WO2014110941A1 - 触控面板的测试装置 - Google Patents

触控面板的测试装置 Download PDF

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Publication number
WO2014110941A1
WO2014110941A1 PCT/CN2013/087605 CN2013087605W WO2014110941A1 WO 2014110941 A1 WO2014110941 A1 WO 2014110941A1 CN 2013087605 W CN2013087605 W CN 2013087605W WO 2014110941 A1 WO2014110941 A1 WO 2014110941A1
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Prior art keywords
substrate
test
port
touch panel
tested
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PCT/CN2013/087605
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English (en)
French (fr)
Inventor
戴中航
黄建龙
李建峰
李莉君
李木生
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宸鸿科技(厦门)有限公司
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Publication of WO2014110941A1 publication Critical patent/WO2014110941A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

Definitions

  • the invention relates to a testing device, in particular to a testing device for a touch panel.
  • the conventional capacitive touch panel includes an upper conductive plate and a lower conductive plate, and the upper and lower conductive plates are optically pasted to form a touch panel.
  • the current practice in the industry is to pass the capacitance test to detect defective products after the upper and lower conductive plates are bonded together.
  • the upper and lower conductive plates are first bonded by optical glue, and then placed in a dedicated test device, and then passed through a probe module or a silicone rubber connector (commonly known as Zebra strip) its bonding pads (Bonding Pad) means that the test contacts are connected to the transfer board and tested by the test board and the program to distinguish between good and bad products.
  • the embodiment of the invention provides a test device for a touch panel, which can be tested after the analog substrate and the substrate to be tested are simulated and bonded, so as to improve the traditional optical glue bonding before testing, so that the detection of defective products is increased. Problems such as the cost of the process.
  • An embodiment of the present invention provides a test device for a touch panel, comprising: a dummy substrate, including a plurality of first electrodes and a first connection port electrically connected to the first electrode; and a test module including the first The test ⁇ and the second test ⁇ , wherein the first test ⁇ is electrically connected to the first port of the analog substrate.
  • the analog substrate is used for pressing a substrate to be tested to simulate a touch panel.
  • the substrate to be tested includes a plurality of second electrodes and a plurality of second ports electrically connected to the second electrodes, and the second port is connected to the second substrate. Electrically connected to the second test port, the first electrode and the second electrode are insulated from each other and arranged in a cross.
  • the analog substrate has a yielding port, and the position of the location port corresponds to the second connection port of the substrate to be tested.
  • position port and the first port are located on the same side of the analog substrate.
  • the first electrode is disposed on an upper surface of the dummy substrate, and the first connection port is disposed on a lower surface opposite to the upper surface of the dummy substrate.
  • the second electrode and the second connecting port are disposed on a lower surface of the substrate to be tested.
  • the dummy substrate includes a first insulating layer covering the first electrode
  • the substrate to be tested includes a second insulating layer
  • the second insulating layer covers the second electrode layer.
  • the first port has a plurality of first contact points
  • the second port has a plurality of second contacts
  • the first test port has a plurality of first test points
  • the second test port has a plurality of second test points
  • the first contact point is electrically connected to the first test point
  • the second contact point is electrically connected to the second test point.
  • the cable module is electrically connected between the first test port and the first port.
  • test head module is electrically connected between the second test port and the second port.
  • a pressing plate is disposed on the dummy substrate, and the pressing plate is used for pressing the substrate to be tested and the dummy substrate.
  • analog substrate is a printed circuit board.
  • the test device for the touch panel provided by the embodiment of the present invention can simulate the real touch panel to test the substrate to be tested by simulating the analog substrate and the substrate to be tested. It can improve the traditional optical glue bonding before testing, so that the detection of defective products increases the cost of the bonding process.
  • 1A is a schematic view (1) of a substrate to be tested according to an embodiment of the invention.
  • FIG. 1B is a schematic view (1) of a dummy substrate according to an embodiment of the invention.
  • FIG. 2 is a schematic diagram (1) of a test state according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a test apparatus according to an embodiment of the present invention.
  • 4A is a schematic view (2) of a substrate to be tested according to another embodiment of the present invention.
  • 4B is a schematic view (2) of a dummy substrate according to another embodiment of the present invention.
  • FIG. 5 is a schematic diagram (2) of a test state according to another embodiment of the present invention.
  • the first embodiment of the present invention provides a test device Z for a touch panel, including a dummy substrate 1 and a test module 3.
  • the analog substrate 1 includes a plurality of first electrodes 10 and a first connection port 11 electrically connected to the first electrodes 10 .
  • the test module 3 includes a first test port 31 and a second test port 32, wherein the first test port 31 is electrically connected to the first port 11 .
  • the analog substrate is used for pressing with a substrate 2 to be tested to simulate a touch panel.
  • the substrate 2 to be tested includes a plurality of second electrodes 20 and a second connection port 22 electrically connected to the second electrode 20 .
  • the second connection port 22 of the substrate 2 to be tested is electrically connected to the second test port 32 of the test module 3, and the first electrode 10 and the second electrode 20 are insulated from each other and arranged in a cross.
  • the test device Z of the touch panel provided by the embodiment of the present invention is not limited to this figure in actual implementation, and can be adjusted according to actual design requirements.
  • the analog substrate 1 includes a plurality of first electrodes 10 and a first connection port 11 electrically connected to the first electrode 10 .
  • the first electrode 10 is disposed on an upper surface 1a of the dummy substrate 1, and the first connection port 11 is disposed on the lower surface 1b of the dummy substrate 1, and the upper surface 1a is disposed opposite to the lower surface 1b.
  • the arrangement direction of the first electrodes 10 can be designed according to the direction of the second electrodes 20 of the substrate 2 to be tested.
  • the first electrodes 10 are arranged in parallel along a first axial direction (for example, a horizontal axis).
  • a first axial direction for example, a horizontal axis
  • the first electrodes 10 are arranged in parallel along the second axial direction (for example, the vertical axis).
  • the first connection port 11 is disposed at an edge of the analog substrate 1, and the first connection port 11 has a plurality of first contact points 111 spaced apart from each other, and the first contact points 111 are electrically connected to the first An electrode 10.
  • the dummy substrate 1 further includes a first insulating layer 13 and a yielding port 14. The insulating layer 13 is covered on the first electrode 10 for preventing the first electrode 10 from being corroded by the environment.
  • the position of the position port 14 corresponds to the position of the second port 22 of the substrate 2 to be tested, whereby when the substrate 2 to be tested is pressed against the dummy substrate 1, the second port 22 of the substrate 2 to be tested passes through the analog substrate.
  • the yielding port 14 of 1 is not blocked by the dummy substrate 1.
  • the position of the position port 14 can be designed according to the position of the second connection port 22 of the substrate 2 to be tested. For example, as shown in FIG. 1B, the position port 14 is located at the edge of the substrate 1, and its position is different from the first connection.
  • the position of the crucible 11 is located on the same side of the substrate 1 as the first connection port 11.
  • the placement port 14 is located at the middle of one side of the substrate 1, and its position is different from the position of the first connection port 11, but is located on the same side of the substrate 1 as the first connection port 11.
  • the analog substrate 1 may be a printed circuit board (PCB)
  • the first electrode 10 may be a conductive copper wire
  • the first insulating layer 13 may be an insulating ink.
  • the contact point 111 can be a conductive material such as a copper foil.
  • the PCB is used as the analog substrate 1 and the substrate 2 to be tested is pressed together to test the substrate 2 to be tested.
  • the PCB process is simple and the technology is mature, so the width of the copper wire as the first electrode 10 can be more precise.
  • the control device that is, the deviation is small. Therefore, the test device Z of the touch panel of the present invention can effectively reduce the uncertainty of the test, reduce the false positive rate during the test, and improve the test yield of the product.
  • the PCB is less susceptible to cracking than the conventional glass conductive substrate, and the cost is low.
  • the substrate 2 to be tested includes a plurality of second electrodes 20 and a second connection port 22 electrically connected to the second electrode 20 .
  • the second electrode 20 and the second connection port 22 are formed on the lower surface 2b of the substrate 2 to be tested.
  • the second electrode 20 may be a transparent electrode layer.
  • the second electrodes 20 are arranged in parallel and have a second axial direction (for example, a vertical axis).
  • the second electrodes 20 are arranged in parallel and have a first axial direction (for example, a horizontal axis).
  • the second connection port 22 is disposed at one of the edges of the substrate 2 to be tested, and the position thereof corresponds to the position of the yielding port 14 of the analog substrate 1 , whereby when the substrate 2 to be tested is pressed against the dummy substrate 1
  • the second port 22 of the substrate 2 to be tested passes through the yielding port 14 of the dummy substrate 1 without being blocked by the dummy substrate 1.
  • the second connection port 22 has a plurality of second contact points 221 spaced apart from each other, and the second contact points 221 are electrically connected to the second electrodes 20, respectively.
  • the substrate 2 to be tested further includes a second insulating layer 23 covering the second electrode 20 to prevent the second electrode 20 from being corroded by the environment.
  • the substrate 2 to be tested may be a conductive glass or a conductive film
  • the second insulating layer 23 may be an insulating ink
  • the second contact point 221 may be a conductive material such as a copper foil.
  • the test module 3 includes a first test port 31 electrically connected to the first port 11 of the analog substrate 1, and a second electrode electrically connected to the substrate 2 to be tested.
  • the second test port 32 of the port 22 is connected.
  • the first test cartridge 31 has a plurality of first test points 311 spaced apart from each other
  • the second test cartridge 32 has a plurality of second test points 321 spaced apart from each other.
  • the first contact point 111 of the analog substrate 1 is electrically connected to the first test point 311 of the test module 3
  • the second contact point 221 of the substrate 2 to be tested is electrically connected to the second test point 321 of the test module 3.
  • the first test point 311 and the second test point 321 may be conductive materials such as copper foil.
  • the testing device Z further includes a cable module 4, a test head module 5 and a pressing plate 6.
  • the cable module 4 is electrically connected between the first test port 31 of the test module 3 and the first port 11 of the analog substrate 1.
  • the test head module 5 is disposed between the test module 3 and the substrate 2 to be tested.
  • the pressing plate 6 is disposed above the dummy substrate 1. When a substrate 2 to be tested is placed on the dummy substrate 1, the pressing plate 6 presses the substrate 2 to be tested against the dummy substrate 1 to ensure the dummy substrate 1 and The substrate to be tested 2 is in normal contact to simulate a true touch panel.
  • the testing device Z further includes a cylinder 7 disposed above the pressing plate 6.
  • the pressing plate 6 can press the substrate 2 to be tested and the dummy substrate 1 by the action of the cylinder 7.
  • the cable module 4 may be a flexible printed circuit board (FPC)
  • the test head module 5 may be in the form of a probe or a silicone rubber connector.
  • the dummy substrate 1 is fixed on the test device Z of the touch panel, and then the substrate 2 to be tested is pressed onto the dummy substrate 1 , wherein the lower surface 2 b of the substrate 2 to be tested is pressed against the upper surface 1 a of the dummy substrate 1 . .
  • the yielding port 14 of the analog substrate 1 corresponds to the second port 22 of the substrate 2 to be tested.
  • the first electrode 10 and the second electrode 20 are electrically insulated from each other by the first insulating layer 13 and the second insulating layer 23, and are distributed to each other to form a grid-like pattern (not shown). Then, the first test port 31 of the test module 3 is electrically connected to the first port 11 of the analog substrate 1 through the cable module 4, and the second test port 32 of the test module 3 is passed through the test head module 5. The second connection port 22 of the substrate 2 to be tested is connected. Finally, after the analog paste is combined and energized, the detection of the substrate 2 to be tested is performed by measuring the mutual inductance formed at the intersection of the first electrode 10 and the second electrode 20.
  • the structure of the analog substrate 1 is designed according to the structural direction of the substrate 2 to be tested, for example, the first electrode 10 of the conductive glass, and the design of the analog substrate 1 is used to improve the traditional touch panel. Testing is performed to make the detection of defective products increase the cost of the bonding process.
  • the position of the second port 22 on the substrate 2 to be tested is corresponding to the position port 14 so that the second connection is made.
  • the first connection port 11 on the dummy substrate 1 is not disposed on the lower surface 1b of the dummy substrate 1, so that the first connection port 11 is not covered by the substrate 2 to be tested.
  • the test device it is only necessary to provide a retaining port on the analog substrate 1.
  • the substrate to be tested does not need to be provided with a retaining port, and the program for making the retaining port on the substrate 2 to be tested can be saved.
  • the substrate 2 to be tested is the upper conductive cover of the touch panel, since the upper conductive cover is generally made of glass and serves as a direct contact surface of the external touch object, it is difficult to set on the upper conductive cover.
  • the test device provided by the present invention can solve the problem that the conductive cover on the touch panel is not easy to set the position.
  • the test device for a touch panel provided by the embodiment of the present invention can simulate the structure of the touch panel by analog mounting of the analog substrate and the substrate to be tested for testing, and the process of simulating the substrate is simple and the error is small. ,low cost.
  • the second connection port of the substrate to be tested is blocked by the embedding port of the analog substrate without being blocked by the analog substrate, so that the test device of the touch panel of the present invention can improve test efficiency and improve test convenience.

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Abstract

一种触控面板的测试装置，包括：模拟基板（1）及测试模组（3）。模拟基板（1）包括多个第一电极（10）及一电性连接于第一电极（10）的第一连接埠（11）。测试模组（3）包括第一测试埠（31）及第二测试埠（32），其中第一测试埠（31）电性连接于模拟基板（1）的第一连接埠（11）。模拟基板（1）用于与一待测基板（2）压合以模拟一触控面板，待测基板（2）包括多个第二电极（20）及电性连接于第二电极（20）的多个第二连接埠（22），第二连接埠（22）电性连接于第二测试埠（32），第一电极（10）与第二电极（20）相互绝缘且交叉排布。通过模拟基板（1）和待测基板（2）的模拟贴合来模拟真实的触控面板以进行待测基板（2）的测试，可以改善传统用光学胶贴合后才进行测试，使得不良品的检测增加了贴合工艺成本等问题。

Description

触控面板的测试装置 技术领域
本发明涉及一种测试装置，尤指一种触控面板的测试装置。
背景技术
传统电容式触控面板包括上导电板和下导电板，上、下导电板通过光学胶贴后形成一触控面板。对这一类双层叠构触控面板的测试，目前业界的作法是在上、下导电板贴合之后通过电容测试来检测不良品。举例来说，在传统的测试方式中，首先是将上、下导电板利用光学胶进行贴合，接着将其放置于专用的测试装置中，然后经过探针模组或硅橡胶连接器(俗称斑马条)将其接合垫(Bonding Pad)亦即测试接触点连接至转接板上，再经由测试主机板和程式进行测试，从而区分良品和不良品。
然而，贴合后才进行测试，不良品的检测增加了贴合工艺成本，且上、下导电板其中任意一个的不良将导致整个触控面板不良而报废，浪费成本。因此，如何改善上述问题，已成为该项事业人士所欲解决的重要课题。
发明内容
本发明实施例提供一种触控面板的测试装置，其能够藉由模拟基板与待测基板模拟贴合后进行测试，以改善传统用光学胶贴合后才进行测试，使得不良品的检测增加了贴合工艺成本等问题。
本发明其中一实施例提供一种触控面板的测试装置，包括：一模拟基板，包括多个第一电极及电性连接于第一电极的第一连接埠；一测试模组，包括第一测试埠及第二测试埠，其中第一测试埠电性连接于模拟基板的第一连接埠。其中，模拟基板用于与一待测基板压合以模拟一触控面板，该待测基板包括多个第二电极及电性连接于第二电极的多个第二连接埠，第二连接埠电性连接于第二测试埠，第一电极与第二电极相互绝缘且交叉排布。
进一步的，模拟基板具有一让位口，让位口的位置对应于待测基板的第二连接埠。
进一步的，让位口与第一连接埠位于模拟基板的一相同侧边。
进一步的，第一电极设置于模拟基板的一上表面，第一连接埠设置于与模拟基板的上表面相对的一下表面。
进一步的，第二电极及第二连接埠设置于待测基板的一下表面。
进一步的，模拟基板包括一第一绝缘层，第一绝缘层覆盖在第一电极上，待测基板包括一第二绝缘层，第二绝缘层覆盖在第二电极层上。
进一步的，第一连接埠具有多个第一接触点，第二连接埠具有多个第二接触点，第一测试埠具有多个第一测试点，第二测试埠具有多个第二测试点，其中第一接触点与第一测试点电性连接，第二接触点与第二测试点电性连接。
进一步的，更包括一线缆模组，线缆模组电性连接于第一测试埠及该第一连接埠之间。
进一步的，更包括一测试头模组，测试头模组电性连接于第二测试埠及第二连接埠之间。
进一步的，更包括一压抵板，其配置在模拟基板上，压抵板用于压合待测基板和模拟基板。
进一步的，模拟基板为印刷电路板。
综上所述，本发明实施例所提供的触控面板的测试装置，可通过模拟基板和待测基板的模拟贴合来模拟真实的触控面板以进行待测基板的测试。可改善传统用光学胶贴合后才进行测试，使得不良品的检测增加了贴合工艺成本等问题。
为使能更进一步了解本发明之特征及技术内容，请参阅以下有关本发明之详细说明与附图，然而所附图式仅提供参考与说明用，并非用来对本发明加以限制者。
附图说明
图1A为本发明一实施例待测基板的示意图(一)。
图1B为本发明一实施例模拟基板的示意图(一)。
图2为本发明一实施例的测试状态示意图(一)。
图3为本发明一实施例测试装置的示意图。
图4A为本发明另一实施例待测基板的示意图(二)。
图4B为本发明另一实施例模拟基板的示意图(二)。
图5为本发明另一实施例的测试状态示意图(二)。
具体实施方式
下面结合附图与具体实施方式对本发明作进一步详细描述。
首先，请同时参阅图1A至图5。由上述图中可知，本发明第一实施例提供一种触控面板的测试装置Z，包括模拟基板1及测试模组3。模拟基板1包括多个第一电极10及电性连接于该些第一电极10的第一连接埠11。测试模组3包括第一测试埠31及第二测试埠32，其中第一测试埠31电性连接于第一连接埠11。模拟基板用于与一待测基板2压合，使其模拟出一触控面板。该待测基板2包括多个第二电极20及电性连接于第二电极20的第二连接埠22。同时，使待测基板2的第二连接埠22电性连接测试模组3的第二测试埠32，第一电极10与第二电极20相互绝缘且交叉排布。须注意的是，本发明实施例所提供的触控面板的测试装置Z，于实际实施时并非以此图为限，可依实际设计需要作调整。
请结合参照图1B及图2，模拟基板1包括多个第一电极10及电性连接于第一电极10的第一连接埠11。第一电极10设置于模拟基板1的一上表面1a上，第一连接埠11设置于模拟基板1的一下表面1b上，该上表面1a与该下表面1b相对设置。第一电极10的排列方向可根据待测基板2的第二电极20的方向而设计。例如，如图1B所示，该些第一电极10沿第一轴向(例如水平轴向)平行排列。或者，如图4B所示，该些第一电极10沿第二轴向(例如垂直轴向)平行排列。另外，第一连接埠11设置在模拟基板1的边缘处，且第一连接埠11具有多个相互间隔的第一接触点111，而该些第一接触点111分别电性连接于该些第一电极10。此外，模拟基板1还包括一第一绝缘层13及一让位口14。绝缘层13覆盖在第一电极10上，用于避免第一电极10受环境的侵蚀。让位口14的位置对应于待测基板2的第二连接埠22的位置，藉此，待测基板2与模拟基板1压合时，待测基板2的第二连接埠22透过模拟基板1的让位口14而不致于被模拟基板1所遮挡。让位口14的位置可根据待测基板2的第二连接埠22的位置而设计，例如，如图1B所示，让位口14位于基板1的边缘处，其位置相异于第一连接埠11的位置，但与第一连接埠11位于基板1的相同侧边。或者，如图4B所示，让位口14位于基板1的一侧边的中部，其位置相异于第一连接埠11的位置，但与第一连接埠11位于基板1的相同侧边。
于一实施例中，上述模拟基板1可为印刷电路板(PCB)，上述第一电极10可为导电的铜线(trace)，上述第一绝缘层13可为绝缘油墨，上述该些第一接触点111可为导电的材质例如铜箔。更进一步地说，采用PCB作为模拟基板1与待测基板2压合后进行待测基板2的测试，PCB制程较简单，技术较成熟，所以作为第一电极10的铜线的宽度能够较精确的控制，亦即偏差较小，因此，本发明的触控面板的测试装置Z，可有效地减小测试的不确定性、降低测试过程中的误判率，并提高产品的测试良率。另外，PCB相较于传统的玻璃导电基板不易破裂，成本低。
请结合参照图1A及图2，待测基板2包括多个第二电极20及电性连接于第二电极20的第二连接埠22。第二电极20及第二连接埠22成形于待测基板2的一下表面2b。举例来说，上述第二电极20可为透明的电极层。于本发明一实例中，如图1A所示，该些第二电极20呈平行排列，且共同具有第二轴向(例如垂直轴向)。于本发明另一实例中，如图4A所示，该些第二电极20呈平行排列，且共同具有第一轴向(例如水平轴向)。另外，第二连接埠22设置在待测基板2的其中一边缘处，其位置与模拟基板1的让位口14的位置相对应，藉此，待测基板2与模拟基板1压合时，待测基板2的第二连接埠22透过模拟基板1的让位口14而不致于被模拟基板1所遮挡。第二连接埠22具有多个相互间隔的第二接触点221，而该些第二接触点221分别电性连接于该些第二电极20。此外，待测基板2还包括一第二绝缘层23，其覆盖在第二电极20上以避免第二电极20受环境的侵蚀。于一具体实施例中，上述待测基板2可为导电玻璃或导电薄膜，上述第二绝缘层23可为绝缘油墨，上述第二接触点221可为导电的材质例如铜箔。
如图2、图3及图5所示，测试模组3包括一电性连接于模拟基板1的第一连接埠11的第一测试埠31及一电性连接于待测基板2的第二连接埠22的第二测试埠32。举例来说，第一测试埠31具有多个相互间隔的第一测试点311，第二测试埠32具有多个相互间隔的第二测试点321。模拟基板1的第一接触点111与测试模组3的第一测试点311分别电性连接，待测基板2的第二接触点221与测试模组3的第二测试点321电性连接。于一具体实施例中，上述第一测试点311及第二测试点321可为导电的材质例如铜箔。
此外，该测试装置Z还包括线缆模组4、测试头模组5及压抵板6。线缆模组4电性连接于测试模组3的第一测试埠31及模拟基板1的第一连接埠11之间。测试头模组5配置在该测试模组3与该待测基板2之间。压抵板6配置在该模拟基板1上方，当一待测基板2放置在模拟基板1上时，压抵板6将该待测基板2抵压于模拟基板1上，以确保模拟基板1与待测基板2之间是正常接触以模拟一真实贴合后的触控面板。于一实施例中，测试装置Z还包括一气缸7，气缸7设置于压抵板6上方，压抵板6可通过气缸7的作用使待测基板2与模拟基板1压合。于实务中，上述线缆模组4可为软性印刷电路板(FPC)，上述测试头模组5可为探针或硅橡胶连接器的型式。
于一具体实施例中，如图2所示，并请同时配合参阅图1A及图1B，或如图5所示，并同时配合参阅图4A及图4B。首先，模拟基板1固定于触控面板的测试装置Z上，接着将待测基板2压合于模拟基板1上，其中，待测基板2的下表面2b压合于模拟基板1的上表面1a。模拟基板1的让位口14对应于待测基板2的第二连接埠22。第一电极10与第二电极20之间通过第一绝缘层13和第二绝缘层23相互电性绝缘，且呈相互交叉分布，从而形成类似网格状的图样(图未示)。然后将测试模组3的第一测试埠31通过线缆模组4电性连接模拟基板1的第一连接埠11，将测试模组3的第二测试埠32通过测试头模组5电性连接待测基板2的第二连接埠22。最后，在模拟贴合并通电后，藉由量测在第一电极10与第二电极20交叉点处所形成的互感电容的方式，以实现对待测基板2之检测。
本发明实施例根据待测基板2，例如导电玻璃的第一电极10的结构方向，而设计一块模拟基板1的结构，藉由模拟基板1的设计，以改善传统触控面板需要贴合后才进行测试，使得不良品的检测增加了贴合工艺成本等问题。另外，待测基板2与模拟基板1压合后，因模拟基板1上设置有让位口14，待测基板2上的第二连接埠22的位置对应于让位口14，使得第二连接埠22不会被模拟基板1所遮盖，而模拟基板1上的第一连接埠11因设置于模拟基板1的下表面1b，所以第一连接埠11也不会被待测基板2所遮盖。换言之，采用此测试装置，只需要在模拟基板1上设置让位口，待测基板2上不需要设置让位口，可节省在待测基板2上制作让位口的程序。进一步的，当待测基板2为触控面板的上导电盖板时，由于上导电盖板一般为玻璃材质，且作为外部触控物体的直接接触面，故较难在上导电盖板上面设置让位口，本发明提供的测试装置可解决触控面板上导电盖板不易设置让位口的问题。
综上所述，本发明实施例所提供的触控面板的测试装置，其可通过模拟基板和待测基板的模拟贴合来模拟触控面板结构以进行测试，模拟基板的制程简单，误差小，成本低。测试时，待测基板的第二连接埠透过模拟基板的让位口而不被模拟基板所遮挡，以使得本发明的触控面板的测试装置能够提升测试效率，提高测试便利性。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明保护的范围之内。

Claims (11)

  1. 一种触控面板的测试装置，其特征在于，包括：
    模拟基板，包括多个第一电极及电性连接于该些第一电极的第一连接埠；
    测试模组，包括第一测试埠及第二测试埠，其中该第一测试埠电性连接于该模拟基板的第一连接埠；
    其中，该模拟基板用于与一待测基板压合以模拟一触控面板，该待测基板包括多个第二电极及电性连接于该些第二电极的第二连接埠，该第二连接埠电性连接于该些第二测试埠，该些第一电极与该些第二电极相互绝缘且交叉排布。
  2. 根据权利要求1所述的触控面板的测试装置，其中该模拟基板具有一让位口，该让位口的位置对应于该待测基板的第二连接埠。
  3. 根据权利要求2所述的触控面板的测试装置，其中该让位口与该第一连接埠位于该模拟基板的一相同侧边。
  4. 根据权利要求1所述的触控面板的测试装置，其中该些第一电极设置于该模拟基板的一上表面，该第一连接埠设置于与该模拟基板的上表面相对的一下表面。
  5. 根据权利要求4所述的触控面板的测试装置，该些第二电极及该第二连接埠设置于该待测基板的一下表面。
  6. 根据权利要求1所述的触控面板的测试装置，其中该模拟基板，包括第一绝缘层，该第一绝缘层覆盖在该些第一电极上，该待测基板包括第二绝缘层，第二绝缘层覆盖在该些第二电极层上。
  7. 根据权利要求1所述的触控面板的测试装置，其中该第一连接埠具有多个相互间隔的第一接触点，该第二连接埠具有多个相互间隔的第二接触点，该第一测试埠具有多个相互间隔的第一测试点，该第二测试埠具有多个相互间隔的第二测试点，其中该些第一接触点与该些第一测试点分别电性连接，该些第二接触点与该些第二测试点分别电性连接。
  8. 根据权利要求1所述的触控面板的测试装置，更包括线缆模组，该线缆模组电性连接于该第一测试埠及该第一连接埠之间。
  9. 根据权利要求1所述的触控面板的测试装置，更包括测试头模组，该测试头模组电性连接于该第二测试埠及该第二连接埠之间。
  10. 根据权利要求1所述的触控面板的测试装置，更包括压抵板，其配置在该模拟基板上，该压抵板用于压合该待测基板和该模拟基板。
  11. 据权利要求1至10任意一项所述的触控面板的测试装置，其中该模拟基板为印刷电路板。
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