WO2014154746A1

WO2014154746A1 - Locking method and vacuum substrate treatment system

Info

Publication number: WO2014154746A1
Application number: PCT/EP2014/056057
Authority: WO
Inventors: Jan Leupold
Original assignee: Von Ardenne Gmbh
Priority date: 2013-03-28
Filing date: 2014-03-26
Publication date: 2014-10-02
Also published as: DE102013205709B4; DE102013205709A1

Abstract

The invention relates to a locking method and a vacuum substrate treatment system, wherein the vacuum substrate treatment system comprises at least one process chamber and at least one lock chamber that can be closed off vacuum-tight from the environment and from the process chamber, by means of a respective lock valve in each case, wherein the lock chamber is divided into chamber segments by at least two separating walls, which are arranged perpendicular to a substrate transport direction and which are each provided with a lock valve that closes vacuum-tight, and wherein a substrate transport device is provided for transporting substrates in the substrate transport direction. The problem addressed by the invention is to reduce the cycle time and thus to increase the productivity of the vacuum substrate treatment system, to reduce the number of system components, and to improve the utilization of the vacuum pumps. The problem is solved in that, during the transport of the substrate through the lock chamber, each lock valve is opened as soon as the front edge of the substrate approaches and is closed as soon as the rear edge of the substrate has passed the lock valve, wherein the pressure in a substrate region closed off by two lock valves is varied from the pressure present before the lock chamber to the pressure present after the lock chamber during said transport of the substrate.

Description

Locking method and vacuum substrate treatment system

The invention relates to a lock method for

Vacuum substrate treatment plants with at least one

Process chamber, at least one compared to the environment and compared to the process chamber by a respective sluice valve vacuum sealable lock chamber arranged by at least two transversely to a substrate transport direction, with at least one vacuum-tight

in closing lock valve provided partitions in

Chamber segments is divided, as well as one

Substrate transport device for transporting substrates in the substrate transport direction.

The invention further relates to a

Vacuum substrate treatment system with at least one

Process chamber and at least one relative to the environment and with respect to the process chamber by a respective lock valve vacuum sealable lock chamber and a substrate transport device for transporting substrates in the substrate transport between an environment with

Atmospheric pressure outside the process chamber and

Subatmospheric pressure inside the process chamber.

For treating substrates, in particular large glass substrates, substrates can be transported directly or by means of a substrate carrier by a substrate transport device, such as a roller conveyor, it is known that the substrates by means of locks

intermittently between an environment with

Atmospheric pressure outside the process chamber and

Subatmospheric pressure, the process vacuum, inside the process chamber of a vacuum substrate treatment plant

be transported. This applies in particular to the Continuous flow working

Vacuum substrate treatment plants, which may have a plurality of process chambers.

Substrates are moved for introduction into the process chamber by means of the substrate transport device at a first speed along a Substrattransportrichtung in a sluice. The lock has along the

Substrate transport direction two lock valves,

Usually lock flaps, wherein the vacuum-side lock valve is closed when retracting the substrates in the lock and thereby seals the process vacuum of a process chamber. After the substrate is fully retracted into the lock, the atmosphere side

Lock valve closed to the environment and the

Substrate stops its movement in substrate transport direction.

This now closed lock room is using

Vacuum pumps evacuated to the required vacuum pressure.

Once this is done, the vacuum side can

Lock valve of the lock to be opened and the

Substrate is transported at a higher second speed from the sluice into a transfer chamber, which is between

Lock and process chamber is arranged, transported to catch up with the shortest possible distance to the moving at a third speed previous substrate. The third speed is less than the second speed. From the transfer chamber is the

Substrate at a constant third speed in the

Process area transported, where the substrate treatment, for example, a coating with the help of

Vacuum coating processes such as sputtering occurs. If particularly high demands are placed on the process vacuum or very low introduction times should be necessary, a further lock is arranged between the lock and the transfer chamber. A discharge of the substrates from the subatmospheric pressure in the interior of the process chamber in the environment with

Atmospheric pressure is carried out in the reverse order according to the introduction. In

Substrate transport direction are also provided at the end of the at least one process chamber, a transfer chamber and a lock.

Today's substrates, for example for later use as architectural glass, have substrate dimensions of up to 3.21 meters by 6.00 meters. By increasing substrate dimensions extend each also the

Substrate transport facilities of the locks and

Transfer chambers to at least these

Substrate dimension change.

To optimize the substrate vacuum treatment, the overall production rate would have to be increased, i. the time for entering and leaving (cycle time) of

Substrates in and out of the lock would have to be as short as possible. The vacuum pressure in the process room would continue to fall, but pumping times can only be reduced with great effort. The distance of the substrates in the

Vacuum treatment plant would have to be lower to the

Treat substrates as effectively and uniformly as possible and contaminate the process chambers, e.g. from

Transport rollers of the substrate transport device, too

reduce. However, high substrate accelerations and substrate speeds, such as are required for rapid transport into and out of the gates to achieve short cycle times, place high mechanical stress on the substrate and the substrate transport.

In addition, correspondingly strongly dimensioned

Drive components with a correspondingly required drive energy necessary.

Known vacuum substrate treatment equipment, such as For example, continuous vacuum substrate treatment plants, accordingly, have a variety of disadvantages.

The required for the insertion and removal of the substrates

Plant components are numerous and exhibit in

Substrattransportrichtung each at least one length corresponding to the substrate length. These plant components comprise a substrate transport device, locks and vacuum-side transfer chambers. That rather, that

Substrate transport device, locks and transfer chambers are always designed for a certain length of substrate. Shorter substrates than those for which the

Vacuum substrate treatment plant has been designed, would significantly reduce the productivity of the vacuum substrate treatment plant. An extension of the substrates

however, only by a complete exchange of

Locks and transfer chambers against longer realizable.

Substrate transporting devices are known, which transport the substrates from the continuous substrate transport in the environment with atmospheric pressure outside the process chamber and in the interior of the process chamber with subatmospheric

Pressure in the discontinuous substrate transport within the lock and bring back. Of the

atmosphere-side section of the

Substrate transport means, which conveys the substrates into the lock, must be able to convey the substrate at a speed higher than the third speed on at least one substrate length. The section of the substrate transport device within the locks and the transfer chamber must also realize this high speed.

The known arrangements of locks and transfer chamber for introducing and discharging substrates could, with further increasing third speeds, become the slowest system components of the Vacuum substrate treatment plant are because the high substrate acceleration required for rapid transfer is limited due to the friction between the transport rollers and the substrate and increasing the pumping power to evacuate the

Lock is very costly. Another disadvantage is a discontinuous utilization of the vacuum pumps, as is not pumped in the time of the introduction of the substrates in the lock.

WO 2009/004 048 A1 discloses an apparatus and a method for the sluicing of overlong substrates in five

Chamber Vacuum Substrate Treatment Equipment. For this purpose is to Einbzw. Discharge of substrates between atmospheric pressure and process pressure in each case a lock system, comprising a lock chamber and a buffer chamber provided. Such vacuum substrate treatment plants are basically designed so that a substrate to be treated each

completely from the lock chamber as well as from the

Buffer chamber can be added.

Vacuum substrate treatment plants according to WO 2009/004 048 AI work discontinuously with respect to the on or

Outward transfer, i. that the transport of the substrate is stopped during the change of the pressure.

For treating overlong substrates, i. of substrates whose dimensions are larger than those for which the system was originally designed, it is proposed in WO 2009/004 048 Al to connect the lock chamber and the buffer chamber with each other. For pressure decoupling between inlet and outlet of the lock system, is a

Flow resistance provided in the lock system. By means of the flow resistance, a pressure gradation within the lock system is possible, ie from the atmosphere-side plant door to the process-side process gate. The sluicing of overlong substrates also takes place discontinuously, ie with a stopped substrate during the change of the Pressure instead.

From DE 298 08 163 Cl is a transfer chamber for

Transformation of the discontinuous substrate transport of the lock chamber for continuous substrate transport of the process chamber and vice versa, as well as for establishing a pressure gradient between the pressure of the lock chamber and the pressure process chamber known in the

Transfer chamber a plurality of partitions are arranged, each having a flow resistance.

From DE 42 40 489 Cl a sluice assembly of several juxtaposed in the substrate transport direction pressure levels is known, between each one

Roller belt sluice, suitable for feeding or leading a strip-shaped substrate into or out of a

Process chamber, is arranged. A non-vacuum-tight

Roller belt lock has for this purpose a movable upper and a rigid lower roller, each as

Sealing elements between the individual pressure stages serve by moving the band-shaped substrate between abutting upper and lower rollers. The single ones

Pressure stages each have a vacuum pump. Thus, the pressure can be gradually between atmospheric pressure and

Process pressure reduced or enlarged.

An object of the invention is therefore, a

Specify vacuum substrate treatment plant and a lock method, which reduces the cycle time and thus the productivity of the vacuum substrate treatment plant

increased, the number of system components can be reduced and the utilization of the vacuum pump can be improved.

The task is accomplished by a lock procedure with the

Features of independent claim 1 and by a

Vacuum substrate treatment plant with the features of independent claim 11 solved. Advantageous embodiments and further developments are specified in the dependent claims.

There will be a lock procedure for

Vacuum substrate treatment plants proposed with

at least one process chamber, at least one against the environment and compared to the process chamber by a respective lock valve vacuum sealable lock chamber by at least two transverse to a

Substrate transport arranged arranged, provided with at least one vacuum-tight closing gate valve partitions is divided into chamber segments, as well as a

Substrate transport device for transporting substrates i substrate transport direction.

The lock procedure comprises the following method steps:

Move at least one substrate to the

Lock chamber closed and open the first

Lock valve of the lock chamber as soon as the front edge of the substrate approaches.

Moving the substrate through the opened first

Lock valve into the lock chamber, with each subsequent lock valve is opened as soon as the front edge of the substrate approaches.

• Close the first lock valve of the

Lock chamber as soon as the trailing edge of the substrate has passed the first lock valve, allowing the substrate in one through two lock valves

• is completed substrate area and wherein the substrate region comprises at least one chamber segment.

Changing the pressure within the substrate area from the pressure prevailing in front of the lock chamber to the pressure prevailing behind the lock chamber during the movement of the substrate and thus of the substrate containing substrate area through the

Lock chamber, each lock valve is opened as soon as the leading edge of the substrate approaches and is closed as soon as the trailing edge of the substrate has passed the lock valve.

• Opening the last lock valve of the

Lock chamber.

• Move the substrate through the opened last one

Lock valve out of the lock chamber, each lock valve is closed as soon as the trailing edge of the substrate has passed the lock valve.

By means of the lock method according to the invention, the cycle times for feeding in and out can be shortened, since a retention of the substrate in the lock chamber, as in a lock chamber according to the prior art, is not required. According to the invention, the substrates can be moved continuously during the entire lock process.

As a result, some vacuum pumps, which on

Chamber segments are attachable, are operated continuously. With the thus extendable pumping times of these

Vacuum pumps can be set according to the invention, a lower pressure in the lock chamber and process chamber. If the pressure in the process chamber compared to the prior art remain the same, according to the invention

Pump power and / or the number required for it

Plant components, such as vacuum pumps can be reduced.

It is advantageous to arrange at least one

Intermediate area between the at least one

Lock chamber and the at least one process chamber, wherein the intermediate region via a flow resistance with the at least one process chamber is connected, whereby substrates are moved through the flow resistance. The intermediate region may itself be formed as a vacuum-tight chamber, which is connected to the lock chamber and the process chamber. The substrates are transported through the intermediate region on a substrate transport device in the substrate transport direction between the lock chamber and the process chamber. Since the intermediate region is arranged in the immediate vicinity of the process chamber, and as a result the pressure in the intermediate region approximately corresponds to the pressure in the interior of the process chamber, when the intermediate region is connected to the process chamber

revealable lock valve, as they are arranged for example in the lock chamber, are dispensed with. Rather, the lock valve can be replaced by a flow resistance. As a result, the lock procedure becomes more effective because lock valves no longer have to be opened as soon as the front edge of the substrate approaches and lock valves no longer have to be closed when the trailing edge of the substrate has passed the lock valve.

According to the invention it can be provided that the

Intermediate area is arranged by transverse to the substrate transport direction arranged, provided with at least one flow resistance partitions in chamber segments.

Substrates are arranged in a substrate region extending over at least one chamber segment. While substrates in the substrate area through

Flow resistors are beweget, the pressure within the substrate region is changed from prevailing before the intermediate region pressure on the pressure prevailing behind the intermediate region.

The productivity of the vacuum substrate treatment plant can be increased according to the invention by using substrates with a length in the substrate transport direction greater than the distance from a lock valve to the next but one

Lock valve can be used. The larger the number of chamber segments in the substrate area, the greater the expected productivity, but the greater the machine outlay. The distances of one

Sluice valve to next but one sluice valve may vary along the substrate transport direction, so that the substrates to be slid must not be greater than each of these distances.

In order to maintain a separation between the atmosphere with atmospheric pressure and the interior of the at least one subatmospheric pressure process chamber, it is expedient that at least one

Sluice valve is closed every lock chamber.

Furthermore, it may be provided for the lock method that lock valves open continuously as soon as

Approach substrates to a lock valve and yourself

Close the gate valves continuously as soon as substrates have passed a gate valve. As a result, the separation between the atmospheric pressure environment and the interior of the at least one subatmospheric pressure processing chamber can be further improved since the time during which a gate valve is opened is minimized.

It is expedient if at least one chamber segment has at least one opening through which the at least one chamber segment is evacuated or ventilated. Thus, the substrate region can be evacuated or vented through openings in one or more chamber segments, so that not every chamber segment need have an opening.

For ventilation of chamber segments, a

Ventilation device may be provided, wherein chamber segment advantageously ventilated with dried, oil-free compressed air become. For evacuating chamber segments, rough vacuum and / or fine vacuum and / or high vacuum pumps may be provided. For example, turbomolecular pumps can be used as high vacuum pumps. For the

Lock method is advantageous when the

Turbomolecular pumps are located in close proximity to chamber segments or directly to chamber segments, as this can be significantly improved the effectiveness of the pumping operation.

In order not to increase the subatmospheric pressure in the interior of the at least one process chamber, it can be provided that the pressure of a substrate region or a chamber segment directly adjoining the at least one process chamber is adjusted between the at least one process chamber and the substrate region or a chamber segment before opening the sluice valve becomes.

To shorten the cycle time and increase the

Productivity, it is still advantageous if the

Substrate with at least two different ones

Speeds is moved. According to the invention

As a result, the valve closing time of a lock valve to be increased, which in turn the pumping time of the

Vacuum pumps can be increased.

In this case, a uniform movement is advantageous, but the speed of the substrate in the

Lock chamber can be variably adjusted, for example, to open a lock valve only when the in

Substrate transport direction behind the gate valve prevailing pressure has reached its target value.

It is expedient that the substrate is first moved at a first speed, then accelerated to a second speed and then accelerated to a third speed. According to the method Both positive and negative accelerations can be set. Thus, the first speed outside the lock chamber and the intermediate area may be less than the second speed in the

Lock chamber and in the intermediate area, the third speed in the process area is again smaller than the second speed. The transitions between first, second and third speed are included

expediently continuously, so that substrates are not mechanically overstressed.

A proposal will continue to be made

Vacuum substrate treatment system with at least one

Atmospheric pressure outside the process chamber and

subatmospheric pressure in the interior of the process chamber, wherein the lock chamber arranged in the interior by at least two transversely to the substrate transport direction, each with a

provided vacuum-tight closing lock valve

Partitions is divided into chamber segments. The

According to the invention, the lock chamber accordingly comprises at least three chamber segments, these along the

Substrate transport direction may have different pressures. As a result, from the prior art

known transfer chamber omitted. It is advantageous if the length of a chamber segment in the substrate transport direction is shorter than the length of a lock chamber according to the prior art. According to the invention, chamber segments in the substrate transport direction can have the same length.

In addition, it can be provided that the mechanical

Strength of lock valves to the differential pressure is adapted to two adjacent chamber segments. Thus, lock valves which are only exposed to a small pressure difference, for example, can be designed more easily. As a result, these lock valves due to a lower inertia in the opening and closing of the

Sluice valve easier to move. At this higher

However differential pressure lock valves can be designed with a higher mechanical strength.

In one embodiment of the invention can be provided that between the at least one lock chamber and the at least one process chamber at least one

Intermediate region is arranged, wherein the intermediate region is connected via a flow resistance with the at least one process chamber. The intermediate region may itself be formed as a vacuum-tight chamber, which is connected to the lock chamber and the process chamber. The substrates are through the intermediate area on a

Substrate transport device in Substrattransportrichtung between the lock chamber and the process chamber

transported. Since the intermediate region is arranged in the immediate vicinity of the process chamber and as a result the pressure in the intermediate region approximately at the pressure in the interior of the

Process chamber corresponds, can with connection of the

Zwischenbereiches with the process chamber on an open lock valve, as for example in the

Lock chamber are arranged to be dispensed with. Rather, the lock valve can be replaced by a flow resistance. The flow resistance is designed so that the substrates to be blown through it

are transportable. The intermediate area can

According to the invention also be materially connected to the process chamber or the lock chamber.

In a further embodiment, the intermediate region is arranged by means of transversely to the substrate transport direction divided at least one flow resistance dividing walls divided into chamber segments. The intermediate area may accordingly be divided into chamber segments like the lock chamber, whereby the same technical advantages arise as in the lock chamber, but disclosed on lock valves can be dispensed with. It is advantageous if the

Plurality of the chamber segments of the intermediate region and the lock chamber the same length in

Substrate transport direction have. It is advantageous if the distance from one

Lock valve to the next but one lock valve to each other is smaller than an extension of the substrate to be blown in the substrate transport direction. The distances from one sluice valve to the next but one sluice valve can vary along the substrate transport direction, so that the substrates to be sluiced need not be larger than each of these distances. It is useful if the

Distance in substrate transport direction from a first

Sluice valve, which closes the lock chamber to the environment, to a last lock valve, which closes the lock chamber to the process chamber towards, is greater than the extent of the substrate to be blown in the substrate transport direction. This is the

Lock chamber very flexible in

Substrate transport direction differently long substrates.

In one embodiment of the invention, the

Substrate transport device a plurality of independently drivable transport sections. As a result, individual substrates can be accelerated, decelerated or transported at different speeds depending on their position.

For detecting substrate or substrate break, i. from

Substrate, which is no longer in its intended for actual use form, and to prevent a closing of a lock valve as long as

Substrate or substrate break located in the valve region can be provided that a substrate detector is arranged in the substrate transport direction before and / or after a gate valve. This may damage the

Lock valve are counteracted. Such a

Substrate detector may be formed, for example, as an optical sensor or other sensor.

In one embodiment of the invention it is provided that at least one chamber segment has at least one opening, whereby the at least one chamber segment

can be evacuated or ventilated. It is expedient that openings with valves can be closed.

To vent the chamber segment, the at least one opening by means of a valve to a

Be connected ventilation device, wherein

Chamber segments advantageous with dried, oil-free

Be vented compressed air. In order to achieve a low pressure in the process chamber and small cycle times, it is inventively advantageous to connect chamber segments via valves with vacuum pumps, which in different

Pressure ranges work. In the atmosphere side

Chamber segments are used rather rough vacuum pumps with high suction power, arranged in the process-side segments rather fine or high vacuum pumps. middle

Chamber segments may have connections for a plurality of vacuum pumps which can be switched by valves, as a result of which the respective chamber segment can be evacuated more and more finely in succession, depending on the pressure.

In order to achieve the highest possible flow conductance between chamber segments to be evacuated, it is advantageous to use fine vacuum pumps, for example turbomolecular pumps, with the largest possible flow cross section and short

Flow path to the chamber segment to be evacuated to tie. Depending on which chamber segment along the substrate transport direction a fine vacuum pump is connected, this can directly or valves with large

Flow cross-section are arranged therebetween.

It can be provided that a chamber segment group of a plurality of adjacent in the substrate transport direction chamber segments with mutually open lock valves via at least one opening of one of these

adjacent chamber segments can be evacuated together. According to the invention, chamber segments which do not have their own opening for evacuation can thus be evacuated from another chamber segment of the chamber segment group. A chamber segment group corresponds to the

Substrate area of the lock process. By analogy with the substrate region moving with the substrate, the chamber segment group is enlarged by a chamber segment when a gate valve opens in front of an approaching substrate and decreases by a chamber segment when a gate valve closes after a substrate closes

Lock valve has happened.

It is expedient that the lock chamber with respect to the number and length of the chamber segments, the number of

Lock valves, the distribution of the transport sections, the arrangement and the number of vacuum pumps on

different requirements can be interpreted. A

Extension of the lock chamber by further chamber segments can also be provided. Advantageously, it is possible to respond so flexibly to other substrates to be blown or other parameters such as, for example, the cycle time or the pressure in the interior of the process chamber.

The invention is based on a

Embodiment will be explained in more detail, In the

accompanying drawings shows Fig. 1 a lock chamber according to the invention and a

Intermediate area for introducing substrates from outside a vacuum substrate treatment plant into the interior of a process chamber

Vakuumsubstratbehandlungsanläge,

Fig. 2 is a lock chamber according to the invention and a

Intermediate area for discharging substrates from a process chamber of a

Vacuum substrate treatment plant in the environment outside of this vacuum substrate treatment plant,

3 is a schematic representation of the path-time course of the movement of a substrate during the introduction and the corresponding states of the lock chamber,

Fig. 4 is a schematic representation of the path-time course of the movement of a substrate during the discharge and the corresponding states of the lock chamber and

Fig. 5 in the upper part of the speed-time course of a substrate to be inserted in a vacuum substrate treatment plant according to the prior art and in the lower part of the

Speed-time course of a

to be inserted substrate in a

Vacuum substrate treatment system according to the invention.

The Einschleuskammer 1 shown in FIG. 1 and the

Intermediate region 16 are components of a continuous vacuum substrate treatment plant, not shown, and designed as a vacuum chamber 4. The

Vacuum substrate treatment plant also comprises at least one process chamber, not shown, as well as a

Outlet chamber 2 with a further intermediate region 16 according to FIG. 2, which are likewise designed as a vacuum chamber 4. The vacuum chamber 4 is in this case as a single chamber or as one of a plurality of

Single chambers composed chamber executed. The

Variety of individual chambers can be connected in a vacuum-tight manner by means of flanges to the vacuum chamber 4. The

Vacuum chamber 4 is mechanically designed to withstand a pressure difference between the atmospheric pressure of the environment and the subatmospheric pressure inside the vacuum chamber 4. For this purpose, for example, outer and / or inner stiffeners may be provided.

The Einschleuskammer 1 and the discharge chamber 2 and the intermediate region 16 include a

Substrate transport device 3, which is designed as a roller conveyor with transport rollers. By means of

Substrate transport means 3 may comprise substrates 7 between the environment outside the vacuum substrate treatment plant and the interior of the process chamber

Substrate transport direction 15 are transported. It is provided that the substrate transport device 3 is divided along the substrate transport direction 15 into transport sections. The transport sections can be driven independently of each other, so that, for example, a substrate transport speed for this

Transport sections can be set independently. It is also provided that for transferring a substrate 7 from one transport section to the next, a substrate transport speed adjustment is performed by submitting substrates 7 for transferring one

Transport section to the next accelerated or decelerated.

The lock chamber 1 is connected at its one end via a vacuum-tight closing lock valve 14 with the environment. At its in Substrate transport direction 15 others End is the lock chamber 1 via a vacuum-tight

closing lock valve 14 closed and it

joins an intermediate region 16. To the

Intermediate area 16 encloses the at least one process chamber (not shown) for treating substrates, for example by means of PVD processes and / or CVD processes in a process vacuum.

The lock chamber 2 is at one end via a vacuum-tight closing lock valve 14 with a

Intermediate area 16 connected. At the other end in

Substrate transport direction 15 is the lock chamber 2 with a vacuum-tight closing lock valve 14

closable. The intermediate region 16 is connected to the process chamber, not shown.

According to FIGS. 1 and 2, the intermediate region 16 comprises only one chamber segment 6. However, several can also be provided

Chamber segments 6 may be provided in the intermediate region 16, wherein the chamber segments 6 transverse to the

Substrate transport 15 arranged partitions 5 are separated from each other. The partitions 5 of

Intermediate area may comprise flow resistances through which substrates 7 can be transported. Of the

Intermediate area 16 is by means of such

Flow resistance with the not shown

Process chamber connected.

The Einschleuskammer 1 and the discharge chamber 2 are divided by partitions 5 in chamber segments 6. The partitions 5 have a vacuum-tight lockable lock valve 14, whereby chamber segments 6 are vacuum-tight separable from each other. The sluice valves 14 are suitable in that, in the opened state of a sluice valve 14, a substrate 7 can be transported through the sluice valve 14. The lock valves 14 can be controlled independently of each other and therefore open independently and close. About open lock valves 14 interconnected chamber segments 6 form a

Chamber segment group.

The illustrated in Fig. 1 vacuum chamber 4 which comprises sixteen chamber segments 6. Except for a chamber segment 6, which is located at the end of the vacuum chamber 4, which closes the lock chamber 1 to the environment, and the chamber segment 6 of the intermediate portion 16 have all the other fourteen Chamber segments 6 the same extent in

Substrate transport 15 on.

Furthermore, at least those chamber segments 6 of the lock chamber 1 can be closed by means of valves 13

Connections to a ventilation device 8, which have the transport of substrates 7 in the lock chamber 1 with open lock valves 14 direct access to the environment and are thus exposed to atmospheric pressure. This relates to the embodiment of FIG. 1, the first eight adjacent chamber segments 6 of

Lock chamber 1 in substrate transport direction 15. Die

Ventilation by means of the ventilation device 8 is preferably carried out with dry air.

At chamber segments 6 of the vacuum chamber 4 closable openings are also provided by means of valves 13 for evacuating chamber segments 6 or chamber segment groups.

Thus, in the substrate transport direction 15 second

Chamber segment 6 of the vacuum chamber 4 of the lock chamber 1 via a closable by a valve 13, opening connected to a roughing vacuum pump 11. This in

Substrattransportrichtung 15 fifth chamber segment 6 of the vacuum chamber 4 of the lock chamber 1 is connected via a, closable by a valve 13, opening to a

Fine vacuum pump 10 connected. This in

Substrate transport direction 15 sixth, eighth, tenth, twelfth, fourteenth and sixteenth chamber segment 6 of the

Vacuum chamber 4 of the lock chamber 1 is connected via a, in each case closable by means of a valve 13, opening to a high vacuum pump 9. Valves 13 can be switched individually or in each case in valve groups.

The illustrated in Fig. 2 vacuum chamber 4 of

Lock chamber 2 comprises sixteen chamber segments 6. Except for the chamber segment 6 of the intermediate region 16 and a

Another chamber segment 6, which can be connected to the environment by means of a vacuum-tight lockable lock valve 14, all the other fourteen chamber segments 6 have the same extent in the substrate transport direction 15.

Furthermore, in the substrate transport direction 15

sixteenth chamber segment 6 of the vacuum chamber 4 of

Lock chamber 2 a, by means of a valve 13th

lockable, connection to a ventilation device 8 on.

In addition, in the substrate transport direction 15 second to twelfth chamber segment 6 of the vacuum chamber 4 of

Lock chamber 2 via a, each closed by a valve 13, opening connected to a high vacuum pump 9. The in Substratetransportrichtung 15 seventh to fifteenth chamber segment 6 of the vacuum chamber 4 of

Lock chamber 2 is connected to a fine vacuum pump via a respective opening which can be closed by means of a valve 13

10 connected. The ninth to sixteenth chamber segment 6 of the vacuum chamber 4 in the substrate transport direction 15

Lock chamber 2 is connected to a coarse vacuum pump via an opening which can be closed by means of a valve 13

11 connected. Valves 13 can be switched individually or in each case in valve groups.

In the following, with reference to FIG. 3, the use of the

Vacuum substrate treatment plant according to Embodiment of FIGS. 1 and 2 will be explained.

Fig. 3 schematically illustrates the path-time history of

Einschleusens a substrate 7 from the environment outside of a vacuum substrate treatment plant in the at least one process chamber, not shown

The substrate 7 is hereby formed from a flat, large-area,

cuboid glass substrate with a length of 6 m in

Substrattransportrichtung 15 and a width of 3.21 m across the substrate transport direction 15th Die

However, vacuum substrate treatment plant according to the invention is also suitable for smaller or larger substrates 7. The vacuum substrate treatment system is particularly flexible for in substrate transport direction 15 longer or shorter

Substrates 7.

In the upper part of Fig. 3 is this one

Einschleuskammer 1 with intermediate region 16 shown in FIG. 1 schematically. The vacuum chamber 4 of the

Locking chamber 1 belonging substrate transport device 3 is arranged so that it has already at a distance li-lo opposite to the substrate transport direction 15 in front of the lock chamber 1 has its beginning, which as a zero point along the lock chamber 1 and along the

Substrattransportrichtung 15 worn plant length is used. The end of the lock chamber 1 is therefore reached at li6. In the substrate transport direction 15, the intermediate region 16 would be adjoined by the at least one process chamber, not shown, from 1 ₁₆ to li7, wherein the

Lock chamber 1 vacuum-tight with the at least one

Process chamber is connected. Vertical auxiliary lines are used to distinguish the individual chamber segments 6 along the substrate transport direction 15. For description, the chamber segments 6 are starting at lo in

Substrate transport direction 15 starting at one consecutive numbered. For the partitions 5 applies accordingly.

From the zero point just described down the time is shown. For the times shown in the corresponding horizontal direction, the position of

Sluice valves 14, the position of ventilation openings and the position of evacuation openings of the respective chamber segments 6 are shown.

The illustrated in Fig. 3 during the injection

Substrate 7 is represented in the diagram area by two diagonal and mutually parallel lines. The substrate 7 is thus in a uniform movement with a

transported at a constant second speed.

According to the invention, however, this second speed does not necessarily have to be the same along the length of the system, but can be adapted along the substrate transport direction 15 in the transport sections described with reference to FIGS. 1 and 2.

At time to s, the trailing edge of the substrate 7 is in the substrate transport direction at lo of the plant length, i. at the very beginning of the substrate transport device 3.

Opposite to the substrate transport direction 15, the leading edge has the following substrate 7n at a distance. The path-time profile of the leading edge of this subsequent substrate 7n in the substrate transport direction 15 is in FIG

Diagram area also represented by a diagonal line, which is steeper, however, than the above-described diagonal and mutually parallel lines of the injectable in Fig. 3 substrate 7. Die

Trailing edge of the substrate 7 to be inserted

leading substrate 7v is also by a

diagonal line in the diagram area, which is also steeper than those described above

diagonal and mutually parallel lines of the substrate 7 to be injected in FIG. 3. The trailing edge of the leading substrate 7v is at time to at I12 the plant length.

Accordingly, the first speed of the trailing substrate 7n and the third speed of the trailing substrate 7v are smaller than those of the substrate 7 to be trafficked. Both the transition between the lower first speed of the substrate 7 before it

Trailing edge has reached the beginning of the substrate transport device 3, on the higher second speed as well as the transition from this higher second speed to the third speed, once the leading edge of the substrate 7 to be inserted has reached the end of the Einschleuskammer 1 at plant length I17, are shown in FIG 3 shown discontinuously. According to the invention, however, the transitions between the speeds described are continuous and accordingly continuously merge. The accelerations of the substrate 7 required for this purpose by the substrate transport device 3 are variable and related to the mechanical strengths of the substrate 7 as well as the friction properties between the substrate 7 and the transport rollers of the substrate transport device 3

customizable, so the limits to be respected not

be crossed, be exceeded, be passed.

The introduction of the substrate 7 proceeds as shown in FIG. 3 as follows.

At the time t ₀ is the trailing edge of the substrate 7 in substrate transport direction 15 at lo the system length. The front edge of the substrate 7 is already in the vacuum chamber 4. The substrate 7 moves at the second speed by means of the substrate transport device 3 in the substrate transport direction 15. Both the lock valve 14, through which the vacuum chamber 4 can be closed to the environment and the lock valves 14th are in the substrate transport direction 15 first four partitions 5 open. The first five chamber segments 6 are already ventilated. The sixth chamber segment 6 is being ventilated.

At time ti, the substrate 7 has moved on. The

Ventilation of the sixth chamber segment 6 is completed. For now . 2, the substrate 7 has moved on and the gate valve 14 of the fifth partition 5 has been opened. The ventilation of the seventh chamber segment 6 is completed.

At time t ₃ , the substrate 7 has moved on and the gate valve 14 of the sixth partition 5 has been opened. The ventilation of the eighth chamber segment 6 is completed.

At time t ₄ , the substrate 7 has moved on and the gate valve 14 of the seventh partition wall 5 has been opened. The trailing edge of the substrate 7 is located in

Substrate transport direction behind the sluice valve 14, through which the vacuum chamber 4 to the environment

is closed and which is then closed. The lock valve 14 of the eighth partition 5 is

closed. The valve 13 on the second chamber segment 6, which connects this chamber segment 6 with the rough vacuum pump 11, is opened and the rough vacuum pump 11

evacuates the chamber segment group, in which the

Substrate 7 is located on the corresponding

subatmospheric pressure. The substrate 7 moves

continuously in the substrate transport direction 15 on. At time ts, the substrate 7 has moved on and the

Sluice valve 14 of the first partition 5 is closed. Accordingly, this is first in the substrate transport direction 15

Chamber segment 6 on both sides by lock valves

locked. The substrate 7 continues to move continuously. Even before reaching t ₆ lock valve 14 of the eighth partition 5 is opened and it begins the venting of the first chamber segment. 6 At the time te, the substrate 7 has moved on and the gate valve 14 of the second partition wall 5 is closed. The lock valve 14 of the ninth partition 5 is

open. After a certain pumping time of the roughing pump 11, the valve 13 is closed to the roughing pump 11 and the valve 13 on the fifth chamber segment 6, which connects this chamber segment 6 with the fine vacuum pump 10 is opened and the fine vacuum pump 10 evacuates the

Chamber segment group in which the substrate 7 is at the corresponding subatmospheric pressure. The

Substrate 7 moves continuously in

Substrate transport direction 15 on.

At time t ₇ , the substrate 7 has moved on and the venting of the first chamber segment 6 is completed. The

Sluice valve 14, through which the vacuum chamber 4 is closed to the environment, is opened.

At time ts, the substrate 7 has moved on and the gate valve 14 of the third partition wall 5 is closed. The gate valve 14 of the tenth partition 5 becomes

open. The second chamber segment 6 is already ventilated.

At the time tg, the substrate 7 has moved on and the gate valve 14 of the fourth partition wall 5 is closed. The gate valve 14 of the eleventh partition 5 is opened. The lock valve 14 of the first partition 5 is already open.

At time tio, the substrate 7 has moved on. The third chamber segment 6 is being ventilated. The lock valve 14 of the fifth partition 5 is closed. The lock valve 14 of the twelfth partition wall 5 is opened. After a

certain pumping time of the fine vacuum pump 10, the valve

13 closed to the fine vacuum pump 10 and the valves 13 of the sixth to thirteenth chamber segment 6, which connect these chamber segments 6 with the high vacuum pump 9, are opened and the high vacuum pump 9 evacuates the chamber segment group in which the substrate 7 is at the corresponding subatmospheric pressure. The

Substrate 7 moves continuously in

Substrate transport direction 15 on.

At time t u, the substrate 7 has moved on and the gate valve 14 of the sixth partition 5 is

closed. The lock valve 14 of the thirteenth

Partition 5 is opened. The aeration of the third

Chamber segment 6 is completed. The lock valve 14 of the second partition 5 is already open.

At time ti ₂ , the substrate 7 has moved on and the gate valve 14 of the seventh partition wall 5 is closed. The gate valve 14 of the fourteenth partition 5 is opened.

At time ti ₃ , the substrate 7 has moved on and the gate valve 14 of the eighth partition wall 5 is closed. The venting of the fourth chamber segment 6 is completed. The lock valve 14 of the third partition 5 is already open.

At time ti ₄ , the substrate 7 has moved on and the gate valve 14 of the fifteenth partition wall 5 is

open, whereby the chamber segment group of the ninth to sixteenth chamber segment is connected to the not shown at least one process chamber.

At the time t is the substrate 7 has moved on and the gate valve 14 of the ninth partition 5 is closed.

At time ti ₆ , the substrate 7 has moved on and the gate valve 14 of the tenth partition 5 is closed. The fifth chamber segment 6 is vented.

At time ti ₇ , the substrate 7 has moved on and the Sluice valve 14 of the fourth partition 5 is opened. The sixth chamber segment 6 is vented. The substrate 7 has on the leading substrate 7v due to

Speed difference between the second

Speed and lower third speed unlocked and is steadily decelerated, so that the substrate 7 and the leading substrate 7v can be transported with a distance through the at least one process chamber. After a cycle time of the insertion of ti ₇ - to, the trailing edge of the following substrate 7n is then at the same position on the substrate transport device 3 as the just introduced substrate 7 at time t ₀ . Thus, the injection for the subsequent substrate 7n may begin. FIG. 4 schematically illustrates the path-time course of the

Removal of a substrate 7 from the at least one process chamber, not shown

Vacuum substrate treatment plant in the environment outside of a vacuum substrate treatment plant. It is considered the discharge of the same substrate 7 as previously in the description of FIG. 3.

In the upper part of FIG. 4, this is a

Outward chamber 2 with intermediate region 16 shown in FIG. 2 schematically. The vacuum chamber 4 of the

Subterranean transport device 3 belonging to the lock chamber 2 is arranged in such a way that it ends behind the lock chamber 2 at a distance li ₇ - li ₆ in the substrate transport direction 15. The zero point system length of the lock chamber 2 is located at the junction between the

at least one process chamber and the beginning of the

Zwischenbereiches 16. The end of the lock chamber 2 is therefore reached at li ₇ the length of the system. vertical

Guides serve to distinguish the individual

Chamber segments 6 along the Substrattransportrichtung 15th For description, the chamber segments 6 are beginning at lo in the substrate transport direction 15, starting at one

consecutively numbered. For the partitions 5 applies

corresponding. From the zero point just described down the time is shown. For the times shown in the corresponding horizontal direction, the position of

The illustrated in Fig. 4 during the discharge

Substrate 7 is represented in the diagram area by two diagonal and mutually parallel lines. The substrate 7 is thus in a uniform movement with

transported at a constant second speed.

According to the invention, however, the second speed does not necessarily have to be uniform along the length of the system, but can be adapted along the substrate transport direction 15 in the transport sections described with reference to FIGS. 1 and 2.

At the time to is the trailing edge of the substrate 7 in substrate transport direction at 1 _{0 of} the plant length, ie at the very beginning of the substrate transport device. 3

Opposite to the substrate transport direction 15, the leading edge has the following substrate 7n a certain distance. The path-time history of the leading edge of this

Subsequent substrate 7n in substrate transport direction 15 is also shown in the diagram area by a diagonal line, which is steeper, however, than the previously described diagonal and each other

parallel lines of the illustrated in Fig. 4

substrate 7 to be ejected. The trailing edge of the substrate 7v leading the substrate 7 to be ejected is also indicated by a diagonal line in the diagram area this is also steeper than the previously described diagonal and mutually parallel lines of the auszuschleusenden shown in Fig. 4

Substrate 7. The trailing edge of the leading substrate 7v is at time to at I12.

The first velocities of the trailing substrate 7n and the third velocity of the advancing substrate 7v are thus smaller than those of the substrate 7 being trajected. Both the transition between the lower first velocity of the substrate 7 before it

Trailing edge has reached the beginning of the substrate transport device 3, on the higher second speed as well as the transition from this higher second speed to the third speed, as soon as the leading edge of the substrate 7 auszuschleusenden the end of the

Exit chamber 2 has reached _i7 , are shown discontinuously in Fig. 4. According to the invention, however, the transitions between the speeds described are continuous and accordingly continuously merge. The accelerations of the substrate 7 required for this purpose by the substrate transport device 3 are variable and related to the mechanical strengths of the substrate 7 as well as the friction properties between the substrate 7 and the transport rollers of the substrate transport device 3

customizable, so the limits to be respected not

be crossed, be exceeded, be passed.

The removal of the substrate 7 proceeds as shown in FIG. 4 as follows.

At the time to is the trailing edge of the substrate 7 in the substrate transport direction at 1 _0th The substrate 7 is located completely in the lock chamber 2. The substrate 7 moves at the second speed by means of the substrate transport device 3 in the substrate transport direction 15. Both the lock valve 14, through which the Vacuum chamber 4 is closed to the at least one process chamber and the lock valves 14 of the first five in the substrate transport direction 15 partition walls 5 are open. The seventh and eighth chamber segment 6 is performed by means of the high vacuum pump 9 described for FIG

opened valves 13 evacuated. The ninth chamber segment 6 is evacuated by means of the fine vacuum pump 10 described with reference to FIG. 2 through the opened valve 13. The tenth and eleventh chamber segment 6 is by means of Fig. 2

evacuated by open valves 13 described Grobvakuumpumpe 11. The sluice valves 14 of the thirteenth to fifteenth partition wall 5 and the sluice valve 14, through which the vacuum chamber 4 with respect to the environment

is closed, are open. The twelfth to sixteenth chamber segment 6 is vented. Chamber segments 6 as well

Chamber segment groups that are not open

Sluice valves 14 are connected to the environment, are evacuated continuously.

At time ti, the substrate 7 has moved on. The

Sluice valve 14 of the sixth partition 5 is opened. The lock valve 14 of the twelfth partition 5 becomes

closed. The valve 13 of the tenth chamber segment 6 to the roughing vacuum pump 11 is closed. The valve 13 of the tenth chamber segment 6 to the fine vacuum pump 10 is opened. The valve 13 of the twelfth chamber segment 6 to the rough vacuum pump 11 is opened and the twelfth

Chamber segment 6 is on the corresponding

subatmospheric pressure evacuated.

For now . 2, the substrate 7 has moved on. The

Sluice valve 14 of the seventh partition 5 is opened. The valve 13 of the eleventh chamber segment 6 for

Grobvakuumpumpe 11 is closed. The valve 13 of the eleventh chamber segment 6 to the fine vacuum pump 10 is

open . At time t ₃ , the substrate 7 has moved on. The

Sluice valve 14 of the seventh partition 5 is opened. The lock valve 14 of the first partition 5 is

closed. The valve 13 of the ninth chamber segment 6 to the fine vacuum pump 10 has been closed. The valve 13 of the ninth chamber segment 6 to the high vacuum pump 9 has been opened. The valve 13 of the twelfth chamber segment 6 to the rough vacuum pump 11 has been closed. The valve 13 of the twelfth chamber segment 6 to the fine vacuum pump 10 was opened.

At time t ₄ , the substrate 7 has moved on. The

Lock valve 14 of the thirteenth partition 5 is

closed. The valve 13 of the thirteenth chamber segment 6 to the rough vacuum pump 11 is opened and the thirteenth chamber segment 6 is on the corresponding

subatmospheric pressure evacuated.

At time ts, the substrate 7 has moved on. The

Sluice valve 14 of the ninth partition 5 is opened. The lock valve 14 of the second partition 5 has been

closed. The valve 13 of the tenth chamber segment 6 to the fine vacuum pump 10 has been closed. The valve 13 of the tenth chamber segment 6 to the high vacuum pump 9 has been opened.

At time t ₆ , the substrate 7 has moved on. The

Sluice valve 14 of the first partition 5 is opened.

At time t ₇ , the substrate 7 has moved on. The

Sluice valve 14 of the tenth partition 5 is opened. The lock valve 14 of the third partition 5 was

closed. The valve 13 of the eleventh chamber segment 6 to the fine vacuum pump 10 has been closed. The valve 13 of the eleventh chamber segment 6 to the high vacuum pump 9 has been

open . At time ts, the substrate 7 has moved on. The

Lock valve 14 of the fourteenth partition 5 was

closed. The valve 13 of the fourteenth chamber segment 6 to the rough vacuum pump 11 is opened and the fourteenth chamber segment 6 is on the corresponding

subatmospheric pressure evacuated. The valve 13 of the thirteenth chamber segment 6 to the rough vacuum pump 11 has been closed. The valve 13 of the thirteenth chamber segment 6 to the fine vacuum pump 10 has been opened. At time t ₉ , the substrate 7 has moved on. The

Sluice valve 14 of the eleventh partition 5 is opened. The lock valve 14 of the fourth partition 5 has been

closed. The valve 13 of the twelfth chamber segment 6 to the fine vacuum pump 10 has been closed. The valve 13 of the twelfth chamber segment 6 to the high vacuum pump 9 has been opened.

At time tio, the substrate 7 has moved on. The

Sluice valve 14 of the second partition 5 is opened.

At time tu, the substrate 7 has moved on. The

Sluice valve 14 of the twelfth partition 5 is opened. The lock valve 14 of the fifth partition 5 has been

closed. The valves 13 of the seventh to twelfth

Chamber segment 6 to the high vacuum pump 9 have been closed. The valves 13 of the seventh to twelfth chamber segment 6 to the fine vacuum pump 10 are opened.

At time ti ₂ , the substrate 7 has moved on. The

Lock valve 14 of the fifteenth partition 5 was

closed. The valve 13 of the fifteenth chamber segment 6 to the rough vacuum pump 11 is opened and the fifteenth chamber segment 6 is on the corresponding

subatmospheric pressure evacuated. The valve 13 of the fourteenth chamber segment 6 to the roughing vacuum pump 11 has been closed. The valve 13 of the fourteenth chamber segment. 6 to the fine vacuum pump 10 was opened.

At time ti3, the substrate 7 has moved on. The

Lock valve 14 of the thirteenth partition 5 is

open. The lock valve 14 of the sixth partition 5 is closed. The valve 13 of the sixth chamber segment 6 to the fine vacuum pump 10 is closed. The valve 13 of the sixth chamber segment 6 to the high vacuum pump 9 is opened.

At time ti4, the substrate 7 has moved on. The

Sluice valve 14 of the third partition 5 is opened.

The lock valve 14 of the vacuum chamber 4, through which the vacuum chamber 4 is closed to the environment, is closed. The valve 13 of the sixteenth

Chamber segment 6 to the rough vacuum pump 11 is opened and the sixteenth chamber segment 6 is evacuated to the corresponding subatmospheric pressure.

At time tis, the substrate 7 has moved on. The

Lock valve 14 of the fourteenth partition 5 is

open. The gate valve 14 of the seventh partition wall 5 has been closed. The valve 13 of the fifteenth

Chamber segment 6 to the rough vacuum pump 11 has been closed. The valve 13 of the fifteenth chamber segment 6 for

Fine vacuum pump 10 was opened.

At time ti6, the substrate 7 has moved on. The

Lock valve 14 of the fifteenth partition 5 is

open. The lock valve 14 of the eighth partition wall 5 was closed. The valves 13 of the ninth to

fifteenth chamber segment 6 to the fine vacuum pump 10 were closed. The valve 13 of the sixteenth chamber segment 6 to the rough vacuum pump 11 has been closed. The valve 13 to the ventilation device 8 of the sixteenth chamber segment 6 is opened. The ventilation by means of

Ventilation device 8 is preferably carried out with dry Air .

At time ti7, the substrate 7 has moved on. After the complete ventilation of the ninth to sixteenth

Chamber segment 6, the gate valve 14, through which the vacuum chamber 4 is connected to the environment, opened.

At time tis, the substrate 7 has moved on. The

Sluice valve 14 of the fourth partition 5 is opened. The lock valve 14 of the ninth partition 5 is

closed. The valve 13 of the ninth chamber segment 6 to the rough vacuum pump 11 is opened and the ninth

Chamber segment 6 is on the corresponding

subatmospheric pressure evacuated.

At the time tig the substrate 7 has moved on. The

Sluice valve 14 of the tenth partition 5 is closed. The valve 13 of the tenth chamber segment 6 for

Grobvakuumpumpe 11 is opened and the tenth

Chamber segment 6 is on the corresponding

subatmospheric pressure evacuated. At time t ₂ o, the substrate 7 has moved on. The

Sluice valve 14 of the fifth partition 5 is opened. The lock valve 14 of the eleventh partition 5 becomes

closed. The valve 13 of the eleventh chamber segment 6 to the roughing vacuum pump 11 is opened and the eleventh chamber segment 6 is evacuated to the corresponding subatmospheric pressure.

At time t2i, the substrate 7 has moved on and the gate valve 14 of the fourth partition wall 5 is opened. The substrate 7 has due to the speed difference between the second speed and the lower third speed outside of the lock chamber 2 on the leading substrate 7v unlocked and is continuous braked, so that the substrate 7 and the leading substrate 7 can be transported with a certain distance outside the lock chamber 2 on. After a cycle time of the removal of t ₂ i -t ₀ , the leading edge of the subsequent substrate 7n is then at the same position on the substrate transport device 3 as the just introduced substrate 7 at time to. Thus, the discharge for the subsequent substrate 7n can begin.

Fig. 5 shows in the upper part of the qualitative

Speed-time course of a substrate to be inserted 7 in a vacuum substrate treatment plant according to the prior art and in the lower part of the

qualitative speed-time course of a

to be inserted substrate 7 in a vacuum substrate treatment plant according to the invention. Both speed-time courses share a common time axis.

For introducing the substrate 7 in the

According to the prior art vacuum substrate treatment plant according to FIG. 5, the vacuum substrate treatment plant comprises a lock chamber, a transfer chamber arranged in substrate transport direction 15 thereon, in which

Substrattransportrichtung 15 at least one process chamber is arranged.

For introducing the substrate 7 into the vacuum substrate treatment system according to the invention according to FIG. 5, the vacuum substrate treatment system according to the invention comprises an infeed chamber 1 and at least one in

Substrate transport 15 arranged thereon

Process chamber.

Both the substrate transport device 3 of

Vacuum treatment plant according to the prior art as well as the substrate transport device 3 of the invention Vacuum treatment plant begins in substrate transport 15 already before the relevant lock chamber. Substrates 7 are transferred to this substrate transporting device 3 from a non-vacuum substrate treatment plant

Substrate transport device with a first

Pass speed v _la and vi.

At time to, the trailing edge of the substrate 7 is at the beginning of the just described

Substrate transport device 3. This applies both to the vacuum substrate treatment plant according to the prior art, as well as for the inventive

Vacuum Substrate Treatment Facilities.

According to the prior art, the substrate 7 is first transported by means of the substrate transport device 3 at the first speed v _ia in the lock chamber. If the substrate 7 is completely inside the lock chamber, the transport of the substrate 7 is stopped and the

Lock chamber closed vacuum-tight. The

The lock chamber is then evacuated to the required subatmospheric process pressure by means of vacuum pumps. During this pumping time, the substrate 7 remains in the

Lock chamber. After reaching the required

Process pressure, a lock valve 14 is opened between the lock chamber and the transfer chamber. The

Substrate is accelerated by the substrate transport device 3 to a second speed v _2a , which is greater than the first speed vi _a . Due to the increased second speed v _2a , the substrate 7 decreases in size as a result of the persistence in the lock chamber

Distance to a leading substrate 7v in the

Transfer chamber in the way that the substrate 7 and the leading substrate 7v in a certain and

constant distance through the process chamber

are transportable. Is this certain distance reached the second speed v _{2a is} reduced to a third speed v _3a . This is after a

Einschleuszeit t _{Za ended} the introduction of the substrate 7 in the process chamber of the vacuum substrate treatment plant according to the prior art.

When using an inventive

Vacuum substrate handling system for introducing a

Substrate 7, the substrate 7 is already at time t ₀ accelerated from the first speed vi to a second speed v ₂ . The second speed v ₂ is in this case approximately one third of the two speeds v _2a according to the prior art. In one embodiment, the second speed v ₂ = 0.5 ms ^_1 . During the Einschleuszeit t _z , the substrate 7 moves uniformly with this second speed v ₂ through the lock chamber 1. Das

In this case, sluice-in by means of the sluice chamber 1 takes place according to the description of FIG. 3. If the front edge of the substrate 7 has the end of the sluice-in chamber 1 in FIG

Substrate transport direction 15 is reached, it is decelerated from the second speed v ₂ to a third speed v ₃ . In one embodiment, the second

Speed v ₂ = 0.25 ms ^_1 . The amount of

In one embodiment, acceleration of the substrate 7 during the transition from the second speed v ₂ to the third speed v ₃ is 1.3 ms ^{~ 2} . Due to the increased second speed v ₂ , the substrate 7 could reduce the distance to the leading substrate 7v, so that the substrate 7 and the leading substrate 7v in FIG

constant distance with the third speed v ₃ can be transported through the process chamber. This is after a Einschleuszeit t _z the introduction of the

Substrate 7 finished in the process chamber of the vacuum substrate treatment plant according to the invention.

According to the invention the Einschleuszeit t _{z is} shorter than the Einschleuszeit t _Za according to the prior art. In a

Embodiment is t _z about three quarters of t _Za . This makes it possible to lower the second speed v ₂ to about one third of the third speed v _2a . For longer or shorter substrates 7, the second

Speed, however, be less than or greater than v ₂ . The lower second speed v ₂ is a prerequisite to even process steps such as a

Substrate pretreatment or quality monitoring in the lock chamber 1 to perform. On the basis of this, the third speed v ₃ can be increased in relation to the third speed v _{3a of} the prior art vacuum substrate treatment system.

Locking method and vacuum substrate treatment system

Locking Chamber (Einschleuskammer)

Lock chamber (reject chamber)

Substrate transport device with transport rollers Vacuum chamber

partition wall

chamber segment

substratum

n subsequent substrate

v leading substrate

aerator

High vacuum pump

0 fine vacuum pump

1 rough vacuum pump

2 exhaust gas

3 valve

4 lock valve

5 substrate transport direction

6 intermediate area

Claims

Locking method and vacuum substrate treatment system Claims

1. Locking method for

Vacuum substrate treatment plants having at least one process chamber, at least one lock chamber (1, 2) which can be closed in a vacuum-tight manner by a respective lock valve (14) in relation to the environment and opposite the process chamber. The lock chamber (1, 2) extends through at least two transversely to a substrate transport direction (15).

arranged, provided with at least one each vacuum-tight closing lock valve (14)

Partitions (5) in chamber segments (6) is divided, and a substrate transport means (3) for the transport of substrates (7, 7v, 7n) in

Substrate transport direction (15), comprising

Moving at least one substrate (7, 7v, 7n) towards the lock chamber (1, 2), opening the first lock valve (14) of the lock chamber (1, 2) as soon as the front edge of the substrate (7, 7v, 7n) approaches,

Moving the substrate (7, 7v, 7n) through the

opened first lock valve (14) in the

Lock chamber (1, 2) into it, each subsequent lock valve (14) being opened as soon as the front edge of the substrate (7, 7v, 7n) approaches,

Closing of the first lock valve (14) of the lock chamber (1, 2) as soon as the trailing edge of the substrate (7, 7v, 7n) the first

Has passed lock valve (14), so that the substrate (7, 7v, 7n) in one through two Closed lock valves (14)

Substrate area is located and wherein the

Substrate area comprises at least one chamber segment (6),

Changing the pressure within the substrate area from the pressure prevailing in front of the lock chamber (1, 2) to the pressure prevailing behind the lock chamber (1, 2) during the movement of the lock

Substrate (7, 7v, 7n) and thus the substrate area containing the substrate through the

Lock chamber (1, 2), each one

Lock valve (14) is opened as soon as the front edge of the substrate (7, 7v, 7n) approaches and is closed as soon as the

Trailing edge of the substrate (7, 7v, 7n) the

Hatch valve (14) has passed

• Opening the last lock valve (14) of the

Lock chamber (1, 2),

Moving the substrate (7, 7v, 7n) through the

opened last lock valve (14) out of the lock chamber (1, 2), each one

Lock valve (14) is closed as soon as the trailing edge of the substrate (7, 7v, 7n) the

Lock valve (14) has happened.

Locking method according to claim 1, characterized

characterized in that the substrates (7, 7v, 7n) during the entire lock process

be moved continuously.

Locking method according to one of the preceding claims, characterized in that between the at least one lock chamber (1, 2) and the at least one process chamber at least one intermediate region (16) is arranged, wherein the intermediate region (16) via a flow resistance is connected to the at least one process chamber and substrates (7, 7v, 7n) through the

Flow resistance are moved through.

Locking method according to claim 3, characterized in that the intermediate region (16) arranged transversely to the substrate transport direction (15), with at least one each

Flow resistance partition walls (5) is divided into chamber segments (6), wherein substrates are arranged in a, over at least one chamber segment (6) extending substrate region, are moved through flow resistances and while the pressure within the

Substrate area of prevailing before the intermediate area pressure on the behind the

Intermediate ruling pressure is changed.

Locking method according to one of the preceding claims, characterized in that substrates (7, 7v, 7n) with a length in

Substrate transport direction (15) greater than that

Distance from a lock valve (14) to

next but one lock valve (14) can be used.

Locking method according to one of the preceding claims, characterized in that at least one lock valve (14) of each lock chamber (1, 2) is closed at each time.

Locking method according to one of the preceding claims, characterized in that at least one chamber segment (6) has at least one opening through which the at least one chamber segment (6) is evacuated or vented.

8. Locking method according to one of the preceding claims, characterized in that the substrate (7, 7v, 7n) arranged by means of a before and / or after a lock valve (14)

Substrate detector is detected.

9. Locking method according to one of the preceding claims, characterized in that the substrate (7, 7v, 7n) with at least two

different speeds is moved.

10. Lock method according to one of the preceding claims, characterized in that the substrate (7, 7v, 7n) first with a first

Speed is then accelerated to a second speed and then accelerated to a third speed.

11. Vacuum substrate treatment plant with at least one process chamber and at least one relative to the environment and with respect to the process chamber by a respective lock valve (14) vacuum-sealable lock chamber (1, 2) and a

Substrate transport device (3) for transporting substrates (7, 7v, 7n) in the substrate transport direction (15) between an atmosphere with atmospheric pressure outside the process chamber and subatmospheric pressure inside the process chamber, characterized in that the lock chamber (1, 2) inside by at least two across

Substrate transport direction (15) arranged, each provided with a vacuum-tight closing gate valve (14) dividing walls (5) in chamber segments (6) is divided.

12. Vacuum substrate treatment plant according to claim 11, characterized in that between the at least one lock chamber (1, 2) and the at least one process chamber at least one

Intermediate area (16) is arranged, wherein the

Intermediate region (16) is connected via a flow resistance with the at least one process chamber.

13. Vacuum substrate treatment plant according to claim 12, characterized in that the

Intermediate area (16), across to the

Substrate transport direction (15) arranged, provided with at least one respective flow resistance partitions (5), in chamber segments (6) is divided.

14. Vacuum substrate treatment plant according to one of

Claims 11 to 13, characterized in that the distance from a lock valve (14) to the next but one lock valve (14) is smaller than the length of a substrate (7, 7v, 7n) in

Substrate transport direction (15).

15. Vacuum substrate treatment plant according to one of

Claims 11 to 14, characterized in that the substrate transport means (3) a plurality of independently drivable

Has transport sections.

16. Vacuum substrate treatment plant according to one of

Claims 11 to 15, characterized in that in the substrate transport direction (15) before and / or after a gate valve (14), a substrate detector is arranged.

17. Vacuum substrate treatment plant according to one of

Claims 11 to 16, characterized in that at least one chamber segment (6) at least an opening, whereby the at least one chamber segment (6) is evacuated or ventilated.

Vacuum substrate treatment plant according to claim 17, characterized in that in one

Chamber segment group of several in

Substrate transport direction (15) of adjacent chamber segments (5) with each other open

Sluice valves (14) at least one chamber segment has no separate opening for evacuation and this at least one chamber segment via at least one opening of another of these

adjacent chamber segments (6) is evacuated.