WO2014156794A1 - Movable jig for electronic component - Google Patents

Movable jig for electronic component Download PDF

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Publication number
WO2014156794A1
WO2014156794A1 PCT/JP2014/057224 JP2014057224W WO2014156794A1 WO 2014156794 A1 WO2014156794 A1 WO 2014156794A1 JP 2014057224 W JP2014057224 W JP 2014057224W WO 2014156794 A1 WO2014156794 A1 WO 2014156794A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
chip
metal sheet
plate
movable plate
Prior art date
Application number
PCT/JP2014/057224
Other languages
French (fr)
Japanese (ja)
Inventor
田中成
守屋孝麿
Original Assignee
日本フイルコン 株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本フイルコン 株式会社 filed Critical 日本フイルコン 株式会社
Publication of WO2014156794A1 publication Critical patent/WO2014156794A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips

Definitions

  • the present invention relates to a chip-shaped electronic component tray in which the chip-shaped electronic component is stored and fixed vertically in a chip-shaped electronic component insertion portion of the chip-shaped electronic component tray, and the chip-shaped electronic component is stored, transported, printed, processed, and the like. It is about.
  • a chip-shaped small electronic component for example, a minute chip-shaped electronic component having a size of 1 mm ⁇ 0.5 mm ⁇ 0.35 mm (length ⁇ width ⁇ thickness) or smaller, It is difficult to store it in a flat form in a tray and maintain a stable posture without shifting or dropping during printing or transportation. It cannot be stored and fixed with the side face as the bottom or top face.
  • the microchip-shaped electronic component is too small, there is a problem that it is sandwiched between two plates such as a cover plate and a movable plate.
  • chip trays that can be arranged and stored without being fixed. Some of them contain chip-like electronic components vertically. However, it is possible to store the chip-shaped electronic component with the side surface being the bottom surface or the top surface, but in the paste printing process such as solder or silver, the chip-shaped electronic component is transferred when the paste printed from the printing plate is transferred. There was a problem that it itself adhered to the paste on the printing plate side and dropped out of the tray.
  • a small chip-shaped electronic component for example, a small chip-shaped electronic component having a size of 1 mm ⁇ 0.5 mm ⁇ 0.35 mm (length ⁇ width ⁇ thickness) or smaller.
  • the electronic component If the electronic component is to be processed or processed, it must be inserted and fixed vertically in the electronic component insertion part of the chip-shaped electronic component tray with the side surface of the electronic component as the upper surface. Even if it can be stored vertically, it cannot be fixed, or even if it can be fixed, it can only be stored flat. Since the latter is intended for relatively large chip-shaped electronic components, the size of the electronic component insertion portion or the size of the opening of the insertion portion is large.
  • the mechanism is extremely small, such as an extremely small mechanism, it will be stored in the longitudinal direction even if it is sandwiched between the movable plate and the bottom plate, or a small chip-shaped electronic component of various sizes is stored and fixed. It cannot be done, part of it enters diagonally with respect to the opening, and electronic parts that have entered the electronic part in a normal state are not fixed, and can not be stored vertically and fall down or stored vertically Even if it cannot be fixed, it will cause troubles such as adhering to the printing plate side in the printing process on the side surface and dropping off from the insertion part when transporting. As described above, it is very difficult to store and fix the electronic component insertion part in the shape of the long side or short side of the small chip-shaped electronic component with the side face up. Development of a chip-shaped electronic component tray capable of storing and fixing such chip-shaped electronic components with the side surfaces facing up is awaited.
  • An example of a chip-shaped electronic component is a chip capacitor.
  • the general structure of a capacitor is one in which a dielectric is sandwiched between opposing electrodes.
  • charge Q is stored. Even if the power supply line is released and the supply of the voltage V is stopped, the charged state is maintained.
  • the electrodes are connected to each other with a conducting wire or an appropriate load resistance, the stored charge Q is released.
  • C is a proportionality constant and is referred to as an electric capacity C with respect to the charge Q and the voltage V. Since the electric capacity C is also expressed as a capacitance, it may be expressed as a capacitor as a general name of the capacitor.
  • a capacitor is a circuit element that has the property of blocking DC voltage. In order to avoid the fluctuation of the power supply voltage in the electronic circuit, it is used in various electronic circuits such as a bypass capacitor disposed between the power supply line and the ground.
  • chip parts include chip inductors, chip resistors, semiconductor chips such as IC chips and LSI chips, and crystal oscillator parts.
  • chip-shaped electronic components are required to have a shape suitable for enabling high-density mounting on a printed wiring board as a SMD (Surface Mount Device, surface mount component), and a rectangular parallelepiped is suitable. Although it is small in size, it tends to be even smaller, contributing to the recent miniaturization of digital cameras, mobile phones, smartphones, etc., and at the same time being manufactured in units of tens of thousands, production efficiency is extremely important.
  • SMD Surface Mount Device, surface mount component
  • the external dimensions are standardized by Japanese Industrial Standards for each chip-like electronic component. If the dimension symbol of a chip capacitor suitable for surface mounting is 1005, 1.0 mm ⁇ 0.5 mm (length ⁇ width), 0603 If it is 0.6mm x 0.3mm (length x width), similarly, it is not specified in the standard, but if it is a dimension symbol 0402 that is individually determined by the manufacturer, 0.4mm x 0.2mm (length x Width). Table 1 below summarizes the dimensions and corresponding external dimensions of chip-like electronic components that are actually distributed. The thickness is a design matter of the manufacturer.
  • the standard dimensions of the chip capacitors given as examples are, in particular, Japanese Industrial Standards Fixed capacitors for electronic equipment Part 21: General rules by product type: Fixed multilayer ceramic capacitors for surface mounting Type 1 JIS C 5101-21: 2006 Annex A (normative) Dimensional symbols for surface mount fixed multilayer ceramic capacitor type 1 and guidelines on regulations. Known from Appendix A Table 1 Dimensions. FIG. 19 shows Annex A and Annex A FIG. 1 of these Japanese Industrial Standards.
  • a chip-shaped electronic component including the above-described chip capacitor as shown in Table 1 in FIG.
  • the length is 0.6 mm and the width is 0.3 mm, but an error of plus or minus 0.03 mm ( ⁇ 0.03 mm) is allowed for the length, and the width is also plus or minus 0.03 mm.
  • An error of ( ⁇ 0.03 mm) is allowed.
  • chip-like electronic components appear that fall off the tray immediately without being properly stored and fixed.
  • chip-like electronic components are extremely hard and fragile due to the properties of the materials used.
  • a chip-shaped electronic component is easily broken or broken during handling, and such a chip-shaped electronic component is easily damaged particularly when stored and fixed in a tray.
  • a chip-shaped electronic component for example, a chip capacitor called a porcelain capacitor or a ceramic capacitor appears prominently. For this reason, it has been very difficult to store and fix chip-like electronic components that are easily damaged in the tray.
  • Patent Document 1 discloses a method in which a chip-shaped electronic component is inserted into a chip insertion hole in a planar shape and fixed to a corner by an X-axis pressing spring and a Y-axis pressing spring. With this, only flat chip fixing is possible.
  • the known chip dimensions according to the above-mentioned Japanese Industrial Standards and distributed product standards, dimensions corresponding to 1005 or smaller, specifically, dimensions corresponding to 1005, 0603, 0402, 0201, and these dimensions Pay attention to the fact that it is very difficult to store and fix the electronic component insertion part in the shape of the long side or short side of the chip-shaped electronic component with the dimension included in the range, with the side facing up.
  • the present inventors have arrived at the invention of a chip-shaped electronic component tray that can store and fix such a minute chip-shaped electronic component with the side surface as the upper surface.
  • the present invention securely and softly stores and fixes even a small chip-like electronic component that is hard and brittle and that is easily damaged.
  • a method of manufacturing a chip-shaped electronic component tray that can be stored and fixed in an electronic component insertion portion in a shape with a long side or a short side of a minute chip-shaped electronic component that has a side face up. It is for the purpose.
  • the present invention provides: The second metal sheet-like object on which the frame plate of the electronic component tray is formed is superimposed on the first metal sheet-like object on which the bottom plate of the electronic component tray is formed, and the movable plate is inserted into the movable plate insertion portion of the frame plate. Next, the third metal sheet on which the cover plate of the electronic component tray is formed is overlaid, and the bottom plate, the frame plate, and the cover plate are welded at a plurality of locations by spot welding, thereby mounting the chip-shaped electronic component tray.
  • the frame portion of the first metal sheet is provided with a plurality of spot welding positioning holes for the first metal sheet, and the bottom plate is inserted into the movement position restricting hole of the movable plate to move the movable plate back and forth.
  • the frame portion of the second metal sheet is provided with a plurality of spot welding positioning holes for the second metal sheet, and the frame plate has one or more U-shaped movable plate insertion portions.
  • An urging means for urging the movable plate in the direction of the opening end is provided at a portion facing the U-shaped opening end.
  • the movable plate is provided with a plurality of chip-shaped electronic component insertion portions, and a movement position restricting hole is provided so that the movable plate does not protrude from the movable plate insertion portion of the electronic component tray.
  • a buffer member such as a spring that absorbs manufacturing tolerance errors in the dimensions of the chip-shaped electronic component is provided on the long side portion of the opening, and the size of the opening of the chip-shaped electronic component insertion portion is set in the longitudinal direction (long Chip-like electronic component having a length of 3 to 4 times the thickness of the chip-like electronic component and 0.2 to 3 mm, and having a short side length provided on the cover plate The length of the short side of the opening of the insertion part is longer by the size of the buffer member,
  • the frame portion of the third metal sheet is provided with a plurality of spot welding positioning holes for the third metal sheet, and the chip-like electronic component provided on the movable plate is provided on the cover plate of the electronic component tray.
  • the same number of chip-like electronic component insertion portions are provided at the same interval as the insertion portion, and the size of the opening of the chip-like electronic component insertion portion is stored and fixed in the longitudinal direction (long side) in a vertical shape. It is longer than the length of the upper surface or lower surface of the chip-shaped electronic component, and the length of the short side is slightly longer than the thickness of the chip-shaped electronic component to be stored and fixed,
  • the relative position is determined by the spot welding positioning hole of the first metal sheet, the spot welding positioning hole of the second metal sheet, and the spot welding positioning hole of the third metal sheet, and the bottom plate and the frame plate
  • the present invention relates to a chip-shaped electronic component tray manufactured by spot welding a cover plate and a chip-shaped electronic component tray manufactured by such a manufacturing method.
  • any one of the first metal sheet-like material, the second metal sheet-like material, and the third metal sheet-like material may be processed by etching, cutting, electric discharge machining, or laser machining. Or may be machined, such as press working. Further, a metal powder such as powder metallurgy or MIM (Metal Injection Molding) may be molded and sintered. These may be combined.
  • the processing method for each sheet-like material may be selected as appropriate, but the movable plate of the chip-shaped electronic component tray that has been assembled operates smoothly without interfering with the bottom plate, the cover plate, and the frame plate, and The effect of fixing the tip without sticking or loosening must not be disturbed. Further, two or four U-shaped movable plate insertion portions may be provided on the frame plate, and each may be provided with a movable plate.
  • the present invention relates to a chip-shaped electronic component corresponding to a minute chip-shaped electronic component, for example, a chip-shaped electronic component having a size of 1 mm ⁇ 0.5 mm (length, width) to 0.2 mm ⁇ 0.1 mm (length, width).
  • This relates to the component tray.
  • it is necessary to provide a large number of chip-shaped electronic component insertion portions in the chip-shaped electronic component tray.
  • one movable plate is enlarged, it is movable. When the plate is deformed, a gap is created between the cover plate and the movable plate, and in some cases between the movable plate and the bottom plate. May end up.
  • a chip that is housed and fixed in the chip-shaped electronic component insertion portion by providing a buffer member that absorbs the difference in manufacturing tolerance of the chip-shaped electronic component on the long side portion of the opening of the chip-shaped electronic component insertion portion. It is also possible to prevent troubles such as the loose electronic components are not loosened, fall off during processing operations, or stick to the printing ink and come out of the chip-shaped electronic component tray.
  • the thickness of the cover plate and movable plate used can be changed according to the thickness of the minute chip-shaped electronic components to be handled. In this case, several cover pieces of metal sheets are overlapped to form the cover plate.
  • a movable plate may be configured, or a movable plate having a necessary thickness may be configured independently.
  • a chip-shaped electronic component tray that supports minute chip-shaped electronic components, and can improve productivity by storing and fixing the chip-shaped electronic components stored vertically, and the chip-shaped electronic component tray is large.
  • the surface smoothness, the adsorptivity, and the electronic component holding function can be improved without losing rigidity while being improved, and the workability can be improved.
  • FIG. 1 shows a plan view of an example of a chip-shaped electronic component tray of the present invention.
  • FIG. 2 is a partially cutaway view of the chip-shaped electronic component tray of FIG.
  • the cover plate, the movable plate, and the frame plate are partially cut away.
  • FIG. 3 is a sectional view taken along line XX in FIG.
  • FIG. 4 is a plan view of the cover plate formed on the third metal sheet.
  • FIG. 5 shows a plan view of the frame plate formed on the second metal sheet.
  • 6A shows a plan view of the movable plate
  • FIG. 6B shows a partially enlarged view of the chip-like electronic component insertion portion 31 shown in FIG.
  • FIG. 7 shows a plan view of the movable plate of FIG. 6 combined with the frame plate of FIG.
  • FIG. 8 shows a plan view of the bottom plate formed on the first metal sheet.
  • FIG. 9 shows a plan view of another example of the chip-shaped electronic component tray of the present invention.
  • FIG. 10 is a plan view of the cover plate formed on the third metal sheet.
  • FIG. 11 shows a plan view of a frame plate formed on the second metal sheet.
  • FIG. 12 shows a plan view of the movable plate combined with the frame plate of FIG.
  • FIG. 13 is a plan view of the bottom plate formed on the first metal sheet.
  • FIG. 14 shows a plan view of another example of the chip-shaped electronic component tray of the present invention.
  • FIG. 15 shows a plan view of the cover plate formed on the third metal sheet.
  • FIG. 16 shows a plan view of a frame plate formed on the second metal sheet.
  • FIG. 17 shows a plan view of the movable plate combined with the frame plate of FIG.
  • FIG. 18 shows a plan view of the bottom plate formed on the first metal sheet.
  • Figure 19 shows Japan Industrial Standard "Electronic equipment fixed capacitors Part 21: General rules by product type: Surface mount fixed multilayer porcelain capacitor type 1 JIS C1-25101-21: 2006 Annex A (normative) surface mount fixed multilayer ceramic capacitors Type 1 dimension code and guidelines on regulations, Appendix A Table 1 Dimensions are shown.
  • FIG. 1 is a plan view of the chip-shaped electronic component tray 1.
  • 10 indicates a cover plate of the tray
  • 11 indicates a chip-shaped electronic component insertion portion.
  • Reference numeral 30 denotes a movable plate. When the movable plate 30 is physically pushed into the cover plate side, the chip-like electronic component insertion portion 11 of the cover plate and the chip-like electronic component insertion portion 31 provided on the movable plate coincide with each other.
  • the chip-shaped electronic component insertion portion 31 When the chip-shaped electronic component is inserted into the space of the insertion portion and the pushing force applied to the movable plate 30 is released, the chip-shaped electronic component insertion portion 31 is displaced in the open end direction, and the chip-shaped electronic component insertion portion 11 and the chip-shaped electronic component are displaced.
  • the chip-shaped electronic component is fixed by the electronic component insertion portion 31.
  • the chip-shaped electronic component When the chip-shaped electronic component is inserted into the space between the two electronic component insertion portions, the minute chip-shaped electronic component is placed on the cover plate so as to be scattered and simultaneously sucked through the vacuum suction hole 41 of the bottom plate.
  • the chip-like electronic component can be easily stored and fixed in the electronic component insertion portion.
  • FIG. 2 is a partially cutaway view of the electronic component tray 1 shown in FIG. 1.
  • the cover plate, the movable plate, and the frame plate are partially cut away.
  • FIG. 3 is a cross-sectional view of the chip-shaped electronic component tray 1 taken along the line XX of FIG.
  • the place shown in the upper left shows the bottom plate 40 disposed at the bottom of the chip-shaped electronic component tray 1
  • the place shown in the middle is a frame of an intermediate structure of the chip-shaped electronic component tray 1.
  • the plate 20 and the movable plate 30 are shown, and the lowermost part shows the cover plate 10 on the upper surface of the chip-shaped electronic component tray 1, and this cover plate 10 is placed on the upper part of the frame plate 20 and the movable plate 30.
  • This is a three-layer structure.
  • the bottom plate 40 is disposed at the bottom of the three-layer structure, the frame plate 20 and the movable plate 30 are disposed in the middle, and the cover plate 10 is disposed at the top. It is.
  • the frame plate 20 and the movable plate 30 are disposed below the cover plate 10, and the bottom plate 40 is disposed below the frame plate 20 and the movable plate 30.
  • 1 is a chip-shaped electronic component tray
  • 11 is a chip-shaped electronic component insertion portion
  • 30 is a movable plate
  • 20 is a frame plate
  • 28 is a biasing means such as a spring
  • 31 is a chip provided on the movable plate
  • 32 is a moving position restricting hole for restricting the range of forward and backward movement of the movable plate in the movable plate inserting part
  • 41 is a vacuum suction hole provided in the bottom plate
  • 42 is a moving position restricting hole for the movable plate.
  • FIG. 4 shows a plan view of the cover plate 10 formed on the third metal sheet 2.
  • the cover plate 10 is provided with the same number of chip-like electronic component insertion portions 11 at the same interval as the chip-like electronic component insertion portion provided on the movable plate, and the size of the opening of the chip-like electronic component insertion portion is as follows.
  • the length in the longitudinal direction (long side) is longer than the length of the upper or lower surface of the chip-shaped electronic component stored and fixed vertically, and the length of the short side is slightly longer than the thickness of the chip-shaped electronic component to be stored and fixed. It has become.
  • the cover plate 10 formed on the third metal sheet-like object 2 is connected to the frame portion 15 via the bridge 16. In FIG. 4, two bridges 16 per rectangular side of the cover plate 10 are connected and held to the frame portion 15 by a total of eight bridges.
  • the frame portion 15 is provided with spot welding positioning holes 17 for spot welding three members of the cover plate 10, the frame plate 20 and the bottom plate 40.
  • FIG. 5 shows a plan view of the frame plate 20 formed on the second metal sheet 3.
  • the frame plate 20 is provided with a U-shaped movable plate insertion portion 24, and a biasing means 28 such as a spring is provided at a portion facing the U-shaped opening end portion 24a.
  • a biasing means 28 such as a spring is provided at a portion facing the U-shaped opening end portion 24a.
  • the movable plate 30 is urged toward the movable plate opening end.
  • the frame plate 20 is connected to the frame portion 25 via a bridge 26.
  • the frame portion 25 is provided with spot welding positioning holes 27 for spot welding three members of the cover plate 10, the frame plate 20, and the bottom plate 40.
  • FIG. 6 a shows the movable plate 30.
  • the movable plate 30 is mounted on the movable plate insertion portion 24, and a plurality of electronic component insertion portions 31 are provided, and a movement position restricting hole 32 is provided so that the movable plate 30 does not protrude from the movable plate insertion portion 24 of the electronic component tray. It has been.
  • a protrusion 42 provided on the bottom plate 40 enters the movement position restricting hole 32 so that the movable plate 30 can move back and forth in the movable plate insertion portion 24 and the movable plate 30 is movable plate insertion portion 24. It is designed not to jump out more.
  • FIG. 6 b shows a partially enlarged view of the chip-shaped electronic component insertion portion 31.
  • a buffer member 31a that absorbs a difference in manufacturing tolerance of minute chip-shaped electronic components is provided on the long side portion of the opening of the chip-shaped electronic component insertion portion 31, and is accommodated and fixed in the chip-shaped electronic component insertion portion. It is possible to prevent troubles such as chipping electronic components not loosening and falling off during a processing operation, or sticking to a printing paste or ink and coming out of a chipping electronic component tray.
  • FIG. 7 shows a plan view of the movable plate of FIG. 6 combined with the frame plate of FIG. In such a state, when the chip-shaped electronic component tray 1 is manufactured by spot welding, it is placed on the upper surface of the bottom plate 40 formed on the first metal sheet-like material 5 in FIG. Become.
  • FIG. 8 shows a plan view of the bottom plate 40 formed on the first metal sheet-like material 5.
  • the bottom plate 40 is provided with a plurality of vacuum suction holes 41, which serve to assist in inserting chip-shaped electronic components into the electronic component insertion portion 11 and the electronic component insertion portion 31 by vacuum suction through the vacuum suction holes 41. ing.
  • the number of vacuum suction holes 41 is at least equal to the number of chip-shaped electronic component insertion portions 31 provided in the movable plate, and is provided in the region of the opening of the chip-shaped electronic component insertion portion 31.
  • a projection 42 is provided on the bottom plate 40, and this projection 42 enters the movement position restricting hole 32 of the movable plate 30 so that the movable plate 30 can move back and forth within the movable plate insertion portion 24. At the same time, the movable plate 30 is prevented from jumping out of the movable plate insertion portion 24.
  • the bottom plate 40 is connected to the frame portion 45 of the first metal sheet-like material 5 via a bridge 46.
  • the frame portion 45 is provided with spot welding positioning holes 47 for spot welding the three members of the cover plate 10, the frame plate 20, and the bottom plate 40.
  • a manufacturing method of the chip-shaped electronic component tray 1 will be described with reference to FIGS.
  • a bottom plate 40 is formed on the first metal sheet 5 shown in FIG. 8 and is coupled to the frame portion 45 via a plurality of bridges 46.
  • the frame portion 45 is provided with a plurality of spot welding positioning holes 47, and the spot welding positioning holes 27 provided in the frame portion 25 of the second metal sheet 3 and the frame portion of the first metal sheet 2.
  • the bottom plate 40, the frame plate 20, and the cover plate 10 are positioned so that spot welding can be performed at the spot welding locations 19, 29, and 49 in cooperation with the spot welding positioning hole 17.
  • a frame plate 20 is formed on the second metal sheet 3 shown in FIG. 5 and is coupled to the frame portion 25 via a plurality of bridges 26.
  • the frame portion 25 is provided with a plurality of spot welding positioning holes 27.
  • the movable plate 30 is attached to the movable plate insertion portion 24 of the frame plate 20, and an urging means 28 such as a spring for urging the movable plate 24 in the direction of the opening end 24a is attached.
  • FIG. 6 shows a plan view of the movable plate 30.
  • 31 indicates an electronic component insertion portion.
  • Reference numeral 32 denotes a movement position restricting hole, and a protrusion 42 provided on a bottom plate 40 arranged below the movable plate 30 enters the movement position restricting hole 32, and the movable plate 30 is a movable plate insertion portion of the frame plate 20. The distance of the back and forth movement within 24 is restricted and it does not jump out of the movable plate insertion part 24.
  • FIG. 7 shows a plan view of the movable plate 30 inserted into the movable plate insertion portion 24 of the frame plate 20 shown in FIG.
  • 20 is a frame plate
  • 28 is an urging means provided on the frame plate 20, which urges the movable plate toward the open end of the movable plate insertion portion.
  • Reference numeral 31 denotes a chip-shaped electronic component insertion portion
  • 32 denotes a movement position restricting hole
  • 25 denotes a frame portion of the metal sheet 7
  • 26 denotes a bridge connecting the frame plate 20 and the frame portion 25.
  • the second metal sheet 3 shown in FIG. 5 is stacked on the first metal sheet 5 shown in FIG. 8, and then the movable plate 30 shown in FIG. It is inserted and mounted on the movable plate insertion portion 34 of the frame plate 20 formed in the metal sheet, and the third metal sheet 2 is placed on this upper surface.
  • a fixing tool is inserted into the spot welding positioning holes 17, 27, 47 formed in the respective metal sheet-like objects, and the respective positions are aligned and fixed so as not to move.
  • the cover plate 10, the frame plate 20, and the bottom surface Spot welding is performed on the necessary portions of the plate 40 to be spot welded (spot welded portions 19, 29, 49), and the plates 40 are integrated and assembled.
  • the assembled chip-shaped electronic component tray is separated from the bridges 16, 26, 46 to form a single unit. What is assembled in this way is a chip-shaped electronic component tray 1 shown in FIG.
  • FIG. 9 shows another example of the chip-shaped electronic component tray of the present invention.
  • two movable plate insertion portions are provided side by side on the frame plate, and the movable plates are respectively attached to the movable plate insertion portions.
  • 101 is a chip-shaped electronic component tray
  • 110 is a cover plate
  • 111 is a chip-shaped electronic component insertion portion provided on the cover plate
  • 130 is a movable plate. Since the movable plate 130 is urged toward the open end 124a of the movable plate insertion portion 124 by the urging means 128 provided on the frame plate 120, the end portion of the movable plate is the cover plate as shown in FIG. It sticks out more.
  • the manufacturing method of the chip-shaped electronic component tray 101 is performed by the same procedure as the manufacturing method of the chip-shaped electronic component tray 1. This manufacturing method will be briefly described with reference to FIGS.
  • FIG. 10 shows the third metal sheet 102.
  • the cover plate 110 formed on the metal sheet 102 is coupled to the frame portion 115 via the bridge 116.
  • the cover plate 110 is provided with a plurality of chip-shaped electronic component insertion portions 111. Spot welding positioning holes 117 are formed in the frame portion 115. Reference numeral 119 denotes a spot-welded portion.
  • FIG. 11 shows the second metal sheet 103.
  • the frame plate 120 formed on the metal sheet 103 is coupled to the frame portion 125 via the bridge 126.
  • the frame plate 120 is provided with a biasing means 128 for biasing the movable plate in the direction of the opening end as in the other examples.
  • a spot welding positioning hole 127 is formed in the frame part 125, and 129 indicates a spot where the frame plate 120 is spot welded.
  • two movable plate insertion portions 124 are formed in the frame plate 120 so that two movable plates can be inserted.
  • 124 a is an open end of the movable plate insertion portion 124.
  • 12 is a view in which a movable plate 130 similar to that in FIG. 6 is mounted on the movable plate insertion portion 124 shown in FIG.
  • FIG. 13 shows the first metal sheet 105.
  • the bottom plate 140 formed on the metal sheet 105 is coupled to the frame portion 145 via a bridge 146.
  • the bottom plate 140 has a vacuum suction hole 141 for inserting a chip-like electronic component into the chip-like electronic component insertion portion and a protrusion for entering the movement position restricting hole 132 of the movable plate 130 and restricting the moving range of the movable plate.
  • a portion 142 is provided.
  • Reference numeral 149 denotes a spot welded portion.
  • the second metal sheet 103 shown in FIG. 11 is overlaid on the first metal sheet 105 shown in FIG. 13, and then the movable plate 130 having the same structure as the movable plate shown in FIG.
  • the third metal sheet 102 is mounted on the movable plate insertion portion 124 of the frame plate 120 formed on the metal sheet.
  • a fixing tool is inserted into the spot welding positioning holes 117, 127, and 147 formed in the respective metal sheet-like materials, and the respective positions are aligned and fixed so as not to move.
  • the cover plate 110, the frame plate 120, and the bottom surface Spot welding is performed on the necessary portions (spot welded portions 119, 129, and 149) of the plate 140 to be integrated.
  • the assembled chip-shaped electronic component tray is separated from the bridges 116, 126, and 146 to form a single unit. What is assembled in this manner is a chip-shaped electronic component tray 1012 shown in FIG.
  • FIG. 14 shows another example of the chip-shaped electronic component tray of the present invention.
  • four movable plate insertion portions are provided on the frame plate, and the movable plates are respectively attached to the movable plate insertion portions.
  • 201 is a chip-shaped electronic component tray
  • 210 is a cover plate
  • 211 is a chip-shaped electronic component insertion portion provided on the cover plate
  • 230 is a movable plate.
  • the movable plate 230 is urged toward the open end 224a of the movable plate insertion portion 224 by the urging means 228 provided on the frame plate 220, so that the end of the movable plate is the cover plate as shown in FIG. It sticks out more.
  • the manufacturing method of the chip-shaped electronic component tray 201 is performed by the same procedure as the manufacturing method of the chip-shaped electronic component tray 1. This manufacturing method will be briefly described with reference to FIGS.
  • FIG. 15 shows a third metal sheet 202.
  • the cover plate 210 formed on the metal sheet 202 is coupled to the frame portion 215 via the bridge 216.
  • the cover plate 210 is provided with a plurality of chip-shaped electronic component insertion portions 211.
  • Spot welding positioning holes 217 are formed in the frame portion 215.
  • Reference numeral 219 denotes a spot welded portion.
  • FIG. 16 shows the second metal sheet 203.
  • the frame plate 220 formed on the metal sheet 203 is coupled to the frame portion 225 via a bridge 226.
  • the frame plate 220 is provided with a biasing means 228 that biases the movable plate toward the opening end.
  • a spot welding positioning hole 227 is formed in the frame portion 225, and 229 indicates a spot where the frame plate 220 is spot welded.
  • four movable plate insertion portions 224 are formed in the frame plate 220 so that the four movable plates can be inserted.
  • 224a is an open end of the movable plate insertion portion 224.
  • 17 is a diagram in which a movable plate 230 similar to that in FIG. 6 is attached to the movable plate insertion portion 224 shown in FIG.
  • FIG. 18 shows the first metal sheet 205.
  • the bottom plate 240 formed on the metal sheet 205 is coupled to the frame portion 245 via a bridge 246.
  • the bottom plate 240 has a vacuum suction hole 241 for inserting a chip-like electronic component into the chip-like electronic component insertion portion, and a protrusion for entering the movement position restricting hole 232 of the movable plate 230 and restricting the moving range of the movable plate.
  • a part 242 is provided.
  • Reference numeral 249 denotes a spot welded portion.
  • the second metal sheet 203 shown in FIG. 16 is stacked on the first metal sheet 205 shown in FIG. 18, and then the movable plate 230 having the same structure as the movable plate shown in FIG.
  • the third metal sheet 202 is placed on the movable plate insertion portion 224 of the frame plate 220 formed on the metal sheet 203 and mounted thereon.
  • a fixture is inserted into the spot welding positioning holes 217, 227, and 247 formed in the respective metal sheet-like materials, and the respective positions are aligned and fixed so as not to move.
  • the cover plate 210, the frame plate 220, and the bottom surface Spot welding is performed to integrate the necessary portions (spot welded portions 219, 229, and 249) of the plate 240 to be spot welded.
  • the assembled chip-shaped electronic component tray is separated from the bridges 216, 226, and 246 to form a single unit. What is assembled in this manner is a chip-shaped electronic component tray 201 shown in FIG.

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Abstract

When minute electronic chip components were stored/fixed in electronic chip component trays and machined or processed, in addition to being extremely small, many were hard and brittle and were easily damaged. Moreover, it was extremely difficult to manufacture trays capable of storing/fixing the minute electronic chip components in electronic chip component insertion sections in a form in which the side surface of a long side or a short side of the electronic chip component was facing upward. The present invention relates to a method for manufacturing electronic chip component trays by: stacking a second metal sheet, on which a frame plate is formed, on a first metal sheet, on which a bottom surface plate is formed; mounting a movable plate in the movable plate insertion section of the frame plate; stacking a third metal sheet on which a cover plate is formed; and welding the bottom surface plate, the frame plate and the cover plate by spot welding in multiple places.

Description

電子部品可動治具Electronic component movable jig
　本発明は、チップ状電子部品トレイのチップ状電子部品挿入部にチップ状電子部品を縦型に収納固定して、チップ状電子部品の保管、運搬、印刷、処理などを行うチップ状電子部品トレイに関するものである。 The present invention relates to a chip-shaped electronic component tray in which the chip-shaped electronic component is stored and fixed vertically in a chip-shaped electronic component insertion portion of the chip-shaped electronic component tray, and the chip-shaped electronic component is stored, transported, printed, processed, and the like. It is about.
　従来、電子部品の可動治具ないし電子部品トレイと呼ばれるものは、電子部品を平面状に収納するものがほとんどである。たとえば、電子部品挿入穴に収納した場合にその大きさに応じてＸ軸方向とＹ軸方向から挿入穴の角隅に固定できるようになっており、このため、可動枠プレートも２つの軸方向から付勢手段により角隅に電子部品を固定できるようになっている（たとえば、特許文献１参照。）。 Conventionally, most of the so-called electronic component movable jigs or electronic component trays store electronic components in a flat shape. For example, when it is stored in the electronic component insertion hole, it can be fixed to the corner of the insertion hole from the X-axis direction and the Y-axis direction according to its size. The electronic parts can be fixed to the corners by the biasing means (see, for example, Patent Document 1).
　しかしながら、このような構造ではチップ状の小型の電子部品、たとえば１ｍｍ×０．５ｍｍ×０．３５ｍｍ（長さ×幅×厚さ）あるいはそれ以下のサイズのような微小なチップ状電子部品を、平面状にトレイに収納し、印刷時や搬送時にずれや脱落せずに安定した姿勢を保持することは困難であるし、ましてこのようなチップ状電子部品を縦状、すなわちチップ状電子部品の側面を底面あるいは上面にして収納固定することはできない。また、微小チップ状電子部品が、小さすぎるためカバープレートと可動プレートなどの２つのプレートに挟まれてしまうなどの問題も生じる。 However, in such a structure, a chip-shaped small electronic component, for example, a minute chip-shaped electronic component having a size of 1 mm × 0.5 mm × 0.35 mm (length × width × thickness) or smaller, It is difficult to store it in a flat form in a tray and maintain a stable posture without shifting or dropping during printing or transportation. It cannot be stored and fixed with the side face as the bottom or top face. In addition, since the microchip-shaped electronic component is too small, there is a problem that it is sandwiched between two plates such as a cover plate and a movable plate.
　その他にも固定をせずに整列し収納するチップトレイは各種存在する。その中には、縦状にチップ状電子部品を収納するものもある。しかしながら、チップ状電子部品の側面を底面あるいは上面にして収納することは可能であるが、はんだや銀などのペースト印刷工程において、印刷版より刷り出されたペーストが転写する際にチップ状電子部品そのものが印刷版側のペーストに付着し、トレーより脱落してしまうなどの問題が生じていた。 There are various other chip trays that can be arranged and stored without being fixed. Some of them contain chip-like electronic components vertically. However, it is possible to store the chip-shaped electronic component with the side surface being the bottom surface or the top surface, but in the paste printing process such as solder or silver, the chip-shaped electronic component is transferred when the paste printed from the printing plate is transferred. There was a problem that it itself adhered to the paste on the printing plate side and dropped out of the tray.
特開２００６－１２８５８５号公報JP 2006-128585 A
　このように、チップ状の小型の電子部品、たとえば１ｍｍ×０．５ｍｍ×０．３５ｍｍ（長さ×幅×厚さ）あるいはそれ以下のサイズのような微小なチップ状電子部品の側面に印刷したり、処理を施したりしようとする場合には、電子部品の側面を上面にして縦状にチップ状電子部品トレイの電子部品挿入部に挿入固定しなければならないが、従来のチップ状電子部品トレイは、縦状に収納できても固定ができないか、固定はできても平面状にしか収納できなかった。後者は比較的大型のチップ状電子部品を対象とするために、電子部品挿入部の大きさ、あるいは挿入部の開口の大きさが大きく、このものを単純に小型にすることは、チップの押さえ機構を極端に小型化するなど構造的に無理が生じるし、可動プレートと底面プレートの間に挟まってしまうとか各種の大きさの微小なチップ状電子部品を収納固定しようとしても長手方向にちゃんと収納できず、一部が開口に対して斜めに入り込んでしまい、電子部品挿入部に正規の状態で入り込んだ電子部品が固定されず、縦状に収納できずに倒れてしまったり、縦状に収納しても固定ができずに側面への印刷工程で印刷版側に付着したり、運搬しようとするときに挿入部から脱落してしまうなどの障害が生じる。
　このように、微小なチップ状電子部品の長辺あるいは短辺の、側面を上面に立てた形状に電子部品挿入部に収納・固定することは、非常に困難であるところから、このような微小なチップ状電子部品を側面を上面にして収納・固定することができるチップ状電子部品トレイの開発が待たれている。 In this way, printing is performed on the side surface of a small chip-shaped electronic component, for example, a small chip-shaped electronic component having a size of 1 mm × 0.5 mm × 0.35 mm (length × width × thickness) or smaller. If the electronic component is to be processed or processed, it must be inserted and fixed vertically in the electronic component insertion part of the chip-shaped electronic component tray with the side surface of the electronic component as the upper surface. Even if it can be stored vertically, it cannot be fixed, or even if it can be fixed, it can only be stored flat. Since the latter is intended for relatively large chip-shaped electronic components, the size of the electronic component insertion portion or the size of the opening of the insertion portion is large. If the mechanism is extremely small, such as an extremely small mechanism, it will be stored in the longitudinal direction even if it is sandwiched between the movable plate and the bottom plate, or a small chip-shaped electronic component of various sizes is stored and fixed. It cannot be done, part of it enters diagonally with respect to the opening, and electronic parts that have entered the electronic part in a normal state are not fixed, and can not be stored vertically and fall down or stored vertically Even if it cannot be fixed, it will cause troubles such as adhering to the printing plate side in the printing process on the side surface and dropping off from the insertion part when transporting.
As described above, it is very difficult to store and fix the electronic component insertion part in the shape of the long side or short side of the small chip-shaped electronic component with the side face up. Development of a chip-shaped electronic component tray capable of storing and fixing such chip-shaped electronic components with the side surfaces facing up is awaited.
　チップ状電子部品の一例としてチップコンデンサが挙げられる。コンデンサの一般的な構造は、対向する電極で誘電体を挟んだものである。対向電極に電圧Ｖを印加すると電荷Ｑを蓄える。給電線を解放し電圧Ｖの供給を止めても蓄電状態を保持するが、それぞれの電極間を導線または適当な負荷抵抗で接続すると、蓄えた電荷Ｑを放出する特性がある。このとき、電荷Ｑは電圧Ｖと比例関係にあり、Ｑ＝ＣＶと表される。Ｃは比例定数であり、電荷Ｑや電圧Ｖに対して電気容量Ｃと言う。電気容量Ｃは、キャパシタンス（ｃａｐａｃｉｔａｎｃｅ）とも表現されることから、コンデンサの一般的呼称としてキャパシター（Ｃａｐａｃｉｔｏｒ）と表現することもある。 An example of a chip-shaped electronic component is a chip capacitor. The general structure of a capacitor is one in which a dielectric is sandwiched between opposing electrodes. When voltage V is applied to the counter electrode, charge Q is stored. Even if the power supply line is released and the supply of the voltage V is stopped, the charged state is maintained. However, when the electrodes are connected to each other with a conducting wire or an appropriate load resistance, the stored charge Q is released. At this time, the charge Q is proportional to the voltage V, and is expressed as Q = CV. C is a proportionality constant and is referred to as an electric capacity C with respect to the charge Q and the voltage V. Since the electric capacity C is also expressed as a capacitance, it may be expressed as a capacitor as a general name of the capacitor.
　また、コンデンサは直流電圧を遮る特性を備えた回路素子である。電子回路における電源電圧の変動を避ける為に、電源供給線とグラウンドの間にバイパスコンデンサとして配設されるなど、多様な電子回路に用いられる。 Also, a capacitor is a circuit element that has the property of blocking DC voltage. In order to avoid the fluctuation of the power supply voltage in the electronic circuit, it is used in various electronic circuits such as a bypass capacitor disposed between the power supply line and the ground.
　その他のチップ部品としてはチップインダクター、チップ抵抗、ＩＣチップやＬＳＩチップなどの半導体チップ、水晶発振器部品などが挙げられる。 Other chip parts include chip inductors, chip resistors, semiconductor chips such as IC chips and LSI chips, and crystal oscillator parts.
　これらのチップ状電子部品は、ＳＭＤ（Ｓｕｒｆａｃｅ　Ｍｏｕｎｔ　Ｄｅｖｉｃｅ，表面実装部品)としてプリント配線板上に高密度実装を可能とするために適した形状が求められ、直方体などが適しており、外形寸法は小型だが更に小さくなる傾向にあり、最近のデジタルカメラや携帯電話、スマートフォンなどの軽薄短小化に寄与すると同時に、数万個単位で製造されるなど、生産効率が極めて重要となっている。 These chip-shaped electronic components are required to have a shape suitable for enabling high-density mounting on a printed wiring board as a SMD (Surface Mount Device, surface mount component), and a rectangular parallelepiped is suitable. Although it is small in size, it tends to be even smaller, contributing to the recent miniaturization of digital cameras, mobile phones, smartphones, etc., and at the same time being manufactured in units of tens of thousands, production efficiency is extremely important.
　外形寸法はチップ状電子部品ごとに日本工業規格において規格化されており、表面実装に適したチップコンデンサの寸法記号が１００５であれば１．０ｍｍ×０．５ｍｍ（長さ×幅）、０６０３であれば０．６ｍｍ×０．３ｍｍ（長さ×幅）、同様に規格上は明示されていないが製造者が個別に定められる寸法記号０４０２であれば０．４ｍｍ×０．２ｍｍ（長さ×幅）となる。その他を含め、実際に流通しているチップ状電子部品の寸法記号と対応する外形寸法は下記の表1のようにまとめられる。また、厚さについては製造者の設計事項である。 The external dimensions are standardized by Japanese Industrial Standards for each chip-like electronic component. If the dimension symbol of a chip capacitor suitable for surface mounting is 1005, 1.0 mm × 0.5 mm (length × width), 0603 If it is 0.6mm x 0.3mm (length x width), similarly, it is not specified in the standard, but if it is a dimension symbol 0402 that is individually determined by the manufacturer, 0.4mm x 0.2mm (length x Width). Table 1 below summarizes the dimensions and corresponding external dimensions of chip-like electronic components that are actually distributed. The thickness is a design matter of the manufacturer.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　例として挙げたチップコンデンサの規格寸法は、具体的には、日本工業規格　電子機器用固定コンデンサ第２１部：品種別通則：表面実装用固定積層磁器コンデンサ種類１　JIS C 5101-21:2006　附属書A（規定）表面実装用固定積層磁器コンデンサ種類１の寸法記号及び規定に関する指針　付属書A表1　寸法　により公知である。
　これらの日本工業規格の附属書Aおよび附属書A図1を図１９に示す。 The standard dimensions of the chip capacitors given as examples are, in particular, Japanese Industrial Standards Fixed capacitors for electronic equipment Part 21: General rules by product type: Fixed multilayer ceramic capacitors for surface mounting Type 1 JIS C 5101-21: 2006 Annex A (normative) Dimensional symbols for surface mount fixed multilayer ceramic capacitor type 1 and guidelines on regulations. Known from Appendix A Table 1 Dimensions.
FIG. 19 shows Annex A and Annex A FIG. 1 of these Japanese Industrial Standards.
　上述のようなチップコンデンサを含めてチップ状電子部品では、製造する際にその指定された寸法であっても許容される寸法誤差が図１９の表１の寸法のところでみるように、たとえば、０６０３Mであれば長さが０．６ｍｍ、幅が０．３ｍｍであるが、長さについてはプラスマイナス０．０３ｍｍ（±０．０３ｍｍ）の誤差が許容され、同様に幅についてもプラスマイナス０．０３ｍｍ（±０．０３ｍｍ）の誤差が許容されることとなっている。しかしながら、この許容される誤差の範囲内の製品であっても、チップ状電子部品をトレイに収納・固定しようとしても実際には緩んだ状態で固定されるものがでてきてしまい、すべての電子部品がちゃんと収納固定されることがなく、すぐにトレイから脱落してしまうチップ状電子部品がでてくるという問題が生じる。この問題は、微小なチップ状電子部品であればあるほど許容される誤差範囲内のものであっても、たとえば０．６ｍｍマイナス０．０３ｍｍのものはちゃんと収納・固定が困難であるためトレイから脱落しやすいなどの微小化に伴う問題が生じる。このために、たとえば、０．６ｍｍのものについてみると、０．６ｍｍ＋０．０３ｍｍの長さのものから０．６ｍｍ－０．０３ｍｍの範囲内のすべてのチップ状電子部品をトレイに収納・固定する必要があるものの、このようなトレイを製造することはきわめて困難であった。 In a chip-shaped electronic component including the above-described chip capacitor, as shown in Table 1 in FIG. In this case, the length is 0.6 mm and the width is 0.3 mm, but an error of plus or minus 0.03 mm (± 0.03 mm) is allowed for the length, and the width is also plus or minus 0.03 mm. An error of (± 0.03 mm) is allowed. However, even if the product is within the allowable error range, even if it is attempted to store and fix the chip-shaped electronic component in the tray, it is actually fixed in a loose state. There is a problem in that chip-like electronic components appear that fall off the tray immediately without being properly stored and fixed. Even if the problem is within the permissible error range for a minute chip-shaped electronic component, for example, the one with 0.6 mm minus 0.03 mm is difficult to store and fix properly. Problems associated with miniaturization, such as being easy to drop off, occur. For this reason, for example, in the case of 0.6 mm, all chip-shaped electronic components within the range of 0.6 mm + 0.03 mm to 0.6 mm−0.03 mm are stored and fixed in the tray. Although necessary, it was extremely difficult to produce such a tray.
さらに、微小なチップ状電子部品の中には、使用されている材料の性質上非常に硬くもろいものがある。このようなチップ状電子部品は取扱中に割れたり壊れたりしやすく、このようなチップ状電子部品は、とくにトレイに収納・固定する際に破損しやすいものである。このようなチップ状電子部品としては、たとえばチップコンデンサのうち磁器コンデンサあるいはセラミックコンデンサとよばれるものなどで顕著に現れる。このようなことから、破損しやすいチップ状電子部品をトレイに収納・固定することは非常に困難であった。 Furthermore, some of the small chip-like electronic components are extremely hard and fragile due to the properties of the materials used. Such a chip-shaped electronic component is easily broken or broken during handling, and such a chip-shaped electronic component is easily damaged particularly when stored and fixed in a tray. As such a chip-shaped electronic component, for example, a chip capacitor called a porcelain capacitor or a ceramic capacitor appears prominently. For this reason, it has been very difficult to store and fix chip-like electronic components that are easily damaged in the tray.
　また、従来技術では、たとえば、特許文献１に、チップ状電子部品をチップ挿入孔に平面状に挿入し、Ｘ軸押さえバネとＹ軸押さえバネにより角隅に固定する方法が開示されているが、これでは平面的なチップ固定しかできない。特に、上記日本工業規格や流通する製品規格により公知のチップ寸法において、１００５に該当する寸法、あるいはそれ以下の寸法、具体的には１００５、０６０３、０４０２、０２０１に該当する寸法、及びこれらの寸法範囲に含まれる寸法の微小なチップ状電子部品の長辺あるいは短辺の、側面を上面に立てた形状に電子部品挿入部に収納・固定することは、非常に困難であるところに着目して鋭意検討した結果、このような微小なチップ状電子部品を、側面を上面にして収納・固定することができるチップ状電子部品トレイの発明に至った。 In the prior art, for example, Patent Document 1 discloses a method in which a chip-shaped electronic component is inserted into a chip insertion hole in a planar shape and fixed to a corner by an X-axis pressing spring and a Y-axis pressing spring. With this, only flat chip fixing is possible. In particular, in the known chip dimensions according to the above-mentioned Japanese Industrial Standards and distributed product standards, dimensions corresponding to 1005 or smaller, specifically, dimensions corresponding to 1005, 0603, 0402, 0201, and these dimensions Pay attention to the fact that it is very difficult to store and fix the electronic component insertion part in the shape of the long side or short side of the chip-shaped electronic component with the dimension included in the range, with the side facing up. As a result of intensive studies, the present inventors have arrived at the invention of a chip-shaped electronic component tray that can store and fix such a minute chip-shaped electronic component with the side surface as the upper surface.
　本発明は、硬くてしかももろく破損しやすい微小なチップ状電子部品であっても、しかもその上許容される範囲すべてにわたる寸法の大きさ長さ幅のものをしっかりとしかもソフトに収納・固定することができ、そのうえ微小なチップ状電子部品の長辺あるいは短辺の、側面を上面に立てた形状に電子部品挿入部に収納・固定することができるチップ状電子部品トレイの製造方法を提供することを目的とするものである。 The present invention securely and softly stores and fixes even a small chip-like electronic component that is hard and brittle and that is easily damaged. A method of manufacturing a chip-shaped electronic component tray that can be stored and fixed in an electronic component insertion portion in a shape with a long side or a short side of a minute chip-shaped electronic component that has a side face up. It is for the purpose.
　このようなチップ状電子部品トレイの製造方法として、本発明は、
電子部品トレイの底面プレートが形成された第１の金属シート状物に電子部品トレイの枠プレートが形成された第２の金属シート状物を重ね合わせ、この枠プレートの可動プレート挿入部に可動プレートを装着し、ついで、電子部品トレイのカバープレートが形成された第３の金属シートを重ね合わせ、底面プレートと枠プレートとカバープレートをスポット溶接により複数箇所で溶接することによりチップ状電子部品トレイを製造する方法において、
第１の金属シート状物のフレーム部には、複数の第１の金属シート状物のスポット溶接位置決め穴が設けられ、底面プレートには、可動プレートの移動位置規制穴に挿入され可動プレート前後動の範囲を規制する突起部と複数個の真空吸引孔が設けられ、
第２の金属シート状物のフレーム部には、複数の第２の金属シート状物のスポット溶接位置決め穴が設けられ、枠プレートには、１または２以上のコ字形状の可動プレート挿入部が設けられ、かつコ字形状の開口端部と対向する部位に可動プレートを開口端部方向に付勢する付勢手段が設けられており、
可動プレートには、複数個のチップ状電子部品挿入部が設けられ、可動プレートが電子部品トレイの可動プレート挿入部より飛び出さないように移動位置規制穴が設けられ、チップ状電子部品挿入部の開口部の長辺部にはチップ状電子部品の寸法の製造許容の誤差を吸収するバネなどの緩衝部材が設けられ、さらにチップ状電子部品挿入部の開口部の大きさは、長手方向（長辺）の長さがチップ状電子部品の厚みの３倍ないし４倍の長さであって、かつ０．２ｍｍないし３ｍｍであり、短辺の長さがカバープレートに設けられたチップ状電子部品挿入部の開口部の短辺の長さより緩衝部材の大きさ分だけ長くなっており、
第３の金属シート状物のフレーム部には、複数の第３の金属シート状物のスポット溶接位置決め穴が設けられ、電子部品トレイのカバープレートには、可動プレートに設けられたチップ状電子部品挿入部と同じ間隔で同数のチップ状電子部品挿入部が設けられ、しかもこのチップ状電子部品挿入部の開口部の大きさは、長手方向（長辺）の長さは縦状に収納固定したチップ状電子部品の上面または下面の長さより長く、短辺の長さは収納固定するチップ状電子部品の厚みよりやや長いものであり、
　第１の金属シート状物のスポット溶接位置決め穴と第２の金属シート状物のスポット溶接位置決め穴と第３の金属シート状物のスポット溶接位置決め穴により相対位置を決定して底面プレートと枠プレートとカバープレートをスポット溶接することを特徴とするチップ状電子部品トレイの製造方法
　およびこのような製造方法によって製造されたチップ状電子部品トレイに関するものである。 As a method for manufacturing such a chip-shaped electronic component tray, the present invention provides:
The second metal sheet-like object on which the frame plate of the electronic component tray is formed is superimposed on the first metal sheet-like object on which the bottom plate of the electronic component tray is formed, and the movable plate is inserted into the movable plate insertion portion of the frame plate. Next, the third metal sheet on which the cover plate of the electronic component tray is formed is overlaid, and the bottom plate, the frame plate, and the cover plate are welded at a plurality of locations by spot welding, thereby mounting the chip-shaped electronic component tray. In the manufacturing method,
The frame portion of the first metal sheet is provided with a plurality of spot welding positioning holes for the first metal sheet, and the bottom plate is inserted into the movement position restricting hole of the movable plate to move the movable plate back and forth. Protrusions and a plurality of vacuum suction holes that regulate the range of
The frame portion of the second metal sheet is provided with a plurality of spot welding positioning holes for the second metal sheet, and the frame plate has one or more U-shaped movable plate insertion portions. An urging means for urging the movable plate in the direction of the opening end is provided at a portion facing the U-shaped opening end.
The movable plate is provided with a plurality of chip-shaped electronic component insertion portions, and a movement position restricting hole is provided so that the movable plate does not protrude from the movable plate insertion portion of the electronic component tray. A buffer member such as a spring that absorbs manufacturing tolerance errors in the dimensions of the chip-shaped electronic component is provided on the long side portion of the opening, and the size of the opening of the chip-shaped electronic component insertion portion is set in the longitudinal direction (long Chip-like electronic component having a length of 3 to 4 times the thickness of the chip-like electronic component and 0.2 to 3 mm, and having a short side length provided on the cover plate The length of the short side of the opening of the insertion part is longer by the size of the buffer member,
The frame portion of the third metal sheet is provided with a plurality of spot welding positioning holes for the third metal sheet, and the chip-like electronic component provided on the movable plate is provided on the cover plate of the electronic component tray. The same number of chip-like electronic component insertion portions are provided at the same interval as the insertion portion, and the size of the opening of the chip-like electronic component insertion portion is stored and fixed in the longitudinal direction (long side) in a vertical shape. It is longer than the length of the upper surface or lower surface of the chip-shaped electronic component, and the length of the short side is slightly longer than the thickness of the chip-shaped electronic component to be stored and fixed,
The relative position is determined by the spot welding positioning hole of the first metal sheet, the spot welding positioning hole of the second metal sheet, and the spot welding positioning hole of the third metal sheet, and the bottom plate and the frame plate The present invention relates to a chip-shaped electronic component tray manufactured by spot welding a cover plate and a chip-shaped electronic component tray manufactured by such a manufacturing method.
　ここで、第１の金属シート状物、第２の金属シート状物あるいは第３の金属シート状物のいずれかがエッチングにより加工したものであってもよいし、切削加工、放電加工、レーザー加工やプレス加工などの、機械加工されたものでもよい。さらには、粉末冶金やＭＩＭ （Ｍｅｔal　Ｉｎｊｅｃｔｉｏｎ　Ｍｏｌｄｉｎｇ）などの金属粉末を成形して焼結したものでもよい。これらを組み合わせてもよい。各シート状物の加工方法は適宜選択すればよいが、組み立てが完了したチップ状電子部品トレイの可動プレートが、底面プレート、カバープレートや枠プレートと干渉せず滑らかに動作し、かつ、がたつきや弛みなくチップを固定する効果が妨げられてはならない。さらに、枠プレートに２個あるいは４個のコ字形状の可動プレート挿入部が設けられ、それぞれに可動プレートが装着されたものであってもよい。 Here, any one of the first metal sheet-like material, the second metal sheet-like material, and the third metal sheet-like material may be processed by etching, cutting, electric discharge machining, or laser machining. Or may be machined, such as press working. Further, a metal powder such as powder metallurgy or MIM (Metal Injection Molding) may be molded and sintered. These may be combined. The processing method for each sheet-like material may be selected as appropriate, but the movable plate of the chip-shaped electronic component tray that has been assembled operates smoothly without interfering with the bottom plate, the cover plate, and the frame plate, and The effect of fixing the tip without sticking or loosening must not be disturbed. Further, two or four U-shaped movable plate insertion portions may be provided on the frame plate, and each may be provided with a movable plate.
　本発明は、微小なチップ状電子部品、たとえば１ｍｍ×０．５ｍｍ（長さ、幅）ないし０．２ｍｍ×０．１ｍｍ（長さ、幅）のようなチップ状電子部品に対応したチップ状電子部品トレイに関するものである。
　微小なチップ状電子部品を取り扱うものであるために、チップ状電子部品トレイには、多数のチップ状電子部品挿入部を設ける必要があるが、一つの可動プレートを大きくしてしまうと、可動する際プレートに変形が生じるなどし、カバープレートと可動プレートの間に、場合では可動プレートと底面プレートの間にも間隙が生じ、この間隙に収納・固定するべき微小なチップ状電子部品が入り込んでしまうことがある。このような場合を回避するために図９や図１４に示すような可動プレートを複数使用することにより可動プレートの大きさを調整して、各プレート間に間隙が生じることがないようにする必要がある。このようにすることにより、チップ状電子部品挿入部にバネなどの付勢手段による均等な力をかけることが容易となるとともに底面プレートに設けられた真空吸引孔から吸引してチップ状電子部品をチップ状電子部品挿入部に収納する際に、吸気が漏れてしまい、カバープレートの表面が凸凹してしまうことも生じなくなる。
　さらに、チップ状電子部品挿入部の開口部の長辺部にはチップ状電子部品の製造許容寸法の差を吸収する緩衝部材を設けることにより、チップ状電子部品挿入部に収納・固定されたチップ状電子部品を緩みなく、かつ処理操作中などに抜け落ちたり、印刷インキに張り付いてチップ状電子部品トレイから抜けてしまうなどの障害も防止することができる。 The present invention relates to a chip-shaped electronic component corresponding to a minute chip-shaped electronic component, for example, a chip-shaped electronic component having a size of 1 mm × 0.5 mm (length, width) to 0.2 mm × 0.1 mm (length, width). This relates to the component tray.
In order to handle minute chip-shaped electronic components, it is necessary to provide a large number of chip-shaped electronic component insertion portions in the chip-shaped electronic component tray. However, if one movable plate is enlarged, it is movable. When the plate is deformed, a gap is created between the cover plate and the movable plate, and in some cases between the movable plate and the bottom plate. May end up. In order to avoid such a case, it is necessary to adjust the size of the movable plate by using a plurality of movable plates as shown in FIGS. 9 and 14 so that no gap is generated between the plates. There is. By doing so, it becomes easy to apply an equal force by a biasing means such as a spring to the chip-shaped electronic component insertion portion, and the chip-shaped electronic component is sucked from the vacuum suction hole provided in the bottom plate. When housed in the chip-shaped electronic component insertion portion, intake air leaks and the surface of the cover plate is not uneven.
Further, a chip that is housed and fixed in the chip-shaped electronic component insertion portion by providing a buffer member that absorbs the difference in manufacturing tolerance of the chip-shaped electronic component on the long side portion of the opening of the chip-shaped electronic component insertion portion. It is also possible to prevent troubles such as the loose electronic components are not loosened, fall off during processing operations, or stick to the printing ink and come out of the chip-shaped electronic component tray.
　また、取り扱う微小なチップ状電子部品の厚みに応じて使用するカバープレートや可動プレートの厚みを変化させることができるが、この場合に金属シート状物の薄いものを何枚か重ね合せてカバープレートや可動プレートを構成してもよいし、必要な厚さのものを単独で構成してもよい。 In addition, the thickness of the cover plate and movable plate used can be changed according to the thickness of the minute chip-shaped electronic components to be handled. In this case, several cover pieces of metal sheets are overlapped to form the cover plate. A movable plate may be configured, or a movable plate having a necessary thickness may be configured independently.
　微小なチップ状電子部品に対応したチップ状電子部品トレイであり、縦状に収納したチップ状電子部品を収納・固定することにより生産性を向上させることができるとともに、チップ状電子部品トレイが大型化されながらも剛性を失うことなく、表面平滑性、吸着性、電子部品保持機能を向上させることができ、作業性を向上させることができる。 A chip-shaped electronic component tray that supports minute chip-shaped electronic components, and can improve productivity by storing and fixing the chip-shaped electronic components stored vertically, and the chip-shaped electronic component tray is large. The surface smoothness, the adsorptivity, and the electronic component holding function can be improved without losing rigidity while being improved, and the workability can be improved.
図１は、本発明のチップ状電子部品トレイの１例の平面図を示す。FIG. 1 shows a plan view of an example of a chip-shaped electronic component tray of the present invention. 図２は、図１のチップ状電子部品トレイの一部切り欠き図を示す。ここでは、カバープレート、可動プレートと枠プレートのそれぞれを一部切り欠いて示してある。FIG. 2 is a partially cutaway view of the chip-shaped electronic component tray of FIG. Here, the cover plate, the movable plate, and the frame plate are partially cut away. 図３は、図１におけるＸ－Ｘ線の断面図を示す。FIG. 3 is a sectional view taken along line XX in FIG. 図４は、第３の金属シート状物に形成されたカバープレートの平面図を示す。FIG. 4 is a plan view of the cover plate formed on the third metal sheet. 図５は、第２の金属シート状物に形成された枠プレートの平面図を示す。FIG. 5 shows a plan view of the frame plate formed on the second metal sheet. 図６のａ図は、可動プレートの平面図を示し、ｂ図はａ図のチップ状電子部品挿入部３１の部分拡大図を示す。6A shows a plan view of the movable plate, and FIG. 6B shows a partially enlarged view of the chip-like electronic component insertion portion 31 shown in FIG. 図７は、図６の可動プレートを図５の枠プレートに組み合わせたものの平面図を示す。FIG. 7 shows a plan view of the movable plate of FIG. 6 combined with the frame plate of FIG. 図８は、第１の金属シート状物に形成された底面プレートの平面図を示す。FIG. 8 shows a plan view of the bottom plate formed on the first metal sheet. 図９は、本発明のチップ状電子部品トレイの別の例の平面図を示す。FIG. 9 shows a plan view of another example of the chip-shaped electronic component tray of the present invention. 図１０は、第３の金属シート状物に形成されたカバープレートの平面図を示す。FIG. 10 is a plan view of the cover plate formed on the third metal sheet. 図１１は、第２の金属シート状物に形成された枠プレートの平面図を示す。FIG. 11 shows a plan view of a frame plate formed on the second metal sheet. 図１２は、可動プレートを図１１の枠プレートに組み合わせたものの平面図を示す。FIG. 12 shows a plan view of the movable plate combined with the frame plate of FIG. 図１３は、第１の金属シート状物に形成された底面プレートの平面図を示す。FIG. 13 is a plan view of the bottom plate formed on the first metal sheet. 図１４は、本発明のチップ状電子部品トレイの他の例の平面図を示す。FIG. 14 shows a plan view of another example of the chip-shaped electronic component tray of the present invention. 図１５は、第３の金属シート状物に形成されたカバープレートの平面図を示す。FIG. 15 shows a plan view of the cover plate formed on the third metal sheet. 図１６は、第２の金属シート状物に形成された枠プレートの平面図を示す。FIG. 16 shows a plan view of a frame plate formed on the second metal sheet. 図１７は、可動プレートを図１６の枠プレートに組み合わせたものの平面図を示す。FIG. 17 shows a plan view of the movable plate combined with the frame plate of FIG. 図１８は、第１の金属シート状物に形成された底面プレートの平面図を示す。FIG. 18 shows a plan view of the bottom plate formed on the first metal sheet. 図１９は、日本工業規格「電子機器用固定コンデンサ第２１部：品種別通則：表面実装用固定積層磁器コンデンサ種類１　JIS　C 5101-21:2006　附属書A（規定）表面実装用固定積層磁器コンデンサ種類１の寸法記号及び規定に関する指針　付属書A表1　寸法」を示す。Figure 19 shows Japan Industrial Standard "Electronic equipment fixed capacitors Part 21: General rules by product type: Surface mount fixed multilayer porcelain capacitor type 1 JIS C1-25101-21: 2006 Annex A (normative) surface mount fixed multilayer ceramic capacitors Type 1 dimension code and guidelines on regulations, Appendix A Table 1 Dimensions are shown.
　以下では、本発明の実施の形態を図を使用して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
　本発明のチップ状電子部品トレイの１例を図１に示す。図１は、チップ状電子部品トレイ１の平面図である。ここで、１０はトレイのカバープレートを、１１はチップ状電子部品挿入部を示す。３０は可動プレートを示す。可動プレート３０をカバープレート側に物理的に押し込むとカバープレートのチップ状電子部品挿入部１１と可動プレートに設けられたチップ状電子部品挿入部３１とが一致し、この一致した両チップ状電子部品挿入部の空間にチップ状電子部品が挿入され、可動プレート３０に加えられた押し込む力を解放するとチップ状電子部品挿入部３１が開放端部方向にずれ、チップ状電子部品挿入部１１とチップ状電子部品挿入部３１でチップ状電子部品が固定される。
チップ状電子部品を両電子部品挿入部の空間に挿入する場合には、カバープレート上に微小なチップ状電子部品をばら撒くようにして置くと同時に底面プレートの真空吸引孔４１を介して吸引するとチップ状電子部品を電子部品挿入部に容易に収納・固定することができる。 An example of the chip-shaped electronic component tray of the present invention is shown in FIG. FIG. 1 is a plan view of the chip-shaped electronic component tray 1. Here, 10 indicates a cover plate of the tray, and 11 indicates a chip-shaped electronic component insertion portion. Reference numeral 30 denotes a movable plate. When the movable plate 30 is physically pushed into the cover plate side, the chip-like electronic component insertion portion 11 of the cover plate and the chip-like electronic component insertion portion 31 provided on the movable plate coincide with each other. When the chip-shaped electronic component is inserted into the space of the insertion portion and the pushing force applied to the movable plate 30 is released, the chip-shaped electronic component insertion portion 31 is displaced in the open end direction, and the chip-shaped electronic component insertion portion 11 and the chip-shaped electronic component are displaced. The chip-shaped electronic component is fixed by the electronic component insertion portion 31.
When the chip-shaped electronic component is inserted into the space between the two electronic component insertion portions, the minute chip-shaped electronic component is placed on the cover plate so as to be scattered and simultaneously sucked through the vacuum suction hole 41 of the bottom plate. The chip-like electronic component can be easily stored and fixed in the electronic component insertion portion.
　図１に示すチップ状電子部品トレイ１の構造は、図２および図３図に示すものである。図２は図１に示す電子部品トレイ１の部分切り欠き図であり、ここでは、カバープレート、可動プレートと枠プレートのそれぞれを一部切り欠いて示してある。図３は図１のＸ－Ｘ線のチップ状電子部品トレイ１の断面図を示す。
　図２では、左上方に示した箇所がチップ状電子部品トレイ１の一番下に配置された底面プレート４０を示し、中間部に示した箇所がチップ状電子部品トレイ１の中間の構造の枠プレート２０と可動プレート３０を示し、一番下に記載した部分がチップ状電子部品トレイ１の上面のカバープレート１０を示し、このカバープレート１０が枠プレート２０と可動プレート３０の上部にのっている構造の３層構造である。 The structure of the chip-shaped electronic component tray 1 shown in FIG. 1 is as shown in FIGS. FIG. 2 is a partially cutaway view of the electronic component tray 1 shown in FIG. 1. Here, the cover plate, the movable plate, and the frame plate are partially cut away. FIG. 3 is a cross-sectional view of the chip-shaped electronic component tray 1 taken along the line XX of FIG.
In FIG. 2, the place shown in the upper left shows the bottom plate 40 disposed at the bottom of the chip-shaped electronic component tray 1, and the place shown in the middle is a frame of an intermediate structure of the chip-shaped electronic component tray 1. The plate 20 and the movable plate 30 are shown, and the lowermost part shows the cover plate 10 on the upper surface of the chip-shaped electronic component tray 1, and this cover plate 10 is placed on the upper part of the frame plate 20 and the movable plate 30. This is a three-layer structure.
　図３では３層構造の下部に配置されているのが底面プレート４０であり、中間に配置されているのが枠プレート２０と可動プレート３０であり、上部に配置されているのがカバープレート１０である。
　ここで、カバープレート１０の下には、枠プレート２０と可動プレート３０が配置され、その下には、底面プレート４０が配置されている。
これらの図において、１はチップ状電子部品トレイ、１１はチップ状電子部品挿入部、３０は可動プレート、２０は枠プレート、２８はバネなどの付勢手段、３１は可動プレートに設けられたチップ状電子部品挿入部、３２は可動プレートが可動プレート挿入部内での前後動の範囲を規制する移動位置規制穴、４１は底面プレートに設けられた真空吸引孔、４２は可動プレートの移動位置規制穴に挿入され可動プレート前後動の範囲を規制する突起部、をそれぞれ示す。 In FIG. 3, the bottom plate 40 is disposed at the bottom of the three-layer structure, the frame plate 20 and the movable plate 30 are disposed in the middle, and the cover plate 10 is disposed at the top. It is.
Here, the frame plate 20 and the movable plate 30 are disposed below the cover plate 10, and the bottom plate 40 is disposed below the frame plate 20 and the movable plate 30.
In these drawings, 1 is a chip-shaped electronic component tray, 11 is a chip-shaped electronic component insertion portion, 30 is a movable plate, 20 is a frame plate, 28 is a biasing means such as a spring, 31 is a chip provided on the movable plate 32 is a moving position restricting hole for restricting the range of forward and backward movement of the movable plate in the movable plate inserting part, 41 is a vacuum suction hole provided in the bottom plate, and 42 is a moving position restricting hole for the movable plate. Each of the projections inserted into the plate and restricts the range of back and forth movement of the movable plate is shown.
　図４は、第３の金属シート状物２に形成されたカバープレート１０の平面図を示す。
　カバープレート１０には、可動プレートに設けられたチップ状電子部品挿入部と同じ間隔で同数のチップ状電子部品挿入部１１が設けられ、しかもこのチップ状電子部品挿入部の開口部の大きさは、長手方向（長辺）の長さは縦状に収納固定したチップ状電子部品の上面または下面の長さより長く、短辺の長さは収納固定するチップ状電子部品の厚みよりやや長いものとなっている。
　第３の金属シート状物２に形成されたカバープレート１０は、フレーム部１５とブリッジ１６を介して連結している。この図４ではカバープレート１０の長方形の１辺あたり２つのブリッジ１６で、合計８つのブリッジによりフレーム部１５と連結され保持されている。フレーム部１５には、カバープレート１０と枠プレート２０と底面プレート４０の３部材をスポット溶接するためのスポット溶接位置決め穴１７が設けられている。 FIG. 4 shows a plan view of the cover plate 10 formed on the third metal sheet 2.
The cover plate 10 is provided with the same number of chip-like electronic component insertion portions 11 at the same interval as the chip-like electronic component insertion portion provided on the movable plate, and the size of the opening of the chip-like electronic component insertion portion is as follows. The length in the longitudinal direction (long side) is longer than the length of the upper or lower surface of the chip-shaped electronic component stored and fixed vertically, and the length of the short side is slightly longer than the thickness of the chip-shaped electronic component to be stored and fixed. It has become.
The cover plate 10 formed on the third metal sheet-like object 2 is connected to the frame portion 15 via the bridge 16. In FIG. 4, two bridges 16 per rectangular side of the cover plate 10 are connected and held to the frame portion 15 by a total of eight bridges. The frame portion 15 is provided with spot welding positioning holes 17 for spot welding three members of the cover plate 10, the frame plate 20 and the bottom plate 40.
　図５は、第２の金属シート状物３に形成された枠プレート２０の平面図を示す。
枠プレート２０にはコ字形状の可動プレート挿入部２４が設けられ、かつコ字形状の開口端部２４ａと対向する部位にはバネなどの付勢手段２８が設けられ、可動プレート３０をコ字形状の可動プレート挿入部２４に装着した場合に、この可動プレート３０を可動プレート開口端部方向に付勢する作用を果たすものである。
この枠プレート２０は、フレーム部２５とブリッジ２６を介して連結している。フレーム部２５には、カバープレート１０と枠プレート２０と底面プレート４０の３部材をスポット溶接するためのスポット溶接位置決め穴２７が設けられている。 FIG. 5 shows a plan view of the frame plate 20 formed on the second metal sheet 3.
The frame plate 20 is provided with a U-shaped movable plate insertion portion 24, and a biasing means 28 such as a spring is provided at a portion facing the U-shaped opening end portion 24a. When mounted on the movable plate insertion portion 24 having a shape, the movable plate 30 is urged toward the movable plate opening end.
The frame plate 20 is connected to the frame portion 25 via a bridge 26. The frame portion 25 is provided with spot welding positioning holes 27 for spot welding three members of the cover plate 10, the frame plate 20, and the bottom plate 40.
　図６のａ図は可動プレート３０を示す。可動プレート３０は可動プレート挿入部２４に装着され、複数の電子部品挿入部３１が設けられるとともに可動プレート３０が電子部品トレイの可動プレート挿入部２４より飛び出さないように移動位置規制穴３２が設けられている。この移動位置規制穴３２に底面プレート４０に設けられた突起部４２が入り込み、可動プレート３０が可動プレート挿入部２４内を前後に移動できるようになっているとともに可動プレート３０が可動プレート挿入部２４より飛び出さないようになっている。
　図６のｂ図は、チップ状電子部品挿入部３１の部分拡大図を示す。チップ状電子部品挿入部３１の開口部の長辺部には微小なチップ状電子部品の製造許容寸法の差を吸収する緩衝部材３１ａが設けられ、チップ状電子部品挿入部に収納・固定されたチップ状電子部品を緩みなく、かつ処理操作中などに抜け落ちたり、印刷ペーストやインキに張り付いてチップ状電子部品トレイから抜けてしまうなどの障害を防止することができる。 FIG. 6 a shows the movable plate 30. The movable plate 30 is mounted on the movable plate insertion portion 24, and a plurality of electronic component insertion portions 31 are provided, and a movement position restricting hole 32 is provided so that the movable plate 30 does not protrude from the movable plate insertion portion 24 of the electronic component tray. It has been. A protrusion 42 provided on the bottom plate 40 enters the movement position restricting hole 32 so that the movable plate 30 can move back and forth in the movable plate insertion portion 24 and the movable plate 30 is movable plate insertion portion 24. It is designed not to jump out more.
FIG. 6 b shows a partially enlarged view of the chip-shaped electronic component insertion portion 31. A buffer member 31a that absorbs a difference in manufacturing tolerance of minute chip-shaped electronic components is provided on the long side portion of the opening of the chip-shaped electronic component insertion portion 31, and is accommodated and fixed in the chip-shaped electronic component insertion portion. It is possible to prevent troubles such as chipping electronic components not loosening and falling off during a processing operation, or sticking to a printing paste or ink and coming out of a chipping electronic component tray.
　図７は、図６の可動プレートを図５の枠プレートに組み合わせたものの平面図を示す。このような状態で、チップ状電子部品トレイ１をスポット溶接により溶接して製造する場合に図８の第１の金属シート状物５に形成された底面プレート４０の上面に載置されることになる。 FIG. 7 shows a plan view of the movable plate of FIG. 6 combined with the frame plate of FIG. In such a state, when the chip-shaped electronic component tray 1 is manufactured by spot welding, it is placed on the upper surface of the bottom plate 40 formed on the first metal sheet-like material 5 in FIG. Become.
　図８は、第１の金属シート状物５に形成された底面プレート４０の平面図を示す。
底面プレート４０には複数の真空吸引孔４１が設けられ、チップ状電子部品をこの真空吸引孔４１を介して真空吸引により電子部品挿入部１１と電子部品挿入部３１に挿入する補助する役目を負っている。真空吸引孔４１は少なくとも可動プレートに設けられたチップ状電子部品挿入部３１と同数でかつチップ状電子部品挿入部３１の開口の領域内に設けられる。また、底面プレート４０に突起部４２が設けられ、この突起部４２が可動プレート３０の移動位置規制穴３２に入り込み、可動プレート３０が可動プレート挿入部２４内を前後に移動できるようになっているとともに可動プレート３０が可動プレート挿入部２４より飛び出さないようになっている。
底面プレート４０は、第１の金属シート状物５のフレーム部４５とブリッジ４６を介して連結している。フレーム部４５には、カバープレート１０と枠プレート２０と底面プレート４０の３部材をスポット溶接するためのスポット溶接位置決め穴４７が設けられている。 FIG. 8 shows a plan view of the bottom plate 40 formed on the first metal sheet-like material 5.
The bottom plate 40 is provided with a plurality of vacuum suction holes 41, which serve to assist in inserting chip-shaped electronic components into the electronic component insertion portion 11 and the electronic component insertion portion 31 by vacuum suction through the vacuum suction holes 41. ing. The number of vacuum suction holes 41 is at least equal to the number of chip-shaped electronic component insertion portions 31 provided in the movable plate, and is provided in the region of the opening of the chip-shaped electronic component insertion portion 31. Further, a projection 42 is provided on the bottom plate 40, and this projection 42 enters the movement position restricting hole 32 of the movable plate 30 so that the movable plate 30 can move back and forth within the movable plate insertion portion 24. At the same time, the movable plate 30 is prevented from jumping out of the movable plate insertion portion 24.
The bottom plate 40 is connected to the frame portion 45 of the first metal sheet-like material 5 via a bridge 46. The frame portion 45 is provided with spot welding positioning holes 47 for spot welding the three members of the cover plate 10, the frame plate 20, and the bottom plate 40.
チップ状電子部品トレイ１の製造方法を図４ないし図８を用いて説明する。
　図８に示す第１の金属シート状物５には、底面プレート４０が形成され、フレーム部４５と複数のブリッジ４６を介して結合されている。フレーム部４５には複数のスポット溶接位置決め穴４７が設けられ、第２の金属シート状物３のフレーム部２５に設けられているスポット溶接位置決め穴２７および第１の金属シート状物２のフレーム部１５に設けられているスポット溶接位置決め穴１７と協働して底面プレート４０と枠プレート２０およびカバープレート１０の三者がスポット溶接される箇所１９、２９、４９でスポット溶接できるように位置決めされる。
　図５に示す第２の金属シート状物３には、枠プレート２０が形成され、フレーム部２５と複数のブリッジ２６を介して結合されている。フレーム部２５には複数のスポット溶接位置決め穴２７が設けられている。この枠プレート２０の可動プレート挿入部２４に可動プレート３０を装着するが、可動プレート２４を開口端部２４ａ方向に付勢するためのバネなどの付勢手段２８を装着する。 A manufacturing method of the chip-shaped electronic component tray 1 will be described with reference to FIGS.
A bottom plate 40 is formed on the first metal sheet 5 shown in FIG. 8 and is coupled to the frame portion 45 via a plurality of bridges 46. The frame portion 45 is provided with a plurality of spot welding positioning holes 47, and the spot welding positioning holes 27 provided in the frame portion 25 of the second metal sheet 3 and the frame portion of the first metal sheet 2. 15, the bottom plate 40, the frame plate 20, and the cover plate 10 are positioned so that spot welding can be performed at the spot welding locations 19, 29, and 49 in cooperation with the spot welding positioning hole 17. .
A frame plate 20 is formed on the second metal sheet 3 shown in FIG. 5 and is coupled to the frame portion 25 via a plurality of bridges 26. The frame portion 25 is provided with a plurality of spot welding positioning holes 27. The movable plate 30 is attached to the movable plate insertion portion 24 of the frame plate 20, and an urging means 28 such as a spring for urging the movable plate 24 in the direction of the opening end 24a is attached.
　図６に可動プレート３０の平面図を示す。ここで、３１は電子部品挿入部を示す。３２は移動位置規制穴を示し、この移動位置規制穴３２に可動プレート３０の下部に配置された底面プレート４０に設けられた突起部４２が入り込み、可動プレート３０が枠プレート２０の可動プレート挿入部２４内での前後動の距離を規制するとともに可動プレート挿入部２４から飛び出さないようにしている。
　図７は可動プレート３０を図５に示す枠プレート２０の可動プレート挿入部２４に入れ込んだものの平面図を示す。ここで、２０は枠プレート、２８は枠プレート２０に設けられた付勢手段であって、可動プレートを可動プレート挿入部の開放端部側に付勢するものである。３１はチップ状電子部品挿入部、３２は移動位置規制穴、２５は金属シート状物７のフレーム部、２６は枠プレート２０とフレーム部２５とをつなぐブリッジを示す。 FIG. 6 shows a plan view of the movable plate 30. Here, 31 indicates an electronic component insertion portion. Reference numeral 32 denotes a movement position restricting hole, and a protrusion 42 provided on a bottom plate 40 arranged below the movable plate 30 enters the movement position restricting hole 32, and the movable plate 30 is a movable plate insertion portion of the frame plate 20. The distance of the back and forth movement within 24 is restricted and it does not jump out of the movable plate insertion part 24.
FIG. 7 shows a plan view of the movable plate 30 inserted into the movable plate insertion portion 24 of the frame plate 20 shown in FIG. Here, 20 is a frame plate, and 28 is an urging means provided on the frame plate 20, which urges the movable plate toward the open end of the movable plate insertion portion. Reference numeral 31 denotes a chip-shaped electronic component insertion portion, 32 denotes a movement position restricting hole, 25 denotes a frame portion of the metal sheet 7, and 26 denotes a bridge connecting the frame plate 20 and the frame portion 25.
　上述のように、まず、図８に示す第１の金属シート状物５の上に図５に示す第２の金属シート状物３を重ね、ついで、図６に示す可動プレート３０を第２の金属シート状物に形成された枠プレート２０の可動プレート挿入部３４に挿入・装着し、さらにこの上面に第３の金属シート状物２を載置する。ついでそれぞれの金属シート状物に形成されているスポット溶接位置決め穴１７、２７、４７に固定具を挿入しそれぞれの位置合わせをして動かないように固定し、カバープレート１０と枠プレート２０と底面プレート４０のそれぞれのスポット溶接するべき必要箇所（スポット溶接される箇所１９，２９，４９）をスポット溶接して一体化して組み立てる。最後に、組み立てられたチップ状電子部品トレイをブリッジ１６、２６、４６から切り離して単体とする。このようにして組み立てられたものが図１に示されるチップ状電子部品トレイ１である。 As described above, first, the second metal sheet 3 shown in FIG. 5 is stacked on the first metal sheet 5 shown in FIG. 8, and then the movable plate 30 shown in FIG. It is inserted and mounted on the movable plate insertion portion 34 of the frame plate 20 formed in the metal sheet, and the third metal sheet 2 is placed on this upper surface. Next, a fixing tool is inserted into the spot welding positioning holes 17, 27, 47 formed in the respective metal sheet-like objects, and the respective positions are aligned and fixed so as not to move. The cover plate 10, the frame plate 20, and the bottom surface Spot welding is performed on the necessary portions of the plate 40 to be spot welded (spot welded portions 19, 29, 49), and the plates 40 are integrated and assembled. Finally, the assembled chip-shaped electronic component tray is separated from the bridges 16, 26, 46 to form a single unit. What is assembled in this way is a chip-shaped electronic component tray 1 shown in FIG.
　図９に本発明のチップ状電子部品トレイの別の例を示す。本例は、枠プレートに２つの可動プレート挿入部が並んで設けられており、この可動プレート挿入部にそれぞれ可動プレートが装着されている。図９において、１０１はチップ状電子部品トレイ、１１０はカバープレート、１１１はカバープレートに設けられたチップ状電子部品挿入部、１３０は可動プレートをそれぞれ示す。可動プレート１３０は、枠プレート１２０に設けられた付勢手段１２８により可動プレート挿入部１２４の開放端部１２４ａに向けて付勢されているので図９にみるように可動プレートの端部がカバープレートよりはみ出している。
このチップ状電子部品トレイ１０１の製造方法は、チップ状電子部品トレイ１の製造方法と同じ手順により行われる。この製造方法を図１０ないし図１３を用いて簡略に説明する。 FIG. 9 shows another example of the chip-shaped electronic component tray of the present invention. In this example, two movable plate insertion portions are provided side by side on the frame plate, and the movable plates are respectively attached to the movable plate insertion portions. In FIG. 9, 101 is a chip-shaped electronic component tray, 110 is a cover plate, 111 is a chip-shaped electronic component insertion portion provided on the cover plate, and 130 is a movable plate. Since the movable plate 130 is urged toward the open end 124a of the movable plate insertion portion 124 by the urging means 128 provided on the frame plate 120, the end portion of the movable plate is the cover plate as shown in FIG. It sticks out more.
The manufacturing method of the chip-shaped electronic component tray 101 is performed by the same procedure as the manufacturing method of the chip-shaped electronic component tray 1. This manufacturing method will be briefly described with reference to FIGS.
　図１０は、第３の金属シート状物１０２を示す。ここで、金属シート状物１０２に形成されたカバープレート１１０は、フレーム部１１５にブリッジ１１６を介して結合している。カバープレート１１０には複数のチップ状電子部品挿入部１１１が設けられている。
フレーム部１１５にはスポット溶接位置決め穴１１７が形成されている。１１９はスポット溶接される箇所を示す。
　図１１は、第２の金属シート状物１０３を示す。ここで、金属シート状物１０３に形成された枠プレート１２０は、フレーム部１２５にブリッジ１２６を介して結合している。枠プレート１２０にはほかの例のものと同様に可動プレートを開口端部方向に付勢する付勢手段１２８が設けられている。フレーム部１２５にはスポット溶接位置決め穴１２７が形成されており、１２９は枠プレート１２０がスポット溶接される箇所を示す。この枠プレート１２０には図１１にみるように２つの可動プレートを挿入できるように２つの可動プレート挿入部１２４が形成されている。１２４ａは可動プレート挿入部１２４の開放端部である。
　図１２は、図６と同様な可動プレート１３０を図１１に示す可動プレート挿入部１２４に装着した図である。ここで、１２０は枠プレート、１２５はフレーム部、１２６はブリッジ、１２７はスポット溶接位置決め穴、１３１は可動プレート１３０に設けられたチップ状電子部品挿入部、１３２は可動プレート１３０に設けられた移動位置規制穴である。
　図１３は、第１の金属シート状物１０５を示す。ここで、金属シート状物１０５に形成された底面プレート１４０は、フレーム部１４５にブリッジ１４６を介して結合している。底面プレート１４０には、チップ状電子部品をチップ状電子部品挿入部に挿入するための真空吸引孔１４１と、可動プレート１３０の移動位置規制穴１３２に入り込み可動プレートの移動範囲を規制するための突起部１４２が設けられている。１４９はスポット溶接される箇所を示す。 FIG. 10 shows the third metal sheet 102. Here, the cover plate 110 formed on the metal sheet 102 is coupled to the frame portion 115 via the bridge 116. The cover plate 110 is provided with a plurality of chip-shaped electronic component insertion portions 111.
Spot welding positioning holes 117 are formed in the frame portion 115. Reference numeral 119 denotes a spot-welded portion.
FIG. 11 shows the second metal sheet 103. Here, the frame plate 120 formed on the metal sheet 103 is coupled to the frame portion 125 via the bridge 126. The frame plate 120 is provided with a biasing means 128 for biasing the movable plate in the direction of the opening end as in the other examples. A spot welding positioning hole 127 is formed in the frame part 125, and 129 indicates a spot where the frame plate 120 is spot welded. As shown in FIG. 11, two movable plate insertion portions 124 are formed in the frame plate 120 so that two movable plates can be inserted. 124 a is an open end of the movable plate insertion portion 124.
12 is a view in which a movable plate 130 similar to that in FIG. 6 is mounted on the movable plate insertion portion 124 shown in FIG. Here, 120 is a frame plate, 125 is a frame portion, 126 is a bridge, 127 is a spot welding positioning hole, 131 is a chip-shaped electronic component insertion portion provided in the movable plate 130, and 132 is a movement provided in the movable plate 130. It is a position restriction hole.
FIG. 13 shows the first metal sheet 105. Here, the bottom plate 140 formed on the metal sheet 105 is coupled to the frame portion 145 via a bridge 146. The bottom plate 140 has a vacuum suction hole 141 for inserting a chip-like electronic component into the chip-like electronic component insertion portion and a protrusion for entering the movement position restricting hole 132 of the movable plate 130 and restricting the moving range of the movable plate. A portion 142 is provided. Reference numeral 149 denotes a spot welded portion.
　まず、図１３に示す第１の金属シート状物１０５の上に図１１に示す第２の金属シート状物１０３を重ね、ついで、図６に示す可動プレートと同じ構造の可動プレート１３０を第２の金属シート状物に形成された枠プレート１２０の可動プレート挿入部１２４に挿入・装着し、さらにこの上に第３の金属シート状物１０２を載置する。ついでそれぞれの金属シート状物に形成されているスポット溶接位置決め穴１１７、１２７、１４７に固定具を挿入しそれぞれの位置合わせをして動かないように固定し、カバープレート１１０と枠プレート１２０と底面プレート１４０のそれぞれのスポット溶接するべき必要箇所（スポット溶接される箇所１１９，１２９，１４９）をスポット溶接して一体化して組み立てる。最後に、組み立てられたチップ状電子部品トレイをブリッジ１１６、１２６、１４６から切り離して単体とする。このようにして組み立てられたものが図９に示されるチップ状電子部品トレイ１０１２である。 First, the second metal sheet 103 shown in FIG. 11 is overlaid on the first metal sheet 105 shown in FIG. 13, and then the movable plate 130 having the same structure as the movable plate shown in FIG. The third metal sheet 102 is mounted on the movable plate insertion portion 124 of the frame plate 120 formed on the metal sheet. Next, a fixing tool is inserted into the spot welding positioning holes 117, 127, and 147 formed in the respective metal sheet-like materials, and the respective positions are aligned and fixed so as not to move. The cover plate 110, the frame plate 120, and the bottom surface Spot welding is performed on the necessary portions (spot welded portions 119, 129, and 149) of the plate 140 to be integrated. Finally, the assembled chip-shaped electronic component tray is separated from the bridges 116, 126, and 146 to form a single unit. What is assembled in this manner is a chip-shaped electronic component tray 1012 shown in FIG.
　図１４に本発明のチップ状電子部品トレイの他の例を示す。本例は、枠プレートに４つの可動プレート挿入部が設けられており、この可動プレート挿入部にそれぞれ可動プレートが装着されている。ここで、２０１はチップ状電子部品トレイ、２１０はカバープレート、２１１はカバープレートに設けられたチップ状電子部品挿入部、２３０は可動プレートをそれぞれ示す。可動プレート２３０は、枠プレート２２０に設けられた付勢手段２２８により可動プレート挿入部２２４の開放端部２２４ａに向けて付勢されているので図１４にみるように可動プレートの端部がカバープレートよりはみ出している。
　このチップ状電子部品トレイ２０１の製造法は、チップ状電子部品トレイ１の製造方法と同じ手順により行われる。この製造方法を図１５ないし図１８を用いて簡略に説明する。 FIG. 14 shows another example of the chip-shaped electronic component tray of the present invention. In this example, four movable plate insertion portions are provided on the frame plate, and the movable plates are respectively attached to the movable plate insertion portions. Here, 201 is a chip-shaped electronic component tray, 210 is a cover plate, 211 is a chip-shaped electronic component insertion portion provided on the cover plate, and 230 is a movable plate. The movable plate 230 is urged toward the open end 224a of the movable plate insertion portion 224 by the urging means 228 provided on the frame plate 220, so that the end of the movable plate is the cover plate as shown in FIG. It sticks out more.
The manufacturing method of the chip-shaped electronic component tray 201 is performed by the same procedure as the manufacturing method of the chip-shaped electronic component tray 1. This manufacturing method will be briefly described with reference to FIGS.
　図１５は、第３の金属シート状物２０２を示す。ここで、金属シート状物２０２に形成されたカバープレート２１０は、フレーム部２１５にブリッジ２１６を介して結合している。カバープレート２１０には複数のチップ状電子部品挿入部２１１が設けられている。フレーム部２１５にはスポット溶接位置決め穴２１７が形成されている。２１９はスポット溶接される箇所を示す。
　図１６は、第２の金属シート状物２０３を示す。ここで、金属シート状物２０３に形成された枠プレート２２０は、フレーム部２２５にブリッジ２２６を介して結合している。枠プレート２２０には可動プレートを開口端部方向に付勢する付勢手段２２８が設けられている。フレーム部２２５にはスポット溶接位置決め穴２２７が形成されており、２２９は枠プレート２２０がスポット溶接される箇所を示す。この枠プレート２２０には図１６にみるように４つの可動プレートを挿入できるように４つの可動プレート挿入部２２４が形成されている。２２４ａは可動プレート挿入部２２４の開放端部である。
　図１７は、図６と同様な可動プレート２３０を図１６に示す可動プレート挿入部２２４に装着した図である。ここで、２２０は枠プレート、２２５はフレーム部、２２６はブリッジ、２２７はスポット溶接位置決め穴、２３１は可動プレート２３０に設けられたチップ状電子部品挿入部、２３２は可動プレート２３０に設けられた移動位置規制穴である。
　図１８は、第１の金属シート状物２０５を示す。ここで、金属シート状物２０５に形成された底面プレート２４０は、フレーム部２４５にブリッジ２４６を介して結合している。底面プレート２４０には、チップ状電子部品をチップ状電子部品挿入部に挿入するための真空吸引孔２４１と、可動プレート２３０の移動位置規制穴２３２に入り込み可動プレートの移動範囲を規制するための突起部２４２が設けられている。２４９はスポット溶接される箇所を示す。 FIG. 15 shows a third metal sheet 202. Here, the cover plate 210 formed on the metal sheet 202 is coupled to the frame portion 215 via the bridge 216. The cover plate 210 is provided with a plurality of chip-shaped electronic component insertion portions 211. Spot welding positioning holes 217 are formed in the frame portion 215. Reference numeral 219 denotes a spot welded portion.
FIG. 16 shows the second metal sheet 203. Here, the frame plate 220 formed on the metal sheet 203 is coupled to the frame portion 225 via a bridge 226. The frame plate 220 is provided with a biasing means 228 that biases the movable plate toward the opening end. A spot welding positioning hole 227 is formed in the frame portion 225, and 229 indicates a spot where the frame plate 220 is spot welded. As shown in FIG. 16, four movable plate insertion portions 224 are formed in the frame plate 220 so that the four movable plates can be inserted. 224a is an open end of the movable plate insertion portion 224.
17 is a diagram in which a movable plate 230 similar to that in FIG. 6 is attached to the movable plate insertion portion 224 shown in FIG. Here, 220 is a frame plate, 225 is a frame portion, 226 is a bridge, 227 is a spot welding positioning hole, 231 is a chip-shaped electronic component insertion portion provided on the movable plate 230, and 232 is a movement provided on the movable plate 230 It is a position restriction hole.
FIG. 18 shows the first metal sheet 205. Here, the bottom plate 240 formed on the metal sheet 205 is coupled to the frame portion 245 via a bridge 246. The bottom plate 240 has a vacuum suction hole 241 for inserting a chip-like electronic component into the chip-like electronic component insertion portion, and a protrusion for entering the movement position restricting hole 232 of the movable plate 230 and restricting the moving range of the movable plate. A part 242 is provided. Reference numeral 249 denotes a spot welded portion.
　まず、図１８に示す第１の金属シート状物２０５の上に図１６に示す第２の金属シート状物２０３を重ね、ついで、図６に示す可動プレートと同じ構造の可動プレート２３０を第２の金属シート状物２０３に形成された枠プレート２２０の可動プレート挿入部２２４に挿入・装着し、さらにこの上に第３の金属シート状物２０２を載置する。ついでそれぞれの金属シート状物に形成されているスポット溶接位置決め穴２１７、２２７、２４７に固定具を挿入しそれぞれの位置合わせをして動かないように固定し、カバープレート２１０と枠プレート２２０と底面プレート２４０のそれぞれのスポット溶接するべき必要箇所（スポット溶接される箇所２１９，２２９，２４９）をスポット溶接して一体化して組み立てる。最後に、組み立てられたチップ状電子部品トレイをブリッジ２１６、２２６、２４６から切り離して単体とする。このようにして組み立てられたものが図１４に示されるチップ状電子部品トレイ２０１である。 First, the second metal sheet 203 shown in FIG. 16 is stacked on the first metal sheet 205 shown in FIG. 18, and then the movable plate 230 having the same structure as the movable plate shown in FIG. The third metal sheet 202 is placed on the movable plate insertion portion 224 of the frame plate 220 formed on the metal sheet 203 and mounted thereon. Next, a fixture is inserted into the spot welding positioning holes 217, 227, and 247 formed in the respective metal sheet-like materials, and the respective positions are aligned and fixed so as not to move. The cover plate 210, the frame plate 220, and the bottom surface Spot welding is performed to integrate the necessary portions (spot welded portions 219, 229, and 249) of the plate 240 to be spot welded. Finally, the assembled chip-shaped electronic component tray is separated from the bridges 216, 226, and 246 to form a single unit. What is assembled in this manner is a chip-shaped electronic component tray 201 shown in FIG.
１、１０１、２０１、チップ状電子部品トレイ
２、１０２、２０２　第３の金属シート状物
３、１０３、２０３　第２のシート状物
５、１０５、２０５　第１のシート状物
１０，１１０，２１０　カバープレート
１１、３１、１１１，１３１、２１１、２３１　チップ状電子部品挿入部
１５、２５、４５、１１５、１２５、１４５、２１５、２２５、２４５　フレーム部
１６、２６、４６、１１６、１２６、１４６、２１６、２２６、２４６　ブリッジ
１７、２７、４７、１１７，１２７，１４７、２１７、２２７、２４７　スポット溶接位置決め穴
１９、２９、４９、１１９、１２９、１４９、２１９、２２９、２４９　スポット溶接される箇所
２０，１２０、２２０　枠プレート
２４、１２４、２２４　可動プレート挿入部
２４ａ、１２４ａ、２２４ａ　開口端部
２８、１２８、２２８　付勢手段
３０、１３０、２３０　可動プレート
３１ａ　緩衝部材
３２，１３２、２３２　移動位置規制穴
４０、１４０、２４０　底面プレート
４１、１４１、２４１　真空吸引孔
４２、１４２、２４２　突起部 1, 101, 201, chip-shaped electronic component trays 2, 102, 202 Third metal sheet 3, 103, 203 Second sheet 5, 105, 205 First sheet 10, 110, 210 Cover plate 11, 31, 111, 131, 211, 231 Chip-shaped electronic component insertion part 15, 25, 45, 115, 125, 145, 215, 225, 245 Frame part 16, 26, 46, 116, 126, 146, 216, 226, 246 Bridge 17, 27, 47, 117, 127, 147, 217, 227, 247 Spot welding positioning hole 19, 29, 49, 119, 129, 149, 219, 229, 249 Spot welding location 20 , 120, 220 Frame plates 24, 124, 224 Movable plate insertion portions 24a, 124a, 224a Mouth end portions 28, 128, 228 Energizing means 30, 130, 230 Movable plate 31a Buffer members 32, 132, 232 Movement position restricting holes 40, 140, 240 Bottom plate 41, 141, 241 Vacuum suction holes 42, 142, 242 protrusion

Claims (5)

  1. 　電子部品トレイの底面プレートが形成された第１の金属シート状物に電子部品トレイの枠プレートが形成された第２の金属シート状物を重ね合わせ、この枠プレートの可動プレート挿入部に可動プレートを装着し、ついで、電子部品トレイのカバープレートが形成された第３の金属シートを重ね合わせ、底面プレートと枠プレートとカバープレートをスポット溶接により複数箇所で溶接することによりチップ状電子部品トレイを製造する方法において、
    　第１の金属シート状物のフレーム部には、複数の第１の金属シート状物のスポット溶接位置決め穴が設けられ、底面プレートには、可動プレートの移動位置規制穴に挿入され可動プレート前後動の範囲を規制する突起部と複数個の真空吸引孔が設けられ、
    　第２の金属シート状物のフレーム部には、複数の第２の金属シート状物のスポット溶接位置決め穴が設けられ、枠プレートには、１または２以上のコ字形状の可動プレート挿入部が設けられ、かつコ字形状の開口端部と対向する部位に可動プレートを開口端部方向に付勢する付勢手段が設けられており、
    　可動プレートには、複数個のチップ状電子部品挿入部が設けられ、可動プレートが電子部品トレイの可動プレート挿入部より飛び出さないように移動位置規制穴が設けられ、チップ状電子部品挿入部の開口部の長辺部にはチップ状電子部品の寸法の製造許容の誤差を吸収する緩衝部材が設けられ、さらにチップ状電子部品挿入部の開口部の大きさは、長手方向（長辺）の長さがチップ状電子部品の厚みの３倍ないし４倍の長さであって、かつ０．２ｍｍないし３ｍｍであり、短辺の長さがカバープレートに設けられたチップ状電子部品挿入部の開口部の短辺の長さより緩衝部材の大きさ分だけ長くなっており、
    　第３の金属シート状物のフレーム部には、複数の第３の金属シート状物のスポット溶接位置決め穴が設けられ、電子部品トレイのカバープレートには、可動プレートに設けられたチップ状電子部品挿入部と同じ間隔で同数のチップ状電子部品挿入部が設けられ、しかもこのチップ状電子部品挿入部の開口部の大きさは、長手方向（長辺）の長さは縦状に収納固定したチップ状電子部品の上面または下面の長さより長く、短辺の長さは収納固定するチップ状電子部品の厚みよりやや長いものであり、
    　第１の金属シート状物のスポット溶接位置決め穴と第２の金属シート状物のスポット溶接位置決め穴と第３の金属シート状物のスポット溶接位置決め穴により相対位置を決定して底面プレートと枠プレートとカバープレートをスポット溶接することを特徴とするチップ状電子部品トレイの製造方法。     The second metal sheet-like object on which the frame plate of the electronic component tray is formed is superimposed on the first metal sheet-like object on which the bottom plate of the electronic component tray is formed, and the movable plate is inserted into the movable plate insertion portion of the frame plate. Next, the third metal sheet on which the cover plate of the electronic component tray is formed is overlaid, and the bottom plate, the frame plate, and the cover plate are welded at a plurality of locations by spot welding, thereby mounting the chip-shaped electronic component tray. In the manufacturing method,
    The frame portion of the first metal sheet is provided with a plurality of spot welding positioning holes for the first metal sheet, and the bottom plate is inserted into the movement position restricting hole of the movable plate to move the movable plate back and forth. Protrusions and a plurality of vacuum suction holes that regulate the range of
    The frame portion of the second metal sheet is provided with a plurality of spot welding positioning holes for the second metal sheet, and the frame plate has one or more U-shaped movable plate insertion portions. An urging means for urging the movable plate in the direction of the opening end is provided at a portion facing the U-shaped opening end.
    The movable plate is provided with a plurality of chip-shaped electronic component insertion portions, and a movement position restricting hole is provided so that the movable plate does not protrude from the movable plate insertion portion of the electronic component tray. A buffer member that absorbs manufacturing tolerance errors in the dimensions of the chip-shaped electronic component is provided on the long side portion of the opening, and the size of the opening of the chip-shaped electronic component insertion portion is in the longitudinal direction (long side). The length of the chip-shaped electronic component insertion portion provided on the cover plate is 3 to 4 times the thickness of the chip-shaped electronic component and 0.2 mm to 3 mm in length. It is longer than the length of the short side of the opening by the size of the buffer member,
    The frame portion of the third metal sheet is provided with a plurality of spot welding positioning holes for the third metal sheet, and the chip-like electronic component provided on the movable plate is provided on the cover plate of the electronic component tray. The same number of chip-like electronic component insertion portions are provided at the same interval as the insertion portion, and the size of the opening of the chip-like electronic component insertion portion is stored and fixed in the longitudinal direction (long side) in a vertical shape. It is longer than the length of the upper surface or lower surface of the chip-shaped electronic component, and the length of the short side is slightly longer than the thickness of the chip-shaped electronic component to be stored and fixed,
    The relative position is determined by the spot welding positioning hole of the first metal sheet, the spot welding positioning hole of the second metal sheet, and the spot welding positioning hole of the third metal sheet, and the bottom plate and the frame plate A chip-shaped electronic component tray manufacturing method characterized by spot welding a cover plate.
  2. 　請求項１に記載のチップ状電子部品トレイの製造方法において、第１の金属シート状物、第２の金属シート状物あるいは第３の金属シート状物のいずれかがエッチングにより加工したものであることを特徴とする製造方法。 2. The method of manufacturing a chip-shaped electronic component tray according to claim 1, wherein any one of the first metal sheet, the second metal sheet, and the third metal sheet is processed by etching. The manufacturing method characterized by the above-mentioned.
  3. 　請求項１に記載のチップ状電子部品トレイの製造方法において、第１の金属シート状物、第２の金属シート状物あるいは第３の金属シート状物のいずれかが機械加工したものであるかまたは焼結金属であることを特徴とする製造方法。 2. The method for manufacturing a chip-shaped electronic component tray according to claim 1, wherein any one of the first metal sheet, the second metal sheet, and the third metal sheet is machined. Or a manufacturing method characterized by being a sintered metal.
  4. 　請求項１に記載の電子部品状電子部品トレイの製造方法において、第２の金属シート状物の形成された枠プレートが、２または４個の可動プレート挿入部が設けられたものであることを特徴とする製造方法。 2. The method of manufacturing an electronic component-like electronic component tray according to claim 1, wherein the frame plate on which the second metal sheet-like material is formed is provided with two or four movable plate insertion portions. A featured manufacturing method.
  5. 　上記請求項1ないし4に記載の製造方法により製造されたチップ状電子部品トレイ。 A chip-shaped electronic component tray manufactured by the manufacturing method according to claim 1.
PCT/JP2014/057224 2013-03-28 2014-03-18 Movable jig for electronic component WO2014156794A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220014A (en) * 1998-01-29 1999-08-10 Tama Electric Co Ltd Chip tray for mounting compact chip part
JP2009139633A (en) * 2007-12-06 2009-06-25 Tdk Corp Method for manufacturing electronic component and holder used for the method
JP2011037518A (en) * 2009-08-18 2011-02-24 Multitest Elektronische Systeme Gmbh Substrate for arranging electronic component with plate slidably disposed

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11220014A (en) * 1998-01-29 1999-08-10 Tama Electric Co Ltd Chip tray for mounting compact chip part
JP2009139633A (en) * 2007-12-06 2009-06-25 Tdk Corp Method for manufacturing electronic component and holder used for the method
JP2011037518A (en) * 2009-08-18 2011-02-24 Multitest Elektronische Systeme Gmbh Substrate for arranging electronic component with plate slidably disposed

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