WO2014134911A1 - 一种肋线式散热器及制造方法 - Google Patents
一种肋线式散热器及制造方法 Download PDFInfo
- Publication number
- WO2014134911A1 WO2014134911A1 PCT/CN2013/083531 CN2013083531W WO2014134911A1 WO 2014134911 A1 WO2014134911 A1 WO 2014134911A1 CN 2013083531 W CN2013083531 W CN 2013083531W WO 2014134911 A1 WO2014134911 A1 WO 2014134911A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rib
- ribs
- feet
- line
- lines
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 39
- 238000012546 transfer Methods 0.000 claims abstract description 26
- 238000007514 turning Methods 0.000 claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 7
- 238000001125 extrusion Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 4
- 101100334009 Caenorhabditis elegans rib-2 gene Proteins 0.000 description 31
- 239000000463 material Substances 0.000 description 8
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010273 cold forging Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000009497 press forging Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
- F21V29/81—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires with pins or wires having different shapes, lengths or spacing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to the field of heat dissipation technology for semiconductor electronic devices, and in particular, to a rib wire heat sink and a method of fabricating the same.
- the object of the present invention is to provide an optimum structure and an inexpensive manufacturing method in view of the above problems.
- the ribbed heat sink includes a ribbed wire (8) and a heat conductive fixing plate (7)
- the rib wire (8) includes a rib foot (3) and a rib body (2), a rib line (8) It adopts stamping and bending forming process to make various shapes, or adopts a spring winding process to form a spring shape
- the heat conducting fixing plate (7) adopts a stamping process or a mesh plate made by extrusion and cutting process.
- the heat transfer contact surface (5) of the heat sink is turned to the bottom surface of all the rib legs (4) and the bottom surface of the heat transfer fixing plate (7).
- the ribbed radiator includes a ribbed wire (8) and a cuff sleeve (1), the length of the central rib (9) is equal to the height of the cuff (1), and the rib (8) includes the rib (3) and the rib Body (2), rib line (8) is made by wire straightening and cutting process, and the hoop sleeve (1) is made by extrusion and cutting process, or cut by metal thin tube.
- ribs (3) are fastened into a bundle, and the jacket is covered with a ferrule (1), and the ferrule sleeve (1) is tightened by a mold tightening process;
- the surface of the semi-finished heat sink of the shrink structure is electrolessly plated with nickel
- the heat transfer contact surface (5) of the radiator is turned by turning, and the end faces of all the ribs (4) and the bottom end of the hoop (1) are neat and smooth;
- the present invention provides a ribbed heat sink including a fixing device and one or more rib wires, each of the rib wires including a rib body and at least one rib foot, the rib body Extending from the ribs, the ribs of each of the ribs are fixed to the fixing device, and the ribs of all the ribs are arranged in a predetermined pattern for heat dissipation.
- the fixing device is selected from one of a heat-conducting fixing plate and a wrap sleeve, and the heat-conducting fixing plate is provided with a positioning hole for fixing the rib of the corresponding rib line, the bag
- the cuff is adapted to enclose the ribs of the ribs.
- the average gap of the adjacent ribs is less than 15 mm, and the average gap of the ribs adjacent to the ribs is greater than 2 mm and less than 30 mm, and the cross-sectional area of each of the ribs is greater than 2 m ltf and less than 30 m ltf
- the total area of the rib foot end regions of the plurality of rib lines of the ribbed heat sink is 1 to 6 times the area of the heat transfer surface of the semiconductor electronic component.
- the ribs of the plurality of rib lines radiate outward in a plane with a circular radius, and are stacked on the longitudinal plane, and the layers are arranged in a staggered structure; or a plurality of the ribs Forming a spherical radius outwardly radiating structure; or a plurality of the ribs are disposed in parallel with the corresponding vertical structure of the rib; or dispersing the rib portion of the rib line, reversing Formed into a cup-shaped structure.
- the predetermined pattern of the ribs of all the ribs is selected from at least one of the following structures or a combination of several:
- Each of the ribs includes a rib and two ribs, the rib extending between the ribs to form an annular rib, the annular rib and the rib Forming a predetermined angle, the two ribs of each of the rib lines are inserted into the positioning holes of the corresponding heat-conducting fixing plate;
- the ribs of the plurality of rib lines form one or more layers, and each layer has a predetermined interval between the ribs; the ribs extend axially to the ribs, and the ribs are Forming an angle of a predetermined size between the planes of the ribs, the ribs of the ribs being bent into a curved shape, the curved shape being selected from a continuous Z-shape, an S-shape, a W-shaped extension, And one of a serpentine extended shape;
- Each of the ribs is disposed in a straight line, and the ribs of all the ribs are radially disposed from a center of the fixing device;
- Each of the ribs is disposed in a spiral shape, and an axis of each of the ribs is disposed parallel to the corresponding ribs;
- the plurality of positioning holes of the heat-conducting fixing plate form a multi-ring positioning hole, and each of the ring-shaped positioning holes is for fixing a part of the ribs of the rib line, so that the ribs of all the rib lines Arranging in a ring shape around a central axis of the heat conducting fixing plate;
- the ribs of the plurality of ribs are fixed to the fixing device, and the ribs of the plurality of ribs surround the fixing device to dispose the fixing device inside the rib body, And the rib body is radially disposed around the fixing device.
- a plane in which each of the rib lines is located forms an angle with a plane of the corresponding rib, and the angle is selected from one of an acute angle, a right angle, and an obtuse angle.
- the heat-conducting fixing plate is made of aluminum, or copper, or copper-aluminum composite material, and has a thickness of more than 2 mm and less than 20 mm;
- the hoop sleeve is made of aluminum, or copper, or copper-aluminum composite material, and the height thereof is greater than 2 mm. Less than 20 m, wherein the length of the center rib of the plurality of ribs is equal to the height of the hoop.
- the rib wire is made of a wire of various shapes and shapes of a wire made of aluminum, or copper, or a copper-aluminum composite material, and the optimum cross section is a circle and a star. Accordingly, the present invention provides a method of manufacturing a ribbed heat sink comprising the following steps:
- the fixing device is a heat-conducting fixing plate or a hoop sleeve, the heat-conducting fixing plate is formed with a positioning hole, and the heat-conducting fixing plate is stamped or extruded.
- the method may be selected from the following:
- step (c) includes the following steps:
- the rib line of the ribbed heat sink of the present invention adopts a wire of various shapes and cross sections of aluminum, or copper, or copper-aluminum composite material, and the cross-sectional area S1 is greater than 2 m ltf, less than 30 m ltf, in order to ensure rib
- the ribs of the wire have sufficient contact heat transfer area with the heat transfer surface of the semiconductor component
- the cross section of the rib foot is preferably circular and star-shaped, and the average gap el of the rib foot is less than 15 mm, and the total length of the rib foot end is
- the cross-sectional area n Sl is 1 to 6 times the derived heat transfer area S of the semiconductor component, so that the end faces of the plurality of rib ribs can be directly or recently contacted with the heat transfer surface of the small-sized semiconductor component.
- the rib line is formed into many shapes by a stamping process or a spring-wound process, and the length of the rib line is increased, that is, the heat-dissipating area is increased, and the ribs of the plurality of rib lines radiate outward in a plane with a circular radius on the longitudinal surface.
- the layers are arranged in a staggered structure; or the plurality of ribs are arranged in a spherical radius outward radiating structure; or the plurality of ribs are arranged in parallel with the vertical structure of the ribs; or the ribs of the ribs are arranged After partially spreading, it is reverse formed into a cup-shaped structure.
- the structure of the structure is ever-changing.
- the average gap e2 between adjacent ribs is greater than 2 mm and less than 30 mm, which makes the rib portion of the ribbed heat sink of the present invention more transparent, which improves the convective heat transfer coefficient of the rib and the air, and greatly improves the coefficient. Thermal performance.
- the heat-conducting fixing plate of the ribbed heat sink of the invention adopts aluminum, or copper, or copper-aluminum composite plate, the thickness of which is greater than 2 mm and less than 20 mm; the hoop sleeve is made of aluminum, or copper, or copper-aluminum composite material, and the height thereof is greater than 2mm, less than 20mm.
- the welding method of the rib foot and the heat-conducting fixed plate may be that the surface is treated by a nickel plating process and then soldered by a soldering process.
- the same surface area of the cold forged ribbed and ribbed integrated structure (the so-called integral, is a rib or rib and heat spreader is a one-piece structure) radiator,
- the same power thermal test is performed at the same time, and the result is that the heat dissipation effect of the ribbed integrated heat sink is better.
- the analysis shows that: 1. The heat transfer area of the ribbed integrated heat sink rib and the heat conducting plate is large; 2.
- the ribbed integrated heat sink has better permeability than the ribbed integrated heat sink.
- each rib of the ribbed integrated heat sink is bent outwardly from the foot end to increase the average spacing between the ribs, and the average spacing is roughly doubled, and the height of the radiator is reduced. As the size increases, the measured heat dissipation is 25% higher than the previous state.
- the analysis shows that the heat dissipation performance of the radiator is related to the convective heat transfer coefficient of the rib or rib and the surrounding air.
- the heat dissipation rib or rib structure of the radiator is designed to be more transparent, and the air convection heat transfer coefficient The higher.
- the samples in the experiment are all made by pure aluminum cold forging process. The cold forging process is to use the plate material to punch into the round cake blank.
- each piece has four right angle materials to be wasted, and the blank material is then put into a cold forging press forging into Semi-finished radiators, using the machining process, and turning waste, the waste rate of light materials is up to 40%.
- you want to improve the heat dissipation performance of the cold-forged ribbed one-piece heat sink you must also increase the process of bending the ribs in a row, just like the experimental sample. This process is not easy to design the fixture and The mechanical operation is used to complete the one-step operation, so it takes a lot of time and labor to increase the cost.
- the present invention uses a metal wire instead of a rib for designing a cold forged ribbed integrated heat sink.
- the present invention is called a rib line type, and a plurality of ribbed rib ends are inserted into the mesh.
- the welding method is used to fix the connection, or the plurality of rib line legs are bundled with the hoop sleeve, and finally the turning faces are all neatly finished by turning or grinding.
- FIG. 1 is a three-dimensional schematic view of a wrap sleeve used in a heat sink of the present invention.
- FIG. 2 is a three-dimensional schematic view of a heat-conductive fixing plate used in the heat sink of the present invention.
- 3a 3b 4a 4b 5a 5b 6a 6b 7 8a 8b are respectively a three-dimensional view and a three-dimensional cut structure schematic view of three heat sinks of the present invention.
- e2 is the average spacing of adjacent ribs
- S1 is the ribbed rib end face area
- nSl is the total area of the ribbed fin rib foot end faces of the ribbed heat sink of the present invention
- S is a semiconductor electronic
- the heat transfer surface area of the device is derived
- h is the thickness of the heat-conducting fixed plate
- H is the height of the hoop sleeve.
- FIG. 1 2 shows a three-dimensional schematic view of a wrap sleeve 1 or a heat-conducting fixing plate 7 used in the ribbed heat sink of the present invention, both of which are made of a highly thermally conductive metal material, aluminum, or copper, or a copper-aluminum composite.
- the hoop sleeve 1 is formed by an extrusion process and then cut into a length by a cutting process.
- the heat-conducting fixing plate 7 is formed by a stamping process, and a plurality of holes are evenly arranged thereon, and the surface is nickel-plated.
- FIG. 3a 3b 4a 4b 5a 5b 6a 6b shows a ribbed heat sink comprising a plurality of ribs 8 and a heat conducting fixing plate 7, the ribs 3 of the plurality of ribs 8 being inserted into the heat conducting fixing plate 7
- the rib line 8 and the heat-conductive fixing plate 7 are nickel-plated, and are welded and fixed by a soldering process.
- the ribbed heat sink shown in FIG. 7 is composed of a plurality of ribs 8 and a ferrule sleeve 1 which is sleeved on the rib 3 end of the plurality of ribs 8 and is provided with a tightening jig.
- the package sleeve 1 is compressed and deformed (as shown in Fig. 7, the sleeve sleeve 1 cylindrical circumference shrinkage fixture embossing 6) process assembly, and finally, the assembled ribbed radiator is put on the fixture, using a lathe Or the grinding machine processes the bottom surface of the heat-conducting fixing plate 7 or the wrapping sleeve 1, that is, the fixed assembling end surface 4 of the rib 3 of the rib line 8, until the end faces of all the ribs 3 are neat and smooth with the bottom surface of the heat-conducting fixing plate 7 or the wrapping sleeve 1, As a ribbed radiator, the heat transfer surface 5 is contacted.
- the rib line 8 comprises a rib 2 and a rib 3, and the rib 8 is formed by a bending forming process, and the average gap e of the rib 2 of the adjacent rib 8 is larger than 2 and less than 30 rib 8
- the area S1 is larger than 2m n and less than 30m n , and the circular section wire is used.
- the total area nS1 of the ribbed end area 4 of the heat sink rib line 8 is 1 to 6 times the area S of the heat transfer surface of the semiconductor electronic component. Times.
- the ribbed heat sink shown in FIG. 3a and 3b, the rib 2 of the rib line 8 is annular, the ribs 3 are symmetrically parallel, the rib 2 and the rib 3 are vertically bent, and the rib 3 is inserted into the heat conduction.
- the inside of the hole of the fixing plate 7 is flush with the bottom surface, and the rib line 8 is divided into three layers to form a layered staggered structure.
- the ribbed heat sink shown in Fig. 4a and 4b, the rib 2 of the rib line 8 is serpentinely bent, The rib 2 and the rib 3 are vertically bent, and the rib line 8 is arranged in three layers.
- the rib 2 of the rib line 8 is linear, the rib 2 and the rib 3 are bent by more than 90 degrees, and the rib 2 of the plurality of ribs 8 is substantially
- the center of the heat-conducting fixing plate 7 is a spherical center, and is radially outwardly arranged in a radial direction of the ball. Such a structure can make the rib 2 of the rib line 8 have a large average gap e2, and increase the convection of the surface of the rib line 8 with air. Thermal coefficient.
- 6a, 6b shows a ribbed heat sink
- the rib line 8 is wound into a spring-like structure by a wrap spring process
- the axis 2 of the rib 2 is parallel to the rib 3
- the plurality of ribs 8 are wound around the central axis of the heat-conductive fixing plate 7
- the column arrangement greatly increases the length of the rib line 8, and also reduces the overall size of the heat sink.
- the ribbed heat sink shown in Fig. 7 the rib 2 of the rib line 8 has a linear structure, and is bent perpendicularly to the rib 3, and the plurality of ribs 3 are abutted together, and the sleeve 1 is tightened.
- the ribs 2 are arranged in a layered staggered structure.
- the ribbed heat sink shown in Figures 8a and 8b is a cup-shaped structure which is formed by a plurality of rib lines, is tightened by a wrap sleeve, and is formed by a press forming process.
- the manufacturing process is as follows: tightening the rib line, surface plating Nickel, solder joint caulking, turning heat transfer surface, rib body punching, ribs horizontally spread, reverse cup molding.
- the present invention provides a ribbed heat sink comprising one or more ribs 8, and a fixing device, which may be a heat-conducting fixing plate 7 or a wrap sleeve 1, Of course, it can also be other fixing devices.
- Each of said ribs 8 includes a rib 2 and one or two ribs 3, and the ribs 3 extend over the ribs 3.
- the ribs 3 are positioned on the fixture to assemble the ribbed heat sink of the invention.
- the rib line 8 is made of a heat conductive material so as to have a heat dissipating function, and its cross section may be various shapes, preferably circular.
- each of the ribs 8 itself may be formed in various shapes, and the plurality of ribs 8 may be spatially arranged in various forms to increase the heat transfer area and improve heat transfer efficiency.
- the fixing device is a heat-conducting fixing plate 7 having a plurality of positioning holes, and the cross-section of the heat-conducting fixing plate 7 may be various shapes such as a triangle, a square, and a circle. Or other polygons, etc.
- Each of the ribs 8 includes a rib 2 and two ribs 3 extending between the ribs 3. That is, in this embodiment of the invention, the body portions of the respective ribs 8 form the ribs 2, and the both ends can form the ribs 3, and the ribs 2 and the ribs 3 can be made of the same material.
- the ribs 3 of the respective ribs 8 are inserted into the positioning holes of the heat-conducting fixing plate 7, respectively. It is worth mentioning that the two ribs 3 of each rib 8 can be inserted into the same positioning hole of the heat-conducting fixing plate 7, or may be in two adjacent positioning holes, or two positioning holes having a predetermined distance. In this embodiment of the invention, the two ribs 3 can be inserted into the same locating hole, and the ribs 3 are arranged adjacent to each other side by side, and the rib 2 extends axially to the ribs. It can also be said that the ribs 2 are bent from the ribs so as not to be in the same plane as the ribs 3.
- the ribs 3 of the respective ribs 8 are substantially annular, and the rings may be circular, triangular, elliptical, or other polygonal.
- the annular rib 3 may form a predetermined angle with the ribs, for example, may be a right angle, or other angles.
- all of the plurality of ribs 8 can be divided into groups, the same set of ribs 8 having ribs 3 of substantially the same length, and the lengths of the ribs 3 between the different sets of ribs 8 are different, Thereby a multilayer structure is formed. Specifically, in this embodiment of the invention, all of these ribs 8 can form a three-layer structure.
- the ribs 8 are divided into three groups, and the lengths of the ribs of the three sets of ribs 8 are different, so that the annular ribs 2 of the three sets of ribs 8 and the heat-conductive fixing plate 7 have three different distances, thereby forming A three-layer structure of ribs, each layer having a plurality of annular ribs 2.
- the ribs 2 of each layer may have different sizes, for example, the ribs 2 located on the respective ribs 8 of the first layer close to the heat-conducting fixing plate 7 may have a larger size, that is, Each of the ribs 2 can form a larger ring shape.
- the respective ribs 2 located in the second layer and the third layer structure away from the heat-conductive fixing plate 7 may have a ring shape of a gradually decreasing size. It can also be said that the length of each of the ribs 2 of each layer can be varied.
- the fixing device is a heat-conducting fixing plate 7 having a plurality of positioning holes.
- Each rib 8 comprises a rib 2 and a rib 3 which extends over the rib 3.
- the body portions of the respective ribs 8 form the ribs 2, wherein one end portion can form the ribs 3, and the rib legs 3 are inserted into the positioning holes of the heat-conducting fixing plate 7.
- the ribs 2 of the respective ribs 8 extend axially to the ribs 3, that is, the ribs 2 and the plane of the ribs 3 form an angle of a predetermined size, which may be At right angles, the ribs 2 of the respective ribs 8 are bent perpendicularly from the ribs 3.
- the ribs 2 of the respective ribs 8 can be bent into various curved shapes such as a continuous Z-shape, an S-shape, a W-shaped extension, or a serpentine extension.
- all of the ribs 8 in this embodiment can also form a multi-layer structure, such as a three-layer structure, in which the layers of the three-layer structure are different from the heat-conducting fixing plate 7, each layer structure
- Each of the ribs 8 may have ribs 3 of substantially the same length. It is to be noted that in the above three-layer structure, the position where the rib 3 of each layer of the rib line 8 is fixed to the heat-conductive fixing plate 7 can also be appropriately and appropriately distributed.
- the ribs 3 of the first layer of ribs 8 are fixed in the positioning holes of the outermost layer of the heat-conducting fixing plate 7, that is, near the edges of the heat-conducting fixing plate 7, and the ribs 3 of the third layer of ribs 8 are fixed to
- the locating holes of the innermost layer of the heat-conducting fixing plate 7 are disposed near the center of the heat-conducting fixing plate 7; the ribs 3 of the second rib line in the middle are fixed in the positioning holes of the intermediate layer of the heat-conductive fixing plate 7.
- the ribs 3 of the first layer of ribs 8 may have a minimum length, that is, the ribs 2 are closest to the heat-conducting fixing plate 7, and the ribs 3 of the third layer of ribs 8 may have the largest length, that is, the ribs thereof. 3 is farthest from the heat conducting fixing plate 7.
- the fixing device is a heat-conductive fixing plate 7, which has a plurality of positioning holes.
- Each of the ribs 8 includes a rib 2 and a rib 3 which integrally and axially extend from the rib 3.
- the ribs 2 are arranged in a straight line.
- the rib 2 is disposed at a predetermined angle with the rib 3, and in this embodiment of the invention, the predetermined angle may be an obtuse angle.
- the ribs 2 of all of these ribs 8 are radially disposed from the center of the conductive plate fixing plate 7, so that adjacent ribs can have a larger pitch to facilitate heat dissipation.
- the rib 2 and the rib 3 of each rib 8 may both form an obtuse angle, and for all of these ribs 8, from the inside to the outside, the rib 2 of each rib 8 The obtuse angle formed with the ribs 3 is gradually reduced.
- the fixing device is a heat-conductive fixing plate 7, which has a plurality of positioning holes.
- Each of the ribs 8 includes a rib 2 and a rib 3 which integrally and axially extend from the rib 3.
- the ribs 2 of the respective ribs 8 extend in a spiral shape or form a spring-like shape.
- the axis of each of the ribs 2 and the ribs 3 can be arranged parallel to each other.
- the plurality of positioning holes of the heat-conducting fixing plate 7 can form a plurality of sets of positioning holes, and each set of positioning holes is arranged annularly around the center of the heat-conductive fixing plate 7, so that the plurality of sets of positioning holes Forming a plurality of sets of annular positioning holes, each set of positioning holes for fixing the ribs 3 of the plurality of ribs 8, so that the ribs 2 of all of the ribs 8 of the ribbed heat sink of the present invention are thermally conductive
- the central axis of the fixing plate 7 is arranged in a ring shape.
- the fixing device is a wrap sleeve 1, and similarly, each rib line 8 includes a rib 2 and a rib 3, and the rib 2 is integrally and axially Extending to the ribs 3 to the ground. All of these ribs 8 can form various shapes in the above embodiments.
- the ends of the ribs 3 of the respective ribs 8 are completely received in the sleeve of the wrap sleeve 1 and are placed in close proximity, and then the wrap sleeve 1 is tightened, thereby All of these ribs 3 are fixed sexually.
- the ribs 2 of the respective ribs 8 may be disposed at right angles to the ribs 3, and may also be formed in a multilayer structure similar to the above embodiment.
- the fixing device is a wrap sleeve 1, each rib line 8 comprising a rib 2 and a rib 3, the rib 2 being integrally and axially The ground extends to the rib foot 3.
- the ribs 2 of the respective ribs 8 are oriented toward the surrounding ferrule 2 The direction of the sleeve 1 is bent and the ribs 2 of all of these ribs 8 are then radially arranged around the center of the ferrule 1.
- the rib 2 and the rib 3 of each rib 8 are not all The portion is located on the same side of the wrap sleeve 1, but a portion of the rib 2 is bent and extends toward the other side of the wrap cover 1. Its final shape resembles the canopy shape of Figure 8a, or the cup shape of Figure 8b. That is, the band cover 1 is wrapped inside by the rib line 8.
- the following method may be employed, that is, the rib 2 of the rib line 8 is punched out by a large angle by a conical die, and then the rib 2 of the rib line 8 is continuously pressed and flattened by a flat die, and finally formed by molding.
- the mold reversely presses the rib 2 of the rib line 8 into a cup shape.
- the wrap sleeve 1 or the heat-conducting fixing plate 7 is located at the bottom and is disposed outwardly, and the rib 2 and the rib 3 are located on the same side of the wrap sleeve 1 or the heat-conducting fixing plate 7. .
- each The ribs 2 of the ribs 8 are bent at an acute angle to the corresponding ribs 3, and then the ribs 2 of all of the ribs 8 are radially disposed around the center of the ferrule 1. That is, the ribs 2 of the respective ribs 8 are bent toward the corresponding ribs 3 and then extend in opposite directions. It is worth mentioning that this structure is also suitable for replacing the wrap cover 1 with the heat-conducting fixing plate 7.
- the ribbed radiator proposed by the invention has extremely light weight, flexible design of the rib line shape, ever-changing structure of the radiator, good permeability, high air convection heat transfer coefficient and simple production process.
- the use of low-cost materials, basically no loss of waste, high material utilization, is of great significance in the field of semiconductor electronic device cooling, especially the semiconductor solid-state lighting technology that promotes and popularizes the high cost of heat dissipation.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种肋线式散热器及制造方法，肋线式散热器包括有肋线（8）和导热固定板（7）或包箍套（1），采用数多肋线（8）的肋脚（3）端插入导热固定板（7）上的孔内，采用焊接方法焊接连接；或采用将数多肋线（8）的肋脚（3）端靠紧成一捆，外套上包箍套（1），再采用缩紧制具工艺，将包箍套（1）缩紧，最后采用车削加工散热器传热接触面（5），至所有肋脚端面（4）与导热固定板（7）底面或包箍套（1）底端面整齐光洁。
Description
一种肋线式散热器及制造方法 技术领域
[0001 ] 本发明属于半导体电子器件散热技术领域， 特别涉及一种肋线式散热器及其制造 方法。 技术背景
[0002] 众所周知， 现今半导体电子技术飞速发展， 尺寸小， 工作频率或功率却在不断增 大， 大的温升陡趋明显， 为了使其更好、 更稳定、 长寿命的工作运行， 设计配置科学合理的 散热设备至关重要， 例如计算机 CPU芯片、 显卡芯片等， 特别是现今发展如火如荼的半导体 固态照明灯具芯片， 散热犹为显著， 其 80%以上的电能转化为热量， 温度每升高 2°C， 其寿命 减少 10%，解决其散热迫在眉捷。
[0003] 传热和散热技术发展了近百年， 业内人士还是一辈辈继承着祖辈的基业， 采用传 统的设计结构和制造方法， 虽然能够勉强解决散热问题， 但是， 散热器产品沉重， 生产工艺 多， 必然导致材料浪费多和不菲的价格， 这与当今大力推崇和倡导的节能环保型和节约型工 业发展思路是相悖的， 轻重量、 低成本、 高性能的散热设备将是时代需求的宠物。 发明内容
[0004] 本发明的目的就是针对上述问题， 提出一种最佳的结构和廉价的制造方法。
[0005] 本发明的技术方案是： 肋线式散热器包括有肋线（8 )和导热固定板（7)，肋线（8 ) 包括肋脚 （3 ) 和肋身 （2)， 肋线 （8 ) 采用冲压折弯成型工艺制成各种形状， 或采用绕簧工 艺绕制成弹簧形状， 导热固定板（7 )采用冲压工艺， 或采用挤出加裁切工艺制成的网孔板结 构，
将成型好的肋线和导热固定板表面化学镀镍处理；
将多个肋线 （8 ) 的肋脚 （3 ) 端插入导热固定板 （7 ) 上的孔内；
采用锡焊方法焊接固定连接；
采用车削加工散热器传热接触面 （5)， 至所有肋脚端面 （4) 与导热固定板 （7 ) 底面整 齐光洁。
肋线式散热器包括有肋线 （8 )和包箍套 （1 )， 中心肋线 （9)长度等于包箍套 （1 ) 的高 度， 肋线（8 )包括肋脚（3 )和肋身 （2)， 肋线（8)采用线材拉直剪断工艺制成， 包箍套（1 ) 采用挤出加裁切工艺制成， 或采用金属薄管裁切而成，
将多个肋线 （8 ) 的肋脚 （3 ) 段靠紧成一捆， 外套上包箍套 （1 )， 采用模具縮紧工艺， 将包箍套 （1 ) 縮紧；
将縮紧结构的半成品散热器表面化学镀镍处理；
采用锡焊工艺填充包箍套 （1 ) 的紧箍肋脚端面的缝隙；
采用车削加工散热器传热接触面 （5)， 至所有肋脚端面 （4) 与包箍套 （1 ) 底端面整齐 光洁；
采用圆锥冲模将肋线的肋身冲压散开一个大角度；
采用平板模将肋线的肋身冲压踏平；
采用成型模具将肋线的肋身反向冲压成杯型。
[0006] 更具体地， 本发明提供一种肋线式散热器， 其包括一固定装置以及一个或多个肋 线， 各个所述肋线包括一个肋身以及至少一个肋脚， 所述肋身延伸于所述肋脚， 各个所述肋 线的所述肋脚固定于所述固定装置， 所有所述肋线的所述肋身被布置成预定的样式， 以用于 散热。
进一步地， 所述固定装置选自导热固定板和包箍套中的一种， 所述导热固定板设置有定 位孔， 以用于固定对应的所述肋线的所述肋脚， 所述包箍套适用于包箍所述肋线的所述肋脚。
进一步地， 相邻所述肋脚的平均间隙小于 15mm， 相邻所述肋线的所述肋身的平均间隙大 于 2mm、 小于 30mm， 各个所述肋线的截面积大于 2m ltf、 小于 30m ltf， 所述肋线式散热器的多 个所述肋线的肋脚端面积的总面积， 是半导体电子元器件的导出传热面面积的 1倍到 6倍。
进一步地， 多个所述肋线的所述肋身在一个平面上呈圆半径向外辐射状， 在纵面上呈层 叠式， 层层间呈错列式结构设置； 或多个所述肋身呈球形半径向外辐射式结构设置； 或多个 所述肋身平行地与对应的所述肋脚竖直结构设置； 或将所述肋线的所述肋身部分散开后， 反 向成型成杯形结构。
进一步地， 所有所述肋线的所述肋身的所述预定的样式选自以下几种结构中的至少一种 或几种的组合：
各个所述肋线包括一所述肋身以及两所述肋脚， 所述肋身延伸于两所述肋脚之间从而形 成环状肋身， 所述环状肋身与所述肋脚之间形成一预定角度， 各个所述肋线的两所述肋脚插 入对应的所述导热固定板的定位孔中；
多个所述肋线的所述肋身形成一层或多层结构， 各层肋身之间具有预定的间隔； 所述肋身轴向地延伸于所述肋脚， 并且所述肋身与所述肋脚所在的平面之间形成一预定 大小的角度， 所述各个肋线的所述肋身弯折成曲线形状， 所述曲线形状选自连续的 Z 形、 S 形、 W形延伸、 和蛇形延伸形状中的一种；
各个所述肋身呈直线形地设置， 所有所述肋线的所述肋身从所述固定装置的中心呈辐射 状地设置；
各个所述肋身呈螺旋状地设置， 并且各个所述肋身的轴线与对应的所述肋脚互相平行地 设置；
所述导热固定板的多个所述定位孔形成多环定位孔， 每一环所述定位孔用于固定部分所 述肋线的所述肋脚， 从而所有所述肋线的所述肋身绕着所述导热固定板的中心轴线呈环形地 设置； 和
多个所述肋线的所述肋脚固定于所述固定装置， 并且多个所述肋线的所述肋身围绕着所 述固定装置以使所述固定装置设置在所述肋身内部， 并且所述肋身以所述固定装置为中心呈 辐射状地设置。
进一步地， 各个所述肋线所在的平面， 与对应的所述肋身所在的平面形成一夹角， 所述 夹角选自锐角、 直角、 钝角中的一种。
进一步地，所述导热固定板采用铝、或铜、或铜铝复合材料，其厚度大于 2mm、小于 20mm; 所述包箍套采用铝、 或铜、 或铜铝复合材料， 其高度大于 2mm、 小于 20m， 其中多个所述肋线 的中心肋线的长度等于所述包箍套的高度。
所述肋线采用铝质、 或铜质、 或铜铝复合材料制成的线材的各种形状截面的线材， 其最 佳截面为圆形和星形。
相应地， 本发明提供一种肋线式散热器的制造方法， 其包括如下步骤：
( a) 提供一固定装置；
(b ) 将多个肋线的肋脚固定于所述固定装置；
( c ) 使多个所述肋线的肋身形成预定的样式； 以及
( d) 采用车削加工所述肋线式散热器的传热接触面。
进一步地， 在步骤 (a)中， 所述固定装置是导热固定板或包箍套， 所述导热固定板上成形 有定位孔， 并且所述导热固定板采用冲压工艺， 或采用挤出加裁切工艺制成的网孔板结构； 所述包箍套采用挤出加裁切工艺制成， 或采用金属薄管裁切而成。
进一步地，， 在步骤 （b ) 中， 可以选自如下的方法：
(b. 1 )将所述肋线与所述导热固定板表面化学镀镍处理， 将各个所述肋线的所述肋脚插 入所述导热固定板的定位孔中， 然后采用锡焊方法焊接固定； 或者
(b. 2 )将多个所述肋线的所述肋脚靠紧成一捆，外套上所述包箍套，采用模具縮紧工艺， 将所述包箍套縮紧， 然后表面化学镀镍处理， 再通过锡焊工艺填充所述包箍套的紧箍肋脚端 面的缝隙。
进一步地，， 所述步骤 （c ) 中包括步骤：
(c. 1)采用圆锥冲模将所述肋线的所述肋身冲压散开一个预定角度；
(c. 2)采用平板模将所述肋线的所述肋身冲压踏平； 以及
(c. 3)采用成型模具将所述肋线的所述肋身反向冲压成杯型。
[0007 ] 本发明肋线式散热器的肋线， 采用铝质、 或铜质、 或铜铝复合材料的各种形状截 面的线材， 其截面积 S1大于 2m ltf，小于 30m ltf， 为了保证肋线的肋脚与半导体元器件的导出 传热面有足够的接触传热面积， 肋脚的截面最好采用圆形和星形， 肋脚的平均间隙 el 小于 15mm, 多个肋脚端面的总截面积 n Sl， 是半导体元器件的导出传热面积 S的 1到 6倍， 为了 使多个肋线肋脚的端面都能直接或最近与小尺寸的半导体元器件的导出传热面接触传热， 肋 脚间尽量靠近设置。 肋线采用冲压工艺或绕簧工艺制成很多形状， 增加了肋线长度， 即增加 了散热面积， 多个肋线的肋身， 在一个平面上呈圆半径向外辐射状， 在纵面上呈层叠式， 层 层间呈错列式结构设置； 或多个肋身呈球形半径向外辐射式结构设置； 或多个肋身平行与肋 脚竖直结构设置； 或将肋线的肋身部分散开后， 反向成型成杯形结构。 总之， 结构造形千变 万化。相邻肋身间的平均间隙 e2大于 2mm， 小于 30mm， 使本发明肋线式散热器的散热肋线肋 身部分更加通透， 提高了肋身与空气的对流换热系数， 大大地提高了散热性能。 本发明肋线 式散热器的导热固定板， 采用铝、 或铜、 或铜铝复合板材， 其厚度大于 2mm，小于 20mm; 包箍 套采用铝、 或铜、 或铜铝复合材料， 其高度大于 2mm， 小于 20mm。 肋脚与导热固定板焊接方 法， 可以是表面都采用镀镍工艺处理， 再采用锡焊工艺焊接。
[0008] 采用同样重量的纯铝， 制成的同等表面积的冷锻肋柱式和肋片式一体结构 （所称 一体， 是肋柱或肋片与导热板为一体成型结构） 的散热器， 在同一个有限测试环境， 同时做 同功率热工测试， 结果是肋柱式一体结构散热器散热效果较好。 分析得出： 一、 肋柱式一体 结构散热器的肋柱与导热板的交接传热面积较大； 二、 肋柱式一体结构散热器较肋片式一体 结构散热器通透性更好。又将肋柱式一体结构散热器的每根肋柱的靠近脚端向外一层层折弯， 增加肋柱间的平均间距， 平均间距大致增大 2倍， 散热器高度尺寸减小， 横向尺寸增大了， 测得散热效果较之前状态提高了 25%。 分析得出， 散热器的散热性能， 与肋柱或肋片与周围 空气的对流换热系数有关， 散热器的散热肋柱或肋片结构设计得越通透， 空气对流换热系数
越高。 实验所述样品都是采用纯铝冷锻工艺制成， 冷锻工艺是先用板材料冲成圆饼毛坯料， 每一件就有四直角料浪费， 毛坯料再放入冷锻压机锻压成半成品散热器， 再采用车加工工序， 又有车削浪费， 就光材料浪费率就达 40%。如果为了提高冷锻肋柱式一体结构散热器 25%的散 热性能， 则还必须像做实验样件一样， 增加将肋柱一排排折弯的工序， 这道工序又不容易设 计治具和采用机械操作来一步操作完成， 所以费工费时， 增加的费用不菲。 综上所述， 本发 明采用金属线材来替代设计冷锻肋柱式一体结构散热器的肋柱， 所以本发明中称为肋线式， 采用将多个肋线肋脚端插入设置在网孔板结构的导热固定板孔内， 再采用焊接方法来固定连 接、或用包箍套来捆绑多个肋线肋脚段， 最后采用车削或磨削加工使全部肋脚端面整齐光洁。 附图说明
[0009] 下面结合附图和具体实施方案对本发明作进一步说明。
[0010] 图 1为本发明散热器所采用包箍套的三维示意图。
[001 1 ] 图 2为本发明散热器所采用导热固定板的三维示意图。
[0012] 图 3a 3b 4a 4b 5a 5b 6a 6b 7 8a 8b、 分别为三种本发明散热器的 三维视图和三维剖切结构示意图。
[0013] 图中， 1、 包箍套， 2、 肋身， 3、 肋脚， 4、 肋脚端面， 5、 散热器传热接触面， 6 收縮治具压印， 7、 导热固定板， 8、 肋线， 9、 中心肋线。
[0014] 图中， e2为相邻肋身的平均间距， S1为肋线肋脚端面面积， 则 nSl为本发明肋线 散热器 n只肋线肋脚端面的总面积， 设 S为半导体电子器件的导出传热面面积， h为导热固 定板的厚度， H为包箍套的高度。 具体实施方案
[0015] 图 1 2分别示出本发明肋线式散热器所采用的包箍套 1或者采用的导热固定板 7 的三维示意图， 都采用高导热金属材料铝、 或铜、 或铜铝复合材料， 包箍套 1采用挤出工艺 成型， 再采用裁切加工成一段段而成， 导热固定板 7采用冲压工艺制成， 其上均匀布置了多 个孔， 表面镀镍处理。
[0016] 图 3a 3b 4a 4b 5a 5b 6a 6b所示肋线式散热器， 包括多个肋线 8和一件 导热固定板 7组成， 多个肋线 8的肋脚 3插入导热固定板 7上， 肋线 8和导热固定板 7表面 镀镍处理， 采用锡焊工艺焊接固定连接。 图 7所示肋线式散热器， 包括多个肋线 8和一件包 箍套 1组成， 采用在多个肋线 8的肋脚 3端套上包箍套 1， 采用縮紧治具， 将包箍套 1压縮 变形 （见图 7所示， 包箍套 1柱面周圈收縮治具压印 6 ) 工艺组装， 最后， 将组装好的肋线 式散热器套上夹具， 采用车床或磨床加工导热固定板 7或包箍套 1的底面， 即肋线 8的肋脚 3的固定组装端面 4， 至所有肋脚 3端面与导热固定板 7或包箍套 1的底面整齐光洁， 做为肋 线式散热器接触传热面 5。 图中示出， 肋线 8包括肋身 2和肋脚 3， 肋线 8采用折弯成型工艺 制成， 相邻肋线 8的肋身 2的平均间隙 e大于 2 小于 30 肋线 8的截面积 S1大于 2m n ，小于 30m n ， 采用圆形截面线材， 散热器多个肋线 8肋脚端面积 4的总面积 nSl， 是半导 体电子元器件的导出传热面面积 S的 1倍到 6倍。
[0017] 图 3a 3b所示肋线式散热器， 肋线 8的肋身 2呈环形， 两肋脚 3对称平行， 肋身 2与肋脚 3呈垂直折弯结构， 两肋脚 3插入导热固定板 7的孔内至与底面平齐， 肋线 8分成 三层设置，形成层层错列式结构。 图 4a 4b所示肋线式散热器，肋线 8的肋身 2呈蛇形折弯，
肋身 2与肋脚 3呈垂直折弯结构， 肋线 8分三层设置。 图 5a、 5b所示肋线式散热器， 肋线 8 的肋身 2呈直线状， 肋身 2与肋脚 3呈大于 90度折弯结构， 多个肋线 8的肋身 2， 大致以导 热固定板 7的中心为球心， 以球半径方向向外呈辐射状结构设置， 这样的结构可以使肋线 8 的肋身 2平均间隙 e2很大， 增加肋线 8表面与空气的对流换热系数。 图 6a、 6b所示肋线式 散热器， 肋线 8采用绕簧工艺绕制成弹簧状结构， 肋身 2轴线与肋脚 3平行， 多个肋线 8绕 导热固定板 7中轴线环绕正列设置， 这样的结构， 大大地增加了肋线 8的长度， 也縮小了散 热器的整体外观尺寸。 图 7所示肋线式散热器， 肋线 8的肋身 2呈直线状结构， 与肋脚 3成 垂直折弯结构， 多个肋脚 3段紧靠在一起， 采用包箍套 1縮紧组装， 肋身 2采用层层错列结 构设置。 图 8a、 8b所示肋线式散热器， 由多个肋线， 采用一包箍套縮紧， 再采用冲压成型工 艺制成的杯型结构， 其制造工艺为： 縮紧肋线、 表面镀镍、 锡焊填缝、 车削传热面、 肋身冲 压散开、 肋身水平散开、 反向杯型成型。
[0018] 更具体地， 本发明提供了一种肋线式散热器， 其包括一个或多个肋线 8， 以及一 固定装置， 所述固定装置可以是导热固定板 7或者包箍套 1， 当然也可以是其他的固定装置。 各个所述肋线 8包括一肋身 2以及一个或两个肋脚 3， 肋身 3—体延伸于肋脚 3。肋脚 3定位 于所述固定装置， 从而组装成本发明的所述肋线散热器。 肋线 8由导热材料制成， 从而具备 有散热功能， 其截面可以是各种形状， 优选圆形。 在本发明中， 各个肋线 8本身可以形成各 种形状， 并且多个肋线 8在空间上也可以布置呈各种形态， 从而增大传热面积， 提高传热效 率。
[0019] 具体地， 如图 3a以及 3b所示， 所述固定装置是导热固定板 7， 其具有多个定位 孔， 导热固定板 7的截面可以是各种形状， 如三角形， 方形， 圆形或其他多边形等。 各个肋 线 8包括一肋身 2以及两肋脚 3， 肋身 2延伸于两肋脚 3之间。 也就是说， 在本发明的这个 实施例中， 各个肋线 8主体部分形成肋身 2， 两端部可以形成两肋脚 3， 肋身 2和肋脚 3可以 由同样的材料制成。 各个肋线 8的两肋脚 3分别插入导热固定板 7的定位孔中。 值得一提的 是， 各个肋线 8的两肋脚 3可以插入导热固定板 7的同一定位孔中， 也可以是相邻的两定位 孔中， 或者是具有预定距离的两定位孔中。 在本发明的这个实施例中， 两肋脚 3可以插入同 一定位孔中， 并且两肋脚 3并排互相邻近地设置， 而肋身 2轴向地延伸于两肋脚。 也可以说， 肋身 2弯折地从两肋脚延伸， 从而与两肋脚 3不在同一平面。 各个肋线 8的肋身 3实质上形 成环形， 所述环形可以是圆环形， 三角形环形， 椭圆形环形， 或其他多边形环形。 环形肋身 3可以与肋脚形成一预定角度， 例如可以是直角， 或者是其他角度。
[0020] 值得一提的是， 所有多个肋线 8可以分成多组， 同一组肋线 8具有大致相同长度的 肋脚 3， 而不同组肋线 8之间的肋脚 3的长度不同， 从而形成多层结构。 具体地， 在本发明 的这个实施例中， 所有这些肋线 8可以形成三层结构。 也就是说， 这些肋线 8分成三组， 这 三组肋线 8的肋脚长度不同， 这样使三组肋线 8的环形肋身 2与导热固定板 7具有三种不同 的距离， 从而形成肋身的三层结构， 每一层具有多个环形肋身 2。 值得一提的是， 每一层的 肋身 2可以具有不同的尺寸， 例如位于靠近导热固定板 7的第一层的各个肋线 8的肋身 2可 以具有较大的尺寸， 也就是说， 各个肋身 2可以形成较大的环形。 而位于远离导热固定板 7 的第二层以及第三层结构的各个肋身 2可以具有逐渐减小的尺寸的环形。 也可以说， 每一层 的各个肋身 2的长度可以是变化的。
[0021 ] 如图 4a以及图 4b所示， 类似地， 所述固定装置是导热固定板 7， 其具有多个定 位孔。 各个肋线 8包括一个肋身 2以及一个肋脚 3， 肋身 2延伸于肋脚 3。 也就是说， 在本发
明的这个实施例中， 各个肋线 8主体部分形成肋身 2， 其中一端部可以形成肋脚 3， 肋脚 3插 入导热固定板 7的定位孔中。 在这个实施例中， 各个肋线 8的肋身 2轴向地延伸于肋脚 3， 也就是说， 肋身 2与肋脚 3所在的平面之间形成一预定大小的角度， 这个角度可以是直角， 从而各个肋线 8的肋身 2垂直地从肋脚 3弯折。 各个肋线 8的肋身 2可以弯折成各种曲线形 状， 如连续的 Z形， S形， W形延伸， 或蛇形延伸等。
[0022] 值得一提的是， 这个实施例中的所有这些肋线 8也可以形成多层结构， 例如三层 结构， 三层结构中各层与导热固定板 7的距离不同， 每一层结构中的各个肋线 8可以具有大 致相同长度的肋脚 3。 值得一提的， 在上述三层结构中， 每一层肋线 8的肋脚 3固定于导热 固定板 7的位置也可以适当合理地分配。 例如第一层肋线 8的肋脚 3固定于导热固定板 7的 最外层的定位孔中， 也就是靠近导热固定板 7的边缘处设置； 第三层肋线 8的肋脚 3固定于 导热固定板 7的最内层的定位孔中， 也就是靠近导热固定板 7的中心处设置； 中间的第二层 肋线的肋脚 3固定于导热固定板 7的中间层的定位孔中。 第一层肋线 8的肋脚 3可以具有最 小的长度， 也就是其肋身 2离导热固定板 7最近， 第三层肋线 8的肋脚 3可以具有最大的长 度， 也就是其肋身 3离导热固定板 7最远。
[0023] 如图 5a至图 5b所示， 类似地， 所述固定装置是导热固定板 7， 其具有多个定位 孔。各个肋线 8包括一个肋身 2以及一个肋脚 3， 肋身 2一体地并且轴向地延伸于肋脚 3。在 这个实施例中， 肋身 2呈直线形地设置。 另外， 肋身 2与肋脚 3呈一预定角度地设置， 在本 发明的这个实施例中， 所述预定角度可以是钝角。 并且， 所有这些肋线 8的肋身 2从导电板 固定板 7的中心呈辐射状地设置， 从而相邻的各个肋身可以具有更大的间距， 以利于散热。 具体地， 在这个实施例中， 作为一个例子， 各个肋线 8的肋身 2与肋脚 3可以都形成钝角， 并且对于所有这些肋线 8， 从内向外地， 各个肋线 8的肋身 2与肋脚 3形成的钝角逐渐减小。
[0024] 如图 6a至图 6b所示， 类似地， 所述固定装置是导热固定板 7， 其具有多个定位孔。 各个肋线 8包括一个肋身 2以及一个肋脚 3， 肋身 2一体地并且轴向地延伸于肋脚 3。在这个 实施例中， 各个肋线 8的肋身 2呈螺旋状地延伸， 或形成类似弹簧的形状。 并且各个肋身 2 的轴线与肋脚 3可以互相平行地设置。 值得一提的是， 在这个实施例中， 导热固定板 7的多 个定位孔可以形成多组定位孔， 每组定位孔绕着导热固定板 7的中心呈环形地布置， 从而多 组定位孔形成多组环形的定位孔， 每一组定位孔用于固定多个肋线 8的肋脚 3， 从而本发明 的这个肋线式散热装置的所有这些肋线 8的这些肋身 2绕着导热固定板 7的中心轴线呈环形 地设置。
[0025] 如图 7所示， 在这个实施例中， 所述固定装置是包箍套 1， 类似地， 各个肋线 8包 括一个肋身 2以及一个肋脚 3， 肋身 2一体地并且轴向地延伸于肋脚 3。所有这些肋线 8可以 形成上述实施例中的各种形状。 在本发明的这个实施例中， 各个肋线 8的肋脚 3的端部完全 容纳在包箍套 1的套腔中， 并且紧密地靠近地设置， 然后包箍套 1被縮紧， 从而一次性地固 定所有这些肋脚 3。 在这个实施例中， 各个肋线 8的肋身 2可以与肋脚 3呈直角地设置， 并 且也可以类似上述实施例中形成多层结构。
[0026] 如图 8a以及 8b所示， 在这个实施例中， 所述固定装置是包箍套 1， 各个肋线 8包 括一个肋身 2以及一个肋脚 3， 肋身 2一体地并且轴向地延伸于肋脚 3。在这个实施例中， 在 所有肋线 8的肋脚 3定位于包箍套 1中将包箍套 1縮紧， 以固定这些肋脚 3之后，各个肋线 8 的肋身 2朝向包围包箍套 1的方向弯折，然后使所有这些肋线 8的肋身 2可以绕着包箍套 1的 中心呈辐射状地设置。 也就是说， 在这个实施例中， 各个肋线 8的肋身 2以及肋脚 3不是全
部位于包箍套 1的同一侧， 而是有部分肋身 2弯折后延伸朝向包箍套 1的另一侧。 其最后的 形状类似图 8a的伞面形， 或图 8b的杯形。 也就是说， 包箍套 1被肋线 8包在内部。 在制作 工艺中， 可以采用如下的方法， 即采用圆锥冲模将肋线 8的肋身 2冲压散开一个大角度， 然 后采用平板模将肋线 8的肋身 2继续冲压踏平， 最后采用成型模具将肋线 8的肋身 2反向冲 压成杯型。 而在前述的实施例中， 包箍套 1或导热固定板 7是位于底部， 并且向外穿出地设 置， 肋身 2和肋脚 3都位于包箍套 1或导热固定板 7的同一侧。 另外， 根据图 8a以及图 8b 示出的实施例的一种变形， 在所有肋线 8的肋脚 3定位于包箍套 1中将包箍套 1縮紧以固定 这些肋脚 3之后，各个肋线 8的肋身 2以与对应的肋脚 3呈锐角角度弯折，然后使所有这些肋 线 8的肋身 2可以绕着包箍套 1的中心呈辐射状地设置。 也就是说， 各个肋线 8的肋身 2朝 向对应的肋脚 3弯折， 然后朝着相反的方向延伸。 值得一提的是， 这个结构也适用于以导热 固定板 7替换包箍套 1。
[0027 ] 综上所述， 本发明提出的肋线式散热器， 重量极轻， 肋线形状设计灵活， 散热器 结构千变万化， 通透性好， 空气对流换热系数非常高， 生产工艺简单， 采用材料价格低廉， 基本没损耗浪费， 材料利用率高， 应用于半导体电子器件散热领域意义重大， 特别是推动与 普及现高额散热成本的半导体固态照明技术， 意义空前。
Claims
1、 一种肋线式散热器， 其特征在于， 包括一固定装置以及一个或多个肋线， 各个所述肋 线包括一个肋身以及至少一个肋脚， 所述肋身延伸于所述肋脚， 各个所述肋线的所述肋脚固 定于所述固定装置， 所有所述肋线的所述肋身被布置成预定的样式， 以用于散热。
2、根据权利要求 1所述的肋线式散热器， 其特征在于， 所述固定装置选自导热固定板和 包箍套中的一种， 所述导热固定板设置有定位孔， 以用于固定对应的所述肋线的所述肋脚， 所述包箍套适用于包箍所述肋线的所述肋脚。
3、 根据权利要求 2 所述的肋线式散热器， 其特征在于， 相邻所述肋脚的平均间隙小于 15mm, 相邻所述肋线的所述肋身的平均间隙大于 2 小于 30mm， 各个所述肋线的截面积大 于 2m ltf、 小于 30m ltf， 所述肋线式散热器的多个所述肋线的肋脚端面积的总面积， 是半导体 电子元器件的导出传热面面积的 1倍到 6倍。
4、根据权利要求 1至 3中任一所述的肋线式散热器， 其特征在于， 多个所述肋线的所述 肋身在一个平面上呈圆半径向外辐射状， 在纵面上呈层叠式， 层层间呈错列式结构设置； 或 多个所述肋身呈球形半径向外辐射式结构设置； 或多个所述肋身平行地与对应的所述肋脚竖 直结构设置； 或将所述肋线的所述肋身部分散开后， 反向成型成杯形结构。
5、根据权利要求 1至 3中任一所述的肋线式散热器， 其特征在于， 所有所述肋线的所述 肋身的所述预定的样式选自以下几种结构中的至少一种或几种的组合：
各个所述肋线包括一所述肋身以及两所述肋脚， 所述肋身延伸于两所述肋脚之间从而形 成环状肋身， 所述环状肋身与所述肋脚之间形成一预定角度， 各个所述肋线的两所述肋脚插 入对应的所述导热固定板的定位孔中；
多个所述肋线的所述肋身形成一层或多层结构， 各层肋身之间具有预定的间隔； 所述肋身轴向地延伸于所述肋脚， 并且所述肋身与所述肋脚所在的平面之间形成一预定 大小的角度， 所述各个肋线的所述肋身弯折成曲线形状， 所述曲线形状选自连续的 Z 形、 S 形、 W形延伸、 和蛇形延伸形状中的一种；
各个所述肋身呈直线形地设置， 所有所述肋线的所述肋身从所述固定装置的中心呈辐射 状地设置；
各个所述肋身呈螺旋状地设置， 并且各个所述肋身的轴线与对应的所述肋脚互相平行地 设置；
所述导热固定板的多个所述定位孔形成多环定位孔， 每一环所述定位孔用于固定部分所 述肋线的所述肋脚， 从而所有所述肋线的所述肋身绕着所述导热固定板的中心轴线呈环形地 设置； 和
多个所述肋线的所述肋脚固定于所述固定装置， 并且多个所述肋线的所述肋身围绕着所 述固定装置以使所述固定装置设置在所述肋身内部， 并且所述肋身以所述固定装置为中心呈 辐射状地设置。
6、 根据权利要求 5所述的肋线式散热器， 其特征在于， 各个所述肋线所在的平面， 与对
应的所述肋身所在的平面形成一夹角， 所述夹角选自锐角、 直角、 钝角中的一种。
7、 根据权利要求 5所述的肋线式散热器， 其特征在于， 所述导热固定板采用铝、 或铜、 或铜铝复合材料， 其厚度大于 2mm、 小于 20mm; 所述包箍套采用铝、 或铜、 或铜铝复合材料， 其高度大于 2mm、 小于 20m， 其中多个所述肋线的中心肋线的长度等于所述包箍套的高度。
8、 根据权利要求 5所述的肋线式散热器， 其特征在于， 所述肋线采用铝质、 或铜质、 或 铜铝复合材料制成，并且各个所述肋线的截面是圆形或星形。
9、 一种肋线式散热器的制造方法， 其特征在于， 包括如下步骤：
( a) 提供一固定装置；
( b ) 将多个肋线的肋脚固定于所述固定装置；
( c ) 使多个所述肋线的肋身形成预定的样式； 以及
( d ) 采用车削加工所述肋线式散热器的传热接触面。
10、 根据权利要求 9所述的方法， 其特征在于， 在步骤 (a)中， 所述固定装置是导热固定 板或包箍套， 所述导热固定板上成形有定位孔， 并且所述导热固定板采用冲压工艺， 或采用 挤出加裁切工艺制成的网孔板结构； 所述包箍套采用挤出加裁切工艺制成， 或采用金属薄管 裁切而成。
11、 根据权利要求 10所述的方法， 其特征在于， 在步骤（b ) 中， 可以选自如下的方法： ( b. 1 )将所述肋线与所述导热固定板表面化学镀镍处理， 将各个所述肋线的所述肋脚插 入所述导热固定板的定位孔中， 然后采用锡焊方法焊接固定； 或者
( b. 2 )将多个所述肋线的所述肋脚靠紧成一捆，外套上所述包箍套，采用模具縮紧工艺， 将所述包箍套縮紧， 然后表面化学镀镍处理， 再通过锡焊工艺填充所述包箍套的紧箍肋脚端 面的缝隙。
12、 根据权利要求 11所述的方法， 其特征在于， 所制得的所述肋线散热器中， 相邻所述 肋脚的平均间隙小于 15mm， 相邻所述肋线的所述肋身的平均间隙大于 2mm、 小于 30mm， 各个 所述肋线的截面积大于 2m ltf、小于 30m ltf， 所述肋线式散热器的多个所述肋线的肋脚端面积 的总面积， 是半导体电子元器件的导出传热面面积的 1倍到 6倍。
13、 根据权利要求 9至 12中任一所述的方法， 其特征在于， 在所述肋线式散热器中， 多 个所述肋线的所述肋身在一个平面上呈圆半径向外辐射状， 在纵面上呈层叠式， 层层间呈错 列式结构设置； 或多个所述肋身呈球形半径向外辐射式结构设置； 或多个所述肋身平行地与 对应的所述肋脚竖直结构设置； 或将所述肋线的所述肋身部分散开后， 反向成型成杯形结构。
14、 根据权利要求 9至 12中任一所述的方法， 其特征在于， 在上述步骤 （c ) 中， 所有 所述肋线的所述肋身的所述预定的样式选自以下几种结构中的至少一种或几种的组合：
各个所述肋线包括一所述肋身以及两所述肋脚， 所述肋身延伸于两所述肋脚之间从而形
成环状肋身， 所述环状肋身与所述肋脚之间形成一预定角度， 各个所述肋线的两所述肋脚插 入对应的所述导热固定板的定位孔中；
多个所述肋线的所述肋身形成一层或多层结构， 各层肋身之间具有预定的间隔； 所述肋身轴向地延伸于所述肋脚， 并且所述肋身与所述肋脚所在的平面之间形成一预定 大小的角度， 所述各个肋线的所述肋身弯折成曲线形状， 所述曲线形状选自连续的 z 形、 S 形、 w形延伸、 和蛇形延伸形状中的一种；
各个所述肋身呈直线形地设置， 所有所述肋线的所述肋身从所述固定装置的中心呈辐射 状地设置；
各个所述肋身呈螺旋状地设置， 并且各个所述肋身的轴线与对应的所述肋脚互相平行地 设置；
所述导热固定板的多个所述定位孔形成多环定位孔， 每一环所述定位孔用于固定部分所 述肋线的所述肋脚， 从而所有所述肋线的所述肋身绕着所述导热固定板的中心轴线呈环形地 设置； 和
多个所述肋线的所述肋脚固定于所述固定装置， 并且多个所述肋线的所述肋身围绕着所 述固定装置以使所述固定装置设置在所述肋身内部， 并且所述肋身以所述固定装置为中心呈 辐射状地设置。
15、 根据权利要求 11所述的方法， 其特征在于， 所述步骤 （c ) 中包括步骤：
(c. 1)采用圆锥冲模将所述肋线的所述肋身冲压散开一个预定角度；
(c. 2)采用平板模将所述肋线的所述肋身冲压踏平； 以及
(c. 3)采用成型模具将所述肋线的所述肋身反向冲压成杯型。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100802845A CN103199066A (zh) | 2013-03-03 | 2013-03-03 | 一种肋线式散热器及制造方法 |
| CN201310080284.5 | 2013-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2014134911A1 true WO2014134911A1 (zh) | 2014-09-12 |
Family
ID=48721520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2013/083531 WO2014134911A1 (zh) | 2013-03-03 | 2013-09-16 | 一种肋线式散热器及制造方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103199066A (zh) |
| WO (1) | WO2014134911A1 (zh) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3324112A1 (en) * | 2016-11-21 | 2018-05-23 | ABL IP Holding LLC | Heat sink |
| USD822624S1 (en) | 2016-08-30 | 2018-07-10 | Abl Ip Holding Llc | Heat sink |
| USD822626S1 (en) | 2016-11-21 | 2018-07-10 | Abl Ip Holding Llc | Heatsink |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199066A (zh) * | 2013-03-03 | 2013-07-10 | 秦吉忠 | 一种肋线式散热器及制造方法 |
| CN104051375A (zh) * | 2014-01-03 | 2014-09-17 | 深圳市核创新照明科技有限公司 | 一种肋线式散热器及其制造方法 |
| CN103794579A (zh) * | 2014-02-22 | 2014-05-14 | 秦顺宗 | 一种散热器 |
| CN106058687A (zh) * | 2016-07-28 | 2016-10-26 | 苏州必信空调有限公司 | 具有垂直低阻力冷却系统的配电箱除湿装置 |
| CN106025818A (zh) * | 2016-07-28 | 2016-10-12 | 苏州必信空调有限公司 | 具有垂直低阻力冷却系统的配电箱除湿装置 |
| CN106158278A (zh) * | 2016-08-23 | 2016-11-23 | 苏州必信空调有限公司 | 具有垂直管低阻力冷却系统的变压器冷却装置 |
| CN109759807A (zh) * | 2019-03-21 | 2019-05-17 | 熊宇 | 一种电子器件用散热器的加工工艺 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
| US5829512A (en) * | 1995-08-29 | 1998-11-03 | Silicon Graphics, Inc. | Heatsink and method of forming a heatsink |
| CN200972859Y (zh) * | 2006-10-23 | 2007-11-07 | 李汉明 | 纤维放射状散热片 |
| US20070284081A1 (en) * | 2006-05-24 | 2007-12-13 | Han-Ming Lee | Heatsink device having fiber-like fins |
| CN103199066A (zh) * | 2013-03-03 | 2013-07-10 | 秦吉忠 | 一种肋线式散热器及制造方法 |
| CN203250732U (zh) * | 2013-03-03 | 2013-10-23 | 秦吉忠 | 一种肋线式散热器 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5158136A (en) * | 1991-11-12 | 1992-10-27 | At&T Laboratories | Pin fin heat sink including flow enhancement |
-
2013
- 2013-03-03 CN CN2013100802845A patent/CN103199066A/zh active Pending
- 2013-09-16 WO PCT/CN2013/083531 patent/WO2014134911A1/zh active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
| US5829512A (en) * | 1995-08-29 | 1998-11-03 | Silicon Graphics, Inc. | Heatsink and method of forming a heatsink |
| US20070284081A1 (en) * | 2006-05-24 | 2007-12-13 | Han-Ming Lee | Heatsink device having fiber-like fins |
| CN200972859Y (zh) * | 2006-10-23 | 2007-11-07 | 李汉明 | 纤维放射状散热片 |
| CN103199066A (zh) * | 2013-03-03 | 2013-07-10 | 秦吉忠 | 一种肋线式散热器及制造方法 |
| CN203250732U (zh) * | 2013-03-03 | 2013-10-23 | 秦吉忠 | 一种肋线式散热器 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD822624S1 (en) | 2016-08-30 | 2018-07-10 | Abl Ip Holding Llc | Heat sink |
| EP3324112A1 (en) * | 2016-11-21 | 2018-05-23 | ABL IP Holding LLC | Heat sink |
| USD822626S1 (en) | 2016-11-21 | 2018-07-10 | Abl Ip Holding Llc | Heatsink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103199066A (zh) | 2013-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2014134911A1 (zh) | 一种肋线式散热器及制造方法 | |
| TWM353311U (en) | Improved heat dissipator | |
| US20120193085A1 (en) | Heatsink for led array light | |
| US20140165401A1 (en) | Thin heat pipe structure and manufacturing method thereof | |
| US20140034279A1 (en) | Heat sink structure and manufacturing method thereof | |
| CN103629968B (zh) | 一种层叠一体式内外翅片换热管及其制造方法 | |
| JP2005203665A5 (zh) | ||
| CN203250732U (zh) | 一种肋线式散热器 | |
| JP5992693B2 (ja) | 冷却器用薄板及びこれにて製作される冷却器の製法 | |
| JP5081757B2 (ja) | 扁平コイル状フィン部材を有する伝熱面構造及びその製造方法 | |
| RU184729U1 (ru) | Радиатор для охлаждения электронных устройств | |
| JP5869267B2 (ja) | 液冷ヒートシンクの製造方法 | |
| CN203659841U (zh) | 一种肋线式散热器 | |
| TWM353309U (en) | Improved tight fitting structure for annular heat dissipating device | |
| CN203586908U (zh) | 一种层叠一体式内外翅片换热管 | |
| CN204796012U (zh) | 热管型散热模组及组装工装 | |
| TWI416310B (zh) | 散熱裝置及具有散熱裝置的裝置組合 | |
| CN211352914U (zh) | 散热器、线路板散热组件以及服务器 | |
| CN207070565U (zh) | 一种散热座 | |
| JP5203031B2 (ja) | 扁平コイル状フィン部材を有する伝熱面構造及びその製造方法 | |
| TWI482002B (zh) | 散熱器及其製造方法 | |
| CN215007791U (zh) | 一种变压器壳体结构 | |
| CN219017636U (zh) | 一种半导体散热器的散热鳍片 | |
| CN100593965C (zh) | 散热器 | |
| JP6109274B1 (ja) | ヒートシンク及び該ヒートシンクの製造方法並びに該ヒートシンクを用いた電子部品パッケージ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13877082 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 13877082 Country of ref document: EP Kind code of ref document: A1 |