KR20130112241A - Multilayer type inductor - Google Patents
Multilayer type inductor Download PDFInfo
- Publication number
- KR20130112241A KR20130112241A KR1020120034474A KR20120034474A KR20130112241A KR 20130112241 A KR20130112241 A KR 20130112241A KR 1020120034474 A KR1020120034474 A KR 1020120034474A KR 20120034474 A KR20120034474 A KR 20120034474A KR 20130112241 A KR20130112241 A KR 20130112241A
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- KR
- South Korea
- Prior art keywords
- sheet
- connection
- electrode
- sheets
- stacked
- Prior art date
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 16
- 230000002787 reinforcement Effects 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- SGGPVBOWEPPPEH-UHFFFAOYSA-N [K].[Zr] Chemical compound [K].[Zr] SGGPVBOWEPPPEH-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Abstract
In one embodiment, a stacked inductor includes a main body in which a plurality of sheets in which internal electrodes are formed are stacked; An external electrode formed on an outer surface of the main body; And a connection reinforcing pattern formed on at least one of the plurality of sheets so as to be implemented at a plurality of points at which electrical connections between the inner electrode and the outer electrode are spaced apart from each other.
Description
The present invention relates to a multilayer inductor.
An inductor, which is one of the multilayer chip electronic components, is a representative passive element used as a component that forms an electronic circuit together with a resistor and a capacitor to remove noise, or forms an LC resonant circuit.
These inductors are manufactured by winding coils around a ferrite core or printing and forming electrodes on both ends of the inductor, and then stacking a plurality of magnetic bodies or dielectrics after printing internal electrodes on magnetic or dielectric materials. And the like.
On the other hand, recently, the multilayer inductor has been widely used, and the multilayer inductor has a structure in which a plurality of magnetic layers or dielectric layers in which internal electrodes are formed, as described above, and internal electrodes are via electrodes formed in respective layers. By sequentially connecting by forming a coil structure as a whole, it is possible to implement characteristics such as target inductance and impedance.
Here, in order to realize the characteristics of the inductance and impedance, which are intended for the multilayer inductor, the internal electrode and the external electrode must be electrically connected, and the stability of the connection is an important factor that determines the performance of the multilayer inductor.
However, in the related art, miniaturization and thinning of the multilayer inductor have been made, and even when the multilayer inductor is manufactured as designed, a problem occurs in that the connection between the internal electrode and the external electrode is weak, resulting in delamination or poor connection. Occurred.
Patent Document 1 described in the following prior art document still has a problem that the performance may be degraded by poor electrical connection between the internal electrode and the external electrode.
An object of the present invention is to reinforce the electrical connection between the internal electrode and the external electrode to improve the electrical properties and at the same time to ensure the stability of the external mechanical impact to the multilayer inductor.
In one embodiment, a stacked inductor includes a main body in which a plurality of sheets in which internal electrodes are formed are stacked; An external electrode formed on an outer surface of the main body; And a connection reinforcing pattern formed on at least one of the plurality of sheets so as to be implemented at a plurality of points at which electrical connections between the inner electrode and the outer electrode are spaced apart from each other.
The connection reinforcing pattern of the multilayer inductor according to an exemplary embodiment may be in contact with the external electrode.
Internal electrodes formed on the plurality of sheets of the multilayer inductor according to an exemplary embodiment of the present invention are connected to each other to form one coil, and the connection reinforcement pattern is configured to connect the external electrodes from the internal electrodes forming one end of the coil. It can be formed extending toward.
An internal electrode forming one end of the coil of the multilayer inductor according to an embodiment of the present invention includes a connection electrode extending along one side edge of the main body, and the connection reinforcement pattern is formed from the connection electrode. A plurality may be formed to extend toward.
The connection reinforcing pattern of the stacked inductor according to an exemplary embodiment of the present invention may be formed on at least some of the sheets sequentially stacked among the plurality of sheets.
The connection reinforcing pattern of the stacked inductor according to the exemplary embodiment of the present invention may be connected by a via electrode along the stacking direction.
The sheet of the multilayer inductor according to an exemplary embodiment of the present invention may include a first sheet disposed on an uppermost side, a second sheet disposed on a lowermost side, and between the first sheet and the second sheet. At least one inner sheet is disposed, and the connection reinforcing pattern may be formed on the inner electrodes formed on the first sheet and the second sheet.
The internal electrodes formed on the first sheet and the second sheet of the multilayer inductor according to an embodiment of the present invention include a connection electrode extending along one edge of the main body, and the connection reinforcing pattern is the connection electrode. A plurality of extending from the toward the external electrode may be formed from.
The connection reinforcing pattern of the multilayer inductor according to an exemplary embodiment of the present invention may be formed in at least some of the inner sheets sequentially stacked from one surface of the first sheet and the second sheet, respectively.
The connection reinforcing pattern of the stacked inductor according to the exemplary embodiment of the present invention may be connected by a via electrode along the stacking direction.
According to the multilayer inductor according to the present invention, the electrical connection between the internal electrode and the external electrode can be strengthened.
In addition, stability can be ensured even against mechanical shocks and external shocks generated when the substrate or the like is mounted.
1 is a schematic perspective view showing a stacked inductor according to an embodiment of the present invention.
2 is a schematic exploded perspective view showing a multilayer inductor according to an embodiment of the present invention.
3 is a schematic exploded perspective view showing a multilayer inductor according to another embodiment of the present invention.
4 is a schematic cross-sectional view showing a multilayer inductor according to another embodiment of the present invention.
Hereinafter, with reference to the drawings will be described in detail a specific embodiment of the present invention. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the inventive concept. Other embodiments falling within the scope of the inventive concept may readily be suggested, but are also considered to be within the scope of the present invention.
The same reference numerals are used to designate the same components in the same reference numerals in the drawings of the embodiments.
1 is a schematic perspective view of a multilayer inductor according to an embodiment of the present invention, and FIG. 2 is a schematic exploded perspective view of a multilayer inductor according to an embodiment of the present invention.
1 and 2, the
Here, all of the
The
Ferrite may be used when the
Specifically, the
In addition, when the
In the case where the
Meanwhile, the
In this case, the
In addition, a
Here, the components of the
The
That is, the
Here, the
Specifically, the
That is, the
The
The
Here, the
In this case, the conductive paste may include silver (Ag), silver-palladium (Ag-Pd), nickel (Ni), copper (Cu), or the like.
In addition, a nickel (Ni) plating layer and tin (Sn) plating layer may be further formed on the surface of the
The
In other words, the
That is, the
Specifically, the
Therefore, the
That is, in the case of a conventional inductor in which a connection terminal extends to an external electrode and an electrical connection is made between an internal electrode and an external electrode, a delamination may occur at a portion where the internal electrode is exposed to the outside of the main body. When mounting on the substrate may also cause a problem that the connection between the internal electrode and the external electrode is broken by the stress generated by the solder and mechanical impact caused by the outside.
In addition, since the connecting portion of the internal electrode and the external electrode should be formed on both sides of the main body and the lower side of the main body to realize a high capacity inductor, the connection between the internal electrode and the external electrode is inevitably weaker.
However, in the case of the stacked
On the other hand, the
3 is a schematic exploded perspective view illustrating a multilayer inductor according to another exemplary embodiment of the present invention, and FIG. 4 is a schematic cross-sectional view illustrating a multilayer inductor according to another exemplary embodiment of the present invention.
Referring to FIGS. 3 and 4, the
The
Specifically, the
More specifically, the
However, the number of
Therefore, the
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be apparent to those skilled in the art that such modifications or variations are within the scope of the appended claims.
100, 200: multilayer inductor 110: main body
111-119: Sheet 112: 1st sheet
113 to 118: inner sheet 119: second sheet
120: external electrode 130: internal electrode
140 and 240:
Claims (10)
An external electrode formed on an outer surface of the main body; And
And a connection reinforcing pattern formed on at least one of the plurality of sheets so that electrical connections between the internal electrodes and the external electrodes are spaced apart from each other.
The connection reinforcement pattern is a stacked inductor in contact with the external electrode.
Internal electrodes formed on the plurality of sheets are connected to each other to form a coil,
The connection reinforcement pattern is a multilayer inductor is formed extending from the internal electrode forming one end of the coil toward the external electrode.
The internal electrode forming one end of the coil has a connection electrode extending along one side edge of the body,
The connection reinforcement pattern is a multilayer inductor is formed by extending a plurality from the connection electrode toward the external electrode.
The connection reinforcement pattern is a stacked inductor is formed on at least a portion of the plurality of sheets that are sequentially stacked.
The connection reinforcement pattern is a stacked inductor electrically connected by a via electrode along a stacking direction.
The sheet includes a first sheet disposed on the uppermost side of the sheet on which the internal electrodes are formed, a second sheet disposed on the lowermost side, and at least one inner sheet disposed between the first sheet and the second sheet. ,
The connection reinforcing pattern is a stacked inductor is formed on the internal electrodes formed on the first sheet and the second sheet.
The internal electrodes formed on the first sheet and the second sheet have connection electrodes extending along one edge of the main body,
The connection reinforcement pattern is a multilayer inductor is formed to extend from the connection electrode toward the external electrode.
The connection reinforcing pattern is a stacked inductor is formed on at least a portion of the inner sheet which is sequentially laminated from one surface of the first sheet and the second sheet, respectively.
The connection reinforcement pattern is a stacked inductor electrically connected by a via electrode along a stacking direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120034474A KR20130112241A (en) | 2012-04-03 | 2012-04-03 | Multilayer type inductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120034474A KR20130112241A (en) | 2012-04-03 | 2012-04-03 | Multilayer type inductor |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20130112241A true KR20130112241A (en) | 2013-10-14 |
Family
ID=49633276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120034474A KR20130112241A (en) | 2012-04-03 | 2012-04-03 | Multilayer type inductor |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20130112241A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10020107B1 (en) | 2017-01-10 | 2018-07-10 | Samsung Electro-Mechanics Co., Ltd. | Hybrid inductor |
KR20190067428A (en) * | 2017-12-07 | 2019-06-17 | 삼성전기주식회사 | Winding type inductor |
-
2012
- 2012-04-03 KR KR1020120034474A patent/KR20130112241A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10020107B1 (en) | 2017-01-10 | 2018-07-10 | Samsung Electro-Mechanics Co., Ltd. | Hybrid inductor |
KR20190067428A (en) * | 2017-12-07 | 2019-06-17 | 삼성전기주식회사 | Winding type inductor |
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