WO2014157249A1 - 導電性及び応力緩和特性に優れる銅合金板 - Google Patents

導電性及び応力緩和特性に優れる銅合金板 Download PDF

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WO2014157249A1
WO2014157249A1 PCT/JP2014/058362 JP2014058362W WO2014157249A1 WO 2014157249 A1 WO2014157249 A1 WO 2014157249A1 JP 2014058362 W JP2014058362 W JP 2014058362W WO 2014157249 A1 WO2014157249 A1 WO 2014157249A1
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copper alloy
alloy sheet
less
mass
mpa
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PCT/JP2014/058362
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English (en)
French (fr)
Japanese (ja)
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波多野　隆紹
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Jx日鉱日石金属株式会社
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Priority to KR1020147030373A priority Critical patent/KR101631786B1/ko
Priority to CN201480001212.XA priority patent/CN104302794B/zh
Publication of WO2014157249A1 publication Critical patent/WO2014157249A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present invention relates to a copper alloy plate and electronic parts for energization or heat dissipation, and in particular, electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, heat sinks, etc. mounted on electric machines / electronic devices, automobiles and the like.
  • the present invention relates to a copper alloy plate used as a raw material, a manufacturing method thereof, and an electronic component using the copper alloy plate.
  • the present invention relates to a plate, a manufacturing method thereof, and an electronic component using the copper alloy plate.
  • Electrical and electronic equipment, automobiles, etc. have built-in components for conducting electricity or heat, such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, heat sinks, etc. These components are made of copper alloy. It is used. Here, electrical conductivity and thermal conductivity are in a proportional relationship.
  • the copper alloy plate is deflected, and the contact force is obtained by the stress generated by this deflection.
  • the stress that is, the contact force is lowered due to the stress relaxation phenomenon, and the contact electric resistance is increased.
  • the copper alloy is required to be more excellent in conductivity so that the amount of generated heat is reduced, and is also required to be superior in stress relaxation characteristics so that the contact force does not decrease even if heat is generated.
  • a heat radiating part called a liquid crystal frame is used for a liquid crystal of a smartphone or a tablet PC.
  • a copper alloy plate for heat dissipation when stress relaxation characteristics are enhanced, creep deformation of the heat sink due to external force is suppressed, and the protection against liquid crystal components, IC chips, etc. disposed around the heat sink is improved. , Etc. can be expected. For this reason, it is desired that the copper alloy plate for heat dissipation also has excellent stress relaxation characteristics.
  • Examples of materials having high electrical conductivity, relatively high strength, and good stress relaxation characteristics include C15100 (0.1 mass% Zr-residual Cu), C15150 (0.02 mass% Zr-residual Cu), C18140 (0 .1 mass% Zr-0.3 mass% Cr-0.02 mass% Si-residual Cu), C18145 (0.1 mass% Zr-0.2 mass% Cr-0.2 mass% Zn-residual Cu) C18070 (0.1% by mass Ti-0.3% by mass Cr-0.02% by mass Si-residual Cu), C18080 (0.06% by mass Ti-0.5% by mass Cr-0.1% by mass Ag) Alloys such as -0.08 mass% Fe-0.06 mass% Si-residual Cu) are registered in CDA (Copper Development Association).
  • a copper alloy obtained by adding Zr or Ti to Cu (hereinafter referred to as a Cu-Zr-Ti alloy) has relatively good stress relaxation characteristics, but the level of the stress relaxation characteristics is a component that allows a large current to flow. However, it was not always sufficient as an application of a part or a part that dissipates a large amount of heat.
  • a copper alloy plate disclosed in Patent Document 1 0.05 to 0.3% by mass of Zr is added, and Mg, Ti, Zn, Ga, Y, Nb, Mo, Ag, In, and Sn are included.
  • the stress relaxation characteristics were improved by adding 0.01 to 0.3% by mass of one or more of the above and further adjusting the crystal grain size after intermediate annealing to 20 to 100 ⁇ m.
  • the stress relaxation rate after holding for 1000 hours is at least 17.2%.
  • an object of the present invention is to provide a copper alloy plate having high strength, high conductivity, and excellent stress relaxation characteristics, and specifically, a Cu—Zr—Ti system having improved stress relaxation characteristics. It is an object to provide an alloy. Furthermore, another object of the present invention is to provide a method for producing the copper alloy plate and an electronic component suitable for large current use or heat radiation use.
  • the inventor has adjusted Cu—Zr—Ti-based alloys to Cu-Zr—having high strength and high conductivity by adjusting the thermal expansion / contraction ratio in the rolling direction to a predetermined value. It has been found that the stress relaxation characteristics of the Ti-based alloy are improved.
  • the present invention completed on the basis of the above knowledge, in one aspect, contains one or two of Zr and Ti in a total of 0.01 to 0.50 mass%, with the balance consisting of copper and inevitable impurities, It is a copper alloy sheet having a 0.2% proof stress of 330 MPa or more and a thermal expansion / contraction rate in the rolling direction of 50 ppm or less when heated at 250 ° C. for 30 minutes.
  • one or two of Zr and Ti are contained in a total amount of 0.01 to 0.50 mass%, and Ag, Fe, Co, Ni, Cr, Mn, Zn, Mg , Si, P, Sn and B are contained in an amount of 1.0% by mass or less, the balance is made of copper and inevitable impurities, has a 0.2% proof stress of 330 MPa or more, and at 250 ° C. for 30 minutes It is a copper alloy plate whose thermal expansion / contraction rate in the rolling direction when heated is 50 ppm or less.
  • the copper alloy plate according to the present invention has a conductivity of 70% IACS or more, and a stress relaxation rate after holding at 150 ° C. for 1000 hours is 15% or less.
  • the ingot is hot-rolled at a temperature of 800 to 1000 ° C. to a thickness of 3 to 30 mm, and then cold rolling and recrystallization annealing are repeated.
  • a method for producing a copper alloy sheet to be annealed wherein (A) in the recrystallization annealing before the final cold rolling, the furnace temperature is set to 250 to 800 ° C., and the average crystal grain size of the copper alloy sheet is set to 50 ⁇ m or less.
  • the total workability is 25 to 99%, the rolling workability per pass is 20% or less, and (C) a straight annealing furnace is used in the strain relief annealing,
  • the above copper alloy comprising passing the copper alloy plate through an inner temperature of 300 to 700 ° C., a tension applied to the copper alloy plate in the furnace of 1 to 5 MPa, and reducing the 0.2% proof stress by 10 to 50 MPa. It is a manufacturing method of a board.
  • the present invention is a high-current electronic component using the copper alloy plate.
  • the present invention is an electronic component for heat dissipation using the copper alloy plate.
  • a copper alloy plate having high strength, high conductivity, and excellent stress relaxation characteristics, a manufacturing method thereof, and an electronic component suitable for high current use or heat dissipation use.
  • This copper alloy can be suitably used as a material for electronic parts such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, etc., and particularly dissipates the material or the large amount of heat of electronic parts that carry a large current.
  • the copper alloy plate according to the embodiment of the present invention has a conductivity of 70% IACS or more and a 0.2% proof stress of 330 MPa or more. If the electrical conductivity is 70% IASC or more, it can be said that the amount of heat generated when energized is equivalent to that of pure copper. In addition, if the 0.2% proof stress is 330 MPa or more, it can be said that the material has a strength necessary for a material for a component that conducts a large current or a material for a component that dissipates a large amount of heat.
  • the stress relaxation rate of the copper alloy plate (hereinafter referred to as “80% stress of 0.2% proof stress”) is maintained at 150 ° C. for 1000 hours. , Simply referred to as stress relaxation rate) is 15% or less, more preferably 10% or less.
  • the stress relaxation rate of ordinary Cu-Zr-Ti alloys is about 25 to 35%, but by reducing this to 15% or less, the contact force decreases even when a large current is applied after processing the connector. Increase in contact electrical resistance is unlikely to occur, and creep deformation is unlikely to occur even if heat and external force are applied simultaneously after processing into a heat sink.
  • the copper alloy sheet according to the embodiment of the present invention contains one or two of Zr and Ti in total of 0.01 to 0.50% by mass, more preferably 0.02 to 0.20% by mass. .
  • the total of one or two of Zr and Ti is less than 0.01% by mass, it becomes difficult to obtain a 0.2% proof stress of 330 MPa or more and a stress relaxation rate of 15% or less. If the total of one or two of Zr and Ti exceeds 0.5% by mass, it becomes difficult to produce an alloy due to hot rolling cracks or the like.
  • the amount added is preferably adjusted to 0.01 to 0.45 mass%, and when adding Ti, the amount added is adjusted to 0.01 to 0.20 mass%. It is preferable.
  • the addition amount is less than the lower limit value, it is difficult to obtain the effect of improving the stress relaxation characteristics, and when the addition amount exceeds the upper limit value, conductivity and manufacturability may be deteriorated.
  • Cu-Zr-Ti alloy contains at least one of Ag, Fe, Co, Ni, Cr, Mn, Zn, Mg, Si, P, Sn and B in order to improve strength and heat resistance. Can be made. However, if the amount added is too large, the electrical conductivity may be reduced to be less than 70% IACS, or the manufacturability of the alloy may be deteriorated. Therefore, the amount added is preferably 1.0% by mass or less in total. Is 0.5 mass% or less. Moreover, in order to acquire the effect by addition, it is preferable to make addition amount into 0.001 mass% or more in total amount.
  • thermal expansion / contraction rate When heat is applied to a copper alloy plate, a very small dimensional change occurs. This ratio of dimensional change is referred to as “thermal expansion / contraction rate”.
  • the present inventors have found that the stress relaxation rate can be remarkably improved by refining the metal structure of the Cu—Zr—Ti based copper alloy sheet using the thermal expansion / contraction rate as an index.
  • a dimensional change rate in the rolling direction when heated at 250 ° C. for 30 minutes is used as the thermal expansion / contraction rate.
  • the thermal expansion / contraction rate By adjusting the absolute value of the thermal expansion / contraction rate (hereinafter simply referred to as the thermal expansion / contraction rate) to 50 ppm or less, preferably 30 ppm or less, the stress relaxation rate becomes 15% or less.
  • the lower limit value of the thermal expansion / contraction rate is not limited from the viewpoint of the characteristics of the copper alloy sheet, but the thermal expansion / contraction rate is rarely 1 ppm or less.
  • the thickness of the product is preferably 0.1 to 2.0 mm. If the thickness is too thin, the cross-sectional area of the current-carrying part will decrease and heat generation will increase during energization, making it unsuitable as a material for connectors that carry large currents, and because it will deform with a slight external force, It is also unsuitable as a material. On the other hand, if the thickness is too thick, bending becomes difficult. From such a viewpoint, a more preferable thickness is 0.2 to 1.5 mm. When the thickness is in the above range, the bending workability can be improved while suppressing heat generation during energization.
  • the copper alloy plate according to the embodiment of the present invention can be suitably used for applications of electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, etc. used in electric / electronic devices, automobiles and the like.
  • electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, etc. used in electric / electronic devices, automobiles and the like.
  • high current electronic components such as connectors and terminals for high current used in electric vehicles, hybrid vehicles, etc.
  • heat dissipation electronic components such as liquid crystal frames used in smartphones and tablet PCs. is there.
  • recrystallization annealing part or all of the rolled structure is recrystallized. Further, by annealing under appropriate conditions, Zr, Ti, etc. are precipitated, and the electrical conductivity of the alloy is increased. In recrystallization annealing (final recrystallization annealing) before final cold rolling, the average crystal grain size of the copper alloy sheet is adjusted to 50 ⁇ m or less. If the average crystal grain size is too large, it will be difficult to adjust the 0.2% yield strength of the product to 330 MPa or more.
  • the final recrystallization annealing conditions are determined based on the target crystal grain size after annealing and the target product conductivity.
  • the annealing may be performed using a batch furnace or a continuous annealing furnace at a furnace temperature of 250 to 800 ° C.
  • the heating time may be appropriately adjusted within the range of 30 minutes to 30 hours at a furnace temperature of 250 to 600 ° C.
  • a continuous annealing furnace the heating time may be appropriately adjusted within the range of 5 seconds to 10 minutes at a furnace temperature of 450 to 800 ° C.
  • higher conductivity can be obtained with the same crystal grain size.
  • the total workability of final cold rolling and the workability per pass are controlled.
  • the total processing degree R is preferably 25 to 99%. If R is too small, it becomes difficult to adjust the 0.2% proof stress to 330 MPa or more. When R is too large, the edge of the rolled material may be broken.
  • the degree of processing r per pass is preferably 20% or less. If at least one of the passes in which r exceeds 20% is included, it is difficult to adjust the thermal expansion / contraction rate to 50 ppm or less even if strain relief annealing is performed under the conditions described later.
  • the strain relief annealing of the present invention is performed using a continuous annealing furnace.
  • a continuous annealing furnace since the material is heated in a state of being wound in a coil shape, the material is deformed during the heating, and the material is warped. Therefore, the batch furnace is not suitable for the strain relief annealing of the present invention.
  • the furnace temperature is set to 300 to 700 ° C.
  • the heating time is appropriately adjusted in the range of 5 seconds to 10 minutes
  • the 0.2% proof stress after the stress relief annealing is 0.2% before the stress relief annealing.
  • the value is adjusted to a value 10 to 50 MPa lower than the proof stress, preferably 15 to 45 MPa lower.
  • the tension applied to the material in the continuous annealing furnace is adjusted to 1 to 5 MPa, more preferably 1 to 4 MPa.
  • the 0.2% yield strength decrease is too small or too large, the reduction in thermal expansion / contraction due to strain relief annealing becomes insufficient, and it becomes difficult to adjust the thermal expansion / contraction to 50 ppm or less. Moreover, even if tension is too large, reduction of the thermal expansion / contraction rate due to strain relief annealing becomes insufficient, and it becomes difficult to adjust the thermal expansion / contraction rate to 50 ppm or less. On the other hand, if the tension is too small, the material in the passing plate of the annealing furnace may come into contact with the furnace wall, and the surface or edge of the material may be damaged.
  • the heating time was 5 hours
  • the furnace temperature was adjusted in the range of 250 to 700 ° C.
  • the crystal grain size and conductivity after annealing were changed.
  • strain relief annealing using a continuous annealing furnace the furnace temperature was 500 ° C., and the heating time was adjusted from 1 second to 15 minutes, so that the amount of 0.2% proof stress reduction due to strain relief annealing was varied. In addition, various tensions were added to the material in the furnace. In some cases, strain relief annealing was not performed.
  • sample No. 13B specified in JIS Z2241 was taken so that the tensile direction was parallel to the rolling direction, and pulled in parallel with the rolling direction in accordance with JIS Z2241. Tests were performed to determine 0.2% yield strength.
  • test piece was taken from the material after strain relief annealing so that the longitudinal direction of the test piece was parallel to the rolling direction, and the conductivity at 20 ° C. was measured by a four-terminal method in accordance with JIS H0505.
  • Table 1 shows the evaluation results. In the final cold rolling, a plurality of passes were performed, and the maximum value in the degree of processing of each pass is shown.
  • the expression “ ⁇ 10 ⁇ m” in the crystal grain size after the final recrystallization annealing indicates that all of the rolling structure is recrystallized and the average crystal grain size is less than 10 ⁇ m, and that only a part of the rolling structure is recrystallized. Both cases of crystallization are included.
  • the total concentration of Zr and Ti is adjusted to 0.01 to 0.50 mass%, and the crystal grain size is adjusted to 50 ⁇ m or less in the recrystallization annealing before the final cold rolling.
  • the total workability is adjusted to 25 to 99%, and the workability per pass is adjusted to 20% or less.
  • the strain relief annealing the material is passed through the continuous annealing furnace with a tension of 1 to 5 MPa. As a result, the 0.2% proof stress was reduced by 10 to 50 MPa. As a result, the thermal expansion / contraction rate was 50 ppm or less, and a conductivity of 70% IACS or more, a 0.2% proof stress of 330 MPa or more, and a stress relaxation rate of 15% or less were obtained.
  • Comparative Example 1 was not subjected to strain relief annealing, the thermal expansion / contraction rate exceeded 50 ppm, and the stress relaxation rate exceeded 30%.
  • Comparative Examples 2 to 4 although stress relief annealing was performed, the material tension in the furnace exceeded 5 MPa, so the thermal expansion / contraction rate exceeded 50 ppm and the stress relaxation rate exceeded 15%.
  • Comparative Example 11 the total work degree in the final cold rolling was less than 25%, and in Comparative Example 12, the crystal grain size after recrystallization annealing before the final cold rolling exceeded 50 ⁇ m.
  • the 0.2% proof stress was less than 330 MPa.

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  • Chemical & Material Sciences (AREA)
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  • Materials Engineering (AREA)
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  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
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  • Crystallography & Structural Chemistry (AREA)
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PCT/JP2014/058362 2013-03-25 2014-03-25 導電性及び応力緩和特性に優れる銅合金板 WO2014157249A1 (ja)

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KR1020147030373A KR101631786B1 (ko) 2013-03-25 2014-03-25 도전성 및 응력 완화 특성이 우수한 구리 합금판
CN201480001212.XA CN104302794B (zh) 2013-03-25 2014-03-25 导电性及应力松弛特性优异的铜合金板

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JP2013085042A JP5380621B1 (ja) 2013-03-25 2013-04-15 導電性及び応力緩和特性に優れる銅合金板
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JP6207539B2 (ja) * 2015-02-04 2017-10-04 Ｊｘ金属株式会社 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品
CN105088010B (zh) * 2015-08-31 2017-08-25 河南科技大学 一种高强高导稀土铜锆合金及其制备方法
CN105568043A (zh) * 2016-02-03 2016-05-11 安徽华联电缆集团有限公司 一种钪合金高性能电缆
TWI674326B (zh) * 2018-11-19 2019-10-11 財團法人工業技術研究院 銅鋯合金散熱元件及銅鋯合金殼體的製造方法
JP7451964B2 (ja) 2019-01-16 2024-03-19 株式会社プロテリアル Ｃｕ合金板およびその製造方法
CN110527866B (zh) * 2019-09-29 2021-02-05 广东和润新材料股份有限公司 一种高导电高强度铜带及其制备方法
JP7136157B2 (ja) * 2020-06-30 2022-09-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材、電子・電気機器用部品、端子
KR102580589B1 (ko) * 2020-12-28 2023-09-20 주식회사 아모센스 전력반도체 모듈의 제조방법 및 이에 의해 제조된 전력반도체 모듈

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010126783A (ja) * 2008-11-28 2010-06-10 Nippon Mining & Metals Co Ltd 電子材料用銅合金板又は条
JP2010248592A (ja) * 2009-04-17 2010-11-04 Hitachi Cable Ltd 銅合金の製造方法及び銅合金

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
AU2003272276A1 (en) * 2002-09-13 2004-04-30 Olin Corporation Age-hardening copper-base alloy and processing
CN101473056B (zh) * 2006-06-23 2010-12-08 日本碍子株式会社 铜基轧制合金的制造方法
JP5411679B2 (ja) 2009-12-07 2014-02-12 株式会社Ｓｈカッパープロダクツ 銅合金材
CN103080347A (zh) * 2010-08-27 2013-05-01 古河电气工业株式会社 铜合金板材及其制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010126783A (ja) * 2008-11-28 2010-06-10 Nippon Mining & Metals Co Ltd 電子材料用銅合金板又は条
JP2010248592A (ja) * 2009-04-17 2010-11-04 Hitachi Cable Ltd 銅合金の製造方法及び銅合金

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CN104302794B (zh) 2016-08-31
JP5380621B1 (ja) 2014-01-08
KR101631786B1 (ko) 2016-06-17
TW201502291A (zh) 2015-01-16
KR20140148462A (ko) 2014-12-31
CN104302794A (zh) 2015-01-21
TWI521071B (zh) 2016-02-11
JP2014208860A (ja) 2014-11-06

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