WO2014103025A1 - Appareil à étiquette ci sans fil - Google Patents

Appareil à étiquette ci sans fil Download PDF

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Publication number
WO2014103025A1
WO2014103025A1 PCT/JP2012/084117 JP2012084117W WO2014103025A1 WO 2014103025 A1 WO2014103025 A1 WO 2014103025A1 JP 2012084117 W JP2012084117 W JP 2012084117W WO 2014103025 A1 WO2014103025 A1 WO 2014103025A1
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WO
WIPO (PCT)
Prior art keywords
tag
patch
wireless
conductor
antenna
Prior art date
Application number
PCT/JP2012/084117
Other languages
English (en)
Japanese (ja)
Inventor
智三 太田
津田　裕彦
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to PCT/JP2012/084117 priority Critical patent/WO2014103025A1/fr
Publication of WO2014103025A1 publication Critical patent/WO2014103025A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H01Q9/285—Planar dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith

Definitions

  • the present invention relates to a wireless IC tag device used for radio frequency identification (abbreviated as RFID).
  • RFID radio frequency identification
  • Wireless communication technology is applied not only in the field of information communication but also in fields such as logistics management, and IC tags for wireless communication (hereinafter referred to as “IC tags”) are widely known as products that play a role in RFID technology. ing. Since there are various uses for physical distribution management and inexpensive information storage media, wireless communication devices are placed in various usage environments.
  • An IC tag is composed of a tag IC as a circuit unit that stores data such as an identification number and controls wireless communication, and a tag antenna for transmitting and receiving radio waves, and has a great advantage that it can be realized thinly and lightly. ing.
  • Such an IC tag is not provided with a power source, but is a passive IC tag that drives a tag IC by radio wave power, and a semi-passive IC that is provided with a power source that drives the tag IC and reflects and modulates transmission radio waves for communication.
  • There is an active IC tag that includes a tag and a power source and can transmit by itself. In terms of frequency, there are a 13 MHz band that uses electromagnetic induction and is mainly used at a short distance, a 900 MHz band that uses a radio wave and a long communication distance, and a 2.45 GHz band.
  • the above-mentioned passive IC tag generates power from the transmission radio wave, the tag IC is activated using the power, and transmits data by reflecting and modulating the transmission radio wave.
  • IC tags using radio waves include those in which a dipole antenna is formed on a dielectric and the tag IC is connected, and meander type in which the transmission line is repeatedly bent to shorten its length.
  • a patch conductor having an electrical length of 1 ⁇ 2 wavelength on the dielectric hereinafter, 1 ⁇ 2 wavelength is 1 ⁇ 2 wavelength of the electrical length on the dielectric
  • An IC tag such as a patch antenna type is well known in which a ground conductor is formed on the other main surface and a tag IC provided between one patch conductor and the other ground conductor is fed.
  • a wireless IC tag device in which an IC tag is connected between a tag antenna and a ground conductor using a 1 ⁇ 2 wavelength microstrip line resonator. Since this wireless IC tag device has an IC tag between a grounding conductor on the side facing the tag antenna via a dielectric, manufacturing is complicated, but even if the grounding conductor side is attached to a metal body or the like Basically, communication can be performed without affecting radio wave radiation. Therefore, effective communication is possible for a linearly polarized radio signal having an electric field parallel to the length direction of the half-wavelength antenna (see, for example, Patent Document 1).
  • Patent Document 2 Another prior art for solving such a problem is described in Patent Document 2, for example.
  • the wireless IC tag device includes a plurality of patch conductors that resonate in plane at a resonance frequency and a wireless IC tag, and the wireless IC tag is disposed between one main surface or the other main surface of the two patch conductors or between the patch conductors. ing.
  • the two patch conductors are disposed in an electrically non-contact state, and the wireless IC tag is disposed at a position where the tag antenna can receive an electric field radiated simultaneously with the resonance of the two patch conductors.
  • the incoming wireless signal undergoes plane resonance with the two patch conductors, and at the same time, a strong electric field radiated enters the tag antenna of the wireless IC tag, and a current is generated in the tag antenna, giving start power to the wireless IC tag.
  • communication is possible.
  • grounding conductor is formed on the other main surface of the board, there is no emission of radio waves or electric fields on the grounding conductor side, and the grounding conductor side of the board can be easily mounted on the object to be mounted. With this configuration, an IC tag device that can be mounted on an object made of metal is realized.
  • JP 2000-332523 A Japanese Patent No. 4428865
  • the wireless IC tag is electromagnetically coupled to the patch conductor at the position where the radiated electric field is the largest at the end portions in the length direction of the two patch conductors, but the optimum position of the wireless IC tag is between the patch conductors. In some cases, the distance between the patch conductors may be large.
  • a disturbance component of electromagnetic field radiation generated in the vicinity of the wireless IC tag due to the arrangement of the wireless IC tag is caused by a lateral direction perpendicular to the wireless IC tag between the two patch conductors. That is, an unnecessary signal wave is emitted in the short side direction of the substrate, the radiation efficiency in the front direction of the wireless IC tag device is lowered, and the unnecessary radiation increases as the distance between the two patch conductors increases. is there.
  • the wireless IC tag since the wireless IC tag is arranged on the patch conductor, it has a three-dimensional structure, and the entire tag becomes thick. When a thin tag device is required, it is very important to form the wireless IC tag and the patch conductor in a plane.
  • the object of the present invention is to improve the radiation efficiency, make it possible to reduce the thickness, reduce the size with a simple configuration, can also divert general various wireless IC tags, and can also be applied to metal objects, etc. Is to provide a wireless IC tag device.
  • the present invention includes an IC tag having a circuit portion and a tag antenna; A dielectric substrate; A patch conductor provided on one main surface of the substrate; A ground conductor provided on the other main surface of the substrate, The patch conductor includes at least two patch antennas that resonate in plane at a resonance frequency; The patch antenna is opposed to each other with a gap, and has a concave cut region including the gap on one side or both sides, The IC tag is at least partially in the cut region, the radiation field component of the IC tag and the resonance axis of the patch conductor are parallel, and the IC tag is not in electrical contact with the patch conductor or The wireless IC tag device is configured to be in contact with any one of the patch conductors.
  • the ground conductor is formed to extend to one end portion of the patch conductor surface, and the patch conductors are connected to ones each having an electrical length of approximately 1 ⁇ 2.
  • a concave portion is formed in one of the patch antennas, and the other patch antenna has a convex portion that is partially fitted into the concave portion.
  • the patch antenna is formed at least partially close to the shape of the tag antenna of the IC tag.
  • the IC tag is formed on the same plane as the patch conductor or on the upper side or the lower side of the patch conductor.
  • the two terminals of the IC tag are brought into contact with each other at two different points on one side of the patch conductor.
  • At least one of the substrate and the ground conductor is detachable.
  • a patch antenna having two patch conductors that are planarly spaced apart from each other is provided on one main surface of the substrate, and a ground conductor is provided on the other main surface of the substrate. At least one of the two patch conductors is formed with a concave portion that is recessed from the edge facing the other patch conductor. A high radiated electric field is generated along the resonance axis of the patch antenna in a region surrounded by the concave portion of one patch conductor on one main surface of the substrate or a region between the concave portion and the other patch conductor.
  • An IC tag is provided.
  • the IC tag Since the IC tag is arranged so as to be sandwiched between the two patch conductors in this way, the radiation electric field of the IC tag is effectively electromagnetically coupled to each patch conductor to suppress unnecessary radiation between the patch conductors from the IC tag.
  • the wireless IC tag device can be manufactured only by plane mounting.
  • each patch conductor has a concave portion
  • the length of each patch conductor is reduced by the difference compared to the case where the electrical length of one patch conductor is ensured in a linear direction parallel to the resonance axis.
  • the tag device can be miniaturized.
  • the ground conductor is formed so as to extend to one end portion of the patch conductor, and the length of the patch conductor is connected to the patch conductor that is approximately 1 ⁇ 2 of the patch conductor. This has the effect of shortening the tag length.
  • the other patch conductor has a convex portion that partially fits into the concave portion of the one patch conductor, so that the patch conductor and the radiated electric field of the IC tag are efficiently coupled.
  • the patch conductor has an effect that a wider frequency band can be obtained due to the difference in electrical length between the two patch conductors due to the unevenness in the shape of the patch conductor.
  • the concave portion of one patch conductor is formed close to the shape of the tag antenna, the radiation field of the IC tag is efficiently coupled and the concave shape is formed in the shape of the patch conductor. Therefore, it is possible to obtain a wider frequency band by changing the electrical length of the two patch conductors. Moreover, since the useless area of the patch conductor surface is eliminated and the patch conductor surface can be effectively used, the radiation efficiency of the patch conductor can be further increased.
  • the tag antenna of the IC tag is in contact at two different places on one patch conductor or the other patch conductor, so that part of the current flowing on the patch conductor on one side due to resonance is on the IC tag side.
  • the patch conductor is strongly excited by the IC tag, and the other patch conductor is excited by the radiated electric field from the IC tag, thereby increasing the sensitivity of the wireless IC tag device.
  • the tag antenna of the IC tag is formed on the upper side or the lower side of the patch conductor in addition to the same plane as the patch conductor.
  • the patch conductor and the tag antenna of the IC tag can be formed simultaneously.
  • the IC tag is formed on the upper side of the patch conductor, by providing a printable surface on the upper part of the IC tag, when printing characters or the like, there is an effect that printing is easy.
  • the IC tag is formed below the patch conductor, there is an effect that a circuit portion such as an IC is protected by the patch conductor.
  • the substrate or the ground conductor is detachable, if the object to which the wireless IC tag device is attached has a metal surface, it can be used as the ground conductor.
  • the object to which the wireless IC tag device is attached can be used as a dielectric substrate and a metal foil tape or the like can be used as a ground conductor, the structure can be simplified.
  • FIG. 1 is a plan view showing a wireless IC tag device 1A1 according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view taken along a section line II-II in FIG.
  • FIG. 3A is a plan view showing wireless IC tag devices 1A2 to 1A5 of other second to fifth embodiments similar to the wireless IC tag device 1A1 of the first embodiment of the present invention, and
  • FIG. 3A (1) is a wireless IC tag of the second embodiment.
  • 3A (2) shows the wireless IC tag device 1A3 of the third embodiment
  • FIG. 3 (3) shows the wireless IC tag device 1A4 of the fourth embodiment, and
  • FIG. 3A (4) shows the fifth embodiment.
  • the wireless IC tag device 1A5 is shown.
  • FIG. 3B is a cross-sectional view of the structure of the wireless IC tag device similar to the first embodiment of the present invention
  • FIG. 3B (1) shows the cross-sectional structure of the wireless IC tag device 1B1
  • FIG. 3B (2) is the wireless IC tag.
  • a cross-sectional structure of the device 1B2 is shown
  • FIG. 3B (3) shows a cross-sectional structure of the wireless IC tag device 1B3.
  • It is a top view which shows the radio
  • FIG. 5 is a cross-sectional view taken along the section line VV in FIG. 4.
  • FIG. 5 is a cross-sectional view taken along the section line VV in FIG. 4.
  • FIG. 6A is a cross-sectional view of the structure of a wireless IC tag device similar to Embodiment 6 of the present invention.
  • FIG. 6A (1) shows the cross-sectional structure of the wireless IC tag device 1C2
  • FIG. 6A (2) is the wireless IC tag.
  • a cross-sectional structure of the device 1C3 is shown
  • FIG. 6A (3) shows a cross-sectional structure of the wireless IC tag device 1C4. It is a top view which shows radio
  • FIG. 6B is a cross-sectional view taken along section line VIC-VIC in FIG. 6B. It is a top view which shows the radio
  • FIG. 6D is a cross-sectional view taken along section line VIE-VIE in FIG. 6D.
  • FIG. It is a top view which shows the radio
  • FIG. 8 is a cross-sectional view taken along section line VIII-VIII in FIG. It is a top view which shows 1 G of radio
  • FIG. 10 is a cross-sectional view taken along the section line XX of FIG. 9. It is a top view which shows the radio
  • FIG. 12 is a cross-sectional view taken along section line XII-XII in FIG. FIG.
  • FIG. 13A is a plan view showing wireless IC tag devices 1H2 to 1H4 of other embodiments 12 to 14 similar to the wireless IC tag device 1H1 of embodiment 11 of the present invention
  • FIG. 13A (1) is a wireless IC tag of the embodiment 12.
  • FIG. 13A (2) shows the wireless IC tag device 1H3 of the thirteenth embodiment
  • FIG. 13A (3) shows the wireless IC tag device 1H4 of the fourteenth embodiment.
  • FIG. 13B is a view showing a structure of a wireless IC tag device similar to the eleventh embodiment of the present invention from a cross section
  • FIG. 13B (1) shows a cross-sectional structure of the wireless IC tag device 1I1
  • FIG. FIG. 13B (3) shows a cross-sectional structure of the wireless IC tag device 1I3.
  • FIG. 15 is a cross-sectional view taken along the section line XV-XV in
  • FIG. 1 is a plan view showing a wireless IC tag device 1A1 according to Embodiment 1 of the present invention
  • FIG. 2 is a cross-sectional view taken along the section line II-II in FIG.
  • the wireless IC tag device 1A1 according to the present embodiment includes a patch antenna 3 including a flat substrate 2 made of a dielectric and two patch conductors 3a and 3b formed on one main surface 2a of the substrate 2. And a ground conductor 4 formed on the entire other main surface 2 b of the substrate 2, and an IC tag 5.
  • the IC tag 5 is integrally formed on the patch conductors 3a and 3b and one main surface 2a of the substrate 2 on the same plane.
  • the substrate 2 is preferably made of a material with a low loss of electromagnetic energy, that is, a low dielectric loss tangent tan ⁇ in the communication frequency band. .
  • the value of the dielectric loss tangent tan ⁇ is preferably 0.02 or less, for example.
  • a dielectric substrate as exemplified below can be used.
  • dielectric base material examples include polypropylene, polyethylene terephthalate (PET), polyimide, glass epoxy substrate, and fluororesin substrate.
  • the patch antenna 3 formed on the one main surface 2a of the substrate 2 and the ground conductor 4 formed on the other main surface 2b of the substrate 2 constitute a radio wave polarization conversion resonant reflector.
  • a radio wave polarization conversion resonant reflector effectively acts on a linearly polarized signal in which the axial ratio of elliptically polarized waves is infinite.
  • the IC tag 5 includes a tag antenna 51 formed on the substrate 2 and a tag IC (Integrated Circuit) 52 which is a circuit unit mounted on the feeding point.
  • the IC tag 5 is preferably arranged so that the radiated electric field is parallel to the resonance axes of the patch conductors 3a and 3b.
  • the two patch conductors 3a and 3b serving as radio wave radiating conductors have a length L that is approximately 1 ⁇ 2 wavelength in terms of the effective wavelength on the dielectric in the length direction X, and in a direction Y perpendicular to the length direction X. They are close to each other with a distance d and are arranged in an electrically non-contact state.
  • the two patch conductors 3a and 3b have concave portions 6a and 6b that are recessed from the edges close to each other on a plane parallel to the paper surface of FIG. 1, and the concave portions 6a and 6b of the main surface 2a.
  • the IC tag 5 is disposed in the area between them, and an electromagnetic field radiated from at least one of the two patch conductors 3a and 3b is received by the tag antenna 51 of the IC tag 5.
  • the concave portions 6a and 6b of the patch conductors 3a and 3b have a longer current path because the current flowing through the edge portion of the patch is bypassed, and are longer than the electrical length with respect to the length L of the patch conductors 3a and 3b. Therefore, in the patch conductors 3a and 3b provided with the concave portions 6a and 6b, the length L needs to be shortened to be the same as the resonance frequency with respect to the length L.
  • the IC tag 5 is surrounded by two patch conductors 3a and 3b.
  • the IC tag 5 is activated, and the electromagnetic field component radiated from the IC tag 5 is effectively combined with the patch conductors 3a and 3b. Electromagnetic radiation is reduced.
  • the interval d between the patch conductors 3a and 3b is sufficiently shorter than a half wavelength of the signal frequency (or communication frequency). Therefore, by adopting the structure shown in FIG. 1 and FIG. 2, high sensitivity can be achieved with a simple configuration, and the dimension shape in the length direction X of the wireless IC tag device 1A1 can be reduced. . In particular, when the IC tag 5 is strongly electromagnetically coupled to the two patch antennas 3a and 3b, the sensitivity becomes higher.
  • either one or both of the two patch conductors 3a and 3b on the substrate 2 are connected to the patch conductors 3a and 3b.
  • Other patch conductors different from each other may be formed close to and outside the one patch conductor 3a or the other patch conductor 3b.
  • the IC tag 5 is arranged so that the antenna major axis of the tag antenna 51 is parallel to the axis parallel to the length direction X. Note that both end portions of the IC tag 5 (both end portions in the length direction X) are arranged on the patch conductors 3a and 3b as viewed from above the patch conductors 3a and 3b according to the form of the tag antenna 51. Alternatively, the patch conductors 3a and 3b may be arranged so as not to overlap.
  • the position of the IC tag 5 is arranged such that the tag antenna 51 can efficiently receive the electric field radiated simultaneously with the resonance of at least one of the patch conductors 3a and 3b.
  • positioning position of IC tag 5 so that the communication sensitivity of wireless IC tag apparatus 1A1 may become the maximum.
  • the two patch conductors 3a and 3b become open boundaries at both ends of the resonance axis parallel to the length direction X, and the length L of each patch conductor 3a and 3b is used on one main surface 2a of the substrate 2. It is set to approximately 1 ⁇ 2 of the equivalent wavelength ⁇ f with respect to the signal frequency f. At this time, the two patch conductors 3a and 3b are accompanied by plane resonance near the resonance frequency f0. As will be described later, in order to increase the bandwidth of the wireless IC tag device 1A1, the equivalent electrical lengths of the two patch conductors 3a and 3b are made different and set to different resonance frequencies.
  • the radio wave polarization conversion resonant reflector constituted by the two patch conductors 3a and 3b and the ground conductor 4 formed on the substrate 2 in the length direction X arriving with respect to the two patch conductors 3a and 3b. It effectively resonates with respect to the linearly polarized signal component having the electric field E.
  • the incoming signal wave resonates in the two patch conductors 3a and 3b, a strong electromagnetic field is generated in the vicinity thereof, and the electric field E is radiated simultaneously with the resonance.
  • the radiated electric field E is directed upward in a direction perpendicular to the surfaces of the patch conductors 3a and 3b (a direction perpendicular to the paper surface of FIG. 1), and in a lateral direction and a diagonally upward direction parallel to the surfaces of the patch conductors 3a and 3b. Re-radiated.
  • a strong electromagnetic field is distributed in the same direction between the one patch conductor 3a and the other patch conductor 3b.
  • the electric field E radiated by each resonance of the two patch conductors 3a and 3b is generated when the IC tag 5 is disposed, and the tag antenna of the IC tag 5 is caused by the strong resonance electric field accompanying the resonance by the two patch conductors 3a and 3b.
  • a strong current is induced in 51, and radio waves accompanied by information of the tag IC 52 are radiated by their mutual electromagnetic coupling.
  • the wireless IC tag device 1A Using the wireless IC tag device 1A1, it is possible to build a mobile object identification (Radio Frequency Identification; abbreviated RFID) system composed of a reader, a reader antenna, and the wireless IC tag device 1A1.
  • RFID Radio Frequency Identification
  • the RFID operation will be described below.
  • the signal wave sent from the reader resonates in plane with the two patch conductors 3a and 3b.
  • a resonant electromagnetic field is generated by this plane resonance, and at the same time, a resonant electromagnetic field is radiated.
  • the radiated electric field E acts on the tag antenna 51 of the IC tag 5 arranged along the radiation direction, and generates a current in the tag antenna 51.
  • the radiated electric fields from the two independent patch conductors 3a and 3b are captured and added on both sides of the single tag antenna 51, so that the current flowing in the tag antenna 51 is the patch conductor 3a. , 3b is stronger than in the case of one.
  • the current flowing in the tag antenna 51 acts on the rectifier in the tag IC 52 and generates a driving voltage for the tag IC 52.
  • the tag IC 52 is activated, and the current flowing in the tag antenna 51 is modulated by the information signal in the memory.
  • the signal current accompanied with the modulation by the tag antenna 51 generates a radiation electric field E parallel to the tag antenna 51 and radiates radio waves.
  • the modulated signal wave radiated from the IC tag 5 in this way is sent to the reader antenna via the patch conductors 3a and 3b.
  • the reader receives and demodulates this signal wave, and the memory information in the IC tag 5 is recognized.
  • the wireless IC tag device 1A1 in the RFID operation, the signal wave sent from the reader gives a stronger signal wave to the IC tag 5 due to resonance by the two patch conductors 3a and 3b. Therefore, the communication sensitivity can be increased and the communication distance can be extended.
  • the two patch conductors 3a and 3b are formed on the one main surface 2a of the substrate 2 in an electrically non-contact state, but there are various other forms of arrangement of the patch conductors 3a and 3b. Can be considered. Specifically, for example, three or more patch conductors are formed in an electrically non-contact state on the one main surface 2a of the substrate 2, and the electric field E radiated simultaneously with the resonance of the three or more patch conductors.
  • the IC tag 5 can be arranged at a position where the tag antenna 51 can efficiently receive the signal.
  • the radiated electric field of the IC tag 5 can be effectively coupled to the patch antenna 3, and the wireless IC Unnecessary electromagnetic radiation of the tag 5 can be reduced and sensitivity can be increased.
  • the resonance frequency f0 is adjusted by changing the electrical length of the two opposing patch conductors 3a and 3b and changing the resonance frequency f0 of the two patch conductors 3a and 3b according to the position of the interval d and the shape of the concave portions 6a and 6b. Therefore, it is possible to increase the bandwidth.
  • the electromagnetic coupling between the two patch conductors 3a and 3b and the IC tag 5 has been described. However, depending on the distance d, the electromagnetic coupling occurs between the two patch conductors 3a and 3b. Broadband and high sensitivity can be achieved.
  • the patch conductors 3a and 3b with the concave portions 6a and 6b, unnecessary radiation is reduced, and the equivalent electrical length of the patch conductors 3a and 3b is lengthened, and the patch conductors 3a and 3b are changed by the amount of the change.
  • the length in the X direction By reducing the length in the X direction, the size of the wireless IC tag device 1A1 can be reduced.
  • the patch antenna 3 having the patch conductors 3a and 3b and the IC tag 5 can be formed in the same plane, the manufacturing method is easy, and the wireless IC tag device 1A1 is provided. The production efficiency when producing in large quantities can be greatly improved.
  • the concave portions are provided on one side of the long sides of the patch conductors 3a and 3b. Good.
  • FIG. 3A is a plan view showing wireless IC tag devices 1A2 to 1A5 of other embodiments 2 to 5 similar to wireless IC tag device 1A1 of embodiment 1 of the present invention
  • FIG. 3A (1) is a second embodiment.
  • 3A (2) shows the wireless IC tag device 1A3 of the third embodiment
  • FIG. 3A (3) shows the wireless IC tag device 1A4 of the fourth embodiment
  • FIG. 3A (4) show wireless IC tag apparatus 1A5 of Embodiment 5.
  • FIG. Note that portions corresponding to those of the first embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • the wireless IC tag device 1A2 of Embodiment 2 shown in FIG. 3A (1) has a structure in which the IC tag 5 includes a gap and overlaps with the patch conductor 3b on one side.
  • the wireless IC tag device 1A3 of Embodiment 3 shown in FIG. 3A (2) has a structure in which the IC tag 5 includes a gap and overlaps with the patch conductors 3a and 3b on both sides.
  • the wireless IC tag device 1A4 of the fourth embodiment shown in FIG. 3A (3) the IC tag 5 is disposed in the concave portion 6b of the patch conductor 3b on one side, and is combined with one patch conductor 3a having no concave portion 6a. Structure.
  • the IC tag 5 is disposed in the concave portion 6b of the patch conductor 3b on one side, and is combined with one patch conductor 3a having the concave portion 6a. Structure.
  • the IC tag 5 is disposed above the patch conductors 3a and 3b.
  • the present invention is not limited to this, and the IC tag 5 is attached to each patch conductor as shown in FIG. You may arrange
  • the two patch conductors 3a and 3b and the IC tag 5 there are various methods for forming the two patch conductors 3a and 3b and the IC tag 5.
  • the IC tag 5 may be provided on the same plane with respect to the patch conductors 3a and 3b, or may be provided on the upper side or the lower side of the patch conductors 3a and 3b.
  • the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 may be brought into electrical contact or may be in non-contact.
  • the tag IC 52 may be mounted by attaching the IC tag 5 to the patch conductors 3a and 3b, or directly forming the tag antenna 51 on the patch conductors 3a and 3b by printing or vapor deposition.
  • the patch conductors 3a and 3b and the tag antenna 51 can be formed of a single conductor, and the tag IC 52 can be mounted.
  • a dielectric film or a dielectric sheet may be sandwiched between the patch conductors 3 a and 3 b and the IC tag 5.
  • the IC tag 5 and the patch conductors 3a and 3b may be coated with a dielectric material.
  • FIG. 3B explains the difference in structure according to the embodiment of the present invention from a cross-sectional view.
  • the wireless IC tag device 1B1 shown in FIG. 3B (1) has a structure in which the IC tag 5 is arranged above the patch conductors 3a and 3b.
  • the wireless IC tag device 1B2 shown in FIG. 5 is a structure arranged below the patch conductors 3a and 3b.
  • the IC tag 5 is arranged on the same plane as the patch conductors 3a and 3b. Structure.
  • the patch conductors 3a and 3b and the IC tag 5 are formed on the same plane, the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 can be simultaneously formed on the substrate 2.
  • printing is easy when printing characters or the like.
  • the IC tag 5 is formed below the patch conductors 3a and 3b, there is an effect that the tag IC 52 which is a circuit portion is protected by the patch conductors 3a and 3b.
  • FIG. 4 is a modification of FIG. 1, and is a plan view showing a wireless IC tag device 1C1 according to Embodiment 6 of the present invention.
  • FIG. 5 is a cross-sectional view taken along the section line VV of FIG. is there. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • the present embodiment is particularly aimed at miniaturization of a wireless IC tag device.
  • the short sides 4a and 4b of the ground conductor 4 are extended upward on one side of the substrate 2 and connected to the ends of the patch conductors 3a and 3b.
  • the length of each of the patch conductors 3a and 3b is approximately a half of the half wavelength and becomes a quarter wavelength.
  • the IC tag 5 is disposed on the same plane as the patch conductors 3a and 3b.
  • the patch conductors 3a and 3b and the ground conductor 4 are short-circuited along the Y-axis direction at the central point P of each of the patch conductors 3a and 3b to increase the patch conductor length.
  • the wireless IC tag device can be further reduced in size.
  • FIG. 6A is a cross-sectional view showing a difference in structure of a wireless IC tag device similar to Embodiment 6 of the present invention.
  • the wireless IC tag device 1C2 shown in FIG. 6A (1) the short sides 4a and 4b of the ground conductor 4 are connected to one end in the length direction X of each patch conductor 3a and 3b, and the IC tag 5 is
  • the wireless IC tag device 1C3 shown in FIG. 6A (2) has a structure in which at least one of the patch conductors 3a and 3b is arranged, and the short side portions 4a and 4b of the ground conductor 4 are connected to each patch conductor 3a.
  • 3b is connected to one end in the length direction X, and the IC tag 5 is disposed below either one of the patch conductors 3a, 3b, and the wireless IC tag shown in FIG. 6A (3)
  • the short sides 4a and 4b of the ground conductor 4 are connected to one end in the longitudinal direction X of the patch conductors 3a and 3b, and the IC tag 5 is flush with the patch conductors 3a and 3b. It is a structure arranged in.
  • the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 may be electrically contacted or non-contacted.
  • the IC tag 5 is attached to the patch conductors 3a and 3b, or the tag antenna 51 is attached to the patch conductors 3a and 3b.
  • the tag IC 52 may be mounted by directly forming by printing or vapor deposition.
  • a dielectric film or a dielectric sheet may be sandwiched between the patch conductors 3 a and 3 b and the IC tag 5.
  • the IC tag 5 and the patch conductors 3a and 3b may be coated with a dielectric material.
  • the patch conductors 3a and 3b and the IC tag 5 can be integrally formed by conductor printing or the like.
  • FIG. 6B is a plan view showing a wireless IC tag device 1D according to another embodiment 7 of the present invention aimed at miniaturization
  • FIG. 6C is a cross-sectional view taken along the section line VIC-VIC of FIG. 6B.
  • portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • the wireless IC tag device 1D of the present embodiment since the equivalent electrical length of the patch conductors 3a and 3b is approximately ⁇ g / 4, the short sides 4a and 4b of the ground conductor 4 are extended, and the short length of the ground conductor 4 is reduced.
  • the side portions 4a and 4b are formed on the patch conductors 3a and 3b side.
  • the ends of the two patch conductors 3a and 3b are connected to the ground conductor 4 on the same plane, but as described above, the short side portions 4a and 4b of the patch conductors 3a and 3b have zero resonance voltage. Therefore, the effect of the two patch conductors 3a and 3b is the same as that of the two independent patch conductors.
  • the tag attenuator 51 of the IC tag 5 is connected to the patch conductor 3b without the concave portion 6b on one side, and the patch conductors 3a and 3b are connected to each other at one end in the length direction X.
  • the tag antenna 51 is formed in contact with and electrically connected to the one-side patch conductor 3b on the same plane as the one-side patch conductor 3b or on the upper side or the lower side.
  • the conductor portion of the tag antenna 51 of the IC tag 5 and the patch conductors 3a and 3b are attached with a conductive material, thermocompression bonded, the tag antenna 51 is printed on the patch conductors 3a and 3b, or the vapor deposition method.
  • the tag IC 52 may be mounted directly.
  • the tag antenna 51 and the patch conductors 3a and 3b can be integrally formed with the same conductor.
  • FIG. 6D is a plan view showing a wireless IC tag device 1E according to another embodiment 8 of the present invention
  • FIG. 6E is a cross-sectional view taken along section line VIE-VIE of FIG. 6D. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • each patch conductor 3a, 3b is connected to one short side portion of the ground conductor 4 by through-hole conductors 53a, 53b formed on one short side portion of the substrate 2.
  • the tag antenna 51 of the IC tag 5 is connected to the patch conductor 3b on one side.
  • the difference between the wireless IC tag device 1D of FIG. 6B and the wireless IC tag device 1E of FIG. 6D is that, in the wireless IC tag device 1E of FIG. 6D, a ground conductor 4 like the wireless IC tag device 1D of FIG.
  • the gap d between the patch conductors 3a and 3b is not formed in the same plane as 3a and 3b, and is formed up to both ends in the length direction X of the patch conductors 3a and 3b.
  • two patch conductors 3a and 3b having an equivalent electrical length of approximately ⁇ g / 4 and the ground conductor 4 are individually connected through the through-hole conductors 53a and 53b.
  • one through-hole conductor may be used, but in the wireless IC tag device 1E in FIG. 6D, two are required.
  • the two patch conductors 3a and 3b can be used as equivalent electrical lengths up to the thickness of the substrate 2, so that the device is smaller.
  • the thickness of the substrate 2 also operates as an antenna, and the radio wave radiation characteristics can be deflected as necessary.
  • FIG. 7 is a plan view showing the wireless IC tag device 1F according to the ninth embodiment of the present invention
  • FIG. 8 is a cross-sectional view taken along the section line VIII-VIII in FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • one patch conductor 3a on one main surface 2a of the substrate 2, of the two patch conductors 3a and 3b facing each other with the gap d therebetween, one patch conductor 3a has the convex portion 21 and faces each other.
  • the other patch conductor 3b has the concave portion 6b.
  • a ground conductor 4 is provided on the other main surface 2b of the substrate 2, and the IC tag 5 is disposed so as to be sandwiched between the convex portion 21 and the concave portion 6b.
  • Such a radiation electric field of the IC tag 5 is arranged to be parallel to the resonance axis of the patch conductors 3a and 3b, that is, to be parallel to the length direction X.
  • the patch conductors 3a and 3b and the electric field radiation of the mounting portion of the tag IC 52 having a strong radiation field of the IC tag 5 are efficiently coupled, and the shape of the patch conductors 3a and 3b is obtained. Since it has an uneven portion, the equivalent electrical lengths of the two patch conductors 3a and 3b can be made different to obtain a wider frequency band.
  • FIG. 9 is a plan view showing the wireless IC tag device 1G according to the tenth embodiment of the present invention
  • FIG. 10 is a cross-sectional view taken along the section line XX of FIG.
  • the concave portions 6a and 6b respectively having convex portions 21 and 22 are provided on the edge portions of the patch conductors 3a and 3b facing each other so as to approach the antenna shape of the tag antenna 51 of the IC tag 5. It is formed.
  • the radiated electric field of the IC tag 5 is arranged so as to be parallel to the resonance axis of each patch conductor 3a, 3b, that is, the length direction X.
  • the concave portions 6a and 6b of the patch conductors 3a and 3b are formed close to each other along the shape of the tag antenna 51, so that the radiation field of the IC tag 5 is efficiently coupled.
  • the patch conductors 3a and 3b have the concave portions 6a and 6b including the convex portions 21 and 22, there is an effect that a wider frequency band can be obtained.
  • unnecessary voids are reduced on the surfaces of the patch conductors 3a and 3b and the area of the patch conductors 3a and 3b can be effectively used, the sensitivity of the entire wireless IC tag device 1G can be increased.
  • FIG. 11 is a plan view showing the wireless IC tag device 1H1 according to the eleventh embodiment of the present invention
  • FIG. 12 is a cross-sectional view taken along the section line XII-XII of FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • each tag antenna 51 of the IC tag 5 contacts at two places different from the other patch conductor 3b.
  • the radiation field of the IC tag 5 is arranged to be parallel to the resonance axes of the patch conductors 3a and 3b.
  • the tag antenna 51 of the IC tag 5 is in contact at two different locations on the other patch conductor 3b, so that a part of the current flowing on the other patch conductor 3b due to resonance is directly applied. Since the current flows to the IC tag 5 side, the other patch conductor 3b is strongly excited, and one patch conductor 3a is also mutually excited by the radiated electric field from the IC tag 5, thereby increasing the sensitivity of the wireless IC tag device 1H1.
  • the patch conductors 3a and 3b and the IC tag 5 can be integrally formed of the same conductor.
  • FIG. 13A is a plan view showing wireless IC tag devices 1H2 to 1H4 of other embodiments 12 to 14 similar to the wireless IC tag device 1H1 of embodiment 11 of the present invention
  • FIG. 13A (2) shows the wireless IC tag device 1H3 of the thirteenth embodiment
  • FIG. 13A (3) shows the wireless IC tag device 1H4 of the fourteenth embodiment. Note that portions corresponding to the above-described eleventh embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • each end of the tag antenna 51 of the IC tag 5 is in contact with the patch conductor 3b on one side, and a part of the tag antenna 51 is partially
  • the wireless IC tag device 1H3 according to the thirteenth embodiment shown in FIG. 13A (2) has a structure that is disposed in the concave portion 6a of one patch conductor 3a and is combined with one patch conductor 3a having the concave portion 6a.
  • 5 has a structure in which each end portion of the tag antenna 51 is in contact with the patch conductor 3b on one side and is combined with one patch conductor 3a without the concave portion 6a.
  • each end of the tag antenna 51 of the IC tag 5 is in contact with the patch conductor 3b on one side and is disposed in the concave portion 6b.
  • This is a structure combined with one patch conductor 3a having the portion 6a.
  • FIG. 13B is a cross-sectional view showing a difference in structure of the wireless IC tag device similar to the eleventh embodiment of the present invention.
  • the wireless IC tag device 1I1 shown in FIG. 13B (1) has a structure in which each end portion of the tag antenna 51 of the IC tag 5 arranged on the upper side of each patch conductor 3a, 3b is connected to the patch conductor 3b on one side.
  • the wireless IC tag device 1I2 shown in FIG. 13B (2) has a structure in which each end portion of the tag antenna 51 of the IC tag 5 arranged below the patch conductors 3a and 3b is connected to the patch conductor 3b on one side.
  • each end of the tag antenna 51 of the IC tag 5 arranged on the same plane as the patch conductors 3a and 3b is connected to the patch conductor 3b on one side. It is a structured.
  • the patch conductors 3a and 3b and the IC tag 5 are formed on the same plane, the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 can be created at the same time. Further, by having a printable surface on the top of the IC tag 5, printing is easy when printing characters or the like. Further, when the IC tag 5 is formed below the patch conductors 3a and 3b, there is an effect that the circuit portions such as the tag IC 52 are protected by the patch conductors 3a and 3b.
  • FIG. 14 is a plan view showing a wireless IC tag device 1J according to another embodiment 15 of the present invention
  • FIG. 15 is a cross-sectional view taken along section line XV-XV in FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • the tag antenna 51 of the IC tag 5 is connected to the other patch conductor 3b having no unevenness.
  • a meander line antenna type tag as an IC tag
  • a tag using a folded dipole antenna or a loop antenna, or a minute dipole or minute loop type is used as an IC tag.
  • Various IC tags may be used as long as they have a linearly polarized radiation component, such as a tag that is modified by applying an antenna and a tag that uses a bow-tie antenna.
  • a wireless IC tag device suitable for a linearly polarized signal has been shown, but it may be used for a circularly polarized signal.
  • the present invention is not limited to this, and the present invention can also be applied as a form suitable for receiving and transmitting circularly polarized signals.
  • two patch conductors 3a and 3b formed on one main surface 2a of the substrate 2 are notched (chamfered) in a pair of corner portions (diagonal portions) facing each other in a substantially square shape.
  • At least one of the substrate 2 or the ground conductor 4 may be configured to be detachably bonded to the two patch conductors 3a and 3b and the IC tag 5 with an adhesive or the like.
  • the substrate 2 or the ground conductor 4 is detachable, when the object to which the wireless IC tag device is attached has a metal surface, it can be used as the ground conductor 4. Further, since the object to which the wireless IC tag device is attached can be used as the dielectric substrate 2 and a metal foil tape or the like can be used as the ground conductor 4, the structure can be simplified.

Landscapes

  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

Selon l'invention, une antenne à plaque comprenant deux corps conducteurs à plaque (3a, 3b) est placée sur une surface principale (2a) d'un substrat (2), lesdits corps conducteurs à plaque ayant une résonance plane à un intervalle (d) entre eux, et un conducteur de masse est placé sur l'autre surface principale (2b) du substrat (2). Au moins dans l'un des deux corps conducteurs à plaque (3a, 3b), une partie en retrait (6b) est formée en retrait d'une partie d'extrémité faisant face à l'autre corps conducteur à plaque (3b). Une étiquette à circuit intégré (CI) (5) est placée au moins sur une partie d'une région, qui est exposée par la partie en retrait (6b) de la première surface principale (2a) du substrat (2), et/ou une partie d'une région entre la partie en retrait (6b) et l'autre corps conducteur à plaque (3b), de manière qu'un fort champ électrique de rayonnement soit généré le long d'un axe de résonance de l'antenne à plaque. Avec une telle configuration, le champ électrique de rayonnement de l'étiquette CI (5) est efficacement couplé électromagnétiquement aux corps conducteurs à plaque, un rayonnement non nécessaire entre les corps conducteurs à plaque (3a, 3b) provenant de l'étiquette CI (5) est supprimé, et un appareil à étiquette CI sans fil peut être fabriqué simplement au moyen d'un montage en surface.
PCT/JP2012/084117 2012-12-28 2012-12-28 Appareil à étiquette ci sans fil WO2014103025A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/084117 WO2014103025A1 (fr) 2012-12-28 2012-12-28 Appareil à étiquette ci sans fil

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Application Number Priority Date Filing Date Title
PCT/JP2012/084117 WO2014103025A1 (fr) 2012-12-28 2012-12-28 Appareil à étiquette ci sans fil

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Publication Number Publication Date
WO2014103025A1 true WO2014103025A1 (fr) 2014-07-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108767469A (zh) * 2018-07-10 2018-11-06 成都爱为贝思科技有限公司 一种双开路并联谐振近距离通信天线
EP3710988A4 (fr) * 2017-11-16 2021-06-30 Confidex Oy Transpondeur rfid

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005303528A (ja) * 2004-04-08 2005-10-27 Hidekazu Ogawa 電波偏波変換共振反射器、電波偏波変換共振反射装置、無線通信システム、金属対応無線ｉｃタグ装置、物品及びｒｆｉｄシステム
JP2008067342A (ja) * 2006-08-09 2008-03-21 Fujitsu Ltd Ｒｆｉｄタグ及びその製造方法
JP2008187601A (ja) * 2007-01-31 2008-08-14 Fujitsu Ltd Ｒｆｉｄタグ
WO2009013817A1 (fr) * 2007-07-25 2009-01-29 Fujitsu Limited Marqueur sans fil

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005303528A (ja) * 2004-04-08 2005-10-27 Hidekazu Ogawa 電波偏波変換共振反射器、電波偏波変換共振反射装置、無線通信システム、金属対応無線ｉｃタグ装置、物品及びｒｆｉｄシステム
JP2008067342A (ja) * 2006-08-09 2008-03-21 Fujitsu Ltd Ｒｆｉｄタグ及びその製造方法
JP2008187601A (ja) * 2007-01-31 2008-08-14 Fujitsu Ltd Ｒｆｉｄタグ
WO2009013817A1 (fr) * 2007-07-25 2009-01-29 Fujitsu Limited Marqueur sans fil

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3710988A4 (fr) * 2017-11-16 2021-06-30 Confidex Oy Transpondeur rfid
CN108767469A (zh) * 2018-07-10 2018-11-06 成都爱为贝思科技有限公司 一种双开路并联谐振近距离通信天线
CN108767469B (zh) * 2018-07-10 2024-05-14 成都爱为贝思科技有限公司 一种双开路并联谐振近距离通信天线

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