the hardening of the encapsulant 150 is not completed, the reflector 160 is inserted into the mold body 120 to complete the installation. Here, inserting the reflector 160 into the mold body 120 in the state that the hardening of the encapsulant 150 is not completed, the bonding force between the encapsulant 150 and the reflector 160 during the hardening process of the encapsulant 150. This is to make it work.
상기와 같은 제조 과정 중, 리드프레임(110)과 몰드바디(120)는 인서트 사출을 통해 한 몸을 이루게 되며, 별도의 공정을 통해 미리 일체화된 상태에서 칩 본딩 이후의 패키징 공정을 위해 투입될 수도 있다.During the manufacturing process as described above, the lead frame 110 and the mold body 120 is formed by insert injection, and may be introduced for the packaging process after chip bonding in a pre-integrated state through a separate process. have.
[실시예2]Example 2
도 7은 본 발명의 플래시용 LED 모듈의 다른 실시예를 보여주는 구성도로서, 본 실시예의 플래시용 LED 모듈의 기본적인 구조는 전술한 실시예1의 것과 동일하다.Figure 7 is a block diagram showing another embodiment of the flash LED module of the present invention, the basic structure of the flash LED module of the present embodiment is the same as that of the first embodiment described above.
다만, 본 실시 예의 플래시용 LED 모듈은, 리플렉터(160) 상부에 커버글래스(170)가 더 구비되는 점에 차이가 있다. 상기 커버글래스(170)는 투명 또는 반투명하게 구성될 수 있으나, 상기 LED 모듈의 내부 구조가 외부에 시각적으로 노출되어서 심미감이 저하되는 것을 방지하기 위해서는 반투명, 예를 들어 반투명한 백색의 색감을 나타내도록 구성될 수 있다.However, the flash LED module of the present embodiment has a difference in that a cover glass 170 is further provided on the reflector 160. The cover glass 170 may be configured to be transparent or translucent, but in order to prevent the internal structure of the LED module from being visually exposed to the outside to reduce aesthetics, the cover glass 170 may have a translucent white color. It can be configured to.
그리고, 이를 위해 본 실시 예의 플래시용 LED 모듈은, 커버글래스(170)가 리플렉터(160) 상면에 안착되도록 상기 몰드바디(120)의 상단부가 리플렉터(160) 상단부에 비해 높게 위치하도록 형성되나, 반드시 이에 한정되는 것은 아니다. 즉, 상기 커버글래스(170)는 상기 리플렉터(160) 상면에 안착될 필요없이 상기 리플렉터(160) 상부에만 위치하면 된다.And, for this purpose, the flash LED module of the present embodiment is formed so that the upper end of the mold body 120 is positioned higher than the upper end of the reflector 160 so that the cover glass 170 is seated on the reflector 160. It is not limited to this. That is, the cover glass 170 may be positioned only on the reflector 160 without being seated on the reflector 160.
한편, 상기와 같이 구성되는 본 실시 예의 플래시용 LED 모듈의 제조 공정은 전술한 실시예1의 공정을 따르게 되며, 다만 상기 리플렉터(160) 상부에 커버글래스(170)를 씌우는 단계를 더 포함하게 된다.On the other hand, the manufacturing process of the LED module for the flash of the present embodiment configured as described above is to follow the process of the first embodiment described above, but it further comprises the step of covering the cover glass 170 on the reflector 160. .
[실시예3]Example 3
도 8은 본 발명의 플래시용 LED 모듈 제조 방식의 다른 예를 보여주는 개략도로서, 원(圓)안의 그림은 리드프레임 스트립(S)의 형태를 보여주는 확대 사시도이고, 도 9는 도 8에 따른 플래시용 LED 모듈 제조 방식의 흐름도이다.Figure 8 is a schematic diagram showing another example of the LED module manufacturing method for flash of the present invention, the figure in the circle is an enlarged perspective view showing the shape of the lead frame strip (S), Figure 9 is for the flash according to Figure 8 This is a flowchart of the LED module manufacturing method.
이들 도면을 참조하면, 본 실시 예는 플래시용 LED 모듈 제조에 있어서, 리드프레임의 인서트 사출을 개별적으로 하지 않고 그룹단위로 한꺼번에 수행하는 방식을 제시한다. Referring to these drawings, in the present embodiment, in the manufacture of a flash LED module, a method of performing insert ejection of lead frames individually without grouping is performed at once.
이를 위해, 상기 리드프레임 스트립(S) 상에 구비되는 리드프레임은 스트립 상에서 가로 및 세로 방향에 대해 어레이(Array) 타입으로 배치됨이 바람직하다.To this end, the lead frame provided on the lead frame strip (S) is preferably arranged in an array (Array) type for the horizontal and vertical direction on the strip.
그리고, 상기 리드프레임 스트립(S) 상에는 제1전극(110a)과 제2전극(110b)이 각각 스트립 본체에 대해 브릿지(B ; 도 8 참조)에만 의존해서 연결되는 구성이므로, 브릿지(B)가 절단되면 상기 리드프레임 스트립(S)으로부터 분리(seperation)되도록 되어 있다. In addition, since the first electrode 110a and the second electrode 110b are connected to only the bridge B (see FIG. 8) with respect to the strip body on the lead frame strip S, the bridge B is connected. When cut, the leadframe strip S is separated.
따라서, 본 실시 예의 플래시용 LED 모듈 제조에 따르면, 먼저 금속재질로서 제1전극(110a)과 이로부터 이격 배치되는 제2전극(110b)을 갖는 리드프레임 스트립(S)이 감겨진 권취롤(R)이 준비된 상태에서, 상기 권취롤(R)로부터 풀려진 리드프레임 스트립(S)이 인서트 사출이 이루어지는 작업공간으로 제공된다.Therefore, according to the manufacture of the LED module for the flash of the present embodiment, first, the winding roll (R) wound around the lead frame strip (S) having the first electrode (110a) and the second electrode (110b) spaced therefrom as a metal material ) Is prepared, the lead frame strip (S) released from the take-up roll (R) is provided to the workspace where the insert injection is made.
그리고, 상기 권취롤(R)로부터 풀려나 작업공간으로 제공되는 리드프레임 스트립(S)이 작업공간의 정해진 위치에 도달시, 리드프레임 스트립(S)의 이동이 멈추게 된다.Then, when the lead frame strip S released from the take-up roll R reaches the predetermined position of the work space, the movement of the lead frame strip S is stopped.
이 후, 상기 리드프레임 스트립(S) 위로 몰드바디(120) 형성용 금형(M)이 하강하여 정위치하게 되고, 상기 금형(M) 내부로 수지를 주입하여 몰드바디(120)를 형성함으로써, 상기 리드프레임(110)이 몰드바디(120)에 인서트 사출되도록 한다.Thereafter, the mold body M for forming the mold body 120 is lowered and positioned on the lead frame strip S, and the resin is injected into the mold M to form the mold body 120. The lead frame 110 is inserted into the mold body 120 to be injected.
이와 같이 인서트 사출에 의해 리드프레임(110)과 몰드바디(120)는 한 몸을 이루게 되는데, 본 발명에서는 이렇게 인서트 사출에 의해 한 몸을 이룬 것을 몰드프레임(100)이라 칭한다.As such, the lead frame 110 and the mold body 120 are formed in one body by insert injection. In the present invention, the mold frame 100 is formed by forming the body by insert injection.
이후, 금형(M)은 상승하여 물러가게 되는데, 상기와 같이 인서트 사출되도록 하여 몰드프레임(100)을 형성한 다음에는, 상기 리드프레임 스트립(S) 상에서 몰드프레임(100)을 분리시켜야 한다.Thereafter, the mold M is lifted and withdrawn. After forming the mold frame 100 by insert injection as described above, the mold frame 100 should be separated from the lead frame strip S.
이때, 상기 몰드프레임(100)은 상기 리드프레임 스트립(S)으로부터 복수개의 몰드프레임(100)을 포함하는 그룹별로 절단하거나 혹은 개별 단위 몰드프레임(100)별로 절단하여 상기 리드프레임 스트립(S)으로부터 분리하게 된다.In this case, the mold frame 100 is cut from the lead frame strip S by a group including a plurality of mold frames 100 or by individual unit mold frames 100 and cut from the lead frame strip S. Will be separated.
그리고, 이와 같이 하나의 인서트 사출 작업이 끝나고 나면, 다음 인서트 사출 작업을 위하여 권취롤(R)에서 풀려난 리드프레임 스트립(S)에 새로이 작업공간으로 제공되어진다.Then, after one insert injection operation is finished, the lead frame strip S released from the take-up roll R is newly provided as a work space for the next insert injection operation.
이에 따라, 상기 권취롤(R)에서 풀려난 리드프레임 스트립(S)에 대해 소정의 그룹별로 이루어지게 되는 인서트 사출 작업은 연속적으로 이루어질 수 있게 된다.Accordingly, the insert injection operation to be performed by a predetermined group with respect to the lead frame strip (S) released from the take-up roll (R) can be made continuously.
한편, 상기에서는 어레이(Array) 타입으로 스트립 상에 배치되는 몰드프레임(100)을 그룹별로 절단하거나 개별 단위 몰드프레임(100)별로 절단한 다음에, 이를 이용하여 별도로 칩 본딩 이후의 패키징 공정이 진행되는 방식을 전제로 설명하였으나, 본 발명은 이에 한정되지 않음은 물론이다.Meanwhile, in the above, the mold frame 100 disposed on the strip in an array type is cut for each group or for each individual mold frame 100, and then a packaging process after chip bonding is performed using the mold frame 100. Although the description has been made on the assumption that the present invention is not limited thereto.
즉, 상기 권취롤(R)로부터 풀려나 작업공간으로 제공된 리드프레임 스트립(S)에 대해 몰드프레임(100) 형성공정이 이루어진 후에, 스트립 상에서 바로 LED칩(130)을 어태치하는 칩 본딩, 전도성 연결부재(140)를 연결하는 와이어 본딩, 투명수지를 이용한 봉지공정, 리플렉터(160) 설치 등의 LED 모듈 제조를 위한 후속공정을 모두 수행한 후에 리드프레임 스트립(S)으로부터 단위 LED 모듈을 분리시키는 싱귤레이션 공정을 수행할 수도 있다.That is, after the mold frame 100 is formed on the lead frame strip S released from the take-up roll R and provided to the work space, chip bonding and conductive connection attaching the LED chip 130 directly onto the strip. A singer that separates the unit LED module from the leadframe strip S after performing all the subsequent processes for manufacturing the LED module such as wire bonding connecting the member 140, encapsulation process using a transparent resin, and installing the reflector 160. You can also perform a migration process.
한편, 도 10의 (가) 및 (나)는 기존 플래시용 LED 모듈과 본 발명에 따른 플래시용 LED 모듈의 광량 및 조도 특성을 비교하여 나타낸 광 모식도로서, (가)는 기존 플래시용 LED 모듈의 광 모식도이고, (나)는 본 발명에 따른 플래시용 LED 모듈의 광 모식도이다.On the other hand, Figure 10 (a) and (b) is an optical schematic diagram showing the comparison of the light quantity and illuminance characteristics of the conventional LED module for flash and the flash LED module according to the present invention, (A) is a conventional LED module for flash It is an optical schematic diagram, (b) is an optical schematic diagram of the LED module for flashes which concerns on this invention.
도 10의 (가) 및 (나)를 참조하면, (가)에 도시된 기존의 플래쉬용 LED 모듈은 중심 광량 및 코너의 광량이 (나)에 도시된 본 발명의 플래시용 LED 모듈에 비해 떨어짐을 확인할 수 있다.Referring to (a) and (b) of FIG. 10, the conventional LED module for flash shown in (a) is lower than the flash LED module of the present invention shown in (b) in the center light amount and corner light amount. can confirm.
즉, 본 발명의 플래시용 LED 모듈은 기존에 비해 중심 및 코너의 광량이 올라감을 할 수 있다.That is, the flash LED module of the present invention can increase the amount of light in the center and corner compared to the conventional.
그리고, 기존의 플래쉬용 LED 모듈은 앞서 기술한 바와 같이 사이즈의 손실 및 공정상의 손실이 발생하는데 반해, 본 발명의 플래시용 LED 모듈은 공정의 단순화 및 사이즈의 슬림화가 가능하게 된다.The flash LED module of the present invention has a size loss and a process loss as described above, whereas the flash LED module of the present invention can simplify the process and slim the size.
한편, 본 발명은 상기한 실시 예로 한정되지 아니하며, 본 발명의 기술사상의 범주를 벗어나지 않는 한, 여러 가지 다양한 형태로 변경 및 수정하는 것이 가능함은 물론이다.On the other hand, the present invention is not limited to the above-described embodiments, and may be changed and modified in various forms without departing from the scope of the technical spirit of the present invention.
그러므로, 상기한 실시 예는 제한적인 것이 아니라 예시적인 것으로 여겨져야 하고, 이에 따라 본 발명은 상술한 설명에 한정되지 않고 첨부된 청구항의 범주 및 그 동등 범위 내에서 변경될 수 있음은 당업자에게는 당연한 사항이라 할 것이다.Therefore, it is to be understood by those skilled in the art that the above-described embodiments are to be considered as illustrative and not restrictive, and therefore, the invention is not limited to the above description but may be modified within the scope of the appended claims and their equivalents. Will be called.
본 발명은 플래시용 LED 모듈에 있어서 광량과 광분포 등에 있어서 원하는 상태로의 광학 컨트롤이 용이하고, 기구적 조립성 및 조립(혹은 설계) 자유도가 우수함, 열 방출 성능을 효과적으로 확보할 수 있어, 모바일 플래시 모듈 등 제품에 적용시 고효율의 LED 모듈로 작용하여 고화질 이미지(High-quality Images) 및 고해상도(High-pixel Resolution)를 구현할 수 있도록 하는 등 제품 경쟁력을 향상시킬 수 있으므로, 산업상 이용 가능성이 매우 높은 발명이다.The present invention is easy to optical control to the desired state in the light quantity and light distribution in the LED module for flash, excellent mechanical assembly and freedom of assembly (or design), can effectively secure heat dissipation performance, mobile When applied to products such as flash modules, it can be used as a high-efficiency LED module to realize high-quality images and high-pixel resolution. It is a high invention.

Claims (13)

  1. 칩 탑재부가 구비된 제1전극과 상기 제1전극으로부터 이격 배치되는 제2전극을 갖는 리드프레임과;A lead frame having a first electrode provided with a chip mounting part and a second electrode spaced apart from the first electrode;
    상기 리드프레임의 가장자리 상측을 둘러싸도록 설치되어 내측에 캐비티를 형성하는 수지재질의 몰드바디와;A mold body made of a resin material installed to surround an upper edge of the lead frame to form a cavity therein;
    상기 제1전극의 칩 탑재부에 직접 어태치(attach)되어 상기 제2전극과 전기적으로 연결되는 LED칩과;An LED chip attached directly to the chip mounting portion of the first electrode and electrically connected to the second electrode;
    상기 LED칩을 봉지하는 투광성의 봉지재와;A translucent encapsulant for encapsulating the LED chip;
    상기 몰드바디 내측에 설치되어 상기 LED칩으로부터 나오는 빛을 원하는 방향으로 지향시키는 리플렉터를 포함하여 구성되는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈.The LED module for flash, comprising a reflector installed inside the mold body to direct light from the LED chip in a desired direction.
  2. 제1항에 있어서,The method of claim 1,
    상기 리플렉터 상부에는 커버글래스가 구비됨을 특징으로 하는 플래시용 ＬＥＤ 모듈.The LED module for flash, characterized in that the cover glass is provided on the reflector.
  3. 제2항에 있어서,The method of claim 2,
    상기 커버글래스는 반투명한 것을 특징으로 하는 플래시용 ＬＥＤ 모듈.The LED module for flash, characterized in that the cover glass is translucent.
  4. 제2항에 있어서,The method of claim 2,
    상기 몰드바디의 상단부는 상기 리플렉터의 상단부에 비해 높게 위치하도록 형성되는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈.LED module for a flash, characterized in that the upper end of the mold body is formed to be located higher than the upper end of the reflector.
  5. 제1항에 있어서,The method of claim 1,
    상기 몰드바디는 상기 리드프레임의 제1전극과 제2전극 사이의 이격 공간을 채우는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈.And the mold body fills the space between the first electrode and the second electrode of the lead frame.
  6. 제1항에 있어서, The method of claim 1,
    상기 몰드바디의 내측면에는 상기 리플렉터가 안착되도록 함과 아울러 삽입 깊이를 한정하도록 내측으로 돌출된 지지부가 구비됨을 특징으로 하는 플래시용 ＬＥＤ 모듈.LED module for a flash, characterized in that the inner surface of the mold body is provided with a support portion protruding inward to limit the insertion depth and to seat the reflector.
  7. 제1항에 있어서,The method of claim 1,
    상기 몰드바디와 리드프레임은 인서트 사출에 의해 한 몸을 이루도록 형성되는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈.The LED module for a flash, characterized in that the mold body and the lead frame is formed to form a body by insert injection.
  8. 제1항에 있어서,The method of claim 1,
    상기 제1전극과 상기 제1전극으로부터 이격 배치되는 상기 제2전극 사이의 오프닝된 부분의 바탐(bottom)에는 상기 몰드바디와의 결합력 향상을 위한 공간 확장부가 형성된 것을 특징으로 하는 플래시용 ＬＥＤ 모듈.LED module for a flash, characterized in that the bottom portion (bottom) of the opened portion between the first electrode and the second electrode spaced apart from the first electrode is formed with a space extension for improving the bonding force with the mold body.
  9. 제1항에 있어서,The method of claim 1,
    상기 리플렉터 및 몰드바디 일측 모서리는 조립 위치를 잡아주기 위한 컷팅부가 구비되는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈.One side edge of the reflector and the mold body is a LED module for flash, characterized in that provided with a cutting portion for holding the assembly position.
  10. a) LED칩이 탑재되는 제전극과 상기 제1전극으로부터 이격 배치되는 제2전극을 갖는 구조의 리드프레임을 준비하는 단계와; a) preparing a lead frame having a structure having a second electrode on which an LED chip is mounted and a second electrode spaced apart from the first electrode;
    b) 상기 리드프레임의 가장자리를 상측을 둘러싸도록 설치되어 내측에 캐비티를 형성하는 수지재질의 몰드바디를 형성하는 단계와;b) forming a mold body made of a resin material formed around the upper edge of the lead frame to form a cavity therein;
    c) 상기 제1전극의 칩 탑재부에 LED칩을 직접 어태치하는 단계와;c) directly attaching the LED chip to the chip mounting portion of the first electrode;
    d) 상기 LED칩과 제2전극을 전도성 연결부재를 이용하여 전기적으로 연결하는 단계와;d) electrically connecting the LED chip and the second electrode using a conductive connection member;
    e) 상기 LED칩과 전도성 연결부재가 보호되도록 투명 수지로 봉지하는 단계와;e) encapsulating with a transparent resin to protect the LED chip and the conductive connection member;
    f) 상기 몰드바디 내측에 리플렉터를 설치하는 단계;를 포함하여 구성되는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈 제조 방법.f) installing the reflector inside the mold body; LED module manufacturing method for a flash, characterized in that it comprises a.
  11. 제10항에 있어서,The method of claim 10,
    상기 리드프레임이 인서트 사출을 통해 몰드바디와 한 몸을 이루도록 하는 단계;를 더 포함하는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈 제조 방법. And forming the lead frame in a body with a mold body through insert injection.
  12. 제10항에 있어서,The method of claim 10,
    상기 리플렉터 상부에 커버글래스를 씌우는 단계를 더 포함하는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈 제조 방법. The method of manufacturing a LED module for a flash, characterized in that it further comprises the step of covering the cover glass on the reflector.
  13. a) LED칩 탑재부가 구비된 제1전극과 상기 제1전극으로부터 이격 배치되는 제2전극을 갖는 리드프레임이 어레이 타입으로 연속 배치된 리드프레임 스트립이 권취롤로부터 풀려나 작업공간으로 제공되는 단계와;a) a lead frame strip having a first electrode provided with an LED chip mounting portion and a second electrode spaced apart from the first electrode, the lead frame strips continuously arranged in an array type from the take-up roll and provided to a work space;
    b) 상기 권취롤로부터 풀려난 리드프레임 스트립이 정해진 위치에 도달시, 리드프레임 스트립의 이동이 멈추는 단계와;b) stopping the movement of the leadframe strip when the leadframe strip released from the take-up roll reaches a predetermined position;
    c) 상기 리드프레임 스트립 위로 몰드바디 형성용 금형이 하강하여 정위치하는 단계와;c) forming a mold body forming mold on the lead frame strip by lowering it;
    d) 상기 금형 내부로 수지를 주입하여 상기 리드프레임이 몰드바디에 인서트 사출되도록 함으로써 몰드프레임을 형성하는 단계와;d) forming a mold frame by injecting resin into the mold to insert insert the lead frame into a mold body;
    e) 상기 리드프레임 스트립에 구비된 각 제1전극의 칩 탑재부에 LED칩을 각각 어태치하는 단계와;e) attaching LED chips to chip mounting portions of respective first electrodes of the lead frame strip;
    f) 각 LED칩과 제2전극을 전도성 연결부재를 이용하여 전기적으로 연결하는 단계와;f) electrically connecting each LED chip and the second electrode using a conductive connection member;
    g) 각 LED칩과 전도성 연결부재가 보호되도록 투명 수지로 봉지하는 단계와;g) encapsulating with a transparent resin to protect each LED chip and the conductive connection member;
    h) 각 몰드바디 내측에 리플렉터를 설치하는 단계;를 포함하여 구성되는 것을 특징으로 하는 플래시용 ＬＥＤ 모듈 제조 방법.h) a step of installing a reflector inside each mold body; LED module manufacturing method for a flash comprising a.
PCT/KR2014/002882 2013-04-05 2014-04-03 Led module for flash and manufacturing method therefor WO2014163409A1 (en)

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