WO2014157815A1 - 유기발광소자 충전제용 열경화형 조성물 및 이를 포함하는 유기발광소자 디스플레이 장치 - Google Patents
유기발광소자 충전제용 열경화형 조성물 및 이를 포함하는 유기발광소자 디스플레이 장치 Download PDFInfo
- Publication number
- WO2014157815A1 WO2014157815A1 PCT/KR2013/012293 KR2013012293W WO2014157815A1 WO 2014157815 A1 WO2014157815 A1 WO 2014157815A1 KR 2013012293 W KR2013012293 W KR 2013012293W WO 2014157815 A1 WO2014157815 A1 WO 2014157815A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- organic light
- weight
- thermosetting composition
- emitting device
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 58
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 47
- 239000000945 filler Substances 0.000 title claims abstract description 45
- 239000003822 epoxy resin Substances 0.000 claims abstract description 97
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 97
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 40
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 239000011347 resin Substances 0.000 claims abstract description 8
- 125000004093 cyano group Chemical group *C#N 0.000 claims abstract description 5
- 239000004593 Epoxy Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 36
- 239000007787 solid Substances 0.000 claims description 25
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 12
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 12
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 8
- 125000003700 epoxy group Chemical group 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000004305 biphenyl Substances 0.000 claims description 6
- 235000010290 biphenyl Nutrition 0.000 claims description 6
- 239000000454 talc Substances 0.000 claims description 6
- 229910052623 talc Inorganic materials 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 4
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 4
- -1 cyanoethyl-2-undecyl Chemical group 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical group N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 claims description 2
- 229930003836 cresol Natural products 0.000 claims description 2
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 2
- 230000000977 initiatory effect Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000013034 phenoxy resin Substances 0.000 claims description 2
- 229920006287 phenoxy resin Polymers 0.000 claims description 2
- 239000004843 novolac epoxy resin Substances 0.000 claims 3
- 102100024044 Aprataxin Human genes 0.000 claims 1
- 101000757586 Homo sapiens Aprataxin Proteins 0.000 claims 1
- 238000001723 curing Methods 0.000 description 29
- 239000010410 layer Substances 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- 239000002313 adhesive film Substances 0.000 description 10
- 230000035699 permeability Effects 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000009975 flexible effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229940060799 clarus Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Definitions
- Thermosetting composition for organic light emitting device layer agent and organic light emitting device display device including the same
- the present invention relates to a thermosetting composition for an organic light emitting device filler and an organic light emitting display device including the same.
- Organic light emitting diodes are polycrystalline semiconductor devices, used for backlights of liquid crystals to obtain high luminance light emission at low voltages, and are expected to be thin flat display devices.
- the organic light emitting device is extremely weak to moisture, the interface between the metal electric field and the organic EL layer is peeled off due to the influence of moisture, the metal is oxidized and highly resistant, and the organic material itself is deteriorated by moisture. Therefore, it does not emit light, and there is a problem that the brightness is also lowered.
- a method of encapsulating an organic light emitting device with a curable composition has been developed.
- a method of molding an organic light emitting device into an acrylic resin by a conventional encapsulation method, a method of blocking an organic light emitting device from moisture by adding a hygroscopic material to the encapsulating resin of the organic light emitting device, and the like have been proposed.
- An object of the present invention is to provide an organic light emitting device filler composition having good adhesion to the organic light emitting device laminated substrate, low moisture permeability.
- Another object of the present invention is to provide an organic light emitting device layer composition for reducing the amount of outgas generated to ensure the reliability of the organic light emitting device.
- Thermosetting composition for an organic light emitting device filler of the present invention (AXAl) an epoxy resin having a weight average molecular weight of about 200 or more but less than l, 000 g / mol, (A2) an epoxy resin having a weight average molecular weight of about 1,000 or more and less than 20,000 g / mol, and (A3) a weight average molecular weight of about 20,000 or more 100, 100 parts by weight of an epoxy resin composed of an epoxy resin of less than 0 (X) g / mol, (B) about 10 to 40 parts by weight of a plate-shaped filler, and (C) about 0.1 to 20 parts by weight of an imidazole curing agent having a cyano group. Can be.
- the organic light emitting diode display device of the present invention may include a cured product of the composition.
- the present invention provides an organic light emitting device layer composition which has good adhesion to an organic light emitting device laminated substrate, low moisture permeability, and a small amount of outgas generation, thereby ensuring reliability of the organic light emitting device.
- FIG. 1 is a cross-sectional view of an organic light emitting display device according to an embodiment of the present invention.
- FIG. 2 is an initial reliability result of the OLED device of Example 1
- Figure 3 is a reliability result after 24 hours at 85 ° C, 85% relative humidity of the OLED device of Example 1.
- 4 is an initial reliability result of the OLED device of Example 2
- Figure 5 is a reliability result after 24 hours at 85 ° C, 85% relative humidity of the OLED device of Example 2.
- 6 is an initial reliability result of the OLED device of Example 3
- Figure 7 is a reliability result after 24 hours at 85 ° C, 85% relative humidity of the ⁇ ED device of Example 3.
- Fig. 8 shows the initial reliability of the LED device of Example 4
- Fig. 9 shows the reliability results after 24 hours at 85 ° C, 85% relative humidity of the MED device of Example 4.
- Fig. 10 shows the reliability of the This is the initial reliability result of the ⁇ ED device
- Figure 11 is a reliability result after 24 hours at 85 ° C, 85% relative humidity of this D device of Comparative Example 1.
- FIG. 16 is an initial reliability result of the OLED device of Comparative Example 4
- Figure 17 is a reliability result after 24 hours at 85 ° C, 85% relative humidity of the OLED device of Comparative Example 4.
- Thermosetting composition for an organic light emitting device filler of an embodiment of the present invention (A) (A1) epoxy resin having a weight average molecular weight of about 200 or more less than l, 000g / mol, (A2) weight average molecular weight of about 1,000 or more 20,000g / mol Less than 100 parts by weight of an epoxy resin, and (A3) an epoxy resin composed of an epoxy resin having a weight average molecular weight of about 20,000 or more and less than lO OOOg / mol, (B) about 10 to 40 parts by weight of a plate-shaped filler, and (C) a cyano group And from about 0.1 to 20 parts by weight of an imidazole curing agent having:
- the thermosetting composition for an organic light emitting device layer agent is characterized in that the weight average molecular weight comprises three kinds of epoxy resins having a specific range in a specific range of content.
- the (A2) epoxy resin can realize the crude liquid phase stability effect by improving the compatibility in the mixture of the (A1) epoxy resin and (A3) epoxy resin.
- the epoxy resins (A1), (A2) and (A3) may each be a resin having a hydrolyzable chlorine or chlorine ion content of about 0 to 500 ppm, specifically about 0 to 200 ppm, and in the above range, after layering agent curing The reliability of the OLED device can be avoided.
- the epoxy resin (A1) may have a weight average molecular weight of about 200 or more but less than l, 000 g / mol, specifically about 500 to 700 g / mol, for example, about 200,300,400,500,600,700,800 or 900 g / mol. If the weight average molecular weight is less than 200g / mol, it has a low viscosity, there is a problem of causing dark spots to diffuse into the OLED device in direct contact with this D device, if it is more than 1000g / mol, Due to the low glycidyl reactor, it may be difficult to form a layered crosslinked structure.
- the epoxy resin (A1) is about 10-50% by weight of the epoxy resin (A), specifically about 20-40% by weight, for example about 10,11,12,13,14,15,16,17,18 , 19,20,21,22,23,24,25,26,27,28,29,30,31,32,33,34, 35,36,37,38,39,40,41,42,43 , 44,45,46,47,48,49 or 50% by weight.
- the epoxy resin (A1) may include an epoxy resin having two or more epoxy groups (eg, glycidyl groups) at its ends.
- the epoxy group may have a flow characteristic that gives room temperature processability before curing in the organic light emitting device layer agent, and may increase film strength and barrier effect by crosslinking after curing.
- the epoxy resin (A1) is a liquid at room temperature (25 ° C.), bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol epoxy resin, cycloaliphatic epoxy resin, naphthalene type. It may include one or more of an epoxy resin, a dicyclopentadiene type epoxy resin, a biphenyl type epoxy resin.
- the epoxy resin is a liquid epoxy resin at room temperature (e.g., 25 ° C), the glass transition temperature is about -40 to lC C, specifically -4 to -39, -38, -37, ⁇ 36, -35,-34, -33, -32, -31, -30, -29, -28, -27, -26, -25, -24, -23-22, -21, -20, -19, -18, -17, -16, -15, -14, -13, -12, -11, -10, -9, -8, -7, -6, -5, -4, -3, -2 ,-One,
- It can be 0,1,2,3,4,5,6,7,8,9 or 10 ° C, and the reliability of the OLED device is deteriorated by the remaining amount of epoxy resin after curing of the filler composition in the above range. It is possible to prevent it, and the effect of improving adhesion and OLED reliability after curing is better.
- the epoxy resin (A2) is a solid at room temperature (e.g., 25 ° C), and is a resin that improves the compatibility between the epoxy resin (A1) and the epoxy resin (A3), with a weight average molecular weight of about 1,000 or more and less than 20,000 g / mol. Specifically, the weight average molecular weight is about 2,000 to 5,000 g / mol, for example about 1000,2000,3000,4000,5000,6000,7000,8000,9000,10000,11000, 12000,13000, 14000, 15000, 16000, 17000, 18000 or 19000 g / mc) l.
- the resin phase may be in the form of liquid phase, there may be a problem that can cause OLED device defects due to excess liquid composition, 20,000 If g / mol or more, there is a problem that the compatibility improvement effect is inferior, the polymer content ratio is high, the room temperature processability falls.
- the epoxy resin is about 20 to 50 parts by weight, specifically about 40 to 50 parts by weight, for example about 20, 21, 22, 23, 24, 100 parts by weight of the total of (A1) and (A3) 25,26,27,28,29,30,31,32,33,34,35,36,37,38,39,40,41,42,43,44,45,46,47,48,49 or 50 parts by weight, and (A2) epoxy resin may be added in about 10 to 40% by weight of epoxy resin (A), specifically about 20 to 40% by weight, for example about
- (A2) epoxy resin may be contained by the weight part of the above (A1) and (A3) or by the weight percentage of the (A) epoxy resin, (A1 There may be an effect of improving the compatibility of the epoxy resin and the epoxy resin (A3), the improvement of the curing rate and the phase of the epoxy resin (A1) is more effective in improving the processability.
- the epoxy resin (A2) may include two or more epoxy groups (eg, glycidyl groups) at both ends, and one epoxy group (eg, glycidyl groups) for each repeating unit of the epoxy resin.
- One epoxy group contained in each repeating unit of the epoxy resin can prevent the uncured (A3) epoxy resin from flowing out by increasing the degree of curing of the composition for the layering agent, and can improve the adhesion even without a silane coupling agent. have.
- the epoxy resin (A2) is a novolak-type epoxy resin, and may include one or more of cresol novolak-type epoxy resins, biphenyl novolak-type epoxy resins, naphthalene novolak-type epoxy resins, but is not limited thereto. It doesn't work.
- Epoxy resins are epoxy resins that are solid at room temperature (e.g. 25 ° C), with glass transition temperatures of about 30 to 70 ° C, for example about 30,31,32,33,34,35,36 , 37,38,39,40,41,42,43,44,45,46,47,48,49,50,51,52,53,54, 55,56,57,58,59,60,61 , 62,63,64,65,66,67,68,69 or 70 ° C, resin dispersion stability is secured in the above range, and the reliability of the organic light emitting device Can be.
- Epoxy resin is about 15 to 30% by weight, specifically about 20 to 25% by weight, for example about 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 or 30% by weight may be included in the above range, it is possible to more secure the organic light emitting device reliability.
- Epoxy resins have an increased average molecular weight of about 20,000 or more but less than 100,000 g / mol, specifically about 40,000 to 6a000 g / mol, for example about 20000,30000,40000,50000,60000,70000,80000 or 90000g / mol This can be If the weight average molecular weight is less than 20,000g / mol, there may be a problem that the film is not formed, if more than 100,000g / mol, there is a problem that difficult to manage the film appearance is difficult to dissolve and high viscosity.
- the epoxy resin is about 10 to 50% by weight of the epoxy resin (A), specifically about 20 to 40% by weight, for example about 10, 11, 12, 13, 14, 15, 16, 17, 18, 19 , 20,21,22,23,24,25,26,27,28,29,30,31,32,33,3 4,35,36,37,38,39,40,41,42,43, 44, 45, 46, 47, 48, 49 or 50% by weight may be included, and the film forming and coating strength in the above range may be more effective.
- the epoxy resin (A3) is solid at room temperature (eg 25 ° C.) and may have two or more epoxy groups (eg glycidyl groups) at its ends.
- the epoxy group may implement a crosslinking effect upon curing.
- the (A3) epoxy resin may comprise a resin having a bisphenol A or bisphenol F epoxy skeleton.
- it may include, but is not limited to, one or more of a solid bisphenol A epoxy resin, a solid bisphenol F epoxy resin, a solid phenoxy resin, a solid dicyclopentadiene epoxy resin, and a solid biphenyl epoxy resin. Do not.
- the epoxy resin (A3) is an epoxy resin that is solid at room temperature (eg, 25 ° C.), and may have a glass transition temperature of about 50 to 12 CTC.
- the epoxy resin may be about 55 to 90% by weight, specifically about 55 to 85% by weight, or about 65 to 90% by weight, more specifically about 55 to 80% by weight, based on solids content. For about
- thermosetting composition for an organic light emitting device layer agent is characterized by using a large amount of the plate-like filler compared to the conventional.
- the high content of the plate-like filler in the composition it is possible to implement the effect of controlling the diffusion of the low molecular weight material in the film.
- the plate-shaped filler does not impart a hygroscopic function by physical adsorption or chemical bonding. Instead, the plate-shaped filler blocks moisture path or increases the length of the path to give hygroscopicity. It is possible to prevent the adhesive layer having the form of from expanding by heat.
- the plate-shaped filler may include a plate-like powder having a length of about 10 nm to 100 in the long direction, about 50 nm to 10 in the unidirectional width, and about 50 nm to 10 in the thickness, and in the above range, may have a low moisture permeability, Film formation can be good.
- the plate-shaped filler is not particularly limited as long as it is a plate-like structure, but may include, for example, one or more of talc, mica, plate silicate, graphite, clay, and specifically, may be talc.
- the plate-shaped filler is about 10 to 40 parts by weight, specifically about 15 to 30 parts by weight based on 100 parts by weight of the epoxy resin (A), for example, 10,11,12,13,14,15,16,17,18 , 19,20,21,22,23,24,25,26,27,28,29,30,31,32,33,34,35,36,37,38,39 or 40 increments. If less than 10 parts by weight ⁇ does not prevent the diffusion of the low molecular material remaining in the film, if greater than 40 parts by weight, there may be a problem of dispersion.
- the plate-shaped filler is about 1 to 30 weight 93 ⁇ 4, specifically about 5 to 29 weight%, for example about 1,2,3,4,5,6,7,8, in the thermosetting composition for a solid organic light emitting device layer filler 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 or 30% by weight.
- the film formability is good, there may be an effect that the physical defect does not occur in the surface irregularities by the filler.
- the imidazole curing agent has a reaction starting degree of about 100 to 16C C and a cyano group It may include an imidazole curing agent having.
- 1-cyanoethyl-2-phenylimidazole, 1-cyano And but is not limited to, one or more of ethyl-2undecylimidazolium-trimellitate, 1-cyanoethylyl 2-phenylimidazolium-trimellitate.
- the imidazole curing agent is a curing agent that is solid at room temperature (eg 25 ° C.) and can have a melting point of about 90 to 250 ° C.
- the imidazole curing agent is about 0.1 to 20 parts by weight, specifically about 5 to 15 parts by weight, for example about 5,6,7,8,9,10,11,12, based on 100 parts by weight of the epoxy counter (A). , 13, 14 or 15 parts by weight, the composition may be thermally cured in the above range, the remaining amount of the curing agent may be more effective to prevent the permeability is poor.
- the imidazole curing agent is about 1 to 15% by weight, specifically about 5 to 10% by weight, for example about 1,2,3,4,5,6,7, of the thermosetting composition for organic light-emitting device filler based on solids 8, 9, 10, 11, 12, 13, 14 or 15% by weight. In the above range, the composition can be cured sufficiently, and it is possible to prevent the degradation of the reliability of the OLED device due to the remaining amount of the curing agent after curing.
- thermosetting material of the thermosetting composition for an organic light emitting device filler has adhesive properties at room temperature (eg, 25 ° C.), and may be attached to a substrate (eg, a glass substrate) on which an organic light emitting device is formed with a predetermined adhesive force.
- thermosets eg, adhesive films
- thermosetting composition for an organic light emitting device layer agent has a water permeability of about 0 to 60 g / m 2 measured at 50 ° C., a relative humidity of 100%, and a pressure of 760 mmHg for 24 hours on a film having a thickness of 20 kPa. day, for example about 30 to 60 g / m 2 ⁇ day.
- Thermosetting composition for an organic light emitting device filler denotes a non-current in the 25 ° C, flow gaesieun also the example about 25 ° C greater than less than 50 ° C, specifically about 40 to 46 ° C, for example, about
- Flow beginning temperature may refer to a silver content in which the composition for layering agent starts to flow after being heated and softened.
- thermosetting composition for an organic light emitting device filler may not include a silane coupling agent.
- the thermosetting composition for an organic light emitting device layer agent may secure a sufficient adhesive force for the OLED device layer agent even if it does not contain a silane coupling agent, can realize the film coating properties, and improve the reliability of the OLED device.
- the thermosetting composition for an organic light emitting device layer agent may further include one or more additives.
- the additive can improve the leveling and coating properties on the surface.
- the additive may be, for example, one or more selected from the group consisting of a leveling agent, an antifoaming agent, a storage stabilizer, and a plasticizer, but is not limited thereto.
- the thermosetting composition for an organic light emitting device filler may be formulated in the form of an adhesive film as an organic light emitting device layer filler.
- the adhesive film may be prepared by drying and laminating a composition for layering agent. For example, although not particularly limited, it may include a method of drying at about 20 to 100 ° C to about 0.2 to 1.5 m / s.
- the thickness of the adhesive film may be about 1 to 100, specifically about 10 to 50.
- the organic EL device and the sealing film can be adhered well.
- the organic light emitting display device of the present invention may include a cured product of the composition of the present invention.
- the apparatus may include a first substrate having an organic light emitting element formed on one surface thereof; A second substrate spaced apart from the first substrate; And an adhesive layer disposed between the first substrate and the second substrate to bond the first substrate and the second substrate, wherein the adhesive layer is a cured product of the thermosetting composition for an organic light-emitting device filler of an embodiment of the present invention, Specifically, it may include a thermoset. Thermosetting of the composition may be carried out for about iocrc, about 2 hours, but is then not limited to ⁇ .
- an organic light emitting diode display device 100 may include a first substrate 110 and a first substrate on which an organic light emitting diode (D) and an organic light emitting diode (D) are formed.
- An adhesive layer disposed between the second substrate 120 and the first substrate 110 and the second substrate 120 spaced apart from the substrate 110 to bond the first substrate 110 and the second substrate 120 to each other. 170 It may include.
- the first substrate may be made of a material such as transparent glass, plastic sheet, silicon or metal substrate, and may have flexible or non-flexible properties and transparent or non-transparent properties.
- One or more organic EL elements are formed on one surface of the first substrate.
- the organic EL element is composed of a transparent electrode, a hole transport layer, an organic EL layer and a back electrode.
- the second substrate may be disposed on the organic EL element and spaced apart on the first substrate, and may be bonded to the first substrate by the adhesive layer.
- the second substrate not only a glass material engine but also a substrate having excellent barrier properties such as a plastic sheet on which metal is laminated may be used.
- a getter 150 may be formed between the first substrate and the second substrate and at the side of the organic EL device to adhere the first substrate and the second substrate.
- Epoxy resin (Al) Mw of 200 to l, less than 100 g / mol epoxy resin (KDS8128, Kukdo Chemical, liquid at 25 ° C), (A2) Mw of less than 1,000 to 20,000 g / mol Epoxy resin (YDCN ⁇ 50 to 90P, Kukdo Chemical, solid at 25 ° C), (A3) Mw of 20,000 to 100,000g / m epoxy resin (JER4275, Mitsubishi chemical, solid to 25 ° C)
- thermosetting composition for an organic light-emitting device filler was prepared in the same manner except for changing the type and content of the imidazole curing agent as shown in Table 2.
- thermosetting composition for an organic light emitting device layer filler was prepared in the same manner.
- thermosetting type composition for organic light emitting device fillers of Examples and Comparative Examples was formed with an applicator, and dried and laminated to prepare a layered adhesive film having a thickness.
- the following physical properties were evaluated for the prepared adhesive film and described in Tables 1 and 2 below.
- Adhesion strength (die shear strength): 5 mm x 5 mm (horizontal x vertical) of the glass plate attached to the laminating layer with the adhesive film for the layering agent and heat-cured for 2 hours in the locrc. Adhesion was measured by a Die shear strength tester under load cell 100N, Speed 50 / rni / sec, and test load lkgf.
- Moisture permeability The layer adhesive film was thermally cured at 10CTC for 2 hours, and nitrogen gas was applied to carrier film for 24 hours under pressure of 5CTC, relative humidity 100%, and 760mmHg for a film of thickness 20.
- MOCON test PERMATRAN-W 3/33, MOCON Co.
- Flow start temperature Using the storage modulus / loss modulus (ARES: Advanced rheological expansion system'TA) of layered agent, enter the flow start temperature of the filler in the temperature range of 25 ° C to 140 ° C. Measure. The specimen of filler is laminated to a thickness of 400 ⁇ and sampled to a diameter of 8.0 mm by 0.1 mm using a circle knife. Temperature was raised to 10 ° C / min, and specifies the inflection point of Strorage modulus (G ') and Loss modulus (G'') at Angular frequency of 10rad / s at a flow initiation temperature.
- G ' inflection point of Strorage modulus
- G'' Loss modulus
- OLED device reliability It was encapsulated and laminated with a substrate on which a layering agent (thermosetting of the adhesive film for layering) was laminated and a substrate on which a 2mmx2mm (horizontal X vertical) OLED Green unit device was deposited. The initial light emission state of the manufactured unit device panel was confirmed. After 24 hours at 85 ° C and 85% relative humidity of the prepared unit device panel was confirmed the emission state again.
- a layering agent thermosetting of the adhesive film for layering
- thermosetting composition for an organic light emitting device layer agent of the present invention has a high adhesion, low moisture permeability, low outgas generation amount can be confirmed that the reliability of the OLED device It was.
- all the square size of the organic light emitting device can be seen that the light emission without dark spots or non-emitting phenomenon, by maintaining the light emission after 24 hours at 85 ° C, 85% relative humidity The emission state was maintained and the reliability of the organic light emitting diode was high.
- Comparative Example 1-4 compared with the present invention, it was confirmed that the adhesion strength is low, the moisture permeability is high : the outgas generation amount is high and the reliability of the OLED device can not be secured. That is, referring to FIGS. 11, 13, 15, and 17 after 24 hours at 85 ° C, 85% relative humidity, which is an evaluation of device reliability of Comparative Examples 1-4, all of the organic light emitting diodes having a square size do not emit light. As a result, only a portion of the light emitting device was not emitted in black at the edge portion of the square, and in some cases, dark spots were also generated from the inside, which indicates low reliability of the organic light emitting device.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201380073916.3A CN105026492B (zh) | 2013-03-26 | 2013-12-27 | 用于有机发光元件填料的热固化组合物和包含其的有机发光元件显示装置 |
US14/769,291 US9887382B2 (en) | 2013-03-26 | 2013-12-27 | Thermosetting composition for organic light-emitting element filler and organic light-emitting element display device comprising same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130032415A KR101549735B1 (ko) | 2013-03-26 | 2013-03-26 | 유기발광소자 충전제용 열경화형 조성물 및 이를 포함하는 유기발광소자 디스플레이 장치 |
KR10-2013-0032415 | 2013-03-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014157815A1 true WO2014157815A1 (ko) | 2014-10-02 |
Family
ID=51624740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2013/012293 WO2014157815A1 (ko) | 2013-03-26 | 2013-12-27 | 유기발광소자 충전제용 열경화형 조성물 및 이를 포함하는 유기발광소자 디스플레이 장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9887382B2 (ko) |
KR (1) | KR101549735B1 (ko) |
CN (1) | CN105026492B (ko) |
WO (1) | WO2014157815A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110603277B (zh) | 2017-06-23 | 2022-05-03 | 三井化学株式会社 | 图像显示装置密封材料及图像显示装置密封片 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080065582A (ko) * | 2005-10-24 | 2008-07-14 | 가부시끼가이샤 쓰리본드 | 유기 el 소자 봉지용 열경화형 조성물 |
JP2011068772A (ja) * | 2009-09-25 | 2011-04-07 | Namics Corp | エポキシ樹脂組成物、および、それによる接着フィルム |
WO2012021258A1 (en) * | 2010-08-10 | 2012-02-16 | 3M Innovative Properties Company | Epoxy structural adhesive |
KR20120113471A (ko) * | 2011-04-05 | 2012-10-15 | 제일모직주식회사 | 유기 el 소자용 접착 필름, 이에 포함되는 조성물 및 이를 포함하는 유기 el 소자 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4423779B2 (ja) | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
US6534179B2 (en) * | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
JP4027332B2 (ja) * | 2004-03-19 | 2007-12-26 | リンテック株式会社 | 半導体用粘接着シートおよび半導体装置の製造方法 |
JP2005327789A (ja) * | 2004-05-12 | 2005-11-24 | Sharp Corp | ダイシング・ダイボンド兼用粘接着シートおよびこれを用いた半導体装置の製造方法 |
US20070142498A1 (en) * | 2005-12-20 | 2007-06-21 | Brennan Joan V | Dental compositions including thermally responsive additives, and the use thereof |
KR101037229B1 (ko) * | 2006-04-27 | 2011-05-25 | 스미토모 베이클리트 컴퍼니 리미티드 | 반도체 장치 및 반도체 장치의 제조 방법 |
JP5771987B2 (ja) * | 2008-03-31 | 2015-09-02 | 住友ベークライト株式会社 | 多層回路基板、絶縁シート、および多層回路基板を用いた半導体パッケージ |
JP5177763B2 (ja) | 2009-06-04 | 2013-04-10 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
US20120115382A1 (en) * | 2010-11-05 | 2012-05-10 | Nitto Denko Automotive, Inc. | Magnetic reinforcing composition, reinforcing sheet and methods for producing the same |
EP2835841A4 (en) * | 2012-08-03 | 2015-11-25 | Lg Chemical Ltd | ADHESIVE FILM AND SEALING METHOD FOR ORGANIC ELECTRONIC DEVICE USING THE SAME |
US9447501B2 (en) * | 2014-10-15 | 2016-09-20 | Eastman Kodak Company | Forming articles and devices with carbon-coated metal particles |
-
2013
- 2013-03-26 KR KR1020130032415A patent/KR101549735B1/ko active IP Right Grant
- 2013-12-27 WO PCT/KR2013/012293 patent/WO2014157815A1/ko active Application Filing
- 2013-12-27 US US14/769,291 patent/US9887382B2/en active Active
- 2013-12-27 CN CN201380073916.3A patent/CN105026492B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080065582A (ko) * | 2005-10-24 | 2008-07-14 | 가부시끼가이샤 쓰리본드 | 유기 el 소자 봉지용 열경화형 조성물 |
JP2011068772A (ja) * | 2009-09-25 | 2011-04-07 | Namics Corp | エポキシ樹脂組成物、および、それによる接着フィルム |
WO2012021258A1 (en) * | 2010-08-10 | 2012-02-16 | 3M Innovative Properties Company | Epoxy structural adhesive |
KR20120113471A (ko) * | 2011-04-05 | 2012-10-15 | 제일모직주식회사 | 유기 el 소자용 접착 필름, 이에 포함되는 조성물 및 이를 포함하는 유기 el 소자 |
Also Published As
Publication number | Publication date |
---|---|
KR101549735B1 (ko) | 2015-09-02 |
CN105026492B (zh) | 2017-03-08 |
KR20140117227A (ko) | 2014-10-07 |
CN105026492A (zh) | 2015-11-04 |
US20160005995A1 (en) | 2016-01-07 |
US9887382B2 (en) | 2018-02-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI588027B (zh) | 封裝膜 | |
US20190270916A1 (en) | Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same | |
EP2781571B1 (en) | Encapsulation film | |
CN103930501B (zh) | 粘合膜 | |
CN104126331B (zh) | 光学器件面封装用组合物、光学器件面封装用片、显示器及显示器的制造方法 | |
JP6010838B2 (ja) | 接着フィルム及びこれを利用した有機電子装置の封止方法 | |
TW201117642A (en) | Sealing member for organic EL device | |
KR101740185B1 (ko) | 접착제 조성물 | |
TWI666280B (zh) | 黏合膜與使用彼之有機電子裝置的包封產物 | |
WO2006104078A1 (ja) | 有機el素子封止用フィルム及び有機el素子の封止構造体 | |
KR101387179B1 (ko) | 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법 | |
WO2014157815A1 (ko) | 유기발광소자 충전제용 열경화형 조성물 및 이를 포함하는 유기발광소자 디스플레이 장치 | |
KR102056598B1 (ko) | 점착제 조성물 | |
KR102189312B1 (ko) | 유기 발광 표시 장치 및 그 제조 방법 | |
KR101374370B1 (ko) | 유기 el 소자용 접착 필름, 이에 포함되는 조성물, 및 이를 포함하는 유기 el 디스플레이 장치 | |
KR20200138705A (ko) | 유기 발광 표시 장치 | |
JP2009062413A (ja) | 接着剤組成物及びダイボンドフィルム | |
KR20120113902A (ko) | 유기 el 디스플레이 장치 및 이에 포함되는 유기 el 소자 봉지용 접착제 조성물 | |
KR102034441B1 (ko) | 점착제 조성물 | |
KR101397692B1 (ko) | 유기 el 디스플레이 장치 및 이에 포함되는 유기 el 소자 봉지용 접착제 조성물 | |
KR20120113471A (ko) | 유기 el 소자용 접착 필름, 이에 포함되는 조성물 및 이를 포함하는 유기 el 소자 | |
KR20150132791A (ko) | 유기발광소자 충전제용 조성물, 이로부터 형성된 유기발광소자 충전용 필름 및 이를 포함하는 유기발광소자 디스플레이 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201380073916.3 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13879869 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14769291 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13879869 Country of ref document: EP Kind code of ref document: A1 |