KR20150089211A - Chip-type Coil Component - Google Patents
Chip-type Coil Component Download PDFInfo
- Publication number
- KR20150089211A KR20150089211A KR1020140009552A KR20140009552A KR20150089211A KR 20150089211 A KR20150089211 A KR 20150089211A KR 1020140009552 A KR1020140009552 A KR 1020140009552A KR 20140009552 A KR20140009552 A KR 20140009552A KR 20150089211 A KR20150089211 A KR 20150089211A
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- main body
- type coil
- longitudinal direction
- coil component
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 4
- 239000010949 copper Substances 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
Abstract
A body formed by stacking a plurality of magnetic body layers and having a lower face provided with a mounting face and an upper face corresponding thereto, both side faces in the longitudinal direction and both lateral faces in the width direction; A conductor pattern formed on the magnetic body layer and connected to have a coil structure; Side external electrodes formed on both longitudinal sides of the main body; And a bottom outer electrode formed on the bottom surface of the main body and divided into arbitrary pieces at both ends in the longitudinal direction, thereby minimizing the mounting height.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type coil component, and more particularly, to a chip-type coil component having a bottom surface external electrode divided into arbitrary pieces.
An inductor is one of the important passive components of an electronic circuit together with a resistor and a capacitor, and can be used for a component removing noise or forming an LC resonance circuit.
Such an inductor can be classified into various types such as a wound-type or thin-film type inductor and a stacked-type inductor according to its structure.
The wound or thin film type inductor may be manufactured by winding a coil on a ferrite core or by printing and forming electrodes at both ends.
The multilayer inductor may be manufactured by printing a conductive pattern on a plurality of sheets of magnetic material, dielectric, or the like, and then stacking the conductive patterns along the thickness direction.
In particular, such a multilayer inductor has advantages in that it can be downsized and reduced in thickness as compared with the above-mentioned wound type inductor, and is also advantageous in direct current resistance, so that it is widely used in a power supply circuit requiring miniaturization and high current.
On the other hand, in accordance with the tendency of electronic products to be made smaller and thinner, requirements for lowering the height of an inductor mounted on a substrate are also increasing. At this time, a method of lowering the height of the inductor main body can be considered, but there is a limit in reducing the height of the main body in connection with the performance of the inductor.
Therefore, a method of reducing the height of the external electrode provided on the lower surface of the inductor can be considered. On the other hand, since the external electrode must have a high fixing force with the inductor main body, a small amount of glass is added to the silver (Ag) paste and formed by a screen printing method. However, such a screen printing method has a problem that the printing thickness can not be lowered to 25 탆 or less due to its nature.
SUMMARY OF THE INVENTION In order to solve the above problems, the present invention is to provide a chip-type coil component having external electrodes at the bottom divided into arbitrary pieces.
A chip-type coil component according to the present invention is a chip-type coil component formed by stacking a plurality of magnetic body layers and having a lower surface provided with a mounting surface and an upper surface corresponding to the lower surface, both side surfaces in the longitudinal direction and both side surfaces in the width direction, A side external electrode formed on both sides in the longitudinal direction of the main body, and a bottom external electrode formed by dividing into arbitrary pieces at both ends in the longitudinal direction of the main body, can do.
In the chip-type coil component according to the present invention, the lower surface external electrodes may be formed by being divided into a checkered pattern.
In the chip-type coil component according to the present invention, at least one piece of the lower outer electrode may be connected to the lateral outer electrode.
In the chip-type coil component according to the present invention, the lower external electrode may have a trapezoidal shape whose width gradually decreases from both ends in the longitudinal direction to the center.
In the chip-type coil component according to the present invention, the side external electrodes may be additionally formed on both sides in the width direction of the main body.
According to the present invention, it is possible to minimize the height at which chip-type coil components are mounted on a substrate by providing a chip-type coil component having external electrodes at the bottom divided into arbitrary pieces.
1 is a perspective view of a chip-type coil component according to an embodiment of the present invention;
2 is an exploded perspective view of a chip-type coil component according to an embodiment of the present invention;
3 is a cross-sectional view taken along line A-A 'in Fig.
4 is a bottom view of a chip-type coil component according to an embodiment of the present invention.
5 is a perspective view of a chip-type coil component according to another embodiment of the present invention;
Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventive concept. Other embodiments falling within the scope of the inventive concept may readily be suggested, but are also considered to be within the scope of the present invention.
In the following description, the same reference numerals are used to designate the same components in the same reference numerals in the drawings.
FIG. 1 is a perspective view of a chip-
L, W and T denote the longitudinal direction, the width direction and the thickness direction, respectively, as shown in the figure, when directions are defined to clearly explain the embodiment of the present invention. Here, the dimension in the longitudinal direction of the chip-
1 to 4, a chip-
The
The
At this time, upper and
The
For example, the
The total number of stacked layers of the
At least two of the
The lead portions may be electrically connected to the side
The via-
The conductive paste may be composed of at least one of silver (Ag), silver-palladium (Ag-Pd), nickel (Ni) and copper (Cu), or an alloy thereof, .
The side
The side
For example, the side
In addition, a nickel (Ni) layer (not shown) and a tin (Sn) layer (not shown) may be sequentially formed on the outer surface of the side
3, the
At this time, the
In addition, the
The
For example, the
In addition, the
As described above, the lower
When forming the
5 is a perspective view of a chip-
5, in the chip-
Components other than the side
While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. And will be apparent to those skilled in the art.
100, 200: chip type coil parts
110, 210:
121, 122, 123: Conductor pattern
130: Via electrode
140, 240: side external electrode
150, 250: When the external electrode
Claims (5)
A conductor pattern formed on the magnetic body layer and connected to have a coil structure;
Side external electrodes formed on both longitudinal sides of the main body; And
And a lower outer electrode formed on the lower surface of the main body so as to be divided into arbitrary pieces at both ends in the longitudinal direction.
The chip-type coil part formed by dividing the external electrode into a checkered pattern.
Wherein at least one piece of the outer electrode is connected to the lateral outer electrode.
Wherein the outer electrode has a trapezoidal shape whose width gradually decreases from both ends in the longitudinal direction toward the center.
Wherein the side external electrodes are additionally formed on both sides in the width direction of the main body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140009552A KR20150089211A (en) | 2014-01-27 | 2014-01-27 | Chip-type Coil Component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140009552A KR20150089211A (en) | 2014-01-27 | 2014-01-27 | Chip-type Coil Component |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20150089211A true KR20150089211A (en) | 2015-08-05 |
Family
ID=53885704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140009552A KR20150089211A (en) | 2014-01-27 | 2014-01-27 | Chip-type Coil Component |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20150089211A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180012618A (en) * | 2016-07-27 | 2018-02-06 | 삼성전기주식회사 | Inductor |
CN109215936A (en) * | 2017-06-30 | 2019-01-15 | Tdk株式会社 | Laminated electronic component |
KR20200086452A (en) * | 2019-01-09 | 2020-07-17 | 삼성전기주식회사 | Coil component |
-
2014
- 2014-01-27 KR KR1020140009552A patent/KR20150089211A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180012618A (en) * | 2016-07-27 | 2018-02-06 | 삼성전기주식회사 | Inductor |
CN109215936A (en) * | 2017-06-30 | 2019-01-15 | Tdk株式会社 | Laminated electronic component |
KR20200086452A (en) * | 2019-01-09 | 2020-07-17 | 삼성전기주식회사 | Coil component |
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Legal Events
Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |