WO2014103025A1 - Wireless ic tag apparatus - Google Patents

Wireless ic tag apparatus Download PDF

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Publication number
WO2014103025A1
WO2014103025A1 PCT/JP2012/084117 JP2012084117W WO2014103025A1 WO 2014103025 A1 WO2014103025 A1 WO 2014103025A1 JP 2012084117 W JP2012084117 W JP 2012084117W WO 2014103025 A1 WO2014103025 A1 WO 2014103025A1
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WO
WIPO (PCT)
Prior art keywords
tag
patch
wireless
conductor
antenna
Prior art date
Application number
PCT/JP2012/084117
Other languages
French (fr)
Japanese (ja)
Inventor
智三 太田
津田　裕彦
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to PCT/JP2012/084117 priority Critical patent/WO2014103025A1/en
Publication of WO2014103025A1 publication Critical patent/WO2014103025A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/28—Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
    • H01Q9/285—Planar dipole
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith

Definitions

  • the present invention relates to a wireless IC tag device used for radio frequency identification (abbreviated as RFID).
  • RFID radio frequency identification
  • Wireless communication technology is applied not only in the field of information communication but also in fields such as logistics management, and IC tags for wireless communication (hereinafter referred to as “IC tags”) are widely known as products that play a role in RFID technology. ing. Since there are various uses for physical distribution management and inexpensive information storage media, wireless communication devices are placed in various usage environments.
  • An IC tag is composed of a tag IC as a circuit unit that stores data such as an identification number and controls wireless communication, and a tag antenna for transmitting and receiving radio waves, and has a great advantage that it can be realized thinly and lightly. ing.
  • Such an IC tag is not provided with a power source, but is a passive IC tag that drives a tag IC by radio wave power, and a semi-passive IC that is provided with a power source that drives the tag IC and reflects and modulates transmission radio waves for communication.
  • There is an active IC tag that includes a tag and a power source and can transmit by itself. In terms of frequency, there are a 13 MHz band that uses electromagnetic induction and is mainly used at a short distance, a 900 MHz band that uses a radio wave and a long communication distance, and a 2.45 GHz band.
  • the above-mentioned passive IC tag generates power from the transmission radio wave, the tag IC is activated using the power, and transmits data by reflecting and modulating the transmission radio wave.
  • IC tags using radio waves include those in which a dipole antenna is formed on a dielectric and the tag IC is connected, and meander type in which the transmission line is repeatedly bent to shorten its length.
  • a patch conductor having an electrical length of 1 ⁇ 2 wavelength on the dielectric hereinafter, 1 ⁇ 2 wavelength is 1 ⁇ 2 wavelength of the electrical length on the dielectric
  • An IC tag such as a patch antenna type is well known in which a ground conductor is formed on the other main surface and a tag IC provided between one patch conductor and the other ground conductor is fed.
  • a wireless IC tag device in which an IC tag is connected between a tag antenna and a ground conductor using a 1 ⁇ 2 wavelength microstrip line resonator. Since this wireless IC tag device has an IC tag between a grounding conductor on the side facing the tag antenna via a dielectric, manufacturing is complicated, but even if the grounding conductor side is attached to a metal body or the like Basically, communication can be performed without affecting radio wave radiation. Therefore, effective communication is possible for a linearly polarized radio signal having an electric field parallel to the length direction of the half-wavelength antenna (see, for example, Patent Document 1).
  • Patent Document 2 Another prior art for solving such a problem is described in Patent Document 2, for example.
  • the wireless IC tag device includes a plurality of patch conductors that resonate in plane at a resonance frequency and a wireless IC tag, and the wireless IC tag is disposed between one main surface or the other main surface of the two patch conductors or between the patch conductors. ing.
  • the two patch conductors are disposed in an electrically non-contact state, and the wireless IC tag is disposed at a position where the tag antenna can receive an electric field radiated simultaneously with the resonance of the two patch conductors.
  • the incoming wireless signal undergoes plane resonance with the two patch conductors, and at the same time, a strong electric field radiated enters the tag antenna of the wireless IC tag, and a current is generated in the tag antenna, giving start power to the wireless IC tag.
  • communication is possible.
  • grounding conductor is formed on the other main surface of the board, there is no emission of radio waves or electric fields on the grounding conductor side, and the grounding conductor side of the board can be easily mounted on the object to be mounted. With this configuration, an IC tag device that can be mounted on an object made of metal is realized.
  • JP 2000-332523 A Japanese Patent No. 4428865
  • the wireless IC tag is electromagnetically coupled to the patch conductor at the position where the radiated electric field is the largest at the end portions in the length direction of the two patch conductors, but the optimum position of the wireless IC tag is between the patch conductors. In some cases, the distance between the patch conductors may be large.
  • a disturbance component of electromagnetic field radiation generated in the vicinity of the wireless IC tag due to the arrangement of the wireless IC tag is caused by a lateral direction perpendicular to the wireless IC tag between the two patch conductors. That is, an unnecessary signal wave is emitted in the short side direction of the substrate, the radiation efficiency in the front direction of the wireless IC tag device is lowered, and the unnecessary radiation increases as the distance between the two patch conductors increases. is there.
  • the wireless IC tag since the wireless IC tag is arranged on the patch conductor, it has a three-dimensional structure, and the entire tag becomes thick. When a thin tag device is required, it is very important to form the wireless IC tag and the patch conductor in a plane.
  • the object of the present invention is to improve the radiation efficiency, make it possible to reduce the thickness, reduce the size with a simple configuration, can also divert general various wireless IC tags, and can also be applied to metal objects, etc. Is to provide a wireless IC tag device.
  • the present invention includes an IC tag having a circuit portion and a tag antenna; A dielectric substrate; A patch conductor provided on one main surface of the substrate; A ground conductor provided on the other main surface of the substrate, The patch conductor includes at least two patch antennas that resonate in plane at a resonance frequency; The patch antenna is opposed to each other with a gap, and has a concave cut region including the gap on one side or both sides, The IC tag is at least partially in the cut region, the radiation field component of the IC tag and the resonance axis of the patch conductor are parallel, and the IC tag is not in electrical contact with the patch conductor or The wireless IC tag device is configured to be in contact with any one of the patch conductors.
  • the ground conductor is formed to extend to one end portion of the patch conductor surface, and the patch conductors are connected to ones each having an electrical length of approximately 1 ⁇ 2.
  • a concave portion is formed in one of the patch antennas, and the other patch antenna has a convex portion that is partially fitted into the concave portion.
  • the patch antenna is formed at least partially close to the shape of the tag antenna of the IC tag.
  • the IC tag is formed on the same plane as the patch conductor or on the upper side or the lower side of the patch conductor.
  • the two terminals of the IC tag are brought into contact with each other at two different points on one side of the patch conductor.
  • At least one of the substrate and the ground conductor is detachable.
  • a patch antenna having two patch conductors that are planarly spaced apart from each other is provided on one main surface of the substrate, and a ground conductor is provided on the other main surface of the substrate. At least one of the two patch conductors is formed with a concave portion that is recessed from the edge facing the other patch conductor. A high radiated electric field is generated along the resonance axis of the patch antenna in a region surrounded by the concave portion of one patch conductor on one main surface of the substrate or a region between the concave portion and the other patch conductor.
  • An IC tag is provided.
  • the IC tag Since the IC tag is arranged so as to be sandwiched between the two patch conductors in this way, the radiation electric field of the IC tag is effectively electromagnetically coupled to each patch conductor to suppress unnecessary radiation between the patch conductors from the IC tag.
  • the wireless IC tag device can be manufactured only by plane mounting.
  • each patch conductor has a concave portion
  • the length of each patch conductor is reduced by the difference compared to the case where the electrical length of one patch conductor is ensured in a linear direction parallel to the resonance axis.
  • the tag device can be miniaturized.
  • the ground conductor is formed so as to extend to one end portion of the patch conductor, and the length of the patch conductor is connected to the patch conductor that is approximately 1 ⁇ 2 of the patch conductor. This has the effect of shortening the tag length.
  • the other patch conductor has a convex portion that partially fits into the concave portion of the one patch conductor, so that the patch conductor and the radiated electric field of the IC tag are efficiently coupled.
  • the patch conductor has an effect that a wider frequency band can be obtained due to the difference in electrical length between the two patch conductors due to the unevenness in the shape of the patch conductor.
  • the concave portion of one patch conductor is formed close to the shape of the tag antenna, the radiation field of the IC tag is efficiently coupled and the concave shape is formed in the shape of the patch conductor. Therefore, it is possible to obtain a wider frequency band by changing the electrical length of the two patch conductors. Moreover, since the useless area of the patch conductor surface is eliminated and the patch conductor surface can be effectively used, the radiation efficiency of the patch conductor can be further increased.
  • the tag antenna of the IC tag is in contact at two different places on one patch conductor or the other patch conductor, so that part of the current flowing on the patch conductor on one side due to resonance is on the IC tag side.
  • the patch conductor is strongly excited by the IC tag, and the other patch conductor is excited by the radiated electric field from the IC tag, thereby increasing the sensitivity of the wireless IC tag device.
  • the tag antenna of the IC tag is formed on the upper side or the lower side of the patch conductor in addition to the same plane as the patch conductor.
  • the patch conductor and the tag antenna of the IC tag can be formed simultaneously.
  • the IC tag is formed on the upper side of the patch conductor, by providing a printable surface on the upper part of the IC tag, when printing characters or the like, there is an effect that printing is easy.
  • the IC tag is formed below the patch conductor, there is an effect that a circuit portion such as an IC is protected by the patch conductor.
  • the substrate or the ground conductor is detachable, if the object to which the wireless IC tag device is attached has a metal surface, it can be used as the ground conductor.
  • the object to which the wireless IC tag device is attached can be used as a dielectric substrate and a metal foil tape or the like can be used as a ground conductor, the structure can be simplified.
  • FIG. 1 is a plan view showing a wireless IC tag device 1A1 according to Embodiment 1 of the present invention.
  • FIG. 2 is a cross-sectional view taken along a section line II-II in FIG.
  • FIG. 3A is a plan view showing wireless IC tag devices 1A2 to 1A5 of other second to fifth embodiments similar to the wireless IC tag device 1A1 of the first embodiment of the present invention, and
  • FIG. 3A (1) is a wireless IC tag of the second embodiment.
  • 3A (2) shows the wireless IC tag device 1A3 of the third embodiment
  • FIG. 3 (3) shows the wireless IC tag device 1A4 of the fourth embodiment, and
  • FIG. 3A (4) shows the fifth embodiment.
  • the wireless IC tag device 1A5 is shown.
  • FIG. 3B is a cross-sectional view of the structure of the wireless IC tag device similar to the first embodiment of the present invention
  • FIG. 3B (1) shows the cross-sectional structure of the wireless IC tag device 1B1
  • FIG. 3B (2) is the wireless IC tag.
  • a cross-sectional structure of the device 1B2 is shown
  • FIG. 3B (3) shows a cross-sectional structure of the wireless IC tag device 1B3.
  • It is a top view which shows the radio
  • FIG. 5 is a cross-sectional view taken along the section line VV in FIG. 4.
  • FIG. 5 is a cross-sectional view taken along the section line VV in FIG. 4.
  • FIG. 6A is a cross-sectional view of the structure of a wireless IC tag device similar to Embodiment 6 of the present invention.
  • FIG. 6A (1) shows the cross-sectional structure of the wireless IC tag device 1C2
  • FIG. 6A (2) is the wireless IC tag.
  • a cross-sectional structure of the device 1C3 is shown
  • FIG. 6A (3) shows a cross-sectional structure of the wireless IC tag device 1C4. It is a top view which shows radio
  • FIG. 6B is a cross-sectional view taken along section line VIC-VIC in FIG. 6B. It is a top view which shows the radio
  • FIG. 6D is a cross-sectional view taken along section line VIE-VIE in FIG. 6D.
  • FIG. It is a top view which shows the radio
  • FIG. 8 is a cross-sectional view taken along section line VIII-VIII in FIG. It is a top view which shows 1 G of radio
  • FIG. 10 is a cross-sectional view taken along the section line XX of FIG. 9. It is a top view which shows the radio
  • FIG. 12 is a cross-sectional view taken along section line XII-XII in FIG. FIG.
  • FIG. 13A is a plan view showing wireless IC tag devices 1H2 to 1H4 of other embodiments 12 to 14 similar to the wireless IC tag device 1H1 of embodiment 11 of the present invention
  • FIG. 13A (1) is a wireless IC tag of the embodiment 12.
  • FIG. 13A (2) shows the wireless IC tag device 1H3 of the thirteenth embodiment
  • FIG. 13A (3) shows the wireless IC tag device 1H4 of the fourteenth embodiment.
  • FIG. 13B is a view showing a structure of a wireless IC tag device similar to the eleventh embodiment of the present invention from a cross section
  • FIG. 13B (1) shows a cross-sectional structure of the wireless IC tag device 1I1
  • FIG. FIG. 13B (3) shows a cross-sectional structure of the wireless IC tag device 1I3.
  • FIG. 15 is a cross-sectional view taken along the section line XV-XV in
  • FIG. 1 is a plan view showing a wireless IC tag device 1A1 according to Embodiment 1 of the present invention
  • FIG. 2 is a cross-sectional view taken along the section line II-II in FIG.
  • the wireless IC tag device 1A1 according to the present embodiment includes a patch antenna 3 including a flat substrate 2 made of a dielectric and two patch conductors 3a and 3b formed on one main surface 2a of the substrate 2. And a ground conductor 4 formed on the entire other main surface 2 b of the substrate 2, and an IC tag 5.
  • the IC tag 5 is integrally formed on the patch conductors 3a and 3b and one main surface 2a of the substrate 2 on the same plane.
  • the substrate 2 is preferably made of a material with a low loss of electromagnetic energy, that is, a low dielectric loss tangent tan ⁇ in the communication frequency band. .
  • the value of the dielectric loss tangent tan ⁇ is preferably 0.02 or less, for example.
  • a dielectric substrate as exemplified below can be used.
  • dielectric base material examples include polypropylene, polyethylene terephthalate (PET), polyimide, glass epoxy substrate, and fluororesin substrate.
  • the patch antenna 3 formed on the one main surface 2a of the substrate 2 and the ground conductor 4 formed on the other main surface 2b of the substrate 2 constitute a radio wave polarization conversion resonant reflector.
  • a radio wave polarization conversion resonant reflector effectively acts on a linearly polarized signal in which the axial ratio of elliptically polarized waves is infinite.
  • the IC tag 5 includes a tag antenna 51 formed on the substrate 2 and a tag IC (Integrated Circuit) 52 which is a circuit unit mounted on the feeding point.
  • the IC tag 5 is preferably arranged so that the radiated electric field is parallel to the resonance axes of the patch conductors 3a and 3b.
  • the two patch conductors 3a and 3b serving as radio wave radiating conductors have a length L that is approximately 1 ⁇ 2 wavelength in terms of the effective wavelength on the dielectric in the length direction X, and in a direction Y perpendicular to the length direction X. They are close to each other with a distance d and are arranged in an electrically non-contact state.
  • the two patch conductors 3a and 3b have concave portions 6a and 6b that are recessed from the edges close to each other on a plane parallel to the paper surface of FIG. 1, and the concave portions 6a and 6b of the main surface 2a.
  • the IC tag 5 is disposed in the area between them, and an electromagnetic field radiated from at least one of the two patch conductors 3a and 3b is received by the tag antenna 51 of the IC tag 5.
  • the concave portions 6a and 6b of the patch conductors 3a and 3b have a longer current path because the current flowing through the edge portion of the patch is bypassed, and are longer than the electrical length with respect to the length L of the patch conductors 3a and 3b. Therefore, in the patch conductors 3a and 3b provided with the concave portions 6a and 6b, the length L needs to be shortened to be the same as the resonance frequency with respect to the length L.
  • the IC tag 5 is surrounded by two patch conductors 3a and 3b.
  • the IC tag 5 is activated, and the electromagnetic field component radiated from the IC tag 5 is effectively combined with the patch conductors 3a and 3b. Electromagnetic radiation is reduced.
  • the interval d between the patch conductors 3a and 3b is sufficiently shorter than a half wavelength of the signal frequency (or communication frequency). Therefore, by adopting the structure shown in FIG. 1 and FIG. 2, high sensitivity can be achieved with a simple configuration, and the dimension shape in the length direction X of the wireless IC tag device 1A1 can be reduced. . In particular, when the IC tag 5 is strongly electromagnetically coupled to the two patch antennas 3a and 3b, the sensitivity becomes higher.
  • either one or both of the two patch conductors 3a and 3b on the substrate 2 are connected to the patch conductors 3a and 3b.
  • Other patch conductors different from each other may be formed close to and outside the one patch conductor 3a or the other patch conductor 3b.
  • the IC tag 5 is arranged so that the antenna major axis of the tag antenna 51 is parallel to the axis parallel to the length direction X. Note that both end portions of the IC tag 5 (both end portions in the length direction X) are arranged on the patch conductors 3a and 3b as viewed from above the patch conductors 3a and 3b according to the form of the tag antenna 51. Alternatively, the patch conductors 3a and 3b may be arranged so as not to overlap.
  • the position of the IC tag 5 is arranged such that the tag antenna 51 can efficiently receive the electric field radiated simultaneously with the resonance of at least one of the patch conductors 3a and 3b.
  • positioning position of IC tag 5 so that the communication sensitivity of wireless IC tag apparatus 1A1 may become the maximum.
  • the two patch conductors 3a and 3b become open boundaries at both ends of the resonance axis parallel to the length direction X, and the length L of each patch conductor 3a and 3b is used on one main surface 2a of the substrate 2. It is set to approximately 1 ⁇ 2 of the equivalent wavelength ⁇ f with respect to the signal frequency f. At this time, the two patch conductors 3a and 3b are accompanied by plane resonance near the resonance frequency f0. As will be described later, in order to increase the bandwidth of the wireless IC tag device 1A1, the equivalent electrical lengths of the two patch conductors 3a and 3b are made different and set to different resonance frequencies.
  • the radio wave polarization conversion resonant reflector constituted by the two patch conductors 3a and 3b and the ground conductor 4 formed on the substrate 2 in the length direction X arriving with respect to the two patch conductors 3a and 3b. It effectively resonates with respect to the linearly polarized signal component having the electric field E.
  • the incoming signal wave resonates in the two patch conductors 3a and 3b, a strong electromagnetic field is generated in the vicinity thereof, and the electric field E is radiated simultaneously with the resonance.
  • the radiated electric field E is directed upward in a direction perpendicular to the surfaces of the patch conductors 3a and 3b (a direction perpendicular to the paper surface of FIG. 1), and in a lateral direction and a diagonally upward direction parallel to the surfaces of the patch conductors 3a and 3b. Re-radiated.
  • a strong electromagnetic field is distributed in the same direction between the one patch conductor 3a and the other patch conductor 3b.
  • the electric field E radiated by each resonance of the two patch conductors 3a and 3b is generated when the IC tag 5 is disposed, and the tag antenna of the IC tag 5 is caused by the strong resonance electric field accompanying the resonance by the two patch conductors 3a and 3b.
  • a strong current is induced in 51, and radio waves accompanied by information of the tag IC 52 are radiated by their mutual electromagnetic coupling.
  • the wireless IC tag device 1A Using the wireless IC tag device 1A1, it is possible to build a mobile object identification (Radio Frequency Identification; abbreviated RFID) system composed of a reader, a reader antenna, and the wireless IC tag device 1A1.
  • RFID Radio Frequency Identification
  • the RFID operation will be described below.
  • the signal wave sent from the reader resonates in plane with the two patch conductors 3a and 3b.
  • a resonant electromagnetic field is generated by this plane resonance, and at the same time, a resonant electromagnetic field is radiated.
  • the radiated electric field E acts on the tag antenna 51 of the IC tag 5 arranged along the radiation direction, and generates a current in the tag antenna 51.
  • the radiated electric fields from the two independent patch conductors 3a and 3b are captured and added on both sides of the single tag antenna 51, so that the current flowing in the tag antenna 51 is the patch conductor 3a. , 3b is stronger than in the case of one.
  • the current flowing in the tag antenna 51 acts on the rectifier in the tag IC 52 and generates a driving voltage for the tag IC 52.
  • the tag IC 52 is activated, and the current flowing in the tag antenna 51 is modulated by the information signal in the memory.
  • the signal current accompanied with the modulation by the tag antenna 51 generates a radiation electric field E parallel to the tag antenna 51 and radiates radio waves.
  • the modulated signal wave radiated from the IC tag 5 in this way is sent to the reader antenna via the patch conductors 3a and 3b.
  • the reader receives and demodulates this signal wave, and the memory information in the IC tag 5 is recognized.
  • the wireless IC tag device 1A1 in the RFID operation, the signal wave sent from the reader gives a stronger signal wave to the IC tag 5 due to resonance by the two patch conductors 3a and 3b. Therefore, the communication sensitivity can be increased and the communication distance can be extended.
  • the two patch conductors 3a and 3b are formed on the one main surface 2a of the substrate 2 in an electrically non-contact state, but there are various other forms of arrangement of the patch conductors 3a and 3b. Can be considered. Specifically, for example, three or more patch conductors are formed in an electrically non-contact state on the one main surface 2a of the substrate 2, and the electric field E radiated simultaneously with the resonance of the three or more patch conductors.
  • the IC tag 5 can be arranged at a position where the tag antenna 51 can efficiently receive the signal.
  • the radiated electric field of the IC tag 5 can be effectively coupled to the patch antenna 3, and the wireless IC Unnecessary electromagnetic radiation of the tag 5 can be reduced and sensitivity can be increased.
  • the resonance frequency f0 is adjusted by changing the electrical length of the two opposing patch conductors 3a and 3b and changing the resonance frequency f0 of the two patch conductors 3a and 3b according to the position of the interval d and the shape of the concave portions 6a and 6b. Therefore, it is possible to increase the bandwidth.
  • the electromagnetic coupling between the two patch conductors 3a and 3b and the IC tag 5 has been described. However, depending on the distance d, the electromagnetic coupling occurs between the two patch conductors 3a and 3b. Broadband and high sensitivity can be achieved.
  • the patch conductors 3a and 3b with the concave portions 6a and 6b, unnecessary radiation is reduced, and the equivalent electrical length of the patch conductors 3a and 3b is lengthened, and the patch conductors 3a and 3b are changed by the amount of the change.
  • the length in the X direction By reducing the length in the X direction, the size of the wireless IC tag device 1A1 can be reduced.
  • the patch antenna 3 having the patch conductors 3a and 3b and the IC tag 5 can be formed in the same plane, the manufacturing method is easy, and the wireless IC tag device 1A1 is provided. The production efficiency when producing in large quantities can be greatly improved.
  • the concave portions are provided on one side of the long sides of the patch conductors 3a and 3b. Good.
  • FIG. 3A is a plan view showing wireless IC tag devices 1A2 to 1A5 of other embodiments 2 to 5 similar to wireless IC tag device 1A1 of embodiment 1 of the present invention
  • FIG. 3A (1) is a second embodiment.
  • 3A (2) shows the wireless IC tag device 1A3 of the third embodiment
  • FIG. 3A (3) shows the wireless IC tag device 1A4 of the fourth embodiment
  • FIG. 3A (4) show wireless IC tag apparatus 1A5 of Embodiment 5.
  • FIG. Note that portions corresponding to those of the first embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • the wireless IC tag device 1A2 of Embodiment 2 shown in FIG. 3A (1) has a structure in which the IC tag 5 includes a gap and overlaps with the patch conductor 3b on one side.
  • the wireless IC tag device 1A3 of Embodiment 3 shown in FIG. 3A (2) has a structure in which the IC tag 5 includes a gap and overlaps with the patch conductors 3a and 3b on both sides.
  • the wireless IC tag device 1A4 of the fourth embodiment shown in FIG. 3A (3) the IC tag 5 is disposed in the concave portion 6b of the patch conductor 3b on one side, and is combined with one patch conductor 3a having no concave portion 6a. Structure.
  • the IC tag 5 is disposed in the concave portion 6b of the patch conductor 3b on one side, and is combined with one patch conductor 3a having the concave portion 6a. Structure.
  • the IC tag 5 is disposed above the patch conductors 3a and 3b.
  • the present invention is not limited to this, and the IC tag 5 is attached to each patch conductor as shown in FIG. You may arrange
  • the two patch conductors 3a and 3b and the IC tag 5 there are various methods for forming the two patch conductors 3a and 3b and the IC tag 5.
  • the IC tag 5 may be provided on the same plane with respect to the patch conductors 3a and 3b, or may be provided on the upper side or the lower side of the patch conductors 3a and 3b.
  • the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 may be brought into electrical contact or may be in non-contact.
  • the tag IC 52 may be mounted by attaching the IC tag 5 to the patch conductors 3a and 3b, or directly forming the tag antenna 51 on the patch conductors 3a and 3b by printing or vapor deposition.
  • the patch conductors 3a and 3b and the tag antenna 51 can be formed of a single conductor, and the tag IC 52 can be mounted.
  • a dielectric film or a dielectric sheet may be sandwiched between the patch conductors 3 a and 3 b and the IC tag 5.
  • the IC tag 5 and the patch conductors 3a and 3b may be coated with a dielectric material.
  • FIG. 3B explains the difference in structure according to the embodiment of the present invention from a cross-sectional view.
  • the wireless IC tag device 1B1 shown in FIG. 3B (1) has a structure in which the IC tag 5 is arranged above the patch conductors 3a and 3b.
  • the wireless IC tag device 1B2 shown in FIG. 5 is a structure arranged below the patch conductors 3a and 3b.
  • the IC tag 5 is arranged on the same plane as the patch conductors 3a and 3b. Structure.
  • the patch conductors 3a and 3b and the IC tag 5 are formed on the same plane, the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 can be simultaneously formed on the substrate 2.
  • printing is easy when printing characters or the like.
  • the IC tag 5 is formed below the patch conductors 3a and 3b, there is an effect that the tag IC 52 which is a circuit portion is protected by the patch conductors 3a and 3b.
  • FIG. 4 is a modification of FIG. 1, and is a plan view showing a wireless IC tag device 1C1 according to Embodiment 6 of the present invention.
  • FIG. 5 is a cross-sectional view taken along the section line VV of FIG. is there. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • the present embodiment is particularly aimed at miniaturization of a wireless IC tag device.
  • the short sides 4a and 4b of the ground conductor 4 are extended upward on one side of the substrate 2 and connected to the ends of the patch conductors 3a and 3b.
  • the length of each of the patch conductors 3a and 3b is approximately a half of the half wavelength and becomes a quarter wavelength.
  • the IC tag 5 is disposed on the same plane as the patch conductors 3a and 3b.
  • the patch conductors 3a and 3b and the ground conductor 4 are short-circuited along the Y-axis direction at the central point P of each of the patch conductors 3a and 3b to increase the patch conductor length.
  • the wireless IC tag device can be further reduced in size.
  • FIG. 6A is a cross-sectional view showing a difference in structure of a wireless IC tag device similar to Embodiment 6 of the present invention.
  • the wireless IC tag device 1C2 shown in FIG. 6A (1) the short sides 4a and 4b of the ground conductor 4 are connected to one end in the length direction X of each patch conductor 3a and 3b, and the IC tag 5 is
  • the wireless IC tag device 1C3 shown in FIG. 6A (2) has a structure in which at least one of the patch conductors 3a and 3b is arranged, and the short side portions 4a and 4b of the ground conductor 4 are connected to each patch conductor 3a.
  • 3b is connected to one end in the length direction X, and the IC tag 5 is disposed below either one of the patch conductors 3a, 3b, and the wireless IC tag shown in FIG. 6A (3)
  • the short sides 4a and 4b of the ground conductor 4 are connected to one end in the longitudinal direction X of the patch conductors 3a and 3b, and the IC tag 5 is flush with the patch conductors 3a and 3b. It is a structure arranged in.
  • the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 may be electrically contacted or non-contacted.
  • the IC tag 5 is attached to the patch conductors 3a and 3b, or the tag antenna 51 is attached to the patch conductors 3a and 3b.
  • the tag IC 52 may be mounted by directly forming by printing or vapor deposition.
  • a dielectric film or a dielectric sheet may be sandwiched between the patch conductors 3 a and 3 b and the IC tag 5.
  • the IC tag 5 and the patch conductors 3a and 3b may be coated with a dielectric material.
  • the patch conductors 3a and 3b and the IC tag 5 can be integrally formed by conductor printing or the like.
  • FIG. 6B is a plan view showing a wireless IC tag device 1D according to another embodiment 7 of the present invention aimed at miniaturization
  • FIG. 6C is a cross-sectional view taken along the section line VIC-VIC of FIG. 6B.
  • portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • the wireless IC tag device 1D of the present embodiment since the equivalent electrical length of the patch conductors 3a and 3b is approximately ⁇ g / 4, the short sides 4a and 4b of the ground conductor 4 are extended, and the short length of the ground conductor 4 is reduced.
  • the side portions 4a and 4b are formed on the patch conductors 3a and 3b side.
  • the ends of the two patch conductors 3a and 3b are connected to the ground conductor 4 on the same plane, but as described above, the short side portions 4a and 4b of the patch conductors 3a and 3b have zero resonance voltage. Therefore, the effect of the two patch conductors 3a and 3b is the same as that of the two independent patch conductors.
  • the tag attenuator 51 of the IC tag 5 is connected to the patch conductor 3b without the concave portion 6b on one side, and the patch conductors 3a and 3b are connected to each other at one end in the length direction X.
  • the tag antenna 51 is formed in contact with and electrically connected to the one-side patch conductor 3b on the same plane as the one-side patch conductor 3b or on the upper side or the lower side.
  • the conductor portion of the tag antenna 51 of the IC tag 5 and the patch conductors 3a and 3b are attached with a conductive material, thermocompression bonded, the tag antenna 51 is printed on the patch conductors 3a and 3b, or the vapor deposition method.
  • the tag IC 52 may be mounted directly.
  • the tag antenna 51 and the patch conductors 3a and 3b can be integrally formed with the same conductor.
  • FIG. 6D is a plan view showing a wireless IC tag device 1E according to another embodiment 8 of the present invention
  • FIG. 6E is a cross-sectional view taken along section line VIE-VIE of FIG. 6D. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • each patch conductor 3a, 3b is connected to one short side portion of the ground conductor 4 by through-hole conductors 53a, 53b formed on one short side portion of the substrate 2.
  • the tag antenna 51 of the IC tag 5 is connected to the patch conductor 3b on one side.
  • the difference between the wireless IC tag device 1D of FIG. 6B and the wireless IC tag device 1E of FIG. 6D is that, in the wireless IC tag device 1E of FIG. 6D, a ground conductor 4 like the wireless IC tag device 1D of FIG.
  • the gap d between the patch conductors 3a and 3b is not formed in the same plane as 3a and 3b, and is formed up to both ends in the length direction X of the patch conductors 3a and 3b.
  • two patch conductors 3a and 3b having an equivalent electrical length of approximately ⁇ g / 4 and the ground conductor 4 are individually connected through the through-hole conductors 53a and 53b.
  • one through-hole conductor may be used, but in the wireless IC tag device 1E in FIG. 6D, two are required.
  • the two patch conductors 3a and 3b can be used as equivalent electrical lengths up to the thickness of the substrate 2, so that the device is smaller.
  • the thickness of the substrate 2 also operates as an antenna, and the radio wave radiation characteristics can be deflected as necessary.
  • FIG. 7 is a plan view showing the wireless IC tag device 1F according to the ninth embodiment of the present invention
  • FIG. 8 is a cross-sectional view taken along the section line VIII-VIII in FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • one patch conductor 3a on one main surface 2a of the substrate 2, of the two patch conductors 3a and 3b facing each other with the gap d therebetween, one patch conductor 3a has the convex portion 21 and faces each other.
  • the other patch conductor 3b has the concave portion 6b.
  • a ground conductor 4 is provided on the other main surface 2b of the substrate 2, and the IC tag 5 is disposed so as to be sandwiched between the convex portion 21 and the concave portion 6b.
  • Such a radiation electric field of the IC tag 5 is arranged to be parallel to the resonance axis of the patch conductors 3a and 3b, that is, to be parallel to the length direction X.
  • the patch conductors 3a and 3b and the electric field radiation of the mounting portion of the tag IC 52 having a strong radiation field of the IC tag 5 are efficiently coupled, and the shape of the patch conductors 3a and 3b is obtained. Since it has an uneven portion, the equivalent electrical lengths of the two patch conductors 3a and 3b can be made different to obtain a wider frequency band.
  • FIG. 9 is a plan view showing the wireless IC tag device 1G according to the tenth embodiment of the present invention
  • FIG. 10 is a cross-sectional view taken along the section line XX of FIG.
  • the concave portions 6a and 6b respectively having convex portions 21 and 22 are provided on the edge portions of the patch conductors 3a and 3b facing each other so as to approach the antenna shape of the tag antenna 51 of the IC tag 5. It is formed.
  • the radiated electric field of the IC tag 5 is arranged so as to be parallel to the resonance axis of each patch conductor 3a, 3b, that is, the length direction X.
  • the concave portions 6a and 6b of the patch conductors 3a and 3b are formed close to each other along the shape of the tag antenna 51, so that the radiation field of the IC tag 5 is efficiently coupled.
  • the patch conductors 3a and 3b have the concave portions 6a and 6b including the convex portions 21 and 22, there is an effect that a wider frequency band can be obtained.
  • unnecessary voids are reduced on the surfaces of the patch conductors 3a and 3b and the area of the patch conductors 3a and 3b can be effectively used, the sensitivity of the entire wireless IC tag device 1G can be increased.
  • FIG. 11 is a plan view showing the wireless IC tag device 1H1 according to the eleventh embodiment of the present invention
  • FIG. 12 is a cross-sectional view taken along the section line XII-XII of FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • each tag antenna 51 of the IC tag 5 contacts at two places different from the other patch conductor 3b.
  • the radiation field of the IC tag 5 is arranged to be parallel to the resonance axes of the patch conductors 3a and 3b.
  • the tag antenna 51 of the IC tag 5 is in contact at two different locations on the other patch conductor 3b, so that a part of the current flowing on the other patch conductor 3b due to resonance is directly applied. Since the current flows to the IC tag 5 side, the other patch conductor 3b is strongly excited, and one patch conductor 3a is also mutually excited by the radiated electric field from the IC tag 5, thereby increasing the sensitivity of the wireless IC tag device 1H1.
  • the patch conductors 3a and 3b and the IC tag 5 can be integrally formed of the same conductor.
  • FIG. 13A is a plan view showing wireless IC tag devices 1H2 to 1H4 of other embodiments 12 to 14 similar to the wireless IC tag device 1H1 of embodiment 11 of the present invention
  • FIG. 13A (2) shows the wireless IC tag device 1H3 of the thirteenth embodiment
  • FIG. 13A (3) shows the wireless IC tag device 1H4 of the fourteenth embodiment. Note that portions corresponding to the above-described eleventh embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • each end of the tag antenna 51 of the IC tag 5 is in contact with the patch conductor 3b on one side, and a part of the tag antenna 51 is partially
  • the wireless IC tag device 1H3 according to the thirteenth embodiment shown in FIG. 13A (2) has a structure that is disposed in the concave portion 6a of one patch conductor 3a and is combined with one patch conductor 3a having the concave portion 6a.
  • 5 has a structure in which each end portion of the tag antenna 51 is in contact with the patch conductor 3b on one side and is combined with one patch conductor 3a without the concave portion 6a.
  • each end of the tag antenna 51 of the IC tag 5 is in contact with the patch conductor 3b on one side and is disposed in the concave portion 6b.
  • This is a structure combined with one patch conductor 3a having the portion 6a.
  • FIG. 13B is a cross-sectional view showing a difference in structure of the wireless IC tag device similar to the eleventh embodiment of the present invention.
  • the wireless IC tag device 1I1 shown in FIG. 13B (1) has a structure in which each end portion of the tag antenna 51 of the IC tag 5 arranged on the upper side of each patch conductor 3a, 3b is connected to the patch conductor 3b on one side.
  • the wireless IC tag device 1I2 shown in FIG. 13B (2) has a structure in which each end portion of the tag antenna 51 of the IC tag 5 arranged below the patch conductors 3a and 3b is connected to the patch conductor 3b on one side.
  • each end of the tag antenna 51 of the IC tag 5 arranged on the same plane as the patch conductors 3a and 3b is connected to the patch conductor 3b on one side. It is a structured.
  • the patch conductors 3a and 3b and the IC tag 5 are formed on the same plane, the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 can be created at the same time. Further, by having a printable surface on the top of the IC tag 5, printing is easy when printing characters or the like. Further, when the IC tag 5 is formed below the patch conductors 3a and 3b, there is an effect that the circuit portions such as the tag IC 52 are protected by the patch conductors 3a and 3b.
  • FIG. 14 is a plan view showing a wireless IC tag device 1J according to another embodiment 15 of the present invention
  • FIG. 15 is a cross-sectional view taken along section line XV-XV in FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.
  • the tag antenna 51 of the IC tag 5 is connected to the other patch conductor 3b having no unevenness.
  • a meander line antenna type tag as an IC tag
  • a tag using a folded dipole antenna or a loop antenna, or a minute dipole or minute loop type is used as an IC tag.
  • Various IC tags may be used as long as they have a linearly polarized radiation component, such as a tag that is modified by applying an antenna and a tag that uses a bow-tie antenna.
  • a wireless IC tag device suitable for a linearly polarized signal has been shown, but it may be used for a circularly polarized signal.
  • the present invention is not limited to this, and the present invention can also be applied as a form suitable for receiving and transmitting circularly polarized signals.
  • two patch conductors 3a and 3b formed on one main surface 2a of the substrate 2 are notched (chamfered) in a pair of corner portions (diagonal portions) facing each other in a substantially square shape.
  • At least one of the substrate 2 or the ground conductor 4 may be configured to be detachably bonded to the two patch conductors 3a and 3b and the IC tag 5 with an adhesive or the like.
  • the substrate 2 or the ground conductor 4 is detachable, when the object to which the wireless IC tag device is attached has a metal surface, it can be used as the ground conductor 4. Further, since the object to which the wireless IC tag device is attached can be used as the dielectric substrate 2 and a metal foil tape or the like can be used as the ground conductor 4, the structure can be simplified.

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Abstract

On one main surface (2a) of a substrate (2), a patch antenna having two patch conductive bodies (3a, 3b) is provided, said patch conductive bodies plane-resonating at an interval (d) therebetween, and on the other main surface (2b) of the substrate (2), a grounding conductor is provided. At least in one of the two patch conductive bodies (3a, 3b), a recessed portion (6b) recessed from an end portion facing the other patch conductive body (3b) is formed. At least on a part of a region, which is exposed from the recessed portion (6b) of the one main surface (2a) of the substrate (2), and/or a part of a region between the recessed portion (6b) and the other patch conductive body (3b), an IC tag (5) is provided such that a high radiation electric field is generated along a resonant axis of the patch antenna. With such configuration, the radiation electric field of the IC tag (5) is effectively electromagnetically coupled with the patch conductive bodies, unneeded radiation between the patch conductive bodies (3a, 3b) from the IC tag (5) is suppressed, and a wireless IC tag apparatus can be manufactured merely by means of surface mounting.

Description

無線ＩＣタグ装置Wireless IC tag device
　本発明は、移動体識別（Radio Frequency Identification；略称ＲＦＩＤ）に用いられる無線ＩＣタグ装置に関する。 The present invention relates to a wireless IC tag device used for radio frequency identification (abbreviated as RFID).
　情報通信の分野のみならず、物流管理などの分野でも無線通信技術が応用され、無線通信用のＩＣタグ（以下、「ＩＣタグ」という。）は、ＲＦＩＤ技術の一翼を担う製品として広く知られている。物流管理や、安価な情報記憶媒体として使用用途は多岐にわたることから、無線通信機器は、様々な使用環境に置かれることになる。 Wireless communication technology is applied not only in the field of information communication but also in fields such as logistics management, and IC tags for wireless communication (hereinafter referred to as “IC tags”) are widely known as products that play a role in RFID technology. ing. Since there are various uses for physical distribution management and inexpensive information storage media, wireless communication devices are placed in various usage environments.
　ＩＣタグは、識別番号などのデータを記憶し、無線通信を制御する回路部としてのタグＩＣと、電波を送受信するためのタグアンテナとによって構成され、薄型・軽量に実現できることが大きな利点とされている。このようなＩＣタグには、電源を備えず、電波の電力によってタグＩＣを駆動するパッシブ型ＩＣタグ、タグＩＣを駆動する電源を備え、送信電波を反射・変調して通信するセミパッシブ型ＩＣタグ、および電源を備え、自ら送信することが可能なアクティブ型ＩＣタグがある。また、周波数別に見ると、電磁誘導を利用し、主に近距離で使用する１３ＭＨｚ帯のものや、電波を利用して通信距離の長い９００ＭＨｚ帯や、２．４５ＧＨｚ帯のものなどがある。 An IC tag is composed of a tag IC as a circuit unit that stores data such as an identification number and controls wireless communication, and a tag antenna for transmitting and receiving radio waves, and has a great advantage that it can be realized thinly and lightly. ing. Such an IC tag is not provided with a power source, but is a passive IC tag that drives a tag IC by radio wave power, and a semi-passive IC that is provided with a power source that drives the tag IC and reflects and modulates transmission radio waves for communication. There is an active IC tag that includes a tag and a power source and can transmit by itself. In terms of frequency, there are a 13 MHz band that uses electromagnetic induction and is mainly used at a short distance, a 900 MHz band that uses a radio wave and a long communication distance, and a 2.45 GHz band.
　前述のパッシブ型ＩＣタグは、送信電波から電力を生成し、その電力を用いてタグＩＣが起動し、送信電波を反射して変調することによってデータを送信する。 The above-mentioned passive IC tag generates power from the transmission radio wave, the tag IC is activated using the power, and transmits data by reflecting and modulating the transmission radio wave.
　電波を利用するＩＣタグでは、誘電体上にダイポールアンテナを形成して、タグＩＣを接続したものや、伝送線路を繰り返し折り曲げて長さを短縮したメアンダ型などがある。他の方式としては、基板の一方主面に、誘電体上の電気長１／２波長（以下、１／２波長は、誘電体上の電気長における１／２波長とする。）のパッチ導体を形成し、他方主面に接地導体を形成し、一方のパッチ導体と他方の接地導体との間に設けられるタグＩＣに給電するパッチアンテナ型などのＩＣタグが周知である。 IC tags using radio waves include those in which a dipole antenna is formed on a dielectric and the tag IC is connected, and meander type in which the transmission line is repeatedly bent to shorten its length. As another method, a patch conductor having an electrical length of ½ wavelength on the dielectric (hereinafter, ½ wavelength is ½ wavelength of the electrical length on the dielectric) on one main surface of the substrate. An IC tag such as a patch antenna type is well known in which a ground conductor is formed on the other main surface and a tag IC provided between one patch conductor and the other ground conductor is fed.
　従来技術では、１／２波長のマイクロストリップ線路共振器を用いて、タグアンテナと接地導体との間にＩＣタグを接続する無線ＩＣタグ装置が提案されている。この無線ＩＣタグ装置は、誘電体を介してタグアンテナと対向した側に接地導体との間にＩＣタグを有するので、製作は複雑であるが、接地導体側を金属体などに装着しても、基本的には電波放射に影響せずに通信することができる。したがって、１／２波長アンテナの長さ方向に平行な電界を有する直線偏波の無線信号に有効な通信を可能としている（たとえば、特許文献１を参照。）。 In the prior art, a wireless IC tag device has been proposed in which an IC tag is connected between a tag antenna and a ground conductor using a ½ wavelength microstrip line resonator. Since this wireless IC tag device has an IC tag between a grounding conductor on the side facing the tag antenna via a dielectric, manufacturing is complicated, but even if the grounding conductor side is attached to a metal body or the like Basically, communication can be performed without affecting radio wave radiation. Therefore, effective communication is possible for a linearly polarized radio signal having an electric field parallel to the length direction of the half-wavelength antenna (see, for example, Patent Document 1).
　一般に、ＩＣタグに金属を隣接させると、誘導電流が流れるため、タグアンテナの電圧振幅が減少し、通信距離が減少することが知られている。これに対して前述の特許文献１に記載される従来技術のＩＣタグ装置では、１／２波長のマイクロストリップ線路共振器を用いて、金属に隣接した場合にも機能するが、パッチ導体と接地導体間にタグＩＣを接続する構成であるので、スルーホールなどの形成が必要であり、製造が複雑になるという問題がある。 Generally, it is known that when a metal is adjacent to an IC tag, an induced current flows, so that the voltage amplitude of the tag antenna decreases and the communication distance decreases. On the other hand, the IC tag device of the prior art described in the above-mentioned Patent Document 1 functions even when it is adjacent to a metal using a half-wavelength microstrip line resonator. Since the tag IC is connected between the conductors, it is necessary to form a through hole or the like, and there is a problem that manufacturing is complicated.
　このような問題を解決する他の従来技術は、たとえば特許文献２に記載されている。この従来技術では、金属体に実装可能な高感度な無線ＩＣタグ装置が提案されている。この無線ＩＣタグ装置は、共振周波数で平面共振する複数のパッチ導体と、無線ＩＣタグとを備え、２つのパッチ導体の一方主面もしくは他方主面またはパッチ導体間に、無線ＩＣタグが配置されている。 Another prior art for solving such a problem is described in Patent Document 2, for example. In this prior art, a highly sensitive wireless IC tag device that can be mounted on a metal body has been proposed. The wireless IC tag device includes a plurality of patch conductors that resonate in plane at a resonance frequency and a wireless IC tag, and the wireless IC tag is disposed between one main surface or the other main surface of the two patch conductors or between the patch conductors. ing.
　２つのパッチ導体は、電気的に非接触な状態で配置されるとともに、無線ＩＣタグは２つのパッチ導体の共振と同時に放射される電界をタグアンテナで受信できる位置に配置されている。到来した無線信号は２つのパッチ導体で平面共振し、これと同時に放射される強い電界が無線ＩＣタグのタグアンテナに入射して、タグアンテナ内に電流が生じ、無線ＩＣタグに起動電力を与えて、通信可能な状態となる。 The two patch conductors are disposed in an electrically non-contact state, and the wireless IC tag is disposed at a position where the tag antenna can receive an electric field radiated simultaneously with the resonance of the two patch conductors. The incoming wireless signal undergoes plane resonance with the two patch conductors, and at the same time, a strong electric field radiated enters the tag antenna of the wireless IC tag, and a current is generated in the tag antenna, giving start power to the wireless IC tag. Thus, communication is possible.
　基板の他方主面には、接地導体が形成されているので、接地導体側に電波または電界の放射がなく、基板の接地導体側を取付対象である物体への実装面とすることによって、簡単な構成によって、金属からなる物体に実装可能なＩＣタグ装置を実現している。 Since the grounding conductor is formed on the other main surface of the board, there is no emission of radio waves or electric fields on the grounding conductor side, and the grounding conductor side of the board can be easily mounted on the object to be mounted. With this configuration, an IC tag device that can be mounted on an object made of metal is realized.
特開２０００－３３２５２３号公報JP 2000-332523 A 特許第４４５２８６５号公報Japanese Patent No. 4428865
　前記特許文献２に記載される従来技術では、該特許文献２の図１に示されるように、１／２波長の２つのパッチ導体の共振軸と無線ＩＣタグの放射電界軸とが平行となるように、２つのパッチ導体の長手方向に沿って、２つのパッチ導体上に無線ＩＣタグが配置されるので、無線ＩＣタグ装置の全長が長くなるという問題がある。 In the prior art described in Patent Document 2, as shown in FIG. 1 of Patent Document 2, the resonance axis of the two patch conductors of ½ wavelength and the radiation electric field axis of the wireless IC tag are parallel to each other. As described above, since the wireless IC tag is disposed on the two patch conductors along the longitudinal direction of the two patch conductors, there is a problem that the entire length of the wireless IC tag device is increased.
　この場合、無線ＩＣタグは、２つのパッチ導体の長さ方向の端部で、その放射電界の最も大きい位置でパッチ導体と電磁界結合するが、無線ＩＣタグの最適な位置は、パッチ導体間の間隔と無線ＩＣタグとの位置関係で決められ、パッチ導体間の間隔が大きくなる場合がある。 In this case, the wireless IC tag is electromagnetically coupled to the patch conductor at the position where the radiated electric field is the largest at the end portions in the length direction of the two patch conductors, but the optimum position of the wireless IC tag is between the patch conductors. In some cases, the distance between the patch conductors may be large.
　また、導体幅の狭いパッチ導体の場合、無線ＩＣタグの配置に伴い、生じた無線ＩＣタグ近傍の電磁界放射の乱れた成分は、２つのパッチ導体間で無線ＩＣタグに垂直な横方向など、すなわち基板の短辺方向に不要な信号波が放射され、無線ＩＣタグ装置の正面方向の放射効率を低下させ、しかも２つのパッチ導体間の間隔が大きいほど、不要放射も大きくなるという問題がある。 Further, in the case of a patch conductor having a narrow conductor width, a disturbance component of electromagnetic field radiation generated in the vicinity of the wireless IC tag due to the arrangement of the wireless IC tag is caused by a lateral direction perpendicular to the wireless IC tag between the two patch conductors. That is, an unnecessary signal wave is emitted in the short side direction of the substrate, the radiation efficiency in the front direction of the wireless IC tag device is lowered, and the unnecessary radiation increases as the distance between the two patch conductors increases. is there.
　さらに、この場合、無線ＩＣタグがパッチ導体上に配置されているため、立体構造となっており、タグ全体が厚くなる。薄型タグ装置を必要とする場合には、無線ＩＣタグとパッチ導体とを平面的に形成することが非常に重要となる。 Further, in this case, since the wireless IC tag is arranged on the patch conductor, it has a three-dimensional structure, and the entire tag becomes thick. When a thin tag device is required, it is very important to form the wireless IC tag and the patch conductor in a plane.
　また無線ＩＣタグを１／２波長よりも大幅に小形化することが困難であるという問題がある。 Also, there is a problem that it is difficult to make the wireless IC tag much smaller than 1/2 wavelength.
　本発明の目的は、放射効率を改善し、薄型化を可能とし、簡単な構成で小形化を図ることができ、また一般的な各種の無線ＩＣタグも流用でき、金属物体などにも適用可能な無線ＩＣタグ装置を提供することである。 The object of the present invention is to improve the radiation efficiency, make it possible to reduce the thickness, reduce the size with a simple configuration, can also divert general various wireless IC tags, and can also be applied to metal objects, etc. Is to provide a wireless IC tag device.
　本発明は、回路部およびタグアンテナを有するＩＣタグと、
　誘電体からなる基板と、
　前記基板の一方主面に設けられるパッチ導体と、
　前記基板の他方主面に設けられる接地導体とを含み、
　前記パッチ導体は、共振周波数で平面共振する少なくとも２つのパッチアンテナを備え、
　前記パッチアンテナは、互いに間隙を挟んで対向し、片側または両側に前記間隙を含む凹型の切込み領域を有し、
　前記ＩＣタグは、少なくとも一部が前記切込み領域内にあり、前記ＩＣタグの放射電界成分と上記パッチ導体の共振軸が平行となり、かつ前記ＩＣタグが前記パッチ導体と電気的に非接触または前記パッチ導体のいずれかと接触させて構成されることを特徴とする無線ＩＣタグ装置である。 The present invention includes an IC tag having a circuit portion and a tag antenna;
A dielectric substrate;
A patch conductor provided on one main surface of the substrate;
A ground conductor provided on the other main surface of the substrate,
The patch conductor includes at least two patch antennas that resonate in plane at a resonance frequency;
The patch antenna is opposed to each other with a gap, and has a concave cut region including the gap on one side or both sides,
The IC tag is at least partially in the cut region, the radiation field component of the IC tag and the resonance axis of the patch conductor are parallel, and the IC tag is not in electrical contact with the patch conductor or The wireless IC tag device is configured to be in contact with any one of the patch conductors.
　また本発明は、前記接地導体を、前記パッチ導体面の片側端部に延長して形成し、前記パッチ導体の電気的長さをそれぞれほぼ１／２としたものに接続することが好ましい。 Further, in the present invention, it is preferable that the ground conductor is formed to extend to one end portion of the patch conductor surface, and the patch conductors are connected to ones each having an electrical length of approximately ½.
　また本発明は、前記パッチアンテナの一方に凹状部が形成され、この凹状部に部分的に嵌合する凸状部を有する他方のパッチアンテナを有することが好ましい。 In the present invention, it is preferable that a concave portion is formed in one of the patch antennas, and the other patch antenna has a convex portion that is partially fitted into the concave portion.
　また本発明は、前記パッチアンテナは、前記ＩＣタグのタグアンテナの形状に少なくとも部分的に沿って近接して形成されることが好ましい。 In the present invention, it is preferable that the patch antenna is formed at least partially close to the shape of the tag antenna of the IC tag.
　また本発明は、前記ＩＣタグが前記パッチ導体と同一面上、もしくは前記パッチ導体の上側または下側に形成されることが好ましい。 In the present invention, it is preferable that the IC tag is formed on the same plane as the patch conductor or on the upper side or the lower side of the patch conductor.
　また本発明は、前記ＩＣタグの２つの端子を、それぞれ前記パッチ導体の片側の異なる２個所で接触させることが好ましい。 In the present invention, it is preferable that the two terminals of the IC tag are brought into contact with each other at two different points on one side of the patch conductor.
　また本発明は、前記基板または前記接地導体の少なくとも一方は、着脱可能であることが好ましい。 In the present invention, it is preferable that at least one of the substrate and the ground conductor is detachable.
　本発明によれば、基板の一方主面に、互いに間隔をあけて平面共振する２つのパッチ導体を有するパッチアンテナが設けられ、基板の他方主面には接地導体が設けられる。２つのパッチ導体の少なくとも一方には、他方のパッチ導体に臨む縁部から凹んだ凹状部が形成される。基板の一方主面の一方のパッチ導体の凹状部に囲まれた領域または凹状部と他方のパッチ導体との間の領域には、パッチアンテナの共振軸に沿って高い放射電界が発生するようにＩＣタグが設けられる。 According to the present invention, a patch antenna having two patch conductors that are planarly spaced apart from each other is provided on one main surface of the substrate, and a ground conductor is provided on the other main surface of the substrate. At least one of the two patch conductors is formed with a concave portion that is recessed from the edge facing the other patch conductor. A high radiated electric field is generated along the resonance axis of the patch antenna in a region surrounded by the concave portion of one patch conductor on one main surface of the substrate or a region between the concave portion and the other patch conductor. An IC tag is provided.
　このようにＩＣタグが２つのパッチ導体間に挟み込むように配置されるので、ＩＣタグの放射電界を各パッチ導体に有効に電磁結合させて、ＩＣタグからの各パッチ導体間の不要放射を抑制し、平面実装のみによって無線ＩＣタグ装置を製造することが可能となる。 Since the IC tag is arranged so as to be sandwiched between the two patch conductors in this way, the radiation electric field of the IC tag is effectively electromagnetically coupled to each patch conductor to suppress unnecessary radiation between the patch conductors from the IC tag. In addition, the wireless IC tag device can be manufactured only by plane mounting.
　したがって、前記従来技術のように、パッチ導体と接地導体との間にＩＣチップを接続するためのスルーホールなどを形成する必要がなく、簡単な構成で生産性を向上し、高感度の無線ＩＣタグ装置を実現することができる。 Therefore, unlike the prior art, there is no need to form a through hole or the like for connecting the IC chip between the patch conductor and the ground conductor, and the productivity is improved with a simple configuration and the wireless IC is highly sensitive. A tag device can be realized.
　また一方のパッチ導体は凹状部を有するので、一方のパッチ導体の電気長を共振軸に平行な直線方向に確保する場合に比べて、その差分だけ各パッチ導体の長さが短縮され、無線ＩＣタグ装置を小形化することができる。 Also, since one patch conductor has a concave portion, the length of each patch conductor is reduced by the difference compared to the case where the electrical length of one patch conductor is ensured in a linear direction parallel to the resonance axis. The tag device can be miniaturized.
　また本発明によれば、接地導体をパッチ導体の片側端部に延長して形成し、パッチ導体の長さをそれぞれ前記のパッチ導体のほぼ１／２としたものに接続することで、無線ＩＣタグの長さを短縮できるという効果を有する。 Further, according to the present invention, the ground conductor is formed so as to extend to one end portion of the patch conductor, and the length of the patch conductor is connected to the patch conductor that is approximately ½ of the patch conductor. This has the effect of shortening the tag length.
　また本発明によれば、他方のパッチ導体は、一方のパッチ導体の凹状部に部分的に嵌合する凸状部を有するので、パッチ導体とＩＣタグの放射電界とが効率的に結合すると共に、パッチ導体の形状に凹凸部を有することによる２つのパッチ導体の電気長の違いによって、より広い周波数帯域が得られるという効果を有する。 Further, according to the present invention, the other patch conductor has a convex portion that partially fits into the concave portion of the one patch conductor, so that the patch conductor and the radiated electric field of the IC tag are efficiently coupled. The patch conductor has an effect that a wider frequency band can be obtained due to the difference in electrical length between the two patch conductors due to the unevenness in the shape of the patch conductor.
　また本発明によれば、一方のパッチ導体の凹状部は、タグアンテナの形状に沿って近接して形成されるので、ＩＣタグの放射電界が効率的に結合すると共に、パッチ導体の形状に凹状部を有するため、２つのパッチ導体の電気長を変えることによって、より広い周波数帯域が得られるという効果を有する。また、パッチ導体面の無駄領域をなくし、有効に利用できるため、パッチ導体の放射効率をより大きくできる。 According to the present invention, since the concave portion of one patch conductor is formed close to the shape of the tag antenna, the radiation field of the IC tag is efficiently coupled and the concave shape is formed in the shape of the patch conductor. Therefore, it is possible to obtain a wider frequency band by changing the electrical length of the two patch conductors. Moreover, since the useless area of the patch conductor surface is eliminated and the patch conductor surface can be effectively used, the radiation efficiency of the patch conductor can be further increased.
　また本発明によれば、ＩＣタグのタグアンテナは、一方のパッチ導体または他方のパッチ導体の異なる２個所で接触するので、共振に伴い片側のパッチ導体上を流れる電流の一部がＩＣタグ側に流れ、同時にＩＣタグによりパッチ導体を強く励振するとともに、ＩＣタグからの放射電界で他方のパッチ導体を励振し、無線ＩＣタグ装置の感度を上げるという効果を有する。 Further, according to the present invention, the tag antenna of the IC tag is in contact at two different places on one patch conductor or the other patch conductor, so that part of the current flowing on the patch conductor on one side due to resonance is on the IC tag side. At the same time, the patch conductor is strongly excited by the IC tag, and the other patch conductor is excited by the radiated electric field from the IC tag, thereby increasing the sensitivity of the wireless IC tag device.
　また本発明によれば、ＩＣタグのタグアンテナは、パッチ導体と同一平面上の他に、パッチ導体の上側、または下側に形成される。パッチ導体と同一平面状に形成される場合は、パッチ導体とＩＣタグのタグアンテナを同時に作成できるという製造上の効果を有する。また、パッチ導体の上側にＩＣタグが形成される場合は、ＩＣタグ上部に印刷可能な面を設けることで、文字などを印字する場合、印刷が容易であるという効果を有する。さらにパッチ導体の下側にＩＣタグが形成される場合は、ＩＣなどの回路部がパッチ導体によって保護されるという効果を有する。 According to the present invention, the tag antenna of the IC tag is formed on the upper side or the lower side of the patch conductor in addition to the same plane as the patch conductor. When formed in the same plane as the patch conductor, there is a manufacturing effect that the patch conductor and the tag antenna of the IC tag can be formed simultaneously. In addition, when the IC tag is formed on the upper side of the patch conductor, by providing a printable surface on the upper part of the IC tag, when printing characters or the like, there is an effect that printing is easy. Furthermore, when the IC tag is formed below the patch conductor, there is an effect that a circuit portion such as an IC is protected by the patch conductor.
　また本発明によれば、基板または接地導体は着脱可能な形態であるので、無線ＩＣタグ装置を貼り付ける物体が金属面を有する場合には、それを接地導体として利用することができる。また無線ＩＣタグ装置を貼り付ける物体を誘電体基板とし、金属箔のテープなどを接地導体として利用することもできるので、構成が簡単になるという効果を有する。 Further, according to the present invention, since the substrate or the ground conductor is detachable, if the object to which the wireless IC tag device is attached has a metal surface, it can be used as the ground conductor. In addition, since the object to which the wireless IC tag device is attached can be used as a dielectric substrate and a metal foil tape or the like can be used as a ground conductor, the structure can be simplified.
　本発明の目的、特色、および利点は、下記の詳細な説明と図面とからより明確になるであろう。
本発明の実施形態１の無線ＩＣタグ装置１Ａ１を示す平面図である。 図１の切断面線ＩＩ－ＩＩから見た断面図である。 本発明の実施形態１の無線ＩＣタグ装置１Ａ１に類似する他の実施形態２～５の無線ＩＣタグ装置１Ａ２～１Ａ５を示す平面図であり、図３Ａ（１）は実施形態２の無線ＩＣタグ装置１Ａ２を示し、図３Ａ（２）は実施形態３の無線ＩＣタグ装置１Ａ３を示し、図３（３）は実施形態４の無線ＩＣタグ装置１Ａ４を示し、図３Ａ（４）は実施形態５の無線ＩＣタグ装置１Ａ５を示す。 本発明の実施形態１に類似する無線ＩＣタグ装置の構造を断面で示した図であり、図３Ｂ（１）は無線ＩＣタグ装置１Ｂ１の断面構造を示し、図３Ｂ（２）は無線ＩＣタグ装置１Ｂ２の断面構造を示し、図３Ｂ（３）は無線ＩＣタグ装置１Ｂ３の断面構造を示す。 本発明の実施形態６の無線ＩＣタグ装置１Ｃ１を示す平面図である。 図４の切断面線Ｖ－Ｖから見た断面図である。 本発明の実施形態６に類似する無線ＩＣタグ装置の構造を断面から表示した図であり、図６Ａ（１）は無線ＩＣタグ装置１Ｃ２の断面構造を示し、図６Ａ（２）は無線ＩＣタグ装置１Ｃ３の断面構造を示し、図６Ａ（３）は無線ＩＣタグ装置１Ｃ４の断面構造を示す。 本発明の他の実施形態７の無線ＩＣタグ装置１Ｄを示す平面図である。 図６Ｂの切断面線ＶＩＣ－ＶＩＣから見た断面図である。 本発明の他の実施形態８の無線ＩＣタグ装置１Ｅを示す平面図である。 図６Ｄの切断面線ＶＩＥ－ＶＩＥから見た断面図である。 本発明の実施形態９の無線ＩＣタグ装置１Ｆを示す平面図である。 図７の切断面線ＶＩＩＩ－ＶＩＩＩから見た断面図である。 本発明の実施形態１０の無線ＩＣタグ装置１Ｇを示す平面図である。 図９の切断面線Ｘ－Ｘから見た断面図である。 本発明の実施形態１１の無線ＩＣタグ装置１Ｈ１を示す平面図である。 図１１の切断面線ＸＩＩ－ＸＩＩから見た断面図である。 本発明の実施形態１１の無線ＩＣタグ装置１Ｈ１に類似する他の実施形態１２～１４の無線ＩＣタグ装置１Ｈ２～１Ｈ４を示す平面図であり、図１３Ａ（１）は実施形態１２の無線ＩＣタグ装置１Ｈ２を示し、図１３Ａ（２）は実施形態１３の無線ＩＣタグ装置１Ｈ３を示し、図１３Ａ（３）は実施形態１４の無線ＩＣタグ装置１Ｈ４を示す。 本発明の実施形態１１に類似する無線ＩＣタグ装置の構造を断面から表示した図であり、図１３Ｂ（１）は無線ＩＣタグ装置１Ｉ１の断面構造を示し、図１３Ｂ（２）は無線ＩＣタグ装置１Ｉ２の断面構造を示し、図１３Ｂ（３）は無線ＩＣタグ装置１Ｉ３の断面構造を示す。 本発明の他の実施形態１５の無線ＩＣタグ装置１Ｊを示す平面図である。 図１４の切断面線ＸＶ－ＸＶから見た断面図である。 Objects, features, and advantages of the present invention will become more apparent from the following detailed description and drawings.
1 is a plan view showing a wireless IC tag device 1A1 according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view taken along a section line II-II in FIG. FIG. 3A is a plan view showing wireless IC tag devices 1A2 to 1A5 of other second to fifth embodiments similar to the wireless IC tag device 1A1 of the first embodiment of the present invention, and FIG. 3A (1) is a wireless IC tag of the second embodiment. 3A (2) shows the wireless IC tag device 1A3 of the third embodiment, FIG. 3 (3) shows the wireless IC tag device 1A4 of the fourth embodiment, and FIG. 3A (4) shows the fifth embodiment. The wireless IC tag device 1A5 is shown. FIG. 3B is a cross-sectional view of the structure of the wireless IC tag device similar to the first embodiment of the present invention, FIG. 3B (1) shows the cross-sectional structure of the wireless IC tag device 1B1, and FIG. 3B (2) is the wireless IC tag. A cross-sectional structure of the device 1B2 is shown, and FIG. 3B (3) shows a cross-sectional structure of the wireless IC tag device 1B3. It is a top view which shows the radio | wireless IC tag apparatus 1C1 of Embodiment 6 of this invention. FIG. 5 is a cross-sectional view taken along the section line VV in FIG. 4. FIG. 6A is a cross-sectional view of the structure of a wireless IC tag device similar to Embodiment 6 of the present invention. FIG. 6A (1) shows the cross-sectional structure of the wireless IC tag device 1C2, and FIG. 6A (2) is the wireless IC tag. A cross-sectional structure of the device 1C3 is shown, and FIG. 6A (3) shows a cross-sectional structure of the wireless IC tag device 1C4. It is a top view which shows radio | wireless IC tag apparatus 1D of other Embodiment 7 of this invention. FIG. 6B is a cross-sectional view taken along section line VIC-VIC in FIG. 6B. It is a top view which shows the radio | wireless IC tag apparatus 1E of other Embodiment 8 of this invention. 6D is a cross-sectional view taken along section line VIE-VIE in FIG. 6D. FIG. It is a top view which shows the radio | wireless IC tag apparatus 1F of Embodiment 9 of this invention. FIG. 8 is a cross-sectional view taken along section line VIII-VIII in FIG. It is a top view which shows 1 G of radio | wireless IC tag apparatuses of Embodiment 10 of this invention. FIG. 10 is a cross-sectional view taken along the section line XX of FIG. 9. It is a top view which shows the radio | wireless IC tag apparatus 1H1 of Embodiment 11 of this invention. FIG. 12 is a cross-sectional view taken along section line XII-XII in FIG. FIG. 13A is a plan view showing wireless IC tag devices 1H2 to 1H4 of other embodiments 12 to 14 similar to the wireless IC tag device 1H1 of embodiment 11 of the present invention, and FIG. 13A (1) is a wireless IC tag of the embodiment 12. FIG. 13A (2) shows the wireless IC tag device 1H3 of the thirteenth embodiment, and FIG. 13A (3) shows the wireless IC tag device 1H4 of the fourteenth embodiment. FIG. 13B is a view showing a structure of a wireless IC tag device similar to the eleventh embodiment of the present invention from a cross section, FIG. 13B (1) shows a cross-sectional structure of the wireless IC tag device 1I1, and FIG. FIG. 13B (3) shows a cross-sectional structure of the wireless IC tag device 1I3. It is a top view which shows the radio | wireless IC tag apparatus 1J of other Embodiment 15 of this invention. FIG. 15 is a cross-sectional view taken along the section line XV-XV in FIG. 14.
　以下、図面を参考にして、本発明の好適な実施形態を詳細に説明する。
　図１は本発明の実施形態１の無線ＩＣタグ装置１Ａ１を示す平面図であり、図２は図１の切断面線ＩＩ－ＩＩから見た断面図である。本実施形態の無線ＩＣタグ装置１Ａ１は、誘電体からなる平板状の基板２と、基板２の一方主面２ａ上に形成される２つのパッチ導体３ａ，３ｂを含んで構成されるパッチアンテナ３と、基板２の他方主面２ｂの全面に形成された接地導体４と、ＩＣタグ５とを備える。本実施形態１は、ＩＣタグ５をパッチ導体３ａ，３ｂと基板２の一方主面２ａ上に同一平面で一体形成した場合を示す。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view showing a wireless IC tag device 1A1 according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view taken along the section line II-II in FIG. The wireless IC tag device 1A1 according to the present embodiment includes a patch antenna 3 including a flat substrate 2 made of a dielectric and two patch conductors 3a and 3b formed on one main surface 2a of the substrate 2. And a ground conductor 4 formed on the entire other main surface 2 b of the substrate 2, and an IC tag 5. In the first embodiment, the IC tag 5 is integrally formed on the patch conductors 3a and 3b and one main surface 2a of the substrate 2 on the same plane.
　基板２は、各パッチ導体３ａ，３ｂ、接地導体４およびＩＣタグ５の位置関係を保つことができれば、電磁エネルギの損失の低い、すなわち通信周波数帯域で誘電正接ｔａｎδが低い材料を用いることが好ましい。誘電正接ｔａｎδの値としては、たとえば０．０２以下であることが好ましい。このような材料としては、下記に例示するような誘電体基材を用いることができる。 As long as the positional relationship among the patch conductors 3a and 3b, the ground conductor 4 and the IC tag 5 can be maintained, the substrate 2 is preferably made of a material with a low loss of electromagnetic energy, that is, a low dielectric loss tangent tan δ in the communication frequency band. . The value of the dielectric loss tangent tan δ is preferably 0.02 or less, for example. As such a material, a dielectric substrate as exemplified below can be used.
　誘電体基材としては、ポリプロピレン、ポリエチレンテレフタレート(ＰＥＴ)、ポリイミド、ガラスエポキシ基板、フッ素樹脂基板などがある。 Examples of the dielectric base material include polypropylene, polyethylene terephthalate (PET), polyimide, glass epoxy substrate, and fluororesin substrate.
　基板２の一方主面２ａ上に形成されたパッチアンテナ３および基板２の他方主面２ｂ上に形成された接地導体４は、電波偏波変換共振反射器を構成する。本実施形態では、電波偏波変換共振反射器が、楕円偏波の軸比が無限大となる直線偏波信号に有効に作用する例を示している。 The patch antenna 3 formed on the one main surface 2a of the substrate 2 and the ground conductor 4 formed on the other main surface 2b of the substrate 2 constitute a radio wave polarization conversion resonant reflector. In the present embodiment, an example is shown in which the radio wave polarization conversion resonant reflector effectively acts on a linearly polarized signal in which the axial ratio of elliptically polarized waves is infinite.
　ＩＣタグ５は、基板２上に形成されたタグアンテナ５１と、その給電点に実装された回路部であるタグＩＣ(Integrated Circuit)５２とによって構成される。ＩＣタグ５は、放射電界が、パッチ導体３ａ，３ｂの共振軸と平行になるように配置されることが好ましい。 The IC tag 5 includes a tag antenna 51 formed on the substrate 2 and a tag IC (Integrated Circuit) 52 which is a circuit unit mounted on the feeding point. The IC tag 5 is preferably arranged so that the radiated electric field is parallel to the resonance axes of the patch conductors 3a and 3b.
　電波放射導体となる２つのパッチ導体３ａ，３ｂは、長さ方向Ｘに誘電体上での実効波長で略１／２波長の長さＬを有し、長さ方向Ｘに垂直な方向Ｙに互いに間隔ｄをあけて接近し、電気的に非接触の状態で配置される。 The two patch conductors 3a and 3b serving as radio wave radiating conductors have a length L that is approximately ½ wavelength in terms of the effective wavelength on the dielectric in the length direction X, and in a direction Y perpendicular to the length direction X. They are close to each other with a distance d and are arranged in an electrically non-contact state.
　２つのパッチ導体３ａ，３ｂは、図１の紙面に平行な一平面上で、互いに近接した各縁部から凹んだ凹状部６ａ，６ｂを有し、一方主面２ａの各凹状部６ａ，６ｂ間の領域には、ＩＣタグ５が配置され、２つのパッチ導体３ａ，３ｂの少なくともいずれか一方から放射される電磁界を、ＩＣタグ５のタグアンテナ５１で受信するように構成されている。 The two patch conductors 3a and 3b have concave portions 6a and 6b that are recessed from the edges close to each other on a plane parallel to the paper surface of FIG. 1, and the concave portions 6a and 6b of the main surface 2a. The IC tag 5 is disposed in the area between them, and an electromagnetic field radiated from at least one of the two patch conductors 3a and 3b is received by the tag antenna 51 of the IC tag 5.
　パッチ導体３ａ，３ｂの凹状部６ａ，６ｂは、そのパッチのエッジ部を流れる電流が迂回するため電流経路が長くなり、パッチ導体３ａ，３ｂの長さＬに対する電気長よりも長くなる。そのため、凹状部６ａ，６ｂを設けたパッチ導体３ａ，３ｂでは、長さＬに対する共振周波数と同じにするには、長さＬを短縮する必要がある。 The concave portions 6a and 6b of the patch conductors 3a and 3b have a longer current path because the current flowing through the edge portion of the patch is bypassed, and are longer than the electrical length with respect to the length L of the patch conductors 3a and 3b. Therefore, in the patch conductors 3a and 3b provided with the concave portions 6a and 6b, the length L needs to be shortened to be the same as the resonance frequency with respect to the length L.
　ＩＣタグ５は、２つのパッチ導体３ａ，３ｂに囲まれており、ＩＣタグ５が起動し、それから放射される電磁界成分は有効にパッチ導体３ａ，３ｂと結合し、ＩＣタグ５からの無駄な電磁波放射は減少する。 The IC tag 5 is surrounded by two patch conductors 3a and 3b. The IC tag 5 is activated, and the electromagnetic field component radiated from the IC tag 5 is effectively combined with the patch conductors 3a and 3b. Electromagnetic radiation is reduced.
　各パッチ導体３ａ，３ｂ間の間隔ｄは、信号周波数（または通信周波数）の１／２波長よりも充分短い間隔とすることが望ましい。従って、図１および図２に示す構造を採用することで、簡単な構成のもとに高感度化を達成できる上、無線ＩＣタグ装置１Ａ１の長さ方向Ｘの寸法形状を小さくすることができる。特に、ＩＣタグ５が２つのパッチアンテナ３ａ，３ｂと強く電磁結合したときには、より高感度となる。 It is desirable that the interval d between the patch conductors 3a and 3b is sufficiently shorter than a half wavelength of the signal frequency (or communication frequency). Therefore, by adopting the structure shown in FIG. 1 and FIG. 2, high sensitivity can be achieved with a simple configuration, and the dimension shape in the length direction X of the wireless IC tag device 1A1 can be reduced. . In particular, when the IC tag 5 is strongly electromagnetically coupled to the two patch antennas 3a and 3b, the sensitivity becomes higher.
　なお、図１および図２の構造において、無線ＩＣタグ装置１Ａ１の感度を向上するために、基板２上の２つのパッチ導体３ａ，３ｂのいずれか一方または双方に、各パッチ導体３ａ，３ｂとは異なる他のパッチ導体を、前記一方のパッチ導体３aまたは前記他方のパッチ導体３ｂの外側に接近させ、それと平行に形成してもよい。 In the structure of FIGS. 1 and 2, in order to improve the sensitivity of the wireless IC tag device 1A1, either one or both of the two patch conductors 3a and 3b on the substrate 2 are connected to the patch conductors 3a and 3b. Other patch conductors different from each other may be formed close to and outside the one patch conductor 3a or the other patch conductor 3b.
　次に、ＩＣタグ５の実装位置に関して説明する。 Next, the mounting position of the IC tag 5 will be described.
　ＩＣタグ５は、タグアンテナ５１のアンテナ長軸が長さ方向Ｘに平行な軸に対して平行となるように配置されている。なお、ＩＣタグ５の両端部（長さ方向Ｘにおける両端部）は、タグアンテナ５１の形態に応じて、パッチ導体３ａ，３ｂの上方からみてパッチ導体３ａ，３ｂ上に重なった状態で配置されてもよく、パッチ導体３ａ，３ｂには重ならない状態で配置されてもよい。 The IC tag 5 is arranged so that the antenna major axis of the tag antenna 51 is parallel to the axis parallel to the length direction X. Note that both end portions of the IC tag 5 (both end portions in the length direction X) are arranged on the patch conductors 3a and 3b as viewed from above the patch conductors 3a and 3b according to the form of the tag antenna 51. Alternatively, the patch conductors 3a and 3b may be arranged so as not to overlap.
　そして、ＩＣタグ５の位置は、パッチ導体３ａ，３ｂの少なくとも一方の共振と同時に放射される電界を、タグアンテナ５１が効率よく受信できるような位置に配置する。なお、ＩＣタグ５の最適配置位置は、無線ＩＣタグ装置１Ａ１の通信感度が最大となるような位置を実験的に求めればよい。 The position of the IC tag 5 is arranged such that the tag antenna 51 can efficiently receive the electric field radiated simultaneously with the resonance of at least one of the patch conductors 3a and 3b. In addition, what is necessary is just to obtain | require experimentally the optimal arrangement | positioning position of IC tag 5 so that the communication sensitivity of wireless IC tag apparatus 1A1 may become the maximum.
　次に、無線ＩＣタグ装置１Ａ１の動作について説明する。
　前記２つのパッチ導体３ａ，３ｂは、長さ方向Ｘに平行な共振軸の両端で開放境界となり、基板２の一方主面２ａ上において、各パッチ導体３ａ，３ｂの長さＬを、使用する信号周波数ｆに対する等価波長λｆの略１／２に設定する。このとき、２つのパッチ導体３ａ，３ｂは、共振周波数ｆ０近傍で平面共振を伴う。なお、後述するように無線ＩＣタグ装置１Ａ１の広帯域化のためには、２つのパッチ導体３ａ，３ｂの等価的電気長を異ならせ、異なった共振周波数に設定する。 Next, the operation of the wireless IC tag device 1A1 will be described.
The two patch conductors 3a and 3b become open boundaries at both ends of the resonance axis parallel to the length direction X, and the length L of each patch conductor 3a and 3b is used on one main surface 2a of the substrate 2. It is set to approximately ½ of the equivalent wavelength λf with respect to the signal frequency f. At this time, the two patch conductors 3a and 3b are accompanied by plane resonance near the resonance frequency f0. As will be described later, in order to increase the bandwidth of the wireless IC tag device 1A1, the equivalent electrical lengths of the two patch conductors 3a and 3b are made different and set to different resonance frequencies.
　このような基板２に形成された２つのパッチ導体３ａ，３ｂおよび接地導体４によって構成される電波偏波変換共振反射器は、２つのパッチ導体３ａ，３ｂに対して到来する長さ方向Ｘの電界Ｅを有する直線偏波信号成分に対して効果的に共振する。そして、到来する信号波が２つのパッチ導体３ａ，３ｂで共振を生じたとき、その近傍に強い電磁界を発生させ、共振と同時に電界Ｅが放射される。この放射された電界Ｅは、パッチ導体３ａ，３ｂの表面に垂直な上方向（図１の紙面に垂直な方向）と、パッチ導体３ａ，３ｂの表面に平行な横方向および斜め上方向に向かって再放射される。 The radio wave polarization conversion resonant reflector constituted by the two patch conductors 3a and 3b and the ground conductor 4 formed on the substrate 2 in the length direction X arriving with respect to the two patch conductors 3a and 3b. It effectively resonates with respect to the linearly polarized signal component having the electric field E. When the incoming signal wave resonates in the two patch conductors 3a and 3b, a strong electromagnetic field is generated in the vicinity thereof, and the electric field E is radiated simultaneously with the resonance. The radiated electric field E is directed upward in a direction perpendicular to the surfaces of the patch conductors 3a and 3b (a direction perpendicular to the paper surface of FIG. 1), and in a lateral direction and a diagonally upward direction parallel to the surfaces of the patch conductors 3a and 3b. Re-radiated.
　ここで、２つのパッチ導体３ａ，３ｂが近接して配置されている場合、一方のパッチ導体３ａと他方のパッチ導体３ｂとは、同様な方向に強い電磁界が分布する。さらに、２つのパッチ導体３ａ，３ｂの各共振によって放射される電界Ｅは、ＩＣタグ５を配置したとき、２つのパッチ導体３ａ，３ｂによる共振に伴う強い共振電界によって、ＩＣタグ５のタグアンテナ５１に強い電流を誘起し、それらの相互電磁結合によってタグＩＣ５２の情報を伴った電波が放射される。 Here, when the two patch conductors 3a and 3b are arranged close to each other, a strong electromagnetic field is distributed in the same direction between the one patch conductor 3a and the other patch conductor 3b. Further, the electric field E radiated by each resonance of the two patch conductors 3a and 3b is generated when the IC tag 5 is disposed, and the tag antenna of the IC tag 5 is caused by the strong resonance electric field accompanying the resonance by the two patch conductors 3a and 3b. A strong current is induced in 51, and radio waves accompanied by information of the tag IC 52 are radiated by their mutual electromagnetic coupling.
　このように、２つのパッチ導体３ａ，３ｂの共振・放射する電界を利用することによって、タグＩＣ５２内には強い電流が発生し、ＩＣタグ５の動作がより確実なものとなる。 As described above, by using the electric field that resonates and radiates the two patch conductors 3a and 3b, a strong current is generated in the tag IC 52, and the operation of the IC tag 5 becomes more reliable.
　無線ＩＣタグ装置１Ａ１を用いて、リーダ、リーダアンテナ、および、無線ＩＣタグ装置１Ａ１によって構成される移動体識別（Radio Frequency Identification；略称ＲＦＩＤ）システムを構築することができる。そのＲＦＩＤ動作について、以下に説明する。 Using the wireless IC tag device 1A1, it is possible to build a mobile object identification (Radio Frequency Identification; abbreviated RFID) system composed of a reader, a reader antenna, and the wireless IC tag device 1A1. The RFID operation will be described below.
　まず、リーダから送られた信号波は、２つのパッチ導体３ａ，３ｂで平面共振する。この平面共振によって共振電磁界が発生すると同時に、共振電磁界が放射される。放射された電界Ｅは、放射方向に沿って配置されたＩＣタグ５のタグアンテナ５１に作用し、タグアンテナ５１内に電流を発生させる。 First, the signal wave sent from the reader resonates in plane with the two patch conductors 3a and 3b. A resonant electromagnetic field is generated by this plane resonance, and at the same time, a resonant electromagnetic field is radiated. The radiated electric field E acts on the tag antenna 51 of the IC tag 5 arranged along the radiation direction, and generates a current in the tag antenna 51.
　このとき、上記したように、１つのタグアンテナ５１の両側で、それぞれ独立した２つのパッチ導体３ａ，３ｂからの放射電界を取り込んで加算するため、タグアンテナ５１内を流れる電流は、パッチ導体３ａ，３ｂが１つの場合よりも強くなる。 At this time, as described above, the radiated electric fields from the two independent patch conductors 3a and 3b are captured and added on both sides of the single tag antenna 51, so that the current flowing in the tag antenna 51 is the patch conductor 3a. , 3b is stronger than in the case of one.
　タグアンテナ５１内を流れる電流は、タグＩＣ５２内の整流器に作用し、タグＩＣ５２の駆動電圧を発生させる。これによってタグＩＣ５２が起動し、タグアンテナ５１内を流れる電流は、メモリ内の情報信号で変調される。 The current flowing in the tag antenna 51 acts on the rectifier in the tag IC 52 and generates a driving voltage for the tag IC 52. As a result, the tag IC 52 is activated, and the current flowing in the tag antenna 51 is modulated by the information signal in the memory.
　タグアンテナ５１で変調を伴った信号電流は、タグアンテナ５１と平行な放射電界Ｅを発生し、電波を放射する。このようにしてＩＣタグ５から放射された変調信号波は、パッチ導体３a，３ｂを介してリーダのアンテナに送出される。リーダでは、この信号波を受信・復調し、ＩＣタグ５内のメモリ情報が認識される。 The signal current accompanied with the modulation by the tag antenna 51 generates a radiation electric field E parallel to the tag antenna 51 and radiates radio waves. The modulated signal wave radiated from the IC tag 5 in this way is sent to the reader antenna via the patch conductors 3a and 3b. The reader receives and demodulates this signal wave, and the memory information in the IC tag 5 is recognized.
　以上のように、無線ＩＣタグ装置１Ａ１によれば、ＲＦＩＤ動作において、リーダから送られた信号波が、２つのパッチ導体３ａ，３ｂによる共振によって、ＩＣタグ５に、より強い信号波を与えることができるので、通信感度を高めることができ、通信距離を延長することができる。 As described above, according to the wireless IC tag device 1A1, in the RFID operation, the signal wave sent from the reader gives a stronger signal wave to the IC tag 5 due to resonance by the two patch conductors 3a and 3b. Therefore, the communication sensitivity can be increased and the communication distance can be extended.
　前述の実施形態では、基板２の一方主面２ａに２つのパッチ導体３ａ，３ｂを電気的に非接触の状態で形成しているが、パッチ導体３ａ，３ｂの配置には他の様々な形態が考えられる。具体的には、例えば、基板２の一方主面２ａに３つ以上のパッチ導体を電気的に非接触の状態で形成し、それらの３つ以上のパッチ導体の共振と同時に放射される電界Ｅをタグアンテナ５１で効率よく受信できる位置にＩＣタグ５を配置する形態を挙げることができる。 In the above-described embodiment, the two patch conductors 3a and 3b are formed on the one main surface 2a of the substrate 2 in an electrically non-contact state, but there are various other forms of arrangement of the patch conductors 3a and 3b. Can be considered. Specifically, for example, three or more patch conductors are formed in an electrically non-contact state on the one main surface 2a of the substrate 2, and the electric field E radiated simultaneously with the resonance of the three or more patch conductors. The IC tag 5 can be arranged at a position where the tag antenna 51 can efficiently receive the signal.
　またＩＣタグ５の２つの端子を、それぞれ前記パッチ導体３ａ，３ｂの片側の異なる２個所で接触させることによって、パッチ導体３ａ，３ｂの凹状部６ａ，６ｂの凹凸形状の調整により、タグＩＣ５２とタグアンテナ５１とのインピーダンスの整合調整を行うことも可能となり、ＩＣタグ５の調整が容易になる。 Further, by bringing the two terminals of the IC tag 5 into contact at two different locations on one side of the patch conductors 3a and 3b, respectively, by adjusting the concave and convex shapes of the concave portions 6a and 6b of the patch conductors 3a and 3b, It is possible to adjust the impedance matching with the tag antenna 51, and the IC tag 5 can be easily adjusted.
　また、間隔ｄをあけて分割された少なくとも２つのパッチ導体３ａ，３ｂでＩＣタグ５を挟み込む構成であるので、ＩＣタグ５の放射電界をパッチアンテナ３に有効に結合させることができ、無線ＩＣタグ５の不要な電磁波放射を軽減して、感度を高めることができる。 In addition, since the IC tag 5 is sandwiched between at least two patch conductors 3a and 3b divided with a gap d, the radiated electric field of the IC tag 5 can be effectively coupled to the patch antenna 3, and the wireless IC Unnecessary electromagnetic radiation of the tag 5 can be reduced and sensitivity can be increased.
　また、２つのパッチ導体３ａ，３ｂを近接させ、それぞれの共振周波数ｆ０を僅かに変化させることによって、ＩＣタグ５の広帯域化を図ることができる。共振周波数ｆ０の調整は、間隔ｄの位置や凹状部６ａ，６ｂの形状によって、対向する２つのパッチ導体３ａ，３ｂの電気長を変え、２つのパッチ導体３ａ，３ｂの共振周波数ｆ０を変えて、広帯域化を図ることができる。なお、上記説明では、特に２つのパッチ導体３ａ，３ｂとＩＣタグ５との電磁結合について説明したが、間隔ｄによっては、２つのパッチ導体３ａ，３ｂ間で電磁結合が生じ、その効果として同時に広帯域化、高感度化を図ることができる。 Further, by making the two patch conductors 3a and 3b close to each other and slightly changing the resonance frequency f0, it is possible to increase the bandwidth of the IC tag 5. The resonance frequency f0 is adjusted by changing the electrical length of the two opposing patch conductors 3a and 3b and changing the resonance frequency f0 of the two patch conductors 3a and 3b according to the position of the interval d and the shape of the concave portions 6a and 6b. Therefore, it is possible to increase the bandwidth. In the above description, the electromagnetic coupling between the two patch conductors 3a and 3b and the IC tag 5 has been described. However, depending on the distance d, the electromagnetic coupling occurs between the two patch conductors 3a and 3b. Broadband and high sensitivity can be achieved.
　また、各パッチ導体３ａ，３ｂに凹状部６ａ，６ｂを設けることによって、不要放射を少なくすると共に、各パッチ導体３ａ，３ｂの等価電気長を長くして、その変化分だけパッチ導体３ａ，３ｂのＸ方向長さを短縮することによって、無線ＩＣタグ装置１Ａ１の小形化を図ることができる。 Further, by providing the patch conductors 3a and 3b with the concave portions 6a and 6b, unnecessary radiation is reduced, and the equivalent electrical length of the patch conductors 3a and 3b is lengthened, and the patch conductors 3a and 3b are changed by the amount of the change. By reducing the length in the X direction, the size of the wireless IC tag device 1A1 can be reduced.
　このように、本実施形態では、パッチ導体３ａ，３ｂを有するパッチアンテナ３とＩＣタグ５とを同一の平面内に形成することができるので、製造方法が容易であり、無線ＩＣタグ装置１Ａ１を大量に生産する際の生産効率を格段に向上することができる。
　なお、上記パッチ導体３ａ，３ｂでは、パッチ導体３ａ，３ｂの長辺の片側に凹部を設けているが、パッチ導体３ａ，３ｂを短縮するため、さらに他の辺にも切込み凹部を設けてもよい。 Thus, in this embodiment, since the patch antenna 3 having the patch conductors 3a and 3b and the IC tag 5 can be formed in the same plane, the manufacturing method is easy, and the wireless IC tag device 1A1 is provided. The production efficiency when producing in large quantities can be greatly improved.
In the patch conductors 3a and 3b, the concave portions are provided on one side of the long sides of the patch conductors 3a and 3b. Good.
　図３Ａは、本発明の実施形態１の無線ＩＣタグ装置１Ａ１に類似する他の実施形態２～５の無線ＩＣタグ装置１Ａ２～１Ａ５を示す平面図であり、図３Ａ（１）は実施形態２の無線ＩＣタグ装置１Ａ２を示し、図３Ａ（２）は実施形態３の無線ＩＣタグ装置１Ａ３を示し、図３Ａ（３）は実施形態４の無線ＩＣタグ装置１Ａ４を示し、図３Ａ（４）は実施形態５の無線ＩＣタグ装置１Ａ５を示す。なお、前述の実施形態１に対応する部分には、同一の参照符を付し、重複する説明は省略する。 FIG. 3A is a plan view showing wireless IC tag devices 1A2 to 1A5 of other embodiments 2 to 5 similar to wireless IC tag device 1A1 of embodiment 1 of the present invention, and FIG. 3A (1) is a second embodiment. 3A (2) shows the wireless IC tag device 1A3 of the third embodiment, FIG. 3A (3) shows the wireless IC tag device 1A4 of the fourth embodiment, and FIG. 3A (4). These show wireless IC tag apparatus 1A5 of Embodiment 5. FIG. Note that portions corresponding to those of the first embodiment are denoted by the same reference numerals, and redundant description is omitted.
　図３Ａ（１）に示す実施形態２の無線ＩＣタグ装置１Ａ２は、ＩＣタグ５が空隙を含み、片側のパッチ導体３ｂと重なる構造である。また図３Ａ（２）に示す実施形態３の無線ＩＣタグ装置１Ａ３は、ＩＣタグ５が空隙を含み、両側のパッチ導体３ａ，３ｂと重なる構造である。さらに図３Ａ（３）に示す実施形態４の無線ＩＣタグ装置１Ａ４は、ＩＣタグ５が片側のパッチ導体３ｂの凹状部６ｂ内に配置され、凹状部６ａのない一方のパッチ導体３ａと組合わせた構造である。さらに図３Ａ（４）に示す実施形態５の無線ＩＣタグ装置１Ａ５は、ＩＣタグ５が片側のパッチ導体３ｂの凹状部６ｂ内に配置され、凹状部６ａを有する一方のパッチ導体３ａと組合わせた構造である。 The wireless IC tag device 1A2 of Embodiment 2 shown in FIG. 3A (1) has a structure in which the IC tag 5 includes a gap and overlaps with the patch conductor 3b on one side. The wireless IC tag device 1A3 of Embodiment 3 shown in FIG. 3A (2) has a structure in which the IC tag 5 includes a gap and overlaps with the patch conductors 3a and 3b on both sides. Further, in the wireless IC tag device 1A4 of the fourth embodiment shown in FIG. 3A (3), the IC tag 5 is disposed in the concave portion 6b of the patch conductor 3b on one side, and is combined with one patch conductor 3a having no concave portion 6a. Structure. Further, in the wireless IC tag device 1A5 of Embodiment 5 shown in FIG. 3A (4), the IC tag 5 is disposed in the concave portion 6b of the patch conductor 3b on one side, and is combined with one patch conductor 3a having the concave portion 6a. Structure.
　このような実施形態２～５においても、前述の実施形態１と同様な効果を達成することができる。 In the second to fifth embodiments, the same effects as those of the first embodiment can be achieved.
　以上の実施形態１～５では、ＩＣタグ５をパッチ導体３ａ，３ｂの上側に配置しているが、これに限られることなく、後述する図３Ｂに示すように、ＩＣタグ５を各パッチ導体３ａ，３ｂのいずれか一方または双方の下側に配置してもよい。このような構成によれば、ＩＣタグ５の物理的損傷、および、タグＩＣ５２の静電気による破損を、当該ＩＣタグ５を被覆している各パッチ導体３ａ，３ｂのいずれか一方または双方によって防ぐことができる。 In the above first to fifth embodiments, the IC tag 5 is disposed above the patch conductors 3a and 3b. However, the present invention is not limited to this, and the IC tag 5 is attached to each patch conductor as shown in FIG. You may arrange | position under either one or both of 3a and 3b. According to such a configuration, physical damage to the IC tag 5 and damage to the tag IC 52 due to static electricity are prevented by one or both of the patch conductors 3a and 3b covering the IC tag 5. Can do.
　図３Ａにおいて、２つのパッチ導体３ａ，３ｂとＩＣタグ５の形成には色々な方法がある。例えば、パッチ導体３ａ，３ｂに対してＩＣタグ５を同一平面に設けるか、パッチ導体３ａ，３ｂの上側、または下側に積層して設けることができる。この場合、パッチ導体３ａ，３ｂとＩＣタグ５のタグアンテナ５１とは、電気的に接触させてもよく、あるいは非接触であってもよい。 3A, there are various methods for forming the two patch conductors 3a and 3b and the IC tag 5. For example, the IC tag 5 may be provided on the same plane with respect to the patch conductors 3a and 3b, or may be provided on the upper side or the lower side of the patch conductors 3a and 3b. In this case, the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 may be brought into electrical contact or may be in non-contact.
　積層方法においても、ＩＣタグ５をパッチ導体３ａ，３ｂに貼り付けたり、パッチ導体３ａ，３ｂに対してタグアンテナ５１を印刷または蒸着法によって直接形成し、タグＩＣ５２を実装してもよい。また、パッチ導体３ａ，３ｂとタグアンテナ５１とを一体導体で形成し、タグＩＣ５２を実装することもできる。また、パッチ導体３ａ，３ｂとＩＣタグ５との電磁結合を最適化するため、パッチ導体３ａ，３ｂとＩＣタグ５との間に誘電体フィルムまたは誘電体シートを挟んでもよい。また、保護のため、ＩＣタグ５やパッチ導体３ａ，３ｂは、誘電体材料によってコーティング処理されてもよい。 Also in the lamination method, the tag IC 52 may be mounted by attaching the IC tag 5 to the patch conductors 3a and 3b, or directly forming the tag antenna 51 on the patch conductors 3a and 3b by printing or vapor deposition. In addition, the patch conductors 3a and 3b and the tag antenna 51 can be formed of a single conductor, and the tag IC 52 can be mounted. Further, in order to optimize the electromagnetic coupling between the patch conductors 3 a and 3 b and the IC tag 5, a dielectric film or a dielectric sheet may be sandwiched between the patch conductors 3 a and 3 b and the IC tag 5. For protection, the IC tag 5 and the patch conductors 3a and 3b may be coated with a dielectric material.
　図３Ｂは、本発明の実施形態による構造の違いを断面から見た図で説明したものである。図３Ｂ（１）に示す無線ＩＣタグ装置１Ｂ１は、ＩＣタグ５が各パッチ導体３ａ，３ｂの上側に配置された構造であり、図３Ｂ（２）に示す無線ＩＣタグ装置１Ｂ２は、ＩＣタグ５が各パッチ導体３ａ，３ｂの下側に配置された構造であり、図３Ｂ（３）に示す無線ＩＣタグ装置１Ｂ３は、ＩＣタグ５が各パッチ導体３ａ，３ｂと同一平面上に配置された構造である。 FIG. 3B explains the difference in structure according to the embodiment of the present invention from a cross-sectional view. The wireless IC tag device 1B1 shown in FIG. 3B (1) has a structure in which the IC tag 5 is arranged above the patch conductors 3a and 3b. The wireless IC tag device 1B2 shown in FIG. 5 is a structure arranged below the patch conductors 3a and 3b. In the wireless IC tag device 1B3 shown in FIG. 3B (3), the IC tag 5 is arranged on the same plane as the patch conductors 3a and 3b. Structure.
　パッチ導体３ａ，３ｂとＩＣタグ５とが同一平面上に形成される場合は、パッチ導体３ａ，３ｂとＩＣタグ５のタグアンテナ５１とを、基板２上に同時に作成することができる。またＩＣタグ５の上部に印刷可能な面を持つことによって、文字などを印字する場合に、印刷が容易である。さらにパッチ導体３ａ，３ｂの下側にＩＣタグ５が形成される場合は、回路部であるタグＩＣ５２がパッチ導体３ａ，３ｂによって保護されるという効果がある。 When the patch conductors 3a and 3b and the IC tag 5 are formed on the same plane, the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 can be simultaneously formed on the substrate 2. In addition, by having a printable surface on the top of the IC tag 5, printing is easy when printing characters or the like. Further, when the IC tag 5 is formed below the patch conductors 3a and 3b, there is an effect that the tag IC 52 which is a circuit portion is protected by the patch conductors 3a and 3b.
　図４は、図１を変形したものであり、本発明の実施形態６の無線ＩＣタグ装置１Ｃ１を示す平面図であり、図５は図４の切断面線Ｖ－Ｖから見た断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付し、重複する説明は省略する。本実施形態は、特に無線ＩＣタグ装置の小形化を目的にしたものである。 FIG. 4 is a modification of FIG. 1, and is a plan view showing a wireless IC tag device 1C1 according to Embodiment 6 of the present invention. FIG. 5 is a cross-sectional view taken along the section line VV of FIG. is there. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted. The present embodiment is particularly aimed at miniaturization of a wireless IC tag device.
　無線ＩＣタグ装置１Ｃ１は、接地導体４の一短辺部４ａ，４ｂが基板２の片側で上部に延長され、各パッチ導体３ａ，３ｂの端部に接続される。このとき、各パッチ導体３ａ，３ｂの長さは、１／２波長のほぼ半分でおよそ１／４波長となる。図５の断面図において、ＩＣタグ５は、パッチ導体３ａ，３ｂと同一平面に配置されている。 In the wireless IC tag device 1C1, the short sides 4a and 4b of the ground conductor 4 are extended upward on one side of the substrate 2 and connected to the ends of the patch conductors 3a and 3b. At this time, the length of each of the patch conductors 3a and 3b is approximately a half of the half wavelength and becomes a quarter wavelength. In the cross-sectional view of FIG. 5, the IC tag 5 is disposed on the same plane as the patch conductors 3a and 3b.
　前述の実施形態１～６では、直線偏波に効果的に共振するλｇ／２長の両端開放パッチ導体３ａ，３ｂを用いた例を示したが、この場合、通常よく知られているように、パッチ導体３ａ，３ｂの長さ方向Ｘに垂直なＹ軸方向の中央部Ｐ点上では、パッチ導体３ａ，３ｂと接地導体４との間の電圧は０となる。 In the above-described first to sixth embodiments, examples in which the λg / 2-length open-ended patch conductors 3a and 3b that resonate effectively with linearly polarized waves have been shown. In this case, as is generally well known. The voltage between the patch conductors 3a, 3b and the ground conductor 4 is 0 on the central point P in the Y-axis direction perpendicular to the length direction X of the patch conductors 3a, 3b.
　従って、このような構成を採用することによって、各パッチ導３ａ，３ｂの中央部Ｐ点で、Ｙ軸方向に沿って、パッチ導体３ａ，３ｂと接地導体４とを短絡してパッチ導体長をλｇ／４として、無線ＩＣタグ装置のさらなる小形化を図ることができる。 Therefore, by adopting such a configuration, the patch conductors 3a and 3b and the ground conductor 4 are short-circuited along the Y-axis direction at the central point P of each of the patch conductors 3a and 3b to increase the patch conductor length. As λg / 4, the wireless IC tag device can be further reduced in size.
　図６Ａは、本発明の実施形態６に類似する無線ＩＣタグ装置の構造の違いを示す断面図である。図６Ａ（１）に示す無線ＩＣタグ装置１Ｃ２は、接地導体４の一短辺部４ａ，４ｂが各パッチ導体３ａ，３ｂの長さ方向Ｘの一方の端部に接続され、ＩＣタグ５がパッチ導体３ａ，３ｂのいずれか少なくとも一方の上側に配置された構造であり、図６Ａ（２）に示す無線ＩＣタグ装置１Ｃ３は、接地導体４の一短辺部４ａ，４ｂが各パッチ導体３ａ，３ｂの長さ方向Ｘの一方の端部に接続され、ＩＣタグ５がパッチ導体３ａ，３ｂのいずれか一方の下側に配置された構造であり、図６Ａ（３）に示す無線ＩＣタグ装置１Ｃ４は、接地導体４の一短辺部４ａ，４ｂが各パッチ導体３ａ，３ｂの長さ方向Ｘの一方の端部に接続され、ＩＣタグ５が各パッチ導体３ａ，３ｂと同一平面上に配置された構造である。 FIG. 6A is a cross-sectional view showing a difference in structure of a wireless IC tag device similar to Embodiment 6 of the present invention. In the wireless IC tag device 1C2 shown in FIG. 6A (1), the short sides 4a and 4b of the ground conductor 4 are connected to one end in the length direction X of each patch conductor 3a and 3b, and the IC tag 5 is The wireless IC tag device 1C3 shown in FIG. 6A (2) has a structure in which at least one of the patch conductors 3a and 3b is arranged, and the short side portions 4a and 4b of the ground conductor 4 are connected to each patch conductor 3a. , 3b is connected to one end in the length direction X, and the IC tag 5 is disposed below either one of the patch conductors 3a, 3b, and the wireless IC tag shown in FIG. 6A (3) In the device 1C4, the short sides 4a and 4b of the ground conductor 4 are connected to one end in the longitudinal direction X of the patch conductors 3a and 3b, and the IC tag 5 is flush with the patch conductors 3a and 3b. It is a structure arranged in.
　この場合、パッチ導体３ａ，３ｂとＩＣタグ５のタグアンテナ５１とは、電気的に接触されてもよく、あるいは非接触であってもよい。図６Ａの２つのパッチ導体３ａ，３ｂとＩＣタグ５との設置に対しては色々な方法がある。例えば、パッチ導体３ａ，３ｂが、誘電体フィルムや誘電体シート上に形成されている場合、ＩＣタグ５をパッチ導体３ａ，３ｂに貼り付けたり、パッチ導体３ａ，３ｂに対してタグアンテナ５１を印刷、または蒸着法によって直接形成し、タグＩＣ５２を実装してもよい。また、パッチ導体３ａ，３ｂとＩＣタグ５との電磁結合を最適化するため、パッチ導体３ａ，３ｂとＩＣタグ５との間に誘電体フィルムまたは誘電体シートを挟んでもよい。また保護のため、ＩＣタグ５やパッチ導体３ａ，３ｂを誘電体材料でコーティング処理されてもよい。 In this case, the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 may be electrically contacted or non-contacted. There are various methods for installing the two patch conductors 3a and 3b and the IC tag 5 in FIG. 6A. For example, when the patch conductors 3a and 3b are formed on a dielectric film or a dielectric sheet, the IC tag 5 is attached to the patch conductors 3a and 3b, or the tag antenna 51 is attached to the patch conductors 3a and 3b. The tag IC 52 may be mounted by directly forming by printing or vapor deposition. Further, in order to optimize the electromagnetic coupling between the patch conductors 3 a and 3 b and the IC tag 5, a dielectric film or a dielectric sheet may be sandwiched between the patch conductors 3 a and 3 b and the IC tag 5. For protection, the IC tag 5 and the patch conductors 3a and 3b may be coated with a dielectric material.
　図６Ａ（３）の場合には、パッチ導体３ａ，３ｂとＩＣタグ５とを導体印刷などによって一体成形することができる。 In the case of FIG. 6A (3), the patch conductors 3a and 3b and the IC tag 5 can be integrally formed by conductor printing or the like.
　図６Ｂは、小形化を目的にした本発明の他の実施形態７の無線ＩＣタグ装置１Ｄを示す平面図であり、図６Ｃは図６Ｂの切断面線ＶＩＣ－ＶＩＣから見た断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付し、重複する説明は省略する。本実施形態の無線ＩＣタグ装置１Ｄは、パッチ導体３ａ，３ｂの等価電気長を略λｇ／４とするため、接地導体４の一短辺部４ａ，４ｂが延長され、接地導体４の一短辺部４ａ，４ｂはパッチ導体３ａ，３ｂ側に形成されている。 FIG. 6B is a plan view showing a wireless IC tag device 1D according to another embodiment 7 of the present invention aimed at miniaturization, and FIG. 6C is a cross-sectional view taken along the section line VIC-VIC of FIG. 6B. . Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted. In the wireless IC tag device 1D of the present embodiment, since the equivalent electrical length of the patch conductors 3a and 3b is approximately λg / 4, the short sides 4a and 4b of the ground conductor 4 are extended, and the short length of the ground conductor 4 is reduced. The side portions 4a and 4b are formed on the patch conductors 3a and 3b side.
　２つのパッチ導体３ａ，３ｂの端部は、同一面の接地導体４に接続されているが、先述のように、パッチ導体３ａ，３ｂの一短辺部４ａ，４ｂは、共振電圧が０点となる位置であるため、２つのパッチ導体３a，３ｂの効果は、独立した２つのパッチ導体と同じである。 The ends of the two patch conductors 3a and 3b are connected to the ground conductor 4 on the same plane, but as described above, the short side portions 4a and 4b of the patch conductors 3a and 3b have zero resonance voltage. Therefore, the effect of the two patch conductors 3a and 3b is the same as that of the two independent patch conductors.
　ＩＣタグ５のタグアテンナ５１は、片側の凹状部６ｂのないパッチ導体３ｂに接続され、かつ各パッチ導体３ａ，３ｂが長さ方向Ｘの一端部で互いに接続される。 The tag attenuator 51 of the IC tag 5 is connected to the patch conductor 3b without the concave portion 6b on one side, and the patch conductors 3a and 3b are connected to each other at one end in the length direction X.
　このような実施形態７においても、前述の実施形態６と同様な効果を達成することができる。 Also in the seventh embodiment, the same effect as in the sixth embodiment can be achieved.
　図６Ｂ、図６Ｃにおいて、タグアンテナ５１は、片側のパッチ導体３ｂと同一面か上側ないしは下側で、片側のパッチ導体３ｂと接触して電気的に接続して形成される。パッチ導体３ａ，３ｂとＩＣタグ５との形成には、色々な方法がある。例えば、ＩＣタグ５のタグアンテナ５１の導体部とパッチ導体３ａ，３ｂとを導電性材料によって貼り付けたり、熱圧着したり、パッチ導体３ａ，３ｂに対してタグアンテナ５１を印刷、または蒸着法によって直接形成し、タグＩＣ５２を実装してもよい。また、パッチ導体３ａ，３ｂとＩＣタグ５とを同一平面で形成する場合には、タグアンテナ５１とパッチ導体３ａ，３ｂとは、同一導体で一体成形することもできる。 6B and 6C, the tag antenna 51 is formed in contact with and electrically connected to the one-side patch conductor 3b on the same plane as the one-side patch conductor 3b or on the upper side or the lower side. There are various methods for forming the patch conductors 3 a and 3 b and the IC tag 5. For example, the conductor portion of the tag antenna 51 of the IC tag 5 and the patch conductors 3a and 3b are attached with a conductive material, thermocompression bonded, the tag antenna 51 is printed on the patch conductors 3a and 3b, or the vapor deposition method. The tag IC 52 may be mounted directly. When the patch conductors 3a and 3b and the IC tag 5 are formed on the same plane, the tag antenna 51 and the patch conductors 3a and 3b can be integrally formed with the same conductor.
　図６Ｄは、本発明の他の実施形態８の無線ＩＣタグ装置１Ｅを示す平面図であり、図６Ｅは図６Ｄの切断面線ＶＩＥ－ＶＩＥから見た断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付し、重複する説明は省略する。本実施形態の無線ＩＣタグ装置１Ｅにおいて、各パッチ導体３ａ，３ｂは、基板２の一短辺部に形成されるスルーホール導体５３ａ，５３ｂによって接地導体４の一短辺部と接続される。ＩＣタグ５のタグアンテナ５１は、片側のパッチ導体３ｂに接続される。 FIG. 6D is a plan view showing a wireless IC tag device 1E according to another embodiment 8 of the present invention, and FIG. 6E is a cross-sectional view taken along section line VIE-VIE of FIG. 6D. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted. In the wireless IC tag device 1E of the present embodiment, each patch conductor 3a, 3b is connected to one short side portion of the ground conductor 4 by through-hole conductors 53a, 53b formed on one short side portion of the substrate 2. The tag antenna 51 of the IC tag 5 is connected to the patch conductor 3b on one side.
　このような実施形態８においても、前述の実施形態６，７と同様な効果を達成することができる。 In the eighth embodiment, the same effects as those of the sixth and seventh embodiments can be achieved.
　図６Ｂの無線ＩＣタグ装置１Ｄと図６Ｄの無線ＩＣタグ装置１Ｅとの違いは、図６Ｄの無線ＩＣタグ装置１Ｅには、図６Ｂの無線ＩＣタグ装置１Ｄのような接地導体４がパッチ導体３ａ，３ｂと同一平面には無く、パッチ導体３ａ，３ｂ間の隙間ｄは、パッチ導体３ａ，３ｂの長さ方向Ｘの両端部まで形成される。両方式の基本的な動作原理の差はないが、例えば等価電気長が略λｇ／４の２つのパッチ導体３ａ，３ｂと接地導体４とをスルーホール導体５３ａ，５３ｂを介して個別に接続した場合、図６Ｂの無線ＩＣタグ装置１Ｄの形態では、１つのスルーホール導体でよいが、図６Ｄの無線ＩＣタグ装置１Ｅでは、２つ必要となる。一方、誘電体基板２が分厚い場合、図６Ｄの無線ＩＣタグ装置１Ｅの構成では、２つのパッチ導体３ａ，３ｂは、基板２の厚さ分まで等価電気長として利用できるため、装置がより小形になり、基板２の厚さ分もアンテナとして動作し、必要により電波の放射特性を偏向することができる。 The difference between the wireless IC tag device 1D of FIG. 6B and the wireless IC tag device 1E of FIG. 6D is that, in the wireless IC tag device 1E of FIG. 6D, a ground conductor 4 like the wireless IC tag device 1D of FIG. The gap d between the patch conductors 3a and 3b is not formed in the same plane as 3a and 3b, and is formed up to both ends in the length direction X of the patch conductors 3a and 3b. Although there is no difference in the basic operation principle of both systems, for example, two patch conductors 3a and 3b having an equivalent electrical length of approximately λg / 4 and the ground conductor 4 are individually connected through the through-hole conductors 53a and 53b. In this case, in the form of the wireless IC tag device 1D in FIG. 6B, one through-hole conductor may be used, but in the wireless IC tag device 1E in FIG. 6D, two are required. On the other hand, when the dielectric substrate 2 is thick, in the configuration of the wireless IC tag device 1E of FIG. 6D, the two patch conductors 3a and 3b can be used as equivalent electrical lengths up to the thickness of the substrate 2, so that the device is smaller. Thus, the thickness of the substrate 2 also operates as an antenna, and the radio wave radiation characteristics can be deflected as necessary.
　図７は、本発明の実施形態９の無線ＩＣタグ装置１Ｆを示す平面図であり、図８は図７の切断面線ＶＩＩＩ－ＶＩＩＩから見た断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付し、重複する説明は省略する。本実施形態では、基板２の一方主面２ａ上において、互いに間隙ｄを挟んで対向する２つのパッチ導体３ａ,３ｂのうち、一方のパッチ導体３ａは、凸状部分２１を有し、対向する他方のパッチ導体３ｂは前記凹状部６ｂを有する。基板２の他方主面２ｂには、接地導体４が設けられ、ＩＣタグ５が凸状部分２１と凹状部６ｂとの間に挟まれるように配置される。このようなＩＣタグ５の放射電界は、パッチ導体３ａ，３ｂの共振軸と平行、すなわち長さ方向Ｘと平行になるように配置される。 FIG. 7 is a plan view showing the wireless IC tag device 1F according to the ninth embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along the section line VIII-VIII in FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted. In the present embodiment, on one main surface 2a of the substrate 2, of the two patch conductors 3a and 3b facing each other with the gap d therebetween, one patch conductor 3a has the convex portion 21 and faces each other. The other patch conductor 3b has the concave portion 6b. A ground conductor 4 is provided on the other main surface 2b of the substrate 2, and the IC tag 5 is disposed so as to be sandwiched between the convex portion 21 and the concave portion 6b. Such a radiation electric field of the IC tag 5 is arranged to be parallel to the resonance axis of the patch conductors 3a and 3b, that is, to be parallel to the length direction X.
　このような構成を採用することによって、パッチ導体３ａ，３ｂとＩＣタグ５の放射電界の強いタグＩＣ５２の実装部の電界放射とが、効率的に結合すると共に、パッチ導体３ａ，３ｂの形状に凹凸部を有するために、２つのパッチ導体３ａ，３ｂの等価電気長を異ならせ、より広い周波数帯域が得ることができる。 By adopting such a configuration, the patch conductors 3a and 3b and the electric field radiation of the mounting portion of the tag IC 52 having a strong radiation field of the IC tag 5 are efficiently coupled, and the shape of the patch conductors 3a and 3b is obtained. Since it has an uneven portion, the equivalent electrical lengths of the two patch conductors 3a and 3b can be made different to obtain a wider frequency band.
　図９は、本発明の実施形態１０の無線ＩＣタグ装置１Ｇを示す平面図であり、図１０は図９の切断面線Ｘ－Ｘから見た断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付し、重複する説明は省略する。本実施形態では、ＩＣタグ５のタグアンテナ５１のアンテナ形状に接近するように、各パッチ導体３ａ，３ｂの互いに対向する縁部に、凸状部分２１，２２をそれぞれ有する凹状部６ａ，６ｂが形成される。ＩＣタグ５の放射電界は、各パッチ導体３ａ，３ｂの共振軸、すなわち長さ方向Ｘと平行になるように配置されている。 FIG. 9 is a plan view showing the wireless IC tag device 1G according to the tenth embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along the section line XX of FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted. In the present embodiment, the concave portions 6a and 6b respectively having convex portions 21 and 22 are provided on the edge portions of the patch conductors 3a and 3b facing each other so as to approach the antenna shape of the tag antenna 51 of the IC tag 5. It is formed. The radiated electric field of the IC tag 5 is arranged so as to be parallel to the resonance axis of each patch conductor 3a, 3b, that is, the length direction X.
　このような構成を採用することによって、タグアンテナ５１の形状に沿って近接して各パッチ導体３ａ，３ｂの凹状部６ａ，６ｂが形成されるので、ＩＣタグ５の放射電界が効率的に結合すると共に、パッチ導体３ａ，３ｂが凸状部分２１，２２を含む凹状部６ａ，６ｂを有するために、より広い周波数帯域が得られるという効果を有する。またパッチ導体３ａ，３ｂの表面に無駄な空隙を少なくし、パッチ導体３ａ，３ｂの面積を有効に活用できるため、無線ＩＣタグ装置１Ｇ全体の感度を高めることができる。 By adopting such a configuration, the concave portions 6a and 6b of the patch conductors 3a and 3b are formed close to each other along the shape of the tag antenna 51, so that the radiation field of the IC tag 5 is efficiently coupled. In addition, since the patch conductors 3a and 3b have the concave portions 6a and 6b including the convex portions 21 and 22, there is an effect that a wider frequency band can be obtained. In addition, since unnecessary voids are reduced on the surfaces of the patch conductors 3a and 3b and the area of the patch conductors 3a and 3b can be effectively used, the sensitivity of the entire wireless IC tag device 1G can be increased.
　図１１は、本発明の実施形態１１の無線ＩＣタグ装置１Ｈ１を示す平面図であり、図１２は図１１の切断面線ＸＩＩ－ＸＩＩから見た断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付し、重複する説明は省略する。本実施形態では、ＩＣタグ５の各タグアンテナ５１は、他方のパッチ導体３ｂと異なった２箇所で接触する。このＩＣタグ５の放射電界は、パッチ導体３ａ，３ｂの共振軸と平行になるように配置される。 FIG. 11 is a plan view showing the wireless IC tag device 1H1 according to the eleventh embodiment of the present invention, and FIG. 12 is a cross-sectional view taken along the section line XII-XII of FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted. In the present embodiment, each tag antenna 51 of the IC tag 5 contacts at two places different from the other patch conductor 3b. The radiation field of the IC tag 5 is arranged to be parallel to the resonance axes of the patch conductors 3a and 3b.
　このような構成を採用することによって、ＩＣタグ５のタグアンテナ５１は、他方のパッチ導体３ｂの異なる２個所で接触するので、共振に伴い他方のパッチ導体３ｂ上を流れる電流の一部が直接ＩＣタグ５側に流れるため、他方のパッチ導体３ｂを強く励振するとともに、ＩＣタグ５からの放射電界によって、一方のパッチ導体３ａをも相互励振し、無線ＩＣタグ装置１Ｈ１の感度を上げるという効果を有する。この場合、パッチ導体３ａ，３ｂとＩＣタグ５とは、同一導体により一体成形することができる。 By adopting such a configuration, the tag antenna 51 of the IC tag 5 is in contact at two different locations on the other patch conductor 3b, so that a part of the current flowing on the other patch conductor 3b due to resonance is directly applied. Since the current flows to the IC tag 5 side, the other patch conductor 3b is strongly excited, and one patch conductor 3a is also mutually excited by the radiated electric field from the IC tag 5, thereby increasing the sensitivity of the wireless IC tag device 1H1. Have In this case, the patch conductors 3a and 3b and the IC tag 5 can be integrally formed of the same conductor.
　図１３Ａは、本発明の実施形態１１の無線ＩＣタグ装置１Ｈ１に類似する他の実施形態１２～１４の無線ＩＣタグ装置１Ｈ２～１Ｈ４を示す平面図であり、図１３Ａ（１）は実施形態１２の無線ＩＣタグ装置１Ｈ２を示し、図１３Ａ（２）は実施形態１３の無線ＩＣタグ装置１Ｈ３を示し、図１３Ａ（３）は実施形態１４の無線ＩＣタグ装置１Ｈ４を示す。なお、前述の実施形態１１に対応する部分には、同一の参照符を付し、重複する説明は省略する。 FIG. 13A is a plan view showing wireless IC tag devices 1H2 to 1H4 of other embodiments 12 to 14 similar to the wireless IC tag device 1H1 of embodiment 11 of the present invention, and FIG. 13A (2) shows the wireless IC tag device 1H3 of the thirteenth embodiment, and FIG. 13A (3) shows the wireless IC tag device 1H4 of the fourteenth embodiment. Note that portions corresponding to the above-described eleventh embodiment are denoted by the same reference numerals, and redundant description is omitted.
　図１３Ａ（１）に示す実施形態１２の無線ＩＣタグ装置１Ｈ２は、ＩＣタグ５のタグアンテナ５１の各端部が片側のパッチ導体３ｂに接触し、かつタグアンテナ５１の一部が部分的に一方のパッチ導体３ａの凹状部６ａに配置され、凹状部６ａを有する一方のパッチ導体３ａと組み合わせた構造であり、図１３Ａ（２）に示す実施形態１３の無線ＩＣタグ装置１Ｈ３は、ＩＣタグ５のタグアンテナ５１の各端部が片側のパッチ導体３ｂに接触し、かつ凹状部６ａのない一方のパッチ導体３ａと組み合わせた構造である。また図１３Ａ（３）に示す実施形態１４の無線ＩＣタグ装置１Ｈ４は、ＩＣタグ５のタグアンテナ５１の各端部が片側のパッチ導体３ｂに接触し、かつ凹状部６ｂ内に配置され、凹状部６ａを有する一方のパッチ導体３ａと組み合わせた構造である。 In the wireless IC tag device 1H2 of the twelfth embodiment shown in FIG. 13A (1), each end of the tag antenna 51 of the IC tag 5 is in contact with the patch conductor 3b on one side, and a part of the tag antenna 51 is partially The wireless IC tag device 1H3 according to the thirteenth embodiment shown in FIG. 13A (2) has a structure that is disposed in the concave portion 6a of one patch conductor 3a and is combined with one patch conductor 3a having the concave portion 6a. 5 has a structure in which each end portion of the tag antenna 51 is in contact with the patch conductor 3b on one side and is combined with one patch conductor 3a without the concave portion 6a. Further, in the wireless IC tag device 1H4 of the fourteenth embodiment shown in FIG. 13A (3), each end of the tag antenna 51 of the IC tag 5 is in contact with the patch conductor 3b on one side and is disposed in the concave portion 6b. This is a structure combined with one patch conductor 3a having the portion 6a.
　このような実施形態１２～１４においても、前述の実施形態１１と同様な効果を達成することができる。 Also in such Embodiments 12 to 14, the same effect as that of Embodiment 11 described above can be achieved.
　また、図１３Ｂは、本発明の実施形態１１に類似する無線ＩＣタグ装置の構造の違いを示す断面図である。図１３Ｂ（１）に示す無線ＩＣタグ装置１Ｉ１は、各パッチ導体３ａ，３ｂの上側に配置されたＩＣタグ５のタグアンテナ５１の各端部が片側のパッチ導体３ｂに接続された構造であり、図１３Ｂ（２）に示す無線ＩＣタグ装置１Ｉ２は、各パッチ導体３ａ，３ｂの下側に配置されたＩＣタグ５のタグアンテナ５１の各端部が片側のパッチ導体３ｂに接続された構造であり、図１３Ｂ（３）に示す無線ＩＣタグ装置１Ｉ３は、各パッチ導体３ａ，３ｂと同一平面上に配置されたＩＣタグ５のタグアンテナ５１の各端部が片側のパッチ導体３ｂに接続された構造である。 FIG. 13B is a cross-sectional view showing a difference in structure of the wireless IC tag device similar to the eleventh embodiment of the present invention. The wireless IC tag device 1I1 shown in FIG. 13B (1) has a structure in which each end portion of the tag antenna 51 of the IC tag 5 arranged on the upper side of each patch conductor 3a, 3b is connected to the patch conductor 3b on one side. The wireless IC tag device 1I2 shown in FIG. 13B (2) has a structure in which each end portion of the tag antenna 51 of the IC tag 5 arranged below the patch conductors 3a and 3b is connected to the patch conductor 3b on one side. In the wireless IC tag device 1I3 shown in FIG. 13B (3), each end of the tag antenna 51 of the IC tag 5 arranged on the same plane as the patch conductors 3a and 3b is connected to the patch conductor 3b on one side. It is a structured.
　各パッチ導体３ａ，３ｂとＩＣタグ５とが同一平面状に形成される場合は、パッチ導体３ａ，３ｂとＩＣタグ５のタグアンテナ５１とを同時に作成することができる。またＩＣタグ５の上部に印刷可能な面を持つことによって、文字などを印字する場合、印刷が容易である。さらにパッチ導体３ａ，３ｂの下側にＩＣタグ５が形成される場合は、タグＩＣ５２などの回路部がパッチ導体３ａ，３ｂによって保護されるという効果がある。 When the patch conductors 3a and 3b and the IC tag 5 are formed on the same plane, the patch conductors 3a and 3b and the tag antenna 51 of the IC tag 5 can be created at the same time. Further, by having a printable surface on the top of the IC tag 5, printing is easy when printing characters or the like. Further, when the IC tag 5 is formed below the patch conductors 3a and 3b, there is an effect that the circuit portions such as the tag IC 52 are protected by the patch conductors 3a and 3b.
　図１４は、本発明の他の実施形態１５の無線ＩＣタグ装置１Ｊを示す平面図であり、図１５は図１４の切断面線ＸＶ－ＸＶから見た断面図である。なお、前述の実施形態と対応する部分には、同一の参照符を付し、重複する説明は省略する。本実施形態の無線ＩＣタグ装置１Ｊは、凹凸のない他方のパッチ導体３ｂにＩＣタグ５のタグアンテナ５１が接続される。 FIG. 14 is a plan view showing a wireless IC tag device 1J according to another embodiment 15 of the present invention, and FIG. 15 is a cross-sectional view taken along section line XV-XV in FIG. Note that portions corresponding to those of the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted. In the wireless IC tag device 1J of the present embodiment, the tag antenna 51 of the IC tag 5 is connected to the other patch conductor 3b having no unevenness.
　このような実施形態１５においても、前述の実施形態１１～１４と同様な効果を達成することができる。 Also in the fifteenth embodiment, the same effects as those of the above-described eleventh to fourteenth embodiments can be achieved.
　なお、上記説明では、ＩＣタグとして、メアンダーラインアンテナ型のタグを用いた例で述べたが、ＩＣタグとしては、折返しダイポールアンテナやループアンテナを利用したタグ、また、微小ダイポールや微小ループ型アンテナを応用し変形したタグ、ボータイアンテナを利用したタグなど、直線偏波放射成分を有するものであれば種々のＩＣタグを用いてもよい。 In the above description, an example using a meander line antenna type tag as an IC tag has been described. However, as an IC tag, a tag using a folded dipole antenna or a loop antenna, or a minute dipole or minute loop type is used. Various IC tags may be used as long as they have a linearly polarized radiation component, such as a tag that is modified by applying an antenna and a tag that uses a bow-tie antenna.
　以上の実施形態では、直線偏波信号に適した無線ＩＣタグ装置の例を示したが円偏波信号に用いてもよい。本発明はこれに限られることなく、円偏波信号を受送信する場合にもそれに適した形態として本発明を適用することができる。その具体的な構造としては、基板２の一方主面２ａに形成する２つのパッチ導体３ａ，３ｂを、略正方形で互いに対向する一対の角部（対角部）にそれぞれ切欠き（面取り）を設けたパッチ導体とすることによって、円偏波信号に作用する無線ＩＣタグ装置を実現することができる。 In the above embodiment, an example of a wireless IC tag device suitable for a linearly polarized signal has been shown, but it may be used for a circularly polarized signal. The present invention is not limited to this, and the present invention can also be applied as a form suitable for receiving and transmitting circularly polarized signals. As a specific structure, two patch conductors 3a and 3b formed on one main surface 2a of the substrate 2 are notched (chamfered) in a pair of corner portions (diagonal portions) facing each other in a substantially square shape. By using the provided patch conductor, a wireless IC tag device that acts on a circularly polarized signal can be realized.
　また、前記基板２または前記接地導体４の少なくとも一方は、２つのパッチ導体３ａ，３ｂおよびＩＣタグ５に対して、粘着剤などによって着脱可能に接合する構成であってもよい。このような構成を採用することによって、前述の各実施形態１～１５に対して任意の構成を容易に実現することができ、用途および配置上の制限などを勘案して適切な構成を容易に実現することができる。 Further, at least one of the substrate 2 or the ground conductor 4 may be configured to be detachably bonded to the two patch conductors 3a and 3b and the IC tag 5 with an adhesive or the like. By adopting such a configuration, an arbitrary configuration can be easily realized for each of the above-described first to fifteenth embodiments, and an appropriate configuration can be easily made in consideration of restrictions on use and arrangement. Can be realized.
　特に、基板２または接地導体４が着脱可能な形態であるので、無線ＩＣタグ装置を貼り付ける物体が金属面を有する場合には、それを接地導体４として利用することができる。また無線ＩＣタグ装置を貼り付ける物体を誘電体基板２とし、金属箔のテープなどを接地導体４として利用することもできるので、構成が簡単になるという効果を有する。 In particular, since the substrate 2 or the ground conductor 4 is detachable, when the object to which the wireless IC tag device is attached has a metal surface, it can be used as the ground conductor 4. Further, since the object to which the wireless IC tag device is attached can be used as the dielectric substrate 2 and a metal foil tape or the like can be used as the ground conductor 4, the structure can be simplified.
　本発明は、その主要な特徴から逸脱することなく、他のいろいろな形態で実施できる。したがって、前述の実施形態はあらゆる点で単なる例示に過ぎず、本発明の範囲は請求の範囲に示すものであって、明細書本文には何ら拘束されない。さらに、請求の範囲に属する変形や変更は全て本発明の範囲内のものである。 The present invention can be implemented in various other forms without departing from the main features thereof. Therefore, the above-described embodiment is merely an example in all points, and the scope of the present invention is shown in the scope of claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the claims are within the scope of the present invention.
　１Ａ～１Ｊ　無線ＩＣタグ装置
　２　基板
　２ａ　一方主面
　２ｂ　他方主面
　３　パッチアンテナ
　３ａ，３ｂ　パッチ導体
　４　接地導体
　５　ＩＣタグ
　６ａ，６ｂ　凹状部
　２１，２２　凸状部分
　５１　タグアンテナ
　５２　タグＩＣ
　Ｅ　電界
　f０　共振周波数
　Ｐ　中央部
　Ｘ　方向
　Ｙ　方向
　ｄ　間隔
　ｔａｎδ　誘電正接
　λｇ　等価波長 1A to 1J Wireless IC tag device 2 Substrate 2a One main surface 2b The other main surface 3 Patch antenna 3a, 3b Patch conductor 4 Ground conductor 5 IC tag 6a, 6b Concave portion 21, 22 Convex portion 51 Tag antenna 52 Tag IC
E electric field f0 resonance frequency P central part X direction Y direction d interval tanδ dielectric loss tangent λg equivalent wavelength

Claims (7)

  1. 　回路部およびタグアンテナを有するＩＣタグと、
    　誘電体からなる基板と、
    　前記基板の一方主面に設けられるパッチ導体と、
    　前記基板の他方主面に設けられる接地導体とを含み、
    　前記パッチ導体は、共振周波数で平面共振する少なくとも２つのパッチアンテナを備え、
    　前記パッチアンテナは、互いに間隙を挟んで対向し、片側または両側に前記間隙を含む凹型の切込み領域を有し、
    　前記ＩＣタグは、少なくとも一部が前記切込み領域内にあり、前記ＩＣタグの放射電界成分と上記パッチ導体の共振軸が平行となり、かつ前記ＩＣタグが前記パッチ導体と電気的に非接触または前記パッチ導体のいずれかと接触させて構成されることを特徴とする無線ＩＣタグ装置。     An IC tag having a circuit part and a tag antenna;
    A dielectric substrate;
    A patch conductor provided on one main surface of the substrate;
    A ground conductor provided on the other main surface of the substrate,
    The patch conductor includes at least two patch antennas that resonate in plane at a resonance frequency;
    The patch antenna is opposed to each other with a gap, and has a concave cut region including the gap on one side or both sides,
    The IC tag is at least partially in the cut region, the radiation field component of the IC tag and the resonance axis of the patch conductor are parallel, and the IC tag is not in electrical contact with the patch conductor or A wireless IC tag device configured to be in contact with any one of patch conductors.
  2. 　前記接地導体を、前記パッチ導体面の片側端部に延長して形成し、前記パッチ導体の電気的長さをそれぞれほぼ１／２としたものに接続したことを特徴とする請求項１に記載の無線ＩＣタグ装置。 2. The ground conductor is formed to extend to one end of the patch conductor surface, and is connected to the patch conductor having an electrical length of approximately ½, respectively. Wireless IC tag device.
  3. 　前記パッチアンテナの一方に凹状部が形成され、この凹状部に部分的に嵌合する凸状部を有する他方のパッチアンテナを有することを特徴とする請求項１または２に記載の無線ＩＣタグ装置。 3. The wireless IC tag device according to claim 1, wherein a concave portion is formed in one of the patch antennas, and the other patch antenna has a convex portion that partially fits in the concave portion. 4. .
  4. 　前記パッチアンテナは、前記ＩＣタグのタグアンテナの形状に少なくとも部分的に沿って近接して形成されることを特徴とする請求項１～３のいずれか１つに記載の無線ＩＣタグ装置。 The wireless IC tag device according to any one of claims 1 to 3, wherein the patch antenna is formed close to at least a part of the shape of the tag antenna of the IC tag.
  5. 　前記ＩＣタグが前記パッチ導体と同一面上、もしくは前記パッチ導体の上側または下側に形成されることを特徴とする請求項１～４のいずれか１つに記載の無線ＩＣタグ装置。 The wireless IC tag device according to any one of claims 1 to 4, wherein the IC tag is formed on the same plane as the patch conductor, or on an upper side or a lower side of the patch conductor.
  6. 　前記ＩＣタグの２つの端子を、それぞれ前記パッチ導体の片側の異なる２個所で接触させたことを特徴とする請求項１～５のいずれか１つに記載の無線ＩＣタグ装置。 The wireless IC tag device according to any one of claims 1 to 5, wherein the two terminals of the IC tag are brought into contact with each other at two different locations on one side of the patch conductor.
  7. 　前記基板または前記接地導体の少なくとも一方は、着脱可能であることを特徴とする請求項１～６のいずれか１つに記載の無線ＩＣタグ装置。 The wireless IC tag device according to any one of claims 1 to 6, wherein at least one of the substrate and the ground conductor is detachable.
PCT/JP2012/084117 2012-12-28 2012-12-28 Wireless ic tag apparatus WO2014103025A1 (en)

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CN108767469A (en) * 2018-07-10 2018-11-06 成都爱为贝思科技有限公司 A kind of double open circuit parallel resonance short-range communication antennas
EP3710988A4 (en) * 2017-11-16 2021-06-30 Confidex Oy Rfid transponder

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JP2008067342A (en) * 2006-08-09 2008-03-21 Fujitsu Ltd Rfid tag, and manufacturing method therefor
JP2008187601A (en) * 2007-01-31 2008-08-14 Fujitsu Ltd Rfid tag
WO2009013817A1 (en) * 2007-07-25 2009-01-29 Fujitsu Limited Wireless tag

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JP2005303528A (en) * 2004-04-08 2005-10-27 Hidekazu Ogawa Radio wave polarization conversion resonance reflector, radio wave polarization conversion resonance reflecting apparatus, radio communication system, metal-adaptive radio ic tag, article and rfid system
JP2008067342A (en) * 2006-08-09 2008-03-21 Fujitsu Ltd Rfid tag, and manufacturing method therefor
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EP3710988A4 (en) * 2017-11-16 2021-06-30 Confidex Oy Rfid transponder
CN108767469A (en) * 2018-07-10 2018-11-06 成都爱为贝思科技有限公司 A kind of double open circuit parallel resonance short-range communication antennas
CN108767469B (en) * 2018-07-10 2024-05-14 成都爱为贝思科技有限公司 Dual-open-circuit parallel resonance near field communication antenna

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