WO2014090157A1 - Structure d'encapsulation et procédé d'encapsulation pour diode électroluminescente - Google Patents

Structure d'encapsulation et procédé d'encapsulation pour diode électroluminescente Download PDF

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Publication number
WO2014090157A1
WO2014090157A1 PCT/CN2013/089076 CN2013089076W WO2014090157A1 WO 2014090157 A1 WO2014090157 A1 WO 2014090157A1 CN 2013089076 W CN2013089076 W CN 2013089076W WO 2014090157 A1 WO2014090157 A1 WO 2014090157A1
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Prior art keywords
emitting diode
light
chip
led
chips
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PCT/CN2013/089076
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English (en)
Chinese (zh)
Inventor
彭晓林
黄荇茜
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广东威创视讯科技股份有限公司
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Publication of WO2014090157A1 publication Critical patent/WO2014090157A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20—Controlling the colour of the light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to the field of LED (Light Emitting Diode) packaging technology, and more particularly to an LED package structure and packaging method for high resolution display applications.
  • LED Light Emitting Diode
  • the resolution of the LED display screen refers to the number of rows and columns of LED display screen pixels.
  • the resolution is the total number of pixels in the LED display screen, which determines the information capacity of a single display for one display.
  • the resolution of the LED display screen is increased, the number of lamps under the same illumination area is greatly increased, and the distance between the lamps and the lamps is also getting smaller and smaller, which makes the wiring between the lamps and the driving chips more difficult.
  • a commonly used LED package structure firstly packages an LED chip (ie, three RGB (Red Green Blue) LED chips) in a component, and then connects the component to a power source; (IC, Integrated Circuit) is located on the back of the lamp board, and connects the driver IC to its corresponding control LED chip through complicated wiring; in addition, it can control the flow through the LED chip by setting a resistor between the component and the driver IC as needed.
  • Current sometimes in order to increase the density of wiring that can be used, the printed circuit board (PCB, Printed Circuit Board) of the traditional high-resolution LED display screen uses more layers of PCB board, and can use one double layer as the inner layer and two pieces.
  • the problem with multi-layer PCBs is that the fabrication process has poor yields and high cost, and as the display density increases, the PCBs are more demanding in terms of precision and number of layers.
  • Embodiments of the present invention provide a package structure and a package method for a light emitting diode, which are used to reduce the difficulty of wiring in a high resolution display application, and at the same time reduce the number of layers and precision of the PCB.
  • the present invention provides:
  • a package structure of a light emitting diode which may include: a package component, a power supply module for supplying power to the package structure, a ground line, and a data bus for transmitting data information; wherein the package component includes N light emitting diode chip sets and performing the N light emitting diode chip sets The controlled driving chip, the N LED chip sets are connected to the driving chip, and the N is a positive integer.
  • the LED chipset includes three LED chips of 1, G, and B.
  • the cathodes of the R, G, and B LED chips are respectively connected to the driving chip, and the anodes are connected together, and The power supply modules are connected.
  • a first resistor for controlling a current flowing through the R light emitting diode chip is disposed between a cathode of the R light emitting diode chip and the driving chip, and a cathode of the G light emitting diode chip and the driving chip
  • a second resistor for controlling a current flowing through the G light emitting diode chip is disposed between the cathode of the B light emitting diode chip and a third resistor for controlling a current flowing through the B light emitting diode chip.
  • the LED chipset includes three LED chips of 1, G, and B.
  • the anodes of the R, G, and B LED chips are respectively connected to the driving chip, the cathodes are connected together, and Ground lines are connected.
  • the power supply module includes a first input voltage, a second input voltage, and a third input voltage, wherein the first input voltage supplies power to the R LED chip, and the second input voltage is the G illumination The diode chip is powered, and the third input voltage supplies power to the B LED chip.
  • the package structure includes three driving chips
  • the first input voltage, the second input voltage, and the third input voltage are respectively connected to the three driving chips, and the R, G,
  • the anodes of the B LED chips are respectively connected to the three driving chips.
  • the embodiment of the invention further provides a method for packaging a light emitting diode, which is applied to the package structure of the light emitting diode as described above, and includes:
  • the package components are connected to the power supply module, the data bus, and the ground using wires. It can be seen from the above technical solution that the package structure and the packaging method of the light emitting diode provided by the embodiment of the present invention encapsulates the N LED chip sets and the driving chip in the same component, The connection has been completed in the package component, which reduces the connection wires between the conventional LED chip and the driver chip, and the two are in the same plane, and the wire connection inside the package component is more simple, so that the application is in high resolution display. This reduces the difficulty of wiring and reduces the requirements for the number of layers and accuracy of the PCB. DRAWINGS
  • FIG. 1 is a schematic diagram of a package structure of an LED according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • FIG. 9 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • FIG. 10 is a schematic flow chart of a method for packaging a light emitting diode according to an embodiment of the present invention.
  • Embodiments of the present invention provide a package structure and a package method for a light emitting diode, which are used to reduce the difficulty of wiring in a high resolution display application, and at the same time reduce the number of layers and precision of the PCB.
  • FIG. 1 is a schematic diagram of a package structure of an LED according to an embodiment of the present invention.
  • Package component 9 power supply module 1 (ie, power supply) for supplying power to the package structure, ground line 4 And a data bus 3 for transmitting data information; wherein the package component 9 includes N light emitting diode chip sets and a driving chip 2 for controlling the N light emitting diode chip sets, the N light emitting diode chip sets and The driving chips 2 are connected, and the N is a positive integer.
  • power supply module 1 ie, power supply
  • the package component 9 includes N light emitting diode chip sets and a driving chip 2 for controlling the N light emitting diode chip sets, the N light emitting diode chip sets and The driving chips 2 are connected, and the N is a positive integer.
  • the LED chipset may include three LED chips of R, G, and B; for convenience of understanding, three LED chips of R, G, and B may be labeled as 5, 6, and 7 respectively in FIG.
  • the following is a detailed analysis of the package structure provided by the present invention:
  • the cathodes of the R, G, and B LED chips (5, 6, and 7) are respectively connected to the driving chip 2, the anodes are connected together, and the power supply module 1 (ie, the power supply) Connected, that is, 1 , G, B three kinds of LED chips (5, 6, 7) are connected by a common anode;
  • the N is 1, that is, the package structure includes an LED chip set; wherein the driving chips 2 and 1 , G, and B emit light
  • the diode chips (5, 6, 7) are packaged together to form package components 9. That is, the driving chip 2 controls three LED chips, and the package component 9 is connected to the power supply module 1 (i.e., power supply), the data bus 3, and the ground line 4 through wires.
  • the R, G, B LED chips need to be connected to the driver chip through three wires, and because the position of the driver chip and the R, G, B LED chips are not in the same plane, the wires
  • the R, G, and B LED chips (5, 6, and 7) are packaged in the same component as the driver chip 2, and the connection between the two is completed in the package component 9.
  • the connecting wires between the conventional LED chip and the driving chip are reduced, and the two are located on the same plane, and the wires inside the package component 9 are more connected.
  • a first resistor 81 for controlling the current flowing through the R LED chip 5 and a cathode of the G LED chip 6 are disposed between the cathode of the R LED chip 5 and the driving chip 2 .
  • a second resistor 82 for controlling a current flowing through the G light emitting diode chip 6 is disposed between the driving chip 2, and a cathode between the cathode of the B LED chip 7 and the driving chip 2 is provided for controlling flow.
  • the third resistor 83 of the current of the LED chip 7 it is also conceivable that the specific resistance of the first resistor 81, the second resistor 82 and the third resistor 83 may or may not be set according to actual application requirements. The embodiment does not specifically limit this.
  • FIG. 2 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • the N is 2, that is, Description The package structure includes two LED chipsets, and the driving chip 2 controls six LED chips.
  • FIG. 3 is a light emitting diode according to an embodiment of the present invention.
  • Another package structure diagram in the embodiment, the N is 4, that is, the package structure includes four LED chip sets, and the driving chip 2 controls 12 LED chips. It can be understood that the first In the second embodiment of the aspect and the third embodiment of the first aspect, the package structure and principle control of the LED may be specifically implemented according to the first embodiment of the first aspect, and will not be specifically described herein.
  • the driving chip 2 controls 3*N LED chips.
  • the R, G, B LED chips need to be connected to the driving chip through 3*N wires, and because the driving chip is 1 and G.
  • the R, G, B LED chip ie, the N group of LED chips
  • the driving The chip 2 is packaged in the same component, and the connection between the two is completed in the package component 9, which reduces the connection wires between the conventional LED chip and the driver chip, and the two are located on the same plane, and the inside of the package component 9
  • Wire connections are more compact, reducing wiring difficulties in high-resolution display applications and reducing the number of PCB layers and accuracy begging.
  • the LED package structure is preferentially selected for 12 and 27 LED chips and the following number of package technologies are improved under the common anode connection embodiment of the LED chip.
  • the anodes of the R, G, and B LED chips are respectively connected to the driving chip 2, and the cathodes are connected together and connected to the ground line 4, that is, 1, G, B three kinds of light-emitting diode chips (5, 6, 7) common cathode connection;
  • the driving chip 2 can use a driving chip with a special voltage dividing function, and can provide an optimal voltage for each LED chip in the LED chipset, so that each LED chip can achieve energy saving. the goal of.
  • the optimal voltage of the R light emitting diode chip may be 2.0 to 2.8 volts, and the optimal voltage of the G light emitting diode chip and the B light emitting diode chip may be 3.0 to 3.5 volts; , different brands, models of LED chips in different applications
  • the specific optimal voltage will be different.
  • the Everlight 1010 packaged chip has an optimum voltage of 2.0 volts for the R LED chip, and the optimum voltage for the G LED chip and the B LED chip is 3.3 V.
  • FIG. 4 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention, where N is 1, that is, the package structure includes a light emitting A diode chip set; wherein the driving chip 2 and the three LED chips (5, 6, 7) of the G, B, and B are packaged together to form the package component 9. That is, the driving chip 2 controls three LED chips, and the package component 9 is connected to the power supply module 1 (i.e., power supply), the data bus 3, and the ground line 4 through wires.
  • the power supply module 1 i.e., power supply
  • the R, G, and B LED chips need to be connected to the driver chip through three wires, and since the positions of the driver chip and the R, G, and B LED chips are not on the same plane,
  • the R, G, and B LED chips (5, 6, and 7) are packaged in the same component as the driver chip 2, and the connection between the two is completed in the package component 9.
  • the connection wire between the traditional LED chip and the driving chip is reduced, and the two are located on the same plane, and the wire connection inside the package component 9 is more simple; and at the same time, the driving chip with the voltage dividing function and the LED chip can be used at the same time.
  • the way the cathode is connected provides an optimum voltage for each LED chip, making the solution more energy efficient.
  • FIG. 5 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • the N is 2, that is, the The package structure includes two LED chipsets, and the driving chip 2 controls six LED chips.
  • FIG. 6 is a light emitting diode according to an embodiment of the present invention.
  • Another package structure diagram, in the embodiment, the N is 4, that is, the package structure includes four LED chip sets, and the driving chip 2 controls 12 LED chips. It can be understood that the second aspect The second embodiment of the second embodiment and the third embodiment of the second aspect, the package structure and principle control of the light emitting diode can be specifically implemented according to the first embodiment of the second aspect, which is not specifically described herein.
  • the driving chip 2 controls 3*N LED chips.
  • the R, G, B LED chips need to be connected to the driving chip through 3*N wires, and Since the positions of the driving chip and the LED chips of the 1, G, and B are not in the same plane, the wire connection is difficult; and in the embodiment of the second aspect of the present invention, the R, G, B LED chips (ie, the N group)
  • the LED chipset is packaged in the same component as the driver chip 2, and the connection between the two is completed in the package component 9, which reduces the connection wires between the conventional LED chip and the driver chip, and the two are on the same plane.
  • the wire connection inside the package component 9 is more simple, thereby reducing the wiring difficulty in the high-resolution display application, and reducing the requirement on the number and precision of the PCB layer; and at the same time, the driving chip with the voltage dividing function can be used.
  • the common cathode connection of the LED chips provides an optimum voltage for each LED chip, which makes the solution more energy efficient.
  • the LED package structure is preferentially selected for 12 and 27 LED chips and the following number of package technology improvements in the common cathode connection embodiment of the LED chip.
  • the anodes of the R, G, and B LED chips are respectively connected to the driving chip 2, and the cathodes are connected together and connected to the ground line 4, that is, 1, G, B three kinds of light-emitting diode chips (5, 6, 7) common cathode connection;
  • the driving chip 2 is a driving chip that does not have a special voltage dividing function
  • FIG. 7 another schematic diagram of a package structure of a light emitting diode according to an embodiment of the present invention, where N is 1, that is, the package structure includes an LED chip.
  • the power supply module 1 (ie, the power supply) includes a first input voltage V R (ie, labeled 10 in the figure), a second input voltage V G (ie, labeled 11 in the figure), and a third input voltage V B (ie, In the figure, 12), the first input voltage V R is used to supply power to the R LED chip 5, the second input voltage is used to supply power to the G LED chip 6, and the third input voltage V B is The B LED chip 7 is powered; wherein, the first input voltage! ⁇ is the optimum voltage of the LED chip 5, the second input voltage V G is the optimum voltage of the G LED chip 6, and the third input voltage V B is the optimum voltage of the B LED chip 7;
  • the optimal voltage of the G light-emitting diode chip and the B-light-emitting diode chip can be 3.0 to 3.5 volts; it is also easy to think that different brands and models of LED chips are different in different application scenarios.
  • the excellent voltage will be different, for example, the Everlight 1010 package chip, the R LED chip has an optimum voltage of 2.0 volts, and the G LED chip and the B LED chip are optimal.
  • the voltage is 3.3 volts, but is not intended to limit the invention.
  • the LED package structure includes three driving chips 2, and the first input voltage V R , the second input voltage V G , and the third input voltage V B are respectively associated with the three
  • the driving chips 2 are connected to each other, and the anodes of the R, G, B LED chips (5, 6, 7) are respectively connected to the three driving chips 2.
  • Three driving chips 2 and 1 , G, B three LED chips (5, 6, 7) are packaged together to form a package component 9, and each of the three driving chips 2 controls an LED chip connected thereto, and the package
  • the component 9 is connected to the power supply module 1 (ie, the power supply), the corresponding three data buses 3, and the ground line 4 through wires.
  • the R, G, and B LED chips need to be connected to the driver chip through three wires, and since the positions of the driver chip and the R, G, and B LED chips are not on the same plane,
  • the R, G, and B LED chips (5, 6, and 7) are packaged in the same component as the driver chip 2, and the connection between the two is completed in the package component 9.
  • the connection wire between the traditional LED chip and the driving chip is reduced, and the two are located on the same plane, and the wire connection inside the package component 9 is more simple; and at the same time, the independent input voltage and the common cathode voltage of the LED chip can be used. In this way, the optimal voltage is provided for each LED chip, which makes the solution more energy efficient.
  • FIG. 8 is a schematic diagram of another package structure of a light emitting diode according to an embodiment of the present invention.
  • the N is 2, that is, the The package structure includes two LED chip sets, and each of the three driving chips 2 controls two LED chips connected thereto.
  • FIG. 9 is an implementation of the present invention.
  • Another package structure diagram of the LED provided by the example, in the embodiment, the N is 4, that is, the package structure includes four LED chip sets, and each of the three driving chips 2 controls four LEDs connected thereto.
  • the package structure and principle control of the LED may be specifically implemented according to the first embodiment of the third aspect. Implementation, no longer elaborated here.
  • the second embodiment, and the third embodiment of the third aspect if three LED chips of R, G, and B in the N sets of LED chipsets are connected in common cathode, Each of the driving chips 2 controls 3*N LED chips connected thereto.
  • N groups of LED chipsets need to pass 3*N wires and driving cores.
  • the chip is connected, and since the position of the driving chip and the R, G, B light emitting diode chips are not on the same plane, the wire connection is difficult; and in the embodiment of the third aspect of the invention, the R, G, B light emitting diodes
  • the chip ie, the N sets of LED chipsets
  • the driver chip 2 are packaged in the same component, and the connection between the two is completed in the package component 9, which reduces the connection wires between the conventional LED chip and the driver chip, and The two are in the same plane, and the wires inside the package component 9 are more connected, which reduces the difficulty of wiring in high-resolution display applications, and reduces the requirement for the number of layers and precision of the PCB; and can also adopt independent input.
  • the embodiment of the invention further provides a method for packaging the light emitting diode based on the package structure of the light emitting diode.
  • the meaning of the noun is the same as that in the above package structure. For specific implementation details, refer to the description in the package structure embodiment.
  • the embodiment of the invention further provides a method for packaging a light emitting diode, which is applied to the package structure of the light emitting diode described in the above embodiments, which is used for reducing the difficulty of wiring in a high resolution display application, and reduces the number and precision of the PCB layer.
  • FIG. 10 is a schematic flowchart of a method for packaging the LED, the method includes:
  • Step 101 The driving chip and the N LED chip chips controlled by the driving chip are encapsulated in a package component, where N is a positive integer;
  • Step 102 Connect the package component to the power supply module, the data bus, and the ground wire by using a wire.
  • the LED chipset may include three LED chips of R, G, and B.
  • the cathodes of the R, G, and B LED chips are respectively connected to the driving chip and connected to the anode.
  • the power supply module that is, three light-emitting diode chips of 1, G, B are commonly connected to the anode, and a cathode chip for controlling the flow of the light-emitting diode chip may be disposed between the cathode of the light-emitting diode chip and the driving chip.
  • the specific resistance of the current, the specific resistance of the resistor may be set according to the actual application, or may not be set, which is not specifically limited in this embodiment.
  • the anodes of the R, G, and B LED chips are respectively driven by a driving core
  • the chip is connected, the cathodes are connected together, and are connected to the ground wire, that is, three LED chips of 1, G, B are commonly cathode-connected; wherein the driving chip can be driven by a special voltage dividing function, which can be a light emitting diode
  • a special voltage dividing function which can be a light emitting diode
  • the anodes of the R, G, and B LED chips are respectively connected to the driving chip, the cathodes are connected together, and are connected to the ground lines, that is, three LED chips of 1, G, and B. a common cathode connection; wherein, the driving chip is a driving chip that does not have a special voltage dividing function, and the power supply module includes three input voltages respectively corresponding to the R, G, B light emitting diode chips, and the three input voltages may be 1
  • the optimal voltage of the G, B LED chips enables each LED chip to achieve energy saving.
  • the optimal voltage of the R light emitting diode chip may be 2.0 to 2.8 volts, and the optimal voltage of the G light emitting diode chip and the B light emitting diode chip may be 3.0 to 3.5 volts;
  • Different brands and models of LED chips have different optimal voltages in different application scenarios, such as the Everlight 1010 package chip, and the R LED chip has an optimum voltage of 2.0 V.
  • the chip and B LED chips have an optimum voltage of 3.3 volts, but are not intended to limit the invention.
  • the method for packaging the light emitting diode provided by the embodiment of the invention encloses the N LED chip sets and the driving chip in the same component, and the connection between the two is completed in the package component, thereby reducing the traditional LED chip and driving
  • the connecting wires between the chips, and the two are located on the same plane, and the wires inside the package components are more connected, thereby reducing the wiring difficulty in the high-resolution display application, and reducing the requirements on the number and precision of the PCB layer;
  • the optimal voltage can be provided for each LED chip by means of a common cathode connection, which makes the solution more energy efficient.
  • the foregoing program may be stored in a computer readable storage medium, including a plurality of instructions for making a A computer device (which may be a personal computer, server, or network device, etc.) performs all or part of the steps of the methods described in various embodiments of the present invention.
  • the foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and the like, which can store program codes. medium.

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Abstract

L'invention concerne une structure d'encapsulation et un procédé d'encapsulation pour une diode électroluminescente qui réduisent une difficulté de câblage, et dans le même temps réduisent les exigences pour le nombre de couches et la précision de plaques de carte de circuits imprimés (PCB) lorsqu'elles sont utilisées dans une application d'affichage à haute résolution. La structure d'encapsulation pour une diode électroluminescente comprend : un composant d'encapsulation (9), un module d'alimentation électrique (1) pour fournir une énergie électrique pour la structure d'encapsulation, un fil de masse (4) et un bus de données (3) pour transmettre des informations de données, le composant d'encapsulation (9) comprenant N groupes de puce de diode électroluminescente et une puce de pilotage (2) qui commande les N groupes de puce de diode électroluminescente, les N groupes de puce de diode électroluminescente étant connectés à la puce de pilotage (2), et N étant un entier positif.
PCT/CN2013/089076 2012-12-11 2013-12-11 Structure d'encapsulation et procédé d'encapsulation pour diode électroluminescente WO2014090157A1 (fr)

Applications Claiming Priority (2)

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CN201210533186.8 2012-12-11
CN2012105331868A CN103000622A (zh) 2012-12-11 2012-12-11 一种发光二极管的封装结构和封装方法

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CN103594464A (zh) * 2013-11-25 2014-02-19 广东威创视讯科技股份有限公司 一种发光二极管的cob封装结构
TWI732621B (zh) * 2019-08-27 2021-07-01 明陽半導體股份有限公司 具有驅動機制的發光二極體裝置
CN111862846A (zh) * 2020-08-24 2020-10-30 深圳市大族元亨光电股份有限公司 一种显示屏单元及双面显示屏

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CN101877350A (zh) * 2010-04-20 2010-11-03 蒋伟东 一种一体化贴片单元
CN102297358A (zh) * 2010-06-24 2011-12-28 乔红瑗 驱动电路混合封装的发光二极管芯片及显示装置
US20120187856A1 (en) * 2010-07-23 2012-07-26 Hsien-Jung Huang Package structure of full-color led integrated with driving mechanism and current limiting elements
CN103000622A (zh) * 2012-12-11 2013-03-27 广东威创视讯科技股份有限公司 一种发光二极管的封装结构和封装方法

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