WO2014163409A1 - Module de del pour flash et son procédé de fabrication - Google Patents

Module de del pour flash et son procédé de fabrication Download PDF

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Publication number
WO2014163409A1
WO2014163409A1 PCT/KR2014/002882 KR2014002882W WO2014163409A1 WO 2014163409 A1 WO2014163409 A1 WO 2014163409A1 KR 2014002882 W KR2014002882 W KR 2014002882W WO 2014163409 A1 WO2014163409 A1 WO 2014163409A1
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WO
WIPO (PCT)
Prior art keywords
electrode
flash
lead frame
mold body
led module
Prior art date
Application number
PCT/KR2014/002882
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English (en)
Korean (ko)
Inventor
이승수
김대영
이장원
이현열
한상훈
이민종
임원규
홍경의
Original Assignee
크루셜텍(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 크루셜텍(주) filed Critical 크루셜텍(주)
Publication of WO2014163409A1 publication Critical patent/WO2014163409A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H01L33/486—
    • H01L33/60—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to an LED module and a manufacturing method thereof, and more particularly, to a flash LED module having a new structure that is easy to control optically to a desired state in light quantity and light distribution, and has excellent mechanical assembly and / or design freedom. It is about.
  • LED Lighting Emitting Diode
  • LED Lighting Emitting Diode
  • LED is a semiconductor p-n junction device is a light emitting semiconductor that converts electrical energy into light energy.
  • LED operation when voltage is applied between terminals, current flows and emits light by the combination of electrons and holes in the vicinity of pn junction or active layer, and various colors (wavelengths) are realized according to the change of energy band gap, a characteristic of semiconductor. .
  • LEDs are used for various purposes due to their low power consumption and durability, robustness, and environmentally friendly characteristics.
  • LED is a light source that converts electrical energy into light energy and emits light of high brightness.
  • the LED has advantages such as high energy efficiency, long lifespan, and high-quality light. It is being developed.
  • the LED is used in various fields such as a display device, a street light or an indoor light, or a decoration such as a light source of a mobile communication terminal, a TV, a monitor, a signboard, a billboard, a backlight unit, and the like, and the fields of application are different. It is also rapidly expanding into the field.
  • LED is widely applied as a light source of a camera flash module of a mobile communication terminal, and a flash module having almost the same performance as that of a digital camera is applied to a recently released mobile phone.
  • the flash module is mounted on a surface of a printed circuit board (PCB) so that the light source is radiated to the outside through a condenser lens installed in the mobile communication terminal, and the LED emits light through power supplied from the mobile communication terminal itself. do.
  • PCB printed circuit board
  • the irradiation angle of the light emitted from the LED is generally about 120 °, which is larger than the camera's angle of view (eg, 75 °), the ratio of the light emitted from the LED to the camera's shooting area when only the LED is used without the lens is used. Is very small, resulting in poor light efficiency.
  • a secondary optical system such as a reflector or a lens is installed in front of the LED so that the irradiation angle of the light exiting the front of the flash module can be narrowed to a desired angle so that the desired light distribution of the shooting area can be narrowed.
  • Such a conventional flash module has a structure in which a reflector, which is a secondary optical system, is assembled on an LED package in which an LED chip is packaged, so that the height and size of the flash module have to be increased.
  • the reflector 4 is again installed on the top of the ready-made LED package formed by encapsulating the LED chip mounted on the substrate 1 with the resin 3.
  • the optical design it is an obstacle to realizing the light and small size of the mobile flash module.
  • the conventional flash module shown in FIG. 1 has a structure in which another printed circuit board 5 is used to install the reflector 4 in the LED package provided as a ready-made product, and the LED chip is mounted on the substrate 1.
  • the reflector 4 is surface-mounted on the printed circuit board 5, the assembly tolerance is large, and the component is easily distorted in the horizontal, vertical, and height directions.
  • the conventional flash module illustrated in FIG. 1 is a main board (ie, a printed circuit) of a product such as a mobile communication terminal in which a flash module having a printed circuit board 5 is used to mount a reflector when applied to a product such as a mobile communication terminal. Since it is surface mounted on the substrate, there is a disadvantage in that the printed circuit board is used twice, and thus there is a structural limitation in reducing the thickness and size of the actual product to which the flash module is applied, including the mobile communication terminal.
  • the present invention is to solve the above problems, and to provide a new structure of the LED module for flash and its manufacturing method which is easy to control to a desired state in light quantity and light distribution, and excellent in mechanical assembly and design freedom.
  • the purpose is.
  • the insert in manufacturing a flash LED module, by inserting a resin into the mold body in the state that the lead frame strip is supplied from the take-up roll, the insert can be injected into the mold body, a large number at once
  • the purpose of the present invention is to improve the productivity in manufacturing a flash LED module by allowing a mold frame to be formed.
  • the present invention includes a lead frame comprising a first electrode provided with a chip mounting portion and a second electrode spaced apart therefrom; A mold body formed of a resin material (eg, PPA: Polyphthalamide) installed to surround an upper edge of the lead frame to form a cavity therein; An LED chip attached directly to the chip mounting portion of the first electrode and electrically connected to the second electrode; A translucent encapsulant for encapsulating the LED chip; The LED module for flash is provided, which is installed inside the mold body and includes a reflector for directing light emitted from the LED chip in a desired direction.
  • a resin material eg, PPA: Polyphthalamide
  • a cover glass may be further provided on the reflector. And the cover glass is characterized in that translucent.
  • the upper end of the mold body may be formed to be higher than the upper end of the reflector.
  • the mold body may be configured to fill a space between the first electrode and the second electrode of the lead frame.
  • the inner surface of the mold body may be provided with a support portion protruding inward to allow the reflector to be seated and to limit the insertion depth, and the mold body and the lead frame are formed to form a body by insert injection.
  • the bottom portion of the opened portion between the first electrode and the second electrode spaced apart from the first electrode may have a space extension part for improving the bonding force with the mold body.
  • one side edge of the reflector and the mold body may be provided with a cutting portion for holding the assembly position.
  • one example of the flash LED module manufacturing method of the present invention for achieving the above object comprises the steps of preparing a lead frame consisting of a first electrode on which the LED chip is mounted and a second electrode spaced apart therefrom; Forming a mold body made of a resin material formed around the upper edge of the lead frame to form a cavity therein; Attaching an LED chip to a chip mounting portion of the first electrode; Electrically connecting the LED chip to the second electrode using a conductive connection member; Encapsulating with a transparent resin to protect the LED chip and the conductive connection member; And installing a reflector inside the mold body.
  • a lead frame having a first electrode provided with an LED chip mounting portion and a second electrode spaced apart from the first electrode array
  • the leadframe strips arranged in series are released from the take-up roll and provided to the workspace; Stopping the movement of the lead frame strip when the lead frame strip released from the winding roll reaches a predetermined position; Positioning a mold for forming a mold body on the lead frame strip by lowering and positioning the mold body; Forming a mold frame by injecting resin into the mold to insert insert the lead frame into a mold body; Attaching LED chips to chip mounting portions of respective first electrodes of the lead frame strip; Electrically connecting each LED chip and the second electrode with a conductive connection member; Sealing each LED chip with a conductive resin so as to protect the conductive connection member; It may be configured to include; a step of installing a reflector inside each mold body.
  • the present invention it is easy to control to a desired state in light quantity, light distribution, and the like.
  • the mechanical assembly and design freedom of the LED module is excellent.
  • productivity in manufacture of the LED module for flash can be improved. That is, in the manufacture of the LED module for the flash, the resin can be injected into the mold body by inserting the resin into the mold in the state continuously supplied by the lead frame strip, thereby producing a flash LED module Productivity can be improved.
  • the LED chip is attached to the lead frame substrate made of metal, it is possible to effectively secure the heat dissipation performance of the LED chip.
  • 1 is a configuration diagram showing an example of the structure of an LED module for a conventional flash
  • Figure 2 is a perspective view of the LED module for flash of the present invention
  • FIG. 3 is an exploded perspective view of FIG.
  • FIG. 4A and 4B are plan and bottom views of FIG. 2, respectively.
  • FIG. 5 is a cross-sectional view taken along the line I-I of FIG.
  • (A) is a cross-sectional view showing the lead frame is ready.
  • (B) is a cross-sectional view showing a state in which a mold body is formed
  • (C) is a cross-sectional view showing the state after the chip attach
  • (D) is a cross-sectional view showing after wire bonding
  • FIG. 7 is a schematic diagram showing another embodiment of the LED module for flash of the present invention.
  • Figure 8 is a schematic diagram showing another example of the LED module manufacturing method of the flash of the present invention, the figure in the circle is an enlarged perspective view of the lead frame strip
  • FIG. 9 is a flow chart of the LED module manufacturing method for flash according to FIG.
  • FIGS. 10 (a) and (b) are optical schematic diagrams comparing the light quantity and illuminance characteristics of the existing LED module for flash and the LED module for flash according to the present invention.
  • (B) is a light schematic diagram of the LED module for flash according to the present invention
  • FIG. 2 is a perspective view of a flash LED module of the present invention
  • Figure 3 is an exploded perspective view of Figure 2
  • Figure 4 (a) and (b) is a plan view and a bottom view of FIG.
  • FIG. 5 is a cross-sectional view taken along the line I-I of FIG.
  • the flash LED module according to the present embodiment, the first electrode 110a provided with a chip mounting portion and the second spaced apart therefrom
  • a lead frame 110 having an electrode 110b and a mold body 120 made of a resin material (eg, PPA: Polyphthalamide) installed to surround the upper edge of the lead frame 110 to form a cavity therein;
  • the LED chip 130 is attached to the chip mounting portion of the first electrode 110a to be electrically connected to the second electrode 110b, and a light-transmissive encapsulant to encapsulate the LED chip 130 ( 150, and a reflector 160 installed inside the mold body 120 to direct light emitted from the LED chip 130 in a desired direction.
  • the first electrode 110a may be one of the cathode and the anode
  • the second electrode 110b may be the other pole.
  • the first electrode may be the cathode part (Cathode). Part) and the second electrode may be an anode part.
  • the LED chip 130 is directly attached to the chip mounting portion of the first electrode 110a to be electrically connected to the second electrode 110b.
  • the inner surface of the reflector 160 is formed as an aspherical surface, the aspherical surface in the front and rear direction and the aspherical surface in the left and right direction may be designed as different aspherical surfaces.
  • the inner surface of the mold body 120 is provided with a support part 120a protruding inwardly to allow the reflector 160 to be seated and to limit the insertion depth.
  • the mold body 120 is configured to fill a space between the first electrode 110a and the second electrode 110b of the lead frame 110.
  • the lead frame 110 to be integrated with the mold body 120, the mold body 120 and the lead frame 110 is formed to form a body by insert injection.
  • a space extension part E for improving coupling force with the mold body 120 is provided on the lower side of the opened portion between the first electrode 110a of the lead frame 110 and the second electrode 110b spaced apart from the lead frame 110. ) Is formed.
  • one side edges of the reflector 160 and the mold body 120 are provided with a cutting part C for holding the assembly position, which is attached to the LED chip and the wire bonding, and the surface mounting of the LED module for the flash. In the process of the process to give the direction so that the work can proceed efficiently.
  • a P-type zener diode 180 is attached to the second electrode 110b, and the P-type zener diode 180 is connected to the first electrode 110a by the conductive connecting member 140.
  • the zener diode is an N-type zener diode, it is attached to the first electrode, which is the opposite region, and is connected to the second electrode by a conductive connecting member.
  • a lead frame 110 including a first electrode 110a on which the LED chip 130 is mounted and a second electrode 110b spaced therefrom is prepared.
  • the edge of the lead frame 110 is formed to surround the upper side to form a mold body 120 of a resin material forming a cavity therein.
  • the mold body 120 is made of, for example, polyphthalamide (PPA).
  • the LED chip 130 and the second electrode 110b are electrically connected by using a conductive connection member 140 such as a gold wire.
  • the LED chip 130 and the conductive connection member 140 is sealed with a transparent resin to protect.
  • the reflector 160 is inserted into the mold body 120 to complete the installation.
  • inserting the reflector 160 into the mold body 120 in the state that the hardening of the encapsulant 150 is not completed the bonding force between the encapsulant 150 and the reflector 160 during the hardening process of the encapsulant 150. This is to make it work.
  • the lead frame 110 and the mold body 120 is formed by insert injection, and may be introduced for the packaging process after chip bonding in a pre-integrated state through a separate process. have.
  • FIG. 7 is a block diagram showing another embodiment of the flash LED module of the present invention, the basic structure of the flash LED module of the present embodiment is the same as that of the first embodiment described above.
  • the flash LED module of the present embodiment has a difference in that a cover glass 170 is further provided on the reflector 160.
  • the cover glass 170 may be configured to be transparent or translucent, but in order to prevent the internal structure of the LED module from being visually exposed to the outside to reduce aesthetics, the cover glass 170 may have a translucent white color. It can be configured to.
  • the flash LED module of the present embodiment is formed so that the upper end of the mold body 120 is positioned higher than the upper end of the reflector 160 so that the cover glass 170 is seated on the reflector 160. It is not limited to this. That is, the cover glass 170 may be positioned only on the reflector 160 without being seated on the reflector 160.
  • the manufacturing process of the LED module for the flash of the present embodiment configured as described above is to follow the process of the first embodiment described above, but it further comprises the step of covering the cover glass 170 on the reflector 160. .
  • FIG 8 is a schematic diagram showing another example of the LED module manufacturing method for flash of the present invention, the figure in the circle is an enlarged perspective view showing the shape of the lead frame strip (S), Figure 9 is for the flash according to Figure 8 This is a flowchart of the LED module manufacturing method.
  • the lead frame provided on the lead frame strip (S) is preferably arranged in an array (Array) type for the horizontal and vertical direction on the strip.
  • first electrode 110a and the second electrode 110b are connected to only the bridge B (see FIG. 8) with respect to the strip body on the lead frame strip S, the bridge B is connected. When cut, the leadframe strip S is separated.
  • the winding roll (R) wound around the lead frame strip (S) having the first electrode (110a) and the second electrode (110b) spaced therefrom as a metal material ) Is prepared, the lead frame strip (S) released from the take-up roll (R) is provided to the workspace where the insert injection is made.
  • the mold body M for forming the mold body 120 is lowered and positioned on the lead frame strip S, and the resin is injected into the mold M to form the mold body 120.
  • the lead frame 110 is inserted into the mold body 120 to be injected.
  • the lead frame 110 and the mold body 120 are formed in one body by insert injection.
  • the mold frame 100 is formed by forming the body by insert injection.
  • the mold M is lifted and withdrawn. After forming the mold frame 100 by insert injection as described above, the mold frame 100 should be separated from the lead frame strip S.
  • the mold frame 100 is cut from the lead frame strip S by a group including a plurality of mold frames 100 or by individual unit mold frames 100 and cut from the lead frame strip S. Will be separated.
  • the lead frame strip S released from the take-up roll R is newly provided as a work space for the next insert injection operation.
  • the insert injection operation to be performed by a predetermined group with respect to the lead frame strip (S) released from the take-up roll (R) can be made continuously.
  • the mold frame 100 disposed on the strip in an array type is cut for each group or for each individual mold frame 100, and then a packaging process after chip bonding is performed using the mold frame 100.
  • chip bonding and conductive connection attaching the LED chip 130 directly onto the strip.
  • a singer that separates the unit LED module from the leadframe strip S after performing all the subsequent processes for manufacturing the LED module such as wire bonding connecting the member 140, encapsulation process using a transparent resin, and installing the reflector 160. You can also perform a migration process.
  • Figure 10 (a) and (b) is an optical schematic diagram showing the comparison of the light quantity and illuminance characteristics of the conventional LED module for flash and the flash LED module according to the present invention
  • (A) is a conventional LED module for flash It is an optical schematic diagram
  • (b) is an optical schematic diagram of the LED module for flashes which concerns on this invention.
  • the conventional LED module for flash shown in (a) is lower than the flash LED module of the present invention shown in (b) in the center light amount and corner light amount. can confirm.
  • the flash LED module of the present invention can increase the amount of light in the center and corner compared to the conventional.
  • the flash LED module of the present invention has a size loss and a process loss as described above, whereas the flash LED module of the present invention can simplify the process and slim the size.
  • the present invention is easy to optical control to the desired state in the light quantity and light distribution in the LED module for flash, excellent mechanical assembly and freedom of assembly (or design), can effectively secure heat dissipation performance, mobile When applied to products such as flash modules, it can be used as a high-efficiency LED module to realize high-quality images and high-pixel resolution. It is a high invention.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention a pour objectif de fournir un module de DEL pour flash possédant une nouvelle structure, laquelle facilite la commande de la quantité de lumière, la distribution de la lumière et analogue dans un état souhaité et possède une excellente efficacité d'assemblage mécanique et une liberté de conception, et son procédé de fabrication. Dans ce but, la présente invention fournit le module de DEL pour flash, comprenant : une structure de grille de connexion comprenant une première électrode pourvue d'une partie de montage de puce, et une seconde électrode placée séparément de la première électrode ; un corps moulé formé d'un matériau de résine (par exemple du : polyphtalamide (PPA)) et est conçu pour entourer le côté supérieur du bord de la structure de grille de connexion de telle sorte qu'une cavité est formée en son sein ; une puce à DEL directement fixée à la partie de montage de puce de la première électrode de sorte à être en connexion électrique avec la seconde électrode ; un matériau d'encapsulation transmettant la lumière pour l'encapsulation de la puce à DEL ; et un réflecteur placé au niveau du côté interne du corps moulé de sorte à diriger la lumière émise depuis la puce à DEL vers une direction souhaitée.
PCT/KR2014/002882 2013-04-05 2014-04-03 Module de del pour flash et son procédé de fabrication WO2014163409A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0037141 2013-04-05
KR1020130037141A KR20140121507A (ko) 2013-04-05 2013-04-05 플래시용 ｌｅｄ 모듈 및 그 제조방법

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WO2014163409A1 true WO2014163409A1 (fr) 2014-10-09

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KR102102363B1 (ko) * 2018-11-26 2020-04-21 모스탑주식회사 발광모듈

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