JP6290655B2 - Electronic component movable jig - Google Patents

Description

 The present invention relates to a chip-shaped electronic component tray for storing and transporting a chip-shaped electronic component in a chip-shaped electronic component insertion portion of the chip-shaped electronic component tray to store, transport, print, and process the chip-shaped electronic component. Is. The present invention particularly relates to a suitable jig used when screen printing is performed on a chip-shaped electronic component.

A wide variety of electronic component trays are used in various places for transporting, storing, cleaning, and inspecting chip-shaped electronic components such as IC chips. As the material of the chip tray, metal materials and plastics are used in accordance with the purpose of use, but in many cases, metal materials are used except when the electrical characteristics are inspected. When handling chip-shaped electronic components, simply reducing the size of a tray that contains relatively large components from the past does not fix all the stored electronic components properly. Problems such as falling out of the tray. As a means for this, for example, in Patent Document 1, when a chip-shaped electronic component is stored and fixed in a planar state at the electronic component insertion portion, the inserted chip-shaped electronic component is placed in the X-axis direction electronic component holding spring and the Y-axis direction. The electronic component holding spring has been proposed to be housed and fixed from these two directions. However, this type of electronic component tray requires a mechanism for moving the electronic component pressing spring in the X-axis direction and the electronic component pressing spring in the Y-axis direction, which increases the number of elements constituting the tray and makes the structure complicated. It cannot be avoided.
In the field of electronics, a screen printing method has begun to be used instead of the conventional method in order to form a pattern on a small electronic component such as a circuit board or to apply a solder paste to a necessary portion. Materials used for screen printing include not only printing ink but also high viscosity materials such as solder paste. For this reason, when screen printing is performed, the chip-shaped electronic component that should have been fixed sticks to ink or paste, and if it is removed from the tray, uneven printing or uneven coating thickness tends to occur. In order to achieve high-precision and high-definition printing quality with a screen printer, there is a jig that can hold and fix chip-shaped electronic components accurately and securely in place and achieve high-precision printing. It is necessary.

JP 2006-128585 A

Surface technology Vol. 42 no. 7 p. 685-690

 In conventional jigs and chip-shaped electronic component trays, the entire movable plate provided with the electronic component insertion portion is moved along the X axis in order to move the electronic component pressing spring in the X axis direction and the electronic component pressing spring in the Y axis direction. It must be movable in two directions, the direction and the Y-axis direction. Since the movable plate is mounted in the frame body of the square-shaped frame plate, two mechanisms for moving the movable plate in the X-axis direction and the Y-axis direction are provided in the gap between the movable plate and the frame plate. It has been. However, if a large number of mechanisms are not provided, the movable plate cannot be moved accurately and reliably in the X-axis direction and the Y-axis direction. For example, the number of elements constituting the jig increases and the number of processing steps increases. (For example, refer to Patent Document 1).

 In addition, when the electronic component holding spring in the X-axis direction and the electronic component holding spring in the Y-axis direction hold the chip, they move so as to slide while rubbing the side surface of the chip-shaped electronic component, so the movement becomes unstable. The problem that it becomes easy to become, and the side is hurt arises. In particular, when the electronic component holding spring is manufactured by etching, a sharp protruding portion called side etching is often generated on the outside of the spring. This sharp protruding portion is a chip-shaped electronic component. Due to the scratches made on the side surfaces, the quality and performance of the chip-shaped electronic component deteriorate, which causes a serious problem.

 In the screen printing method, factors such as screen gap, screen tilt, squeegee tilt (attack angle), squeegee pressure and squeegee speed must be considered as factors for printing with high accuracy such as fine pattern formation (for example, non-printing). Patent Document 1). In particular, screen printing in the electronics field requires fine control of printing conditions so as to reduce coating unevenness and film thickness variations.

 FIG. 28 schematically shows the arrangement and shape of openings in a conventional chip-shaped electronic component insertion portion. As shown in FIG. 28, the chip-shaped electronic component insertion portions are arranged in a vertical row, and a large number of the vertical row arrangements are provided at regular intervals. For this reason, when it is going to screen-print on a chip-shaped electronic component using the conventional jig | tool, a gap | interval exists in a row between chip-shaped electronic components inserted in the several electronic component insertion part. Therefore, when the squeegee to be printed passes through the printed part of the chip-shaped electronic component, it is pressed and a reaction force is applied from the chip. The reaction force is not applied. In other words, when the squeegee passes through the printed part and the gap part of the chip-shaped electronic component, the state where the squeegee is applied and the state where the force is not applied alternately, the squeegee is caught in this gap, etc. Shaking occurs. As a result, the amount of printing ink changes, printing unevenness, printing misalignment, and the like occur, which adversely affects product quality.

There are various types of chip-shaped electronic components targeted by the present invention.
An example is a chip capacitor. The general structure of a capacitor is one in which a dielectric is sandwiched between opposing electrodes. When voltage V is applied to the counter electrode, charge Q is stored. Even if the power supply line is released and the supply of the voltage V is stopped, the charged state is maintained. However, when the electrodes are connected to each other with a conducting wire or an appropriate load resistance, the stored charge Q is released. At this time, the charge Q is proportional to the voltage V, and is expressed as Q = CV. C is a proportional constant and is referred to as an electric capacity C with respect to the charge Q and the voltage V. Since the electric capacity C is also expressed as a capacitance, it may be expressed as a capacitor as a general name of the capacitor.
The capacitor is a circuit element having a characteristic of blocking a direct current voltage. In order to avoid fluctuations in power supply voltage in an electronic circuit, it is used in various electronic circuits such as a bypass capacitor disposed between a power supply line and ground.

  Other chip-shaped electronic components include chip inductors, chip resistors, semiconductor chips such as IC chips and LSI chips, crystal oscillator parts, semiconductor ceramics, piezoelectric ceramics, dielectric ceramics, oscillators, vibrators, resonators, light emitting elements Etc.

 The external dimensions of such a chip-shaped electronic component are standardized by the Japanese Industrial Standard for each chip-shaped electronic component. If the dimension symbol of a chip capacitor suitable for surface mounting is 4532, 4.5 mm × 3.2 mm. (Length × width), 5.7 mm × 5.0 mm (length × width) if 5750, and 7.75 if dimension symbol 7563 is specified by the manufacturer but not specified in the standard. 5 mm × 6.3 mm (length × width). Since the thickness varies depending on the performance of the product, the manufacturer can arbitrarily design and leave it to the company.

The standard dimensions of the chip capacitor given as an example are specifically as follows: Japan Industrial Standard Fixed Capacitors for Electronic Equipment Part 21: General Rules for Each Type: Surface Mounted Fixed Multilayer Ceramic Capacitor Type 1 JISC 5101-21: 2006 Annex A (Rule) Dimension symbols for surface mount fixed multilayer ceramic capacitors Type 1 and guidelines on regulations are known from Appendix A Table 1 Dimensions.
FIG. 39 shows Annex A and Annex A FIG. 1 of these Japanese Industrial Standards.

  The present invention can reliably hold and fix the chip-shaped electronic component from two directions by moving the movable plate in one axis direction, and can be used as a screen printing jig without damaging the chip side surface. Even if it is used, chip-like electronic components that prevent squeegee rattling during printing, enable high-precision and high-definition printing, and simultaneously hold a large number of chip-like electronic components accurately and reliably The purpose is to provide a tray. Another object of the present invention is to provide a chip-shaped electronic component tray that can be easily repaired because the movable plate of the chip-shaped electronic component tray can be easily replaced and repaired.

  In order to achieve such an object, the present invention relates to a chip-shaped electronic component tray having a structure as described below.

That is, the present invention
(1) A bottom plate having a plurality of protrusions inserted into the movement position restriction hole of the movable plate and restricting the movable range of the movable plate, and a plurality of fastening member insertion holes,
One or two or more U-shaped movable plate insertion portions, a biasing means for biasing the movable plate in the direction of the opening end portion, and a plurality of fastening member insertion holes at a portion facing the opening end portion of the movable plate insertion portion. A frame plate disposed on the upper surface of the bottom plate,
A plurality of rectangular chip-shaped electronic component insertion portions that are rectangular and have a symmetrical axis inclined at an angle of 30 to 60 degrees are arranged in a staggered manner and densely arranged, and the chip-shaped electronic component insertion portions A buffer member that absorbs the manufacturing tolerance error of the size of the chip-shaped electronic component is provided on two adjacent opening walls on the biasing means side, and the size of the opening of the chip-shaped electronic component insertion portion is the cover plate. A plurality of chip-shaped electronic component insertion portions larger than the size of the opening portion of the chip-shaped electronic component insertion portion provided on the base plate and a protrusion that regulates the range of the movable plate back-and-forth movement provided on the bottom plate Corresponding to the movable plate mounted on the movable plate insertion portion of the frame plate having a plurality of movement position restricting holes to be engaged, and the chip-shaped electronic component insertion portion provided on the movable plate The chip-shaped electronic component insertion portions are arranged in the same staggered arrangement and are densely arranged, and the opening of the chip-shaped electronic component insertion portion is rectangular and has a symmetrical axis of 30 to 60 degrees. If the rectangular shape is a square, the side length is 2 mm to 15.5 mm, or the rectangle is 2.5 mm to 16 mm in length and width A cover having a plurality of chip-like electronic component insertion portions and a plurality of fastening member insertion holes each having a length of 2 mm to 15.5 mm, the frame plate and the movable plate being disposed on the upper surface of the frame plate attached to the movable plate insertion portion A chip-shaped electronic component tray that has a plate and is fastened by a fastening member that is inserted into each fastening member insertion hole of the bottom plate, the frame plate, and the cover plate;
(2) Inserting a spacer plate inserted between the first movable plate and the second movable plate while being inserted into the movement position regulating hole of the first and second movable plates to regulate the movable range of the movable plate. A bottom plate having a plurality of protrusions penetrating the hole and a plurality of fastening member insertion holes;
One or two or more U-shaped movable plate insertion portions, a biasing means for biasing the second movable plate toward the opening end portion, and a plurality of fastening members at a portion facing the opening end portion of the movable plate insertion portion A second frame plate having an insertion hole and disposed on the upper surface of the bottom plate,
A plurality of rectangular chip-shaped electronic component insertion portions that are rectangular and have a symmetrical axis inclined at an angle of 30 to 60 degrees are arranged in a staggered manner and densely arranged, and the chip-shaped electronic component insertion portions A buffer member that absorbs the manufacturing tolerance error of the dimensions of the chip-shaped electronic component is provided on the two adjacent opening walls on the biasing means side, and the size of the opening of the chip-shaped electronic component insertion portion is the cover plate. A plurality of chip-like electronic component insertion portions that are larger than the size of the opening portion of the provided chip-like electronic component insertion portion by the size of the buffer member, and a protrusion that restricts the range of left-right movement of the movable plate provided on the bottom plate A second movable plate attached to the movable plate insertion portion of the second frame plate having a plurality of movement position regulating holes into which
A chip-shaped electronic component insertion portion provided in the same staggered arrangement and densely arranged at a position corresponding to the chip-shaped electronic component insertion portion provided on the first and second movable plates, and the chip-shaped electronic component The opening of the component insertion portion is rectangular and has a shape in which the axis of symmetry is inclined at an angle of 30 ° to 60 °, and the length of the side of the rectangular shape is square. A plurality of chip-like electronic component insertion portions and a plurality of fastening member insertions having the same structure as the cover plate having a length of 2.5 mm to 16 mm and a width of 2 mm to 15.5 mm in a rectangle. A spacer plate having an insertion hole for a protrusion provided in the hole and the bottom plate, the second movable plate being disposed on the upper surface of the second frame plate attached to the movable plate insertion portion;
One or two or more U-shaped movable plate insertion portions, a biasing means for biasing the first movable plate in the direction of the opening end portion, and a plurality of fastening members at a portion facing the opening end portion of the movable plate insertion portion A first frame plate having an insertion hole and disposed on the upper surface of the spacer plate;
It has the same structure as the second movable plate, and has the same number as the first movable plate mounted on the movable plate insertion portion of the first frame plate and the chip-shaped electronic component insertion portion provided on the spacer plate. A cover plate having a chip-shaped electronic component insertion portion and a plurality of fastening member insertion holes having the same size and arrangement, and a first movable plate mounted on the movable plate insertion portion is disposed on the upper surface of the first frame plate. Have
A chip-like electronic component tray, which is fastened by a fastening member inserted into each fastening member insertion hole of the bottom plate, the second frame plate, the spacer plate, the first frame plate, and the cover plate;
It is about.

Here, the bottom plate may further be provided with a vacuum suction hole at a location corresponding to the chip-shaped electronic component insertion portion.
Also, in order to determine the relative positions of the fastening member insertion holes of the bottom plate, the frame plate, and the cover plate, or the bottom plate, the second frame plate, the spacer plate, the first frame plate, and the cover plate, A plurality of common positioning holes may be provided.

The present invention is applicable to chip-shaped electronic components, for example, chip-shaped electronic components having a rectangular shape such as 2 mm × 3 mm to 15 mm × 15.5 m, and chip-shaped electronic components having a square shape of 2 mm × 2 mm to 15 mm × 15 mm. The target is a chip-shaped electronic component tray. Moreover, the same effect can be obtained by changing the size of the insertion slot not only in the above size but also in other sizes.
In addition, as the fastening member, a member that can be easily fastened, such as a bolt or a screw, is used. For this reason, when there is a member that needs to be damaged or replaced, such as a movable plate, the tray can be easily disassembled, the member can be easily replaced, and can be re-assembled by fastening with the fastening member. The fastening member is inserted into a plurality of fastening member insertion holes provided in the bottom plate, the frame plate, the cover plate, and the spacer plate, and these plates are fastened to assemble the chip-shaped electronic component tray. At this time, in order to easily determine the relative positions of these plates, a plurality of positioning holes are separately provided in these plates, and the positioning members can be inserted into the positioning holes to determine the relative positions. . After that, when the fastening member is inserted into the fastening member insertion hole and these plates are fastened, fastening becomes extremely easy. That is, when the positioning hole is provided, when the fastening member is inserted into the fastening member insertion hole, the relative positioning of the three plates or the five plates becomes easy. As a result, the fastening of the three plates or the five plates is facilitated. The upper and lower positions of the member insertion holes are exactly overlapped, and the fastening by the fastening member becomes smoother.

When providing a large number of chip-shaped electronic component insertion parts in the chip-shaped electronic component tray, if one movable plate is enlarged, the movable plate is likely to be deformed as the movable plate is moved. Or a gap between the movable plate and the bottom plate, the chip-shaped electronic component tray may not function normally. In order to avoid such a case, the size of the movable plate should be adjusted by using a plurality of movable plates as shown in FIGS. 17 and 22 so that deformation does not occur between the plates. Can do. By doing in this way, it becomes easy to apply equal force by biasing means, such as a spring, to a chip-like electronic component insertion part.
The vacuum suction hole is provided in the bottom plate at a position corresponding to the chip-like electronic component insertion portion provided in the cover plate, the movable plate, or the spacer plate, and air is sucked through the vacuum suction hole and at the same time the chip-like electronic component Since it is also sucked by the chip-shaped electronic component insertion portion, it can serve as an auxiliary for inserting the chip-shaped electronic component into this insertion portion.
Further, a chip-shaped electronic component is provided by providing a buffer member that absorbs a difference in manufacturing tolerance of the chip-shaped electronic component on two adjacent opening walls on the biasing means side of the chip-shaped electronic component insertion portion of the movable plate. To prevent problems such as chipping electronic components stored and fixed in the insertion section without loosening, falling off during processing operations, or sticking to printing ink or screens, etc. Can do.

In addition, the thickness of the cover plate or movable plate used can be changed according to the dimensions of the chip-shaped electronic component to be handled. You may comprise a plate and may comprise the thing of required thickness independently.
Further, as in the second invention of the present invention, a combination of a spacer plate and a second movable plate / second frame plate is interposed between the bottom plate and the first movable plate / first frame plate. Then, a thick chip shape is formed by a five-layer structure of a cover plate, a first movable plate, a first frame plate, a spacer plate, a second movable plate, a second frame plate, and a bottom plate. The electronic component can be firmly and securely held and fixed to the electronic component insertion portion provided on the cover plate, the first movable plate, the spacer plate, and the second movable plate. In this case, the buffer material on the opening wall of the chip-like electronic component insertion portion of the first movable plate and the buffer member on the opening wall of the chip-like electronic component insertion portion of the second movable plate firmly secure the chip-like electronic component. And securely hold and fix.
Furthermore, since it has a five-layer structure, not only the chip-like electronic component is inserted into the electronic component insertion portion in a planar shape, but also the chip-like electronic component is inserted vertically or with the side surface in contact with the bottom plate, Screen printing etc. can be applied to the side facing. Of course, even in a three-layer structure, the chip-like electronic component can be held and fixed to the insertion portion in a planar shape or in a vertical shape by adjusting the thickness of the movable plate or the cover plate.
Hereinafter, the chip-shaped electronic component may be referred to as an electronic component, the chip-shaped electronic component insertion portion may be referred to as an electronic component insertion portion or insertion portion, and the chip-shaped electronic component tray may be simply referred to as a tray.

The shape of the opening of the chip-like electronic component insertion portion provided in the movable plate, the cover plate, and the spacer plate is a rectangular shape including a square as shown in FIG. The axis Z′-Z ′ is inclined at 30 to 60 degrees (see FIGS. 27 b and 27 d). A rectangle is defined as a quadrangle having four equal corners, and a quadrangle having four equal sides is called a square. In the present invention, the shape including both of them is called a rectangular shape. Then, the rectangular symmetrical axis ZZ including the square or the symmetrical axis Z′-Z ′ is inclined at 30 degrees to 60 degrees. FIG. B shows a figure in which the axis of symmetry of the square is tilted 30 to 60 degrees to the right as shown in FIG. B. In the case of a square, the one tilted 30 to 60 degrees to the left is the same as FIG. It becomes the shape of a rhombus. FIG. D shows the case of FIG. C, in which the axis of symmetry of a vertically long rectangle is tilted 30 to 60 degrees to the right. When it is tilted 30 to 60 degrees to the left, it has a shape tilted leftward (not shown in FIG. 27). In the case of a horizontally long rectangle, the one tilted 30 degrees to 60 degrees to the right has an upward leftward shape, and the one inclined 30 degrees to 60 degrees to the right has an upward rightward shape. The rhombus means that the lengths of the four sides are equal. Here, the rhombus may be referred to as a rhombus shape as an expression including a deformed shape as shown in FIG.
The rhombus-shaped chip-shaped electronic component insertion portion shown in FIGS. 27 and 27 in FIG. 27 is formed on the cover plate and the movable plate. To mount and fix the chip-shaped electronic component, this rhombus-shaped chip-shaped electronic component is used. A considerable number of insertion portions must be provided. For this purpose, the diamond-shaped chip-shaped electronic component insertion portions are arranged so as to be closely spaced as shown in FIG. 1 and FIG. It will be necessary. At this time, the interval between the openings of the insertion portion is determined in consideration of the size of the chip-shaped electronic component to be inserted / fixed and the material and thickness of the chip-shaped electronic component tray such as the cover plate and the movable plate. In this way, the maximum chip-shaped electronic component insertion part can be provided on the cover plate and the movable plate, and when used as a screen printing jig, the squeegee is always used when printing. Since it is in contact with the printed part of the chip-shaped electronic component and does not pass through the gap of the chip-shaped electronic component unlike the printing using the conventional jig, the movement of the squeegee is smooth, high accuracy, High-definition printing is possible.
In the case of chip-shaped electronic component insertion portions provided on the cover plate and the spacer plate, the size of the opening is 2 mm to 15.5 mm on the side in the square shape, or in the rectangular shape. Has a length of 2.5 mm to 16 mm and a width of 2 mm to 15.5 mm.
In the case of the chip-shaped electronic component insertion portion provided on the movable plate, the adjacent two opening wall 31b on the open end side of the opening absorbs the manufacturing tolerance error of the size of the chip-shaped electronic component. Since the buffer member is provided, the side becomes longer in the case of a square by the size, and the length and the width become longer in the case of a rectangle. In this case, the size 31w of the buffer member is the size of the protruding portion of the buffer member 31a from the opening wall 31b as seen in FIG. 3b1.
FIG. 28 schematically shows the arrangement and shape of openings in a conventional electronic component insertion portion. The shape of the electronic component insertion portion in the cover plate or the like is a substantially square shape as shown in FIG. B, and means for holding the electronic component in the opening of this shape is provided at the corner of the opening. The electronic component insertion portions are arranged in a vertical row, and a plurality of the vertical row arrangements are arranged at regular intervals. For this reason, the problem as already shown will arise in the conventional one.

The present invention is a tray corresponding to a chip-shaped electronic component, and can improve productivity by storing and fixing the chip-shaped electronic component, and also improve surface smoothness, adsorptivity, and electronic component holding function. And workability can be improved.
Further, by driving the movable plate uniaxially, the chip-shaped electronic component can be held from two directions at the chip-shaped electronic component insertion portion, and the number of components of the chip-shaped electronic component tray can be reduced. . In addition, it is possible to suppress the generation of scratches on the side surface of the chip when the chip-shaped electronic component is stored and fixed, and to improve the yield in manufacturing the chip-shaped electronic component.
Furthermore, when this chip-shaped electronic component tray was used as a jig for screen printing, no squeegee rattling occurred and high-precision and high-definition printing was possible. In addition, in the square shape of the opening of the chip-like electronic component insertion portion as shown in FIG. 20 in the past, various problems have occurred from the viewpoint of coating uniformity due to shakiness of the squeegee. Uniformity of coating can be realized by forming a rectangular shape with a symmetrical axis inclined at 30 to 60 degrees and densely arranged.
Furthermore, if the chip-shaped electronic component tray of the present invention is continuously used for a long time, the buffer member may be deformed or missing, and the movable plate needs to be replaced. In such a case, since the tray can be disassembled by removing the fastening member, there is also an advantage that the movable plate can be replaced and the tray can be reassembled and regenerated.

FIG. 1 shows a plan view of a first example of a chip-shaped electronic component tray of the present invention. FIG. 2 is a partially cutaway view of the chip-shaped electronic component tray of FIG. Here, the cover plate, the movable plate, and the frame plate are partially cut away. 3 is a partial plan view of a chip-shaped electronic component insertion portion of the chip-shaped electronic component tray shown in FIG. 1, a partial plan view when the chip-shaped electronic component is inserted into the chip-shaped electronic component insertion portion, and a chip shape. The partial top view which inserted the chip-shaped electronic component in the electronic component insertion part is shown, and the fragmentary sectional view of the chip-shaped electronic component tray of the vicinity of the chip-shaped electronic component insertion part in these cases is shown, respectively. FIG. 4 shows a plan view of the cover plate. FIG. 5 shows a plan view of the frame plate. 6A shows a plan view of the movable plate, and FIG. 6B shows a partially enlarged view of the chip-like electronic component insertion portion 31 shown in FIG. 7 shows a plan view of the movable plate of FIG. 6 mounted on the frame plate of FIG. FIG. 8 shows a plan view of the bottom plate. FIG. 9 is a plan view of a second example of the chip-shaped electronic component tray of the present invention. FIG. 10 is a partially cutaway view of the chip-shaped electronic component tray of FIG. Here, the cover plate, the movable plate, and the frame plate are partially cut away. 11 is a partial plan view of a chip-shaped electronic component insertion portion of the chip-shaped electronic component tray shown in FIG. 9, a partial plan view when the chip-shaped electronic component is inserted into the chip-shaped electronic component insertion portion, and a chip shape. The partial top view which inserted the chip-shaped electronic component in the electronic component insertion part is shown, and the fragmentary sectional view of the chip-shaped electronic component tray of the chip-shaped electronic component insertion part vicinity in these cases is each shown. FIG. 12 shows a plan view of the cover plate. FIG. 13 shows a plan view of the frame plate. 14A shows a plan view of the movable plate, and FIG. 14B shows a partially enlarged view of the chip-like electronic component insertion portion 31 shown in FIG. 15 shows a plan view of the movable plate of FIG. 14 mounted on the frame plate of FIG. FIG. 16 shows a plan view of the bottom plate. FIG. 17 is a plan view of a third example of the chip-shaped electronic component tray of the present invention. FIG. 18 shows a plan view of the cover plate. FIG. 19 shows a plan view of the frame plate. FIG. 20 shows a plan view of the movable plate combined with the frame plate of FIG. FIG. 21 shows a plan view of the bottom plate. FIG. 22 shows a plan view of a fourth example of the chip-shaped electronic component tray of the present invention. FIG. 23 shows a plan view of the cover plate. FIG. 24 shows a plan view of the frame plate. FIG. 25 shows a plan view of the movable plate mounted on the frame plate of FIG. FIG. 26 shows a plan view of the bottom plate. FIG. 27 is a view for explaining the shape of the opening of the chip-shaped electronic component insertion portion in which a rectangular and symmetric axis including a square is inclined at an angle of 30 to 60 degrees. FIG. 28 schematically shows the shape of the opening of the conventional electronic component insertion portion and the arrangement of the holding member. FIG. 29 is a plan view of a fifth example of the chip-shaped electronic component tray of the present invention. FIG. 30 shows a plan view of the cover plate. FIG. 31 shows a plan view of the first frame plate. FIG. 32 is a plan view of the movable plate mounted on the first frame plate of FIG. FIG. 33 shows a plan view of the spacer plate. FIG. 34 shows a plan view of the second frame plate. FIG. 35 shows a plan view of the second movable plate combined with the second frame plate of FIG. FIG. 36 shows a plan view of the bottom plate. FIG. 36 is a partial cross-sectional view of the chip-shaped electronic component tray in the vicinity of the chip-shaped electronic component insertion portion of the chip-shaped electronic component tray shown in FIG. FIG. 38 is a partial cross-sectional view of the vicinity of the protrusion that regulates the range of left and right movement of the movable plate provided on the bottom plate in the chip-shaped electronic component tray shown in FIG. Fig. 39 shows Japanese Industrial Standard "Electronic Equipment Fixed Capacitors Part 21: General Rules for Each Type: Surface Mounted Fixed Multilayer Ceramic Capacitor Type 1 JISC 5101-21: 2006 Annex A (normative) Surface Mounted Fixed Multilayer Ceramic Capacitor Types 1 Dimensional Symbols and Regulation Guidelines Appendix A Table 1 Dimensions ”.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

A first example of the chip-shaped electronic component tray of the present invention is shown in FIG. FIG. 1 is a plan view of the chip-shaped electronic component tray 1.
Here, 10 indicates a cover plate of the chip-shaped electronic component tray, and 11 indicates a chip-shaped electronic component insertion portion. A fastening member 13 is inserted into fastening member insertion holes 19, 29, and 49 provided in the cover plate 10, the frame plate 20, and the bottom plate 40 to fasten these three members. Reference numeral 30 denotes a movable plate, which is attached to the movable plate insertion portion 24 of the frame plate 20. When the movable plate 30 is physically pushed into the cover plate side, the chip-like electronic component insertion portion 11 of the cover plate and the chip-like electronic component insertion portion 31 provided on the movable plate coincide with each other. When the chip-shaped electronic component is inserted into the space of the insertion portion and the pushing force applied to the movable plate 30 is released, the chip-shaped electronic component insertion portion 31 of the movable plate is displaced toward the open end, and the chip-shaped electronic component of the cover plate The chip-shaped electronic component is fixed by the insertion portion 11 and the chip-shaped electronic component insertion portion 31 of the movable plate. At this time, the chip-shaped electronic component is more directly pressed against the opening wall of the chip-shaped electronic component insertion portion 11 and stored and fixed by the buffer member 31a provided on the opening wall of the chip-shaped electronic component insertion portion 31 of the movable plate. The Rukoto.

The structure of the chip-shaped electronic component tray 1 shown in FIG. 1 is that shown in FIG. FIG. 2 is a partially cutaway view of the electronic component tray 1 shown in FIG. 1, with the cover plate, the movable plate, and the frame plate partially cut away, and as a whole, the cover plate layer and the movable plate And a frame plate layer and a bottom plate layer.
In FIG. 2, the place shown in the upper left shows the bottom plate 40 disposed at the bottom of the chip-shaped electronic component tray 1, and the place shown in the middle is a frame of an intermediate structure of the chip-shaped electronic component tray 1. The plate 20 and the movable plate 30 are shown, and the portion described below shows the cover plate 10 on the upper surface of the chip-shaped electronic component tray 1, and the cover plate 10 is arranged above the frame plate 20 and the movable plate 30. It has a three-layer structure.

3 is a partial plan view of a chip-shaped electronic component insertion portion of the chip-shaped electronic component tray shown in FIG. 1, a partial plan view when the chip-shaped electronic component is inserted into the chip-shaped electronic component insertion portion, and a chip shape. The partial top view which inserted the chip-shaped electronic component in the electronic component insertion part is shown, and the fragmentary sectional view of the chip-shaped electronic component tray of the vicinity of the chip-shaped electronic component insertion part in these cases is shown, respectively.
3 is a partial plan view of the chip-shaped electronic component insertion portion of each chip-shaped electronic component tray shown in FIG. FIG. a2 shows a sectional view taken along line X′-X ′ in FIG. Here, the bottom plate 40 is disposed in the lower part of the three-layer structure, the movable plate 30 is disposed in the middle, and the cover plate 10 is disposed in the upper part. Reference numeral 11 denotes a chip-like electronic component insertion portion provided on the cover plate 10, and 31 denotes a chip-like electronic component insertion portion provided on the movable plate 30. Reference numeral 31 a denotes a buffer member that absorbs a difference in manufacturing allowable dimensions of the chip-shaped electronic component provided on the opening wall 31 b of the chip-shaped electronic component insertion portion 31. Here, the buffer member 31a is actually provided in two adjacent opening walls 31b on the biasing means side provided in the frame plate. The buffer member 31a does not loosen the chip-shaped electronic component housed and fixed in the chip-shaped electronic component insertion portion and falls off during the processing operation, or sticks to the printing paste or ink and comes out of the chip-shaped electronic component tray. It is possible to prevent failures such as end.
FIG. b1 illustrates the opening of the chip-like electronic component insertion portion 11 of the cover plate 10 and the opening of the chip-like electronic component insertion portion 31 of the movable plate 30 by moving the movable plate 30 of FIG. 1 to the right. It is the figure which made it the state where it was made to correspond and the chip-shaped electronic component 50 could be inserted. A cross-sectional view taken along line X ″ -X ″ in FIG.
FIG. c1 shows a state in which the chip-shaped electronic component 50 is housed and fixed in the chip-shaped electronic component insertion portion, and FIG. c2 shows a cross-sectional view taken along line X ′ ″-X ″ ′ of FIG.
In FIG. c1, the chip-like electronic component 50 is inserted into the chip-like electronic component insertion portion in the state shown in FIG. b1, and then the movable plate is urged to the left by the urging means 28 provided on the frame plate 20 to produce the chip-like electronic. The component 50 is pressed against the opening wall of the chip-shaped electronic component insertion portion 11 of the cover plate 10 by the buffer member 31a to be stored and fixed.
The shape of the opening of the chip-like electronic component insertion portion is a substantially square diamond shape as shown in the figure. For this reason, the chip-like electronic component 50 inserted into the chip-like electronic component insertion portion 11 of the cover plate 10 and the chip-like electronic component insertion portion 31 of the movable plate 30 urges the movable plate as shown in FIG. The frame plate of the chip-shaped electronic component insertion portion 11 is pushed by two adjacent opening walls on the biasing means 28 side of the chip-shaped electronic component insertion portion 31 that is biased by the frame 28 toward the open end portion of the frame plate. Are pressed against two adjacent opening walls on the open end side. At this time, the chip-shaped electronic component is more firmly housed and fixed by the buffer members 31a respectively provided on the two adjacent opening walls on the biasing means 28 side of the chip-shaped electronic component insertion portion 31. . Thus, even if it does not urge the chip-shaped electronic component insertion portion from two directions, it is adjacent to the open end portion side of the frame plate of the chip-shaped electronic component insertion portion 11 only by urging from one direction of the rhombus. Since it is pressed against the two opening walls, the structure is further simplified.

FIG. 4 shows a plan view of the cover plate 10.
The cover plate 10 is provided with the same number of chip-like electronic component insertion portions 11 at the same interval as the chip-like electronic component insertion portion provided on the movable plate, and the size of the opening of the chip-like electronic component insertion portion is as follows. The length in the longitudinal direction (long side) is longer than the length of the upper or lower surface of the chip-shaped electronic component stored and fixed vertically, and the length of the short side is slightly longer than the thickness of the chip-shaped electronic component to be stored and fixed. It has become. Reference numeral 19 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 10, the frame plate 20, and the bottom plate 40.

FIG. 5 shows a plan view of the frame plate 20.
The frame plate 20 is provided with a U-shaped movable plate insertion portion 24, and a biasing means 28 such as a spring is provided at a portion facing the U-shaped opening end portion 24a. When mounted on the movable plate insertion portion 24 having a shape, the movable plate 30 is urged toward the movable plate opening end. Reference numeral 29 denotes a fastening member insertion hole. The fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 10, the frame plate 20, and the bottom plate 40.

6 shows a plan view of the movable plate 30. FIG. The movable plate 30 is mounted on the movable plate insertion portion 24 of the frame plate 20, and a plurality of electronic component insertion portions 31 are provided, and the movement position is restricted so that the movable plate 30 does not jump out of the movable plate insertion portion 24 of the electronic component tray. A hole 32 is provided. A protrusion 42 provided on the bottom plate 40 enters the movement position restricting hole 32 so that the movable plate 30 can move within the movable plate insertion portion 24 and the movable plate 30 protrudes from the movable plate insertion portion 24. It is supposed not to.
FIG. 6 b shows a partially enlarged view of the chip-shaped electronic component insertion portion 31. A buffer member 31a that absorbs the difference in manufacturing tolerance of minute chip-shaped electronic components is provided on two adjacent opening walls 31b on the biasing means side of the chip-shaped electronic component insertion portion 31, and the chip-shaped electronic component insertion is performed. The chip-like electronic components housed and fixed in the unit can be prevented from loosening and falling off during processing operations, etc., or sticking to printing paste or ink and coming out of the chip-like electronic component tray .

  7 shows a plan view of the movable plate of FIG. 6 mounted on the frame plate of FIG. In such a state, it is placed on the upper surface of the bottom plate 40. A fastening member is inserted into the fastening member insertion hole, and the three plates of the cover plate 10, the frame plate 20, and the bottom plate 40 are fastened.

FIG. 8 shows a plan view of the bottom plate 40.
The bottom plate 40 is provided with a protrusion 42, and this protrusion 42 enters the movement position restricting hole 32 of the movable plate 30 so that the movable plate 30 can move back and forth in the movable plate insertion portion 24. The movable plate 30 is prevented from protruding from the movable plate insertion portion 24. Reference numeral 49 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 10, the frame plate 20, and the bottom plate 40.

A manufacturing method of the chip-shaped electronic component tray 1 will be described with reference to FIGS.
The frame plate 20 shown in FIG. 5 is placed on the upper surface of the bottom plate 40 shown in FIG. 8, and the movable plate 30 is mounted on the movable plate insertion portion 24 of the frame plate 20. 42 is engaged with the movement position restricting hole 32 of the movable plate 30 to restrict the distance of the left and right movement within the movable plate insertion portion 24 and to prevent the movable plate insertion portion 24 from jumping out. As a result, a structure in which the movable plate 30 is mounted on the movable plate insertion portion 24 of the frame plate 20 as shown in FIG. It should be noted that the movable plate insertion portion 24 is preloaded with a biasing means 28 such as a spring for biasing the movable plate 24 in the direction of the opening end 24a.

  Next, the cover plate 10 shown in FIG. 4 is placed on these upper surfaces, and the fastening members are inserted into the fastening member insertion holes 19 of the cover plate 10, the fastening member insertion holes 29 of the frame plate 20, and the fastening member insertion holes 49 of the bottom plate 40. The chip-shaped electronic component tray 1 shown in FIG. 1 is assembled and manufactured by inserting 13 and fastening the three plates. When a malfunction occurs in the movable plate 30 or the cover plate 10, the fastening member 13 is removed, only the plate in which the malfunction has occurred is replaced, and the fastening member 13 is inserted into the fastening member insertion holes 19, 29, and 49 again. Can be assembled.

A second example of the chip-shaped electronic component tray of the present invention is shown in FIG. FIG. 9 is a plan view of the chip-shaped electronic component tray 101.
Here, 110 indicates a cover plate, and 111 indicates a chip-shaped electronic component insertion portion. Reference numeral 117 denotes a positioning hole. Positioning members are inserted into positioning holes 117, 127, and 147 provided in the cover plate 110, the frame plate 120, and the bottom plate 140, respectively, and the relative positions of the cover plate 110, the frame plate 120, and the bottom plate 140 are determined. Next, the fastening member 113 is inserted into the fastening member insertion holes 119, 129, and 149, and the chip-shaped electronic component tray is assembled. If the positioning hole is provided, the relative positioning of the three plates is facilitated when the fastening member is inserted into the fastening member insertion hole, and as a result, the upper and lower positions of the fastening member insertion holes of the three plates are exactly Fastening by the overlapping fastening member becomes smoother. A fastening member 113 is inserted into fastening member insertion holes 119, 129, and 149 provided in the cover plate 110, the frame plate 120, and the bottom plate 140, and fastens these three members. A movable plate 130 is attached to the movable plate insertion portion 124 of the frame plate 120. When the movable plate 130 is physically pushed to the cover plate side, the chip-like electronic component insertion portion 111 of the cover plate and the chip-like electronic component insertion portion 131 provided on the movable plate coincide with each other. When the chip-shaped electronic component is inserted into the space of the insertion portion and the pushing force applied to the movable plate 130 is released, the chip-shaped electronic component insertion portion 131 of the movable plate is displaced toward the open end, and the chip-shaped electronic component of the cover plate The chip-shaped electronic component is fixed by the insertion portion 111 and the chip-shaped electronic component insertion portion 131 of the movable plate. At this time, the chip-shaped electronic component is more strongly pressed against the opening wall of the chip-shaped electronic component insertion portion 111 and stored and fixed by the buffer member 131a provided on the opening wall of the chip-shaped electronic component insertion portion 131 of the movable plate. The Rukoto.

The structure of the chip-shaped electronic component tray 101 shown in FIG. 9 is the structure shown in FIG. FIG. 10 is a partially cutaway view of the electronic component tray 101 shown in FIG. 9, in which the cover plate, the movable plate, and the frame plate are partially cut away. And a frame plate layer and a bottom plate layer. That is, the cover plate 110 has a three-layer structure in which the frame plate 120 and the movable plate 130 are arranged on the upper surface of the bottom plate 140.
In FIG. 10, the place shown at the upper left shows the bottom plate 140 disposed at the bottom of the chip-shaped electronic component tray 101, and the place shown in the middle is a frame of an intermediate structure of the chip-shaped electronic component tray 101. The plate 120 and the movable plate 130 are shown, and the lower part shows the cover plate 110 on the upper surface of the chip-shaped electronic component tray 101. Reference numerals 117 and 127 denote positioning holes. Positioning members are inserted into positioning holes 117, 127, and 147 provided in the cover plate 110, the frame plate 120, and the bottom plate 140, respectively, and the relative positions of the cover plate 110, the frame plate 120, and the bottom plate 140 are determined. Next, the fastening member 113 is inserted into the fastening member insertion holes 119, 129, and 149 to assemble the chip-shaped electronic component tray.

FIG. 11 is a partial plan view (a1) of the chip-shaped electronic component insertion portion of the chip-shaped electronic component tray shown in FIG. 9, and a partial plan view when the chip-shaped electronic component is inserted into the chip-shaped electronic component insertion portion. (B1) and a partial plan view (FIG. C1) in which the chip-shaped electronic component is inserted into the chip-shaped electronic component insertion portion, and a partial sectional view of each chip-shaped electronic component tray in the vicinity of the chip-shaped electronic component insertion portion (A2 figure, b1 figure, c1 figure) are shown.
That is, a1 of FIG. 11 shows a partial plan view of the chip-shaped electronic component insertion portion of each chip-shaped electronic component tray shown in FIG. FIG. a2 shows a sectional view taken along line Y′-Y ′ in FIG. Here, the bottom plate 140 is disposed in the lower part of the three-layer structure, the movable plate 130 is disposed in the middle, and the cover plate 110 is disposed in the upper part. Reference numeral 111 denotes a chip-like electronic component insertion portion provided on the cover plate 110, and 131 denotes a chip-like electronic component insertion portion provided on the movable plate 130. Reference numeral 131a denotes a buffer member that absorbs a difference in manufacturing allowable dimensions of the chip-shaped electronic component provided on the opening wall 131b of the chip-shaped electronic component insertion portion 131. Here, the buffer part 131a is actually provided in two adjacent opening part walls 131b on the biasing means side provided in the frame plate. The buffer member 131a does not loosen the chip-shaped electronic component housed and fixed in the chip-shaped electronic component insertion section and falls off during the processing operation, or sticks to the printing paste or ink and comes out of the chip-shaped electronic component tray. It is possible to prevent failures such as end.
In FIG. b1, the movable plate 130 in FIG. 9 is moved to the right in the figure, and the opening of the chip-like electronic component insertion portion 111 of the cover plate 110 and the opening of the chip-like electronic component insertion portion 131 of the movable plate 130 are moved. As shown in the figure, the chip-like electronic component 150 is in a state in which it can be inserted and matched. A cross-sectional view taken along line Y ″ -Y ″ in FIG.
FIG. c1 shows a state in which the chip-shaped electronic component 150 is housed and fixed in the chip-shaped electronic component insertion portion, and FIG. c2 shows a cross-sectional view taken along the line Y ′ ″-Y ″ ′ of FIG.
In FIG. c1, the chip-like electronic component 150 is inserted into the chip-like electronic component insertion portion in the state shown in FIG. b1, and then the movable plate is urged to the left in the figure by the urging means 128 provided on the frame plate 120. The shaped electronic component 150 is pressed against the opening wall of the chip-shaped electronic component insertion portion 111 of the cover plate 110 by the buffer member 131a to be stored and fixed.
The shape of the opening of the chip-like electronic component insertion portion is a substantially square diamond shape as shown in the figure. For this reason, the chip-shaped electronic component 150 inserted into the chip-shaped electronic component insertion portion 111 of the cover plate 110 and the chip-shaped electronic component insertion portion 131 of the movable plate 130, as shown in FIG. When it is urged toward the open end portion of the frame plate by 128, it is pushed by two adjacent opening walls on the urging means 128 side of the chip-shaped electronic component insertion portion 131, and the frame plate of the chip-shaped electronic component insertion portion 111 is pushed. It is pressed against two adjacent opening walls on the open end side. At this time, the chip-shaped electronic component is more firmly housed and fixed by the buffer members 131 a provided on the two adjacent opening walls on the biasing means 128 side of the chip-shaped electronic component insertion portion 131. In this way, even if the chip-shaped electronic component insertion portion is not biased from two directions, it is adjacent to the open end portion side of the frame plate of the chip-shaped electronic component insertion portion 111 only by biasing from one direction of the rhombus. Since it is pressed against the two opening walls, the structure is further simplified.

FIG. 12 shows a plan view of the cover plate 110.
The cover plate 110 is provided with the same number of chip electronic component insertion portions 111 at the same interval as the chip electronic component insertion portions provided on the movable plate, and the size of the opening of the chip electronic component insertion portion is as follows. The length in the longitudinal direction (long side) is longer than the length of the upper or lower surface of the chip-shaped electronic component stored and fixed vertically, and the length of the short side is slightly longer than the thickness of the chip-shaped electronic component to be stored and fixed. It has become. Reference numeral 119 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 110, the frame plate 120, and the bottom plate 140.
Reference numeral 117 denotes a positioning hole. Positioning members are inserted into positioning holes 117, 127, and 147 provided in the cover plate 110, the frame plate 120, and the bottom plate 140, respectively, and the relative positions of the cover plate 110, the frame plate 120, and the bottom plate 140 are determined. Next, the fastening member 113 is inserted into the fastening member insertion holes 119, 129, and 149 to assemble the chip-shaped electronic component tray.

FIG. 13 shows a plan view of the frame plate 120.
The frame plate 120 is provided with a U-shaped movable plate insertion portion 124, and a biasing means 128 such as a spring is provided at a portion facing the U-shaped opening end portion 124a. When mounted on the movable plate insertion portion 124 having a shape, the movable plate 130 is urged toward the opening end of the movable plate. Reference numeral 129 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 110, the frame plate 120, and the bottom plate 140. Reference numeral 127 denotes a positioning hole. Positioning members are inserted into positioning holes 117, 127, and 147 provided in the cover plate 110, the frame plate 120, and the bottom plate 140, respectively, and the relative positions of the cover plate 110, the frame plate 120, and the bottom plate 140 are determined. Next, the fastening member 113 is inserted into the fastening member insertion holes 119, 129, and 149 to assemble the chip-shaped electronic component tray.

14 shows a plan view of the movable plate 130. FIG.
The movable plate 130 is mounted on the movable plate insertion portion 124 of the frame plate 120, and a plurality of electronic component insertion portions 131 are provided, and the movement position is restricted so that the movable plate 130 does not jump out of the movable plate insertion portion 124 of the electronic component tray. A hole 132 is provided. The protrusion 142 provided on the bottom plate 140 enters the movement position restricting hole 132 so that the movable plate 130 can move left and right within the movable plate insertion portion 124 and the movable plate 130 is movable plate insertion portion 124. It is designed not to jump out more.
FIG. 14 b shows a partially enlarged view of the chip-shaped electronic component insertion portion 131. A buffer member 131a that absorbs a difference in manufacturing tolerance of minute chip-shaped electronic components is provided on two adjacent opening walls 131b on the biasing means side of the chip-shaped electronic component insertion portion 131, and the chip-shaped electronic component insertion is performed. The chip-like electronic components housed and fixed in the unit can be prevented from loosening and falling off during processing operations, etc., or sticking to printing paste or ink and coming out of the chip-like electronic component tray .

  15 shows a plan view of the movable plate of FIG. 14 mounted on the frame plate of FIG. In such a state, it is placed on the upper surface of the bottom plate 140. A fastening member is inserted into the fastening member insertion hole, and the three plates of the cover plate 110, the frame plate 120, and the bottom plate 140 are fastened.

FIG. 16 shows a plan view of the bottom plate 140.
The bottom plate 140 is provided with a protrusion 142, and this protrusion 142 enters the movement position restricting hole 132 of the movable plate 130 so that the movable plate 130 can move in the left and right within the movable plate insertion portion 124. The movable plate 130 is prevented from jumping out from the movable plate insertion portion 124. Reference numeral 149 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 110, the frame plate 120, and the bottom plate 140.
Reference numeral 141 denotes a vacuum suction hole. The vacuum suction hole is provided in the bottom plate at a position corresponding to the chip-shaped electronic component insertion portion provided in the cover plate or the movable plate. Air is sucked through the vacuum suction hole, and at the same time, the chip-shaped electronic component is also chip-shaped. Since it is sucked by the electronic component insertion portion, it can serve as an auxiliary for inserting the chip-like electronic component into this insertion portion.
Reference numeral 147 denotes a positioning hole. Positioning members are inserted into positioning holes 117, 127, and 147 provided in the cover plate 110, the frame plate 120, and the bottom plate 140, respectively, and the relative positions of the cover plate 110, the frame plate 120, and the bottom plate 140 are determined. Next, the fastening member 113 is inserted into the fastening member insertion holes 119, 129, and 149 to assemble the chip-shaped electronic component tray.

A manufacturing method of the chip-shaped electronic component tray 101 will be described with reference to FIGS.
The frame plate 120 shown in FIG. 13 is placed on the upper surface of the bottom plate 140 shown in FIG. The movable plate 130 is attached to the movable plate insertion portion 124 of the frame plate 120, and the protrusion 142 provided on the bottom plate is engaged with the movement position restricting hole 132 of the movable plate 130. Thereby, the movable plate 130 is prevented from jumping out of the movable plate insertion portion 124 while the distance of the left and right movement in the movable plate insertion portion 124 is restricted. As a result, a structure in which the movable plate 130 is mounted on the movable plate insertion portion 124 of the frame plate 120 as shown in FIG. It should be noted that the movable plate insertion portion 124 is preloaded with a biasing means 128 such as a spring for biasing the movable plate 130 toward the opening end portion 124a.

Next, the cover plate 110 shown in FIG. Then, positioning members are inserted into positioning holes 117, 127, and 147 provided in the cover plate 110, the frame plate 120, and the bottom plate 140, respectively, and the relative positions of the cover plate 110, the frame plate 120, and the bottom plate 140 are determined. Then, the upper and lower positions of the fastening member insertion holes 119, 129, and 149 overlap exactly, and the fastening by the fastening member is smoother. Next, the fastening member 113 is inserted into the fastening member insertion holes 119, 129, and 149, and the chip-shaped electronic component tray 101 is assembled.
When the chip-shaped electronic component tray 101 is used, if a malfunction occurs in the movable plate 130 or the cover plate 110, the fastening member 113 is removed, only the defective plate is replaced, and the fastening member is inserted again. The fastening member 113 can be inserted into the holes 119, 129, and 149 and assembled.

FIG. 17 shows a third example of the chip-shaped electronic component tray of the present invention.
In this example, two movable plate insertion portions are provided side by side on the frame plate, and the movable plates are respectively attached to the movable plate insertion portions.
In FIG. 17, 201 is a chip-shaped electronic component tray, 210 is a cover plate, 211 is a chip-shaped electronic component insertion portion provided on the cover plate, and 230 is a movable plate. The movable plate 230 is urged toward the open end 224a of the movable plate insertion portion 224 by the urging means 228 provided on the frame plate 220, so that the end of the movable plate is the cover plate as shown in FIG. It sticks out more. Reference numeral 217 denotes a positioning hole.
Inserting positioning members into positioning holes 217, 227, and 247 provided in the cover plate 210, the frame plate 220, and the bottom plate 240, respectively, to determine the relative positions of the cover plate 210, the frame plate 220, and the bottom plate 240; Subsequently, the chip-shaped electronic component tray is assembled by inserting the fastening member 213 into the fastening member insertion holes 219, 229, and 249. If the positioning hole is provided, the relative positioning of the three plates is facilitated when the fastening member is inserted into the fastening member insertion hole, and as a result, the upper and lower positions of the fastening member insertion holes of the three plates are exactly Fastening by the overlapping fastening member becomes smoother. Reference numeral 213 denotes a fastening member, which is inserted into fastening member insertion holes 219, 229, and 249 provided in the cover plate 210, the frame plate 220, and the bottom plate 240, respectively, to fasten these three members.
The manufacturing method of the chip-shaped electronic component tray 201 is performed by the same procedure as the manufacturing method of the chip-shaped electronic component tray 1. This manufacturing method will be briefly described with reference to FIGS.

FIG. 18 shows a plan view of the cover plate 210.
The cover plate 210 is provided with the same number of chip-like electronic component insertion portions 211 at the same interval as the chip-like electronic component insertion portion provided on the movable plate, and the size of the opening of the chip-like electronic component insertion portion is as follows. The length in the longitudinal direction (long side) is longer than the length of the upper or lower surface of the chip-shaped electronic component stored and fixed vertically, and the length of the short side is slightly longer than the thickness of the chip-shaped electronic component to be stored and fixed. It has become. Reference numeral 217 denotes a positioning hole. Reference numeral 219 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 210, the frame plate 220, and the bottom plate 240.

FIG. 19 shows a plan view of the frame plate 220.
The frame plate 220 is provided with a U-shaped movable plate insertion portion 224, and a biasing means 228 such as a spring is provided at a portion facing the U-shaped opening end 224a. When mounted on the movable plate insertion portion 224 having a shape, the movable plate 230 is urged toward the opening end of the movable plate. Reference numeral 229 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 210, the frame plate 220, and the bottom plate 240.
As shown in FIG. 19, two movable plate insertion portions 224 are formed in the frame plate 220 so that the two movable plates can be inserted.

20 is a plan view in which a movable plate 230 having the same structure as the movable plate shown in FIGS. 6 and 14 is mounted on the movable plate insertion portion 224 shown in FIG.
Here, 220 is a frame plate, 231 is a chip-shaped electronic component insertion portion provided on the movable plate, 232 is a movement position restricting hole provided on the movable plate, and 227 is a positioning hole.
In such a state, it is placed on the upper surface of the bottom plate 240. After the positioning member is inserted into the positioning hole of each plate and the relative position of each plate is determined to match the fastening member communication hole, the fastening member is inserted into the fastening member insertion hole, and the cover plate 210 and the frame plate The three plates 220 and the bottom plate 240 are fastened.

FIG. 21 shows a plan view of the bottom plate 240.
The bottom plate 240 is provided with a protruding portion 242, and this protruding portion 242 is engaged with the movement position restricting hole 232 of the movable plate 230 so that the movable plate 230 can move in the movable plate insertion portion 224 left and right. In addition, the movable plate 230 does not protrude from the movable plate insertion portion 224. Reference numeral 249 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 210, the frame plate 220, and the bottom plate 240.
Reference numeral 241 denotes a vacuum suction hole. The vacuum suction hole is provided in the bottom plate at a position corresponding to the chip-shaped electronic component insertion portion provided in the cover plate or the movable plate. Air is sucked through the vacuum suction hole, and at the same time, the chip-shaped electronic component is also chip-shaped. Since it is sucked by the electronic component insertion portion, it can serve as an auxiliary for inserting the chip-like electronic component into this insertion portion. The number of vacuum suction holes 241 is at least equal to the number of chip-shaped electronic component insertion portions 231 provided in the movable plate, and is provided in the region of the opening of the chip-shaped electronic component insertion portion 231.
Reference numeral 227 denotes a positioning hole. Inserting positioning members into positioning holes 217, 227, and 247 provided in the cover plate 210, the frame plate 220, and the bottom plate 240, respectively, to determine the relative positions of the cover plate 210, the frame plate 220, and the bottom plate 240; Next, the fastening member 213 is inserted into the fastening member insertion holes 219, 229, and 249 to assemble the chip-shaped electronic component tray.

Since the manufacturing method of the chip-shaped electronic component tray 201 is manufactured by the same procedure as the manufacturing method of the chip-shaped electronic component tray 1, it will be briefly described with reference to FIGS.
A frame plate 220 shown in FIG. 19 is placed on the upper surface of the bottom plate 240 shown in FIG. The movable plate 230 is mounted on the movable plate insertion portion 224 of the frame plate 220, and the protrusion 242 provided on the bottom plate is engaged with the movement position restricting hole 232 of the movable plate 230. Thereby, the movable plate 230 is prevented from jumping out of the movable plate insertion portion 224 while the distance of the left and right movement in the movable plate insertion portion 224 is restricted. As a result, a structure in which the movable plate 230 is mounted on the movable plate insertion portion 224 of the frame plate 220 as shown in FIG. The movable plate insertion portion 224 is pre-mounted with a biasing means 228 such as a spring for biasing the movable plate 224 in the direction of the opening end 224a.

Next, a cover plate 210 shown in FIG. Then, positioning members are inserted into positioning holes 217, 227, and 247 provided in the cover plate 210, the frame plate 220, and the bottom plate 240, respectively, and the relative positions of the cover plate 210, the frame plate 220, and the bottom plate 240 are determined. Then, the upper and lower positions of the fastening member insertion holes 219, 229, and 249 are exactly overlapped, and the fastening by the fastening member is smoother. Next, the fastening member 213 is inserted into the fastening member insertion holes 219, 229, and 249, and the chip-shaped electronic component tray 201 is assembled.
When the chip-shaped electronic component tray 201 is used, if a defect occurs in the movable plate 230 or the cover plate 210, the fastening member 213 is removed, only the defective plate is replaced, and the fastening member is inserted again. The fastening member 213 can be inserted into the holes 219, 229, and 249 and assembled.

FIG. 22 shows a fourth example of the chip-shaped electronic component tray of the present invention.
FIG. 22 is a plan view of the chip-shaped electronic component tray 301. This example is a chip-shaped electronic component tray in which four movable plate insertion portions are provided on the frame plate, and the movable plates are respectively attached to the movable plate insertion portions. Here, 310 is a cover plate, 311 is a chip-shaped electronic component insertion portion provided on the cover plate, and 330 is a movable plate. Since the movable plate 330 is urged toward the open end 324a of the movable plate insertion portion 324 by the urging means 328 provided on the frame plate 320, the end of the movable plate is the cover plate as shown in FIG. It sticks out more.
The structure of the chip-shaped electronic component tray 301 is basically a three-layer structure similar to that of the chip-shaped electronic component trays 1, 101, 201 as shown in FIGS. That is, there is a frame plate layer on which the movable plate is mounted on the upper surface of the bottom plate, and the cover plate is disposed thereon.

  FIG. 23 shows a plan view of the cover plate 310. Reference numeral 311 denotes a chip-shaped electronic component insertion portion, 319 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 310, the frame plate 320, and the bottom plate 340. is there.

FIG. 24 shows a plan view of the frame plate 320.
The frame plate 320 is provided with a U-shaped movable plate insertion portion 324, and a biasing means 328 such as a spring is provided at a portion facing the U-shaped opening end 324a. When mounted on the movable plate insertion portion 324 having a shape, the movable plate 330 is urged toward the movable plate opening end portion. Reference numeral 329 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 310, the frame plate 320, and the bottom plate 340.

FIG. 25 is a plan view in which a movable plate 330 having the same structure as the movable plate shown in FIGS. 6 and 14 is mounted on the movable plate insertion portion 324 shown in FIG.
Here, 320 is a frame plate, 328 is a biasing means such as a spring, 329 is a fastening member insertion hole,
Reference numeral 331 denotes a chip-shaped electronic component insertion portion provided on the movable plate, and reference numeral 332 denotes a movement position restricting hole provided on the movable plate.
In such a state, it is placed on the upper surface of the bottom plate 340. The fastening member is inserted into the fastening member insertion hole, and the three plates of the cover plate 310, the frame plate 320, and the bottom plate 340 are fastened.

FIG. 26 shows a plan view of the bottom plate 340.
The bottom plate 340 is provided with a protrusion 342, and this protrusion 342 is engaged with the movement position restricting hole 332 of the movable plate 330 so that the movable plate 330 can move in the movable plate insertion part 324 from side to side. In addition, the movable plate 330 does not protrude from the movable plate insertion portion 324. Reference numeral 349 denotes a fastening member insertion hole, and a fastening member is inserted into the insertion hole to fasten the three plates of the cover plate 310, the frame plate 320, and the bottom plate 340.

The manufacturing method of the chip-shaped electronic component tray 301 is performed by the same procedure as the manufacturing method of the chip-shaped electronic component tray 1. This manufacturing method will be briefly described with reference to FIGS.
The frame plate 320 shown in FIG. 24 is placed on the upper surface of the bottom plate 340 shown in FIG. The movable plate 330 is attached to the movable plate insertion portion 324 of the frame plate 320, and the protrusion 342 provided on the bottom plate is engaged with the movement position restriction hole 332 of the movable plate 330. As a result, the movable plate 330 is prevented from jumping out of the movable plate insertion portion 324 while the distance of the left and right movement in the movable plate insertion portion 324 is restricted. As a result, a structure in which the movable plate 330 is mounted on the movable plate insertion portion 324 of the frame plate 320 as shown in FIG. The movable plate insertion portion 324 is preliminarily mounted with a biasing means 328 such as a spring for biasing the movable plate 324 toward the opening end 324a.
Next, a cover plate 310 shown in FIG. Next, the fastening member 313 is inserted into the fastening member insertion holes 319, 329, and 349, and the chip-shaped electronic component tray 301 is assembled.
When the chip-shaped electronic component tray 301 is used, if a malfunction occurs in the movable plate 330 or the cover plate 310, the fastening member 313 is removed, only the defective plate is replaced, and the fastening member is inserted again. The fastening member 313 can be inserted into the holes 319, 329, and 349 and assembled.

FIG. 29 shows a fifth example of the chip-shaped electronic component tray of the present invention.
FIG. 29 is a plan view of the chip-shaped electronic component tray 401. The tray 401 has a five-layer structure as shown in FIGS.
FIG. 37 is a partial sectional view of the chip-shaped electronic component tray in the vicinity of the chip-shaped electronic component insertion portion 411 of the chip-shaped electronic component tray 401 shown in FIG.

The bottom layer is a bottom plate 440. As shown in FIG. 35, an upper surface of the second movable plate 460 mounted on the second frame plate 470 of FIG. A spacer plate 450 of FIG. 33 is arranged on the upper surface as a third layer structure. Furthermore, as shown in FIG. 32, the upper surface is provided with the first movable plate 430 attached to the first frame plate 420 of FIG. A cover plate 410 shown in FIG. 30 is disposed on the uppermost surface.
Here, 410 is a cover plate of the chip-shaped electronic component tray, and 411 is a chip-shaped electronic component insertion portion. Reference numeral 430 denotes a first movable plate. When the first movable plate 430 and the second movable plate 460 are physically pushed into the cover plate side, the chip-like electronic component insertion portion 411 of the cover plate and the chip-like electronic component insertion portion provided on the first movable plate 431 and the chip-like electronic component insertion portion 451 of the spacer plate 450 and the chip-like electronic component insertion portion 461 provided on the second movable plate are coincident with each other, and the coincident chip-like electronic component insertion portions 411, 431, 451, 461 are aligned. A chip-like electronic component can be inserted into the space. When the pushing force applied to the first movable plate 430 and the second movable plate 460 is released, the chip-like electronic component insertion portion 431 of the first movable plate and the chip-like electronic component insertion portion provided in the second movable plate 461 shifts toward the open end. As a result, the chip-shaped electronic component insertion portion 411 of the cover plate, the chip-shaped electronic component insertion portion 431 of the first movable plate, the chip-shaped electronic component insertion portion 451 of the spacer plate 450, and the chip provided on the second movable plate The chip-shaped electronic component is fixed by the cylindrical electronic component insertion portion 461. At this time, the buffer member 431a provided on the opening wall of the chip-like electronic component insertion portion 431 of the first movable plate and the buffer member 461a provided on the opening wall of the chip-like electronic component insertion portion 461 of the second movable plate. As a result, the chip-shaped electronic component is directly pressed against the opening walls of the chip-shaped electronic component insertion portions 411 and 451 to be stored and fixed.

FIG. 30 shows a plan view of the cover plate 410.
Here, reference numeral 411 denotes a chip-shaped electronic component insertion portion, 417 denotes a positioning hole, and 419 denotes a fastening member insertion hole. Positioning members are located in the positioning hole 417 of the cover plate 410, the positioning hole 427 of the first movable plate 420, the positioning hole 457 of the spacer plate 450, the positioning hole 477 of the second movable plate 460, and the positioning hole 447 of the bottom plate 440. By determining the relative positions of the respective plates that are inserted, the upper and lower positions of the fastening member insertion holes 419, 429, 259, 479, and 449 of the respective plates are exactly overlapped, and the fastening member 413 is inserted through these fastening members. The chip-shaped electronic component tray 401 is assembled by being inserted into the hole. For this reason, by providing the positioning hole, the fastening of each plate by the fastening member can be performed more smoothly and accurately.

FIG. 31 shows a plan view of the first frame plate 420.
The frame plate 420 is provided with a U-shaped movable plate insertion portion 424, and a biasing means 428 such as a spring is provided at a portion facing the U-shaped opening end 424 a. When mounted on the movable plate insertion portion 424 having a shape, the movable plate 430 is urged toward the movable plate opening end. Reference numeral 429 denotes a fastening member insertion hole, and 427 denotes a positioning hole.

32 is a plan view in which a movable plate 430 having the same structure as the movable plate shown in FIGS. 6 and 14 is mounted on the movable plate insertion portion 424 shown in FIG.
Here, 420 is a first frame plate, 427 is a positioning hole, 428 is a biasing means, 429 is a fastening member insertion hole, 431 is a chip-like electronic component insertion portion provided on the movable plate, and 432 is provided on the movable plate. This is the movement position restriction hole. In such a state, it is placed on the upper surface of the spacer plate 410.

FIG. 33 is a plan view of the spacer plate 450.
The basic structure of the spacer plate 450 is substantially the same as the structure of the cover plate 410 except that the insertion hole 452 for the protrusion of the bottom plate 440 is provided. Reference numeral 451 denotes a chip-shaped electronic component insertion portion, 457 denotes a positioning hole, and 458 denotes a fastening member insertion hole. The spacer plate 450 is placed on the upper surface of the structure in which the second movable plate 460 shown in FIG. 35 is mounted on the second frame plate 470.

FIG. 34 shows a plan view of the second frame plate 470.
This second frame plate has the same structure as the first frame plate 420 shown in FIG. Here, 474 is a movable plate insertion portion, 474a is an opening end, 477 is a positioning hole, 478 is a biasing means, and 479 is a fastening member insertion hole.

FIG. 35 is a plan view in which a movable plate 460 having the same structure as the movable plate shown in FIGS. 6 and 14 is mounted on the movable plate insertion portion 474 of the second frame plate 470 shown in FIG.
Here, 470 is a second frame plate, 477 is a positioning hole, 478 is a biasing means, 479 is a fastening member insertion hole, 461 is a chip-like electronic component insertion portion provided in the movable plate, and 462 is provided in the movable plate. This is the movement position restriction hole. In such a state, it is placed on the upper surface of the bottom plate 440.

FIG. 36 shows a plan view of the bottom plate 440.
The structure of the bottom plate is almost the same as that of the bottom plate 140 shown in FIG. A protrusion 442 is provided on the bottom plate 440. This protrusion 442 is inserted into the movement position restricting hole 462 of the second movable plate 460, further inserted into the insertion hole 452 of the spacer plate 450, and finally engaged with the movement position restricting hole 432 of the first movable plate 430. Entered. By doing so, the second movable plate 460 can move left and right within the movable plate insertion portion 474, and is prevented from jumping out of the movable plate insertion portion 474, and the first The movable plate 430 can move left and right within the movable plate insertion portion 424 and does not protrude from the movable plate insertion portion 424. Reference numeral 447 denotes a positioning hole, 441 denotes a vacuum suction hole, and 449 denotes a fastening member insertion hole.
The height of the protrusion 442 is substantially equal to the sum of the thicknesses of the second movable plate, the spacer plate, and the first movable plate.

The manufacturing method of the chip-shaped electronic component tray 401 is performed by the same procedure as the manufacturing method of the chip-shaped electronic component tray 1 and the like. This manufacturing method will be briefly described with reference to FIGS.
The second frame plate 470 shown in FIG. 34 is placed on the upper surface of the bottom plate 440 shown in FIG. 36, and then the second movable plate 460 is attached to the movable plate insertion portion 474 of the second frame plate. At the same time, the protrusion 442 of the bottom plate is engaged with the movement position restricting hole 462 of the movable plate. The height of the protrusion 442 is substantially equal to the sum of the thicknesses of the second movable plate, the spacer plate, and the first movable plate.
By doing so, a state in which the second movable plate is mounted on the movable plate insertion portion of the second frame plate shown in FIG. 35 is placed on the upper surface of the bottom plate.
Next, a spacer plate 450 shown in FIG. 33 is placed thereon. At the same time, the protrusion 442 protruding from the movement position restricting hole 462 of the movable plate 460 is inserted into the protrusion insertion hole 452 of the spacer plate.
Next, the first frame plate 420 is placed on the upper surface of the spacer plate, and the first movable plate 430 is mounted on the movable plate insertion portion 424 of the first frame plate. At the same time, the protrusion 442 protruding from the protrusion insertion hole 452 of the serplate is engaged with the movement position restricting hole 432 of the first movable plate into the protrusion insertion hole 452 of the spacer plate.
By doing so, a state in which the first movable plate is mounted on the movable plate insertion portion of the first frame plate shown in FIG. 32 is placed on the upper surface of the spacer plate.
Further, a cover plate 410 shown in FIG. 30 is placed thereon.
Thereafter, the positioning members are the positioning holes 417 of the cover plate 410, the positioning holes 427 of the first frame plate 420, the positioning holes 457 of the spacer plate 450, the positioning holes 477 of the second frame plate 470, and the positioning of the bottom plate 440. The relative position of each plate is determined by being inserted into the hole 447. By determining the relative positions, the upper and lower positions of the fastening member insertion holes 419, 429, 459, 479, and 449 of the respective plates are exactly overlapped, and the fastening of each plate by the fastening member is facilitated. Finally, the chip-shaped electronic component tray 401 is manufactured by inserting the fastening member 413 through these fastening member insertion holes and fastening each plate.
When using a chip-shaped electronic component tray, if any of the cover plate, movable plate, spacer plate, or bottom plate fails, remove the fastening member and replace only the defective plate. The relative position of each plate is determined by the positioning member, and the fastening member is inserted into the fastening member insertion hole and fastened to regenerate the chip-shaped electronic component tray.

1, 101, 201, 301, 401 Chip-shaped electronic component tray 10, 110, 210, 310, 410 Cover plate 11, 31, 111, 131, 211, 231, 311, 331, 411, 431, 451, 461 Chip-shaped Electronic component insertion part 13, 113, 213, 313, 413 Fastening member 117, 127, 147, 217, 227, 247, 417, 427, 447, 457, 477 Positioning hole 19, 29, 49, 119, 129, 149, 219, 229, 249, 319, 329, 349, 419, 429, 449, 459, 479, fastening member insertion holes 20, 120, 220, 320, 420, 470 Frame plates 24, 124, 224, 324, 424, 474 Movable plate insertion parts 24a, 124a, 224a, 324a, 42 a, 474a Open end 28, 128, 228, 328, 428, 478 Biasing means 30, 130, 230, 330, 430 Movable plates 31a, 131a, 431a, 461a Buffer members 31b, 31c, 131b, 131c Opening wall 31w, 131w Buffer member size 32, 132, 232, 332, 432, 462 Movement position restricting hole 40, 140, 240, 340, 440 Bottom plate 42, 142, 242, 342, 442 Protrusion 141, 241, 441 Vacuum suction hole 452 Protrusion insertion hole 50, 150 Chip-shaped electronic component

Claims (6)

A bottom plate having a plurality of protrusions and a plurality of fastening member insertion holes which are inserted into the movement position restriction holes of the movable plate and restrict the movable range of the movable plate;
One or two or more U-shaped movable plate insertion portions, a biasing means for biasing the movable plate in the direction of the opening end portion, and a plurality of fastening member insertion holes at a portion facing the opening end portion of the movable plate insertion portion. A frame plate disposed on the upper surface of the bottom plate,
A plurality of rectangular chip-shaped electronic component insertion portions that are rectangular and have a symmetrical axis inclined at an angle of 30 to 60 degrees are arranged in a staggered manner and densely arranged, and the chip-shaped electronic component insertion portions A buffer member that absorbs the manufacturing tolerance error of the size of the chip-shaped electronic component is provided on two adjacent opening walls on the biasing means side, and the size of the opening of the chip-shaped electronic component insertion portion is the cover plate. A plurality of chip-shaped electronic component insertion portions larger than the size of the opening portion of the chip-shaped electronic component insertion portion provided on the base plate and a protrusion that regulates the range of the movable plate back-and-forth movement provided on the bottom plate A position corresponding to the movable plate mounted on the movable plate insertion portion of the frame plate having a plurality of movement position restricting holes into which the chip is inserted, and the chip-shaped electronic component insertion portion provided on the movable plate The chip-shaped electronic component insertion portions are arranged in the same staggered arrangement and are densely arranged, and the opening of the chip-shaped electronic component insertion portion is rectangular and has a symmetrical axis of 30 to 60 degrees. If the rectangular shape is a square, the side length is 2 mm to 15.5 mm, or the rectangle is 2.5 mm to 16 mm in length and width A cover having a plurality of chip-like electronic component insertion portions and a plurality of fastening member insertion holes each having a length of 2 mm to 15.5 mm, the frame plate and the movable plate being disposed on the upper surface of the frame plate attached to the movable plate insertion portion A chip-shaped electronic component tray having a plate and fastened by a fastening member inserted into a fastening member insertion hole of each of a bottom plate, a frame plate, and a cover plate.   2. The chip-shaped electronic component tray according to claim 1, wherein a vacuum suction hole is provided in a position corresponding to the chip-shaped electronic component insertion portion of the movable plate in the bottom plate. 2. The chip-shaped electronic component tray according to claim 1, wherein positioning holes for determining relative positions of the fastening member insertion holes of the bottom plate, the frame plate, and the cover plate are provided in the bottom plate, the frame plate, and the cover plate. A chip-shaped electronic component tray. It is inserted into the movement position restricting hole of the first and second movable plates, restricts the movable range of the movable plate, and penetrates the insertion hole of the spacer plate interposed between the first movable plate and the second movable plate. A bottom plate having a plurality of protrusions and a plurality of fastening member insertion holes,
One or two or more U-shaped movable plate insertion portions, a biasing means for biasing the second movable plate toward the opening end portion, and a plurality of fastening members at a portion facing the opening end portion of the movable plate insertion portion A second frame plate having an insertion hole and disposed on the upper surface of the bottom plate,
A plurality of rectangular chip-shaped electronic component insertion portions that are rectangular and have a symmetrical axis inclined at an angle of 30 to 60 degrees are arranged in a staggered manner and densely arranged, and the chip-shaped electronic component insertion portions A buffer member that absorbs the manufacturing tolerance error of the dimensions of the chip-shaped electronic component is provided on the two adjacent opening walls on the biasing means side, and the size of the opening of the chip-shaped electronic component insertion portion is the cover plate. A plurality of chip-shaped electronic component insertion portions that are larger than the size of the opening of the provided chip-shaped electronic component insertion portion by the size of the buffer member and a protrusion that regulates the range of back and forth movement of the movable plate provided on the bottom plate A second movable plate attached to a movable plate insertion portion of the second frame plate having a plurality of movement position restriction holes to be inserted;
A chip-shaped electronic component insertion portion provided in the same staggered arrangement and densely arranged at a position corresponding to the chip-shaped electronic component insertion portion provided on the first and second movable plates, and the chip-shaped electronic component The opening of the component insertion portion is rectangular and has a shape in which the axis of symmetry is inclined at an angle of 30 ° to 60 °, and the length of the side of the rectangular shape is square. A plurality of chip-like electronic component insertion portions and a plurality of fastening member insertions having the same structure as the cover plate having a length of 2.5 mm to 16 mm and a width of 2 mm to 15.5 mm in a rectangle. A spacer plate having an insertion hole for a protrusion provided in the hole and the bottom plate, the second movable plate being disposed on the upper surface of the second frame plate attached to the movable plate insertion portion;
One or two or more U-shaped movable plate insertion portions, a biasing means for biasing the first movable plate in the direction of the opening end portion, and a plurality of fastening members at a portion facing the opening end portion of the movable plate insertion portion A first frame plate having an insertion hole and disposed on the upper surface of the spacer plate;
It has the same structure as the second movable plate, and has the same number as the first movable plate mounted on the movable plate insertion portion of the first frame plate and the chip-shaped electronic component insertion portion provided on the spacer plate. A cover plate having a chip-shaped electronic component insertion portion and a plurality of fastening member insertion holes having the same size and arrangement, and a first movable plate mounted on the movable plate insertion portion is disposed on the upper surface of the first frame plate. Have
A chip-shaped electronic component tray, which is fastened by a fastening member inserted into a fastening member insertion hole of each of a bottom plate, a second frame plate, a spacer plate, a first frame plate, and a cover plate.   5. The chip-shaped electronic component tray according to claim 4, wherein a vacuum suction hole is provided in a position corresponding to the chip-shaped electronic component insertion portion of the movable plate in the bottom plate. 5. The chip-shaped electronic component tray according to claim 4, wherein positioning holes for determining the relative positions of the respective fastening member insertion holes of the bottom plate, the second frame plate, the spacer plate, the first frame plate and the cover plate are provided. A chip-shaped electronic component tray provided on a bottom plate, a second frame plate, a spacer plate, a first frame plate, and a cover plate.